TWI401751B - 半導體裝置之製造方法 - Google Patents

半導體裝置之製造方法 Download PDF

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Publication number
TWI401751B
TWI401751B TW095110598A TW95110598A TWI401751B TW I401751 B TWI401751 B TW I401751B TW 095110598 A TW095110598 A TW 095110598A TW 95110598 A TW95110598 A TW 95110598A TW I401751 B TWI401751 B TW I401751B
Authority
TW
Taiwan
Prior art keywords
leads
wafer
suspension
suspension leads
semiconductor wafer
Prior art date
Application number
TW095110598A
Other languages
English (en)
Chinese (zh)
Other versions
TW200723414A (en
Inventor
天野賢治
長谷部一
Original Assignee
瑞薩電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞薩電子股份有限公司 filed Critical 瑞薩電子股份有限公司
Publication of TW200723414A publication Critical patent/TW200723414A/zh
Application granted granted Critical
Publication of TWI401751B publication Critical patent/TWI401751B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
TW095110598A 2005-04-25 2006-03-27 半導體裝置之製造方法 TWI401751B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005126392A JP4624170B2 (ja) 2005-04-25 2005-04-25 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW200723414A TW200723414A (en) 2007-06-16
TWI401751B true TWI401751B (zh) 2013-07-11

Family

ID=37187473

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110598A TWI401751B (zh) 2005-04-25 2006-03-27 半導體裝置之製造方法

Country Status (5)

Country Link
US (4) US7429500B2 (https=)
JP (1) JP4624170B2 (https=)
KR (1) KR101254803B1 (https=)
CN (1) CN1855409B (https=)
TW (1) TWI401751B (https=)

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US8174096B2 (en) * 2006-08-25 2012-05-08 Asm Assembly Materials Ltd. Stamped leadframe and method of manufacture thereof
JP5001872B2 (ja) * 2008-02-13 2012-08-15 ルネサスエレクトロニクス株式会社 半導体装置
KR101047603B1 (ko) * 2009-03-10 2011-07-07 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
US8610156B2 (en) 2009-03-10 2013-12-17 Lg Innotek Co., Ltd. Light emitting device package
US9337360B1 (en) 2009-11-16 2016-05-10 Solar Junction Corporation Non-alloyed contacts for III-V based solar cells
US9214586B2 (en) 2010-04-30 2015-12-15 Solar Junction Corporation Semiconductor solar cell package
JP2012113919A (ja) * 2010-11-24 2012-06-14 Toshiba Corp 照明装置
US9524928B2 (en) 2010-12-13 2016-12-20 Infineon Technologies Americas Corp. Power quad flat no-lead (PQFN) package having control and driver circuits
US9711437B2 (en) 2010-12-13 2017-07-18 Infineon Technologies Americas Corp. Semiconductor package having multi-phase power inverter with internal temperature sensor
US9362215B2 (en) 2010-12-13 2016-06-07 Infineon Technologies Americas Corp. Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter
US9355995B2 (en) 2010-12-13 2016-05-31 Infineon Technologies Americas Corp. Semiconductor packages utilizing leadframe panels with grooves in connecting bars
US9443795B2 (en) 2010-12-13 2016-09-13 Infineon Technologies Americas Corp. Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)
US9449957B2 (en) 2010-12-13 2016-09-20 Infineon Technologies Americas Corp. Control and driver circuits on a power quad flat no-lead (PQFN) leadframe
US8587101B2 (en) * 2010-12-13 2013-11-19 International Rectifier Corporation Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections
US9324646B2 (en) 2010-12-13 2016-04-26 Infineon Technologies America Corp. Open source power quad flat no-lead (PQFN) package
US9659845B2 (en) 2010-12-13 2017-05-23 Infineon Technologies Americas Corp. Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
US9620954B2 (en) 2010-12-13 2017-04-11 Infineon Technologies Americas Corp. Semiconductor package having an over-temperature protection circuit utilizing multiple temperature threshold values
US8962989B2 (en) 2011-02-03 2015-02-24 Solar Junction Corporation Flexible hermetic semiconductor solar cell package with non-hermetic option
KR20130064477A (ko) * 2011-12-08 2013-06-18 삼성전자주식회사 단층 배선 패턴을 포함하는 인쇄회로기판
JP5919087B2 (ja) * 2012-05-10 2016-05-18 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
JP5947107B2 (ja) * 2012-05-23 2016-07-06 ルネサスエレクトロニクス株式会社 半導体装置
JP2016072376A (ja) * 2014-09-29 2016-05-09 ルネサスエレクトロニクス株式会社 半導体装置
US10090420B2 (en) 2016-01-22 2018-10-02 Solar Junction Corporation Via etch method for back contact multijunction solar cells
US9680035B1 (en) 2016-05-27 2017-06-13 Solar Junction Corporation Surface mount solar cell with integrated coverglass
US20190221502A1 (en) * 2018-01-17 2019-07-18 Microchip Technology Incorporated Down Bond in Semiconductor Devices
CN109576676B (zh) * 2018-12-25 2023-12-29 西安立芯光电科技有限公司 一种用于半导体激光器侧腔面镀膜的夹具
CN112151489B (zh) * 2020-09-01 2023-06-06 通富微电科技(南通)有限公司 引线框架、引线框架的形成方法及引线框架封装体
CN113013039B (zh) * 2021-02-02 2023-02-10 江西新菲新材料有限公司 引线框架的制备方法

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US5859471A (en) * 1992-11-17 1999-01-12 Shinko Electric Industries Co., Ltd. Semiconductor device having tab tape lead frame with reinforced outer leads
TW425644B (en) * 1998-04-28 2001-03-11 Toshiba Corp Resin encapsulating semiconductor device and its manufacture, and lead frame
US6611048B1 (en) * 2000-08-25 2003-08-26 Skyworks Solutions, Inc. Exposed paddle leadframe for semiconductor die packaging
US6703260B2 (en) * 1998-05-20 2004-03-09 Micron Technology, Inc. Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes
TW200406903A (en) * 2002-06-06 2004-05-01 Hitachi Ltd Semiconductor device and method of manufacturing the same
US20040232442A1 (en) * 1999-06-30 2004-11-25 Hitachi, Ltd. Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

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JP2885605B2 (ja) * 1993-05-07 1999-04-26 九州日本電気株式会社 樹脂封止型半導体装置
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JP2000243889A (ja) * 1999-02-22 2000-09-08 Sony Corp 半導体装置用リードフレームの形状加工装置及び形状加工方法並びに半導体装置用リードフレーム
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US5859471A (en) * 1992-11-17 1999-01-12 Shinko Electric Industries Co., Ltd. Semiconductor device having tab tape lead frame with reinforced outer leads
TW425644B (en) * 1998-04-28 2001-03-11 Toshiba Corp Resin encapsulating semiconductor device and its manufacture, and lead frame
US6703260B2 (en) * 1998-05-20 2004-03-09 Micron Technology, Inc. Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes
US20040232442A1 (en) * 1999-06-30 2004-11-25 Hitachi, Ltd. Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
US6611048B1 (en) * 2000-08-25 2003-08-26 Skyworks Solutions, Inc. Exposed paddle leadframe for semiconductor die packaging
TW200406903A (en) * 2002-06-06 2004-05-01 Hitachi Ltd Semiconductor device and method of manufacturing the same

Also Published As

Publication number Publication date
US7514293B2 (en) 2009-04-07
TW200723414A (en) 2007-06-16
US20060240599A1 (en) 2006-10-26
US20110186976A1 (en) 2011-08-04
US7948068B2 (en) 2011-05-24
US20080305586A1 (en) 2008-12-11
US7429500B2 (en) 2008-09-30
JP2006303371A (ja) 2006-11-02
KR101254803B1 (ko) 2013-04-15
CN1855409B (zh) 2010-06-23
CN1855409A (zh) 2006-11-01
US8102035B2 (en) 2012-01-24
JP4624170B2 (ja) 2011-02-02
US20090176335A1 (en) 2009-07-09
KR20060112611A (ko) 2006-11-01

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