KR101129471B1 - 표면처리동박 및 회로기판 - Google Patents
표면처리동박 및 회로기판 Download PDFInfo
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- KR101129471B1 KR101129471B1 KR1020050010353A KR20050010353A KR101129471B1 KR 101129471 B1 KR101129471 B1 KR 101129471B1 KR 1020050010353 A KR1020050010353 A KR 1020050010353A KR 20050010353 A KR20050010353 A KR 20050010353A KR 101129471 B1 KR101129471 B1 KR 101129471B1
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- copper foil
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (22)
- 입자상태의 결정으로 이루어지는 전해 동박의 적어도 한쪽 면에 동(銅) 또는 동합금(銅合金)의 조화(粗化)입자가 부착하여 조화(粗化)처리면이 되고, 상기 조화처리면의 표면 거칠기(Rz)가 1.5 내지 4.0㎛이고, 명도값이 30 이하이면서,상기 조화 입자의 양이 2.5㎎/dm2 이상, 400㎎/dm2 이하이고,상기 조화입자로 형성된 돌기물의 높이가 1㎛ 내지 5㎛이고, 이 돌기물이 100㎛×100㎛의 면적에 200 내지 25000개 분포하고,상기 각 돌기물의 최대폭은 0.01㎛ 이상이고, 25㎛의 범위에 존재하는 상기 돌기물의 개수로 25㎛를 나눈 길이의 2배 이하이고,상기 돌기물에 있어서, 1개의 돌기물과 이 돌기물과 인접하는 돌기물의 사이에 형성되는 홈부의 바닥과 돌기물의 정점과의 거리 (홈 깊이)의 평균이, 0.5 ㎛ 이상인 것을 특징으로 하는 표면처리 동박.
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- 제 1항에 있어서,상기 돌기물이 관찰 단면 25㎛의 범위에 6 내지 35개의 개수로 균등하게 분포되어 있는 것을 특징으로 하는 표면처리동박.
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- 제 1항에 있어서,조화 처리전의 상기 전해 동박의 조화처리를 실시하는 쪽의 표면이, 표면 거칠기(Rz)가 2.0㎛ 이하의 매트면인 것을 특징으로 하는 표면처리동박.
- 제 1항 또는 5항에 있어서,상기 표면처리동박의 조화처리 전의 전해 동박의 적어도 조화처리를 실시하는 쪽 표면의 표면 거칠기(Rz)가 2.0㎛ 이하인 것을 특징으로 하는 표면처리동박.
- 제 1항 또는 제 5항에 있어서,상기 돌기물이, Cu로 이루어지는 입자 혹은 Cu와 Mo의 합금입자 또는 Cu와 Ni, Co, Fe, Cr, V, W의 군으로부터 선택되는 적어도 1종의 원소로 이루어지는 합금 입자에 의해 형성되어 있는 것을 특징으로 하는 표면처리동박.
- 제 1항 또는 5항에 있어서,상기 돌기물을 갖는 면에, Ni 또는 Ni 합금으로 이루어지는 피막이 형성되어 있는 것을 특징으로 하는 표면처리동박.
- 제 1항 또는 5항에 있어서,상기 돌기물을 갖는 면에, 아연층 혹은 아연 합금층 및 Cr 금속층 또는 크로메이트층으로 이루어지는 방청층이 구비되어 있는 것을 특징으로 하는 표면처리동박.
- 제 16항에 있어서,상기 돌기물을 갖는 면 및 방청층 위에 실란 커플링층이 형성되어 있는 것을 특징으로 하는 표면처리동박.
- 제 1항 또는 제 5항에 기재된 표면처리동박을 이용하여 제작된 것을 특징으로 하는 회로기판.
- 제 1항 또는 5항에 있어서,상기 돌기물을 갖는 면에, 아연층 혹은 아연 합금층, 또는 Cr 금속층 또는 크로메이트층으로 이루어지는 방청층이 구비되어 있는 것을 특징으로 하는 표면처리동박.
- 제 19항에 있어서,상기 돌기물을 갖는 면 및 방청층 위에 실란 커플링층이 형성되어 있는 것을 특징으로 하는 표면처리동박.
- 제 16항에 있어서,상기 돌기물을 갖는 면 및 방청층 위에 실란 커플링층이 형성되어 있는 것을 특징으로 하는 표면처리동박.
- 제 19항에 있어서,상기 돌기물을 갖는 면 및 방청층 위에 실란 커플링층이 형성되어 있는 것을 특징으로 하는 표면처리동박.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004031164 | 2004-02-06 | ||
JPJP-P-2004-00031164 | 2004-02-06 |
Publications (2)
Publication Number | Publication Date |
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KR20060041689A KR20060041689A (ko) | 2006-05-12 |
KR101129471B1 true KR101129471B1 (ko) | 2012-04-02 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020050010353A KR101129471B1 (ko) | 2004-02-06 | 2005-02-04 | 표면처리동박 및 회로기판 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7381475B2 (ko) |
EP (1) | EP1562413A3 (ko) |
JP (1) | JP5367529B2 (ko) |
KR (1) | KR101129471B1 (ko) |
CN (1) | CN1657279B (ko) |
TW (1) | TW200535259A (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2018004151A1 (ko) * | 2016-06-30 | 2018-01-04 | 일진머티리얼즈 주식회사 | 시인성이 향상된 표면처리동박 및 그의 제조방법 |
WO2018004152A1 (ko) * | 2016-06-30 | 2018-01-04 | 일진머티리얼즈 주식회사 | 후처리 후 에칭성이 우수한 표면처리동박 및 그 제조방법 |
KR20230129209A (ko) | 2016-11-01 | 2023-09-07 | 에스케이넥실리스 주식회사 | 표면처리 전해동박, 이의 제조방법, 및 이의 용도 |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006103189A (ja) * | 2004-10-06 | 2006-04-20 | Furukawa Circuit Foil Kk | 表面処理銅箔並びに回路基板 |
US20070048507A1 (en) * | 2006-08-01 | 2007-03-01 | Furukawa Circuit Foil Co., Ltd. | Laminated circuit board |
US7976956B2 (en) * | 2005-08-01 | 2011-07-12 | Furukawa Circuit Foil., Ltd. | Laminated circuit board |
US8449987B2 (en) * | 2006-06-12 | 2013-05-28 | Jx Nippon Mining & Metals Corporation | Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil |
ATE518968T1 (de) * | 2006-10-02 | 2011-08-15 | Kobe Steel Ltd | Kupferlegierungsplatte für elektrische und elektronische bauteile |
US20080142249A1 (en) * | 2006-12-13 | 2008-06-19 | International Business Machines Corporation | Selective surface roughness for high speed signaling |
JP5043094B2 (ja) * | 2007-03-20 | 2012-10-10 | Jx日鉱日石金属株式会社 | 無接着剤フレキシブルラミネート及びその製造方法 |
JP5181618B2 (ja) * | 2007-10-24 | 2013-04-10 | 宇部興産株式会社 | 金属箔積層ポリイミド樹脂基板 |
KR101256086B1 (ko) * | 2009-02-13 | 2013-04-23 | 후루카와 덴키 고교 가부시키가이샤 | 금속박과 그 제조 방법, 절연기판, 및 배선기판 |
WO2010096873A1 (en) * | 2009-02-27 | 2010-09-02 | Brian Investments Pty Ltd | Wear sensor |
EP2457725B1 (en) * | 2009-07-24 | 2018-11-28 | Mitsubishi Gas Chemical Company, Inc. | Resin composite electrolytic copper foil, copper-clad laminate, and printed wiring board |
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JP5634103B2 (ja) * | 2010-04-06 | 2014-12-03 | 福田金属箔粉工業株式会社 | 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。 |
JP5885054B2 (ja) * | 2010-04-06 | 2016-03-15 | 福田金属箔粉工業株式会社 | 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。 |
JP5654581B2 (ja) | 2010-05-07 | 2015-01-14 | Jx日鉱日石金属株式会社 | 印刷回路用銅箔、銅張積層板、印刷回路基板、印刷回路及び電子機器 |
KR101871029B1 (ko) * | 2010-09-27 | 2018-06-25 | 제이엑스금속주식회사 | 프린트 배선판용 구리박, 그 제조 방법, 프린트 배선판용 수지 기판 및 프린트 배선판 |
JP4799710B1 (ja) * | 2010-11-17 | 2011-10-26 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔 |
JP5654416B2 (ja) | 2011-06-07 | 2015-01-14 | Jx日鉱日石金属株式会社 | 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔 |
KR20150097821A (ko) * | 2011-07-29 | 2015-08-26 | 후루카와 덴키 고교 가부시키가이샤 | 전해 동합금박, 그 제조 방법, 그것의 제조에 이용하는 전해액, 그것을 이용한 2차 전지용 음극 집전체, 2차 전지 및 그 전극 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003201597A (ja) | 2002-01-09 | 2003-07-18 | Nippon Denkai Kk | 銅箔とその製造方法及び該銅箔を用いた電磁波シールド体 |
JP2003239082A (ja) | 2002-02-18 | 2003-08-27 | Hitachi Cable Ltd | 樹脂接着用銅箔およびその製造方法 |
WO2003102277A1 (fr) * | 2002-06-04 | 2003-12-11 | Mitsui Mining & Smelting Co.,Ltd. | Feuille de cuivre traitee en surface pour substrat dielectrique faible, stratifie cuivre comportant cette feuille et carte a cablage imprime |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3447669A1 (de) * | 1983-12-29 | 1985-07-18 | Hitachi, Ltd., Tokio/Tokyo | Verbundstruktur aus metall und kunstharz sowie verfahren zu deren herstellung |
JPH07202367A (ja) * | 1993-12-28 | 1995-08-04 | Japan Energy Corp | 印刷回路用銅箔の表面処理方法 |
TW317575B (ko) * | 1994-01-21 | 1997-10-11 | Olin Corp | |
JP3255862B2 (ja) * | 1995-11-30 | 2002-02-12 | 日本パーカライジング株式会社 | 摺動部材およびその製造方法 |
US5863410A (en) * | 1997-06-23 | 1999-01-26 | Circuit Foil Usa, Inc. | Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby |
JP2000058364A (ja) * | 1998-08-04 | 2000-02-25 | Fujitsu Ltd | 磁性薄膜及びその形成方法 |
JP2000233448A (ja) | 1998-12-16 | 2000-08-29 | Sumitomo Chem Co Ltd | 溶融液晶性ポリエステル樹脂成形体と金属との熱融着方法 |
JP2001049002A (ja) | 1999-08-10 | 2001-02-20 | Kuraray Co Ltd | 熱可塑性液晶ポリマーフィルムおよびその製造方法 |
JP2001068816A (ja) * | 1999-08-24 | 2001-03-16 | Mitsui Mining & Smelting Co Ltd | 銅張積層板及びその銅張積層板を用いたレーザー加工方法 |
US6372113B2 (en) * | 1999-09-13 | 2002-04-16 | Yates Foil Usa, Inc. | Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same |
US6497806B1 (en) * | 2000-04-25 | 2002-12-24 | Nippon Denkai, Ltd. | Method of producing a roughening-treated copper foil |
US20020182432A1 (en) * | 2000-04-05 | 2002-12-05 | Masaru Sakamoto | Laser hole drilling copper foil |
JP3628585B2 (ja) * | 2000-04-05 | 2005-03-16 | 株式会社日鉱マテリアルズ | 銅張り積層板及び銅張り積層板のレーザーによる穴開け方法 |
JP3690962B2 (ja) * | 2000-04-26 | 2005-08-31 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板 |
