TWI671849B - 膠帶貼附裝置及膠帶貼附方法 - Google Patents

膠帶貼附裝置及膠帶貼附方法 Download PDF

Info

Publication number
TWI671849B
TWI671849B TW104116774A TW104116774A TWI671849B TW I671849 B TWI671849 B TW I671849B TW 104116774 A TW104116774 A TW 104116774A TW 104116774 A TW104116774 A TW 104116774A TW I671849 B TWI671849 B TW I671849B
Authority
TW
Taiwan
Prior art keywords
tape
substrate
roller
masking tape
wafer
Prior art date
Application number
TW104116774A
Other languages
English (en)
Chinese (zh)
Other versions
TW201545271A (zh
Inventor
伊藤賢也
內山圭介
松井富一
渋谷真人
Original Assignee
日商荏原製作所股份有限公司
日商Ｉｓ工程股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司, 日商Ｉｓ工程股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW201545271A publication Critical patent/TW201545271A/zh
Application granted granted Critical
Publication of TWI671849B publication Critical patent/TWI671849B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/06—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for folding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/0013—Article or web delivery apparatus incorporating cutting or line-perforating devices and applying the article or the web by adhesive to a surface
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/11—Dimensional aspect of article or web
    • B65H2701/111—Plane geometry, contour
    • B65H2701/1111—Geometric shape
    • B65H2701/11112—Geometric shape disk

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Textile Engineering (AREA)
TW104116774A 2014-05-28 2015-05-26 膠帶貼附裝置及膠帶貼附方法 TWI671849B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014110515A JP6340249B2 (ja) 2014-05-28 2014-05-28 テープ貼り付け装置およびテープ貼り付け方法
JP2014-110515 2014-05-28

Publications (2)

Publication Number Publication Date
TW201545271A TW201545271A (zh) 2015-12-01
TWI671849B true TWI671849B (zh) 2019-09-11

Family

ID=54841320

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104116774A TWI671849B (zh) 2014-05-28 2015-05-26 膠帶貼附裝置及膠帶貼附方法

Country Status (5)

Country Link
US (1) US9738483B2 (enExample)
JP (1) JP6340249B2 (enExample)
KR (1) KR102363106B1 (enExample)
CN (1) CN105321851B (enExample)
TW (1) TWI671849B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105734494B (zh) * 2016-04-12 2018-12-25 京东方科技集团股份有限公司 一种蒸镀载板及蒸镀装置
BR102016008166B1 (pt) * 2016-04-13 2022-04-19 Tas Equipamentos Eireli Disposição construtiva aplicada em cabeçote para sistema de envidraçamento estrutural
JP6908464B2 (ja) * 2016-09-15 2021-07-28 株式会社荏原製作所 基板加工方法および基板加工装置
DE102016226058B4 (de) 2016-12-22 2019-01-17 Tesa Se Klebebandabroller mit Umlenkeinrichtung
JP6871812B2 (ja) * 2017-06-21 2021-05-12 リンテック株式会社 シート貼付装置および貼付方法
KR101952653B1 (ko) * 2017-12-13 2019-02-27 우림이엔지 주식회사 원통의 원주방향 테이핑 장치
JP6948286B2 (ja) * 2018-06-15 2021-10-13 豊臣機工株式会社 シール貼付装置
US11430677B2 (en) * 2018-10-30 2022-08-30 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer taping apparatus and method
CN111377295A (zh) * 2018-12-27 2020-07-07 汉能移动能源控股集团有限公司 双面贴胶装置及双面贴胶方法
CN111702864B (zh) * 2020-06-17 2021-09-21 深圳市燕川光电有限公司 一种用于调整遮光胶带宽度的调节装置及模切机
CN111700736B (zh) * 2020-06-29 2022-01-07 中南大学湘雅医院 一种外科手术用医用压敏胶带盒
JP7618158B2 (ja) * 2020-08-07 2025-01-21 株式会社荏原製作所 テープ貼り付けシステム、テープ貼り付け方法、テープ剥がしシステム、およびテープ剥がし方法
CN112587408B (zh) * 2020-12-22 2023-09-15 安徽雨桐医疗科技有限公司 一种在灸头加热装置用安装板周边铺设隔热材料层的装置
KR102837607B1 (ko) * 2021-02-05 2025-07-22 주식회사 엘지에너지솔루션 이차전지용 테이프의 부착 방법
JP7788248B2 (ja) * 2021-09-30 2025-12-18 リンテック株式会社 シート貼付装置およびシート貼付方法
JP7386550B2 (ja) * 2021-10-27 2023-11-27 清川メッキ工業株式会社 無電解めっき用シリコンウェハの製造方法
JP2023096520A (ja) * 2021-12-27 2023-07-07 リンテック株式会社 環状接着シート形成装置および環状接着シート形成方法
JP2023096519A (ja) * 2021-12-27 2023-07-07 リンテック株式会社 環状接着シート形成装置および環状接着シート形成方法
JP2023114594A (ja) * 2022-02-07 2023-08-18 株式会社Ｓｃｒｅｅｎホールディングス センタリング装置、センタリング方法および基板処理装置
JP7765326B2 (ja) * 2022-03-23 2025-11-06 リンテック株式会社 シート貼付装置およびシート貼付方法
JP2023141064A (ja) * 2022-03-23 2023-10-05 リンテック株式会社 シート貼付装置およびシート貼付方法
JP2023163815A (ja) * 2022-04-28 2023-11-10 リンテック株式会社 シート貼付装置およびシート貼付方法
CN114772367B (zh) * 2022-05-11 2023-11-21 青岛博锐智远减振科技有限公司 一种遮蔽胶带安装装置及其使用方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090095426A1 (en) * 2005-12-09 2009-04-16 Lintec Corporation Tape sticking apparatus, mounting apparatus and mounting method
US20090165958A1 (en) * 2005-12-09 2009-07-02 Lintec Corporation Tape sticking apparatus and sticking method
JP2010272702A (ja) * 2009-05-21 2010-12-02 Panasonic Corp 異方性導電材貼付装置及び貼付方法
JP2012069782A (ja) * 2010-09-24 2012-04-05 Tokyo Electron Ltd 基板処理装置，基板処理方法，周縁テープ剥離装置，周縁テープ剥離方法
US20130126100A1 (en) * 2010-08-10 2013-05-23 Lintec Corporation Sheet separation apparatus and separation method, and sheet attaching apparatus and attaching method

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3260660D1 (en) * 1981-08-17 1984-10-11 Ciba Geigy Ag Device for applying adhesive tape to the edge of sheet material
US4588463A (en) * 1982-11-04 1986-05-13 Datafile Limited Method of producing a reinforced file folder
ZA841105B (en) * 1983-02-16 1984-09-26 Ciba Geigy Ag Apparatus for the application of an adhesive tape about the edge of a shaped part of sheet metal
JPH0253883A (ja) * 1988-08-18 1990-02-22 Nec Corp マスキング装置
JPH06211410A (ja) * 1993-01-14 1994-08-02 Lintec Corp テープ貼付ヘッドおよびテープ自動貼付装置
JPH0738171U (ja) * 1993-12-13 1995-07-14 日立電線株式会社 マスキングテープの剥離装置
JP3012931U (ja) * 1994-12-26 1995-06-27 川崎製鉄株式会社 サンプル鋼板端縁部への粘着テープ貼り機およびその装置
JP2002026218A (ja) * 2000-07-07 2002-01-25 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2005303158A (ja) 2004-04-15 2005-10-27 Nec Corp デバイスの形成方法
JP4297829B2 (ja) * 2004-04-23 2009-07-15 リンテック株式会社 吸着装置
JP4665429B2 (ja) 2004-04-26 2011-04-06 富士電機システムズ株式会社 半導体素子の製造方法
JP4387879B2 (ja) * 2004-06-17 2009-12-24 株式会社ディスコ 保護テープ装着方法および保護テープ装着装置
JP4583920B2 (ja) * 2004-12-28 2010-11-17 立山マシン株式会社 テープ剥離方法と装置
JP5050374B2 (ja) * 2005-05-16 2012-10-17 富士電機株式会社 半導体装置の製造方法
JP4731369B2 (ja) * 2006-03-23 2011-07-20 リンテック株式会社 テープ貼付装置
JP4895766B2 (ja) * 2006-11-14 2012-03-14 日東電工株式会社 半導体ウエハの保護テープ切断方法および保護テープ切断装置
WO2010018767A1 (ja) * 2008-08-11 2010-02-18 電気化学工業株式会社 半導体加工方法及び粘着テープ
DE202011104929U1 (de) * 2011-08-29 2011-11-21 Lohmann Gmbh & Co. Kg Klebebandapplikator
JP4974094B1 (ja) * 2011-09-30 2012-07-11 フジコー株式会社 マスキングテープ貼付方法および貼付装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090095426A1 (en) * 2005-12-09 2009-04-16 Lintec Corporation Tape sticking apparatus, mounting apparatus and mounting method
US20090165958A1 (en) * 2005-12-09 2009-07-02 Lintec Corporation Tape sticking apparatus and sticking method
JP2010272702A (ja) * 2009-05-21 2010-12-02 Panasonic Corp 異方性導電材貼付装置及び貼付方法
US20130126100A1 (en) * 2010-08-10 2013-05-23 Lintec Corporation Sheet separation apparatus and separation method, and sheet attaching apparatus and attaching method
JP2012069782A (ja) * 2010-09-24 2012-04-05 Tokyo Electron Ltd 基板処理装置，基板処理方法，周縁テープ剥離装置，周縁テープ剥離方法

Also Published As

Publication number Publication date
CN105321851B (zh) 2019-07-30
US9738483B2 (en) 2017-08-22
KR102363106B1 (ko) 2022-02-15
TW201545271A (zh) 2015-12-01
KR20150137022A (ko) 2015-12-08
US20160023861A1 (en) 2016-01-28
CN105321851A (zh) 2016-02-10
JP2015224300A (ja) 2015-12-14
JP6340249B2 (ja) 2018-06-06

Similar Documents

Publication Publication Date Title
TWI671849B (zh) 膠帶貼附裝置及膠帶貼附方法
KR100652257B1 (ko) 이면 연삭/다이싱 테이프 부착 시스템
WO2005036628A1 (ja) マウント装置及びマウント方法
TWI539501B (zh) Sheet stripping device and peeling method
TWI779140B (zh) 膠帶黏貼裝置
CN108666234B (zh) 片材粘贴装置及粘贴方法
WO2015141744A1 (ja) ガラスフィルムの洗浄方法、及びガラスフィルムの洗浄装置
TW201519304A (zh) 黏著帶貼附方法及黏著帶貼附裝置
JP2010023131A (ja) フィルムの貼り付け装置及び貼り付け方法
JP6621365B2 (ja) 保護テープの剥離方法
JP2008166459A (ja) 保護テープ貼付方法と装置
TWI534942B (zh) Sheet manufacturing apparatus and manufacturing method thereof
JP2003063704A (ja) ラミネータ用フィルム自動交換装置
JP5789463B2 (ja) シート貼付装置及び貼付方法、並びに、シート製造装置及び製造方法
JP2007168046A (ja) テープカット装置及びテープカット方法
JP7432345B2 (ja) シート剥離装置
TWI600526B (zh) 光學部件貼合體之製造裝置
JP6920113B2 (ja) テープ形成装置
JP2024088925A (ja) 粘着テープ貼付装置
TW202403926A (zh) 片貼附裝置以及片貼附方法
JP5690896B2 (ja) シート剥離装置及び剥離方法
JP2012166932A (ja) シート材の加工供給装置
JP2014017509A (ja) シート剥離装置及び剥離方法
JPS62264164A (ja) 薄膜張付装置用搬送装置
JP2010131706A (ja) シート貼付装置及び貼付方法