JP6340249B2 - テープ貼り付け装置およびテープ貼り付け方法 - Google Patents

テープ貼り付け装置およびテープ貼り付け方法 Download PDF

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Publication number
JP6340249B2
JP6340249B2 JP2014110515A JP2014110515A JP6340249B2 JP 6340249 B2 JP6340249 B2 JP 6340249B2 JP 2014110515 A JP2014110515 A JP 2014110515A JP 2014110515 A JP2014110515 A JP 2014110515A JP 6340249 B2 JP6340249 B2 JP 6340249B2
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JP
Japan
Prior art keywords
tape
substrate
roller
masking tape
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014110515A
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English (en)
Japanese (ja)
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JP2015224300A5 (enExample
JP2015224300A (ja
Inventor
伊藤　賢也
賢也 伊藤
圭介 内山
圭介 内山
富一 松井
富一 松井
真人 渋谷
真人 渋谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
IS Engineering Co Ltd
Original Assignee
Ebara Corp
IS Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, IS Engineering Co Ltd filed Critical Ebara Corp
Priority to JP2014110515A priority Critical patent/JP6340249B2/ja
Priority to US14/720,068 priority patent/US9738483B2/en
Priority to TW104116774A priority patent/TWI671849B/zh
Priority to KR1020150074055A priority patent/KR102363106B1/ko
Priority to CN201510281718.7A priority patent/CN105321851B/zh
Publication of JP2015224300A publication Critical patent/JP2015224300A/ja
Publication of JP2015224300A5 publication Critical patent/JP2015224300A5/ja
Application granted granted Critical
Publication of JP6340249B2 publication Critical patent/JP6340249B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/06—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for folding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/0013—Article or web delivery apparatus incorporating cutting or line-perforating devices and applying the article or the web by adhesive to a surface
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/11—Dimensional aspect of article or web
    • B65H2701/111—Plane geometry, contour
    • B65H2701/1111—Geometric shape
    • B65H2701/11112—Geometric shape disk

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Textile Engineering (AREA)
JP2014110515A 2014-05-28 2014-05-28 テープ貼り付け装置およびテープ貼り付け方法 Active JP6340249B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014110515A JP6340249B2 (ja) 2014-05-28 2014-05-28 テープ貼り付け装置およびテープ貼り付け方法
US14/720,068 US9738483B2 (en) 2014-05-28 2015-05-22 Tape sticking apparatus and tape sticking method
TW104116774A TWI671849B (zh) 2014-05-28 2015-05-26 膠帶貼附裝置及膠帶貼附方法
KR1020150074055A KR102363106B1 (ko) 2014-05-28 2015-05-27 테이프 첩부 장치 및 테이프 첩부 방법
CN201510281718.7A CN105321851B (zh) 2014-05-28 2015-05-28 胶带贴附装置及胶带贴附方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014110515A JP6340249B2 (ja) 2014-05-28 2014-05-28 テープ貼り付け装置およびテープ貼り付け方法

Publications (3)

Publication Number Publication Date
JP2015224300A JP2015224300A (ja) 2015-12-14
JP2015224300A5 JP2015224300A5 (enExample) 2016-12-15
JP6340249B2 true JP6340249B2 (ja) 2018-06-06

Family

ID=54841320

Family Applications (1)

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JP2014110515A Active JP6340249B2 (ja) 2014-05-28 2014-05-28 テープ貼り付け装置およびテープ貼り付け方法

Country Status (5)

Country Link
US (1) US9738483B2 (enExample)
JP (1) JP6340249B2 (enExample)
KR (1) KR102363106B1 (enExample)
CN (1) CN105321851B (enExample)
TW (1) TWI671849B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022030556A1 (ja) 2020-08-07 2022-02-10 株式会社荏原製作所 テープ貼り付けシステム、テープ貼り付け方法、テープ剥がしシステム、およびテープ剥がし方法

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CN105734494B (zh) * 2016-04-12 2018-12-25 京东方科技集团股份有限公司 一种蒸镀载板及蒸镀装置
BR102016008166B1 (pt) * 2016-04-13 2022-04-19 Tas Equipamentos Eireli Disposição construtiva aplicada em cabeçote para sistema de envidraçamento estrutural
JP6908464B2 (ja) * 2016-09-15 2021-07-28 株式会社荏原製作所 基板加工方法および基板加工装置
DE102016226058B4 (de) 2016-12-22 2019-01-17 Tesa Se Klebebandabroller mit Umlenkeinrichtung
JP6871812B2 (ja) * 2017-06-21 2021-05-12 リンテック株式会社 シート貼付装置および貼付方法
KR101952653B1 (ko) * 2017-12-13 2019-02-27 우림이엔지 주식회사 원통의 원주방향 테이핑 장치
JP6948286B2 (ja) * 2018-06-15 2021-10-13 豊臣機工株式会社 シール貼付装置
US11430677B2 (en) * 2018-10-30 2022-08-30 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer taping apparatus and method
CN111377295A (zh) * 2018-12-27 2020-07-07 汉能移动能源控股集团有限公司 双面贴胶装置及双面贴胶方法
CN111702864B (zh) * 2020-06-17 2021-09-21 深圳市燕川光电有限公司 一种用于调整遮光胶带宽度的调节装置及模切机
CN111700736B (zh) * 2020-06-29 2022-01-07 中南大学湘雅医院 一种外科手术用医用压敏胶带盒
CN112587408B (zh) * 2020-12-22 2023-09-15 安徽雨桐医疗科技有限公司 一种在灸头加热装置用安装板周边铺设隔热材料层的装置
KR102837607B1 (ko) * 2021-02-05 2025-07-22 주식회사 엘지에너지솔루션 이차전지용 테이프의 부착 방법
JP7788248B2 (ja) * 2021-09-30 2025-12-18 リンテック株式会社 シート貼付装置およびシート貼付方法
JP7386550B2 (ja) * 2021-10-27 2023-11-27 清川メッキ工業株式会社 無電解めっき用シリコンウェハの製造方法
JP2023096520A (ja) * 2021-12-27 2023-07-07 リンテック株式会社 環状接着シート形成装置および環状接着シート形成方法
JP2023096519A (ja) * 2021-12-27 2023-07-07 リンテック株式会社 環状接着シート形成装置および環状接着シート形成方法
JP2023114594A (ja) * 2022-02-07 2023-08-18 株式会社Ｓｃｒｅｅｎホールディングス センタリング装置、センタリング方法および基板処理装置
JP7765326B2 (ja) * 2022-03-23 2025-11-06 リンテック株式会社 シート貼付装置およびシート貼付方法
JP2023141064A (ja) * 2022-03-23 2023-10-05 リンテック株式会社 シート貼付装置およびシート貼付方法
JP2023163815A (ja) * 2022-04-28 2023-11-10 リンテック株式会社 シート貼付装置およびシート貼付方法
CN114772367B (zh) * 2022-05-11 2023-11-21 青岛博锐智远减振科技有限公司 一种遮蔽胶带安装装置及其使用方法

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US4588463A (en) * 1982-11-04 1986-05-13 Datafile Limited Method of producing a reinforced file folder
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JPH0253883A (ja) * 1988-08-18 1990-02-22 Nec Corp マスキング装置
JPH06211410A (ja) * 1993-01-14 1994-08-02 Lintec Corp テープ貼付ヘッドおよびテープ自動貼付装置
JPH0738171U (ja) * 1993-12-13 1995-07-14 日立電線株式会社 マスキングテープの剥離装置
JP3012931U (ja) * 1994-12-26 1995-06-27 川崎製鉄株式会社 サンプル鋼板端縁部への粘着テープ貼り機およびその装置
JP2002026218A (ja) * 2000-07-07 2002-01-25 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2005303158A (ja) 2004-04-15 2005-10-27 Nec Corp デバイスの形成方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022030556A1 (ja) 2020-08-07 2022-02-10 株式会社荏原製作所 テープ貼り付けシステム、テープ貼り付け方法、テープ剥がしシステム、およびテープ剥がし方法
EP4657513A2 (en) 2020-08-07 2025-12-03 Ebara Corporation Tape sticking system, tape sticking method, tape peeling system, and tape peeling method

Also Published As

Publication number Publication date
CN105321851B (zh) 2019-07-30
US9738483B2 (en) 2017-08-22
KR102363106B1 (ko) 2022-02-15
TW201545271A (zh) 2015-12-01
KR20150137022A (ko) 2015-12-08
US20160023861A1 (en) 2016-01-28
TWI671849B (zh) 2019-09-11
CN105321851A (zh) 2016-02-10
JP2015224300A (ja) 2015-12-14

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