TWI430450B - 設有半導體元件的顯示裝置和其製造方法、及安裝有設有半導體元件的顯示裝置之電子裝置 - Google Patents
設有半導體元件的顯示裝置和其製造方法、及安裝有設有半導體元件的顯示裝置之電子裝置 Download PDFInfo
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- TWI430450B TWI430450B TW094126595A TW94126595A TWI430450B TW I430450 B TWI430450 B TW I430450B TW 094126595 A TW094126595 A TW 094126595A TW 94126595 A TW94126595 A TW 94126595A TW I430450 B TWI430450 B TW I430450B
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0316—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6732—Bottom-gate only TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6745—Polycrystalline or microcrystalline silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
- H10D86/0223—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials
- H10D86/0229—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials characterised by control of the annealing or irradiation parameters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0241—Manufacture or treatment of multiple TFTs using liquid deposition, e.g. printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
- H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/136295—Materials; Compositions; Manufacture processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/80—Constructional details
- H10K10/82—Electrodes
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004241119A JP4628040B2 (ja) | 2004-08-20 | 2004-08-20 | 半導体素子を備えた表示装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200618306A TW200618306A (en) | 2006-06-01 |
| TWI430450B true TWI430450B (zh) | 2014-03-11 |
Family
ID=35908810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094126595A TWI430450B (zh) | 2004-08-20 | 2005-08-04 | 設有半導體元件的顯示裝置和其製造方法、及安裝有設有半導體元件的顯示裝置之電子裝置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7759735B2 (enExample) |
| JP (1) | JP4628040B2 (enExample) |
| KR (1) | KR101191279B1 (enExample) |
| CN (1) | CN1755943B (enExample) |
| TW (1) | TWI430450B (enExample) |
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| US20020182237A1 (en) * | 2001-03-22 | 2002-12-05 | The Procter & Gamble Company | Skin care compositions containing a sugar amine |
| US7977253B2 (en) * | 2004-08-31 | 2011-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| US7622338B2 (en) | 2004-08-31 | 2009-11-24 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US7470604B2 (en) * | 2004-10-08 | 2008-12-30 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device |
| US7537976B2 (en) * | 2005-05-20 | 2009-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of thin film transistor |
| US8138075B1 (en) | 2006-02-06 | 2012-03-20 | Eberlein Dietmar C | Systems and methods for the manufacture of flat panel devices |
| EP2034520B1 (en) * | 2006-06-08 | 2013-04-03 | International Business Machines Corporation | Highly heat conductive, flexible sheet |
| JP4565573B2 (ja) * | 2006-09-07 | 2010-10-20 | 株式会社フューチャービジョン | 液晶表示パネルの製造方法 |
| JP5181587B2 (ja) * | 2006-09-29 | 2013-04-10 | 大日本印刷株式会社 | 有機半導体素子およびその製造方法、有機トランジスタアレイ、およびディスプレイ |
| KR101485926B1 (ko) * | 2007-02-02 | 2015-02-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 기억장치 |
| KR20160040319A (ko) * | 2007-10-01 | 2016-04-12 | 씬 필름 일렉트로닉스 에이에스에이 | 전기 활성 디바이스 및 그 제조 방법 |
| US20090090915A1 (en) | 2007-10-05 | 2009-04-09 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor, display device having thin film transistor, and method for manufacturing the same |
| JP2009119395A (ja) * | 2007-11-16 | 2009-06-04 | Dainippon Screen Mfg Co Ltd | 塗布システムおよび塗布方法 |
| TWI508282B (zh) * | 2008-08-08 | 2015-11-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
| JP5651961B2 (ja) * | 2010-02-03 | 2015-01-14 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法、ならびに電子機器 |
| JP5771417B2 (ja) * | 2010-03-26 | 2015-08-26 | 株式会社半導体エネルギー研究所 | リチウム二次電池の電極の作製方法及びリチウムイオンキャパシタの電極の作製方法 |
| US9437454B2 (en) * | 2010-06-29 | 2016-09-06 | Semiconductor Energy Laboratory Co., Ltd. | Wiring board, semiconductor device, and manufacturing methods thereof |
| CN103299431B (zh) * | 2011-01-13 | 2016-06-15 | 夏普株式会社 | 半导体装置 |
| KR101835005B1 (ko) * | 2011-04-08 | 2018-03-07 | 삼성전자주식회사 | 반도체소자 및 그 제조방법 |
| KR101947166B1 (ko) * | 2012-11-19 | 2019-02-13 | 삼성디스플레이 주식회사 | 기판 및 상기 기판을 포함하는 표시장치 |
| US9425090B2 (en) * | 2014-09-19 | 2016-08-23 | Infineon Technologies Austria Ag | Method of electrodepositing gold on a copper seed layer to form a gold metallization structure |
| CN104409509A (zh) * | 2014-10-20 | 2015-03-11 | 深圳市华星光电技术有限公司 | 薄膜晶体管 |
| TW202129783A (zh) * | 2016-08-24 | 2021-08-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
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| JPS62247569A (ja) * | 1986-04-18 | 1987-10-28 | Matsushita Electric Ind Co Ltd | 半導体装置 |
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| JP3774638B2 (ja) | 2001-04-24 | 2006-05-17 | ハリマ化成株式会社 | インクジェット印刷法を利用する回路パターンの形成方法 |
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| JP2003080694A (ja) | 2001-06-26 | 2003-03-19 | Seiko Epson Corp | 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体 |
| EP1416069B1 (en) | 2001-08-09 | 2010-10-27 | Asahi Kasei Kabushiki Kaisha | Organic semiconductor film and method for manufacture thereof |
| JP2003133691A (ja) * | 2001-10-22 | 2003-05-09 | Seiko Epson Corp | 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体 |
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| JP2003317945A (ja) | 2002-04-19 | 2003-11-07 | Seiko Epson Corp | デバイスの製造方法、デバイス、及び電子機器 |
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| JP2003318401A (ja) | 2002-04-22 | 2003-11-07 | Seiko Epson Corp | デバイスの製造方法、デバイス、表示装置、および電子機器 |
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| KR100938885B1 (ko) * | 2003-06-30 | 2010-01-27 | 엘지디스플레이 주식회사 | 액정표시장치용 어레이기판과 제조방법 |
| JP4586345B2 (ja) * | 2003-09-17 | 2010-11-24 | ソニー株式会社 | 電界効果型トランジスタ |
| WO2005048222A1 (en) | 2003-11-14 | 2005-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting display device, method for manufacturing the same, and tv set |
| CN1890698B (zh) | 2003-12-02 | 2011-07-13 | 株式会社半导体能源研究所 | 显示器件及其制造方法和电视装置 |
-
2004
- 2004-08-20 JP JP2004241119A patent/JP4628040B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-03 US US11/195,768 patent/US7759735B2/en not_active Expired - Fee Related
- 2005-08-04 TW TW094126595A patent/TWI430450B/zh not_active IP Right Cessation
- 2005-08-17 KR KR1020050075157A patent/KR101191279B1/ko not_active Expired - Fee Related
- 2005-08-19 CN CN2005100920813A patent/CN1755943B/zh not_active Expired - Fee Related
-
2010
- 2010-07-12 US US12/834,048 patent/US8003420B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US8003420B2 (en) | 2011-08-23 |
| US7759735B2 (en) | 2010-07-20 |
| US20100279449A1 (en) | 2010-11-04 |
| KR101191279B1 (ko) | 2012-10-16 |
| CN1755943A (zh) | 2006-04-05 |
| TW200618306A (en) | 2006-06-01 |
| US20060038174A1 (en) | 2006-02-23 |
| JP2006060060A (ja) | 2006-03-02 |
| JP4628040B2 (ja) | 2011-02-09 |
| CN1755943B (zh) | 2010-05-12 |
| KR20060050514A (ko) | 2006-05-19 |
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