TWI354034B - - Google Patents
Download PDFInfo
- Publication number
- TWI354034B TWI354034B TW094102629A TW94102629A TWI354034B TW I354034 B TWI354034 B TW I354034B TW 094102629 A TW094102629 A TW 094102629A TW 94102629 A TW94102629 A TW 94102629A TW I354034 B TWI354034 B TW I354034B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper
- foil
- copper foil
- treated
- treatment
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 123
- 239000010949 copper Substances 0.000 claims description 74
- 239000011889 copper foil Substances 0.000 claims description 72
- 229910052802 copper Inorganic materials 0.000 claims description 58
- 239000002245 particle Substances 0.000 claims description 34
- 230000003746 surface roughness Effects 0.000 claims description 31
- 239000011888 foil Substances 0.000 claims description 30
- 229910000831 Steel Inorganic materials 0.000 claims description 29
- 239000010959 steel Substances 0.000 claims description 29
- 238000007788 roughening Methods 0.000 claims description 23
- 238000004381 surface treatment Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 14
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 4
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- 210000003298 dental enamel Anatomy 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 2
- 230000003449 preventive effect Effects 0.000 claims description 2
- 238000003723 Smelting Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 49
- 239000000758 substrate Substances 0.000 description 43
- 229920000106 Liquid crystal polymer Polymers 0.000 description 30
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 30
- 238000005868 electrolysis reaction Methods 0.000 description 21
- 239000010410 layer Substances 0.000 description 14
- 238000009713 electroplating Methods 0.000 description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 238000007747 plating Methods 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 239000002131 composite material Substances 0.000 description 7
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 229910000365 copper sulfate Inorganic materials 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000003792 electrolyte Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 238000003490 calendering Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- -1 polyimine Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 241000208140 Acer Species 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 241000282465 Canis Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017827 Cu—Fe Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910017313 Mo—Co Inorganic materials 0.000 description 1
- 206010028980 Neoplasm Diseases 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910000629 Rh alloy Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 101100443631 Schizosaccharomyces pombe (strain 972 / ATCC 24843) dni2 gene Proteins 0.000 description 1
- 241001122767 Theaceae Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- APUPEJJSWDHEBO-UHFFFAOYSA-P ammonium molybdate Chemical compound [NH4+].[NH4+].[O-][Mo]([O-])(=O)=O APUPEJJSWDHEBO-UHFFFAOYSA-P 0.000 description 1
- 229940010552 ammonium molybdate Drugs 0.000 description 1
- 235000018660 ammonium molybdate Nutrition 0.000 description 1
