JP4628040B2 - 半導体素子を備えた表示装置の製造方法 - Google Patents
半導体素子を備えた表示装置の製造方法 Download PDFInfo
- Publication number
- JP4628040B2 JP4628040B2 JP2004241119A JP2004241119A JP4628040B2 JP 4628040 B2 JP4628040 B2 JP 4628040B2 JP 2004241119 A JP2004241119 A JP 2004241119A JP 2004241119 A JP2004241119 A JP 2004241119A JP 4628040 B2 JP4628040 B2 JP 4628040B2
- Authority
- JP
- Japan
- Prior art keywords
- organic solvent
- region
- semiconductor
- source
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0316—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6732—Bottom-gate only TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6745—Polycrystalline or microcrystalline silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
- H10D86/0223—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials
- H10D86/0229—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials characterised by control of the annealing or irradiation parameters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0241—Manufacture or treatment of multiple TFTs using liquid deposition, e.g. printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
- H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/136295—Materials; Compositions; Manufacture processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/80—Constructional details
- H10K10/82—Electrodes
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004241119A JP4628040B2 (ja) | 2004-08-20 | 2004-08-20 | 半導体素子を備えた表示装置の製造方法 |
| US11/195,768 US7759735B2 (en) | 2004-08-20 | 2005-08-03 | Display device provided with semiconductor element and manufacturing method thereof, and electronic device installed with display device provided with semiconductor element |
| TW094126595A TWI430450B (zh) | 2004-08-20 | 2005-08-04 | 設有半導體元件的顯示裝置和其製造方法、及安裝有設有半導體元件的顯示裝置之電子裝置 |
| KR1020050075157A KR101191279B1 (ko) | 2004-08-20 | 2005-08-17 | 반도체소자를 구비한 표시장치와 그 제조 방법 및 그반도체소자를 구비한 표시장치를 탑재한 전자기기 |
| CN2005100920813A CN1755943B (zh) | 2004-08-20 | 2005-08-19 | 具有半导体元件的显示器件及其制造方法 |
| US12/834,048 US8003420B2 (en) | 2004-08-20 | 2010-07-12 | Display device provided with semiconductor element and manufacturing method thereof, and electronic device installed with display device provided with semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004241119A JP4628040B2 (ja) | 2004-08-20 | 2004-08-20 | 半導体素子を備えた表示装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006060060A JP2006060060A (ja) | 2006-03-02 |
| JP2006060060A5 JP2006060060A5 (enExample) | 2007-09-06 |
| JP4628040B2 true JP4628040B2 (ja) | 2011-02-09 |
Family
ID=35908810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004241119A Expired - Fee Related JP4628040B2 (ja) | 2004-08-20 | 2004-08-20 | 半導体素子を備えた表示装置の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7759735B2 (enExample) |
| JP (1) | JP4628040B2 (enExample) |
| KR (1) | KR101191279B1 (enExample) |
| CN (1) | CN1755943B (enExample) |
| TW (1) | TWI430450B (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020182237A1 (en) * | 2001-03-22 | 2002-12-05 | The Procter & Gamble Company | Skin care compositions containing a sugar amine |
| US7977253B2 (en) * | 2004-08-31 | 2011-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| US7622338B2 (en) | 2004-08-31 | 2009-11-24 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US7470604B2 (en) * | 2004-10-08 | 2008-12-30 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device |
