KR20190087976A - Apparatus and system for processing a substrate in a vacuum chamber, and a method of transporting a carrier in a vacuum chamber - Google Patents

Abstract

An apparatus 100 for processing a substrate 10 in a vacuum chamber 101 is described. The apparatus comprises a first carrier transport system configured to transport a first carrier (11) along a first transport path in a first direction (X), a first carrier (11) for mounting a first carrier (11) 121) configured to move the first carrier from the first transport path to the first mount in a second direction (Z) transverse to the first direction (X) Devices (41, 141) and a common support structure (50, 150) for supporting or holding at least a portion of the alignment system (20, 120) and at least a portion of the first shifting device (41, 141). In addition, a system for processing substrates and a method of transporting carriers in a vacuum chamber are described.

Description

Apparatus and system for processing a substrate in a vacuum chamber, and a method of transporting a carrier in a vacuum chamber

[0001] Embodiments of the present disclosure relate to an apparatus and system for processing substrates in a vacuum chamber, and to a method of transporting carriers in a vacuum chamber. More specifically, a method of transporting, positioning, and aligning a substrate carrier and a mask carrier in a vacuum chamber is described. Embodiments of the present disclosure specifically relate to the deposition of a coating material on a substrate, wherein the substrate is aligned with respect to the mask prior to deposition. The methods and apparatuses described herein may be used in the fabrication of organic light emitting diode (OLED) devices.

[0002] Techniques for layer deposition on a substrate include, for example, thermal evaporation, physical vapor deposition (PVD), and chemical vapor deposition (CVD). Coated substrates can be used in a variety of applications and in various technology fields. For example, coated substrates can be used in the field of organic light emitting diode (OLED) devices. OLEDs can be used for the production of television screens, computer monitors, mobile phones, other hand-held devices, etc. for displaying information. An OLED device, such as an OLED display, may include one or more layers of organic material positioned between two electrodes, all of which are deposited on a substrate.

[0003] During deposition of a coating material on a substrate, the substrate can be held by the substrate carrier, and the mask can be held by the mask carrier in front of the substrate. A plurality of pixels corresponding to a material pattern, e.g., an opening pattern of the mask, can be deposited on the substrate.

[0004] The functionality of an OLED device typically depends on the coating thickness of the organic material, which coating thickness must be within a predetermined range. In order to obtain high-resolution OLED devices, the technical challenges for the deposition of vaporized materials need to be overcome. In particular, it is a challenge to accurately and smoothly transport substrate carriers and mask carriers through a vacuum system. In addition, precise alignment of the substrate to the mask is important in achieving high quality deposition results, for example, for producing high-resolution OLED devices. Still further, efficient utilization of the coating material is beneficial, and idle times of the system should be kept as short as possible.

[0005] In view of the foregoing, it would be advantageous to provide devices and systems for accurately and reliably transporting, positioning, and / or aligning substrates and masks in a vacuum chamber.

[0006] In view of the foregoing, there is provided a device for processing substrates in a vacuum chamber, a system for processing substrates in a vacuum chamber, and a method of transporting carriers in a vacuum chamber. Further aspects, benefits, and features of the present disclosure are apparent from the claims, the description, and the accompanying drawings.

[0007] According to an aspect of the present disclosure, an apparatus is provided for processing a substrate in a vacuum chamber. The apparatus includes a first carrier transport system configured to transport a first carrier along a first transport path in a first direction, an alignment system including a first mount for mounting a first carrier in an alignment system, A first shifting device configured to move the first carrier from the first transport path in a second direction to the first mount and a common support structure to support or hold at least a portion of the alignment system and at least a portion of the first shifting device .

[0008] In embodiments, the first carrier is a substrate carrier configured to hold a substrate. Alternatively, the first carrier may be a mask carrier configured to hold a mask.

[0009] In some embodiments, the common support structure holds or supports the alignment unit and the first mount of the alignment system configured to align the first carrier in the vacuum chamber. In some embodiments, the common support structure holds or supports the actuators and / or bearings of the first shifting device.

[0010] According to another aspect of the present disclosure, an apparatus is provided for processing a substrate in a vacuum chamber. The apparatus includes a first carrier transport system configured to transport a first carrier along a first transport path in a first direction, an alignment system including a first mount for mounting a first carrier in an alignment system, And a first shifting device configured to move the first carrier from the first transport path to the first mount in a second direction of rubbing. The first shifting device is arranged in the vacuum chamber, in particular by a common support structure which also holds the alignment system.

[0011] According to another aspect of the present disclosure, an apparatus is provided for processing a substrate in a vacuum chamber. The apparatus includes a first carrier transport system extending in a first direction, an alignment system including a first mount, a first shifting device extending in a second direction across the first direction, and at least a portion of the alignment system, And a common support structure for supporting or holding at least a portion of the shifting device.

[0012] According to another aspect of the present disclosure, a system for processing a substrate in a vacuum chamber is provided. The system comprises a device according to any of the embodiments described herein, a first carrier configured as a substrate carrier mounted on a first mounting portion, and a second carrier configured as a mask carrier mounted on a second mounting portion of the alignment system .

[0013] According to a further aspect of the present disclosure, a method of transporting a carrier in a vacuum chamber is provided. The method includes the steps of transporting a first carrier along a first transport path in a first direction, using a first shifting device, moving the first transport path from a first transport path in a second direction transverse to the first direction, At least a portion of the first shifting device and at least a portion of the alignment system being supported or held by a common support structure; mounting a first carrier to a first mount of the alignment system, And aligning the first carrier using an alignment system.

[0014] In some embodiments, the first carrier is a substrate carrier that holds the substrate, and aligning the first carrier includes aligning the substrate carrier with respect to the mask carrier that holds the mask in front of the substrate.

[0015] Embodiments also relate to apparatus for performing the disclosed methods and apparatus parts for performing each of the described method aspects. These methodological aspects may be performed by hardware components, by a computer programmed by appropriate software, by any combination of the two, or in any other manner. In addition, embodiments in accordance with the present disclosure also relate to methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for performing all of the respective functions of the apparatus.

[0016] In the manner in which the recited features of the present disclosure can be understood in detail, a more particular description of the present disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described below.
Figure 1A shows a schematic cross-sectional view of an apparatus for processing a substrate in a first position, according to embodiments described herein.
FIG. 1B is a schematic cross-sectional view of the device of FIG. 1A in a second position.
Figure 2a shows a schematic cross-sectional view of an apparatus for processing a substrate in a first position, according to embodiments described herein.
Figure 2b is a schematic cross-sectional view of the device of Figure 2a in a second position.
Figure 3 shows a schematic cross-sectional view of an apparatus according to embodiments described herein.
Figure 4 shows a schematic front view of an apparatus according to embodiments described herein.
Figures 5A-5B illustrate various stages of a method for transporting carriers in a vacuum chamber, in accordance with embodiments described herein.
Figure 6 is a flow chart illustrating a method of transporting a carrier in a vacuum chamber, in accordance with embodiments described herein.

[0018] Now, various embodiments of the present disclosure will be referred to in detail, and one or more examples of various embodiments thereof are illustrated in the drawings. In the following description of the drawings, like reference numerals refer to like components. In general, only differences for the individual embodiments are described. Each example is provided as an illustration of the present disclosure and is not intended as a limitation of the present disclosure.

[0018] Additionally, features illustrated or described as part of an embodiment may be used with other embodiments or for other embodiments to produce further embodiments. It is intended that the description include such modifications and variations.

[0019] FIG. 1A illustrates a schematic cross-sectional view of an apparatus 100 for processing a substrate 10, in accordance with embodiments described herein, wherein a first carrier 11 is in a first position . FIG. 1B shows the apparatus 100 of FIG. 1A, wherein the first carrier 11 has moved to the second position.

[0020] In the following description, the term "first carrier" is used to designate a substrate carrier configured to hold a substrate 10, as schematically shown in FIG. 1A. The term " second carrier " is used to designate a mask carrier configured to hold a mask (see FIG. 2A). However, it should be understood that, alternatively, the first carrier 11 may be a carrier configured to hold a different object, e.g. a mask or shield.

[0021] "Substrate carrier" relates to a carrier device configured to transport a substrate 10 along a substrate transport path in a vacuum chamber. The substrate carrier may hold the substrate 10 during deposition of a coating material on the substrate. In some embodiments, the substrate 10 may be held on the substrate carrier in a non-horizontal orientation, particularly an intrinsic vertical orientation, e.g. during transport and / or deposition.

[0022] For example, the substrate 10 may be heated during the transportation through the vacuum chamber 101, during positioning of the substrate 10 in the vacuum chamber 101 with respect to the mask, and / or during deposition of the coating material on the substrate, Can be held on the holding surface of the first carrier (11). In particular, the substrate 10 may be held on the first carrier 11 by a chucking device, such as an electrostatic chuck or a magnetic chuck. The chucking device may be incorporated into the first carrier 11.

[0023] The first carrier 11 may include a carrier body having a holding surface configured to hold the substrate 10, particularly in a non-horizontal orientation. The carrier body may be movable along the first transport path by the first carrier transport system. In some embodiments, the first carrier 11 may be held in a noncontact manner to the guiding structure during transport, e.g., by a levitation system.

[0024] A " mask carrier " as used herein relates to a carrier device configured to carry a mask for transporting a mask along a mask transport path in a vacuum chamber. The mask carrier may carry the mask during transport, during alignment with the substrate, and / or during deposition on the substrate. In some embodiments, the mask may be held in the mask carrier in a non-horizontal orientation, particularly an intrinsic vertical orientation, during transport and / or deposition. The mask may be held on the mask carrier by a chucking device, such as a mechanical chuck, such as a clamp, electrostatic chuck, or magnetic chuck. Other types of chucking devices that can be connected to the mask carrier or integrated into the mask carrier can be used.

[0025] For example, the mask may be an edge exclusion mask or a shadow mask. An edge exclusion mask is a mask configured to mask one or more edge zones of a substrate such that material is not deposited on one or more edge zones during coating of the substrate. A shadow mask is a mask configured to mask a plurality of features to be deposited on a substrate. For example, the shadow mask may comprise a plurality of small openings, e.g., a grid of small openings.

As used herein, the terms "transport," "moving," "routing," "rotating," "positioning," or " May refer to a respective movement of a carrier carrying a substrate or mask.

[0027] As used herein, "intrinsic vertical orientation" can be understood as an orientation having a vertical orientation, ie, a deviation of 10 ° or less from the gravity vector, specifically 5 ° or less. For example, the angle between the main surface of the substrate (or mask) and the gravity vector may be + 10 ° to -10 °, specifically 0 ° to -5 °. In some embodiments, the orientation of the substrate (or mask) is not precisely vertical during transport and / or during deposition, for example at an oblique angle of 0 [deg.] To -5 [deg.], It may be slightly inclined with respect to the axis. Negative angles refer to the orientation of the substrate (or mask) where the substrate (or mask) is tilted downward. Deviations in substrate orientation from gravity vectors during deposition can be beneficial and can result in a more stable deposition process, or downward orientation can be suitable to reduce particles on the substrate during deposition. However, accurate vertical alignment (+/- 1 DEG) is also possible during transport and / or during deposition. In other embodiments, the substrates and the masks may be transported in a non-vertical orientation, and / or the substrates may be coated in a non-vertical orientation, e.g., intrinsic horizontal orientation.

The apparatus 100 according to the embodiments described herein includes a vacuum chamber 101 wherein an alignment system 20 is provided in the vacuum chamber 101. The alignment system 20 can be configured to accurately position the first carrier 11 in the vacuum chamber. In some embodiments, a deposition source 110 is provided in the vacuum chamber 101. The deposition source 110 is configured to deposit the coating material on the substrate 10 held by the first carrier 11.

The alignment system 20 includes a first mounting portion 21 for mounting the first carrier 11 on the alignment system 20. Additionally, the alignment system 20 may include a alignment unit 20 for moving the first mount 21 in at least one direction to align the first carrier 11 with respect to a mask arranged in front of the substrate, for example, (25). The substrate 10 carried by the first carrier 11 can be accurately positioned in the vacuum chamber 101 using the alignment unit 25 of the alignment system 20. [

[0030] The apparatus further comprises a first carrier transport system 31 configured to transport the first carrier 11 along a first transport path in a first direction X. The first carrier transport system 31 may be configured to transport the first carrier 11 into the deposition region 111 in the vacuum chamber 101 and in the deposition region 111 the substrate 10 may be configured such that the coating material Facing the deposition source (110) so that it can be deposited on the substrate (10). The first direction X is essentially perpendicular to the plane of the drawing of Fig.

[0031] After deposition of the coating material on the substrate 10, the first carrier transport system 31 may, for example, be used to unload the coated substrate from the vacuum chamber or to deposit additional coating material To deposit, the first carrier 11 can be transported out of the deposition region 111. [

[0032] The first carrier transport system 31 may be configured to transport the first carrier 11 in a non-contact manner in the vacuum chamber 101. For example, the first carrier transport system 31 can hold and transport the first carrier 11 by magnetic forces. In particular, the first carrier transport system 31 may include a magnetic levitation system.

[0033] In the exemplary embodiment of FIG. 1A, the first carrier transport system 31 comprises a holding device, the holding device is at least partially arranged above the first carrier 11, Of at least a portion of the weight of the article. The holding device may comprise an active magnetic unit, for example an active magnetic bearing, configured to non-contactly hold the first carrier 11 to the holding device. The first carrier transport system 31 may further comprise a drive device configured to move the first carrier 11 in a first direction X in a non-contact manner. In some embodiments, the drive device may be at least partially arranged below the first carrier 11. [ The drive device may include a drive configured to move the first carrier by applying a magnetic force on the first carrier, such as a linear motor.

[0034] The apparatus 100 is configured to move from the first transport path in a second direction Z transverse to the first direction X, essentially perpendicularly to the first direction X, A first shifting device 41 (also referred to herein as a " cross drive device ") configured to move the first carrier 11 to the mounting portion 21. [ 1A, the first direction X is a horizontal direction, and the second direction Z is a horizontal direction that is essentially perpendicular to the first direction X. In the embodiment of FIG. The first carrier transport system 31 may be configured to transport a first carrier into the deposition region 111 at a predetermined distance from the deposition source 110 and the first shifting device 41 may be configured to transport the first carrier into the deposition region 111 in a second direction Or to move the first carrier away from the deposition source 110 toward the deposition source 110 or to the deposition source 110. [

In some implementations the first shifting device 41 is moved to the first mounting portion 21 of the alignment system 20 until the first carrier 11 is brought into contact with the first mounting portion 21. [ To the first carrier (11) in a second direction (Z) towards the second carrier (11). The first mount 21 is configured to mechanically or magnetically hold and hold the first carrier 11 in the alignment system 20 with the first carrier 11 in contact with the first mount 21, . ≪ / RTI >

[0036] The first carrier transport system 31 may be configured to transport the first carrier 11 to the first position shown in FIG. 1A along the first carrier transport path, and in the first position, (11) is located a certain distance from the first mounting portion (21) of the alignment system (20). It may not yet be possible for the first mounting portion 21 to catch the first carrier 11 when the first carrier 11 is in the first position. The first shifting device 41 can be moved in the second direction 11 by a distance of 1 mm or more and / or 50 mm or less until the first carrier 11 contacts the first mount 21 Z) (" Z-transfer ") to the first mount 21 (see FIG. 1B). As a result, the first carrier 11 can be mounted on the first mounting portion 21, for example, by activating the magnetic chuck of the first mounting portion 21. [ A second position in which the first carrier 11 contacts the first mounting portion 21 and is held by the first mounting portion 21 is schematically shown in Figure 1B.

[0037] According to the embodiments described herein, a common support structure 50 for supporting or holding at least a portion of the alignment system 20 and at least a portion of the first shifting device 41 is provided.

[0038] In particular, the common support structure 50 may support or hold the first mount 21 and the alignment unit 25 of the alignment system 20. For example, the common support structure 50 connects the first mounting portion 21 and the alignment unit 25 of the alignment system 20 to the vacuum chamber 101, so that the alignment unit 25 can be used to deposit a vacuum chamber Is held in place in the region (111).

[0039] Additionally, the common support structure 50 also supports at least a portion of the first shifting device 41, particularly the actuators and / or bearings of the first shifting device 41. The first shifting device 41 may include a moveable part 42 movable in a second direction Z through an actuator 43, (43) may be supported on a common support structure (50). In some embodiments, the movable part 42 includes a magnetic unit configured to move the first carrier 11 in a noncontact manner toward the first mounting portion 21 by applying a magnetic force on the first carrier 11 can do.

[0040] In some embodiments, which may be combined with other embodiments described herein, the actuator 43 and the moveable part 42 may include, for example, mechanical amplification of the stroke of the piezoelectric- And an integrated drive unit including a piezo-actuator integrated with the structure for the piezoelectric actuator. The structure for mechanical amplification of the stroke may be a flexible structure. In particular, the shifting device may include an amplification type piezoactuator including a mechanical amplification mechanism utilizing lever arms and / or spring leaves in particular. For example, the piezoelectric stroke can be amplified by a factor of 10, 20, or more. The integrated drive device may be provided entirely in the vacuum chamber, for example fixed to a common support structure.

1A and 1B, the common support structure 50 can support the actuator 43 of the first shifting device 41 in the vacuum chamber 101, It is possible to hold the first mounting portion 21 and the alignment unit 25 of the mounting portion 20. The first shifting device may move the first carrier 11 in the second direction Z towards the first mount 21 and / or move the first carrier 11 toward the first mount 21). ≪ / RTI >

In some embodiments, which may be combined with other embodiments described herein, the common support structure 50 may include at least a portion of the alignment system 20, particularly at least a portion of the alignment system 20, The mounting portion 21 and the alignment unit 25 are connected. In addition, the bearings and / or actuators of the first shifting device 41 may be attached to the common support structure 50. In particular, the first shifting device 41 and the alignment system 20 may be connected to the vacuum chamber 101 via a common support structure 50.

[0043] According to the embodiments described herein, at least a portion of the first shifting device 41 and at least a portion of the alignment system 20 are held by the same support structure. Therefore, no additional support structure or mount is required to connect the first shifting device 41 to the vacuum chamber 101. [ Rather, the common support structure 50 can hold both the first shifting device and the alignment system in the vacuum chamber, which saves space and reduces the cost of the first substrate 21 Both of which can enable the arrangement of the first shifting device 41 to be done. Arranging the first shifting device 41 and the alignment system 20 in close proximity to one another in the vacuum chamber 101 can reduce the complexity and weight of the device. In addition, when both the first shifting device and the alignment system are fixed to the same common support structure, the tolerance chain can be kept small. In particular, the first shifting device 41 and the alignment unit 25, both configured to move and position the first carrier in the vacuum chamber 101, can be connected to the vacuum chamber via a common mechanical connection. Thus, the deposition accuracy as well as the alignment accuracy of the first carrier in the vacuum chamber can be improved.

The common support structure 50 includes a support bar, a support frame, an attachment support, and a housing (not shown) configured to hold a portion of the alignment system 20 and a portion of the first shifting device 41. [ Such as an aligner housing, for example. In one embodiment, the common support structure 50 comprises a support frame or support bar connected to the vacuum chamber 101, wherein at least one actuator and / or bearing of the first shifting device 41, At least one alignment unit of the frame 20 is mounted on the support frame. In some implementations, a plurality of actuators and / or bearings of the first shifting device, and a plurality of alignment units may be mounted to the support frame.

[0045] In some embodiments, the common support structure 50 includes an aligner housing secured directly or indirectly to the vacuum chamber 101, wherein the aligner housing includes at least one , Wherein at least one actuator and / or bearing of the first shifting device (41) is fixed to the aligner housing.

[0046] In some embodiments, the first shifting device 41 is provided entirely in the vacuum chamber 101. An actuator 43 and a movable part 42 of the first shifting device 41 are provided in the vacuum chamber 101 and the common support structure 50 . The actuators of the first shifting device 41 may be arranged outside the vacuum chamber 101 and the bearings of the first shifting device 41 may be provided inside the vacuum chamber 101 And may be fixed to the common support structure 50. The bearing may support a moveable part of the first shifting device. In particular, according to the embodiments described herein, at least one of the actuators and bearings of the first shifting device 41 may be arranged inside the vacuum chamber 101, .

[0047] In some embodiments, which may be combined with other embodiments described herein, the first shifting device 41 is configured to move the movable part 42 of the first shifting device 41 Wherein the actuator 43 comprises a piezoelectric actuator, a linear motor, a coil, a servo motor, a walking drive, a piezoelectric stepper motor, a spindle drive, a pneumatic actuator, and a voice coil, Or the like.

The movable part 42 of the first shifting device 41 is configured to non-contactly shift the first carrier 11 in the second direction Z by applying a magnetic force on the first carrier 11 Lt; / RTI > For example, the moveable part 42 may include magnetic side guides for the first carrier 11, including a plurality of magnets. When the magnets are moved in the second direction Z by the actuator 43, the first carrier 11 maintains a constant distance in the second direction Z between the magnets and the first carrier 11 , The movement of the magnets can be followed.

[0049] In some embodiments, the apparatus 100 described herein may be operated as follows.

First, the first carrier 11 for holding the substrate 10 is moved into the deposition region 111 along the first transport path in the first direction X by the first carrier transport system 31 It is transported. The first carrier 11 can be stopped at the first position shown in Fig. 1A, and in its first position, the substrate 10 faces the deposition source 110. In the first position, the first carrier 11 is positioned at a distance of 1 mm or more from the first mounting portion 21 of the alignment system 20, e.g., in the second direction Z, and at a distance of 10 mm or less .

The first carrier 11 is then moved by the first shifting device 41 in the second direction Z toward the first mounting portion 21 of the alignment system 20. 1B shows a second position of the first carrier 11, and in its second position, the first carrier contacts the first mounting portion 21 of the alignment system. The first mounting portion 21 can magnetically mount the first carrier 11 on the alignment system 20.

The first carrier 11 can then be precisely positioned in the deposition area 111 by the alignment unit 25 of the alignment system 20 and the alignment unit 25 can be positioned precisely in the at least one direction 1 mounting portion 21 of the apparatus. The first carrier 11 may be positioned with respect to a mask arranged in front of the substrate 10.

After alignment of the first carrier 11, a coating material 112 may be deposited on the substrate 10 by a deposition source 110. In some embodiments, the deposition source 110 is a vapor source configured to direct the vaporized material toward the substrate.

[0054] According to the embodiments described herein, at least a portion of the alignment system 20 and at least a portion of the first shifting device 41 are connected to the vacuum chamber 101 via a common support structure 50 . Thus, the tolerance chain can be kept small and the complexity of the first shifting device and alignment system can be reduced.

[0055] FIG. 2a is a schematic diagram of an apparatus 200 according to embodiments described herein, wherein a first carrier 11 and a second carrier 13 are arranged in a first position. Figure 2b is a schematic view of the apparatus 200 of Figure 2a, in which the first carrier 11 and the second carrier 13 have moved to the second position.

As shown schematically in FIG. 2A, the apparatus 200 includes a vacuum chamber 101, wherein an alignment system 120 is provided in the vacuum chamber 101. The alignment system 120 may be configured to accurately position the first carrier 11 with respect to the second carrier 13. The first carrier 11 may be a substrate carrier configured to hold the substrate 10 and the second carrier 13 may be a mask carrier configured to hold the mask. Thus, the alignment system 120 is configured to align the substrate 10 held by the first carrier 11 with respect to the mask held by the second carrier 13.

[0057] A deposition source 110 may be provided in the vacuum chamber 101. The deposition source 110 may be configured to direct the coating material 112 toward the deposition region 111 in which the alignment system 120 is arranged. The coating material 112 may be deposited on the substrate 10 through a mask. A material pattern corresponding to the opening pattern of the mask can be deposited on the substrate by the evaporation source 110, for example, by evaporation.

The alignment system 120 includes a first mounting portion 121 for mounting the first carrier 11 on the alignment system 120 and a second mounting portion 121 for mounting the second carrier 13 on the alignment system 120. [ 2 mounting portion 122, as shown in Fig. In addition, the alignment system 120 includes an alignment unit 125 for moving the first mount 121 and the second mount 122 relative to each other in at least one direction, particularly in two or more directions, . The first carrier 11 can be aligned with the second carrier 13 by moving the first mounting portion 121 with respect to the second mounting portion 122. [

[0059] In some embodiments, the alignment unit 125 is configured to be aligned in a first direction X, in a second direction Z, and / or perpendicular to the first direction X and the second direction Z And may be configured to move the first mounting portion 121 with respect to the second mounting portion 122 in the third direction Y. [

[0060] In some embodiments, which may be combined with other embodiments described herein, the first mounting portion 121 may include a first mounting portion 121 that is configured to magnetically clamp the first carrier 11 to the first mounting portion 121, And / or the second mount 122 includes a magnetic chuck configured to magnetically clamp the second carrier 13 to the second mount 122. In some embodiments, the magnetic chuck may include an electromagnet with a controller configured to activate and / or deactivate the magnetic field of the electromagnet. In some embodiments, the magnetic chuck includes an electropermanent magnet assembly (EPM) with a controller configured to activate a magnetic chucking force of the permanent magnet device by applying an electric pulse.

The apparatus 200 includes a first carrier transport system 31 configured to transport a first carrier 11 along a first transport path in a first direction X and a second carrier transport system 31 configured to transport a first And a second carrier transport system (32) configured to transport the second carrier (13) along the transport path. The first carrier 11 and the second carrier 13 can be transported into the deposition region 111, for example, essentially parallel to each other at a distance of 5 cm or less from each other. For example, the substrate carrier track and the mask carrier track may extend essentially parallel to each other in the deposition region 111. [ In some embodiments, the substrate carrier track and the mask carrier track may be provided at equal heights in a vertical direction. In some embodiments, as schematically shown in Figure 2A, the substrate carrier track and the mask carrier track may be provided at different heights in the vertical direction. In the illustrated embodiment, the second carrier 13 has a larger dimension than the first carrier 11 in the vertical direction, and the mask carrier tracks are arranged at a lower height than the substrate carrier track.

The first carrier transport system 31 and the second carrier transport system 32 may be configured to transport the first carrier 11 and the second carrier 13 into the deposition region 111. In the deposition region 111, a second carrier 13 for holding the mask may be arranged between the first carrier 11 and the deposition source 110. In particular, the second transport path is located between the first transport path and the deposition source 110 in the second direction Z. A coating material 112 may be deposited on the substrate 10 through a mask held by the second carrier 13 from the deposition source 110. [

[0063] In some embodiments, the first carrier transport system 31 is configured to transport the first carrier 11 in a non-contact manner along the first transport path, and / or the second carrier transport system 32 And is configured to transport the second carrier 13 in a non-contact manner along the second transport path in the first direction X. [ For example, the first carrier transport system 31 may hold and transport the first carrier 11 by magnetic forces, and / or the second carrier transport system 32 may be capable of holding and transporting the second carrier 13 ) Can be held and transported. In particular, the first carrier transport system 31 and / or the second carrier transport system 32 may include magnetic levitation devices.

The apparatus 200 includes a first shifting device 141 configured to move a first carrier 11 from a first transport path to a first mounting portion 121 of the alignment system 120, Further comprising a second shifting device (142) configured to move the second carrier (13) from the path to the second mounting portion (122) of the alignment system. The second direction Z may be essentially perpendicular to the first direction X, i.e. perpendicular to the transport direction of the carriers. In particular, the first carrier transport system 31 may be configured to transport a first carrier into the deposition region 111 at a predetermined distance from the first mounting portion 121, and the first shifting device 141 may be configured to transport the first carrier, (Toward the deposition source 110 in the exemplary embodiments of FIG. 2A) toward the first mounting portion 121 in the direction Z in FIG. The second carrier transport system 32 may be configured to transport a second carrier into the deposition region 111 at a predetermined distance from the second mount 122 and the second shifting device 142 may be configured to transport the second carrier into the deposition region 111 in a second direction Z) away from the deposition source 110 (in the exemplary embodiment of FIG. 2B) toward the second mount 122. The first shifting device 141 and / or the second shifting device 142 may be configured according to the first shifting device 41 shown in FIGS. 1A and 1B, The above embodiments can be referred to.

The second shifting device 142 is configured to move the second carrier 11 in a direction opposite to the direction in which the first shifting device 141 shifts the first carrier 11 toward the first loading portion 121, To the second carrier (13). The first carrier 11 and the second carrier 13 can be moved to opposite sides of the alignment system 120 in which the first mounting portion 121 and the second mounting portion 122 are arranged, The second shifting device 141 and the second shifting device 142.

In some implementations, at least a portion of the first shifting device 141, at least a portion of the second shifting device 142, and at least a portion of the alignment system 120 are supported by a common support structure 150 Held or supported. In particular, the first mounting portion 121, the second mounting portion 122, and the alignment unit 125 of the alignment system 120 are arranged such that the alignment system 120 is connected to the vacuum chamber 101 by a common support structure, And can be held by the common support structure 150. Additionally, the actuators and / or bearings of the first shifting device 141 and the actuators and / or bearings of the second shifting device 142 may be secured to the common support structure 150. The common support structure 150 may be constructed in accordance with the common support structure 50 shown in FIG. 1A, so that the above description, which is not repeated herein, may be referred to.

When at least a portion of the first shifting device 141 and at least a portion of the second shifting device 142 are attached to a common support structure 150 that also holds the alignment system 120, The error chain can be reduced. The manufacturing and installation of the device 200 can be facilitated and the alignment accuracy of the carriers with respect to each other can be improved.

[0068] In some embodiments, the first shifting device 141 and / or the second shifting device 142 are each configured to move the movable part, and the movable part in the second direction Z, And may comprise a configured actuator. The movable part can be configured to non-contactly shift the carrier in the second direction (Z) by applying a magnetic force on the carrier.

In particular, the first shifting device 141 and the second shifting device 142 may include a magnetic unit configured to non-contactly shift the carrier in the second direction Z. For example, the movable part may comprise a magnetic side guide configured to stabilize the carrier at a constant distance from the side guides in the second direction Z. The actuators and / or magnetic side guides of the shifting devices may be arranged in a vacuum chamber, in particular supported by a common support structure 150.

In some implementations, the actuators of the first and second shifting devices may be piezoelectric actuators, linear motors, or piezoelectric actuators, each of which is arranged in a vacuum chamber 101, Lt; / RTI >

In some embodiments, which may be combined with other embodiments described herein, the common support structure 150 includes an aligner housing that houses the alignment unit 125 of the alignment system 120, Here, the actuators and / or bearings of the first and second shifting devices are attached to the aligner housing. The aligner housing may be fixed directly or indirectly to the inner wall of the vacuum chamber 101.

[0072] In some embodiments, which may be combined with other embodiments described herein, the actuators and / or bearings of the first shifting device 141 are attached to the first side of the common support structure 150 The actuators and / or bearings of the second shifting device 142 are attached to the second side of the common support structure 150 opposite the first side. 2A, the first shifting device 141 is attached to the lower side of the common support structure 150 and the second shifting device 142 is attached to the lower side of the common support structure 150 And is attached to the upper side. Thus, the first carrier 11 and the second carrier 13 can be shifted in a second direction Z towards and away from each other without interfering with each other, Are arranged on opposite sides of the common support structure.

2B, the first carrier 11 and the second carrier 13 are rotated until the first carrier contacts the first loading portion 121 and the second carrier comes in contact with the second loading portion 122 Through the first shifting device 141 and the second shifting device 142, toward each other in the second position. The first carrier 11 and the second carrier 13 are arranged such that the alignment system is at least partially arranged between the first carrier 11 and the second carrier 13. In the second position, And is mounted on two opposing surfaces. In the second position, the first carrier may be aligned with respect to the second carrier by moving the first mounting portion with respect to the second mounting portion using the alignment unit 125 of the alignment system.

In some embodiments, which may be combined with other embodiments described herein, the alignment system 120 includes a plurality of alignment units (not shown) for aligning the first carrier 11 with respect to the second carrier 13, . The upper alignment unit 126 and the lower alignment unit 127 are illustratively shown in FIG. 2A. Further alignment units may be provided. For example, at least four alignment units may be provided for spaced positions in a common support structure to align the first carrier 11 with respect to the second carrier 13, e.g., at four corners of the carriers .

[0075] The upper alignment unit 126 and the lower alignment unit 127 can be held by a support frame of a common support structure. Alternatively, the upper alignment unit 126 may be held by the upper aligner housing or the upper support bar 151 of the common support structure 150, and the lower alignment unit 127 may be held by the common support structure 150 And can be held by the lower aligner housing or the lower support bar 152.

The alignment system 120 includes a plurality of first mounts for mounting a first carrier 11 on an alignment system and a plurality of second mounts 12 for mounting a second carrier 13 on the alignment system 120. [ And may include mounting portions. In the exemplary embodiment of FIG. 2A, the upper alignment unit 126 is connected between the upper first mounting portion and the upper second mounting portion, and the lower alignment unit 127 is connected between the lower first mounting portion and the lower second mounting portion . Additional mounts and alignment units may be provided. Each alignment unit of the plurality of alignment units may be configured to move each first mount relative to each second mount to align the first carrier 11 with respect to the second carrier 13. [

[0077] In some embodiments, an upper shifting device 143 configured to move the first carrier 11 (the upper portion of the first carrier 11) in a second direction Z, A lower shifting device 144 configured to move the first carrier 11 (the lower portion of the first carrier 11) to the second carrier Z may be provided. At least a portion of the upper shifting device 143 may be supported or held by the upper aligner housing or upper support bar 151 of the common support structure 150 and at least a portion of the lower shifting device 144 may be supported by a common Or may be supported or held by the lower aligner housing or lower support bar 152 of the support structure 150. Similarly, at least one upper shifting device configured to move the upper portion of the second carrier 13 in the second direction Z and a lower portion of the second carrier 13 in the second direction Z At least one lower shifting device configured to move the substrate may be provided.

[0078] In some embodiments, the alignment unit 125 may be configured to move the first mount 121 relative to the second mount 122 in a second direction Z. Accordingly, the distance between the first carrier 11 and the second carrier 13 can be appropriately adjusted by the alignment unit 125. [ Alternatively or additionally, the alignment unit 125 may be configured to move the first mounting portion 121 relative to the second mounting portion 122 in a first direction X. [ Therefore, the relative position between the mask and the substrate in the width direction of the substrate can be appropriately adjusted by the alignment unit 125. [ Alternatively or additionally, the alignment unit 125 may be mounted to the first mounting portion 121 (e.g., the first mounting portion 122) with respect to the second mounting portion 122 in a third direction Y perpendicular to the first direction X and the second direction Z ). ≪ / RTI > Thus, the relative position between the mask and the substrate in the height direction of the substrate can be appropriately adjusted by the alignment unit 125. [

[0079] The alignment unit 125 may include one or more piezoelectric actuators for moving the first mount relative to the second mount in one or more directions. Alternatively, the alignment unit may be selected from the group consisting of stepper actuators, brushless actuators, DC (direct current) actuators, voice coil actuators, and pneumatic actuators.

[0080] In some embodiments, the deposition source 110 may be a vapor source configured to direct the vaporized material toward the substrate 10. The deposition source 110 may be movable along a source transport track that may be provided in the vacuum chamber 101. In particular, the deposition source 110 may be movable past the substrate in a first direction X. The first direction X may correspond to the width direction of the substrate 10. The deposition source 110 may be moved past the substrate 10 in the width direction of the substrate 10 to deposit the coating material 112 on the substrate 10.

[0081] The deposition source 110 may be provided as a line source extending in the third direction Y, that is, the essential vertical direction. The height of the vertical deposition source 110 can be adapted to the height of the vertically oriented substrate so that the substrate can be coated by moving the deposition source 110 past the substrate in the first direction X. [

[0082] The deposition source 110 may include a distribution pipe having a plurality of vapor openings or nozzles for directing the coating material 112 toward the deposition region 111. Additionally, the deposition source 110 may include a crucible configured to heat and vaporize the coating material. The crucible may be connected to a distribution pipe, e.g., in fluid communication with the distribution pipe.

[0083] In some embodiments, which may be combined with other embodiments described herein, the deposition source 110 may be rotatable. For example, the deposition source may be rotatable from a first orientation in which the vapor openings of the deposition source are directed toward the deposition region 111, to a second orientation in which the vapor openings are directed toward the second deposition region. The deposition region 111 and the second deposition region may be located on opposite sides of the deposition source 110 and the deposition source may be rotatable at an angle of about 180 between the deposition region and the second deposition region.

[0084] Figures 2a and 2b further illustrate a system for processing a substrate, according to embodiments described herein. The system includes an apparatus according to any of the embodiments described herein, a first carrier 11 configured as a substrate carrier mounted on a first mounting portion 121 of the alignment system 120, And a second carrier 13 configured as a mask carrier mounted on the mounting portion 122.

[0085] FIG. 3 is a schematic cross-sectional view of an apparatus 300 according to embodiments described herein. 4 is a schematic front view of an apparatus 300 according to embodiments described herein. Apparatus 300 may include some or all of the features of the previously described embodiments that are not repeated herein.

[0086] The apparatus 300 includes a vacuum chamber 101, wherein a portion of the wall of the vacuum chamber 101 is shown in FIG. A common support structure 150 is secured to the wall of the vacuum chamber.

The alignment system 120 configured to align the first carrier 11 with respect to the second carrier 13, the bearing 301 of the first shifting device 141, and / or the second shifting device 142 are held by the common support structure 150 in the vacuum chamber 101. In this way, In particular, the alignment unit 125, the bearing 301, and the second bearing 302 are connected to the vacuum chamber 101 via the common support structure 150. The common support structure 150 includes a support bar, a support frame, an aligner housing, or any other type of support that connects the alignment unit 125, the bearing 301 and the second bearing 302 to the vacuum chamber 101. [ Lt; / RTI >

[0088] One benefit of the common support structure 150 is that the tolerance chain of shifting devices is based on the same reference as the alignment system. This reduces tolerance specifications and simplifies assembly.

[0089] In the embodiment shown in FIG. 3, the common support structure 150 includes an aligner housing 305 housing the alignment unit 125 of the alignment system 120. In some embodiments, the common support structure 150 may include a plurality of aligner housings, wherein each aligner housing houses an alignment unit 125 of the alignment system 120. In some embodiments, The aligning units are configured to move each first mount relative to each second mount to align the first carrier (11) mounted on the first mounts with respect to the second carrier (13) mounted on the second mountings .

[0090] In some embodiments, which may be combined with other embodiments described herein, the first shifting device 141 includes a movable part 311, a movable part 311 in a second direction Z And a bearing 301 for movably supporting the movable part 311 in the common support structure 150. The actuator 311 may be configured to move the movable part 311 to the common support structure 150, In other words, the movable part 311 can be supported on the common support structure 150 via the bearing 301. [ The bearings 301 may be attached to the common support structure 150 in the vacuum chamber 101. In the embodiment of FIG. 3, the bearing 301 is attached to the aligner housing 305 in the vacuum chamber 101.

The movable part 311 may include a magnetic unit configured to non-contactly shift the first carrier 11 in the second direction Z by applying a magnetic force on the first carrier 11.

The actuator 321 may be arranged in the vacuum chamber 101 or outside the vacuum chamber 101. 3, the actuator 321 is arranged outside the vacuum chamber and the movable part 311 is moved from the actuator 321 into the interior of the vacuum chamber 101 through the wall of the vacuum chamber 101 Where the movable part 311 is supported by the bearing 301. [ For example, the actuator may include a servo motor, a piezoelectric stepper motor, or a walking drive. Providing the actuator 321 outside the vacuum chamber may be beneficial in some applications because the maintenance of the actuator can be facilitated and the space requirements outside the vacuum chamber can be less stringent. In other applications, it may be advantageous to provide an actuator 321 within the vacuum chamber, which may require a feed-through for guiding the moveable part 311 through the wall of the vacuum chamber < RTI ID = 0.0 > It can not be.

The movable part 311 can be supported on the common support structure 150 by the bearing 301. The bearing 301 can be configured as a flexible structure that can guide the moveable part 311, without creating friction of the particles essentially in the second direction Z. [

[0094] In some embodiments, the bearing 301 may be a flexible mechanism, that is, a flexible mechanism, that transmits the input force provided by the actuator 321, through deformation of the elastic body. The actuator may, for example, be connected to a flexible mechanism integrated with the elastic body, or may be formed integrally with the flexible mechanism. The elastomeric body may include at least one elastically deformable body, such as a leaf spring. By attaching a compliant mechanism to the same support structure as the alignment system 20, the tolerance chain of the first shifting device 141 is based on the same criteria as the tolerance chain of the alignment unit 125. [ Thus, the installation of the device can be simplified.

[0095] The flexibility mechanism of the first shifting device may be configured as a cantilever beam arrangement, eg, vertical arrangement, horizontal arrangement, or combination. The flexibility mechanism can be fabricated by electrical EDM (electrical discharge machining) cutting of metal, e.g., titanium blocks. The particle generation due to the relative movement between the parts in the vacuum chamber can be reduced or completely prevented.

In addition, a second shifting device 142 may be provided to move the second carrier 13 in a second direction Z toward the second mounting portion 122 of the alignment system 120. The second shifting device 142 may be configured in a manner similar or the same as the first shifting device 141, so that the above description may be referred to. In particular, the second shifting device 142 may include a second bearing 302 attached to an aligner housing 305 housing a common support structure 150, particularly an alignment unit 125.

The second shifting device 142 may include a second actuator 322 configured to move the second moveable part 312 in a second direction Z, The part 312 is supported on a common support structure 150 via a second bearing 302. The bearing 302 may be constructed as a flexible structure that is capable of guiding the moveable part 312 essentially without creating friction of the particles. In some embodiments, the second bearing 302 may be a flexible mechanism. The elastomeric body may include at least one elastically deformable body, such as a leaf spring.

By attaching the flexibility mechanism of the first shifting device 141 and the flexibility mechanism of the second shifting device 142 to the same support structure as the alignment system 120, the first shifting device 141, The two shifting device 142, and the alignment unit 125 are based on the same criteria.

In some embodiments, the bearing 301 of the first shifting device 141 is attached to the first side, eg, the top side, of the aligner housing 305, and the second shifting device 142 The second bearing 302 is attached to the second side of the aligner housing 305 opposite the first side, e.g., the lower side.

3, the common support structure 150 may include at least one additional aligner housing 306 for holding at least one additional alignment unit, wherein additional alignment The bearings of the device can be supported on an additional alignment housing.

[00101] FIG. 4 shows the device 300 of FIG. 3 in front view. As shown schematically in FIG. 4, the common support structure 150 may include a plurality of supports, such as three upper supports and three lower supports. Each support includes an aligner housing 305 housing the alignment unit 125 of the alignment system 120 configured to move the respective first mounts 121 relative to the respective second mounts 122 .

[00102] At least a portion of the first shifting device 141 for moving the first carrier 11 in the second direction Z and at least a portion of the first shifting device 141 for moving the second carrier 13 in the second direction Z, At least a portion of the second shifting device 142 may be attached to each of the supports of the common support structure 150.

[00103] In some implementations, the first shifting device 141 may include a magnetic side guide 313 configured to non-contactly shift the first carrier 11 in a second direction Z, where The magnetic side guide 313 can be supported on a plurality of supports, particularly aligner housings 305, through a plurality of bearings, particularly a plurality of flexible mechanisms. The bearings may be attached to the aligner housings 305 of the common support structure 150. The bearings may be constructed as flexible mechanisms including flexible elements for transferring the displacement force of one or more actuators to the magnetic side guide 313. Therefore, the magnetic side guide 313 can be shifted in the second direction Z. [

[00104] Similarly, the second shifting device 142 may include a magnetic side guide configured to non-contactly shift the second carrier 13 in a second direction Z, The magnetic side guides of the locking device 142 may be supported on a plurality of supports via a plurality of bearings, particularly a plurality of flexible mechanisms.

[00105] In another embodiment, the common support structure comprises a support frame, wherein each alignment unit of the plurality of alignment units is attached to a support frame. Additionally, actuators and / or bearings of the first shifting device, and actuators and / or bearings of the second shifting device may be attached to the support frame. The support frame may be connected to the vacuum chamber via a mechanical isolation element, e.g., a vibration damper, to decouple the vibrations of the vacuum chamber from the support frame holding the alignment system as well as the shifting devices.

[00106] Figures 5A-D illustrate various stages of a method of transporting carriers in a vacuum chamber, in accordance with methods described herein. 5A to 5D, the substrate carrier (first carrier 11) is transported and aligned with respect to the mask carrier (second carrier 13). The method can be performed with the sequence shown in Figs. 5A to 5D. Alternatively, the order of some of the stages may be changed.

5A, a second carrier 13 carrying a mask is moved by a second carrier transport system 32 along a second transport path in a first direction X to a deposition area 111 (FIG. Lt; / RTI > The second carrier transport system 32 may be a transport system configured to transport the second carrier in a noncontact manner, including, for example, a levitation system.

The second carrier 13 is stopped at the first position shown in FIG. 5A, and at its first position, the second carrier 13 is moved from the first side of the alignment system 120 to the second stage 122 As shown in FIG.

5b, the second carrier 13 is displaced by the second shifting device 142 toward the second mount 122 of the alignment system 120, essentially perpendicular to the first direction X in the first direction X, And is laterally shifted in the second direction Z. [ The second shifting device 142 may be configured as a cross drive device that may include a moveable part for shifting the second carrier 13 toward the second mount 122.

5b, the second shifting device 142 can be moved in the second direction (the second direction) until the second carrier 13 comes in contact with the second mounting portion 122 of the alignment system 120. [00110] Z to the alignment system 120 from the second transport path. For example, the second shifting device may shift the second carrier in the second direction Z by a distance of 4 mm or more and 10 mm or less.

The second carrier 13 can be mounted on the second mount 122 by, for example, activating the magnet of the second mount 122, so that the second carrier 13 can be mounted on the second mount 122 and is held by the second mount in the alignment system 120. [

5b a first carrier 11 carrying a substrate 10 is deposited by a first carrier transport system 31 along a first transport path in a first direction X, Region < RTI ID = 0.0 > 111. The first carrier transport system 31 may be a transport system configured to transport the first carrier in a noncontact manner, including for example a levitation system.

The first carrier 11 is stopped at the first position shown in FIG. 5B, and in its first position, the first carrier 11 is located on the opposite side of the first side in which the second carrier 13 is arranged Is arranged on the second side of the alignment system (120). In particular, the first carrier 11 may be arranged between the walls of the vacuum chamber (not shown in Figure 5B) and the alignment system 120.

In Figure 5c the first carrier 11 is displaced by the first shifting device 141 toward the first mounting portion 121 of the alignment system 120 in a direction substantially perpendicular to the first direction X in the first direction X, And is laterally shifted in the second direction Z. [ The first shifting device 141 may be configured as a cross drive device that may include a moveable part for non-contactly shifting the first carrier 11 toward the first mount 121. For example, the first shifting device 141 may shift the substrate carrier in the second direction Z by a distance of 4 mm or more and 10 mm or less toward the alignment system.

As shown in FIGS. 5B and 5C, the second shifting device 142 is configured to move the second carrier 11 in a direction opposite to the direction in which the first shifting device is shifting the first carrier 11, (13). ≪ / RTI > Thus, the first carrier 11 and the second carrier 13 may be shifted toward opposite sides of the alignment system 120, respectively, through the first shifting device and the second shifting device.

The first carrier 11 can be mounted on the first mounting portion 121 by activating the magnet of the first mounting portion 121 so that the first carrier 11 can be mounted on the first mounting portion 121 121 and is held by the first mounting portion in the alignment system 120. [

5D, the first carrier 11 is supported on the second carrier 13 by an aligning unit 125 provided in a mechanical connecting path between the first mounting portion 121 and the second mounting portion 122 . Thus, the mask and the substrate are aligned with respect to each other with high accuracy. The coating material 112 may then be deposited on the substrate, particularly by evaporation.

[00118] Actuators and / or bearings of the first shifting device 141 and the second shifting device 142 as well as the alignment system 120 are supported or held by a common support structure.

[00119] FIG. 6 is a flow diagram that schematically illustrates a method of transporting carriers in accordance with methods described herein.

In the box 710, the first carrier 11 carrying the substrate 10 is transported into the deposition region 111 along the first transport path in the first direction X. [00120]

[00121] In box 720, the first carrier 11 is moved by the first shifting device from the first transport path in the second direction Z transverse to the first direction to the first mounting portion of the alignment system Wherein at least a portion of the first shifting device and at least a portion of the alignment system are supported or held by a common support structure.

[00122] At box 730, the first carrier 11 is mounted on a first mounting portion of the alignment system.

[00123] At box 740, the first carrier is aligned by an alignment system.

[00124] At box 750, a coating material is deposited on the substrate.

[00125] The method comprises the steps of transporting a second carrier 13 carrying a mask along a second transport path in a first direction X, in a box 705, which may be carried out before box 710, Moving the second carrier (13) from the second transport path to the second mounting portion of the alignment system by the second shifting device, at least a portion of the second shifting device being supported or held by a common support structure, and And optionally mounting a second carrier to a second mounting of the alignment system.

[00126] Alignment in the box 740 may include moving the first mount relative to the second mount to align the first carrier 11 with respect to the second carrier 13.

[00127] The apparatus described herein may be configured for the manufacture of OLED devices, for example, to evaporate organic materials. By way of example, the deposition source may be an evaporation source, particularly an evaporation source for depositing one or more organic materials on a substrate to form a layer of an OLED device.

[00128] The embodiments described herein can be utilized for evaporation on large area substrates, for example for OLED display manufacturing. In particular, the substrates on which structures and methods according to embodiments described herein are provided are large area substrates having a surface area of, for example, 0.5 m2 or more, especially 1 m2 or more. For example, a large area substrate or carrier may have a GEN 5 corresponding to a surface area of about 0.67 m 2 (0.73 x 0.92 m), a GEN 5 corresponding to a surface area of about 1.4 m 2 (1.1 m x 1.3 m) m, corresponding to the surface area of GEN 7.5, about 5.7 m 2 (2.2 mx 2.5 m), or even GEN 8 corresponding to a surface area of about 8.7 m 2 (2.85 mx 3.05 m). Larger generations such as GEN 11 and GEN 12 and corresponding surface areas can similarly be implemented. Half sizes of GEN generations can also be provided for OLED display manufacture.

[00129] According to some embodiments, which may be combined with other embodiments described herein, the substrate thickness may be between 0.1 mm and 1.8 mm. The substrate thickness may be about 0.9 mm or less, such as 0.5 mm. The term "substrate" as used herein may in particular comprise substantially unregulated substrates, for example slices of transparent crystals such as wafers, sapphire, etc., or glass plates. However, the present disclosure is not so limited, and the term "substrate" may also include flexible substrates such as webs or foils. The term "substantially unlikely" is understood to mean "flexible ". Specifically, a substantially non-flexible substrate, for example, a glass plate having a thickness of 0.9 mm or less, such as 0.5 mm or less, may have some degree of flexibility, wherein the flexibility of the substantially non- .

[00130] According to the embodiments described herein, the substrate may be made of any material suitable for material deposition. For example, the substrate may be formed of any material or material that can be coated by a deposition process, such as glass (e.g., soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound materials, ≪ / RTI > and combinations thereof.

[00131] The method described herein may include aligning the first carrier and the second carrier with respect to each other using an alignment unit of the alignment system. At least one of mechanical noise, vibrations from the system, and vibrations from the building, that is, dynamic and static deformations, that can be transferred from the vacuum chamber to the alignment system can be compensated or reduced by the mechanical isolation element, The mechanical isolation element may be arranged in a connection line between the alignment system and the vacuum chamber, and may in particular be incorporated in a common support structure.

[00132] The combination of pre-alignment via non-contact transport systems, such as a magnetic levitation system, and micro-alignment by mechanical contact by an alignment system, enables an alignment system with reduced complexity and reduced cost of ownership.

[00133] According to embodiments described herein, a method for aligning and / or transporting a substrate carrier and a mask carrier in a vacuum chamber uses computer programs, software, computer software products, and correlated controllers The correlated controllers may have input and output devices that communicate with the CPU, memory, user interface, and corresponding components of the device.

[0013] The present disclosure provides a first carrier transport system for a first carrier and a second carrier transport system for a second carrier, which can be equally sized in at least one dimension. In other words, the second carrier can be fitted in the first carrier transport system, and the first carrier can be fitted in the second carrier transport system. The first carrier transport system and the second carrier transport system can be used flexibly providing accurate and smooth transport of carriers through a vacuum system. The alignment system enables precise alignment of the substrate relative to the mask or vice versa. High quality processing results can be achieved, for example, for the production of high resolution OLED devices.

[00135] In other embodiments, mask carriers and substrate carriers can be sized differently. For example, the mask carriers may be larger, especially in the vertical direction, than the substrate carriers.

[00136] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure can be devised without departing from the basic scope thereof, and the scope of the present disclosure is defined by the following claims Is determined by the claims.

Claims (16)

As an apparatus (100, 200, 300) for processing substrates in a vacuum chamber (1010)
A first carrier transport system (31, 131) configured to transport a first carrier (11) along a first transport path in a first direction (X);
An alignment system (20, 120) comprising a first mounting part (21, 121) for mounting the first carrier (11) on an alignment system (20, 120);
A first shifting device configured to move the first carrier from the first transport path to the first loading part in a second direction Z transverse to the first direction X, 141); And
A common support structure (50, 150) for supporting or holding at least a portion of the alignment system (20, 120) and at least a portion of the first shifting device (41, 141)
/ RTI >
RTI ID = 0.0 > 1, < / RTI > The method according to claim 1,
The common support structure (50,150) connects at least a portion of the alignment system (20,120) to the vacuum chamber (101,201) and the actuators and bearings (301) of the first shifting device A second support structure attached to said common support structure,
RTI ID = 0.0 > 1, < / RTI > 3. The method according to claim 1 or 2,
The apparatus of claim 1, wherein the common support structure (50, 150) comprises an aligner housing (305) housing the alignment unit (25, 125) of the alignment system (20, 120), the first shifting device 41 and 141 and the bearing 301 are attached to the aligner housing 305,
RTI ID = 0.0 > 1, < / RTI > 4. The method according to any one of claims 1 to 3,
The first shifting device 41, 141 includes a movable part 311 supported on the common support structure 50, 150 via a bearing 301 including a flexible structure, in particular a flexible mechanism doing,
RTI ID = 0.0 > 1, < / RTI > 5. The method according to any one of claims 1 to 4,
The first shifting device 41,141 comprises an actuator, in particular a piezoactuator or a linear motor, arranged in the vacuum chamber 101 and fixed to the common support structure 50,151,
RTI ID = 0.0 > 1, < / RTI > 6. The method according to any one of claims 1 to 5,
A top shifting device (143) configured to move an upper portion of the first carrier in the second direction (Z), and a lower shifting device configured to move a lower portion of the first carrier in the second direction Shifting device 144,
RTI ID = 0.0 > 1, < / RTI > 7. The method according to any one of claims 1 to 6,
The first shifting device (41, 141) is configured to non-contactly shift the first carrier (11) in the second direction (Z) by applying a magnetic force on the first carrier (11) (311).
RTI ID = 0.0 > 1, < / RTI > 8. The method according to any one of claims 1 to 7,
The alignment system 120 includes a second mounting portion 122 for mounting a second carrier 13 to the alignment system 120 and a second mounting portion 122 for mounting the first mounting portion 121 and the second mounting portion 122 to each other And an alignment unit (125)
RTI ID = 0.0 > 1, < / RTI > 9. The method of claim 8,
Wherein the first mounting portion 121 includes a magnetic chuck magnetically clamping the first carrier 11 to the first mounting portion 121 and / or the second mounting portion 122 includes a second mounting portion 121, And a magnetic chuck configured to magnetically clamp the second carrier (13) to the mounting portion (122).
RTI ID = 0.0 > 1, < / RTI > 10. The method according to claim 8 or 9,
Further comprising a second shifting device (142) configured to move the second carrier (13) to the second mount (122) in the second direction (Z), the second shifting device (142) At least a portion of which is supported on or affixed to the common support structure (150)
RTI ID = 0.0 > 1, < / RTI > 11. The method of claim 10,
The common support structure 150 includes an aligner housing 305 housing the alignment unit 125 of the alignment system 120 and the actuator 321 of the first shifting device 141 and the bearing 301 is attached to a first side of the aligner housing (305), and at least one of an actuator and a bearing of the second shifting device (142) is located on the opposite side of the first side of the aligner housing Which is attached to the second side of the <
RTI ID = 0.0 > 1, < / RTI > The method according to any one of claims 8 to 11,
Further comprising a second carrier transport system (132) configured to transport the second carrier (13) along a second transport path in the first direction (X), the first carrier transport system (131) And the second carrier transport system (132) is configured to transport the second carrier (13) in a noncontact manner along the second transport path felled,
RTI ID = 0.0 > 1, < / RTI > An apparatus for processing a substrate in a vacuum chamber (101)
A first carrier transport system extending in a first direction (Z);
An alignment system including a first mounting portion;
A first shifting device extending in a second direction (Z) transverse to the first direction; And
A common support structure (50, 150) for supporting or holding at least a portion of the alignment system and at least a portion of the first shifting device,
/ RTI >
RTI ID = 0.0 > 1, < / RTI > A system for processing a substrate,
An apparatus (100) as claimed in any one of claims 8 to 12;
A first carrier (11) configured as a substrate carrier mounted on the first mounting portion; And
A second carrier (13) configured as a mask carrier mounted on the second mounting portion,
/ RTI >
A system for processing a substrate. CLAIMS 1. A method of transporting a carrier in a processing chamber,
Transporting the first carrier (11) along a first transport path in a first direction (X);
Using the first shifting device 141, the first carrier 11 is moved from the first transport path to the first mounting portion of the alignment system 120 in a second direction Z transverse to the first direction At least a portion of the first shifting device and at least a portion of the alignment system being supported or held by a common support structure (150);
Mounting the first carrier (11) on the first mounting portion of the alignment system (120); And
Aligning the first carrier (11) using the alignment system (120)
/ RTI >
A method of transporting a carrier. 16. The method of claim 15,
Transporting a second carrier (13) along a second transport path in the first direction (X);
Moving the second carrier (13) from the second transport path to a second mounting portion of the alignment system (120) using the second shifting device (142) Some supported or held by the common support structure (150); And
Mounting the second carrier (13) on the second mounting portion of the alignment system (120)
/ RTI >
Wherein the aligning step comprises moving the first mount relative to the second mount to align the first carrier (11) with respect to the second carrier (130).
A method of transporting a carrier.

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