- 239000011609 ammonium molybdate Substances 0.000 description 1
- UNTBPXHCXVWYOI-UHFFFAOYSA-O azanium;oxido(dioxo)vanadium Chemical compound [NH4+].[O-][V](=O)=O UNTBPXHCXVWYOI-UHFFFAOYSA-O 0.000 description 1
- 230000005266 beta plus decay Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 201000011510 cancer Diseases 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 1
- 229940044175 cobalt sulfate Drugs 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- OUFLLVQXSGGKOV-UHFFFAOYSA-N copper ruthenium Chemical compound [Cu].[Ru].[Ru].[Ru] OUFLLVQXSGGKOV-UHFFFAOYSA-N 0.000 description 1
- GBAOZECSOKXKEL-UHFFFAOYSA-N copper yttrium Chemical compound [Cu].[Y] GBAOZECSOKXKEL-UHFFFAOYSA-N 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 210000003414 extremity Anatomy 0.000 description 1
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920000412 polyarylene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000035922 thirst Effects 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004031164 | 2004-02-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200535259A TW200535259A (en) | 2005-11-01 |
| TWI354034B true TWI354034B (enExample) | 2011-12-11 |
Family
ID=34675570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094102629A TW200535259A (en) | 2004-02-06 | 2005-01-28 | Treated copper foil and circuit board |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7381475B2 (enExample) |
| EP (1) | EP1562413A3 (enExample) |
| JP (1) | JP5367529B2 (enExample) |
| KR (1) | KR101129471B1 (enExample) |
| CN (1) | CN1657279B (enExample) |
| TW (1) | TW200535259A (enExample) |
Families Citing this family (61)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006103189A (ja) * | 2004-10-06 | 2006-04-20 | Furukawa Circuit Foil Kk | 表面処理銅箔並びに回路基板 |
| US7976956B2 (en) * | 2005-08-01 | 2011-07-12 | Furukawa Circuit Foil., Ltd. | Laminated circuit board |
| US20070048507A1 (en) * | 2006-08-01 | 2007-03-01 | Furukawa Circuit Foil Co., Ltd. | Laminated circuit board |
| US8449987B2 (en) * | 2006-06-12 | 2013-05-28 | Jx Nippon Mining & Metals Corporation | Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil |
| EP2388348B1 (en) * | 2006-10-02 | 2013-07-31 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Copper alloy sheet for electric and electronic parts |
| US20080142249A1 (en) * | 2006-12-13 | 2008-06-19 | International Business Machines Corporation | Selective surface roughness for high speed signaling |
| WO2008114539A1 (ja) * | 2007-03-20 | 2008-09-25 | Nippon Mining & Metals Co., Ltd. | 無接着剤フレキシブルラミネート及びその製造方法 |
| JP5181618B2 (ja) * | 2007-10-24 | 2013-04-10 | 宇部興産株式会社 | 金属箔積層ポリイミド樹脂基板 |
| WO2010093009A1 (ja) * | 2009-02-13 | 2010-08-19 | 古河電気工業株式会社 | 金属箔およびその製造方法，絶縁基板，配線基板 |
| US20120043980A1 (en) * | 2009-02-27 | 2012-02-23 | Brian Investments Pty Ltd | Wear sensor |
| CN102574365B (zh) * | 2009-07-24 | 2015-11-25 | 三菱瓦斯化学株式会社 | 树脂复合电解铜箔、覆铜层压板和印刷线路板 |
| JP2011174131A (ja) * | 2010-02-24 | 2011-09-08 | Showa Denko Kk | めっき浴、めっき方法、めっき膜、放熱板 |
| JP5563849B2 (ja) * | 2010-03-02 | 2014-07-30 | 福田金属箔粉工業株式会社 | 処理銅箔 |
| JP5885054B2 (ja) * | 2010-04-06 | 2016-03-15 | 福田金属箔粉工業株式会社 | 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。 |
| JP5634103B2 (ja) * | 2010-04-06 | 2014-12-03 | 福田金属箔粉工業株式会社 | 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。 |
| CN102884228B (zh) | 2010-05-07 | 2015-11-25 | 吉坤日矿日石金属株式会社 | 印刷电路用铜箔 |
| EP2624671A4 (en) | 2010-09-27 | 2016-12-21 | Jx Nippon Mining & Metals Corp | COPPER FOIL FOR FITTED PCB, METHOD FOR MAKING THIS COPPER FILM, RESIN COVER FOR FITTED PCB AND FITTED PCB |
| WO2012066658A1 (ja) * | 2010-11-17 | 2012-05-24 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔 |
| JP5654416B2 (ja) | 2011-06-07 | 2015-01-14 | Jx日鉱日石金属株式会社 | 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔 |
| TWI496954B (zh) * | 2011-07-29 | 2015-08-21 | Furukawa Electric Co Ltd | An electrolytic copper alloy foil manufacturing method, an electrolytic solution for the production of the alloy foil, a negative electrode current collector for a secondary battery, a secondary battery and an electrode |
| CN102505138A (zh) * | 2011-10-21 | 2012-06-20 | 江苏同昌电路科技有限公司 | 电镀干板线的加工工艺 |
| JP5204908B1 (ja) * | 2012-03-26 | 2013-06-05 | Ｊｘ日鉱日石金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板 |
| JP5417538B1 (ja) * | 2012-06-11 | 2014-02-19 | Ｊｘ日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法 |
| JP6134485B2 (ja) * | 2012-07-25 | 2017-05-24 | Ｊｘ金属株式会社 | 液晶ポリマーと接合させるための表面を有する金属材料、金属−液晶ポリマー複合体及びその製造方法、並びに、電子部品 |
| JP5869976B2 (ja) * | 2012-07-25 | 2016-02-24 | Ｊｘ金属株式会社 | 金属−液晶ポリマー複合体の製造方法 |
| JP5705381B2 (ja) * | 2013-02-28 | 2015-04-22 | 三井金属鉱業株式会社 | 黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板 |
| WO2015012327A1 (ja) * | 2013-07-23 | 2015-01-29 | Jx日鉱日石金属株式会社 | 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法 |
| US10257938B2 (en) * | 2013-07-24 | 2019-04-09 | Jx Nippon Mining & Metals Corporation | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board |
| JP2015041729A (ja) * | 2013-08-23 | 2015-03-02 | イビデン株式会社 | プリント配線板 |
| JP6283664B2 (ja) * | 2013-09-20 | 2018-02-21 | 三井金属鉱業株式会社 | 銅箔、キャリア箔付銅箔及び銅張積層板 |
| JP6062341B2 (ja) * | 2013-10-23 | 2017-01-18 | 古河電気工業株式会社 | 銅・樹脂複合体、及びその製造方法 |
| JP5710737B1 (ja) * | 2013-11-29 | 2015-04-30 | Jx日鉱日石金属株式会社 | 表面処理銅箔、積層板、プリント配線板、プリント回路板及び電子機器 |
| WO2016035876A1 (ja) * | 2014-09-05 | 2016-03-10 | 古河電気工業株式会社 | 銅箔、銅張積層板、および基板 |
| KR102118455B1 (ko) * | 2015-08-12 | 2020-06-03 | 후루카와 덴키 고교 가부시키가이샤 | 표면 처리 동박 및 이를 이용하여 제조되는 동 클래드 적층판 또는 프린트 배선판 |
| JPWO2017051897A1 (ja) * | 2015-09-24 | 2018-08-30 | Ｊｘ金属株式会社 | 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法 |
| KR20170037750A (ko) * | 2015-09-25 | 2017-04-05 | 일진머티리얼즈 주식회사 | 표면처리동박 및 그의 제조방법 |
| KR20170038969A (ko) * | 2015-09-30 | 2017-04-10 | 일진머티리얼즈 주식회사 | 표면처리동박 및 그의 제조방법 |
| US9397343B1 (en) | 2015-10-15 | 2016-07-19 | Chang Chun Petrochemical Co., Ltd. | Copper foil exhibiting anti-swelling properties |
| JP5913714B1 (ja) * | 2015-10-19 | 2016-04-27 | 矢崎総業株式会社 | 車両表示装置用金属調装飾部品、及び、車両表示装置 |
| US9707738B1 (en) * | 2016-01-14 | 2017-07-18 | Chang Chun Petrochemical Co., Ltd. | Copper foil and methods of use |
| KR20180003700A (ko) * | 2016-06-30 | 2018-01-10 | 일진머티리얼즈 주식회사 | 시인성이 향상된 표면처리동박 및 그의 제조방법 |
| KR20180003706A (ko) * | 2016-06-30 | 2018-01-10 | 일진머티리얼즈 주식회사 | 후처리 후 에칭성이 우수한 표면처리동박 및 그 제조방법 |
| KR101828698B1 (ko) * | 2016-09-08 | 2018-02-12 | 윤희탁 | 도금 장식품 제조 방법 |
| KR102274906B1 (ko) * | 2016-09-12 | 2021-07-09 | 후루카와 덴키 고교 가부시키가이샤 | 구리박 및 이것을 갖는 동장 적층판 |
| KR20180047897A (ko) | 2016-11-01 | 2018-05-10 | 케이씨에프테크놀로지스 주식회사 | 표면처리 전해동박, 이의 제조방법, 및 이의 용도 |
| KR102335444B1 (ko) * | 2017-03-30 | 2021-12-03 | 후루카와 덴키 고교 가부시키가이샤 | 표면 처리 동박, 그리고 이를 이용한 동 클래드 적층판 및 프린트 배선판 |
| JP7055049B2 (ja) * | 2017-03-31 | 2022-04-15 | Ｊｘ金属株式会社 | 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法 |
| TWI646227B (zh) * | 2017-12-08 | 2019-01-01 | 南亞塑膠工業股份有限公司 | 應用於信號傳輸的銅箔以及線路板組件的製造方法 |
| US10337115B1 (en) * | 2018-01-05 | 2019-07-02 | Chang Chun Petrochemical Co., Ltd. | Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making |
| TWI668333B (zh) * | 2018-09-17 | 2019-08-11 | 金居開發股份有限公司 | 微粗糙電解銅箔及銅箔基板 |
| TWI669032B (zh) * | 2018-09-26 | 2019-08-11 | 金居開發股份有限公司 | 微粗糙電解銅箔及銅箔基板 |
| CN118390123A (zh) | 2019-06-12 | 2024-07-26 | 东洋钢钣株式会社 | 粗糙化镀板 |
| JP7421208B2 (ja) | 2019-12-24 | 2024-01-24 | 日本電解株式会社 | 表面処理銅箔及びその製造方法 |
| KR102454686B1 (ko) * | 2020-12-30 | 2022-10-13 | 에스케이씨 주식회사 | 표면 처리 동박 및 이를 포함하는 회로 기판 |
| EP4317529A4 (en) * | 2021-03-26 | 2025-10-08 | Mitsubishi Materials Corp | METAL FOIL MATERIAL, LAMINATED BODY, INSULATED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING METAL FOIL MATERIAL |
| CN113737238B (zh) * | 2021-10-11 | 2023-04-11 | 中色奥博特铜铝业有限公司 | 一种超低轮廓度压延铜箔表面粗化处理方法 |
| KR102789764B1 (ko) * | 2021-12-22 | 2025-04-03 | 롯데에너지머티리얼즈 주식회사 | 내열성을 가지는 표면처리동박, 이를 포함하는 동박적층판 및 프린트 배선판 |
| CN114919255B (zh) * | 2022-05-27 | 2024-03-08 | 广州方邦电子股份有限公司 | 一种挠性覆铜板及印刷线路板 |
| CN116190022B (zh) * | 2023-04-24 | 2023-07-28 | 广州方邦电子股份有限公司 | 一种复合基材及电路板 |
| CN118832922B (zh) * | 2024-07-01 | 2025-03-04 | 江苏耀鸿电子有限公司 | 一种柔性耐高温bt树脂基覆铜板及其制备方法 |
| CN119724781B (zh) * | 2025-01-10 | 2025-09-30 | 广州方邦电子股份有限公司 | 一种复合金属箔、覆金属层叠板和电路板 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR920003400B1 (ko) * | 1983-12-29 | 1992-04-30 | 가부시기가이샤 히다찌세이사꾸쇼 | 금속과 수지와의 복합체 및 그 제조방법 |
| JPH07202367A (ja) * | 1993-12-28 | 1995-08-04 | Japan Energy Corp | 印刷回路用銅箔の表面処理方法 |
| TW317575B (enExample) * | 1994-01-21 | 1997-10-11 | Olin Corp | |
| JP3255862B2 (ja) * | 1995-11-30 | 2002-02-12 | 日本パーカライジング株式会社 | 摺動部材およびその製造方法 |
| US5863410A (en) * | 1997-06-23 | 1999-01-26 | Circuit Foil Usa, Inc. | Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby |
| JP2000058364A (ja) * | 1998-08-04 | 2000-02-25 | Fujitsu Ltd | 磁性薄膜及びその形成方法 |
| JP2000233448A (ja) | 1998-12-16 | 2000-08-29 | Sumitomo Chem Co Ltd | 溶融液晶性ポリエステル樹脂成形体と金属との熱融着方法 |
| JP2001049002A (ja) | 1999-08-10 | 2001-02-20 | Kuraray Co Ltd | 熱可塑性液晶ポリマーフィルムおよびその製造方法 |
| JP2001068816A (ja) * | 1999-08-24 | 2001-03-16 | Mitsui Mining & Smelting Co Ltd | 銅張積層板及びその銅張積層板を用いたレーザー加工方法 |
| US6372113B2 (en) * | 1999-09-13 | 2002-04-16 | Yates Foil Usa, Inc. | Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same |
| US6497806B1 (en) * | 2000-04-25 | 2002-12-24 | Nippon Denkai, Ltd. | Method of producing a roughening-treated copper foil |
| US20020182432A1 (en) * | 2000-04-05 | 2002-12-05 | Masaru Sakamoto | Laser hole drilling copper foil |
| JP3628585B2 (ja) * | 2000-04-05 | 2005-03-16 | 株式会社日鉱マテリアルズ | 銅張り積層板及び銅張り積層板のレーザーによる穴開け方法 |
| JP3690962B2 (ja) * | 2000-04-26 | 2005-08-31 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板 |
| JP3429290B2 (ja) * | 2000-09-18 | 2003-07-22 | 日本電解株式会社 | 微細配線用銅箔の製造方法 |
| JP4429539B2 (ja) * | 2001-02-16 | 2010-03-10 | 古河電気工業株式会社 | ファインパターン用電解銅箔 |
| JP4798894B2 (ja) | 2001-08-20 | 2011-10-19 | Ｊｘ日鉱日石金属株式会社 | 積層板用銅合金箔 |
| JP2003201597A (ja) | 2002-01-09 | 2003-07-18 | Nippon Denkai Kk | 銅箔とその製造方法及び該銅箔を用いた電磁波シールド体 |
| JP3900961B2 (ja) | 2002-02-18 | 2007-04-04 | 日立電線株式会社 | 樹脂接着用銅箔およびその製造方法 |
| KR100602896B1 (ko) * | 2002-06-04 | 2006-07-19 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 저유전성 기재용 표면처리 동박과 그것을 사용한 동클래드적층판 및 프린트 배선판 |
| TW200404484A (en) * | 2002-09-02 | 2004-03-16 | Furukawa Circuit Foil | Copper foil for soft circuit board package module, for plasma display, or for radio-frequency printed circuit board |
| TW200500199A (en) * | 2003-02-12 | 2005-01-01 | Furukawa Circuit Foil | Copper foil for fine patterned printed circuits and method of production of same |
| KR101065758B1 (ko) * | 2003-02-27 | 2011-09-19 | 후루카와 덴키 고교 가부시키가이샤 | 전자파 실드용 동박, 그 제조방법 및 전자파 실드체 |
| JP4833556B2 (ja) * | 2004-02-06 | 2011-12-07 | 古河電気工業株式会社 | 表面処理銅箔 |
| JP2006103189A (ja) * | 2004-10-06 | 2006-04-20 | Furukawa Circuit Foil Kk | 表面処理銅箔並びに回路基板 |
| US7976956B2 (en) * | 2005-08-01 | 2011-07-12 | Furukawa Circuit Foil., Ltd. | Laminated circuit board |
-
2005
- 2005-01-28 TW TW094102629A patent/TW200535259A/zh not_active IP Right Cessation
- 2005-02-03 CN CN2005100542538A patent/CN1657279B/zh not_active Expired - Lifetime
- 2005-02-04 KR KR1020050010353A patent/KR101129471B1/ko not_active Expired - Lifetime
- 2005-02-04 EP EP05002416A patent/EP1562413A3/en not_active Ceased
- 2005-02-07 US US11/052,998 patent/US7381475B2/en not_active Expired - Fee Related
-
2009
- 2009-10-20 JP JP2009241107A patent/JP5367529B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20050175826A1 (en) | 2005-08-11 |
| KR20060041689A (ko) | 2006-05-12 |
| JP2010013738A (ja) | 2010-01-21 |
| CN1657279B (zh) | 2011-07-27 |
| CN1657279A (zh) | 2005-08-24 |
| US7381475B2 (en) | 2008-06-03 |
| EP1562413A2 (en) | 2005-08-10 |
| KR101129471B1 (ko) | 2012-04-02 |
| JP5367529B2 (ja) | 2013-12-11 |
| TW200535259A (en) | 2005-11-01 |
| EP1562413A3 (en) | 2008-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI354034B (enExample) | ||
| JP4833556B2 (ja) | 表面処理銅箔 | |
| CN1770953B (zh) | 表面处理铜箔及电路基板 | |
| JP3977790B2 (ja) | キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板 | |
| TWI704048B (zh) | 表面處理銅箔及使用其製成的覆銅積層板 | |
| JP2007186797A (ja) | キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板 | |
| JP2013177695A (ja) | 表面粗化銅板の製造方法及び表面粗化銅板 | |
| KR101168613B1 (ko) | 표면처리층의 구조가 개선된 전해동박 및 그 제조방법과, 동장적층판 및 인쇄회로기판 | |
| TWI402009B (zh) | Surface treatment of copper foil and circuit substrate | |
| JP2001181886A (ja) | 電解銅箔 | |
| CN101545122A (zh) | 电解铜箔和布线板 | |
| JP4615226B2 (ja) | 基板用複合材及びそれを用いた回路基板 | |
| JP2006005149A (ja) | 抵抗層付き導電性基材及び抵抗層付き回路基板材料 | |
| JP3954958B2 (ja) | 抵抗層付き銅箔及び抵抗層付き回路基板材料 | |
| JP4217778B2 (ja) | 抵抗層付き導電性基材、抵抗層付き回路基板及び抵抗回路配線板 | |
| JP4429539B2 (ja) | ファインパターン用電解銅箔 | |
| JP4609850B2 (ja) | 積層回路基板 | |
| US7976956B2 (en) | Laminated circuit board | |
| JP4748519B2 (ja) | キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板 | |
| JP4391437B2 (ja) | 積層回路基板、積層回路基板用表面処理銅箔及び表面処理銅箔 | |
| JP2005015897A (ja) | 厚銅シート、それを用いたプリント配線板 | |
| US20070048507A1 (en) | Laminated circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |