CN1657279B - 表面处理铜箔和电路基板 - Google Patents

表面处理铜箔和电路基板 Download PDF

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Publication number
CN1657279B
CN1657279B CN2005100542538A CN200510054253A CN1657279B CN 1657279 B CN1657279 B CN 1657279B CN 2005100542538 A CN2005100542538 A CN 2005100542538A CN 200510054253 A CN200510054253 A CN 200510054253A CN 1657279 B CN1657279 B CN 1657279B
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China
Prior art keywords
copper foil
treated copper
thrust
roughened
particles
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CN2005100542538A
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English (en)
Chinese (zh)
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CN1657279A (zh
Inventor
铃木裕二
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Furukawa Electric Co Ltd
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Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of CN1657279A publication Critical patent/CN1657279A/zh
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN2005100542538A 2004-02-06 2005-02-03 表面处理铜箔和电路基板 Expired - Lifetime CN1657279B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004031164 2004-02-06
JP2004031164 2004-02-06
JP2004-031164 2004-02-06

Publications (2)

Publication Number Publication Date
CN1657279A CN1657279A (zh) 2005-08-24
CN1657279B true CN1657279B (zh) 2011-07-27

Family

ID=34675570

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005100542538A Expired - Lifetime CN1657279B (zh) 2004-02-06 2005-02-03 表面处理铜箔和电路基板

Country Status (6)

Country Link
US (1) US7381475B2 (enExample)
EP (1) EP1562413A3 (enExample)
JP (1) JP5367529B2 (enExample)
KR (1) KR101129471B1 (enExample)
CN (1) CN1657279B (enExample)
TW (1) TW200535259A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI566647B (zh) * 2012-06-11 2017-01-11 Jx Nippon Mining & Metals Corp Surface treatment of copper foil and the use of its laminate, printed wiring board, electronic equipment, and printing wiring board manufacturing methods
CN107018622A (zh) * 2015-09-30 2017-08-04 日进材料股份有限公司 微电路基板用经表面处理的铜箔及其制造方法

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006103189A (ja) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk 表面処理銅箔並びに回路基板
US7976956B2 (en) * 2005-08-01 2011-07-12 Furukawa Circuit Foil., Ltd. Laminated circuit board
US20070048507A1 (en) * 2006-08-01 2007-03-01 Furukawa Circuit Foil Co., Ltd. Laminated circuit board
US8449987B2 (en) * 2006-06-12 2013-05-28 Jx Nippon Mining & Metals Corporation Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil
EP2388348B1 (en) * 2006-10-02 2013-07-31 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Copper alloy sheet for electric and electronic parts
US20080142249A1 (en) * 2006-12-13 2008-06-19 International Business Machines Corporation Selective surface roughness for high speed signaling
WO2008114539A1 (ja) * 2007-03-20 2008-09-25 Nippon Mining & Metals Co., Ltd. 無接着剤フレキシブルラミネート及びその製造方法
JP5181618B2 (ja) * 2007-10-24 2013-04-10 宇部興産株式会社 金属箔積層ポリイミド樹脂基板
WO2010093009A1 (ja) * 2009-02-13 2010-08-19 古河電気工業株式会社 金属箔およびその製造方法，絶縁基板，配線基板
US20120043980A1 (en) * 2009-02-27 2012-02-23 Brian Investments Pty Ltd Wear sensor
CN102574365B (zh) * 2009-07-24 2015-11-25 三菱瓦斯化学株式会社 树脂复合电解铜箔、覆铜层压板和印刷线路板
JP2011174131A (ja) * 2010-02-24 2011-09-08 Showa Denko Kk めっき浴、めっき方法、めっき膜、放熱板
JP5563849B2 (ja) * 2010-03-02 2014-07-30 福田金属箔粉工業株式会社 処理銅箔
JP5885054B2 (ja) * 2010-04-06 2016-03-15 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
JP5634103B2 (ja) * 2010-04-06 2014-12-03 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
CN102884228B (zh) 2010-05-07 2015-11-25 吉坤日矿日石金属株式会社 印刷电路用铜箔
EP2624671A4 (en) 2010-09-27 2016-12-21 Jx Nippon Mining & Metals Corp COPPER FOIL FOR FITTED PCB, METHOD FOR MAKING THIS COPPER FILM, RESIN COVER FOR FITTED PCB AND FITTED PCB
WO2012066658A1 (ja) * 2010-11-17 2012-05-24 Jx日鉱日石金属株式会社 プリント配線板用銅箔
JP5654416B2 (ja) 2011-06-07 2015-01-14 Jx日鉱日石金属株式会社 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔
TWI496954B (zh) * 2011-07-29 2015-08-21 Furukawa Electric Co Ltd An electrolytic copper alloy foil manufacturing method, an electrolytic solution for the production of the alloy foil, a negative electrode current collector for a secondary battery, a secondary battery and an electrode
CN102505138A (zh) * 2011-10-21 2012-06-20 江苏同昌电路科技有限公司 电镀干板线的加工工艺
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JP6134485B2 (ja) * 2012-07-25 2017-05-24 Ｊｘ金属株式会社 液晶ポリマーと接合させるための表面を有する金属材料、金属−液晶ポリマー複合体及びその製造方法、並びに、電子部品
JP5869976B2 (ja) * 2012-07-25 2016-02-24 Ｊｘ金属株式会社 金属−液晶ポリマー複合体の製造方法
JP5705381B2 (ja) * 2013-02-28 2015-04-22 三井金属鉱業株式会社 黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板
WO2015012327A1 (ja) * 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
US10257938B2 (en) * 2013-07-24 2019-04-09 Jx Nippon Mining & Metals Corporation Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
JP2015041729A (ja) * 2013-08-23 2015-03-02 イビデン株式会社 プリント配線板
JP6283664B2 (ja) * 2013-09-20 2018-02-21 三井金属鉱業株式会社 銅箔、キャリア箔付銅箔及び銅張積層板
JP6062341B2 (ja) * 2013-10-23 2017-01-18 古河電気工業株式会社 銅・樹脂複合体、及びその製造方法
JP5710737B1 (ja) * 2013-11-29 2015-04-30 Jx日鉱日石金属株式会社 表面処理銅箔、積層板、プリント配線板、プリント回路板及び電子機器
WO2016035876A1 (ja) * 2014-09-05 2016-03-10 古河電気工業株式会社 銅箔、銅張積層板、および基板
KR102118455B1 (ko) * 2015-08-12 2020-06-03 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박 및 이를 이용하여 제조되는 동 클래드 적층판 또는 프린트 배선판
JPWO2017051897A1 (ja) * 2015-09-24 2018-08-30 Ｊｘ金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
KR20170037750A (ko) * 2015-09-25 2017-04-05 일진머티리얼즈 주식회사 표면처리동박 및 그의 제조방법
US9397343B1 (en) 2015-10-15 2016-07-19 Chang Chun Petrochemical Co., Ltd. Copper foil exhibiting anti-swelling properties
JP5913714B1 (ja) * 2015-10-19 2016-04-27 矢崎総業株式会社 車両表示装置用金属調装飾部品、及び、車両表示装置
US9707738B1 (en) * 2016-01-14 2017-07-18 Chang Chun Petrochemical Co., Ltd. Copper foil and methods of use
KR20180003700A (ko) * 2016-06-30 2018-01-10 일진머티리얼즈 주식회사 시인성이 향상된 표면처리동박 및 그의 제조방법
KR20180003706A (ko) * 2016-06-30 2018-01-10 일진머티리얼즈 주식회사 후처리 후 에칭성이 우수한 표면처리동박 및 그 제조방법
KR101828698B1 (ko) * 2016-09-08 2018-02-12 윤희탁 도금 장식품 제조 방법
KR102274906B1 (ko) * 2016-09-12 2021-07-09 후루카와 덴키 고교 가부시키가이샤 구리박 및 이것을 갖는 동장 적층판
KR20180047897A (ko) 2016-11-01 2018-05-10 케이씨에프테크놀로지스 주식회사 표면처리 전해동박, 이의 제조방법, 및 이의 용도
KR102335444B1 (ko) * 2017-03-30 2021-12-03 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박, 그리고 이를 이용한 동 클래드 적층판 및 프린트 배선판
JP7055049B2 (ja) * 2017-03-31 2022-04-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
TWI646227B (zh) * 2017-12-08 2019-01-01 南亞塑膠工業股份有限公司 應用於信號傳輸的銅箔以及線路板組件的製造方法
US10337115B1 (en) * 2018-01-05 2019-07-02 Chang Chun Petrochemical Co., Ltd. Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making
TWI668333B (zh) * 2018-09-17 2019-08-11 金居開發股份有限公司 微粗糙電解銅箔及銅箔基板
TWI669032B (zh) * 2018-09-26 2019-08-11 金居開發股份有限公司 微粗糙電解銅箔及銅箔基板
CN118390123A (zh) 2019-06-12 2024-07-26 东洋钢钣株式会社 粗糙化镀板
JP7421208B2 (ja) 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法
KR102454686B1 (ko) * 2020-12-30 2022-10-13 에스케이씨 주식회사 표면 처리 동박 및 이를 포함하는 회로 기판
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CN116190022B (zh) * 2023-04-24 2023-07-28 广州方邦电子股份有限公司 一种复合基材及电路板
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US7381475B2 (en) 2008-06-03
TWI354034B (enExample) 2011-12-11
EP1562413A2 (en) 2005-08-10
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