CN109563609B - Apparatus and system for processing a substrate in a vacuum chamber and method of transporting a carrier in a vacuum chamber - Google Patents

Apparatus and system for processing a substrate in a vacuum chamber and method of transporting a carrier in a vacuum chamber Download PDF

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CN109563609B
CN109563609B CN201780028386.9A CN201780028386A CN109563609B CN 109563609 B CN109563609 B CN 109563609B CN 201780028386 A CN201780028386 A CN 201780028386A CN 109563609 B CN109563609 B CN 109563609B
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carrier
mount
displacement device
alignment system
substrate
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CN109563609A (en
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马蒂亚斯·赫曼尼斯
安娜贝儿·霍夫曼
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Applied Materials Inc
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Applied Materials Inc
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4587—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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Abstract

An apparatus (100) for processing a substrate (10) in a vacuum chamber (101) is described. The apparatus comprises a first carrier transport system, an alignment system (20, 120), a first displacement device (41, 141) and a common support structure (50, 150); the first carrier transport system is configured to transport a first carrier (11) in a first direction (X) along a first transport path; the alignment system (20, 120) comprises a first mount (21, 121) for mounting the first carrier (11) to the alignment system; a first displacement device (41, 141) configured to move the first carrier from the first transport path to the first mount in a second direction (Z), the second direction being transverse to the first direction (X); the common support structure (50, 150) supports or holds at least a portion of the alignment system (20, 120) and at least a portion of the first displacement device (41, 141). Further, a system for processing a substrate and a method of transporting a carrier in a vacuum chamber are described.

Description

Apparatus and system for processing a substrate in a vacuum chamber and method of transporting a carrier in a vacuum chamber
Technical Field
The present disclosure relates to an apparatus and system for processing a substrate in a vacuum chamber, and a method of transporting a carrier in a vacuum chamber. More specifically, a method of transporting, positioning and aligning a substrate carrier and a mask carrier in a vacuum chamber is described. The present disclosure is particularly directed to depositing a coating material on a substrate, wherein the substrate is aligned relative to a mask prior to deposition. The methods and apparatus described herein may be used to fabricate organic light-emitting diode (OLED) devices.
Background
Techniques for depositing layers on a substrate include, for example, thermal evaporation, Physical Vapor Deposition (PVD), and Chemical Vapor Deposition (CVD). The coated substrate can be used in several applications and in several technical fields. For example, the coated substrate may be used in the field of Organic Light Emitting Diode (OLED) devices. OLEDs can be used to manufacture television screens, computer monitors, cell phones and other hand held devices, etc. for displaying information. OLED devices, such as OLED displays, may include one or more layers of organic material disposed between two electrodes, all deposited on a substrate.
During deposition of the coating material on the substrate, the substrate may be held by a substrate carrier, while the mask may be held in front of the substrate by a mask carrier. A pattern of material (e.g., a plurality of pixels) corresponding to the opening pattern of the mask may be deposited on the substrate.
The function of an OLED device is generally dependent on the coating thickness of the organic material, which must fall within a predetermined range. In order to obtain high resolution OLED devices, technical challenges regarding deposition of evaporated materials must be overcome. In particular, it is challenging to accurately and smoothly transport the substrate carrier and the mask carrier by a vacuum system. Furthermore, precise alignment of the substrate with respect to the mask is critical to achieve high quality deposition results (e.g., for producing high resolution OLED devices). Furthermore, it is beneficial to use the coating material efficiently, while keeping the idle time of the system as short as possible.
In view of the foregoing, it would be beneficial to provide an apparatus and system for accurately and reliably transporting, positioning, and/or aligning a substrate and a mask in a vacuum chamber.
Disclosure of Invention
In view of the above, an apparatus for processing a substrate in a vacuum chamber, a system for processing a substrate in a vacuum chamber, and a method of transporting a carrier in a vacuum chamber are provided. Further aspects, benefits and features of the present disclosure will become apparent from the claims, specification and drawings.
According to an aspect of the present invention, there is provided an apparatus for processing a substrate in a vacuum chamber. The apparatus comprises: a first carrier transport system configured to transport a first carrier in a first direction along a first transport path; an alignment system comprising a first mount for mounting the first carrier to the alignment system; a first displacement device configured to move the first carrier from the first transport path to the first mount in a second direction, the second direction being transverse to the first direction; the common support structure supports or holds at least a portion of the alignment system and at least a portion of the first displacement device.
In an embodiment, the first carrier is a substrate carrier configured to hold a substrate; or the first carrier may be a mask carrier configured to hold a mask.
In certain embodiments, the common support structure supports or holds the first mount and an alignment unit of the alignment system, the alignment unit configured to align the first carrier in the vacuum chamber. In certain embodiments, the common support structure supports or holds the actuator and/or the bearing of the first displacement device.
According to another aspect of the present invention, there is provided an apparatus for processing a substrate in a vacuum chamber. The apparatus comprises a first carrier transport system, an alignment system, and a first displacement device; the first carrier transport system is configured to transport a first carrier in a first direction along a first transport path; the alignment system comprises a first mount for mounting the first carrier mount to the alignment system; the first displacement device is configured to move the first carrier from the first transport path to the first mount in a second direction, the second direction being transverse to the first direction. The first displacement device is arranged in the vacuum chamber, in particular held by a common support structure, which also holds the alignment system.
According to another aspect of the present invention, there is provided an apparatus for processing a substrate in a vacuum chamber. The apparatus comprises a first carrier transport system, an alignment system, a first displacement device and a common support structure; the first carrier transport system extends in a first direction; the alignment system includes a first mount; the first displacement means extends in a second direction, the second direction being transverse to the first direction; the common support structure supports or holds at least a portion of the alignment system and at least a portion of the first displacement device.
According to another aspect of the present invention, there is provided a system for processing a substrate in a vacuum chamber, the system comprising an apparatus for processing a substrate in a vacuum chamber according to any of the embodiments described herein, a first carrier and a second carrier; the first carrier is configured as a substrate carrier mounted to the first mount; the second carrier is configured as a mask carrier mounted to the second mount of the alignment system.
According to a further aspect of the invention, a method of transporting a carrier in a vacuum chamber is provided. The method comprises the following steps: transporting a first carrier in a first direction along a first transport path; moving the first carrier from the first transport path to the first mount of the alignment system with the first displacement device in a second direction, the second direction being transverse to the first direction, wherein the common support structure supports or retains at least a portion of the first displacement device and at least a portion of the alignment system; mounting a first carrier to a first mount of an alignment system; and aligning the first carrier with the alignment system.
In some embodiments, the first carrier is a substrate carrier that holds the substrate, and aligning the first carrier includes aligning the substrate carrier relative to a mask carrier that holds the mask in front of the substrate.
Embodiments are also directed to apparatuses for carrying out the methods of the present disclosure and including apparatus portions for performing various described method aspects. The methods may be implemented by hardware components, a computer programmed with suitable software, a combination of the two, or in any other way. Furthermore, embodiments of the present invention are also directed to methods for operating the described apparatus. The method for operating the device includes method aspects for performing each function of the device.
Drawings
So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described below:
fig. 1A shows a schematic cross-sectional view of an apparatus for processing a substrate in a first position, according to embodiments described herein;
FIG. 1B is a schematic cross-sectional view of the apparatus of FIG. 1A in a second position;
fig. 2A shows a schematic cross-sectional view of an apparatus for processing a substrate in a first position according to embodiments described herein;
FIG. 2B is a schematic cross-sectional view of the apparatus of FIG. 2A in a second position;
fig. 3 shows a schematic cross-sectional view of an apparatus according to embodiments described herein;
fig. 4 shows a schematic front view of an apparatus according to embodiments described herein;
fig. 5A-5D illustrate various stages of a method for transporting a carrier in a vacuum chamber according to embodiments described herein; and
fig. 6 is a flow diagram illustrating a method of transporting a carrier in a vacuum chamber according to embodiments described herein.
