TWI566478B - 印刷電路板 - Google Patents

印刷電路板 Download PDF

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TWI566478B
TWI566478B TW101137810A TW101137810A TWI566478B TW I566478 B TWI566478 B TW I566478B TW 101137810 A TW101137810 A TW 101137810A TW 101137810 A TW101137810 A TW 101137810A TW I566478 B TWI566478 B TW I566478B
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ground
circuit board
printed circuit
conductive
conductors
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TW101137810A
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TW201324960A (zh
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傑生Ｊ 艾莉生
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Fci公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09354—Ground conductor along edge of main surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

印刷電路板
本發明係關於電子裝置，且更特定言之係關於用於高速電連接器的串音干擾減少。
電連接器使用信號接點而在電子裝置之間提供信號連接。通常，該等信號接點經如此緊密隔開使得在相鄰信號接點之間發生非所要干擾或「串擾」。當一信號接點中之一信號歸因於干擾電場而在一相鄰信號接點中引致電干擾時便會發生串音干擾，藉此損及信號完整性。串音干擾亦可發生在差動信號對之間。串音干擾通常隨著干擾信號接點之間之距離減小而增加。
隨著電子裝置之持續小型化及對高速電子通信的需求日益增加，減小串音干擾通常係電連接器設計中之一重要目標。
在一實施例中，一種印刷電路板包含一印刷電路板本體、複數個信號導體、複數個接地導體及接觸且電連接至少一對該等接地導體之一接地耦合總成。
可藉由電連接連接器內之接地接點而改良具有差動信號對之現有電連接器(諸如串列進階附接技術(SATA)、串列附接小型電腦系統介面(SCSI或SAS)，包含迷你型SAS HD連接器、CXP連接器、後板及夾層式連接器)之電性能。本 文描述之實施例容許簡單地改進經設計以依較慢資料傳輸速率操作之現有連接器，從而產生一偶入可相容、較高資料傳輸速度的連接器，該連接器亦遵循正在發展的新標準，諸如SATA第2.6版、SAS-2第115版及IEEE 802.3ap，該等標準之各者之內容以宛如全文闡述引用的方式併入本文。更具體言之，本文描述之實施例可移位現有連接器之共振頻率以在不改變現有標準化或非標準化連接器之配接或安裝介面尺寸之情況下擴展現有操作頻率範圍。換言之，該等所描述之實施例可容許修改及/或替換現有連接器以在現有連接器外殼尺寸之範圍內產生一經修改連接器使得該經修改連接器以較快資料傳輸速率(在頻域及時域串音干擾限制內，諸如標準中所闡述，針對約40 ps之時域為6%或更小或針對約40 ps之頻域為約-24 dB或更小(-26 dB))有效地操作，但與無法以新發展標準之參數操作之現有連接器仍保持偶入式相容。本文描述之實施例雖易於建構，但對各種標準之現有實施者提供一顯著優點且亦對標準實施者及組件供應者提供大幅成本節省。
參考圖1A至圖1E，根據一實施例建構之一電連接器總成20包含一第一電連接器22及一互補第二電連接器24，使得該第一電連接器22及該第二電連接器24經組態以彼此配接。如所示，該第一電連接器22可為一SAS連接器，包含一迷你型SAS HD、一SATA連接器、一CXP連接器或經組態以促進一第一電裝置與一第二電裝置之間之電連通之任何合適的替代性電連接器，包含一光學連接器。即，該第 一電連接器22可界定經組態以與該第二電連接器24配接以在該第一電連接器22與該第二電連接器24之間建立一電連接之一第一或配接介面26及經組態以安裝至一對應電組件(諸如可為一印刷電路板之一基板)上以在該第一電連接器22與該對應電組件之間建立一電連接之一第二或安裝介面28。因此，當該第一電連接器22與該第二電連接器24及該對應電組件完全配接時，該第一電連接器22使該基板與該第二電連接器24彼此電連通。
亦參考圖2A至圖2D，該第一電連接器22包含一介電或電絕緣第一連接器外殼30及藉由該第一連接器外殼30支撐之複數個電接點32。該第一連接器外殼30界定一前端30a及沿一縱向方向L與該前端30a隔開之一相對後端30b、一頂端30c及沿實質上垂直於該縱向方向L之一橫向方向T與該頂端30c隔開之一相對底端30d及沿垂直於該橫向方向T及該縱向方向L二者之一側向方向A彼此隔開之相對側30e。除非本文另有指示，否則術語「側向」、「縱向」及「橫向」係用以描述各種組件之正交方向分量。術語「內側」與「內部」及「外側」與「外部」及類似術語在針對一特定方向分量而使用時旨在指代沿該方向分量朝向及遠離所描述設備之中心之方向。
如自下列描述將明白，該前端30a可界定經組態以沿該縱向方向L(其可界定一配接方向)配接至該第二電連接器24之配接介面之配接介面26，且該底端30d可界定經組態以沿該橫向方向T(其可界定一安裝方向)安裝至該對應電 組件上之安裝介面28。因為該配接介面26經定向相對於該安裝介面28垂直，所以該電連接器22可稱為一直角電連接器。或者，該電連接器22可組態為一垂直電連接器，藉此該配接介面26經定向平行於該安裝介面28。
應明白，雖然縱向方向及側向方向係圖解說明為沿一水平面延伸且橫向方向係圖解說明為沿一垂直平面延伸，但是涵蓋各個方向之平面可在使用期間取決於(例如)各種組件之定向而有所不同。因此，如僅為清楚及方便之目的而圖解說明，方向術語「垂直」及「水平」係用以描述連接器總成20及其組件，應明白可在使用期間改變此等定向。
該等電接點32之各者界定一配接端32a，該配接端32a經安置靠近該配接介面26且經組態以在該第一電連接器22配接至該第二電連接器24時與該第二電連接器24之互補電接點之一配接端配接。該等電接點32之各者進一步界定經組態以安裝至對應電組件之一安裝端32b。根據所圖解說明之實施例，該等配接端32a沿該縱向方向L定向，且該等安裝端32b沿該橫向方向T定向。因為該等配接端32a經定向垂直於該安裝端32b，所以該等電接點32可稱為直角電接點。或者，該等電接點32可組態為垂直電接點，藉此該等配接端32a經定向平行於該等安裝端32b。
可視需要配置該等電接點32。例如，根據所圖解說明之實施例，該等電接點32界定至少一列，諸如電接點32之複數個列35，該等列35在該配接介面26處沿橫向方向T彼此隔開。因此，每一列35之電接點32沿一列方向彼此隔開。 該等列35可在該安裝介面28處沿縱向方向L彼此隔開。該等列35之各者之電接點32沿側向方向A彼此隔開。該電連接器22可在該配接介面26處界定沿橫向方向T界定於相鄰列35之間之至少一插座33。
根據所圖解說明之實施例，該配接介面26界定電接點32之兩對相鄰列35，使得每一對相鄰列35界定沿橫向方向T彼此隔開且經組態以接納該第二電連接器24之一對應基板或經建構配接端以使該第一電連接器22配接至該第二電連接器24之對應插座33a及33b。因此，該第一電連接器22可稱為電接點32經組態以接納該第二電連接器24之配接端之一插座連接器。雖然該電連接器22係圖解說明為界定第一插座33a及第二插座33b，但是應明白該電連接器22可界定任何數目個插座33，例如至少一插座。每一插座33可沿側向方向A呈長形且經組態以沿縱向配接方向接納該第二電連接器24之配接端。每一插座33係藉由安置在該插座33之相對橫向側上之一對電接點32而界定，使得該等電接點32經組態以建立與插入該插座33中之第二電連接器24之基板之一電連接。
該等電接點32之至少一者至多全部可界定信號接點37，且該等電接點32之至少一者(諸如複數個)可界定可安置在相鄰信號接點37之間之接地接點39。例如，每一列35之沿側向方向A隔開之相鄰信號接點37可界定差動信號對41，且可沿該列35在相鄰差動信號對41之間安置接地接點39或可視需要以其他方式安置該等接地接點39。因此，該等電 接點32可沿側向方向A在各自列35中界定一重複S-S-G型樣、G-S-S型樣、S-G-S型樣，或可視需要界定任何其他型樣，其中「S」表示一信號接點37且「G」表示一接地接點39。
繼續參考圖1A至圖1E，該第二電連接器24可包含一介電或電絕緣第二連接器外殼34及藉由該第二連接器外殼34承載之至少一基板36。該第二連接器外殼34可界定一前端34a及沿縱向方向L與該前端34a隔開之一後端34b、一頂端34c及沿橫向方向T與該頂端34c隔開之一底端34d以及沿側向方向A彼此隔開之相對側34e。該前端34a及該後端34b之各者可界定在藉由側向方向A及橫向方向T界定之一平面中呈長形之各自前表面及後表面。該第二電連接器24界定一第一或配接介面27，該第一或配接介面27可藉由該第二連接器外殼34之前端34a界定且經組態以在該第一電連接器22與該第二電連接器24彼此配接時與該第一電連接器22之配接介面26配接。該第二電連接器進一步界定經組態以安裝至一對應電組件上以在該第二電連接器24與該對應電組件之間建立一電連接之一第二或安裝介面29(其可包含複數個電纜)。因此，該第二電連接器24及該電纜可界定一電纜總成，該電纜總成經組態以與該第一電連接器22配接以使至少一電纜與該第一電連接器22電連通，且因此在該第一電連接器22安裝至對應電組件時與該第一電連接器22所安裝至之電組件電連通。
亦參考圖2A至圖2D，該電連接器24可包含藉由該第二 連接器外殼34支撐且沿橫向方向T彼此隔開之一對基板36。例如，該等基板36之各者可經安置靠近該配接介面27，且經組態以在該第一電連接器22配接至該第二電連接器24時插入該第一電連接器22之對應插座33對之各自者中，藉此在該等基板36與該第一電連接器22之電接點32之若干者之間建立一電連接。因此，該電連接器24可稱為具有至少一基板36之一插頭連接器，該插頭連接器接納於該第一電連接器22之一對應插座中以在該第一電連接器22之電接點32之若干者與該至少一基板36之間建立一電連接。
該等基板36之至少一者或二者包含一各自介電或非導電基板本體51及至少一信號導體43(諸如藉由該基板本體51支撐之複數個信號導體43)以及至少一接地導體45(諸如藉由該基板本體51支撐之複數個接地導體45)。可界定一印刷電路板本體之基板本體51可界定一第一或上表面51a及沿橫向方向T與該上表面51隔開之一第二或下表面51b。該上表面51a及該下表面51b可沿側向方向A及縱向方向L延伸。
該等基板本體51之各者亦可界定一第三或前表面51c及一第四或後表面51d，該等表面之各者沿側向方向A及橫向方向T在該上表面51a與該下表面51b之間延伸。應明白，該前表面51c及該後表面51d界定該基板本體51之各自前端及後端，且對該前表面51c及該後表面51d之引用進一步包含對前端及後端之引用。該前表面51c沿縱向方向L與該後表面51d隔開，且藉由各自基板36插入該第一電連接器22 之一對應插座33中之一前端界定。該等基板本體51之各者可進一步界定在該前表面51c與該後表面51d之間等距地隔開之一中線59。
該前表面51c可經組態以沿一正向縱向方向插入第一電連接器22之插座33之一對應者中，使得後表面51d沿縱向方向L安置在該對應插座33後面。後表面51d可經組態以藉由連接器外殼34支撐，使得該等信號導體43經安排路線穿過該連接器外殼34以界定該安裝介面29。如圖解說明，縱向方向L係為配接而插入基板36之方向。縱向方向L因此可稱為配接方向，其可為根據所圖解說明之實施例之一插入方向。因此，應瞭解，印刷電路板本體界定經組態以沿一配接方向插入一互補電連接器22之一插座33中之一前表面51c，該印刷電路板本體進一步界定沿配接方向與該前表面51c相對之一後表面51d。
如上所述，每一基板36可包含藉由該基板本體51支撐之複數個電信號導體43。每一信號導體43可包含一信號接觸墊42及與該信號接觸墊42及該安裝介面29電連通之至少一導電信號跡線47。例如，該信號跡線47可與該接觸墊42成一體。每一信號導體43可在縱向方向L上沿對應基板本體51呈長形。例如，每一信號導體43之至少一部分可沿該上表面51a及該下表面51b之一者延伸，或可嵌入該上表面51a與該下表面51b之間之基板本體51中。根據所圖解說明之實施例，該等信號接觸墊42藉由該上表面51a及該下表面51b之各自者承載，且該信號跡線47可同樣藉由該上表 面51a及該下表面51b之各自者承載，或嵌入該上表面51a與該下表面51b之間之基板本體51中。當基板36插入該第一電連接器之插座33中時，藉由該上表面51a承載之信號接觸墊42經組態以接觸該等列35之一者(例如，界定該插座33之該對列之一上列)之電信號接點37。類似地，當該基板36插入該第一電連接器22之插座33中時，藉由該下表面51b承載之信號接觸墊42經組態以接觸另一列(例如，界定該插座33之列35之一下列)之電信號接點37。該基板本體51亦可含有可沿縱向方向L對準該等信號接觸墊42之各自者之至少一磨損減小墊56，諸如複數個磨損減小墊56。該等磨損減小墊56可安置在該等各自信號接觸墊42與導電跡線48之間。
進一步如上所述，每一基板36可包含藉由該基板本體51支撐之複數個電接地導體45。該等基板36之至少一者或二者進一步支撐複數個接地導體45，該等接地導體45之各者可包含一接地接觸墊44及與該接觸墊44電連通之一導電跡線48。例如，該導電跡線48可與接地導體45及接觸墊44成一體。每一接地導體45可在縱向方向L上沿對應基板本體51延伸。例如，每一接地導體45之至少一部分可沿該上表面51a及該下表面51b之一者延伸，或可嵌入該上表面51a與該下表面51b之間之基板本體51中。根據所圖解說明之實施例，該等接地接觸墊44藉由該上表面51a及該下表面51b之各自者承載，且該導電跡線48同樣可藉由該上表面51a及該下表面51b之各自者承載，或嵌入該上表面51a與 該下表面51b之間之基板本體51中。當該基板36插入該第一電連接器之插座33中時，藉由該上表面51a承載之接地接觸墊44經組態以接觸該等列35之一者(例如，界定該插座33之該對列之一上列)之電接地接點39。類似地，當該基板36插入該第一電連接器22之插座33中時，藉由該下表面51b承載之接地接觸墊44經組態以接觸另一列(例如，界定該插座33之列35之一下列)之電接地接點39。因此，應瞭解，接地導體45及信號導體43經組態以與互補第一電連接器22之各自互補電接地接點及電信號接點配接。
該接地導體45可定位於相鄰信號導體43之間且在縱向方向L上於該前表面51c與該後表面51d之間沿對應基板本體51呈長形。該等信號導體43及該等接地導體45可沿側向方向A(其可界定一列方向)彼此隔開且配置。雖然信號接觸墊42及接地接觸墊44可沿列方向(如圖2A至圖2D中描繪)彼此對準，但信號接觸墊42及接地接觸墊44亦可沿縱向方向L彼此偏移(且因此並未沿側向方向A對準)。因此，應瞭解，該印刷電路板本體界定沿垂直於配接方向之一方向彼此隔開之一上表面51a及一下表面51b，該上表面51a及該下表面51b之各者沿配接方向及一列方向延伸，且接地導體45及信號導體43沿該列方向彼此隔開。應進一步瞭解，前表面51c及後表面51d之各者沿該列方向延伸。
當該第一電連接器22及該第二電連接器24彼此完全配接時，該第二電連接器24之基板36之各者可沿縱向方向L插入該第一電連接器22之插座33之一各自者中達足以使信號 接觸墊42接觸該第一電連接器22之電信號接點37之配接端32a以與該等互補電信號接點37配接之一深度。類似地，當該第一電連接器22及該第二電連接器24彼此完全配接時，該第二電連接器24之基板36之各者可沿縱向方向L插入該第一電連接器22之插座33之一各自者中達足以使接地接觸墊44接觸該第一電連接器22之電接地接點39之配接端32a以與該等互補電接地接點39配接之一深度。因此，沿側向方向A之相鄰信號導體43可界定差動信號對55，且該等接地導體45可安置在該等差動信號對55之相鄰各自者之間(例如相鄰差動信號對之間)或可視需要以其他方式安置。因此，該等信號導體43及該等接地導體45可界定一重複S-S-G型樣、G-S-S型樣、S-G-S型樣，或視需要沿側向方向A之任何其他型樣，其中「S」表示一信號導體43且「G」表示一接地導體45。
繼續參考圖2A至圖2D，該等基板36之至少一者至多全部可包含一接地耦合總成46，該接地耦合總成46經組態以電連接至少兩個接地導體45同時維持相對於信號導體43之電隔離，使得一介電材料(諸如僅基板本體51或與空氣組合)使全部接地耦合總成46與全部信號導體43分離。根據一實施例，該接地耦合總成46可提供為使該等接地接觸墊44之至少兩者或兩者以上至多全部彼此電連通之一或多個導電接地共同構件53。例示性接地共同構件53包含導電接地跡線，該等導電接地跡線之一些或全部彼此連接或彼此成一體以界定一電共同接地跡線61及導電接地導通體57， 該等導電接地導通體57之各者可藉由一接地通孔52及定位於該接地通孔52內部且沿橫向方向T或沿使該上表面51a與下表面51b彼此分離之一方向沿該接地通孔52之整個長度延伸之一導電接地塊體50界定。例如，該等接地通孔52可在該上表面51a與下表面51b之間延伸。例如，該等接地通孔52之至少一者或至多全部可自該上表面51a延伸至該下表面51b。替代性地或此外，該等接地通孔52之至少一者或至多全部可自該上表面51a延伸朝向該下表面51b，且終止於該上表面51a與該下表面51b之間。替代性地或此外，該等接地通孔52之至少一者或至多全部可自該下表面51b延伸朝向該上表面51a，且終止於該上表面51a與該下表面51b之間。替代性地或此外，該等接地通孔52之至少一者或至多全部可自皆安置於該上表面51a與該下表面51b之間之相對終端延伸。因此，據信該等接地通孔52可至少部分延伸穿過該基板本體51，例如部分或完全穿過該基板本體51或部分穿過該本體51。
該等接地耦合構件53之至少一者或多者至多全部可電接觸沿該列方向彼此隔開之接地導體45之至少兩者或兩者以上至多全部。例如，該等接地耦合構件53之至少一者或多者至多全部可在該中線59與該前表面51c之間之一位置處接觸該等接地導體45之至少兩者或兩者以上至多全部之各者。根據所圖解說明之實施例，該等導電共同接地跡線61在該中線59與該前表面51c之間之一位置處接觸該等接地導體45之兩者或兩者以上至多全部。替代性地或此外，該 等導電導通體57之一或多者可在該中線59與該前表面51c之間之一位置處接觸該等接地導體45之兩者或兩者以上至多全部。
如上所述，該等接地共同構件53可包含導電接地跡線，該等導電接地跡線之一些或全部可彼此連接或彼此成一體以界定一導電共同接地跡線61及導電接地導通體57。例如，該導電共同接地跡線61可包含沿側向方向A在該基板本體51之相對側51e之間延伸之至少一導電跡線48及在該等導電跡線48之至少一選擇者與該等接地導體45之個別者之間(例如，該等接地接觸墊44處)延伸之複數個導電鏈路49，藉此電連接個別接地接觸墊44、個別鏈路49及導電跡線48。例如，一選擇導電跡線48可沿該基板本體51之上表面51a安置，且一選擇導電跡線48可進一步沿該基板本體51之下表面51b安置。因此，該等鏈路49可在該中線59與該基板本體51之前表面51c之間之一位置處(例如)該等接地接觸墊44處接觸該等接地導體45。應明白，該等導電接地跡線61可視需要建構，且(例如)當該選擇導電跡線48在(例如)該中線59與該基板本體51之前表面51c之間之一位置處接觸該等接地導體45時可缺少該等鏈路49。根據所圖解說明之實施例，該等鏈路49使該導電跡線48相對於該等接地接觸墊44向前朝向該基板本體51之前表面51c隔開。根據例示性實施例，該導電共同接地跡線61可電連接至藉由該基板本體51承載之一對接地導體45至多全部該等接地導體45。該等接地導體45與該導電共同接地跡線61亦可彼此成 一體。
根據圖2A至圖2D中圖解說明之實施例，該等導電跡線48及因此該導電共同接地跡線61連接在至少一對至多全部該等接地導體45之間。該導電共同接地跡線61之至少一部分至多全部可沿該上表面51a延伸，替代性地或此外可沿該下表面51b延伸，且替代性地或此外可在該上表面51a與該下表面51b之間之一位置處嵌入該基板本體51中。該選擇導電跡線48且至多全部該等導電跡線48可在自該等信號導體43向前隔開之一位置處及因此在該等信號導體43與該前表面51c之間沿側向方向A實質上跨該基板本體51延伸。因此，該導電共同接地跡線61使與該導電共同接地跡線61電連通之接地導體45彼此電連通。因此應瞭解，該接地耦合總成46在沿自該後表面51d朝向該前表面51c之一方向處於該等信號導體43之前方的一位置處電接觸該等接地導體之至少兩者。
繼續參考圖2A至圖2D，該接地耦合總成46可包含至少一導電接地塊體，諸如在與導電跡線48對準之一位置處沿橫向方向T延伸進入或穿過該基板本體51之複數個導電接地塊體50。導電共同接地跡線61及導電接地塊體50可視需要由任何所要導電材料建構。例如，該導電接地共同跡線61之至少一部分可沿該基板本體51之一第一表面延伸，該第一表面可為根據所圖解說明之實施例之上表面51a，且該接地耦合總成46可進一步包含至少一此接地通孔52，諸如沿橫向方向T延伸朝向與該第一表面隔開之一第二表面 之複數個接地通孔52。例如，該導電共同接地跡線61可包含藉由該基板本體51承載之複數個導電跡線48。例如，該等導電跡線48之一者可沿該上表面51a、該下表面51b及/或在該上表面51a與該下表面51b之間延伸。因此，該第二表面可為根據所圖解說明之實施例之下表面51b。因此，應進一步明白，該第一表面可為該下表面51b且該第二表面可為該上表面51a。因此，應瞭解，該導電共同接地跡線61可含有一第一導電跡線48及沿垂直於配接方向之一方向與該第一導電跡線隔開之一第二導電跡線48，該第二導電跡線48與該第一導電跡線48電連通且沿垂直於該配接方向之一方向呈長形。應進一步瞭解，該第一導電跡線48及該第二導電跡線48沿垂直於該配接方向及第二方向二者之一第三方向呈長形，該第二方向垂直於該配接方向。
該等接地塊體50可安置在該等接地通孔52之一對應者中以形成導電接地導通體57，使得該等接地塊體50與該等導電跡線48之兩者或兩者以上至多全部接觸且電連通。該等接地塊體50因此與該等接地導體45之至少兩者至多全部電連通。進一步言之，接地塊體50及通孔52可與導電跡線48對準，且因此與該導電共同接地跡線61對準，使得該導電跡線48或該導電共同接地跡線61之替代部分(諸如鏈路49)覆疊且接觸該接地塊體50(參見圖2B)。或者，接地塊體及通孔可延伸穿過導電跡線48、導電共同接地跡線61，使得該導電跡線48或該導電共同接地跡線61之替代位置(諸如鏈路49)接觸該接地塊體50。
根據所圖解說明之實施例，該等接地塊體50可沿側向方向A沿一中心距離隔開，該中心距離實質上等於側向方向A上該等接觸墊(包含信號接觸墊42及接地接觸墊44)之相鄰者之間之一中心距離。因此，應瞭解，該等導通體57沿列方向隔開一中心距離，該中心距離等於沿該列方向在相鄰信號導體43與接地導體45之間之中心距離。
如上所述，該接地耦合總成46可包含沿該上表面51a延伸之至少一導電共同接地跡線61，且可進一步包含沿該上表面51a、在該上表面51a與該下表面51b之間及沿該下表面51b延伸之導電跡線48。該接地耦合總成46中之導電跡線48之各者可沿橫向方向T在該基板36之上表面51a與下表面51b之間之一行中隔開。此外，該等導電跡線48之各者可在除縱向方向L及側向方向A之一者或二者以外亦包含橫向方向T之一方向上在該基板36之上表面51a與下表面51b之間隔開。該至少一接地塊體50可在該接地耦合總成46之導電跡線48之兩者或兩者以上之間延伸以使至少一對或多對至多全部該等接地導體45之接地跡線之各者彼此電連通。因此，應瞭解，一通孔及定位於該通孔內部之一導電接地塊體在一第一導電跡線48與一第二導電跡線48之間延伸。
繼續參考圖2A至圖2D，除導電接地導通體57以外，該基板可進一步包含延伸穿過基板46之額外導電接地導通體54及65，且可配置在沿縱向方向L定向之行60及沿側向方向A定向之列62中。如上文關於該等導電接地導通體57描 述般，該等導電接地導通體54及65之各者可藉由一接地通孔及定位於該接地通孔內部之一導電接地塊體界定。該等導電接地導通體65類似於導電接地導通體54且進一步包含藉由跡線66電耦合至接地接觸墊44之一大墊65。該等導電導通體54及65之行60可與該等導電接地導通體57之各自者對準。該等導電導通體54及65之行60可定位於相鄰信號跡線47之間，例如相鄰差動對55之間。該等額外導電導通體54及65可藉由(例如)至少一接地跡線58電連接在一起。接地跡線58可電連接至少一對至多全部該等導電導通體54及65，且沿縱向方向L及/或側向方向A在表面51a與51b之間或在表面51a或51b之一者或二者上延伸。例如，該等導電跡線58之一或多者可進一步連接至該等導電導通體54及65之一或多者至多全部。例如，該等接地跡線58之一或多者可單獨或與列62組合連接至各自行60之導電接地導通體54及65。進一步言之，個別接地跡線58可在選擇區域處沿側向方向A附接至導電跡線48。
現在參考圖3A至圖3B且如上所述，當該第一電連接器22與該第二電連接器24彼此完全配接時，基板36之各者插入該第一電連接器22之插座33之一各自者中達足以使信號接觸墊42與該第一電連接器22之電信號接點37配接且使接地接觸墊44與該第一電連接器之電接地接點39配接之一插入深度。例如，該等信號接觸墊42接觸該等電信號接點37之互補電信號接點之配接端32a，且該等接地接觸墊44接觸該等電接地接點39之互補電接地接點之配接端32a。如 圖3A中圖解說明，當電連接器22與24完全配接時，基板36之接地耦合總成46沿縱向方向L界定沿縱向方向L自該等接觸墊42及44接觸該等電接點32之各自配接端32a之一位置至該基板本體51之前表面51c量測之一插入深度ID。因此，亦可沿縱向方向L藉由該等配接端32a與該基板本體51之前表面51c之間之沿縱向方向之一距離界定該插入深度ID。該插入深度ID可大於圖3B中圖解說明之並不包含該接地耦合總成46之類型的習知基板之插入深度。根據一實施例，該插入深度ID可大於該習知基板之插入深度(諸如大0.8 mm)以對相對於該等信號接觸墊42縱向向前安置之接地塊體50及導電跡線48提供間隙。
此外，如圖解說明，該第一電連接器22並不包含任何金屬屏蔽，但是應明白，除非另有指定，否則該第一電連接器22可包含一或多個金屬屏蔽(若需要)，該一或多個金屬護罩可提供為(例如)實質上覆蓋信號接點37之整個長度之金屬串音干擾板。因此，除非另有指示，否則該第一電連接器22可為一無屏蔽連接器(即，在缺少金屬串音干擾板之情況下操作之一連接器)。
不限於理論，據信在多個位置處將接地接點彼此短路使接地更穩健且有效地縮短接地之電長度，藉此使接地接點之電共振移位至更高頻率。此改良插入損失及串音干擾二者。因此，接地耦合總成46可達成第一電連接器22及連接器總成20之各種效能優點，諸如使共振發生之頻率移位，該頻率可指如下文更詳細描述般發生明顯非所要信號劣化 之一頻率。使明顯所非要插入損失共振移位至更高頻率可容許連接器總成20中具有更便於使用的頻寬。資料傳送速率可增加直到遭遇一共振頻率。在該共振頻率處，串音干擾變得太高(即，對於時域或一可比較時域量測為高於6%)或插入損失對串音干擾比率變得太低且連接器無法正常運作(超出規格或損失資料)。此外，據信可達成使上述共振頻率移位而不實質變更連接器之阻抗分佈。
應注意，該等圖式中展示之實施例之圖解及論述僅係為例示性目的，且不應解釋為限制本發明。熟習此項技術者應明白，本發明預期各種實施例。此外，應瞭解，上文使用上述實施例描述之概念可單獨採用或與上述任何其他實施例之任一實施例組合。應進一步明白，除非另有指示，否則上文關於一經圖解說明之實施例描述之各種替代性實施例可應用於如本文描述之全部實施例。
20‧‧‧電連接器總成
22‧‧‧第一電連接器
24‧‧‧第二電連接器
26‧‧‧第一介面/配接介面
27‧‧‧第一介面/配接介面
28‧‧‧第二介面/安裝介面
29‧‧‧第二介面/安裝介面
30‧‧‧第一連接器外殼
30a‧‧‧前端
30b‧‧‧後端
30c‧‧‧頂端
30d‧‧‧底端
30e‧‧‧相對側
32‧‧‧電接點
32a‧‧‧配接端
32b‧‧‧安裝端
33‧‧‧插座
33a‧‧‧插座
33b‧‧‧插座
34‧‧‧第二連接器外殼
34a‧‧‧前端
34b‧‧‧後端
34c‧‧‧頂端
34d‧‧‧底端
34e‧‧‧相對側
35‧‧‧電接點之列
36‧‧‧基板
37‧‧‧電信號接點
39‧‧‧電接地接點
41‧‧‧差動信號對
42‧‧‧信號接觸墊
43‧‧‧信號導體
44‧‧‧接地接觸墊
45‧‧‧接地導體
46‧‧‧接地耦合總成
47‧‧‧信號跡線/導電信號跡線
48‧‧‧導電跡線
49‧‧‧導電鏈路
50‧‧‧導電接地塊體
51‧‧‧基板本體
51a‧‧‧第一表面/上表面
51b‧‧‧第二表面/下表面
51c‧‧‧第三表面/前表面
51d‧‧‧第四表面/後表面
51e‧‧‧基板本體之相對側
52‧‧‧接地通孔
53‧‧‧導電接地共同構件/接地耦合構件
54‧‧‧導電接地導通體
55‧‧‧差動信號對
56‧‧‧磨損減小墊
57‧‧‧導電接地導通體
58‧‧‧接地跡線
59‧‧‧中線
60‧‧‧行
61‧‧‧導電共同接地跡線
62‧‧‧列
65‧‧‧導電接地導通體/墊
66‧‧‧跡線
A‧‧‧側向方向
L‧‧‧縱向方向
T‧‧‧橫向方向
圖1A係根據一實施例建構之一電連接器總成之一透視圖，該電連接器總成包含第一電連接器及第二電連接器；圖1B至圖1E描繪圖1A中圖解說明之電連接器總成之額外透視圖；圖2A係圖1A中圖解說明之電連接器總成之一部分之一透視圖，該部分包含該第一電連接器及該第二電連接器之印刷電路板；圖2B係圖2A中圖解說明之電連接器總成之一部分(其中移除基板本體之上表面)之一俯視透視圖； 圖2C係圖2A中圖解說明之電連接器總成之印刷電路板之一俯視平面圖；圖2D係圖2A中圖解說明之電連接器總成之一部分之一俯視平面圖；圖3A係圖2A中圖解說明之電連接器總成之該部分之一截面側視圖；及圖3B係一習知電連接器總成之一部分之一截面側視圖。
26‧‧‧第一介面/配接介面
42‧‧‧信號接觸墊
43‧‧‧信號導體
44‧‧‧接地接觸墊
45‧‧‧接地導體
46‧‧‧接地耦合總成
47‧‧‧導電信號跡線
48‧‧‧導電跡線
49‧‧‧導電鏈路
50‧‧‧導電接地塊體
51a‧‧‧第一表面/上表面
51b‧‧‧第二表面/下表面
51c‧‧‧第三表面/前表面
51d‧‧‧第四表面/後表面
51e‧‧‧基板本體之相對側
52‧‧‧接地通孔
53‧‧‧導電接地共同構件/接地耦合構件
54‧‧‧導電接地導通體
55‧‧‧差動信號對
56‧‧‧磨損減小墊
57‧‧‧導電接地導通體
58‧‧‧接地跡線
59‧‧‧中線
60‧‧‧行
62‧‧‧列
65‧‧‧導電接地導通體/墊
66‧‧‧跡線
A‧‧‧側向方向
L‧‧‧縱向方向
T‧‧‧橫向方向

Claims (10)

  1. 一種印刷電路板，其包括：一印刷電路板本體，其界定經組態以沿一配接方向插入一互補電連接器之一插座中之一前表面，在上表面與下表面之間延伸之一後表面，及等距地間隔在該前表面與該後表面之間之一中線；複數個信號導體，其藉由該印刷電路板本體支撐且沿該配接方向呈長形；複數個接地導體，其沿該配接方向呈長形且藉由該印刷電路板本體支撐，該複數個接地導體之至少一者係安置在該等信號導體之相鄰者之間的一位置處，該複數個接地導體及信號導體之各者經組態以與該互補電連接器之各自互補電接地接點及電信號接點配接；及一第一導電跡線，其藉由該印刷電路板本體之該上表面支撐，沿著與該配接方向夾一角度之一方向呈長形，與該上表面之該等接地導體之至少兩者電連通以使該等接地導體之至少兩者彼此電連接，且在該中線與該前表面之間的一位置處接觸該印刷電路板本體之該上表面上之該複數個接地導體，及一第二導電跡線，其藉由在該前表面處之基板本體之該下表面支撐，該第二導電跡線係沿著橫向方向與該第一導電跡線間隔開，與該導電跡線電連通，且在該中線與該前表面之間的一位置處接觸該基板本體之該下表面處之該複數個接地導體。
  2. 如請求項1之印刷電路板，其中該第二導電跡線沿垂直於該配接方向及該第二方向兩者之一第三方向呈長形，該第二方向垂直於該配接方向。
  3. 如請求項1之印刷電路板，其進一步包括一通孔及定位在該通孔內部之一導電接地塊體，該通孔及該導電接地塊體在該第一導電跡線與該第二導電跡線之間延伸。
  4. 如請求項3之印刷電路板，其中該等通孔沿一列方向隔開一中心距離，該中心距離等於沿該列方向之相鄰信號導體與該複數個接地導體之間的中心距離。
  5. 如請求項1之印刷電路板，其中該第二導電跡線沿垂直於該配接方向之一方向呈長形。
  6. 如請求項1之印刷電路板，其中該印刷電路板本體界定沿垂直於該配接方向之一方向彼此隔開之一上表面及一下表面，其中該上表面及該下表面之各者沿該配接方向及一列方向延伸，且該複數個接地導體及該複數個信號導體沿該列方向彼此隔開。
  7. 如請求項1之印刷電路板，其中該第一導電跡線嵌入該上表面與該下表面之間。
  8. 如請求項1之印刷電路板，其中該第一導電跡線及該複數個接地導體彼此成一體。
  9. 如請求項1之印刷電路板，其中相鄰信號導體界定差動信號對，且該複數個接地導體之該至少兩者各安置在相鄰差動信號對之間。
  10. 如請求項1之印刷電路板，其中 該第一導電跡線係在一位置處電接觸該複數個接地導體之至少兩者，該位置係沿自該後表面朝向該前表面之一方向處於該複數個信號導體之前方。
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