TWI492676B - 基座基板之製造方法、電子裝置之製造方法、基座基板及電子機器 - Google Patents
基座基板之製造方法、電子裝置之製造方法、基座基板及電子機器 Download PDFInfo
- Publication number
- TWI492676B TWI492676B TW102123368A TW102123368A TWI492676B TW I492676 B TWI492676 B TW I492676B TW 102123368 A TW102123368 A TW 102123368A TW 102123368 A TW102123368 A TW 102123368A TW I492676 B TWI492676 B TW I492676B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal layer
- film
- base substrate
- electronic device
- layer
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 146
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 191
- 239000002184 metal Substances 0.000 claims description 191
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 58
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 49
- 239000012212 insulator Substances 0.000 claims description 44
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 31
- 229910052796 boron Inorganic materials 0.000 claims description 31
- 229910052763 palladium Inorganic materials 0.000 claims description 29
- 229910052759 nickel Inorganic materials 0.000 claims description 24
- 238000005245 sintering Methods 0.000 claims description 22
- 239000010931 gold Substances 0.000 claims description 21
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 19
- 229910052737 gold Inorganic materials 0.000 claims description 19
- 238000002844 melting Methods 0.000 claims description 18
- 230000008018 melting Effects 0.000 claims description 16
- 229910052721 tungsten Inorganic materials 0.000 claims description 16
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 15
- 239000010937 tungsten Substances 0.000 claims description 15
- 229910052750 molybdenum Inorganic materials 0.000 claims description 14
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 239000011733 molybdenum Substances 0.000 claims description 13
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 description 32
- 229910000679 solder Inorganic materials 0.000 description 24
- 239000000463 material Substances 0.000 description 19
- 238000003466 welding Methods 0.000 description 19
- 229910000521 B alloy Inorganic materials 0.000 description 18
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 17
- 230000006870 function Effects 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 10
- 229910001096 P alloy Inorganic materials 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 8
- 238000007772 electroless plating Methods 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 230000005284 excitation Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000470 constituent Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000011651 chromium Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- LJWWWIOEQCNHBE-UHFFFAOYSA-N C(C1C2)C3C1C2CC3 Chemical compound C(C1C2)C3C1C2CC3 LJWWWIOEQCNHBE-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0504—Holders or supports for bulk acoustic wave devices
- H03H9/0509—Holders or supports for bulk acoustic wave devices consisting of adhesive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012148512A JP6024242B2 (ja) | 2012-07-02 | 2012-07-02 | 電子デバイスの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201404251A TW201404251A (zh) | 2014-01-16 |
| TWI492676B true TWI492676B (zh) | 2015-07-11 |
Family
ID=49777928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102123368A TWI492676B (zh) | 2012-07-02 | 2013-06-28 | 基座基板之製造方法、電子裝置之製造方法、基座基板及電子機器 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9549481B2 (enExample) |
| JP (1) | JP6024242B2 (enExample) |
| CN (1) | CN103524149B (enExample) |
| TW (1) | TWI492676B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014013795A (ja) * | 2012-07-03 | 2014-01-23 | Seiko Epson Corp | ベース基板、電子デバイスおよび電子機器 |
| US10109669B2 (en) * | 2014-12-18 | 2018-10-23 | Sony Corporation | Solid-state imaging device and electronic apparatus |
| WO2017022504A1 (ja) * | 2015-07-31 | 2017-02-09 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| CH712475A2 (fr) * | 2016-05-19 | 2017-11-30 | Swatch Group Res & Dev Ltd | Procédé de fabrication d'une pièce pour l'horlogerie dotée d'un élément d'habillage creux ou en relief. |
| JP6772574B2 (ja) * | 2016-06-16 | 2020-10-21 | 株式会社村田製作所 | 圧電振動子及びその製造方法 |
| JP2019047309A (ja) | 2017-09-01 | 2019-03-22 | 株式会社村田製作所 | 圧電振動子 |
| CN111362715A (zh) * | 2020-03-16 | 2020-07-03 | 研创科技（惠州）有限公司 | 一种基于纳米金属的封装方法 |
| JP2020150554A (ja) * | 2020-05-29 | 2020-09-17 | 株式会社村田製作所 | 圧電振動子及びその製造方法 |
| WO2022102444A1 (ja) * | 2020-11-10 | 2022-05-19 | 株式会社村田製作所 | 電子部品モジュール、および、電子部品モジュールの製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200952048A (en) * | 2008-01-23 | 2009-12-16 | Seiko Epson Corp | Method of forming bonded body and bonded body |
| TW201139315A (en) * | 2010-03-19 | 2011-11-16 | Seiko Instr Inc | Glass substrate bonding method, glass assembly, package manufacturing method, package, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0645283A (ja) | 1992-07-27 | 1994-02-18 | Nec Corp | 半導体装置の製造方法 |
| JP3323871B2 (ja) | 1993-03-15 | 2002-09-09 | 株式会社東芝 | 半導体素子の製造方法 |
| JPH10270831A (ja) * | 1997-03-27 | 1998-10-09 | Hitachi Ltd | セラミック配線板のめっき方法 |
| JP3466452B2 (ja) * | 1997-12-24 | 2003-11-10 | 京セラ株式会社 | 配線基板の製造方法 |
| DE10120517B4 (de) | 2001-04-26 | 2013-06-06 | Epcos Ag | Elektrischer Vielschicht-Kaltleiter und Verfahren zu dessen Herstellung |
| JP2003152145A (ja) | 2001-08-31 | 2003-05-23 | Sumitomo Electric Ind Ltd | 半導体放熱用基板とその製造方法及びパッケージ |
| JP2003155575A (ja) | 2001-11-16 | 2003-05-30 | Ngk Insulators Ltd | 複合材料及びその製造方法 |
| JP2003297158A (ja) | 2002-04-01 | 2003-10-17 | Canon Inc | グリッド電極を有する透明導電膜及びその製造方法 |
| JP2004127953A (ja) * | 2002-07-29 | 2004-04-22 | Kyocera Corp | 配線基板 |
| JP2004200644A (ja) * | 2002-10-22 | 2004-07-15 | Kyocera Corp | 配線基板 |
| JP2005022956A (ja) * | 2003-07-02 | 2005-01-27 | Rohm & Haas Electronic Materials Llc | セラミックの金属化 |
| JP2005252121A (ja) | 2004-03-08 | 2005-09-15 | Sumitomo Metal Electronics Devices Inc | 半導体素子収納用パッケージ及びその製造方法 |
| US7293359B2 (en) * | 2004-04-29 | 2007-11-13 | Hewlett-Packard Development Company, L.P. | Method for manufacturing a fluid ejection device |
| JP2006086480A (ja) | 2004-09-17 | 2006-03-30 | Ngk Spark Plug Co Ltd | セラミック配線基板及びその製造方法 |
| JP4817043B2 (ja) | 2005-08-30 | 2011-11-16 | 日立金属株式会社 | セラミクス基板およびセラミクス基板を用いた電子部品とセラミクス基板の製造方法 |
| US9634412B2 (en) * | 2011-07-15 | 2017-04-25 | Tessera, Inc. | Connector structures and methods |
-
2012
- 2012-07-02 JP JP2012148512A patent/JP6024242B2/ja not_active Expired - Fee Related
-
2013
- 2013-06-20 US US13/922,622 patent/US9549481B2/en not_active Expired - Fee Related
- 2013-06-20 CN CN201310246968.8A patent/CN103524149B/zh not_active Expired - Fee Related
- 2013-06-28 TW TW102123368A patent/TWI492676B/zh not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200952048A (en) * | 2008-01-23 | 2009-12-16 | Seiko Epson Corp | Method of forming bonded body and bonded body |
| TW201139315A (en) * | 2010-03-19 | 2011-11-16 | Seiko Instr Inc | Glass substrate bonding method, glass assembly, package manufacturing method, package, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6024242B2 (ja) | 2016-11-09 |
| US9549481B2 (en) | 2017-01-17 |
| JP2014011383A (ja) | 2014-01-20 |
| CN103524149A (zh) | 2014-01-22 |
| US20140003004A1 (en) | 2014-01-02 |
| CN103524149B (zh) | 2016-12-28 |
| TW201404251A (zh) | 2014-01-16 |
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