Detailed Description
Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. In the following description of the drawings, like reference numerals refer to like parts. Only the differences with respect to the individual embodiments are generally described. The various embodiments are provided by way of explanation of the disclosure, and are not meant as limitations of the invention.
Furthermore, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. The description is intended to embrace such modifications and variations.
Fig. 1A is a schematic cross-sectional view of an apparatus 100 for processing a substrate 10 according to embodiments described herein, wherein a first carrier 11 is located at a first position. Fig. 1B shows the apparatus 100 of fig. 1A, wherein the first carrier 11 has been moved to the second position.
In the following description, the term "first carrier" is used to represent a substrate carrier configured to hold a substrate 10, as schematically depicted in fig. 1A. The term "second carrier" is used to represent a mask carrier configured to hold a mask (see fig. 2A). However, it is to be understood that the first carrier 11 may alternatively be a carrier configured to hold a different object, for example a mask or shield (shield).
"substrate carrier" relates to a carrier device configured to carry a substrate 10 along a substrate transport path in a vacuum chamber. The substrate carrier may hold the substrate 10 during deposition of the coating material on the substrate. In certain embodiments, the substrate 10 may be held in a non-horizontal orientation (particularly a substantially vertical orientation), for example, during transport and/or deposition.
For example, the substrate 10 may be held at a holding surface of the first carrier 11 during transport through the vacuum chamber 101, during positioning of the substrate 10 in the vacuum chamber 101 (e.g. with respect to a mask) and/or during deposition of the coating material on the substrate. In particular, the substrate 10 may be held at the first carrier 11 by an adsorption means, for example by an electrostatic chuck or a magnetic chuck. The adsorption means may be integrated in the first carrier 11.
The first carrier 11 may comprise a carrier body having a holding surface configured to hold the substrate 10, in particular in a non-horizontal orientation. The carrier body may be movable along a first transport path by a first carrier transport system. In some embodiments, the first carrier 11 may be held contactlessly at the guide structure during transport, for example by a magnetic levitation system.
As used herein, "mask carrier" relates to a carrier device configured to carry a carrier for transporting a mask along a mask transport path in a vacuum chamber. The mask carrier may carry the mask during transport, during alignment with respect to the substrate, and/or during deposition on the substrate. In certain embodiments, the mask is held at the mask carrier in a non-horizontal orientation (particularly in a substantially vertical orientation) during transport and/or deposition. The mask may be held at the mask carrier by a chucking device, for example a mechanical chuck, such as a clamp, but also an electromagnetic chuck or a magnetic chuck. Other types of chucking mechanisms may be used, which may be attached to the mask carrier or integrated into the mask carrier.
For example, the mask may be an edge exclusion mask or a shadow mask. An edge exclusion mask is a mask configured for masking one or more edge regions of a substrate such that coating material is not deposited on the one or more edge regions during coating of the substrate. A shadow mask is a mask configured for masking a plurality of features to be deposited on a substrate. For example, the shadow mask can include a plurality of small openings, such as a grid of small openings.
As used herein, "transporting," "moving," "routing," "rotating," "positioning," or "aligning" a substrate or mask may refer to the carrier carrying the corresponding movement of the substrate or mask.
As used herein, "substantially vertical orientation" may be understood as an orientation that deviates from a vertical orientation (i.e., from the gravity vector) by less than or equal to 10 ° (specifically, less than or equal to 5 °). For example, the angle between the major surface of the substrate (or mask) and the gravity vector may be between +10 ° and-10 °, in particular between 0 ° and-5 °. In certain embodiments, the orientation of the substrate (or mask) may not be strictly vertical during transport and/or deposition, but rather slightly tilted with respect to a vertical axis, for example at a tilt angle between 0 ° and-5 °, in particular between-1 ° and-5 °. The negative angle indicates the orientation of the substrate (or mask) with the substrate (or mask) tilted downward. Deviations of the substrate orientation from the gravity vector during deposition may be beneficial and may result in a more stable deposition process, or a face down orientation may be suitable for reducing particles on the substrate during deposition. However, a strictly vertical orientation (+/-1 °) during transport and/or deposition is also possible. In other embodiments, the substrate and mask may be transported in a non-vertical orientation, and/or the substrate may be coated in a non-vertical orientation, such as a substantially horizontal orientation.
The apparatus 100 according to embodiments described herein comprises a vacuum chamber 101, wherein the alignment system 20 is provided in the vacuum chamber 101. The alignment system 20 may be configured to accurately position the first carrier 11 in the vacuum chamber. In some embodiments, the deposition source 110 is disposed in the vacuum chamber 101. The deposition source 110 is configured to deposit a coating material on the substrate 10, the substrate 10 being held by the first carrier 11.
The alignment system 20 comprises a first mount 21 for mounting the first carrier 11 to the alignment system 20. Furthermore, the alignment system 20 comprises an alignment unit 25 for moving the first mount 21 in at least one direction in the vacuum chamber for aligning the first carrier 11, e.g. for aligning the first carrier 11 with respect to a mask arranged in front of the substrate. Thus, with the alignment unit 25 of the alignment system 20, the substrates 10 carried by the first carrier 11 in the vacuum chamber 101 can be correctly positioned.
The apparatus further comprises a first carrier transport system 31 configured to transport the first carrier 11 along the first transport path in the first direction X. The first carrier transport system 31 may be configured to transport the first carrier 11 into the deposition area 111 in the vacuum chamber 101, with the substrate 10 facing the deposition source 110, so that the coating material may be deposited on the substrate 10. The first direction X is substantially perpendicular to the paper of fig. 1A.
After the coating material is deposited on the substrate 10, the first carrier transport system 31 may transport the first carrier 11 away from the deposition area 111, for example for unloading the coated substrate from the vacuum chamber, or for depositing additional coating material on the substrate at an additional deposition area.
The first carrier transport system 31 may be configured to contactlessly transport the first carrier 11 in the vacuum chamber 101. For example, the first carrier transport system 31 may hold and transport the first carrier 11 by magnetic force. In particular, the first carrier transport system 31 may comprise a magnetic levitation system.
In the exemplary embodiment of fig. 1A, the first carrier transport system 31 comprises a holding device, which is arranged at least partially above the first carrier 11 and which is configured to carry at least a part of the weight of the first carrier 11. The holding means may comprise an active magnetic unit, such as an active magnetic bearing, configured to hold the first carrier 11 at the holding means without contact. The first carrier transport system 31 may further comprise a drive device configured to contactlessly move the first carrier 11 in the first direction X. In some embodiments, the drive means may be arranged at least partially below the first carrier 11. The drive means may comprise a drive, such as a linear motor, configured to move the first carrier by applying a magnetic force to the first carrier.
The apparatus 100 further comprises a first displacement device 41, also referred to herein as "cross-drive device", configured to move the first carrier 11 from the first transport path to the first mount 21 of the alignment system 20 in a second direction Z, which is transverse to the first direction X, in particular, substantially perpendicular to the first direction X. In the embodiment of fig. 1A, the first direction X is a horizontal direction and the second direction Z is a horizontal direction substantially perpendicular to the first direction X. In particular, the first carrier transport system 31 may be configured to transport the first carrier into the deposition area 111 at a predetermined distance from the deposition source 110, and the first displacement device 41 may be configured to move the first carrier in the second direction Z towards the deposition source 110, or to move the first carrier in the second direction Z away from the deposition source 110.
