JP6893572B2 - 表面処理銅箔の製造方法 - Google Patents
表面処理銅箔の製造方法 Download PDFInfo
- Publication number
- JP6893572B2 JP6893572B2 JP2020073991A JP2020073991A JP6893572B2 JP 6893572 B2 JP6893572 B2 JP 6893572B2 JP 2020073991 A JP2020073991 A JP 2020073991A JP 2020073991 A JP2020073991 A JP 2020073991A JP 6893572 B2 JP6893572 B2 JP 6893572B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- treated copper
- roughened
- treated
- present application
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 162
- 239000011889 copper foil Substances 0.000 title claims description 134
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- 238000007788 roughening Methods 0.000 claims description 24
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 20
- 230000003449 preventive effect Effects 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 11
- 239000008151 electrolyte solution Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 description 33
- 230000000052 comparative effect Effects 0.000 description 30
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 16
- 239000007788 liquid Substances 0.000 description 13
- 238000007747 plating Methods 0.000 description 13
- 230000005540 biological transmission Effects 0.000 description 11
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229910000990 Ni alloy Inorganic materials 0.000 description 5
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 5
- 230000008054 signal transmission Effects 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- 229920001353 Dextrin Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- HSSJULAPNNGXFW-UHFFFAOYSA-N [Co].[Zn] Chemical compound [Co].[Zn] HSSJULAPNNGXFW-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- WZJYKHNJTSNBHV-UHFFFAOYSA-N benzo[h]quinoline Chemical compound C1=CN=C2C3=CC=CC=C3C=CC2=C1 WZJYKHNJTSNBHV-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
- C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
表面粗さ(Rz)の評価: 上述の粗化処理前の電解銅箔及び表面処理銅箔の粗化面の表面粗さ(Ra、Rmax、Rz)は、先端のrが2μmのダイヤモンドスタイラスを備える触針式の表面粗さ計((株)小坂研究所製、商品名:SEF−30D)を用い、JIS B 0601:1982に準拠して測定した。
表面処理銅箔の製造: 比較例1では、実施例1の粗化処理条件において、電気量を50C/dm2とした以外は、実施例1と同様にして表面処理銅箔を製造し、比較例1に係る表面処理銅箔を得た。比較例1で得られた表面処理銅箔の走査型電子顕微鏡観察像を図2に比較例1として示す。
表面処理銅箔の製造: 比較例2では、実施例1の粗化処理の条件において、電気量を300C/dm2とした以外は、実施例1と同様にして表面処理銅箔を製造し、比較例2に係る表面処理銅箔を得た。比較例2で得られた表面処理銅箔の走査型電子顕微鏡観察像を図2に比較例2として示す。
比較例3では、特許文献2の実施例で採用した粗化処理条件を使用して、本件出願の実施例1と同様の電解銅箔に粗化処理を施した。即ち、以下のとおりである。
以下、実施例と比較例との対比を行うにあたり、以下の表1に実施例と比較例との評価結果を纏めて列挙する。
Claims (5)
- 前記粗化面の表面積比が1.7〜2.4である請求項1に記載の表面処理銅箔の製造方法。
- 前記粗化面に、防錆処理及びシランカップリング剤処理の少なくとも1種を施す請求項1又は請求項2に記載の表面処理銅箔の製造方法。
- 請求項1から請求項3のいずれか一項に記載の表面処理銅箔の製造方法を用いて得られた表面処理銅箔の粗化面と、絶縁樹脂基材とを張り合わせて得られることを特徴とする銅張積層板の製造方法。
- 請求項4に記載の銅張積層板の製造方法を用いて得られた銅張積層板を用いることを特徴とするプリント配線板の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013184092 | 2013-09-05 | ||
JP2013184092 | 2013-09-05 | ||
JP2015515307A JP6722452B2 (ja) | 2013-09-05 | 2014-09-02 | 表面処理銅箔、その表面処理銅箔を用いて得られる銅張積層板及びプリント配線板 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015515307A Division JP6722452B2 (ja) | 2013-09-05 | 2014-09-02 | 表面処理銅箔、その表面処理銅箔を用いて得られる銅張積層板及びプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020109216A JP2020109216A (ja) | 2020-07-16 |
JP6893572B2 true JP6893572B2 (ja) | 2021-06-23 |
Family
ID=52628391
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015515307A Active JP6722452B2 (ja) | 2013-09-05 | 2014-09-02 | 表面処理銅箔、その表面処理銅箔を用いて得られる銅張積層板及びプリント配線板 |
JP2020073991A Active JP6893572B2 (ja) | 2013-09-05 | 2020-04-17 | 表面処理銅箔の製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015515307A Active JP6722452B2 (ja) | 2013-09-05 | 2014-09-02 | 表面処理銅箔、その表面処理銅箔を用いて得られる銅張積層板及びプリント配線板 |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP6722452B2 (ja) |
TW (1) | TWI515342B (ja) |
WO (1) | WO2015033917A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107614760B (zh) | 2015-07-03 | 2018-07-13 | 三井金属矿业株式会社 | 粗糙化处理铜箔、覆铜层叠板和印刷电路板 |
JP7068341B2 (ja) * | 2017-12-26 | 2022-05-16 | Jx金属株式会社 | 放熱用銅箔及び放熱部材 |
TWI695898B (zh) | 2018-11-05 | 2020-06-11 | 金居開發股份有限公司 | 經微細粗糙化處理的電解銅箔以及使用其的覆銅基板 |
JP7453154B2 (ja) * | 2018-11-19 | 2024-03-19 | 三井金属鉱業株式会社 | 表面処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
JP7421208B2 (ja) | 2019-12-24 | 2024-01-24 | 日本電解株式会社 | 表面処理銅箔及びその製造方法 |
CN114514798B (zh) | 2020-06-11 | 2023-04-11 | 三井金属矿业株式会社 | 两面覆铜层叠板 |
WO2022209990A1 (ja) * | 2021-03-29 | 2022-10-06 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
CN118160417A (zh) | 2021-10-28 | 2024-06-07 | 三井金属矿业株式会社 | 双面覆铜层叠板、电容器元件和内置电容器的印刷电路板以及双面覆铜层叠板的制造方法 |
WO2024154742A1 (ja) * | 2023-01-16 | 2024-07-25 | 東洋鋼鈑株式会社 | ニッケルめっき金属板 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2563118B2 (ja) * | 1987-12-26 | 1996-12-11 | 日鉱金属株式会社 | フレキシブルプリント回路基板用銅又は銅合金素材及びその製造方法 |
JPH07273458A (ja) * | 1994-03-31 | 1995-10-20 | Hitachi Chem Co Ltd | 多層配線板の製造法 |
JP3709221B2 (ja) * | 1994-10-06 | 2005-10-26 | 古河サーキットフォイル株式会社 | 銅箔の表面粗化処理方法 |
JP3281783B2 (ja) * | 1995-12-06 | 2002-05-13 | 三井金属鉱業株式会社 | プリント配線板用銅箔、その製造法及び電解装置 |
JPH10212365A (ja) * | 1996-11-29 | 1998-08-11 | Mitsui Chem Inc | 樹脂成形体およびその製造方法 |
JPH10330983A (ja) * | 1997-05-30 | 1998-12-15 | Fukuda Metal Foil & Powder Co Ltd | 電解銅箔及びその製造方法 |
JPH11340596A (ja) * | 1998-05-21 | 1999-12-10 | Furukawa Electric Co Ltd:The | 印刷回路基板用の銅箔、および樹脂付き銅箔 |
JPH11340595A (ja) * | 1998-05-21 | 1999-12-10 | Furukawa Electric Co Ltd:The | 印刷回路基板用の銅箔、および樹脂付き銅箔 |
US6969557B2 (en) * | 2002-06-04 | 2005-11-29 | Mitsui Mining & Smelting Co., Ltd. | Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same |
JP4129166B2 (ja) * | 2002-10-29 | 2008-08-06 | 京セラ株式会社 | 電解銅箔、電解銅箔付きフィルム及び多層配線基板と、その製造方法 |
JP5116943B2 (ja) * | 2003-02-04 | 2013-01-09 | 古河電気工業株式会社 | 高周波回路用銅箔及びその製造方法 |
JP2005154815A (ja) * | 2003-11-21 | 2005-06-16 | Mitsui Mining & Smelting Co Ltd | 電解銅箔製造用銅電解液及び電解銅箔の製造方法 |
JP5090028B2 (ja) * | 2007-03-16 | 2012-12-05 | 福田金属箔粉工業株式会社 | リチウム二次電池負極集電体用銅箔およびその製造方法 |
JP5129642B2 (ja) * | 2007-04-19 | 2013-01-30 | 三井金属鉱業株式会社 | 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板 |
KR101570756B1 (ko) * | 2011-06-28 | 2015-11-23 | 후루카와 덴키 고교 가부시키가이샤 | 전해 동박, 상기 전해 동박을 사용한 배선판 및 플렉서블 배선판 |
JP5379928B2 (ja) * | 2011-06-30 | 2013-12-25 | 古河電気工業株式会社 | 電解銅箔、該電解銅箔の製造方法及び該電解銅箔を集電体とするリチウムイオン二次電池 |
KR20140054435A (ko) * | 2011-09-30 | 2014-05-08 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 수지와의 밀착성이 우수한 동박 및 그 제조 방법 그리고 그 전해 동박을 사용한 프린트 배선판 또는 전지용 부극재 |
JP5730742B2 (ja) * | 2011-10-25 | 2015-06-10 | 古河電気工業株式会社 | リチウムイオン二次電池用電解銅箔とその製造方法 |
JP2013133514A (ja) * | 2011-12-27 | 2013-07-08 | Furukawa Electric Co Ltd:The | 銅箔、二次電池の電極、二次電池、並びにプリント回路基板 |
-
2014
- 2014-08-29 TW TW103129858A patent/TWI515342B/zh active
- 2014-09-02 WO PCT/JP2014/073026 patent/WO2015033917A1/ja active Application Filing
- 2014-09-02 JP JP2015515307A patent/JP6722452B2/ja active Active
-
2020
- 2020-04-17 JP JP2020073991A patent/JP6893572B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
WO2015033917A1 (ja) | 2015-03-12 |
JPWO2015033917A1 (ja) | 2017-03-02 |
TW201512468A (zh) | 2015-04-01 |
JP2020109216A (ja) | 2020-07-16 |
JP6722452B2 (ja) | 2020-07-15 |
TWI515342B (zh) | 2016-01-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6893572B2 (ja) | 表面処理銅箔の製造方法 | |
KR101129471B1 (ko) | 표면처리동박 및 회로기판 | |
TWI619409B (zh) | 表面處理銅箔、積層板、印刷配線板、電子機器、附載體銅箔及印刷配線板之製造方法 | |
JP5129642B2 (ja) | 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板 | |
TWI509111B (zh) | Surface treatment of electrolytic copper foil, laminated board, and printed wiring board, electronic equipment | |
KR102274906B1 (ko) | 구리박 및 이것을 갖는 동장 적층판 | |
US20040241487A1 (en) | Electrodeposited copper foil with carrier foil | |
JP2006103189A (ja) | 表面処理銅箔並びに回路基板 | |
JP7374298B2 (ja) | 粗化処理銅箔、銅張積層板及びプリント配線板 | |
KR20180026584A (ko) | 수지와의 밀착성이 우수한 동박 및 그 제조 방법 그리고 그 전해 동박을 사용한 프린트 배선판 또는 전지용 부극재 | |
JP2017106068A (ja) | プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板 | |
JP2015124426A (ja) | 表面処理銅箔及び積層板 | |
KR102655111B1 (ko) | 표면처리 전해동박, 이의 제조방법, 및 이의 용도 | |
JP5532475B2 (ja) | 処理銅箔及び未処理銅箔の粗化処理方法並びに銅張積層板 | |
JP2017508890A (ja) | 銅箔、これを含む電気部品及び電池 | |
JP6687409B2 (ja) | 高彩度処理銅箔及び該処理銅箔を用いた銅張積層板並びに該処理銅箔の製造方法 | |
TW202030379A (zh) | 表面處理銅箔、覆銅積層板及印刷配線板 | |
JP4615226B2 (ja) | 基板用複合材及びそれを用いた回路基板 | |
JP6845382B1 (ja) | 表面処理銅箔、銅張積層板、及びプリント配線板 | |
KR20090084517A (ko) | 내열성과 내약품성이 개선된 인쇄회로용 동박 및 그제조방법 | |
JP6379055B2 (ja) | 表面処理銅箔及び積層板 | |
TWI819511B (zh) | 表面處理銅箔及使用該表面處理銅箔的覆銅層壓板以及印刷線路板 | |
TWI805902B (zh) | 表面處理銅箔、覆銅積層板及印刷線路板 | |
JP2005159239A (ja) | 高周波用銅箔、それを用いた銅張積層板 | |
US20240121902A1 (en) | Low-roughness surface-treated copper foil with low bending deformation, copper clad laminate comprising same, and printed wiring board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200417 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210209 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210225 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210305 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210507 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210601 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6893572 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |