CN106340478A - 晶圆喷淋装置的支撑台 - Google Patents

晶圆喷淋装置的支撑台 Download PDF

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Publication number
CN106340478A
CN106340478A CN201610881587.0A CN201610881587A CN106340478A CN 106340478 A CN106340478 A CN 106340478A CN 201610881587 A CN201610881587 A CN 201610881587A CN 106340478 A CN106340478 A CN 106340478A
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China
Prior art keywords
liquid
wafer
support bench
supporting table
spray
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CN201610881587.0A
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English (en)
Inventor
吕耀安
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WUXI HI-NANO TECHNOLOGY Co Ltd
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WUXI HI-NANO TECHNOLOGY Co Ltd
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Priority to CN201610881587.0A priority Critical patent/CN106340478A/zh
Publication of CN106340478A publication Critical patent/CN106340478A/zh
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Abstract

本发明涉及一种晶圆喷淋装置的支撑台，所述支撑台由多根支撑杆支撑，所述支撑杆固定安装于竖向气缸的活塞杆上端部，所述竖向气缸的缸体固定安装于气缸支撑台上；所述支撑台的外圈安装有一圈挡液环腔，支撑台中具有弧形导液腔，支撑台的上表面放置晶圆并设有漏液孔，所述弧形导液腔的外缘与所述挡液环腔连通，所述挡液环腔的底部连接有导出管。本发明用于晶圆喷淋时的支撑，采用气缸调节水平度，保证晶圆喷淋的均匀性，合理设置的挡液环腔及弧形导液腔，对喷淋废液的导流效果好。

Description

晶圆喷淋装置的支撑台
技术领域
本发明涉及集成电路技术领域，特别涉及晶圆的喷淋设备。
背景技术
半导体镀膜工艺中，通常采用喷淋头对着晶圆喷淋高温金属气体，为了保证喷淋的均匀性，需要将喷淋头整平，使得所有喷淋头与晶圆之间的距离相等。目前采用的喷淋结构，只能喷淋前对喷淋头的高度位置调节，而喷淋过程中无法实时调节，从而由于喷淋过程中喷淋头高度的变化，导致还存在喷淋不均匀的现象。
发明内容
针对现有技术存在的上述问题，申请人进行研究及改进，提供一种晶圆喷淋装置的支撑台，能实时调节喷淋高度，保证均匀喷淋。
为了解决上述问题，本发明采用如下方案：
一种晶圆喷淋装置的支撑台，所述支撑台由多根支撑杆支撑，所述支撑杆固定安装于竖向气缸的活塞杆上端部，所述竖向气缸的缸体固定安装于气缸支撑台上；所述支撑台的外圈安装有一圈挡液环腔，支撑台中具有弧形导液腔，支撑台的上表面放置晶圆并设有漏液孔，所述弧形导液腔的外缘与所述挡液环腔连通，所述挡液环腔的底部连接有导出管。
本发明的技术效果在于：
本发明用于晶圆喷淋时的支撑，采用气缸调节水平度，保证晶圆喷淋的均匀性，合理设置的挡液环腔及弧形导液腔，对喷淋废液的导流效果好。
附图说明
图1为本发明的结构示意图。
图中：1、支撑台；2、支撑杆；3、竖向气缸；4、气缸支撑台；5、挡液环腔；6、弧形导液腔；7、晶圆；8、导出管。
具体实施方式
下面结合附图对本发明的具体实施方式作进一步说明。
如图1所示，本实施例的晶圆喷淋装置的支撑台，支撑台1由多根支撑杆2支撑，支撑杆2固定安装于竖向气缸3的活塞杆上端部，竖向气缸3的缸体固定安装于气缸支撑台4上；支撑台1的外圈安装有一圈挡液环腔5，支撑台1中具有弧形导液腔6，支撑台1的上表面放置晶圆7并设有漏液孔，弧形导液腔6的外缘与挡液环腔5连通，挡液环腔5的底部连接有导出管8。通过竖向气缸3，可调节支撑台1的水平度，喷淋过程中保证始终处于水平状态，保证喷淋的均匀性；喷淋液进入弧形导液腔6中后，导入至边缘处，从挡液环腔5中导出。
以上所举实施例为本发明的较佳实施方式，仅用来方便说明本发明，并非对本发明作任何形式上的限制，任何所属技术领域中具有通常知识者，若在不脱离本发明所提技术特征的范围内，利用本发明所揭示技术内容所作出局部改动或修饰的等效实施例，并且未脱离本发明的技术特征内容，均仍属于本发明技术特征的范围内。

Claims (1)

1.一种晶圆喷淋装置的支撑台，其特征在于：所述支撑台(1)由多根支撑杆(2)支撑，所述支撑杆(2)固定安装于竖向气缸(3)的活塞杆上端部，所述竖向气缸(3)的缸体固定安装于气缸支撑台(4)上；所述支撑台(1)的外圈安装有一圈挡液环腔(5)，支撑台(1)中具有弧形导液腔(6)，支撑台(1)的上表面放置晶圆(7)并设有漏液孔，所述弧形导液腔(6)的外缘与所述挡液环腔(5)连通，所述挡液环腔(5)的底部连接有导出管(8)。
CN201610881587.0A 2016-10-09 2016-10-09 晶圆喷淋装置的支撑台 Withdrawn CN106340478A (zh)

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CN201610881587.0A CN106340478A (zh) 2016-10-09 2016-10-09 晶圆喷淋装置的支撑台

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CN201610881587.0A CN106340478A (zh) 2016-10-09 2016-10-09 晶圆喷淋装置的支撑台

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106931548A (zh) * 2017-03-02 2017-07-07 青岛海尔空调器有限总公司 溶液喷淋装置
CN107578975A (zh) * 2017-08-17 2018-01-12 北京北方华创微电子装备有限公司 反应腔室及半导体加工设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11297800A (ja) * 1998-04-09 1999-10-29 Nec Kyushu Ltd 半導体装置製造用装置
JP2003249536A (ja) * 2002-02-25 2003-09-05 Tokyo Electron Ltd 被処理体の支持機構及び支持方法
CN1723541A (zh) * 2002-12-10 2006-01-18 株式会社尼康 曝光装置和器件制造方法
US20080110397A1 (en) * 2006-11-10 2008-05-15 Hyoung Kyu Son Lift pin driving device and a flat panel display manufacturing apparatus having same
CN203134772U (zh) * 2013-01-22 2013-08-14 北京京东方光电科技有限公司 一种基板支撑装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11297800A (ja) * 1998-04-09 1999-10-29 Nec Kyushu Ltd 半導体装置製造用装置
JP2003249536A (ja) * 2002-02-25 2003-09-05 Tokyo Electron Ltd 被処理体の支持機構及び支持方法
CN1723541A (zh) * 2002-12-10 2006-01-18 株式会社尼康 曝光装置和器件制造方法
US20080110397A1 (en) * 2006-11-10 2008-05-15 Hyoung Kyu Son Lift pin driving device and a flat panel display manufacturing apparatus having same
CN203134772U (zh) * 2013-01-22 2013-08-14 北京京东方光电科技有限公司 一种基板支撑装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106931548A (zh) * 2017-03-02 2017-07-07 青岛海尔空调器有限总公司 溶液喷淋装置
CN107578975A (zh) * 2017-08-17 2018-01-12 北京北方华创微电子装备有限公司 反应腔室及半导体加工设备

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