In some embodiments, the first displacement device 41 may be configured to move the first carrier 11 in the second direction Z towards the first mount 21 of the alignment system 20 until the first carrier 11 contacts the first mount 21. First mount 21 may comprise a magnetic chuck configured to mechanically or magnetically grasp and hold first carrier 11 at alignment system 20 when first carrier 11 contacts first mount 21.
The first carrier transport system 31 may be configured to transport the first carrier 11 along the first carrier transport path to a first position as shown in fig. 1A, when the first carrier 11 is located at a distance from the first mount 21 of the alignment system 20. When the first carrier 11 is in said first position, the first mount 21 may not yet be able to grip the first carrier 11. The first displacement device 41 may be configured to move the first carrier 11 in the second direction Z ("Z movement") towards the first mount 21 by a distance of 1mm or more and/or 50mm or less, in particular by a distance of 3mm or more and/or 10mm or less, until the first carrier 11 contacts the first mount 21 (see fig. 1B). The first carrier 11 may then be mounted to the first mount 21, for example by activating a magnetic chuck of the first mount 21. A second position, in which the first carrier 11 contacts the first mount 21 and the first mount 21 holds the first carrier 11, is schematically depicted in fig. 1B.
According to embodiments described herein, a common support structure 50 is provided, the common support structure 50 supporting or holding at least a portion of the alignment system 20 and at least a portion of the first displacement device 41.
In particular, the common support structure 50 may support or hold the alignment unit 25 and the first mount 21 of the alignment system 20. For example, the common support structure 50 connects the alignment unit 25 and the first mount 21 of the alignment system 20 to the vacuum chamber 101 such that the alignment unit 25 is held in place in the deposition area 111 of the vacuum chamber.
Furthermore, the common support structure 50 also supports at least a part of the first displacement device 41, in particular the bearings and/or actuators of the first displacement device 41. As exemplarily depicted in fig. 1B, the first displacement device 41 may comprise a movable part 42, the movable part 42 being movable in the second direction Z by an actuator 43, wherein the actuator 43 may be supported on the common support structure 50. In certain embodiments, the movable portion 42 may comprise a magnetic unit configured to move the first carrier 11 towards the first mount 21 by applying a magnetic force on the first carrier 11 without contacting.
In some embodiments, which may be combined with other embodiments described herein, the actuator 43 and the movable portion 42 may be configured as an integrated drive unit, including, for example, a piezoelectric actuator integrated with a structure for mechanically amplifying the stroke (stroke) of the piezoelectric actuator. The structure that mechanically amplifies the stroke may be a flexible structure. In particular, the displacement means may comprise an amplifying piezoelectric actuator, in particular a mechanical amplifying mechanism using lever arms and/or spring blades. For example, the piezoelectric stroke may be amplified by a certain factor or 10, 20, or more times. The integrated drive means may be provided entirely within the vacuum chamber, e.g. fixed to a common support structure.
As schematically depicted in fig. 1A and 1B, the common support structure 50 may hold the alignment unit 25 and the first mount 21 of the alignment system 20 and may support the actuator 43 of the first displacement device 41 in the vacuum chamber 101. The first displacement device may be configured to move the first carrier 11 in the second direction Z towards the first mount 21 and/or away from the first mount 21 towards the first transport path.
In some embodiments, which can be combined with other embodiments described herein, the common support structure 50 connects at least a part of the alignment system 20 to the vacuum chamber 101, in particular the alignment unit 25 and the first mount 21 of the alignment system. Furthermore, the actuators and/or bearings of the first displacement device 41 may be attached to the common support structure 50. In particular, the first displacement device 41 and the alignment system 20 may both be connected to the vacuum chamber 101 through a common support structure 50.
According to embodiments described herein, at least a portion of first displacement device 41 and at least a portion of alignment system 20 are held by the same support structure. Therefore, the first displacement device 41 can be connected to the vacuum chamber 101 without additional support structures or mounting members. Instead, the common support structure 50 may hold the alignment system and the first displacement device in the vacuum chamber, which both saves space and allows the first displacement device 41 to be arranged close to the first mounting 21 of the alignment system 20. Arranging the first displacement device 41 and the alignment system 20 close together in the vacuum chamber 101 may reduce the weight and complexity of the apparatus. Furthermore, a small tolerance chain (tolerance chain) can be maintained when both the first displacement device and the alignment system are fixed to the same common support structure. In particular, the first displacement device 41 and the alignment unit 25, both configured for moving and positioning the first carrier in the vacuum chamber 101, may be connected to the vacuum chamber by a common mechanical connection device. Thus, the alignment accuracy of the first carrier in the vacuum chamber and the deposition results are improved.
The common support structure 50 may comprise at least one of a support bar, a support bracket, an auxiliary support, and a housing (e.g., an aligner housing) configured to hold a portion of the alignment system 20 and a portion of the first displacement device 41. In an embodiment, the common support structure 50 comprises a support frame or support bar connected to the vacuum chamber 101, wherein at least one alignment unit of the alignment system 20 and at least one actuator and/or bearing of the first displacement device 41 are mounted on the support frame. In certain embodiments, the plurality of alignment units and the plurality of actuators and/or bearings of the first displacement device may be mounted on the support frame.
In some embodiments, the common support structure 50 comprises an aligner housing, which is directly or indirectly fixed to the vacuum chamber 101, wherein the aligner housing houses at least one alignment unit of the alignment system 20, and wherein at least one actuator and/or bearing of the first displacement device 41 is fixed to the aligner housing.
In some embodiments, the first displacement device 41 is provided entirely within the vacuum chamber 101. For example, as schematically depicted in fig. 1A and 1B, the actuator 43 and the movable part 42 of the first displacement device 41 are provided in the vacuum chamber 101 and are fixed to a common support structure 50. In other embodiments, the actuator of the first displacement device 41 may be arranged outside the vacuum chamber 101, and the bearing of the first displacement device 41 may be provided inside the vacuum chamber 101 and fixed to the common support structure 50. The bearing may support the movable portion of the first displacement device. In particular, according to embodiments described herein, at least one of the actuator and the bearing of the first displacement device 41 may be arranged inside the vacuum chamber 101, in particular fixed to the common support structure 50.
In some embodiments, which can be combined with other embodiments described herein, the first displacement device 41 comprises an actuator 43, the actuator 43 being for moving the movable part 42 of the first displacement device 41, wherein the actuator 43 comprises at least one of a piezoelectric actuator, a linear motor, a coil, a servo motor, a walking drive, a piezoelectric stepping motor, a spindle drive, a pneumatic actuator, and a voice coil.
The movable portion 42 of the first displacement device 41 may be configured to displace the first carrier 11 in the second direction Z by applying a magnetic force on the first carrier 11 without contact. For example, the movable portion 42 may include a magnetic side guide for the first carrier 11, the magnetic side guide including a plurality of magnets. When the magnets are moved by the actuator 43 in the second direction Z, the first carrier 11 may follow the magnets, maintaining a constant distance between the magnets and the first carrier 11 in the second direction Z.
In certain embodiments, the apparatus 100 described herein may be operated as follows:
first, the first carrier 11 holding the substrate 10 is transported along a first transport path in the first direction X into the deposition area 111 by the first carrier transport system 31. The first carrier 11 may stop at a first position, as shown in fig. 1A, wherein the substrate 10 faces the deposition source 110. In the first position, the first carrier 11 is arranged at a distance from the first mount 21 of the alignment system 20, for example a distance greater than or equal to 1mm and less than or equal to 10mm in the second direction Z.
Then, with the first displacement device 41, the first carrier 11 is moved in the second direction Z towards the first mount 21 of the alignment system 20. Fig. 1B shows a second position of the first carrier 11, wherein the first carrier 11 contacts the first mount 21 of the alignment system 20. First mount 21 may magnetically mount first carrier 11 to alignment system 20.
The first carrier 11 may then be accurately positioned in the deposition area 111 with the alignment unit 25 of the alignment system 20, the alignment unit 25 of the alignment system 20 being configured to move the first mount 21 in at least one direction. The first carrier 11 may be positioned relative to a mask, which is arranged in front of the substrate 10.
After the first carrier 11 is aligned, the coating material 112 may be deposited on the substrate 10 using the deposition source 110. In certain embodiments, the deposition source 110 is a vapor source (vapor source) configured to direct the vaporized coating material toward the substrate.
According to embodiments described herein, at least a portion of the alignment system 20 and at least a portion of the first displacement device 41 are connected to the vacuum chamber 101 by a common support structure 50. Thus, a small tolerance chain may be maintained and the complexity of the first displacement device and the alignment system may be reduced.
Fig. 2A is a schematic view of a device 200 according to embodiments described herein, wherein the first carrier 11 and the second carrier 13 are arranged in a first position. Fig. 2B is a schematic view of the apparatus 200 of fig. 2A, wherein the first carrier 11 and the second carrier 13 have been moved to a second position.
As schematically depicted in fig. 2A, the apparatus 200 comprises a vacuum chamber 101, wherein the alignment system 120 is provided in the vacuum chamber 101. The alignment system 120 may be configured to accurately position the first carrier 11 relative to the second carrier 13. The first carrier 11 may be a substrate carrier configured to hold the substrate 10, and the second carrier 13 may be a mask carrier configured to hold a mask. Accordingly, the alignment system 120 is configured to align the substrate 10 held by the first carrier 11 with respect to the mask held by the second carrier 13.
The deposition source 110 may be disposed in the vacuum chamber 101. The deposition source 110 may be configured to direct the coating material 112 toward the deposition area 111, with the alignment system 120 arranged in the deposition area 111. The coating material 112 may be deposited on the substrate 10 through a mask. A pattern of material corresponding to the pattern of openings of the mask may be deposited on the substrate by the deposition source 110, for example by evaporation.
The alignment system 120 comprises a first mount 121 and a second mount 122, the first mount 121 being used for mounting the first carrier 11 to the alignment system 120, the second mount 122 being used for mounting the second carrier 13 to the alignment system 20. Furthermore, the alignment system 120 comprises an alignment unit 125 for moving the first mount 121 and the second mount 122 relative to each other in at least one direction, in particular in two or more directions. By moving the first mount 121 relative to the second mount 122, the first carrier 11 may be aligned relative to the second carrier 13.
In some embodiments, the alignment unit 125 may be configured to move the first mount 121 relative to the second mount 122 in a first direction X, a second direction Z, and/or a third direction Y, the third direction Y being perpendicular to the first direction X and the third direction Y being perpendicular to the second direction Z.
In some embodiments, which can be combined with other embodiments described herein, the first mount 121 comprises a magnetic chuck configured to magnetically clamp the first carrier 11 to the first mount 121 and/or the second mount 122 comprises a magnetic chuck configured to magnetically clamp the second carrier 13 to the second mount 122. In certain embodiments, the magnetic chuck may include an electromagnet with a controller configured to activate and/or deactivate a magnetic field of the electromagnet. In some embodiments, the magnetic chuck includes an electro permanent magnet assembly (EPM) with a controller configured to initiate magnetic attraction of the permanent magnet arrangement by applying an electrical pulse.
The apparatus 200 further comprises a first carrier transport system 31 and a second carrier transport system 32, the first carrier transport system 31 being configured to transport the first carrier 11 in the first direction X along a first transport path, the second carrier transport system 32 being configured to transport the second carrier 13 in the first direction X along a second transport path. The first carrier 11 and the second carrier 13 may be transported substantially parallel to each other into the deposition area 111, for example at a distance of 5cm or less from each other of the first carrier 11 and the second carrier 13. For example, the substrate carrier track and the mask carrier track may extend substantially parallel to each other in the deposition area 111. In some embodiments, the substrate carrier track and the mask carrier track may be provided at the same height in a vertical direction. In other embodiments, the substrate carrier track and the mask carrier track may be provided at different heights in the vertical direction, as schematically depicted in fig. 2A. In the depicted embodiment, the second carrier 13 has a larger dimension in the vertical direction than the first carrier 11, and the mask carrier track is arranged at a lower height than the substrate carrier track.
The first carrier transport system 31 and the second carrier transport system 32 may be configured to transport the first carrier 11 and the second carrier 13 into the deposition area 111. In the deposition area 111, a second carrier 13 holding a mask may be arranged between the first carrier 11 and the deposition source 110. In particular, the second transport path is located between the first transport path and the deposition source 110 in the second direction Z. The coating material 112 may be deposited on the substrate 10 from the deposition source 110 through a mask held by the second carrier 13.
In some embodiments, the first carrier transport system 31 is configured for transporting the first carrier 11 contactlessly along a first transport path, and/or the second carrier transport system 32 is configured for transporting the second carrier 13 contactlessly along a second transport path in the first direction X. For example, the first carrier transport system 31 may hold and transport the first carrier 11 by magnetic force, and/or the second carrier transport system 32 may hold and transport the second carrier 13 by magnetic force. In particular, the first carrier transport system 31 and/or the second carrier transport system 32 may comprise magnetic levitation means.
The apparatus 200 further comprises a first displacement device 141 and a second displacement device 142, the first displacement device 141 being configured to move the first carrier 11 from the first transport path to the first mount 121 of the alignment system 120, the second displacement device 142 being configured to move the second carrier 13 from the second transport path to the second mount 122 of the alignment system. The second direction Z may be substantially perpendicular to the first direction X, i.e. perpendicular to the transport direction of the carrier. In particular, the first carrier transport system 31 may be configured to transport the first carrier into the deposition area 111 at a predetermined distance from the first mount 121, and the first displacement device 141 may be configured to move the first carrier in the second direction Z towards the first mount 121 (towards the deposition source 110 of the exemplary embodiment of fig. 2A). The second carrier transport system 32 may be configured to transport the second carrier into the deposition area 111 at a predetermined distance from the second mount 122, and the second displacement device 142 may be configured to move the second carrier in the second direction Z towards the second mount 122 (away from the deposition source 110 of the exemplary embodiment of fig. 2B). The first displacement device 141 and/or the second displacement device 142 may be configured in line with the first displacement device 41 depicted in fig. 1A and 1B, so that reference may be made to the above embodiments without being repeated here.
The second displacement device 142 may be configured to displace the second carrier 13 towards the second mount 122 in a direction opposite to the direction in which the first displacement device 141 displaces the first carrier 11 towards the first mount 121. Thus, the first and second carriers 11, 13 are displaceable towards opposite sides of the alignment system 120 by means of the first and second displacement devices 141, 142, the first and second mounts 121, 122 being arranged at the first and second displacement devices 141, 142, respectively.
In some embodiments, the common support structure 150 holds or supports at least a portion of the first displacement device 141, at least a portion of the second displacement device 142, and at least a portion of the alignment system 120. In particular, the common support structure 150 may hold the first mount 121, the second mount 122 and the alignment unit 125 of the alignment system 120 such that the alignment system 120 is connected to the vacuum chamber 101 through the common support structure. Furthermore, the actuator and/or bearing of the first displacement device 141 and the actuator and/or bearing of the second displacement device 142 may be fixed to a common support structure 150. The common support structure 150 may be configured in accordance with the common support structure 50 depicted in fig. 1A, such that reference may be made to the above embodiments, which are not repeated here.
When at least a portion of the first displacement device 141 and at least a portion of the second displacement device 142 are attached to the common support structure 150, the common support structure 150 also retains the alignment system 120, the tolerance chain can be reduced. Manufacturing and installation of the apparatus 200 may be facilitated and alignment accuracy between carriers may be improved.
In some embodiments, the first displacement device 141 and/or the second displacement device 142 may comprise a movable portion and an actuator, respectively, configured to move the movable portion in the second direction Z. The movable portion may be configured to contactlessly displace the carrier in the second direction Z by applying a magnetic force to the carrier.
In particular, the first and second displacement devices 141, 142 may comprise magnetic units configured to contactlessly displace the carrier in the second direction Z. For example, the movable portion may comprise a magnetic side guide configured to stabilize the carrier and in the second direction Z at a constant distance from the side guide. The actuators and/or the magnetic side guides of the displacement device may be arranged in the vacuum chamber, in particular supported by a common support structure 150.
In some embodiments, the actuators of the first and second displacement devices each comprise a piezoelectric actuator, a linear motor, or a coil arranged in the vacuum chamber 101 (in particular fixed to the common support structure 150).
In some embodiments, which can be combined with other embodiments described herein, the common support structure 150 includes an aligner housing that houses the alignment unit 125 of the alignment system 120, wherein the actuators and/or bearings of the first and second displacement devices are attached to the aligner housing. The aligner housing may be secured directly or indirectly to the inner wall of the vacuum chamber 101.
In some embodiments, which can be combined with other embodiments described herein, the actuators and/or bearings of the first displacement device 141 are attached to a first side of the common support structure 150, and the actuators and/or bearings of the second displacement device 142 are attached to a second side of the common support structure 150, the second side being opposite to the first side. For example, as schematically depicted in fig. 2A, the first displacement device 141 is attached to a lower side of the common support structure 150, while the second displacement device 142 is attached to an upper side of the common support structure 150. Thus, the first carrier 11 and the second carrier 13 can be displaced towards or away from each other in the second direction Z without interfering with each other, since the respective displacement means are arranged on opposite sides of the common support structure.
In fig. 2B, the first carrier 11 and the second carrier 13 have been moved towards each other to the respective second position by the first 141 and the second 142 displacement means until the first carrier contacts the first mount 121 and the second carrier contacts the second mount 122. In the second position, the first carrier 11 and the second carrier 13 are mounted to two opposite sides of the alignment system 120 such that the alignment system is at least partially arranged between the first carrier 11 and the second carrier 13. In the second position, the first carrier may be aligned relative to the second carrier by moving the first mount relative to the second mount using the alignment unit 125 of the alignment system.
In some embodiments, which can be combined with other embodiments described herein, the alignment system 120 comprises a plurality of alignment units for aligning the first carrier 11 with respect to the second carrier 13. An upper alignment unit 126 and a lower alignment unit 127 are exemplarily depicted in fig. 2A. However, additional alignment units may also be provided. For example, at least four alignment units may be provided at spaced apart locations (e.g. at the four corners of the carrier) at the common support structure for aligning the first carrier 11 relative to the second carrier 13.
The upper and lower alignment units 126 and 127 may be held by a support frame of a common support structure. Or the upper alignment unit 126 may be held by the upper support bar 151 or upper aligner housing of the common support structure 150 and the lower alignment unit 127 may be held by the lower support bar 152 or lower aligner housing of the common support structure 150.
The alignment system 120 may comprise a plurality of first mounts for mounting the first carrier 11 to the alignment system and a plurality of second mounts for mounting the second carrier 13 to the alignment system 120. In the exemplary embodiment of fig. 2A, the upper alignment unit 126 is connected between the upper first mount and the upper second mount, and the lower alignment unit 127 is connected between the lower first mount and the lower second mount. Additional mounts and alignment units may be provided. Each alignment unit of the plurality of alignment units may be configured to move the respective first mount relative to the respective second mount to align the first carrier 11 relative to the second carrier 13.
In some embodiments, an upper displacement device 143 and a lower displacement device 144 may be provided, the upper displacement device 143 being configured to move (the upper part of) the first carrier 11 in the second direction Z, the lower displacement device 144 being configured to move (the lower part of) the first carrier 11 in the second direction Z. At least a portion of the upper displacement device 143 may be supported or held by the upper support bar 151 or upper aligner housing of the common support structure 150 and at least a portion of the lower displacement device 144 may be supported or held by the lower support bar 152 or lower aligner housing of the common support structure 150. Similarly, at least one upper displacement device configured to move an upper portion of the second carrier 13 in the second direction Z, and at least one lower displacement device configured to move a lower portion of the second carrier 13 in the second direction Z may be provided.
In some embodiments, the alignment unit 125 may be configured to move the first mount 121 relative to the second mount 122 in the second direction Z. Accordingly, the alignment unit 125 may appropriately adjust the distance between the first carrier 11 and the second carrier 13. Alternatively or additionally, the alignment unit 125 may be configured to move the first mount 121 relative to the second mount 122 in the first direction X. Accordingly, the relative position between the mask and the substrate in the width direction of the substrate can be appropriately adjusted by the alignment unit 125. Alternatively or additionally, the alignment unit 125 may be configured to move the first mount 121 relative to the second mount 122 in a third direction Y, which is perpendicular to the first direction X and the second direction Z. Accordingly, the relative position between the mask and the substrate in the height direction of the substrate can be appropriately adjusted by the alignment unit 125.
The alignment unit 125 may comprise one or more piezo-electric actuators for moving the first mount in one or more directions relative to the second mount. Alternatively, the alignment unit may be selected from the group consisting of a step actuator, a brushless actuator, a DC (direct current) actuator, a voice coil actuator, and a pneumatic actuator.
In certain embodiments, the deposition source 110 may be a vapor source configured to direct the vaporized coating material toward the substrate 10. The deposition source 110 may be movable along a source transport track, which may be disposed within the vacuum chamber 101. In particular, the deposition source 110 may be movable across the substrate in the first direction X. The first direction X may correspond to a width direction of the substrate 10. Accordingly, the deposition source 110 may move across the substrate 10 in a width direction of the substrate 10 in order to deposit the coating material 112 on the substrate 10.
The deposition source 110 may be provided as a line source extending in the third direction Y (i.e., in a substantially vertical direction). The height of the deposition source 110 in the vertical direction may be adapted to the height of the vertically oriented substrate, such that the substrate may be coated by moving the deposition source 110 through the substrate in the first direction X.
The deposition source 110 may include a distribution tube with a plurality of vapor openings or nozzles for directing the coating material 112 toward the deposition area 111. In addition, the deposition source 110 may include a crucible configured to heat and evaporate the coating material. The crucible may be connected to the distribution tube such that the crucible is in fluid communication with the distribution tube.
In some embodiments, which may be combined with other embodiments described herein, the deposition source 110 may be rotatable. For example, the deposition source may be rotated from a first orientation in which the vapor openings of the deposition source are directed toward the deposition area 111 to a second orientation in which the vapor openings are directed toward the second deposition area. The deposition area 111 and the second deposition area may be located on opposite sides of the deposition source 110, and the deposition source may be rotatable 180 ° between the deposition area and the second deposition area.
Fig. 2A and 2B further illustrate a system for processing a substrate according to embodiments described herein. The system comprises an apparatus according to any of the embodiments described herein, a first carrier 11 and a second carrier 13, the first carrier 11 being configured as a substrate carrier mounted to the first mount 121 of the alignment system 120, the second carrier 13 being configured as a mask carrier mounted to the second mount 122 of the alignment system 120.
Fig. 3 is a schematic cross-sectional view of an apparatus 300 according to embodiments described herein. Fig. 4 is a schematic front view of an apparatus 300 according to embodiments described herein. The apparatus 300 may include some or all of the features of the previous embodiments and will not be described again.
The apparatus 300 comprises a vacuum chamber 101, wherein a portion of the walls of the vacuum chamber 101 is depicted in fig. 3. The common support structure 150 is fixed at the wall of the vacuum chamber.
The alignment system 120 is configured to align a first carrier 11 relative to a second carrier 13, the common support structure 150 holding the bearing 301 of the first displacement device 141 and/or the second bearing 302 of the second displacement device 142 in the vacuum chamber 101. In particular, the alignment unit 125, the bearing 301 and the second bearing 302 are connected to the vacuum chamber 101 via a common support structure 150. The common support structure 150 may comprise support bars, support frames, aligner housings, or different types of supports connecting the alignment unit 125, the bearing 301, and the second bearing 302 to the vacuum chamber 101.
One benefit of the common support structure 150 is that the tolerance chain and alignment system of the displacement device are based on the same reference basis, which reduces tolerance specifications and simplifies assembly.
In the embodiment depicted in fig. 3, the common support structure 150 includes an aligner housing 305, the aligner housing 305 housing the alignment unit 125 of the alignment system 120. In certain embodiments, the common support structure 150 may include a plurality of aligner housings, where each aligner housing receives an alignment unit 125 of the alignment system 120. The alignment unit is configured to move the respective first mount relative to the respective second mount to align the first carrier 11 relative to the second carrier 13, the first carrier 11 being mounted to the first mount and the second carrier 13 being mounted to the second mount.
In some embodiments, which can be combined with other embodiments described herein, the first displacement device 141 can comprise a movable part 311, an actuator 321, and a bearing 301, the actuator 321 being configured to move the movable part 311 in the second direction Z, the bearing 301 movably supporting the movable part 311 at the common support structure 150. In other words, the movable portion 311 may be supported on the common support structure 150 by the bearing 301. The bearings 301 may be attached to the common support structure 150 in the vacuum chamber 101. In the embodiment of fig. 3, the bearing 301 is attached to the aligner housing 305 in the vacuum chamber 101.
The movable portion 311 may include a magnetic unit configured to contactlessly displace the first carrier 11 in the second direction Z by applying a magnetic force on the first carrier 11.
The actuator 321 may be arranged in the vacuum chamber 101 or arranged outside the vacuum chamber 101. In the embodiment depicted in fig. 3, the actuator 321 is arranged outside the vacuum chamber, and the movable part 311 extends from the actuator 321 through the wall of the vacuum chamber 101 into the interior of the vacuum chamber 101, where the movable part 311 is supported by the bearing 301. The actuator may comprise, for example, a servo motor, a piezoelectric stepper motor or a stepper drive. Providing the actuator 321 outside the vacuum chamber may be beneficial in certain applications, as maintenance of the actuator may be facilitated and the space requirements outside the vacuum chamber may be less stringent. In other applications, it may be beneficial to provide the actuator 321 inside the vacuum chamber, as there may be no feedthrough required through the wall of the vacuum chamber for guiding the movable part 311.
The movable portion 311 may be supported on the common support structure 150 by the bearing 301. The bearing 301 may be configured as a flexible structure that may guide the movable part 311 in the second direction Z substantially without friction generating particles.
In some embodiments, the bearing 301 may be a compliant mechanism, i.e., a flexible mechanism, that translates the input force provided by the actuator 321 through deformation of an elastomer. The actuator may be connected to the flexible mechanism, or the actuator may be integrally formed with the flexible mechanism, e.g., integrated with the elastomer. The resilient body may comprise at least one resiliently deformable body, such as a leaf spring. By attaching the compliant structure to the same support structure as the alignment system 20, the tolerance chain of the first displacement device 141 and the tolerance chain of the alignment unit 125 are based on the same reference basis. Thus, installation of the apparatus can be simplified.
The compliant mechanism of the first displacement device may be configured as a cantilevered beam arrangement, such as a vertical arrangement, a horizontal arrangement, or a combination of both, which may be fabricated by electrical spark machining (EDM) cutting of a metal, such as a Titanium (Titanium) block. Particles generated by relative movement of parts in the vacuum chamber can be reduced or completely avoided.
Furthermore, second displacement means 142 may be provided for moving the second carrier 13 in the second direction Z towards the second mount 122 of the alignment system 120. The second shifting device 142 may be configured in a similar or identical manner to the first shifting device 141 so that reference may be made to the above description. In particular, the second displacement device 142 may comprise a second bearing 302 attached to the common support structure 150, in particular to an aligner housing 305, the aligner housing 305 accommodating the alignment unit 125.
The second displacement device 142 may comprise a second actuator 322 configured to move the second movable part 312 in the second direction Z, wherein the second movable part 312 is supported on the common support structure 150 via the second bearing 302. The second bearing 302 may be configured as a flexible structure that may guide the second movable portion 312 substantially without friction-generating particles. In some embodiments, the second bearing 302 may be a compliant mechanism. The resilient body may comprise at least one resiliently deformable body, such as a leaf spring.
By attaching the compliant mechanism of the first displacement device 141 and the compliant mechanism of the second displacement device 142 to the same support structure as the alignment system 120, the tolerance chain of the first displacement device 141, the tolerance chain of the second displacement device 142, and the tolerance chain of the alignment unit 125 are based on the same reference basis.
In certain embodiments, the bearing 301 of the first displacement device 141 is attached to a first side of the aligner housing 305, e.g., to a higher side, and the second bearing 302 of the second displacement device 142 is attached to a second side of the aligner housing 305 (the second side being opposite the first side), e.g., to a lower side.
As schematically depicted in fig. 3, the common support structure 150 may comprise at least one further aligner housing 306, the further aligner housing 306 holding at least one further alignment unit, wherein bearings of further displacement devices may be supported on the further aligner housing.
Fig. 4 shows a front view of the device 300 of fig. 3. As schematically depicted in fig. 4, the common support structure 150 may comprise a plurality of supports, for example three upper supports and three lower supports. Each support may include an aligner housing 305, the aligner housing 305 housing an alignment unit 125 of the alignment system 120, the alignment unit 125 configured to move the respective first mount 121 relative to the respective second mount 122.
At least a part of the first displacement means 141 for moving the first carrier 11 in the second direction Z and at least a part of the second displacement means 142 for moving the second carrier 13 in the second direction Z may be attached to respective supports of the common support structure 150.
In some embodiments, the first displacement device 141 may comprise a magnetic sideguide 313 configured to contactlessly displace the first carrier 11 in the second direction Z, wherein the magnetic sideguide 313 may be supported by a plurality of supports, in particular via a plurality of bearings, on the aligner housing 305, in particular via a plurality of compliant mechanisms. The bearings may be attached to the aligner housing 305 of the common support structure 150. The bearings may be configured as compliant mechanisms including flexible elements for transferring the displacement force of the one or more actuators to the magnetic sideguides 313. Thus, the magnetic side guide 313 can be displaced in the second direction Z.
Similarly, the second displacement device 142 may comprise a magnetic side guide configured to contactlessly displace the second carrier 13 in the second direction Z, wherein the magnetic side guide of the second displacement device 142 may also be supported on a plurality of supports via a plurality of bearings (in particular via a plurality of compliant mechanisms).
In another embodiment, the common support structure comprises a support frame, wherein each alignment unit of the plurality of alignment units is attached to the support frame. Furthermore, the bearing and/or actuator of the first displacement device and the bearing and/or actuator of the second displacement device may be attached to the support frame. The support frame may be connected to the vacuum chamber via mechanical isolation elements (e.g. vibration dampers) to reduce the vibration that the support frame brings to the vacuum chamber, the support frame holding the alignment system and the displacement device.
Fig. 5A-5D illustrate several stages of a method of transporting a carrier in a vacuum chamber according to the methods described herein. In fig. 5A to 5D, the substrate carrier (first carrier 11) is transported and aligned with respect to the mask carrier (second carrier 13). This method may be performed in the order depicted in fig. 5A-5D. Alternatively, the order of certain stages may be changed.
In fig. 5A, the second carrier 13 carrying the mask is transported in the first direction X along a second transport path into a deposition area 111 in a vacuum chamber by means of a second carrier transport system 32. The second carrier transport system 32 may be a transport system configured to contactlessly transport the second carrier, including, for example, a magnetic levitation system.
In the first position, depicted in fig. 5A, the second carrier 13 is stopped, in which the second carrier 13 is arranged on a first side of the alignment system 120 at a distance from the second mount 122.
In fig. 5B, the second displacement device 142 moves the second carrier 13 laterally (laterally) towards the second mount 122 of the alignment system 120 in a second direction Z, which is substantially perpendicular to the first direction X. The second displacement device 142 may be configured as a cross drive device, which may comprise a movable part to displace the second carrier 13 towards the second mount 122.
As shown in fig. 5B, the second displacement device 142 may displace the second carrier 13 in the second direction Z from the second transport path towards the alignment system 120 until the second carrier 13 contacts the second mount 122 of the alignment system 120. For example, the second displacement means displaces the second carrier in the second direction Z by a distance equal to or greater than 4mm and equal to or less than 10 mm.
The second carrier 13 may be mounted to the second mount 122, for example by activating magnets of the second mount 122, such that the second carrier 13 magnetically attracts the second mount 122, and the second mount holds the second carrier 13 at the alignment system 120.
Further, in fig. 5B, the first carrier transport system 31 transports the first carrier 11 carrying the substrate 10 into the deposition area 111 along the first transport path in the first direction X. The first carrier transport system 31 may be a transport system configured to contactlessly transport the first carrier, including, for example, a magnetic levitation system.
The first carrier 11 stops at a first position depicted in fig. 5B, in which the first carrier 11 is arranged on a second side of the alignment system 120, the second side being opposite to the first side on which the second carrier 13 is arranged. In particular, the first carrier 11 may be arranged between the alignment system 120 and a wall of the vacuum chamber (not shown in fig. 5B).
In fig. 5C, the first displacement device 141 laterally moves the first carrier 11 towards the first mount 121 of the alignment system 120 in a second direction Z, which is substantially perpendicular to the first direction X. The first displacement device 141 may be configured as a cross drive device, which may comprise a movable part to contactlessly displace the first carrier 11 towards the first mount 121. For example, the first displacement device 141 may displace the substrate carrier in the second direction Z towards the alignment system by a distance equal to or greater than 4mm and equal to or less than 10 mm.
As shown in fig. 5B and 5C, the second displacement device 142 may be configured to displace the second carrier 13 in a direction opposite to the direction in which the first displacement device displaces the first carrier 11. Thus, by the first and second displacement devices, the first and second carriers 11, 13 may be displaced towards opposite sides of the alignment system 120, respectively.
The first carrier 11 may be mounted to the first mount 121, for example by activating the magnets of the first mount 121, such that the first carrier 11 magnetically attracts the first mount 121 and the first mount holds the first carrier 11 in the alignment system 120.
In fig. 5D, the alignment unit 125 aligns the first carrier 11 with respect to the second carrier 13, and the alignment unit 125 is provided in a mechanical connection path between the first mounting part 121 and the second mounting part 122. Therefore, the mask and the substrate are aligned with respect to each other with high accuracy. The coating material 112 may then be deposited on the substrate, in particular by evaporation.
The common support structure supports or holds the alignment system 120 and the actuators and/or bearings of the first displacement device 141 and the second displacement device 142.
Fig. 6 is a flow chart schematically illustrating a method of transporting a carrier in accordance with the methods described herein.
In block 710, a first carrier 11 carrying a substrate 10 is transported along a first transport path in a first direction X into a deposition area 111.
In block 720, the first displacement device moves the first carrier 11 from the first transport path in a second direction Z to the first mount of the alignment system, the second direction Z being transverse to the first direction, wherein the common support structure supports or holds at least a portion of the first displacement device and at least a portion of the alignment system.
In block 730, the first carrier 11 is mounted to a first mount of an alignment system.
In block 740, the first carrier is aligned with the alignment system.
In block 750, a coating material is deposited on the substrate.
This method may optionally include block 705, which may be performed before block 710: transporting the second carrier 13 carrying the mask in the first direction X along a second transport path; the second carrier 13 is moved from the second transport path to the second mount of the alignment system using the second displacement device, wherein the common support structure supports or holds at least a portion of the second displacement device and at least a portion of the second displacement device mounts the second carrier to the second mount of the alignment system.
The alignment in block 740 may include moving the first mount relative to the second mount to align the first carrier 11 relative to the second carrier 13.
The apparatus described herein may be configured to evaporate organic materials, for example, for use in the manufacture of OLED devices. For example, the deposition source may be an evaporation source, in particular an evaporation source for depositing one or more organic materials on the substrate to form a layer of the OLED device.
Embodiments described herein may be used for evaporation of large area substrates, for example for the manufacture of OLED displays. In particular, the structures and methods of the embodiments described herein provide for substrates that are large area substrates, e.g., having a thickness of 0.5m2Or larger surface area, especially 1m2Or larger. For example, the large area substrate or carrier may be GEN 4.5, corresponding to a surface area of about 0.67m2(0.73x 0.92 m); may be GEN 5, corresponding to a surface area of about 1.4m2(1.1m x 1.3.1 m); may be GEN 7.5, corresponding to a surface area of about 4.29m2(1.95m x 2.2.2.2 m); may be GEN 8.5, corresponding to a surface area of about 5.7m2(2.2m x 2.5.2 m); or even GEN 10, corresponding to a surface area of about 8.7m2(2.85m x 3.05.05 m). Higher generations such as GEN 11 and GEN 12 with larger corresponding surface areas can be carried out in a similar manner. Half the size of the GEN of each generationCan be provided for manufacturing OLED displays.
According to some embodiments, which can be combined with other embodiments described herein, the substrate thickness can be from 0.1mm to 1.8 mm. The substrate thickness may be about 0.9mm or less, for example 0.5 mm. The term "substrate" as used herein may particularly comprise a substantially inflexible substrate, such as a wafer, a transparent crystal slide, such as sapphire or the like, or a glass plate. However, the invention is not limited thereto and the term "substrate" may also include flexible substrates, such as rolls or foils. It is to be understood that "substantially non-flexible" is intended to distinguish it from "flexible". In particular, the substantially inflexible substrate may have a certain degree of flexibility, for example a glass plate having a thickness of 0.9mm or less, such as 0.5mm or less, wherein the substantially inflexible substrate is less flexible than the flexible substrate.
According to embodiments described herein, the substrate may be made of any material suitable for material deposition. For example, the substrate may be made of a material selected from the group consisting of glass (e.g., soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, composite, carbon fiber material, or any other material, or a combination of materials that may be applied by a deposition process.
The method described herein may include aligning the first carrier and the second carrier relative to each other using an alignment unit of an alignment system. At least one of mechanical noise, system vibrations and building vibrations (i.e. dynamic deformations and static deformations) that may be transferred from the vacuum chamber to the alignment system may be compensated for or reduced by mechanical isolation elements that may be arranged in the connection line between the alignment system and the vacuum chamber, in particular integrated with the common support structure.
The combination of front alignment via a contactless transport system (e.g. a magnetic levitation system) and fine alignment by mechanical contact of the alignment system allows for a reduced complexity of the alignment system and thus a reduced cost of ownership.
According to embodiments described herein, the method of aligning and/or transporting a substrate carrier and a mask carrier in a vacuum chamber may be performed using a computer program, software, a computer software product and an associated controller (interconnected controllers) which may comprise a central processor, a memory, a user interface and input-output devices in communication with corresponding elements of the apparatus.
The present disclosure provides a first carrier transport system for a first carrier and a second carrier transport system for a second carrier, which may be identical in at least one dimension. In other words, the second carrier may be adapted to the first carrier transport system, and the first carrier may be adapted to the second carrier transport system. The first carrier transport system and the second carrier transport system can be flexibly used when providing accurate and smooth carrier transport by the vacuum system. The alignment system allows for precise alignment of the substrate with respect to the mask or the mask with respect to the substrate. High quality processing results, such as the production of high resolution OLED devices, can be achieved.
The mask carrier and the substrate carrier may be of different sizes. For example, the dimensions of the mask carrier may be larger than the dimensions of the substrate carrier, in particular the dimensions in the vertical direction.
While the foregoing is directed to embodiments of the present invention, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof. The scope of the invention is determined by the appended claims.

Claims (19)

1. An apparatus for processing a substrate in a vacuum chamber (101), comprising:
a first carrier transport system configured to transport a first carrier (11) in a first direction (X) along a first transport path;
an alignment system comprising a first mount for mounting the first carrier (11) to the alignment system;
a first displacement device configured to move the first carrier from the first transport path to the first mount in a second direction (Z), the second direction (Z) being transverse to the first direction (X); and
a common support structure supporting or holding at least a portion of the alignment system and at least a portion of the first displacement device.
2. The apparatus of claim 1, wherein the common support structure connects at least a portion of the alignment system to the vacuum chamber (101), and wherein at least one of an actuator and a bearing (301) of the first displacement device is attached to the common support structure.
3. The apparatus of claim 1, wherein the common support structure comprises an aligner housing (305), the aligner housing (305) housing an alignment unit of the alignment system, wherein at least one of an actuator and a bearing (301) of the first displacement device is attached to the aligner housing (305).
4. The apparatus of claim 1, wherein the first displacement means comprises a movable part (311), the movable part (311) being supported on the common support structure via a bearing (301), the bearing (301) comprising a flexible structure.
5. The device of claim 4, wherein the bearing (301) comprises a compliant mechanism.
6. The apparatus of claim 1, wherein the first displacement device comprises an actuator arranged in the vacuum chamber (101) and fixed to the common support structure.
7. The apparatus of claim 6, wherein the first displacement device comprises a piezoelectric actuator.
8. The apparatus of claim 6, wherein the first displacement device comprises a linear motor.
9. The apparatus of claim 1, comprising an upper displacement device (143) and a lower displacement device (144), the upper displacement device (143) being configured to move an upper portion of the first carrier in the second direction (Z), the lower displacement device (144) being configured to move a lower portion of the first carrier in the second direction (Z).
10. The apparatus of claim 1, wherein the first displacement means comprises a movable portion (311), the movable portion (311) being configured to contactlessly displace the first carrier (11) in the second direction (Z) by applying a magnetic force on the first carrier (11).
11. The apparatus of one of claims 1 to 10, wherein the alignment system (120) comprises a second mount (122) and an alignment unit (125), the second mount (122) being for mounting a second carrier (13) to the alignment system (120), the alignment unit (125) being for moving the first mount (121) and the second mount (122) relative to each other.
12. The apparatus of claim 11, wherein the first mount (121) comprises a magnetic chuck configured to magnetically clamp the first carrier (11) to the first mount (121), or wherein the second mount (122) comprises a magnetic chuck configured to magnetically clamp the second carrier (13) to the second mount (122).
13. The apparatus of claim 11, further comprising a second displacement device (142) configured to move the second carrier (13) in the second direction (Z) to the second mount (122), wherein at least a portion of the second displacement device (142) is supported on the common support structure (150) or attached to the common support structure (150).
14. The apparatus of claim 13, wherein the common support structure (150) comprises an aligner housing (305), the aligner housing (305) housing an alignment unit (125) of the alignment system (120), wherein at least one of an actuator (321) and a bearing (301) of the first displacement device (141) is attached to a first side of the aligner housing (305) and at least one of an actuator and a bearing of the second displacement device (142) is attached to a second side of the aligner housing (305), the second side being opposite the first side.
15. The apparatus of claim 11, further comprising a second carrier transport system (132) configured to transport the second carrier (13) along a second transport path in the first direction (X), wherein the first carrier transport system (131) is configured to transport the first carrier (11) along the first transport path without contact, and wherein the second carrier transport system (132) is configured to transport the second carrier (13) along the second transport path without contact.
16. An apparatus for processing a substrate in a vacuum chamber (101), comprising:
a first carrier transport system extending in a first direction (X) and configured to transport a first carrier (11) in the first direction (X) along a first transport path;
an alignment system (120) comprising a first mount (121), a second mount (122) and an alignment unit (125), the alignment unit (125) for moving the first mount (121) and the second mount (122) relative to each other;
a first displacement device (141) extending in a second direction (Z), the second direction (Z) being transverse to the first direction and configured to move the first carrier from the first transport path in the second direction (Z) to the first mount (121); and
a common support structure (150) supporting or holding at least a portion of the alignment system (120) and at least a portion of the first displacement device (141) in the vacuum chamber (101).
17. A system for processing a substrate, comprising:
the apparatus (100) of any of claims 11 to 16;
a first carrier (11) configured as a substrate carrier mounted on the first mount; and
a second carrier (13) configured as a mask carrier mounted on the second mount.
18. A method of transporting a carrier in a vacuum chamber, comprising:
-transporting a first carrier (11) in a first direction (X) along a first transport path;
-moving the first carrier (11) from the first transport path in a second direction (Z) to a first mount of an alignment system (120) with a first displacement device (141), the second direction (Z) being transverse to the first direction, wherein at least a part of the first displacement device and at least a part of the alignment system are supported or held by a common support structure (150);
mounting the first carrier (11) to the first mount of the alignment system (120); and
-aligning the first carrier (11) using the alignment system (120).
19. The method of claim 18, further comprising:
-transporting a second carrier (13) in the first direction (X) along a second transport path;
-moving the second carrier (13) from the second transport path to a second mount of the alignment system (120) with a second displacement device (142), wherein the common support structure (150) supports or holds at least a part of the second displacement device; and
mounting the second carrier (13) to the second mount of the alignment system (120),
wherein aligning comprises moving the first mount relative to the second mount to align the first carrier (11) relative to the second carrier (13).
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