JP3429290B2 (ja) * | 2000-09-18 | 2003-07-22 | 日本電解株式会社 | 微細配線用銅箔の製造方法 |
JP4429539B2 (ja) * | 2001-02-16 | 2010-03-10 | 古河電気工業株式会社 | ファインパターン用電解銅箔 |
JP4798894B2 (ja) | 2001-08-20 | 2011-10-19 | Jx日鉱日石金属株式会社 | 積層板用銅合金箔 |
TW200404484A (en) * | 2002-09-02 | 2004-03-16 | Furukawa Circuit Foil | Copper foil for soft circuit board package module, for plasma display, or for radio-frequency printed circuit board |
TW200500199A (en) * | 2003-02-12 | 2005-01-01 | Furukawa Circuit Foil | Copper foil for fine patterned printed circuits and method of production of same |
KR101065758B1 (ko) * | 2003-02-27 | 2011-09-19 | 후루카와 덴키 고교 가부시키가이샤 | 전자파 실드용 동박, 그 제조방법 및 전자파 실드체 |
JP4833556B2 (ja) * | 2004-02-06 | 2011-12-07 | 古河電気工業株式会社 | 表面処理銅箔 |
JP2006103189A (ja) * | 2004-10-06 | 2006-04-20 | Furukawa Circuit Foil Kk | 表面処理銅箔並びに回路基板 |
US7976956B2 (en) * | 2005-08-01 | 2011-07-12 | Furukawa Circuit Foil., Ltd. | Laminated circuit board |
-
2005
- 2005-01-28 TW TW094102629A patent/TW200535259A/zh unknown
- 2005-02-03 CN CN2005100542538A patent/CN1657279B/zh active Active
- 2005-02-04 EP EP05002416A patent/EP1562413A3/en not_active Ceased
- 2005-02-04 KR KR1020050010353A patent/KR101129471B1/ko active IP Right Grant
- 2005-02-07 US US11/052,998 patent/US7381475B2/en not_active Expired - Fee Related
-
2009
- 2009-10-20 JP JP2009241107A patent/JP5367529B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003201597A (ja) | 2002-01-09 | 2003-07-18 | Nippon Denkai Kk | 銅箔とその製造方法及び該銅箔を用いた電磁波シールド体 |
JP2003239082A (ja) | 2002-02-18 | 2003-08-27 | Hitachi Cable Ltd | 樹脂接着用銅箔およびその製造方法 |
WO2003102277A1 (fr) * | 2002-06-04 | 2003-12-11 | Mitsui Mining & Smelting Co.,Ltd. | Feuille de cuivre traitee en surface pour substrat dielectrique faible, stratifie cuivre comportant cette feuille et carte a cablage imprime |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018004151A1 (ko) * | 2016-06-30 | 2018-01-04 | 일진머티리얼즈 주식회사 | 시인성이 향상된 표면처리동박 및 그의 제조방법 |
WO2018004152A1 (ko) * | 2016-06-30 | 2018-01-04 | 일진머티리얼즈 주식회사 | 후처리 후 에칭성이 우수한 표면처리동박 및 그 제조방법 |
KR20230129209A (ko) | 2016-11-01 | 2023-09-07 | 에스케이넥실리스 주식회사 | 표면처리 전해동박, 이의 제조방법, 및 이의 용도 |
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JP2010013738A (ja) | 2010-01-21 |
CN1657279A (zh) | 2005-08-24 |
TWI354034B (ko) | 2011-12-11 |
EP1562413A2 (en) | 2005-08-10 |
JP5367529B2 (ja) | 2013-12-11 |
US7381475B2 (en) | 2008-06-03 |
TW200535259A (en) | 2005-11-01 |
CN1657279B (zh) | 2011-07-27 |
EP1562413A3 (en) | 2008-04-02 |
KR20060041689A (ko) | 2006-05-12 |
US20050175826A1 (en) | 2005-08-11 |
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