CN103999294B - 串扰降低的高速电连接器 - Google Patents
串扰降低的高速电连接器 Download PDFInfo
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
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- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09154—Bevelled, chamferred or tapered edge
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09354—Ground conductor along edge of main surface
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
Abstract
提供了一种包括印刷电路板的电连接器，该印刷电路板包括板体，该板体支承着限定相应接地触垫的多个接地导体和限定相应信号触垫的多个信号导体。所述触垫构造成与互补电连接器的电触头配合。所述印刷电路板包括电连接所述接地导体中的至少一对的接地结合组件。
Description
背景技术
电连接器使用信号触头在电子装置之间进行信号连接。通常，信号触头如此密集以至相邻信号触头之间出现不期望的干扰，或“串扰”。当一个信号触头中的信号导致相邻信号触头中的电干扰时，由于干扰电场而发生串扰，从而影响信号的完整性。串扰也发生在差分信号对之间。串扰通常随着干扰信号触头之间的距离减小而增强。
随着电子装置的持续小型化以及对高速电子通信的期望不断增加，串扰的降低通常是电连接器设计的重要目的。
发明内容
在一个实施例中，印刷电路板包括印刷电路板体、多个信号导体、多个接地导体以及接触并电连接所述接地导体中的至少一对的接地结合组件。
附图说明
图1A是根据一个实施例构造的包括第一和第二电连接器的电连接器组件的透视图；
图1B至图1E示出了图1A中示出的电连接器组件的其它透视图；
图2A是图1A中示出的电连接器组件的包括第一电连接器以及第二电连接器的印刷电路板的部分的透视图；
图2B是图2A中示出的电连接器组件的部分在上表面基板体去除的情况下的顶部透视图；
图2C是图2A示出的电连接器组件的印刷电路板的俯视图；
图2D是图2A示出的电连接器组件的一部分的俯视图；
图3A是图2A示出的电连接器组件的部分的截面侧视图；以及
图3B是传统电连接器组件的一部分的截面侧视图。
具体实施方式
具有差分信号对的现有电连接器，比如串行高级技术附件（SATA）、串行连接小型计算机系统接口（SCSI或SAS），包括mini-SAS HD连接器、CXP连接器、背板和夹层连接器，的电气性能可以通过将接地触头电连接在连接器内而得以改进。本文描述的实施例允许对设计成在较慢的数据传输率下工作的现有连接器进行简单的改造，从而产生插入式兼容的、更高的数据传输速度的连接器，该连接器也符合制定的新标准，如SATA Revision2.6、SAS-2Revision15，以及IEEE802.3ap，其中每一个的公开内容通过引用并入本文，犹如其全部在本文中提出。更具体地说，这里描述的实施例可以改变现有连接器的共振频率来扩展现有的工作频率范围，而不改变现有的标准化或非标准化连接器的配合或安装接口尺寸。换种方式来说，所描述的实施例可以允许修改和/或替换现有的连接器以产生在现有连接器外壳的尺寸的范围内的修改的连接器，使得修改后的连接器以更快的数据传输速率有效地工作（在频域和时域串扰极限内，例如上述标准中提出的对于时域在约40ps下的6％或更少或对于频域在约40ps下的大约-24dB或更低（-26dB）），但仍保持与不能利用新制定标准的参数进行工作的现有连接器插入式兼容。本文描述的实施例构造简单，但对各种标准的现有实施者提供了显著的优势，并为标准的实施者和部件供应商实现了显著的成本节约。
参考图1A-E，根据一个实施例构造的电连接器组件20包括第一电连接器22和互补第二电连接器24，使得第一和第二电连接器22和24构造成彼此配合。如图所示，第一电连接器22可以是构造成便于第一电气装置和第二电气装置之间电通信的包括mini-SAS HD连接器的SAS连接器、SATA连接器、CXP连接器，或包括光学连接器的任何合适的替代电连接器。也就是说，第一电连接器22可限定：第一或配合接口26，其构造成与第二电连接器24配合，从而在第一和第二电连接器22和24之间建立电连接；以及第二或安装接口28，其构造成安装到可以是印刷电路板的如基板等对应的电部件上，从而在第一电连接器22和对应的电部件之间建立电连接。因此，当第一电连接器22与第二电连接器24和对应的电部件充分配合时，第一电连接器22使基板和第二电连接器24彼此电通信。
还参考图2A-D，第一电连接器22包括介电或电绝缘的第一连接器外壳30和由第一连接器外壳30支撑的多个电触头32。第一连接器外壳30限定前端30a和沿纵向L与前端30a隔开的相反的后端30b，顶端30c和沿基本上垂直于纵向L的横向T与顶端30c隔开的相反的底端30d，和沿与横向T和纵向L都垂直的侧向A彼此隔开的相反侧30e。除非本文另有说明，术语“侧向”、“纵向”和“横向”用来描述不同部件的正交方向分量。术语“在…内”和“内部”以及“在…外”和“外面”以及类似术语当关于特定方向分量使用时用来指沿着朝向和背离所描述的设备中心的方向分量的方向。
将从下面的描述了解，前端30a可以限定配合接口26，配合接口26构造成沿可限定配合方向的纵向L与第二电连接器24的配合接口配合，并且底端30d可以限定安装接口28，安装接口28构造成沿可限定安装方向的横向T安装到对应的电部件上。因为配合接口26相对于安装接口28垂直地定向，所以可以将电连接器22称为直角电连接器。可选地，电连接器22可以构造为竖直电连接器，由此配合接口26被定向为平行于安装接口28。
应该了解，虽然纵向和侧向被示出为沿着水平面延伸，横向被示出为沿着竖直面延伸，但是包含各方向的平面在使用中可能有所不同，例如取决于不同部件的定向。因此，方向术语“竖直”和“水平”用来描述如图所示的连接器组件20及其部件，仅为了清楚和方便的目的，应该了解这些定向在使用过程中可能改变。
每一个电触头32限定配合端32a，配合端32a布置成靠近配合接口26并构造成当第一电连接器22配合到第二电连接器24上时与第二电连接器24的互补电触头的配合端配合。每个电触头32还限定构造成安装到对应的电部件上的安装端32b。按照图示实施例，配合端32a沿纵向L定向，安装端32b沿横向T定向。因为配合端32a被定向为垂直于安装端32b，所以可以将电触头32称为直角电触头。可选地，电触头32可以构造为竖直电触头，由此配合端32a被定向为平行于安装端32b。
电触头32可根据需要进行布置。例如，按照图示实施例，电触头32限定至少一行，如电触头32的多个行35，行35在配合接口26处沿着横向T彼此隔开。因此，每行35的电触头32沿行的方向彼此隔开。行35可以在安装接口28处沿纵向L彼此隔开。每行35的电触头32沿侧向A彼此隔开。电连接器22可以在限定在相邻行35之间的配合接口26处沿横向T限定至少一个插口33。
按照图示实施例，配合接口26限定电触头32的两对相邻的行35，使得每对相邻的行35限定对应的插口33a和33b，插口33a和33b沿横向T彼此隔开，并且构造成接纳第二电连接器24的对应的基板或可选构造的配合端，从而使第一电连接器22配合到第二电连接器24上。因此，可以将第一电连接器22称为插口式连接器，其电触头32构造成接纳第二电连接器24的配合端。虽然电连接器22显示为限定第一和第二插口33a和33b，但应该了解电连接器22可以限定任何数量的插口33，例如至少一个插口。每个插口33可沿侧向A伸长，并且构造成沿着纵向配合方向接纳第二电连接器24的配合端。每个插口33由布置在插口33的相对的横向侧上的一对电触头32限定，使得电触头32构造成与第二电连接器24的插入插口33中的基板建立电连接。
至少一个多达所有电触头32可以限定信号触头37，并且例如多个电触头32的至少一个可以限定可布置在相邻信号触头37之间的接地触头39。例如，每行35的沿着侧向A隔开的相邻信号触头37可以限定差分信号对41，并且接地触头39可以沿着行35布置在相邻的差分信号对41之间，或者可以根据需要以其他方式布置。因此，电触头32可以在相应行35中沿着侧向A限定重复的S-S-G模式，G-S-S模式，S-G-S模式，或者可以根据需要限定任何其它模式，其中，“S”标识信号触头37且“G”标识接地触头39。
继续参考图1A-1E，第二电连接器24可包括介电或电绝缘的第二连接器外壳34和由第二连接器外壳34支承的至少一个基板36。第二连接器外壳34可以限定前端34a和沿纵向L与前端34a隔开的后端34b，顶端34c和沿横向T与顶端34c隔开的底端34d，以及沿侧向A彼此隔开的相反侧34e。前端34a和后端34b均可以限定在由侧向A和横向T限定的平面内伸长的相应前表面和后表面。第二电连接器24限定第一或配合接口27，第一或配合接口27可以由第二连接器外壳34的前端34a限定，并且构造成当第一和第二电连接器22和24彼此配合时与第一电连接器22的配合接口26配合。第二电连接器还限定第二或安装接口29，第二或安装接口29构造成安装到对应的电部件上，从而在第二电连接器24和可包括多根缆线的对应的电部件之间建立电连接。因此，第二电连接器24和缆线可以限定缆线组件，该缆线组件构造成与第一电连接器22配合，以使至少一根缆线与第一电连接器22电通信，并且从而当第一电连接器22安装到对应的电部件上时与第一电连接器22所安装的电部件配合。
还参考图2A-2D，电连接器24可包括一对基板36，该对基板由第二连接器外壳34支撑并且沿着横向T彼此隔开。每个基板36可以例如布置成靠近配合接口27，并构造成当第一电连接器22与第二电连接器24配合时插入第一电连接器22的对应一对插口33的相应一个中，从而在基板36和第一电连接器22的一些电触头32之间建立电连接。因此，可以将电连接器24称为插头式连接器，该插头式连接器具有接纳在第一电连接器22的对应插口中的至少一个基板36，以在第一电连接器22的一些电触头32和至少一个基板36之间建立电连接。
至少一个或两个基板36包括相应的介电或非导电基板体51和由基板体51支撑的诸如多个信号导体43的至少一个信号导体43，以及由基板体51支撑的诸如多个接地导体45的至少一个接地导体45。可限定印刷电路板体的基板体51可以限定第一或上表面51a和沿着横向T与上表面51a隔开的第二或下表面51b。上表面51a和下表面51b可以沿着侧向A和纵向L延伸。
每个基板体51还可以限定分别在上表面51a和下表面51b之间沿着侧向A和横向T延伸的第三或前表面51c和第四或后表面51d。应该了解，前表面51c和后表面51d限定基板体51的相应前端和后端，并且参考前表面51c和后表面51d还包括参考前端和后端。前表面51c沿纵向L与后表面51d隔开，并且由相应基板36的相对于插入第一电连接器22的对应插口33中的前导端限定。基板体51中的每一个还可以限定在前表面51c和后表面51d之间等距间隔的中线59。
前表面51c可以构造成沿着向前的纵向插入第一电连接器22的插口33的对应一个中，使得后表面51d布置在对应插口33的沿着纵向L的后方。后表面51d可以构造成由连接器外壳34支撑，使得信号导体43延伸通过连接器外壳34以限定安装接口29。如图所示，纵向L是基板36被插入以便进行配合的方向。因此，可以将纵向L称为配合方向，该配合方向可以是按照图示实施例的插入方向。因此，可以理解，印刷电路板体限定前表面51c，前表面51c构造成沿着配合方向插入互补电连接器22的插口33中，印刷电路板体还限定沿着配合方向与前表面51c相反的后表面51d。
如上所述，每个基板36可包括由基板体51支撑的多个电信号导体43，每个信号导体43可以包括信号触垫42以及与信号触垫42和安装接口29电通信的至少一个导电信号迹线47。例如，信号迹线47可以与触垫42成单体。每个信号导体43可以在纵向L上沿着对应基板体51伸长。例如，每个信号导体43的至少一部分可以沿着上表面51a和下表面51b中的一个延伸，或者可以在上表面51a和下表面51b之间嵌入基板体51中。按照图示实施例，信号触垫42由上表面51a和下表面51b的相应一个支承，并且信号迹线47可以同样由上表面51a和下表面51b的相应一个支承，或者在上表面51a和下表面51b之间嵌入基板体51中。当基板36插入第一电连接器的插口33中时，由上表面51a支承的信号触垫42构造成接触行35的其中一行（例如限定插口33的一对行的上部行）的信号电触头37。类似地，当基板36插入第一电连接器22的插口33中时，由下表面51b支承的信号触垫42构造成接触另一行（例如限定插口33的行35的下部行）的信号电触头37。基板体51还可以包含沿纵向L与信号触垫42的相应一些对齐的诸如多个减少磨损垫56的至少一个减少磨损垫56。减少磨损垫66可以布置在相应信号触垫42与导电迹线48之间。
进一步如上文所述，每个基板36可包括由基板体51支撑的多个电接地导体45。基板36的至少一个或两个还支撑多个接地导体45，多个接地导体45均可以包括接地触垫44和与触垫44电通信的导电迹线48。例如，导电迹线48可以与接地导体45和触垫44成单体。每个接地导体45可以在纵向L上沿着对应基板体51延伸。例如，每个接地导体45的至少一部分可以沿着上表面51a和下表面51b中的一个延伸，或者可以在上表面51a和下表面51b之间嵌入基板体51中。按照图示实施例，接地触垫44由上表面51a和下表面51b的相应一个支承，并且导电迹线48可以同样由上表面51a和下表面51b的相应一个支承，或者在上表面51a和下表面51b之间嵌入基板体51中。当基板36插入第一电连接器的插口33中时，由上表面51a支承的接地触垫44构造成接触行35的其中一行（例如限定插口33的一对行的上部行）的接地电触头39。类似地，当基板36插入第一电连接器22的插口33中时，由下表面51b支承的接地触垫44构造成接触另一行（例如限定插口33的行35的下部行）的接地电触头39。因此，可以理解，接地导体45和信号导体43构造成与互补的第一电连接器22的相应的互补接地电触头和信号电触头配合。
接地导体45可以设置在相邻信号导体43之间并在纵向L上在前表面51c和后表面51d之间沿着对应基板体51伸长。信号导体43和接地导体45可以彼此隔开并沿可以限定行方向的侧向A布置。虽然信号触垫42和接地触垫44可以沿着行方向彼此对齐（如图2A-2D所示），但是信号触垫42和接地触垫44还可以沿着纵向L彼此偏移（并因此沿着侧向A不对齐）。因此，可以理解，印刷电路板体限定沿着垂直于配合方向的方向彼此隔开的上表面51a和下表面51b，上表面51a和下表面51b中的每一个沿着配合方向和行方向延伸，并且接地导体45和信号导体43沿着行方向彼此隔开。还可以理解，前表面51c和后表面51d中的每一个均沿着行方向延伸。
当第一电连接器22和第二电连接器24彼此充分配合时，第二电连接器24中的每一个基板36沿着纵向L插入第一电连接器22的插口33中的深度对于信号触垫42而言足以接触第一电连接器22的信号电触头37的配合端32a而与互补信号电触头37配合。类似地，当第一电连接器22和第二电连接器24彼此充分配合时，第二电连接器24中的每一个基板36沿着纵向L插入第一电连接器22的插口33中的深度对于接地触垫44而言足以接触第一电连接器22的接地电触头39的配合端32a而与互补接地电触头39配合。因此，沿着侧向A的相邻信号导体43可以限定差分信号对55，并且接地导体45可以布置在差分信号对55的相邻的相应一个之间，例如布置在相邻的差分信号对之间，或者可以根据需要以其它方式布置。因此，信号导体43和接地导体45可限定重复的S-S-G模式、G-S-S模式、S-G-S模式，或者根据需要沿着侧向A的任意其它模式，其中“S”标示信号导体43，“G”标示接地导体45。
继续参考图2A-2D，多达所有基板36的至少一个基板可以包括接地结合组件46，其构造成电连接至少两个接地导体45同时相对于信号导体43保持电绝缘，使得诸如单独的基板体51或者与空气组合的介电材料将所有接地结合组件46与所有信号导体43分离。根据一个实施例，接地结合组件46可以被设置作为一个或多个导电接地共用构件53，其使至少两个或多达所有的接地触垫44彼此电通信。示例性接地共用构件53包括导电接地迹线，一些或所有的导电接地迹线可以彼此连接或彼此成单体，以限定电共用接地迹线61和导电接地导通孔57，导电接地导通孔57均可以由接地导通孔52和设置在接地导通孔52内部并沿横向T或沿使上表面51a和下表面51b彼此分离的方向沿着接地导通孔52的整个长度延伸的导电接地块50限定。例如，接地导通孔52可在上表面51a和下表面51b之间延伸。例如，至少一个或多达所有的接地导通孔52可从上表面51a延伸到下表面51b。可选地或者另外，至少一个或多达所有的接地导通孔52可从上表面51a朝下表面51b延伸，并且在上表面51a和下表面51b之间终止。可选地或者另外，至少一个或多达所有的接地导通孔52可从下表面51b朝上表面51a延伸，并且在上表面51a和下表面51b之间终止。可选地或者另外，至少一个或多达所有的接地导通孔52可从都布置在上表面51a和下表面51b之间的相对终端延伸。因此，可以说，接地导通孔52可至少部分地延伸通过基板体51，例如部分或完全通过基板体51或部分通过基板体51。
至少一个或多达所有的接地结合构件53可以与沿行方向彼此隔开的至少两个或多个、多达所有的接地导体45电接触。例如，至少一个或多达所有的接地结合构件53可以与至少两个或多个、多达所有的接地导体45的每一个在中线59和前表面51c之间的位置处接触。按照图示实施例，导电共用接地迹线61与两个或多个、多达所有的接地导体45在中线59和前表面51c之间的位置处接触。可选地或者另外，一个或多个导电导通孔57可以与两个或多个、多达所有的接地导体45在中线59和前表面51c之间的位置处接触。
如上所述，接地共用构件53可以包括导电接地迹线，一些或所有的导电接地迹线可以彼此连接或彼此成单体，以限定导电共用接地迹线61和导电接地导通孔57。例如，导电共用接地迹线61可以包括沿侧向A在基板体51的相对侧51e之间延伸的至少一个导电迹线48以及在导电迹线48的至少选择的一个与单独的一些接地导体45之间延伸的多个导电连接部49，例如在接地触垫44处，从而电连接单个接地触垫44、单个连接部49和导电迹线48。例如，选择的导电迹线48可以沿着基板体51的上表面51a布置，并且选择的导电迹线48还可以沿着基板体51的下表面51b设置。因此，连接部49可以例如在接地触垫44处、在中线59与基板体51的前表面51c之间的位置处与接地导体45接触。应该了解，例如当选择的导电迹线48例如在中线59和基板体51的前表面51c之间的位置处与接地导体45接触时，导电接地迹线61可以根据需要被构造，并且可以没有连接部49。按照图示实施例，连接部49将导电迹线48向前朝基板体51的前表面51c相对于接地触垫44隔开。根据示例性实施例，导电共用接地迹线61可以与由基板体51支承的一对接地导体45多达所有的接地导体45电连接。接地导体45和导电共用接地迹线61还可以是一体的和彼此成单体。
根据图2A-2D所示的实施例，导电迹线48以及因此导电共用接地迹线61被连接在至少一对多达所有的接地导体45之间。至少一部分多达所有的导电共用接地迹线61可以沿着上表面51a延伸，可以可选地或者另外沿着下表面51b沿着，并且可以可选地或者另外在上表面51a和下表面51b之间的位置处嵌入基板体51中。选择的导电迹线48并且多达所有的导电迹线48可以沿侧向A在向前与信号导体43隔开的位置处大致延伸穿过基板体51，并因此位于信号导体43和前表面51之间。因此，导电共用接地迹线61使与导电共用接地迹线61电通信的接地导体45彼此电通信。因此，可以理解，接地结合组件46在信号导体43的前方的位置处沿着从后表面51d朝前表面51c的方向与接地导体中的至少两个电接触。
继续参考图2A-2D，接地结合组件46可以包括诸如多个导电接地块50的至少一个导电接地块，其在与导电迹线48对齐的位置处沿横向T延伸到基板体51中或延伸通过基板体51。导电共用接地迹线61和导电接地块50可以根据需要由任何期望的导电材料构成。例如，导电共用接地迹线61的至少一部分可以沿基板体51的第一表面延伸，所述第一表面可以是按照图示实施例的上表面51a，并且接地结合组件46还可以包括诸如朝沿横向T与第一表面隔开的第二表面延伸的多个接地导通孔52的至少一个这样的接地导通孔52。例如，导电共用接地迹线61可以包括由基板体51支承的多个导电迹线48。例如，其中一个导电迹线48可以沿上表面51a、下表面51b延伸，和/或在上表面51a和下表面51b之间延伸。因此，第二表面可以是按照图示实施例的下表面51b。因此，还应该了解，第一表面可以是下表面51b，并且第二表面可以是上表面51a。因此，可以理解，导电共用接地迹线61可包含第一导电迹线48和沿与配合方向垂直的方向与第一导电迹线隔开的第二导电迹线48，第二导电迹线48与第一导电迹线48电通信并且沿与配合方向垂直的方向伸长。还可以理解，第一和第二导电迹线48沿与配合方向和第二方向都垂直的第三方向伸长，并且第二方向垂直于配合方向。
接地块50可以设置在接地导通孔52的对应一个中以形成导电接地导通孔7，使得接地块50与两个或多达所有的导电迹线48接触和电通信。因此，接地块50与至少两个或多达所有的接地导体45电通信。此外，接地块50和导通孔52可以与导电迹线48对齐，并因此与导电共用接地迹线61对齐，使得导电迹线48或导电共用接地迹线61的可选部分（例如连接部49）覆盖和接触接地块50（参见图2B）。可选地，接地块和导通孔可以延伸通过导电迹线48、导电共用接地迹线61，使得导电迹线48或导电共用接地迹线61的可选位置（例如连接部49）接触接地块50。
按照图示实施例，接地块50可以沿顺着侧向A的与侧向A上的相邻触垫（包括信号触垫42和接地触垫44）之间的中心距大致相等的中心距隔开。因此，可以理解，导通孔57隔开沿着行方向的与相邻信号导体43和接地导体45之间沿行方向的距离相等的中心距。
如上所述，接地结合组件46可以包括沿着上表面51a延伸的至少一个导电共用接地迹线61，并且还可以包括沿着上表面51a、在上表面51a和下表面51b之间以及沿着下表面51b延伸的导电迹线48。接地结合组件46中的导电迹线48的每一个可以在基板36的上表面51a和下表面51b之间沿着横向T以列隔开。另外，导电迹线48的每一个可以在除了纵向L和侧向A的一个或两个之外还包括横向T的方向上在基板36的上表面51a和下表面51b之间隔开。至少一个接地块50可以在接地结合组件46的导电迹线48的两个或多个之间延伸，以使至少一对或多达所有接地导体45的每个接地迹线彼此电通信。因此，可以理解，导通孔和设置在导通孔内的导电接地块在第一导电迹线48与第二导电迹线48之间延伸。
继续参考图2A-2D，除了导电接地导通孔57之外，基板36还可包括延伸通过基板36的另外的导电接地导通孔54和65，并且可以布置在沿着纵向L定向的列60中或沿着侧向A定向的行62中。上述关于导电接地导通孔57描述的导电接地导通孔54和65均可以由接地导通孔和设置在接地导通孔内的导电接地块限定。导电接地导通孔65与导电接地导通孔54类似，并且还包括利用迹线66电结合到接地触垫44上的较大的垫65。导电导通孔54和65的列60可以与导电接地导通孔57的相应一个对齐。导电导通孔54和65的列60可以设置在相邻信号迹线47之间，例如相邻差分信号对55之间。另外的导电导通孔54和65可以利用例如至少一个接地迹线58电连接在一起。接地迹线58可以电连接至少一对或多达所有的导电导通孔54和65，并且沿着纵向L和/或侧向A在表面51a和51b之间或表面51a或51b的一个或两个上延伸。例如，一个或多个导电迹线58还可以连接到一个或多个、多达所有的导电接地导通孔54和65上。例如，一个或多个接地迹线58可以连接到单独相应列60的或与行62组合的导电接地导通孔54和65上。此外，单个接地迹线58可以在沿着侧向A的选择区域处附连到导电迹线48上。
现在参考图3A-B，如上所述，当第一电连接器22和第二电连接器24彼此充分配合时，每一个基板36插入第一电连接器22的相应一个插口33中的插入深度对于信号触垫42而言足以与第一电连接器22的信号电触头37配合，并且对接地触垫44而言足以与第一电连接器的接地电触头39配合。例如，信号触垫42接触信号电触头37的互补部分的配合端32a，并且接地触垫44接触接地电触头39的互补部分的配合端32a。如图3A所示，当电连接器22和24充分配合时，基板36的接地结合组件46限定插入深度ID，插入深度ID被从触垫42和44的与电触头32的相应配合端32a接触的位置到基板体51的前表面51c沿纵向L测量。因此，插入深度ID还可以由配合端32a和基板体51的前表面51c之间沿着纵向L的距离限定。插入深度ID可大于图3B所示类型的不包括接地结合组件46的传统基板的插入深度。根据一个实施例，插入深度ID可比传统基板的插入深度大（例如大0.8mm），以便为相对于信号触垫42在纵向上靠前设置的接地块50和导电迹线48提供间隙。
此外，如图所示，第一电连接器22不包括任何金属屏蔽体，但是应该了解，除非另有规定，第一电连接器22可以包括一个或多个金属屏蔽体，其可以被提供例如作为需要时基本上覆盖信号触头37的整个长度的金属串扰板。因此，除非另有说明，第一电连接器22可以是无屏蔽连接器（即，在没有金属串扰板的情况下工作的连接器）。
在不受理论限制的情况下，可以相信，在多个位置处使接地触头彼此短路使得接地更稳固并有效地缩短接地的电长度，由此将接地触头的电共振改变到较高频率。这改善了插入损耗和串扰。因此，接地结合组件46可以为第一电连接器22和连接器组件20实现各种性能优势，例如改变共振会出现的频率，其可以涉及如下面更详细描述的显著的不需要的信号衰减出现的频率。将显著的不需要的插入损耗共振改变到较高频率可以允许连接器组件20中更多的可用带宽。数据传输率可以增加，直到遇到共振频率。在共振频率下，串扰变得太高（即，对于时域百分之六以上或相当的时域测量）或者插入损耗与串扰比变得太低，并且连接器不再可接受地起作用（在规范或数据损耗之外）。此外，可以相信，可以在基本上不改变连接器的阻抗剖面的情况下改变上述共振频率。
应该注意，对附图中示出的实施例的图示和讨论仅用于示范目的，并且不应解释为限制本公开。本领域内的技术人员将了解本公开设想各种各样的实施例。另外，应该理解，关于上述实施例描述的概念可以单独或与上述其它实施例中的任一个结合使用。还应该了解，除非特别指出，在上面关于一个图示实施例所描述的各种可选实施例可适用于这里描述的所有实施例。
Claims (10)
1.一种印刷电路板，包括：
印刷电路板体，其限定构造成沿着配合方向插入互补电连接器的插口中的前表面、在上表面和下表面之间延伸的后表面、以及在前表面和后表面之间等距间隔的中线；
多个信号导体，其由所述印刷电路板体支撑并且沿着所述配合方向伸长；
多个接地导体，其沿着所述配合方向伸长并且由所述印刷电路板体支撑，所述多个接地导体中的至少一个设置在所述信号导体的相邻信号导体之间的位置处，所述多个接地导体和信号导体中的每一个构造成与所述互补电连接器的相应的互补接地电触头和信号电触头配合；
第一导电迹线，其由所述印刷电路板体的上表面支撑，沿着相对于配合方向成角度的方向伸长，在上表面与所述接地导体中的至少两个电通信从而将所述接地导体中的所述至少两个彼此电连接，并且在印刷电路板的上表面在所述中线和所述前表面之间的位置处接触所述多个接地导体；以及
第二导电迹线，其由所述印刷电路板体的下表面支撑，所述第二导电迹线沿垂直于上表面的横向方向与所述第一导电迹线隔开，与第一导电迹线电通信，并且在印刷电路板体的下表面在所述中线和所述前表面之间的位置处接触所述多个接地导体。
2.根据权利要求1所述的印刷电路板，其中，所述第二导电迹线沿着与所述配合方向和所述横向方向都垂直的第三方向伸长。
3.根据权利要求1所述的印刷电路板，还包括导通孔和设置在所述导通孔内侧的导电接地块，所述导通孔和所述导电接地块在所述第一导电迹线和所述第二导电迹线之间延伸。
4.根据权利要求3所述的印刷电路板，其中，所述导通孔被沿着行方向间隔开与相邻信号导体和所述多个接地导体之间沿行方向的距离相等的中心距。
5.根据权利要求1所述的印刷电路板，其中，所述第二导电迹线沿着与所述配合方向垂直的方向伸长。
6.根据权利要求1所述的印刷电路板，其中，所述印刷电路板体限定沿着垂直于所述配合方向的方向彼此隔开的上表面和下表面，所述上表面和所述下表面中的每一个沿着所述配合方向和行方向延伸，并且所述多个接地导体和所述多个信号导体沿着所述行方向彼此隔开。
7.根据权利要求1所述的印刷电路板，其中，所述第一导电迹线被嵌在所述上表面和所述下表面之间。
8.根据权利要求1所述的印刷电路板，其中，所述第一导电迹线和所述多个接地导体是一体的和彼此成单体。
9.根据权利要求1所述的印刷电路板，其中，相邻的信号导体限定差分信号对，所述多个接地导体中的所述至少两个分别布置在相邻的差分信号对之间。
10.根据权利要求1所述的印刷电路板，其中，所述第一导电迹线在沿着从后表面朝前表面的方向位于所述多个信号导体的前方位置处与所述多个接地导体中的至少两个电接触。
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161547288P | 2011-10-14 | 2011-10-14 | |
| US61/547,288 | 2011-10-14 | ||
| US13/644,092 US9277649B2 (en) | 2009-02-26 | 2012-10-03 | Cross talk reduction for high-speed electrical connectors |
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| Publication Number | Publication Date |
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| CN103999294A CN103999294A (zh) | 2014-08-20 |
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| Country | Link |
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| US (1) | US9277649B2 (zh) |
| EP (1) | EP2766955A4 (zh) |
| CN (1) | CN103999294B (zh) |
| SG (1) | SG11201400575RA (zh) |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201324960A (zh) | 2013-06-16 |
| WO2013055567A3 (en) | 2013-07-11 |
| CN103999294A (zh) | 2014-08-20 |
| EP2766955A2 (en) | 2014-08-20 |
| TWI566478B (zh) | 2017-01-11 |
| SG11201400575RA (en) | 2014-09-26 |
| US20130092429A1 (en) | 2013-04-18 |
| EP2766955A4 (en) | 2015-07-08 |
| US9277649B2 (en) | 2016-03-01 |
| WO2013055567A2 (en) | 2013-04-18 |
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