TWI334160B - - Google Patents
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- Publication number
- TWI334160B TWI334160B TW092134803A TW92134803A TWI334160B TW I334160 B TWI334160 B TW I334160B TW 092134803 A TW092134803 A TW 092134803A TW 92134803 A TW92134803 A TW 92134803A TW I334160 B TWI334160 B TW I334160B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- liquid
- exposure apparatus
- recovery
- exposure
- Prior art date
Links
- 239000007788 liquid Substances 0.000 claims description 392
- 239000000758 substrate Substances 0.000 claims description 384
- 238000011084 recovery Methods 0.000 claims description 180
- 230000003287 optical effect Effects 0.000 claims description 108
- 238000000034 method Methods 0.000 claims description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 238000007654 immersion Methods 0.000 claims description 21
- 238000001179 sorption measurement Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000004064 recycling Methods 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims 3
- 239000012466 permeate Substances 0.000 claims 1
- 230000008685 targeting Effects 0.000 claims 1
- 238000012545 processing Methods 0.000 description 11
- 230000033001 locomotion Effects 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 238000005286 illumination Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 101000891579 Homo sapiens Microtubule-associated protein tau Proteins 0.000 description 3
- 102100040243 Microtubule-associated protein tau Human genes 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- OQCFWECOQNPQCG-UHFFFAOYSA-N 1,3,4,8-tetrahydropyrimido[4,5-c]oxazin-7-one Chemical compound C1CONC2=C1C=NC(=O)N2 OQCFWECOQNPQCG-UHFFFAOYSA-N 0.000 description 1
- 206010010071 Coma Diseases 0.000 description 1
- 101001077660 Homo sapiens Serine protease inhibitor Kazal-type 1 Proteins 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 102100025144 Serine protease inhibitor Kazal-type 1 Human genes 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000010627 cedar oil Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000010630 cinnamon oil Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000026676 system process Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002357958 | 2002-12-10 | ||
| JP2003296491 | 2003-08-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200425268A TW200425268A (en) | 2004-11-16 |
| TWI334160B true TWI334160B (cg-RX-API-DMAC7.html) | 2010-12-01 |
Family
ID=32510636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092134803A TW200425268A (en) | 2002-12-10 | 2003-12-10 | Exposure device and manufacturing method for device |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US20050219488A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1571695A4 (cg-RX-API-DMAC7.html) |
| JP (1) | JP4596077B2 (cg-RX-API-DMAC7.html) |
| KR (2) | KR20120127755A (cg-RX-API-DMAC7.html) |
| CN (2) | CN101852993A (cg-RX-API-DMAC7.html) |
| AU (1) | AU2003289236A1 (cg-RX-API-DMAC7.html) |
| SG (3) | SG157962A1 (cg-RX-API-DMAC7.html) |
| TW (1) | TW200425268A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2004053953A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (238)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG121818A1 (en) | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| CN100568101C (zh) | 2002-11-12 | 2009-12-09 | Asml荷兰有限公司 | 光刻装置和器件制造方法 |
| SG121822A1 (en) | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| CN101470360B (zh) | 2002-11-12 | 2013-07-24 | Asml荷兰有限公司 | 光刻装置和器件制造方法 |
| US9482966B2 (en) | 2002-11-12 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7110081B2 (en) | 2002-11-12 | 2006-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US10503084B2 (en) | 2002-11-12 | 2019-12-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7372541B2 (en) | 2002-11-12 | 2008-05-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| DE60335595D1 (de) | 2002-11-12 | 2011-02-17 | Asml Netherlands Bv | Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung |
| SG131766A1 (en) | 2002-11-18 | 2007-05-28 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| DE60319658T2 (de) | 2002-11-29 | 2009-04-02 | Asml Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung |
| SG157962A1 (en) * | 2002-12-10 | 2010-01-29 | Nikon Corp | Exposure apparatus and method for producing device |
| JP4529433B2 (ja) * | 2002-12-10 | 2010-08-25 | 株式会社ニコン | 露光装置及び露光方法、デバイス製造方法 |
| US7242455B2 (en) | 2002-12-10 | 2007-07-10 | Nikon Corporation | Exposure apparatus and method for producing device |
| EP2945016B1 (en) | 2003-02-26 | 2017-09-06 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
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-
2003
- 2003-12-08 SG SG200704279-9A patent/SG157962A1/en unknown
- 2003-12-08 CN CN201010155625A patent/CN101852993A/zh active Pending
- 2003-12-08 EP EP03777347A patent/EP1571695A4/en not_active Withdrawn
- 2003-12-08 SG SG200704278-1A patent/SG150388A1/en unknown
- 2003-12-08 CN CN200380105423XA patent/CN1723541B/zh not_active Expired - Fee Related
- 2003-12-08 WO PCT/JP2003/015666 patent/WO2004053953A1/ja not_active Ceased
- 2003-12-08 AU AU2003289236A patent/AU2003289236A1/en not_active Abandoned
- 2003-12-08 SG SG200704280-7A patent/SG158745A1/en unknown
- 2003-12-08 KR KR1020127029007A patent/KR20120127755A/ko not_active Ceased
- 2003-12-08 KR KR1020057009676A patent/KR20050062665A/ko not_active Abandoned
- 2003-12-10 TW TW092134803A patent/TW200425268A/zh not_active IP Right Cessation
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20050062665A (ko) | 2005-06-23 |
| EP1571695A1 (en) | 2005-09-07 |
| SG157962A1 (en) | 2010-01-29 |
| CN101852993A (zh) | 2010-10-06 |
| EP1571695A4 (en) | 2008-10-15 |
| JP2009105472A (ja) | 2009-05-14 |
| JP4596077B2 (ja) | 2010-12-08 |
| TW200425268A (en) | 2004-11-16 |
| US20060238730A1 (en) | 2006-10-26 |
| SG158745A1 (en) | 2010-02-26 |
| US20050219488A1 (en) | 2005-10-06 |
| US7589820B2 (en) | 2009-09-15 |
| US20090180089A1 (en) | 2009-07-16 |
| CN1723541A (zh) | 2006-01-18 |
| SG150388A1 (en) | 2009-03-30 |
| WO2004053953A1 (ja) | 2004-06-24 |
| CN1723541B (zh) | 2010-06-02 |
| KR20120127755A (ko) | 2012-11-23 |
| AU2003289236A1 (en) | 2004-06-30 |
| US8089611B2 (en) | 2012-01-03 |
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