| US7537976B2 (en) * | 2005-05-20 | 2009-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of thin film transistor |
| US8138075B1 (en) | 2006-02-06 | 2012-03-20 | Eberlein Dietmar C | Systems and methods for the manufacture of flat panel devices |
| EP2034520B1 (en) * | 2006-06-08 | 2013-04-03 | International Business Machines Corporation | Highly heat conductive, flexible sheet |
| JP4565573B2 (ja) * | 2006-09-07 | 2010-10-20 | 株式会社フューチャービジョン | 液晶表示パネルの製造方法 |
| JP5181587B2 (ja) * | 2006-09-29 | 2013-04-10 | 大日本印刷株式会社 | 有機半導体素子およびその製造方法、有機トランジスタアレイ、およびディスプレイ |
| KR101485926B1 (ko) * | 2007-02-02 | 2015-02-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 기억장치 |
| KR20160040319A (ko) * | 2007-10-01 | 2016-04-12 | 씬 필름 일렉트로닉스 에이에스에이 | 전기 활성 디바이스 및 그 제조 방법 |
| US20090090915A1 (en) | 2007-10-05 | 2009-04-09 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor, display device having thin film transistor, and method for manufacturing the same |
| JP2009119395A (ja) * | 2007-11-16 | 2009-06-04 | Dainippon Screen Mfg Co Ltd | 塗布システムおよび塗布方法 |
| TWI508282B (zh) * | 2008-08-08 | 2015-11-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
| JP5651961B2 (ja) * | 2010-02-03 | 2015-01-14 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法、ならびに電子機器 |
| JP5771417B2 (ja) * | 2010-03-26 | 2015-08-26 | 株式会社半導体エネルギー研究所 | リチウム二次電池の電極の作製方法及びリチウムイオンキャパシタの電極の作製方法 |
| US9437454B2 (en) * | 2010-06-29 | 2016-09-06 | Semiconductor Energy Laboratory Co., Ltd. | Wiring board, semiconductor device, and manufacturing methods thereof |
| CN103299431B (zh) * | 2011-01-13 | 2016-06-15 | 夏普株式会社 | 半导体装置 |
| KR101835005B1 (ko) * | 2011-04-08 | 2018-03-07 | 삼성전자주식회사 | 반도체소자 및 그 제조방법 |
| KR101947166B1 (ko) * | 2012-11-19 | 2019-02-13 | 삼성디스플레이 주식회사 | 기판 및 상기 기판을 포함하는 표시장치 |
| US9425090B2 (en) * | 2014-09-19 | 2016-08-23 | Infineon Technologies Austria Ag | Method of electrodepositing gold on a copper seed layer to form a gold metallization structure |
| CN104409509A (zh) * | 2014-10-20 | 2015-03-11 | 深圳市华星光电技术有限公司 | 薄膜晶体管 |
| TW202129783A (zh) * | 2016-08-24 | 2021-08-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
Family Cites Families (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62247569A (ja) * | 1986-04-18 | 1987-10-28 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| US5132248A (en) * | 1988-05-31 | 1992-07-21 | The United States Of America As Represented By The United States Department Of Energy | Direct write with microelectronic circuit fabrication |
| JPH0820643B2 (ja) | 1989-08-29 | 1996-03-04 | シャープ株式会社 | アクティブマトリクス表示装置 |
| JPH03159174A (ja) | 1989-11-16 | 1991-07-09 | Sanyo Electric Co Ltd | 液晶表示装置 |
| JPH06163584A (ja) | 1992-11-18 | 1994-06-10 | Nippon Sheet Glass Co Ltd | 薄膜トランジスタの製造方法 |
| JPH07333648A (ja) | 1994-06-07 | 1995-12-22 | Mitsubishi Electric Corp | 液晶表示装置およびその製法 |
| US5737041A (en) * | 1995-07-31 | 1998-04-07 | Image Quest Technologies, Inc. | TFT, method of making and matrix displays incorporating the TFT |
| US5814834A (en) * | 1995-12-04 | 1998-09-29 | Semiconductor Energy Laboratory Co. | Thin film semiconductor device |
| KR100241287B1 (ko) * | 1996-09-10 | 2000-02-01 | 구본준 | 액정표시소자 제조방법 |
| JPH10170960A (ja) | 1996-12-16 | 1998-06-26 | Casio Comput Co Ltd | パターン形成方法 |
| JPH10209463A (ja) | 1997-01-27 | 1998-08-07 | Matsushita Electric Ind Co Ltd | 表示装置の配線形成方法、表示装置の製造方法、および表示装置 |
| KR100255592B1 (ko) * | 1997-03-19 | 2000-05-01 | 구본준 | 액정 표시 장치 구조 및 그 제조 방법 |
| JPH1056193A (ja) | 1997-05-09 | 1998-02-24 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| US6215541B1 (en) * | 1997-11-20 | 2001-04-10 | Samsung Electronics Co., Ltd. | Liquid crystal displays and manufacturing methods thereof |
| JPH11251259A (ja) | 1998-03-04 | 1999-09-17 | Seiko Epson Corp | 半導体層への不純物の導入方法、および薄膜トランジスタ並びに半導体装置の製造方法 |
| JP4087949B2 (ja) | 1998-05-20 | 2008-05-21 | セイコーエプソン株式会社 | 電気光学装置の製造方法及び電気光学装置 |
| US6416583B1 (en) * | 1998-06-19 | 2002-07-09 | Tokyo Electron Limited | Film forming apparatus and film forming method |
| US6555420B1 (en) * | 1998-08-31 | 2003-04-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and process for producing semiconductor device |
| KR100439944B1 (ko) * | 1998-12-10 | 2004-11-03 | 엘지.필립스 엘시디 주식회사 | 박막트랜지스터형광감지센서,센서박막트랜지스터와그제조방법 |
| US6630274B1 (en) * | 1998-12-21 | 2003-10-07 | Seiko Epson Corporation | Color filter and manufacturing method therefor |
| US6573964B1 (en) * | 1998-12-25 | 2003-06-03 | Fujitsu Display Technologies Corporation | Multidomain vertically aligned liquid crystal display device |
| US6891236B1 (en) * | 1999-01-14 | 2005-05-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
| US6426595B1 (en) * | 1999-02-08 | 2002-07-30 | Sony Corporation | Flat display apparatus |
| US6265243B1 (en) * | 1999-03-29 | 2001-07-24 | Lucent Technologies Inc. | Process for fabricating organic circuits |
| TWI243432B (en) * | 1999-10-29 | 2005-11-11 | Hitachi Ltd | Semiconductor device, method of making the same and liquid crystal display device |
| TW473800B (en) * | 1999-12-28 | 2002-01-21 | Semiconductor Energy Lab | Method of manufacturing a semiconductor device |
| JP3918412B2 (ja) * | 2000-08-10 | 2007-05-23 | ソニー株式会社 | 薄膜半導体装置及び液晶表示装置とこれらの製造方法 |
| CN1171188C (zh) | 2000-10-27 | 2004-10-13 | 友达光电股份有限公司 | 薄膜晶体管平面显示器及其制作方法 |
| JP4022470B2 (ja) * | 2001-02-19 | 2007-12-19 | 日本アイ・ビー・エム株式会社 | 薄膜トランジスタ構造の製造方法、およびディスプレイ・デバイス |
| JP3900248B2 (ja) | 2001-03-30 | 2007-04-04 | ハリマ化成株式会社 | 多層配線板およびその形成方法 |
| JP3774638B2 (ja) | 2001-04-24 | 2006-05-17 | ハリマ化成株式会社 | インクジェット印刷法を利用する回路パターンの形成方法 |
| US6870180B2 (en) * | 2001-06-08 | 2005-03-22 | Lucent Technologies Inc. | Organic polarizable gate transistor apparatus and method |
| JP2003080694A (ja) | 2001-06-26 | 2003-03-19 | Seiko Epson Corp | 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体 |
| EP1416069B1 (en) | 2001-08-09 | 2010-10-27 | Asahi Kasei Kabushiki Kaisha | Organic semiconductor film and method for manufacture thereof |
| JP2003133691A (ja) * | 2001-10-22 | 2003-05-09 | Seiko Epson Corp | 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体 |
| EP1306909A1 (en) * | 2001-10-24 | 2003-05-02 | Interuniversitair Micro-Elektronica Centrum | Ambipolar organic transistors |
| US6911675B2 (en) * | 2001-11-30 | 2005-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix display device and manufacturing method thereof |
| JP2003317945A (ja) | 2002-04-19 | 2003-11-07 | Seiko Epson Corp | デバイスの製造方法、デバイス、及び電子機器 |
| JP3965562B2 (ja) * | 2002-04-22 | 2007-08-29 | セイコーエプソン株式会社 | デバイスの製造方法、デバイス、電気光学装置及び電子機器 |
| JP2003318401A (ja) | 2002-04-22 | 2003-11-07 | Seiko Epson Corp | デバイスの製造方法、デバイス、表示装置、および電子機器 |
| JP2003318193A (ja) | 2002-04-22 | 2003-11-07 | Seiko Epson Corp | デバイス、その製造方法及び電子装置 |
| KR100640210B1 (ko) * | 2002-12-31 | 2006-10-31 | 엘지.필립스 엘시디 주식회사 | 액정표시소자 및 그 제조방법 |
| KR100938885B1 (ko) * | 2003-06-30 | 2010-01-27 | 엘지디스플레이 주식회사 | 액정표시장치용 어레이기판과 제조방법 |
| JP4586345B2 (ja) * | 2003-09-17 | 2010-11-24 | ソニー株式会社 | 電界効果型トランジスタ |
| WO2005048222A1 (en) | 2003-11-14 | 2005-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting display device, method for manufacturing the same, and tv set |
| CN1890698B (zh) | 2003-12-02 | 2011-07-13 | 株式会社半导体能源研究所 | 显示器件及其制造方法和电视装置 |
-
2004
- 2004-08-20 JP JP2004241119A patent/JP4628040B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-03 US US11/195,768 patent/US7759735B2/en not_active Expired - Fee Related
- 2005-08-04 TW TW094126595A patent/TWI430450B/zh not_active IP Right Cessation
- 2005-08-17 KR KR1020050075157A patent/KR101191279B1/ko not_active Expired - Fee Related
- 2005-08-19 CN CN2005100920813A patent/CN1755943B/zh not_active Expired - Fee Related
-
2010
- 2010-07-12 US US12/834,048 patent/US8003420B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US8003420B2 (en) | 2011-08-23 |
| US7759735B2 (en) | 2010-07-20 |
| US20100279449A1 (en) | 2010-11-04 |
| KR101191279B1 (ko) | 2012-10-16 |
| CN1755943A (zh) | 2006-04-05 |
| TW200618306A (en) | 2006-06-01 |
| TWI430450B (zh) | 2014-03-11 |
| US20060038174A1 (en) | 2006-02-23 |
| JP2006060060A (ja) | 2006-03-02 |
| CN1755943B (zh) | 2010-05-12 |
| KR20060050514A (ko) | 2006-05-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4628040B2 (ja) | 半導体素子を備えた表示装置の製造方法 | |
| KR101234003B1 (ko) | 반도체 장치 제조 방법 | |
| US7417373B2 (en) | Light emitting device, electronic device, and television device | |
| TWI389216B (zh) | 製造場效電晶體的方法 | |
| US7732334B2 (en) | Method for manufacturing semiconductor device | |
| KR102180037B1 (ko) | 가요성 표시 장치 및 그 제조 방법 | |
| US20050122351A1 (en) | Liquid droplet ejection system and control program of ejection condition of compositions | |
| US20030234398A1 (en) | Device, method of manufacturing device, electro-optic device, and electronic equipment | |
| US9237657B2 (en) | Wiring substrate, semiconductor device, and method for manufacturing thereof | |
| US7416977B2 (en) | Method for manufacturing display device, liquid crystal television, and EL television | |
| US7385223B2 (en) | Flat panel display with thin film transistor | |
| US7531294B2 (en) | Method for forming film pattern, method for manufacturing semiconductor device, liquid crystal television, and EL television | |
| CN1913146A (zh) | 薄膜导体及其制造方法 | |
| KR100946809B1 (ko) | 박막트랜지스터 및 그의 제조방법 | |
| KR101065600B1 (ko) | 박막 트랜지스터, 박막 트랜지스터의 제조 방법 및 표시 장치의 제조 방법 | |
| JP4877871B2 (ja) | 表示装置の作製方法、液晶テレビジョン、及びelテレビジョン | |
| CN1841779A (zh) | 薄膜晶体管、薄膜晶体管阵列面板及其制造方法 | |
| JP4785396B2 (ja) | 半導体装置の作製方法 | |
| JP4713192B2 (ja) | 薄膜トランジスタの作製方法 | |
| US20090207108A1 (en) | Display substrate and method of manufacturing the same | |
| JP4712332B2 (ja) | 薄膜トランジスタの作製方法 | |
| JP2010147269A (ja) | 薄膜半導体装置の製造方法 | |
| KR20090036872A (ko) | 폴리실리콘막 형성방법, 이를 이용한 박막 트랜지스터의형성방법 및 유기전계 발광소자 형성방법 | |
| JP2005136403A (ja) | 薄膜トランジスタの作製方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070720 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070720 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100908 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101005 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101008 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20101102 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20101109 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131119 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131119 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |