TW200425268A - Exposure device and manufacturing method for device - Google Patents

Abstract

The present invention provides an exposure device, which can transfer the pattern in good precision and also eliminate the environmental variance even the liquid flows out from the substrate during using immersion method for the exposure processing; in which, the exposure device is filled with liquid 50 on partial imaging surface of the projected optical system PL; projecting the pattern on the substrate P through the liquid 50 and the projected optical system PL; thus, exposing the substrate. The present invention includes a recycling device 20 to recycle the liquid 50 flowing out from the substrate P.

Description

200425268 发明 、 Explanation of the invention: [Technical field to which the invention belongs] The present invention relates to the exposure of a pattern image projected by the projection optical system in a state where the image surface side of the projection optical system PL is filled with liquid in a state of liquid. Device and method for manufacturing element using the exposure device. [Prior Art] Semiconductor devices and liquid crystal display devices are manufactured using a so-called lithography method in which a pattern formed on a photomask is transferred onto a photosensitive substrate. The exposure device used in this lithography process has a mask supporting stage and a substrate supporting stage. While the mask stage and the substrate stage are sequentially moved, the mask pattern is transferred through the projection optical system. Printed to substrate. In recent years, in order to respond to the further accumulation of element patterns, the projection optical system has been required to have a more southern resolution. The resolution of the projection optical system is higher as the exposure wavelength used is shorter and the aperture number of the projection optical system is larger. Therefore, with the miniaturization of the integrated circuit, the exposure wavelength used by the projection exposure device becomes shorter every year, and the number of apertures of the projection optical system also increases. At present, although the exposure wavelength of 248nm of krF excimer laser is still the mainstream ', the shorter wavelength of 193nm of ArF excimer laser is becoming practical. Also, when performing exposure, the depth of focus (D0F) is very important as well as the resolution. The resolution R and the focal depth δ are defined by the following formulas, respectively. R = kl · λ / ΝΑ (1) δ = ± k2 · λ / ΝΑ2 (2) Here, λ is the exposure wavelength, NA is the number of apertures of the projection optical system, 200425268 kl, and k2 is the process coefficient. According to equations (1) and (2), in order to improve the resolution R, when the exposure wavelength λ is shortened and the aperture number να is increased, the depth of focus δ will be narrowed. If the depth of focus becomes too narrow, the surface of the substrate is intended to be narrowed. Aligning the image plane of the projection optical system will be very difficult, and there is a risk that the exposure operation margin will be insufficient. Therefore, as a method of substantially shortening the exposure wavelength and widening the focal depth, for example, an immersion method is proposed in International Publication No. 99/49504. This immersion method is to fill the space between the lower surface of the projection optical system and the surface of the wafer with liquid such as water or organic solvent. The wavelength of the light in the liquid by exposure is 1 / n times that of air (n series liquid (The refractive index is generally about 1.2 to 1.6)) to improve the resolution and expand the focal depth to about η times. However, in the aforementioned prior art, the following problems still exist. The above-mentioned prior art is partially filled with liquid between the lower surface of the image plane side of the projection optical system and the substrate (crystal circle), and no liquid will flow out of the substrate when the exposure area near the center of the substrate is exposed. However, as shown in the schematic diagram of FIG. 14, the peripheral region (edge region) E of the substrate ρ is moved to the projection region ιo of the projection optical system, and when the exposure of the edge region of the substrate ρ is performed, it also flows out to the substrate. ρ Outside. Leaving the outflowing liquid unattended will cause changes in the environment (humidity, etc.) of the substrate ρ, and cause the optical path of the interferometer (used to measure the position information of the substrate stage holding the substrate ρ) and various optical The refractive index in the optical path of the detection light of the detection device changes, and the desired pattern transfer accuracy may not be obtained. In addition, due to the outflow of liquid, rust problems will occur on mechanical parts used to hold the substrate 200425268 and the surrounding soil σ. Although it can also be considered to expose the peripheral region E of the substrate P to avoid liquid outflow, if the peripheral region i or E is subjected to an exposure process to form a pattern, it will be used in subsequent processes such as CMP (Chemical Mechanical * Grinding). For the polishing surface of the CMP device, a problem that a part of the wafer substrate P cannot be polished well may occur. Furthermore, if the outflowing liquid intrudes into the tube of the vacuum system (suction system), the vacuum system as a vacuum source may be damaged or malfunctioned. [Summary of the Invention] The present invention has been made in view of this, and an object thereof is to provide an exposure device capable of transferring a pattern with good accuracy, an exposure method, and an element using the exposure device when the projection optical system and the substrate are filled with liquid for exposure processing. Production method. In order to solve the above problems, the present invention uses the configurations shown in Figs. 1 to 13 corresponding to the embodiments. However, the bracket symbol of each element is merely an example of the element 'and does not limit the elements. According to an exposure apparatus (EX) according to a first embodiment of the present invention, a pattern image is transferred to a substrate (P) through a liquid (50) to expose the substrate, and is characterized by comprising: a projection optical system (PL); The pattern image is projected on the substrate; and the recovery device (20) is used to recover the liquid flowing out of the substrate. According to the invention, even if the liquid flows out of the substrate, the liquid flowing out will not be placed and will be recovered. Device recycling. Therefore, it is possible to suppress the change of the environment of the base 200425268 board, and to suppress the occurrence of rust and other undesirable conditions of the mechanical parts around the substrate stage used to hold the substrate. element. According to an exposure device (E ×) of the second embodiment of the present invention, a pattern image is transferred to a substrate (P) through a liquid (50) to expose the substrate, and particularly includes: a projection optical system (PL); Projecting a pattern image onto a substrate · The liquid supply device (1) 'is for supplying liquid from above the substrate; and a recovery device (2) is for recovering the liquid supplied by the liquid supply device (1); Liquid is recovered above the substrate. According to the present invention, the liquid can be recovered (suctioned) without going from above the substrate. Therefore, it is possible to prevent sound and vibration from being generated during substrate exposure. In addition, since the liquid flowing to the outside of the substrate is recovered by the recovery device, it is possible to prevent a change in the environment in which the substrate is located and the occurrence of corrosion of mechanical parts. Therefore, a pattern can be formed on the substrate with good accuracy, and a device having high pattern accuracy can be manufactured. According to an exposure device (E ×) of a third embodiment of the present invention, a pattern image is transferred to a substrate (ρ) through a liquid (50) to expose the substrate, and is characterized by comprising: a projection optical system (PL); The pattern image is projected onto the substrate; the suction system (24, 32, 33) has a suction port; and a recovery device recovers a liquid sucked from the suction port. According to the present invention, for example, even if the liquid flows out and flows into the suction port of the suction system 200425268, the liquid will be recovered to prevent the liquid from entering the vacuum source as the suction source. Therefore, even if the immersion exposure is performed, the function of the getter system can be ensured. "The substrate is accurately exposed with a high-precision pattern to manufacture the element. An exposure device according to the fourth embodiment of the present invention is a liquid (50) through The pattern image is transferred onto the substrate (p) to expose the substrate, and is characterized by: a projection optical system (PL) for projecting the pattern image onto the substrate; a substrate stage (PST) for holding the substrate; and recycling At least a part of the device (20) is arranged on the substrate table to recover the liquid. The exposure device of the present invention can prevent changes in the environment in which the substrate is located and corrosion of mechanical parts. According to the exposure method of the fifth embodiment of the present invention, a pattern image is transferred to a substrate through a liquid to expose the substrate, and is characterized by including: supplying liquid between the projection optical system and the substrate from above the substrate. A step of recovering the supplied liquid from outside the substrate and lower than the substrate; and a step of exposing the substrate during the supply and recovery of the liquid. The exposure method of this month, because the liquid is supplied from above the substrate during the immersion exposure, and the liquid is recovered below the position of the indicator on the substrate, so the sound and vibration can be effectively prevented during substrate exposure. The present invention further provides a device manufacturing method using the exposure apparatus (EX) in the form of any of the first to fourth implementations of 200425268. [Embodiment] Hereinafter, an exposure apparatus and a device manufacturing method of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. Fig. 1 is a schematic configuration diagram of an embodiment of an exposure apparatus of the present invention. "First Embodiment"

In FIG. 1, the exposure apparatus main body EX includes: a mask stage MST supporting the mask M, and a substrate stage PST supporting the substrate ρ. The mask μ supported by the mask stage MST is irradiated with the exposure light EL. Illumination optical system IL, a projection optical system pL for projecting a pattern image of a mask μ illuminated with exposure light EL onto a substrate ρ supported by a substrate stage PST, and a control device for overall control of the operation of the entire exposure device EX c〇NT. Here, in this embodiment, a scanning exposure device (a so-called

Sweep handle stepper) is taken as an example to explain. This type of exposure device is to make the photomask M and the substrate ρ face different from each other in the scanning direction. The formed pattern is exposed to the base

In the description of Pm, 'the photomask M and the substrate ρ are moved in the horizontal plane: the (scanning direction) is the χ-axis direction, and the direction orthogonal to the X-axis in the horizontal plane is the γ-axis direction (non-scanning direction). Take the direction perpendicular to the χ axis and the Υ4 direction and the axis a + & 忐 axis AX of the projection optical system PL as the quarterly direction. In addition, the directions around the χ-axis, γ-axis, direction, and Z-axis are respectively the and... Directions. In addition, the "substrate" package here refers to those who apply a photoresist on a semiconductor wafer, and the so-called "photomask" package = _; 12 200425268 Forms a reticle for reducing the element pattern projected onto the substrate.

Illumination optical system IL is used to illuminate the mask M supported by the mask carrier MST with the exposure light EL. It has an exposure light source and an optical integrator for uniformizing the illuminance of the light beam emitted by the exposure light source. Condensing lens, relay lens system 'and variable field diaphragm (for illuminating the exposure area EL on the illuminating area on the mask M for condensing the exposure light EL from the light to the integral thief Set in slit shape) and so on. The predetermined illumination area on the mask M is illuminated by the illumination optical system IL with exposure light EL having a uniform illumination distribution. The exposure light EL emitted from the illumination optical system IL is, for example, far-ultraviolet light (2 lines, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) such as ultraviolet rays (e.g., ultraviolet rays) emitted from a mercury lamp. DUV light) Vacuum ultraviolet light such as ArF excimer laser light (wavelength 193nm) and dagger laser light (wavelength 157nm). This embodiment uses excimer laser light. The photomask stage MST is used to support the photomask μ, and it can perform 2-dimensional movement and small rotations in the 0Z direction in a plane perpendicular to the optical axis AX of the projection optical system PL. The reticle stage MST is driven by a linear reticle stage drive device MSTD. The two-dimensional position and rotation angle of the photomask M on the photomask stage MST are measured by a laser interferometer, and the results are sent to the control unit CONT. The control device c nt drives the photomask stage driving device MSTD according to the measurement result of the laser interferometer, thereby positioning the photomask μ supported by the photomask stage MST. The projection optical system PL is used to project and expose the pattern of the mask μ to the substrate P at a predetermined projection magnification β, and is composed of a plurality of optical elements (lenses). This 2004 25268 and other optical elements are supported by a metal tube PK . In this embodiment, the 'projection magnification β is a reduction system such as 1/4 or 1/4. The projection optical system PL may be any of an equal magnification system and a magnification system, or may be configured using a mirror. In addition, on the front end side (substrate P side) of the projection optical system PL of this embodiment, the optical element (lens) 60 is exposed from the lens barrel ρκ. This optical element 60 is provided on the lens barrel ρκ in a manner capable of being detached (replaced). The substrate stage PST is used to support the substrate P, and is provided with a Z-stage 51 for holding the substrate ρ through the substrate holder to support The XY stage 52 of the Z stage, and the base 53 for holding the X stage 52. The substrate stage pST is driven by a substrate stage driving device PSTD such as a linear motor. The substrate stage driving device PSTD is controlled by a control device CONT. The Z stage 51 is driven to control the position (focus position) of the substrate ρ held by the z stage 51 in the z direction and the position of the 0X, direction. In addition, the position of the substrate ρ in the XY direction (position substantially parallel to the image plane of the projection optical system PL) is controlled by driving the XY stage 52. That is, the z-stage 51 controls the focus position and tilt angle of the substrate P, and aligns the surface of the substrate P with the image plane of the projection optical system PL by the autofocus method and the auto-leveling method. Positioning of the substrate ρ in the X-axis direction and the γ-axis direction. In addition, of course, the Z stage and the X stage may be integrated. The substrate stage PST (Z stage 51) is provided with a moving mirror 54 which moves relative to the projection optical system PL together with the substrate stage pST. A laser interferometer 55 is provided at a position facing the moving mirror 54. The two-dimensional position and rotation angle of the substrate p on the substrate stage PST are measured by the laser interferometer 55 in real time. 200425268: 'The measurement result is output to the control device ⑽T. The control system ⑽τ drives the substrate stage drive to set psTD according to the measurement result of the laser interferometer 55 to perform positioning of the substrate p supported by the substrate stage PST. In this embodiment, the exposure wavelength is substantially shortened to improve the resolution, and in order to substantially obtain a wider focus. Mining, and the immersion method was used. Therefore, at least while the pattern image of the photomask M is being transferred to the substrate p, the surface P of the substrate P and the substrate-side optical element (front end surface (lower surface) 7 of the lens) 7 of the projection optical system PL are filled with a predetermined liquid 5 〇 is filled. As described above, the lens 60 is exposed from the front end side of the projection optical system PL, and the liquid 50 only contacts the lens 60. Accordingly, the corrosion of the lens barrel ρκ made of metal can be prevented in this embodiment. Liquid 50 uses pure water. Pure water can not only penetrate ArF laser light. For example, when using ultraviolet band bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248nm) emitted from mercury lamps. ), Such as far-ultraviolet light (DUV light), as the exposure light el, the exposure light EL can be penetrated. The exposure device EX 'is provided with a liquid supply device 1 and a liquid recovery device 2', of which the liquid supply device 1 is used The predetermined liquid 50 is supplied to the space 5 6 between the front end surface of the projection optical system PL (the front end surface of the lens 60) 7 and the substrate p, and the liquid recovery device 2 is used to recover the empty 50 6 liquid 50. Liquid supply Device 1 'is used to The body 50 fills at least a portion between the projection optical system pl and the substrate P, and includes a container for storing the liquid 50, a pressure pump, and a temperature adjusting device (for adjusting the temperature of the liquid 50 supplied to the space 56). The liquid supply device 1 is connected to one end of the supply pipe 3, and the other end of the supply pipe 3 is connected to the supply nozzle 4. The liquid supply device 1 is connected through the supply pipe 3 and the supply nozzle 4 to supply liquid 50 to the space 56. The liquid recovery device 2 includes a suction spring and a container for storing the recovered liquid 50. The liquid recovery device 2 is connected to one end of the recovery tube 6 and the other end of the recovery tube 6 is connected to a recovery nozzle liquid recovery device. = The liquid M in the space 56 is recovered through the recovery pipe 6 and the recovery nozzle 5. When the liquid 50 is to be filled in the space 56, the control device cONT will drive the liquid supply, and the transmission through the supply pipe 3 and the supply nozzle 4 ' The air Fb1 56 supplies a predetermined amount of liquid 50 ′ per time and drives the liquid recovery device 2 to recover the predetermined amount of liquid 50 per unit time from the space 56 through the recovery pipe 6 and the recovery nozzle 5. According to this, in the projection optical system Before PL The space 56 between the surface 7 and the substrate p holds the liquid 50 'to form an immersed portion. Here, the control device 2 Nτ can arbitrarily set the liquid supply per unit time to the space M by controlling the liquid supply device i. The amount of liquid recovered from the substrate p per unit time can be arbitrarily set by controlling the liquid recovery device 2. The second figure 2 shows the lower part of the projection optical system pL of the exposure device Ex, the liquid supply device 1, and the liquid. A partially enlarged view of the drawing of the recycling device 2 and the like. In FIG. 2, the lens 60 of the lowermost end of the projection optical system PL has a front end portion 60A that leaves a required portion in the scanning direction and is formed in the γ direction (non-scanning). Direction) slender rectangle. During the scanning exposure, a part of the pattern image of the mask M is projected on a rectangular projection area directly below the front end portion 60A. The mask M is moved in an X direction (or + χ direction) at a speed of 1 relative to the projection optical system PL. The substrate P is synchronized with this and moves through the χγ stage 52 in the + 乂 direction (or -X direction) at a speed β · ν (β-based projection magnification). After the exposure to an exposure irradiation area is completed, the substrate P The stepping movement of P moves the next 16 200425268 exposure ik shot area to the scanning start position, and then sequentially exposes each exposure irradiation area in a step-and-scan manner. In the present embodiment, the flow direction of the liquid 50 is set in the same direction as the moving direction of the substrate p and the moving direction of the substrate P. FIG. 3 shows the lens μ of the projection optical system pL, the front end μα, the supply nozzle 4 (4A to 4C) for supplying the liquid 50 to the X-axis direction, and the recovery nozzle 5 (5A, 5 for the magic of the liquid 50). The positional relationship diagram. In FIG. 3, the shape of the front end portion 60A of the lens 60 is a slender rectangle in the γ-axis direction, and the front end portion of the lens 60 of the projection optical system PL is held in the X-axis direction. Three supply nozzles 4A ~ 4C are arranged on the + X direction side, and two recovery nozzles are arranged on the -X direction side, 5A, 5Bβ, and the supply nozzles M ~ are connected to the liquid supply device through the supply pipe 3 and the recovery nozzle 5A. 5b is connected to the liquid recovery device 2 through the recovery pipe 4. In addition, the supply nozzle 8A ~ is disposed at a position where the supply nozzles ο to 4C and the recovery nozzles 5A and 5B are rotated approximately by a degree relative to the center of the front end portion 60a. 8C and recovery nozzles 9A, 9b. Here ': = 4A ~ 4C and recovery nozzles 9A, 9B are arranged alternately in the Y-axis direction, ::: 8A-8C and recovery nozzles 5A, 5B are in the γ-axis direction, = — It is through the supply pipe 1. It is connected to the liquid supply device; 9A, 9B are connected to the liquid recovery device through the recovery pipe 11 as shown in the figure. 4 sides are provided for ... 3 ": In the direction of the two summer supply nozzles 13, 14 and the recovery nozzle 15 ★ nozzles and recovery 喈 1 + i Feng lb, 16. The precise direction of this supply is to move the substrate in the direction of step H (On the y-axis side, the liquid 50 can be stably supplied 17 between the projection optical system PL and the substrate P. End: The shape of the ΪΓ part is not particularly limited. For example, the liquid can be 5 ° for the first two pairs of mouths. Supply or recovery In addition, in order to be able to supply and recover liquid 50 in + χ direction #. ^ A door times 门-X direction, it is also possible to arrange the top and bottom of the recovery nozzle in order to arrange the 0. Next, referring to FIG. 5 and FIG. 6 ′, a real # ^ ρςτ ^. ^ Which is used to recover the recovery device 20 that flows out of the substrate p is described. FIG. 5 is a view of the Z stage 51 (on the substrate). A perspective view 'FIG. 6 is an enlarged sectional view of a main part. 7 * In FIG. 6, the recovery device 2G includes a liquid recovery member 21, and the periphery 51 is disposed around the substrate ρ held by the holder portion 57. = The absorption member 21 has a predetermined structure. A ring-shaped member having a width is arranged on the inside of the groove portion 23 formed in a ring shape. There is a halberd that is continuous with the groove portion 23. 51 疋 々 路 22, the bottom of the liquid absorbing member 21 disposed in the groove portion 23 is connected to Dilow and connected to the flow channel 22. The liquid absorbing member 21 ′ can be formed by, for example, Porous Zeng Yuchu Kong Beitao is composed of a porous material of 4. Or, = the forming material of the absorbing member 21 can also be a porous sponge. = The liquid absorbing member 21 formed of a porous material can maintain a predetermined value. On the Z-stage 51, between the liquid absorbing member 21 and the substrate ρ held by the holder portion 57, a 顼 邾 -shaped auxiliary plate portion M is provided, which surrounds the substrate P with a predetermined width. The periphery. Auxiliary plate portion | The south degree of the surface of Dy is set to be approximately the same as the surface height of the substrate p expected by the holder portion 57 of the “Z”. The auxiliary plate portion 59 ′ even the peripheral area of the substrate P (18 200425268 edge area) E is located below the lens 60 of the projection optical system pl, and can continue between the lens 6G of the projection optical system PL and the substrate p: the body 50. In addition, this auxiliary is surrounded by a predetermined width The liquid absorbing member 21 on the outer periphery of the plate portion 59 has a function of absorbing (recovering) the liquid 50 flowing out of the auxiliary plate portion 59 when the liquid recovery device 2 as the second recovery device cannot be completely recovered. The Z stage 51 is formed by a plurality of circular recesses formed to have substantially the same size as the substrate p, and is provided with a plurality of protruding portions 58 for supporting the back surface of the substrate p. These protruding portions 58 are respectively provided for adsorbing the substrate. The suction holes 24 of P. The suction holes 24 are respectively connected to the flow paths 25 ... formed in the Z stage 51, and a plurality of liquid recovery are formed near the outermost periphery of the holder portion 57 (circular recess). Hole 4 6. This liquid returns The receiving hole 46 is connected to the flow path 22 connected to the liquid absorption member 21. In addition, a flow path different from the flow path 22 connected to the liquid absorption member 21 (the groove portion 23) may be provided and connected to the liquid recovery hole 46. The flow path 22 respectively connected to the liquid absorbing member 21 and the liquid recovery hole 46 is connected to one end of a pipe 26 provided outside the z stage 51. On the other hand, the other end of the pipe 26 is provided through The first tank 27 and valve 28 outside the Z stage 51 are connected to the pump 29 of the suction device. The flow path 25 connected to the suction hole 24 is connected to the pipe 30 provided outside the z stage 51 On the other hand, the other end of the pipeline 30 is connected to the pump 33 of the suction device through the second groove 31 and the valve 32 provided outside the Z stage 51. The liquid recovery member 21 and the liquid recovery hole 46, The liquid flowing to the outside of the substrate p and the surrounding gas (air) are recovered together. The liquid flowing to the back side of the substrate 200425268 P is collected by the adsorption hole 24 together with the surrounding body f (cold milk). Recovery. These liquid recovery methods, ^ ^ 驰 # 谩 述. BY Liquid absorption member 2 1. Liquid recovery hole 46 and adsorption $ 9/1 private r ~> l The liquid (water) recovered from the attached hole 24 will be separated from the gas (air) and stored temporarily in the 2nd tank and 2nd tank respectively. The 2 tank 3 prevents the liquid from flowing into the vacuum pumps 29 and 33 as a vacuum source and prevents the vacuum pumps 29 and 33 from being damaged by the separation of the liquid gas. The i and the second tanks 27 and 31 are respectively provided with a discharge flow path 2 ? a, 3U, using a water level sensor, etc. 'When the liquid is stored in a predetermined amount, it is discharged from the discharge flow path 27a, 3u. In addition, a flow path 22 connected to the liquid absorption member 21 (the groove portion 23) can also be provided. (Slot 27, valve 28, vacuum pump 29) are connected to the liquid recovery hole 46 with different flow paths. In Fig. 5, a moving mirror 54x extending in the Y-axis direction is provided on the + X side end 邛 of the Z stage 51, and a moving mirror 54γ extending in the X-axis direction is provided on the γ side. The laser interferometer irradiates laser light on the moving mirrors 54 ×, 54Υ to detect the positions of the x-axis direction and the γ-axis direction of the substrate stage PST. Next, the procedure of exposing the pattern of the photomask M onto the substrate P using the above-mentioned exposure device EX will be described. After the photomask M is mounted on the photomask stage mst and the substrate P is mounted on the substrate stage PST, the 'control device CONT drives the liquid supply device 1 and the liquid recovery device 2' to form an immersion portion of the liquid 50 in the space 56. (Refer to FIG. 1) ° Then, the control device CONT illuminates the mask M with the exposure light EL using the illumination optical system IL, and projects the pattern image of the mask M through the projection optical system pL and the liquid 50 onto the substrate ρ. At this time, the liquid 50 is applied to the outside of the plate P by the liquid recovery device 2 while the exposure irradiation area near the center of the substrate p is exposed. The liquid is supplied by the liquid supply device for recycling, so it will not flow out to the base. On the other hand, as shown in Figure B, the glass is not exposed, because the edge area E of the substrate P is exposed to the lamp, and the projection is caused by wind. The submerged portion between W p M PL and the substrate p is located near the edge region F t of the substrate P. Although the liquid can be maintained between the projection light system ^ and the substrate p by the auxiliary plate portion 59, if the liquid 5

When a part flows out of the auxiliary plate portion 59, the outflowed BM is absorbed (recovered) by the liquid absorbing member 21. Here, the control device CONT starts driving the above-mentioned liquid supply device 丨 and the liquid recovery device 2 and starts the opening of the valve 28 and the driving of the pump 29. Therefore, the liquid 50 recovered by the liquid absorbing member 2 is sucked by the pump 29 of the suction device, passes through the flow path 22 and the pipe 26 with the surrounding air, and is sucked and collected in the first tank 27.

The liquid flowing out from the gap between the substrate P and the auxiliary plate portion 59 passes through the liquid recovery holes 46 provided on the back side of the substrate P, is sucked into the flow path 22 together with the surrounding air, and is recovered through the pipe 26 to The first slot 27. In addition, the liquid 50 flowing into the back side of the substrate p through the gap between the substrate P and the auxiliary plate portion 59 may flow into the suction hole 24 for holding and holding the substrate P. As described above, since the suction hole 24 is connected to the pump 33 of the suction device through the flow path 25, the pipe 30, and the second groove 31, the substrate p is adsorbed by the opening of the valve 32 and the driving of the pump 33. It is held on the Z stage 51, and the liquid 50 flowing into the adsorption hole 24 is collected into the second tank 31 through the flow path 25 and the pipeline 30. In other words, the "third recovery device for recovering the liquid 50 flowing into the adsorption hole 24" also includes the flow path 25, the pipeline 30, 21 200425268, the second tank 3, the head 32, the pump 33, and the drive control. These control devices are under review. The suction hole 24 at this time also functions as a liquid recovery hole (recovery device) provided on the back side of the substrate P. In addition, similar to the liquid recovery hole 46, the liquid (water) flowing around the back surface of the substrate P and the gas (air) on the back surface of the substrate p flows into the suction hole 24, and the liquid (water) is dropped into the second tank 3. ) Separated from gas (air). By periodically recovering the liquid stored in the second tank 31, the liquid is prevented from flowing into the truth as a vacuum source (33). In this way, the true U M is prevented. However, during the exposure processing of the edge region E of the substrate P, that is, when the immersion portion between the projection optical system PL and the substrate P is located near the edge of the substrate p, as described above, a portion of the liquid 5 () may flow out To the substrate ^ Bu side. In this embodiment, 'the control device looks at the immersed part located on the edge area E_ of the substrate p, and performs at least the following control, that is, controls the liquid supply device 1 to increase the liquid supply to the space 56 per unit time' or The liquid recovery device (second recovery device) is controlled to reduce the amount of liquid recovered from the space 56 per unit time, and even when the liquid flows out of the substrate ρ, the projection optical system PL and the substrate ρ can be sufficiently separated. The liquid 50 is filled. At this time, 'the control device c0NT' under the control of the above-mentioned increase in the liquid supply amount and the decrease in the liquid recovery amount 'can perform the liquid control device 1 and / or the liquid recovery device based on the position detection result of the substrate P of the laser interferometer. Control of 2 'Or, a detection device for detecting the amount of recovered (outflowing) liquid is provided in the i, the second tank 27, 32 or the pipeline 26' 30, etc., and the liquid is carried out based on the detection result of this detection device. Control device 22 200425268 1 and / or liquid recovery device 2 Also ‘本 贯 施 # 胄 的 胄 光 装 ^ Εχ is the so-called step-and-scan method. Therefore, when the substrate P is moved to the scanning direction " (-X direction) shown by arrow Xa (refer to Fig. 3) for scanning exposure, the supply pipe 3, the supply nozzles 4A to 4C, the recovery pipe 4, and The recovery nozzles 5A, 5B supply and recover the liquid 50 with the liquid supply device = 1 and the liquid supply device 2. That is, when the substrate P is moved in the X direction, the liquid 50 is supplied from the liquid supply device 1 through the supply pipe 3 and the supply nozzle 4 (乜 ~ 4C) to the projection optical system and the substrate P, and is recovered through The nozzles 5 (5A, 5B) and the recovery pipe 6 recover the liquid 50 to the liquid recovery device 2 and cause the liquid 50 to flow in the -X direction to fill the space between the lens 60 and the substrate P. On the other hand, when the substrate p is moved in the scanning direction (+ χ direction) indicated by the arrow Xb for scanning exposure, the supply pipe 10, the supply nozzles 8A to 8C, the recovery pipe U, and the recovery nozzles 9A to 9B are used. Liquid supply device 1 and liquid supply device 2 are used to supply and recover liquid 50. That is, when the substrate p is moved in the + X direction, the liquid 50 is supplied from the liquid supply device 1 through the supply pipe 10 and the supply nozzle g (8A to 8C) between the optical system PL and the substrate P. 'And the liquid 50 is recovered to the liquid recovery device 2 through the recovery nozzle 9 (ga 9B) and the recovery pipe 11, and the liquid 50 flows in the + X direction to fill the space between the lens 60 and the substrate P. In this way, the control device CONT uses the liquid supply device 1 and the liquid recovery device 2 to inject liquid 50 in the moving direction of the substrate P. At this time, for example, the liquid 50 supplied from the liquid supply device 1 through the supply nozzle 4 is sucked into the space 56 as the substrate p moves in the _X direction, so even if the supply of the liquid supply device 1 is small, b 1 is small. It can also easily supply the liquid 50 to the space 5 6. In addition to the 2004 2004268, the direction of the flow of the liquid 50 is switched by the visual direction. When the substrate ρ is scanned from any direction of + χ ° or X direction, the front end 7 of the lens 6G and the substrate ρ can be liquid 50. Fill in between to get high resolution and wide focal depth. As explained above, even if the liquid 50 flows out to the substrate? On the outside, the liquid 50 flowing out will not be placed and will be recovered by the recovery device 20. Therefore, 'in addition to suppressing changes in the environment where the substrate P is located, and because it can suppress the occurrence of rust, such as rust and money, on the mechanical parts surrounding the substrate P and the substrate PST, the pattern can be transferred to the substrate with good motion p, while manufacturing components with high-precision patterns. In addition, the liquid absorbing member 21 as the recovery device 20 is provided on the substrate stage PST, whereby the liquid 50 can be held (recovered) over a wide range. In addition, the pump 29 as a suction device is connected to the liquid absorbing member 21 through the flow path, whereby the liquid 50 absorbed by the liquid absorbing member 21 can be discharged to the outside of the substrate stage PST at any time. Therefore, it is possible to more surely suppress the change in the environment in which the substrate P is located, and it is possible to suppress the weight change of the substrate stage pST due to the liquid 50. In addition, the pump 29 may be stopped during the substrate exposure operation, and the liquid 50 flowing out of the substrate p may be held by the liquid absorbing member 21 or the like. After the substrate exposure is completed, the pump 29 is operated to discharge the liquid. On the other hand, instead of providing the pump 29, the liquid 50 recovered by the liquid absorbing member 21 may flow down into the tank 27 at its own weight. In addition, the liquid absorbing member 21 may be provided only on the substrate stage PST without providing the pump 29, the tank 27, and the flow path, and the liquid absorbing member 21 that has absorbed the liquid 50 may be replaced periodically (for example, each batch). . At this time, although the substrate stage 24 200425268 PST has a weight change due to the liquid 50, the stage control parameters can be changed according to the weight of the liquid 50 recovered by the liquid recovery member 21 to maintain the positioning accuracy of the stage. In addition, since the tanks 27 and 31 for separating liquid (water) and gas (air) are provided before the vacuum pumps 29 and 33 to prevent liquid from entering the vacuum pumps 29 and 33 ′, the failure and damage of the vacuum pumps 29 and 33 can be prevented. . In addition, the vacuum pumps 29 and 33 in the above embodiment may be arranged in the exposure device EZ, or may be arranged in a factory where the exposure device EXi is installed. In addition, in the above embodiment, the vacuum system (before the vacuum pump) of the recovery device 20 for recovering the liquid flowing out of the substrate p and the vacuum system for adsorbing and holding the substrate P are provided to separate the liquid ( Water) and gas (air) tank (tank), but the mechanism (liquid recovery tank, etc.) used to separate liquid (water) and gas (air) is not limited to this, but can also be installed in Suction system (vacuum system) connected to the suction port where liquid may enter. For example, it can be arranged in a gas recovery system (suction system) for a gas bearing, in a suction system for adsorbing and holding the substrate P on a substrate transfer arm, or in a suction system for adsorbing and holding a substrate holding member (can be mounted (Removed) in the suction system of the substrate stage. Regarding the gas recovery system (suction system) of the gas bearing, it is disclosed in, for example, JP-A-iUMggO. As for the absorbing system for adsorbing and holding the substrate p on the substrate transfer arm, JP-A-6-1818 Japanese Patent Publication No. 10-ll 676 () discloses a suction system for suction holding (detachable) a substrate holding member on a substrate stage. The application is disclosed in this application. To the extent permitted by the laws of the United States, the content of these US patents is cited as 25 200425268

Part of this " Children's Book of Records. In addition, in this embodiment, although a mechanism such as a tank that separates liquid (water) from gas (air) is applicable to an exposure device that forms an immersed area in a part of the substrate p and exposes the substrate p at the same time. An exposure device that moves a substrate stage in a liquid tank, or an exposure device that forms a liquid tank on a substrate stage and holds the substrate therein. The structure and exposure operation of an exposure device that moves a substrate stage in a liquid tank are disclosed in, for example, Japanese Patent Application Laid-Open No. 6_124873, and an exposure apparatus that forms a liquid tank on a substrate stage and holds a substrate therein. It is disclosed in Japanese Patent Application Laid-Open No. 10-3031 (U.S. Patent No. 5,825,043) that, within the scope of the law of the country where the application is filed, the content of these documents is used as part of this specification. In addition, in the above-mentioned embodiment, although the liquid absorbing member 21 is formed in a continuous loop that surrounds the entire periphery of the substrate P, it may be arranged at the base name pguan-partial portion or may be arranged at a discontinuous predetermined interval. In addition, although the liquid absorbing member 21 in this embodiment is formed in a ring shape, its shape can be arbitrarily set to a shape such as a rectangle.

The arrangement of the air outlets is not limited by the above embodiment. In the exposure of the substrate I, it is not necessary to cause the liquid supply device i and the liquid two device 2 to operate in parallel. As long as the exposure light between the projection optical system pL and the substrate p is filled with the liquid 50, either one can be stopped, or It is to stop the movement of both parties: As mentioned above, the advantage of this pure water is that the liquid 50 of the embodiment is composed of pure water. It can be easily obtained in large quantities in a semiconductor manufacturing plant. It has no adverse effect on the photoresist and optical elements (lenses) on the substrate P. In addition, 'pure water does not cause adverse effects on the environment, and since the content of impurities is extremely low', it is also possible to expect the cleaning effect on the surface of the substrate p and the surface of the optical element provided on the front end surface of the projection optical system PL.

Also, the refractive index η of pure water (water) on the exposure light EL having a wavelength of about 193 nm is considered to be about i 47 to 1.44, and ArF excimer laser light (wavelength is used as the light of the exposure light EL). In the case of i93nm), on the substrate P, the wavelength of 1 / n ', that is, the wavelength of i93nm is reduced to about 131 to 134nm by pure water, and high resolution can be obtained. In addition, since the depth of focus is approximately η times that in the air, that is, approximately 1.47 to 1.44 times, so long as the same depth of focus can be ensured when used in air. Time 'can further increase the aperture number of the projection optical system PL, and in this regard, it can also improve the resolution.

In the above embodiment, although the lens 60 is installed at the front end of the projection optical system PL, as an optical element installed at the front end of the projection optical system P1, it can also be used to adjust the optical characteristics of the projection optical system PL, such as adjusting aberration ( Spherical aberration, coma aberration, etc.). Alternatively, it may be a parallel plane plate that penetrates the exposure light EL every month b. If a parallel plane plate that is cheaper than a lens is used as the optical element in contact with the liquid 50, the transport, assembly, adjustment, etc. of the exposure device EX, even if the parallel plane plate is attached, will cause the transmittance and exposure of the projection optical system PL. When using a light EL on the substrate p and a substance having a reduced uniformity in illumination distribution (such as a silicon-based organic substance), it is only necessary to replace the parallel plane plate immediately before the liquid 50 is supplied, and a lens is used as the liquid 50 The situation of the contacted optical components is relatively low compared to the 'replacement cost' of 20042004268. That is, the scattered particles or liquid 5 generated from the photoresist by irradiation with chirped light. The attachment of impurities and other impurities will contaminate the optical element that is in contact with the liquid 50. The surface of the ta. ^^ piece surface is replaced during the shirting period, but if an inexpensive parallel flat plate is used as this optical element, it is compared with a lens Not only the replacement cost is low, but also the replacement cost can be shortened, and the maintenance cost (operating cost) can be reduced. Wang Ya's hand, because the pressure between the projection optical system element and the substrate P is relatively large due to the flow of the liquid 50, when the green is large, it is not necessary to replace the optical element. ≪ First learn 70 solid sturdy umbrellas to avoid movement due to the pressure. The liquid 50 in the above embodiment is water, but it can also be liquid other than water. For example, the light source of the exposure light EL is &; Laser, because 2: 2: Radiation does not penetrate water, so at this time, as liquid 50, you can use gaseous oil (gaseous liquid), or all chemical polymerization. (). In addition to "as a liquid 50", it is also possible to use those that have high transparency and high refractive index before exposure, and that have a stable photoresist on the surface of the projection optical system PL and the substrate P (such as fir oil). , Such as oil). "Second Embodiment" ~ Next, another embodiment of the exposure apparatus Ex of the present invention will be described with reference to Fig. 7. Here, "in the following description, the following description is the same as the above embodiment or has the same structure: points are assigned the same reference numerals, and their descriptions are simplified or omitted. The characteristic portion of the present embodiment is a component that replaces the liquid absorbing member 28 200425268 as a recovery device, and a liquid recovery tank 35 is provided around the substrate P, and the substrate port PST and the pipeline 26 can be freely connected and separated. In Fig. 7, the recovery device 2G is provided with a liquid recovery tank 35 formed on the Z stage 51 around the auxiliary plate portion 59 and having a predetermined width. A connection valve 36 is provided at one end of the flow path 22. On the other hand, at one end of the pipe support, a connection valve 37 is provided which can be connected to and disconnected from the connection valve 36. When the connection valves 36 and 37 are in the separated state, the ends of the flow path 22 are closed and the fluid 50 does not flow out of the stage. On the other hand, when the connection valve% and 37 are in the connected state, the end of the flow path 22 is in the open state, and the liquid 50 in the flow path µ can flow to the pipe 26. During the exposure process, the connection valve 37 is disconnected.

'In the exposure process, since the substrate stage chat and the pipeline 26 are separated, it is possible to smoothly move to the scanning direction (scanning movement), and move to the virtual non-scanning # (flowing out during stepping processing) The liquid to the outside of the base handle p flows in the liquid recovery tank 35 and the flow path 22.

After the exposure process is completed, the substrate stage PST is moved to the switching position (Load, UniOad) of the substrate p. At this substrate exchange position ', the connection valves 36, 37 are connected. When the connection valve%, 37 is connected, the control device ⑽τ will be opened 28 and the pump 29 will be driven. Thereby, the liquid 50 recovered to the liquid recovery tank 35 (as a recovery device) is discharged to the outside of the stage at the substrate exchange position. In addition, in the present practice, because the liquid 50 in the liquid recovery tank 35 was received by t% # periodically, such as each batch, it was discharged to the outside of the carrier, so the liquid recovery tank 35 size (volume), such as luxury. It is also the size that can store liquid equivalent to a batch of 29 200425268 parts. At this time, the county determines the relationship between the predetermined number of exposed processing substrates (that is, a batch) and the amount of liquid flowing out, and sets the size of the liquid recovery tank 35 based on the relationship obtained. Or, based on the relationship obtained above, set the time interval for connecting the connecting valves 36, 37 (that is, the timing of the action such as the liquid being discharged to the outside of the stage). In the above-mentioned embodiment, although the liquid recovery tank 35 is formed in a continuous ring shape that surrounds the entire periphery of the substrate P, it may be arranged at a part of the periphery of the substrate p or may be arranged at a discontinuous predetermined interval. In addition, although the liquid recovery tank 35 in this embodiment is formed in a ring shape, its shape can be arbitrarily set to a shape such as a rectangle. Furthermore, a liquid absorbing member may be disposed in the liquid recovery tank 35. In each of the above embodiments, although the auxiliary plate portion 59 is provided on the outside of the substrate p, the auxiliary plate portion 59 may not be provided, and the liquid recovery member 21 and the liquid recovery tank 35 may be provided near the outer periphery of the p. In addition, in the above embodiment, although a liquid-filled exposure device is partially used between the projection optical system and the substrate P, the present invention is shown in FIG. 6 and FIG. The liquid recovery mechanism that adsorbs and holds the substrate p) can also be applied to an immersion exposure device that moves the stage holding the substrate to be exposed in a liquid tank, or to form a liquid tank with a predetermined depth and force on the stage. An immersion exposure device in which a substrate is held. As described above, the structure and exposure operation of an immersion exposure device that moves a stage holding an exposure target substrate in a liquid bath is disclosed in, for example, Japanese Patent Application Laid-Open No. 6-124873. A structure of a liquid tank having a predetermined depth formed on a stage, an immersion exposure device holding a substrate therein, and a 200425268 2 operation 'are disclosed in, for example, Japanese Patent Application Laid-Open No. 3114 (U.S. Patent No. 5,825,043). "Third embodiment" &amp; The following "Mai Zhao Figures 8 to 10", another embodiment of the recovery device will be described. As shown in Fig. 8, the upper surface of the z stage 51 is inclined to hold the substrate P. The top of the portion 57 is horizontal. A liquid recovery tank is formed around the holder portion 57. At this time, although the liquid recovery tank 35 is annular in a plan view, it is inclined in a side view. That is, the liquid recovery tank 35 is formed along the inclination of the upper surface of the Z stage 51. With this, the liquid 50 discharged from the outside of the substrate P is naturally stored in the inclined lower portion 35A of the liquid recovery tank 35. When the liquid 50 is recovered, since only the liquid 50 stored in the inclined lower portion 35A is recovered, the recovery operation can be easily performed. As shown in Fig. 9 (a), a liquid recovery tank 35 is provided on a portion above the Z stage?. During the exposure process, the liquid 50 is accumulated in the liquid recovery tank 35. In addition, as shown in FIG. 9 (b), the liquid 50 accumulated in the liquid recovery tank 35 passes through the mounting device η (for loading or unloading the substrate P on the substrate stage PST or from the substrate stage PST). ) Of line 38 to recover. . Only when the exposure process is completed, and the conveying device is used to carry the substrate out of the substrate stage PST, and the substrate stage PST is started to be processed, the line 37 constituting a part of the suction device sucks the liquid accumulated in the liquid recovery tank 35 50. << Fourth Embodiment >> Hereinafter, another embodiment of the recovery device will be described. As shown in FIG. 31 200425268 10 (a), a liquid recovery tank is provided on the upper surface of the z stage 51. The receiving tank 35 is connected to the flow path 39 penetrating to the lower side of the Z stage 51. = A valve 39A is provided in port 3 of body 3. In addition, three flow paths 52 corresponding to the z-stage 51 and a flow path with through holes formed in the base 53 * u 5 41 〇 During the exposure process, the valve 39A is closed, as shown in FIG. 10 (a), ^ Stored in the liquid recovery tank 35 "Next, when the exposure process is completed, set the substrate stage PST to the substrate exchange, Ganji = 39A. In this way, as shown in Fig. 10 (b), the liquid recovery &gt; slave 50 is shifted to the position of the soil plate, and is discharged to the outside of the stage through the flow paths 39, M and 41 at its own weight. In addition, although the recovery of the liquid π in the liquid recovery tank 35 is preferably performed at the substrate exchange position, the discharge operation may be performed at a position different from the position where the substrate is changed. «Fifth Embodiment» In each of the above embodiments, the liquid supply device 丨 supplies the liquid 50 to the substrate ρ from above the substrate P through the supply nozzle 4, and the liquid recovery device 2 as the second recovery device is passed through the recovery nozzle 5 The liquid 50 on the substrate P is recovered above the substrate p, thereby forming an immersion area on a portion of the substrate p, but as shown in FIG. 11, the liquid recovery device 2 (recovery nozzle 5) may not be provided above the substrate p. And almost all the liquid 50 'supplied to the substrate p is recovered by the recovery device 20 provided on the substrate stage pst. Fig. 11 shows supply nozzles 4, 8 provided on both sides of the scanning direction (X-axis direction) of the projection area (optical element 60) of the projection optical system PL. When scanning the exposed substrate p to supply the liquid 50, the liquid can be supplied from any of the supply nozzles 4, 8 according to the moving direction of the substrate p 50 32 200425268, or the liquid can be supplied from both the supply nozzles 4, 8 at the same time. 50%. The liquid 50 supplied from the liquid supply Yuzhi 1 is enlarged on the substrate p, and a large immersion area can be formed. In addition, as shown in the perspective view of FIG. 12, the liquid 50 supplied to the substrate P flows to the outside of the substrate P, but on the substrate? In the surroundings, there is a recovery device 20 of a groove portion 23 (liquid absorbing member 21) provided as a recovery port to recover almost all of the liquid. Here, in the exposure process for the substrate p, the liquid 50 is continuously supplied to the substrate by the liquid supply device 1 so that a good immersion area is formed on the substrate P, and the substrate P can be caused by the supply of the liquid 50 The upper liquid 50 generates a flow, so that a fresh (clean) liquid 50 can be supplied to the substrate at any time, and the liquid 50 on the substrate p can flow to the groove portion 23. The liquid recovery device 2 of the above-mentioned second liquid recovery device sucks and recovers the liquid on the substrate P through the recovery nozzle 5 by using the true n-system suction above the substrate p, because the liquid (water) is recovered together with the gas (air). Therefore, when the liquid hits the inner wall of the recovery pipe 6, sound and vibration are generated. At this time, as in the embodiment shown in FIG. 11 and FIG. 12, the operation of sucking the recovered liquid 50 from above the substrate P is not performed, and only the recovery liquid 20 provided on the substrate stage PST is used to perform the liquid 5 The recovery of 〇 can prevent the sound and vibration from being generated during the exposure of the substrate P. In addition, when the present embodiment in which liquid is not recovered from above the substrate P is not used, as the recovery rack 20, a configuration other than that shown in Fig. 7 of the second embodiment can be used. In FIG. 7 ', since the vacuum system 29 does not attract the liquid recovered by the liquid recovery tank 35 during the exposure of the substrate P, it is more effective to suppress the sound and vibration accompanying the liquid suction. 33 200425268 In addition, as in the previously described embodiment, the liquid recovery device 2 that performs liquid recovery from above the substrate P through the recovery nozzle 5 does not operate the liquid recovery device 2 during the exposure of the substrate p, but only uses the recovery device. After the liquid is recovered, after the substrate p is exposed, the liquid recovery device 2 and the recovery device 20 may be used to recover the liquid 50. In this case, it is also possible to suppress the influence of sound and vibration accompanying the attraction (recovery) of the liquid during the exposure of the substrate P. a As the substrate P in each of the above embodiments, not only semiconductor wafers for semiconductor device manufacturing, but also glass substrates for display elements, ceramic wafers for thin-film magnetic heads, or photomasks or reticle used in exposure devices. Original plate (synthetic quartz, silicon wafer), etc. As the exposure device EX, in addition to a scanning type exposure device (scanning stepper) of a step &amp; scan method that scans the pattern of the exposure mask M by moving the mask M and the substrate p simultaneously. Step &amp; repeat projection exposure device (step &amp; repeat) method suitable for one-time exposure of the pattern of the photomask M under the stationary state of the photomask m and the substrate P Device). In addition, the present invention can also be applied to an exposure device of a step stitching method in which at least two patterns are partially overlapped and transferred on the substrate p. As a type of the exposure device EX, the present invention is not limited to an exposure device for manufacturing a semiconductor element that exposes a semiconductor element pattern to a substrate P, but can be widely applied to an exposure device for manufacturing a liquid crystal display element or a display. In order to manufacture a thin-film magnetic head, an exposure device such as a reticle or a reticle, a photomask, etc. 34 200425268 In addition, the present invention can also be applied to a two-stage type exposure device. Regarding the structure of the two-stage type exposure device And exposure actions, for example, have been disclosed in Japanese Patent Application Laid-open Nos. 10-16 and ㈣2 2 ㈣, No. 2000-505958, U.S. Patent Nos. 6,341,007, 6, and 6, In documents such as No. 6,549,269 and 6,59., 634, this case is under the national law of the applicant. To the extent permitted by the order, the disclosure of these US patents is used as part of this specification. When using a linear motor, you can use either a silent suspension type (using air bearings) or a magnetic suspension type (using Loosez force or reaction). Also, each stage pst, dark, can be Yes The type of guide rail movement or the type without guide rail can be used. Examples of the use of linear motors have been disclosed in U.S. Patent Nos. 623'853 and 5,528,118. 'Using the disclosure of these documents as part of this specification is a drive mechanism containing 0 PST and MST, and a magnet unit with two-dimensional magnets f and an armature unit with two-dimensional coils can be used to oppose 1 Use the electromagnetic force to drive the plane motors of each stage PST and MST. At this time, contact any of the magnetic unit and the armature unit to the stage PST and MST, and connect the magnet unit to the other unit of the armature unit. One side can be set on the moving surface side of the stage pST and MST. In addition to the reaction force generated by the movement of the substrate stage pst, it can be mechanically released to the ground using a frame wooden member to avoid transmission to the projection optics The processing method of this reaction force is disclosed in detail in, for example, Japanese 35 200425268 Patent Publication No. 8-1 66475 (U.S. Patent No. 5,528,118). This case is within the scope of the permission of the applicant country. , Referencing this The disclosed contents are provided as part of this specification. Also, 'the reaction force caused by the movement of the mask stage MST can be mechanically released to the ground using a frame member to avoid transmission to the projection optical system PL. This reaction The processing method of force is disclosed in detail in, for example, Japanese Patent Laid-Open No. 8-330224 (US Patent No. 5,874,820).

In the report, ‘this case is within the scope of the law of the applicant country, and the disclosure of the document is used as part of this specification. As mentioned above, the exposure device Eχ in the embodiment of the present case will include various sub-systems including the constituent elements exemplified in the scope of the patent application for this case to perform the steps to achieve mechanical precision and various electrical accuracy, including various sub-connections. Before the connection steps of the air pressure circuit, of course, there are various steps to the exposure device, and the accuracy of the device licks. Dust-free under the control of degree, etc. It is assembled and manufactured in a way that maintains the predetermined mechanical accuracy, electrical accuracy, and optical accuracy. In order to ensure the above-mentioned various accuracy, before and after this assembly, various optical systems are adjusted to achieve optical accuracy.

Adjustment. Various sub-systems are assembled to the exposure device, including mechanical connections, electrical circuits, and so on. The various sub-systems are the steps of assembling the sub-system to the exposure device. After the various sub-systems are turned over, they are comprehensively adjusted to ensure the screw, and the exposure device is manufactured better in temperature and reading room. @ Figure 13 The design steps of the micro-components are used to fabricate photomasks (micro-components such as reticle semiconductor components, such as functional and performance design steps 201, according to this 36 200425268 pieces) step 202 'manufacturing substrates (element substrates) Step 203, using the exposure device EX of the foregoing embodiment to expose the pattern of the photomask to the substrate exposure processing step 204, the component assembly step (cutting process, bonding process, packaging process) 205, inspection step 206 and manufacturing. According to the present invention, even if the liquid flows out, the discharged liquid will not be placed and will be recovered by a recovery device. Therefore, it is possible to prevent an adverse condition caused by the outflow of liquid, and to manufacture a device having high pattern accuracy. [Brief description of the drawings] (I) Schematic part Fig. 1 is a schematic configuration diagram showing an embodiment of the exposure apparatus of the present invention. Fig. 2 is a diagram showing the positional relationship between the front end of the projection optical system and the liquid supply device and the liquid recovery device. FIG. 3 is a diagram showing an example of the arrangement of the supply nozzle and the recovery nozzle. FIG. 4 is a diagram showing an example of the arrangement of the supply nozzle and the recovery nozzle. Fig. 5 is a perspective view showing an embodiment of a recovery device. Fig. 6 'is an enlarged sectional view of a main part showing an embodiment of the recovery device. Fig. 7 is an enlarged sectional view showing a main part of another embodiment of the recovery device. Fig. 8 is a perspective view showing another embodiment of the recovery device. Fig. 9 is a schematic sectional view showing another embodiment of the recovery device. 37 200425268 Fig. 10 is a schematic sectional view showing another embodiment of the recovery device. Fig. 11 is a diagram showing another embodiment of the liquid recovery operation of the recovery device. Fig. 12 is a diagram showing another embodiment of the liquid recovery operation of the recovery device. FIG. 13 is a flowchart showing a manufacturing example of a semiconductor device. % Fig. 14 is a diagram for explaining a conventional problem. (2) Symbols of components 1 Liquid supply mechanism 2 Liquid recovery mechanism 3, 10 Supply pipes 4 (4A to 4C), 8A to 8C, 13 Supply nozzles 5 (5A, 5B), 9A, 9B, 15, 16 Recovery nozzle 6 , 11 Recovery tube 7 Front end face of lens (lower side) 20 Recovery device 21 Liquid absorbing member 22, 25 Flow path 23 Slot part 24 Adsorber L 26, 30 Line 27 First slot 38 200425268 27A, 31A Flow path 28, 32 Valve 29, 33 Vacuum pump 31 Second tank 46 Liquid recovery hole 50 Liquid 51 Z stage 52 XY stage 53 Base 54 Moving mirror 55 Laser interferometer 56 Space 57 Holder portion 58 Projection portion 59 Auxiliary plate portion 60 Optical element ( Lens) 60A lens front end EX exposure device M mask MST mask stage MSTD mask stage drive P substrate PK lens barrel PL projection optical system

39 200425268 PST substrate stage PSTD substrate stage drive

40

Claims (1)

200425268 Patent application scope: 1 · An exposure device that transfers a pattern image onto a substrate through a liquid to expose the substrate, which is characterized by: a projection optical system that projects the pattern image onto a substrate; and a recycling device Is used to recover the liquid flowing out of the substrate. 2. The exposure device according to item 丨 of the patent application scope, which includes a substrate stage holding the substrate, and the recovery device has a recovery section provided on the substrate stage. 3. The exposure device according to item 2 of the scope of patent application, wherein the recovery section of the recovery device is arranged at least in a part of the periphery of the substrate holding section provided on the substrate stage. 4 · The exposure device according to item 2 of the patent application, wherein the recovery unit of the recovery device includes a liquid absorbing member arranged on the substrate stage. 5 · The exposure device according to item 4 of the patent application, wherein: The absorbing member includes a porous member. Body 6 · The exposure apparatus according to item 2 of the scope of patent application, wherein the recovered recovery portion 'includes a liquid recovery tank disposed on the substrate stage. 7 · The exposure device according to item 2 of the scope of the patent application, wherein the recycling portion 'includes a recycling hole disposed on the substrate stage. 8 · The exposure device according to item 2 of the patent application scope, wherein the recovery device recovers the substrate backside body that is held by the substrate stage. Night 9 · If the exposure device according to item 2 of the scope of patent application, the recovery 200425268 / set two in / when the substrate carrier reaches the substrate exchange position, the liquid recovered by the recovery unit is discharged. 10. The exposure device according to item 2 of the patent, which is provided with a suction device for suctioning the liquid recovered by the recovery section of the recovery unit. 11_ As mentioned in the patent, the exposure device of item 2 is provided, which is provided for receiving surgery. Container for liquid recovered by the recovery section of the Hai recovery device. 12 · If the patent application scope 1 item of the exposure device, it is equipped with a supply device to supply the liquid between the "Hai Ying film optical system and the substrate, when M only ~ photon system, and the immersion between the 4 and 4 substrates When the part is located at the periphery of the substrate, the supply device increases the supply of liquid. 13 The exposure device of item i in the patent scope of Shenyan has a second recovery device for recovering the liquid on the substrate. When the immersion part between the projection optical system and the substrate is located near the periphery of the substrate, the second recovery device reduces the liquid recovery amount. 14 · For the exposure device of the first scope of the patent application, wherein The substrate stage 'is equipped with an adsorption hole for holding and holding the substrate' and is equipped with a 帛 3 recovery device to recover the liquid flowing out of the substrate and flowing into the adsorption hole. 15 · Exposure to item 14 as in the scope of patent application A device, wherein the third recovery device is a separator for separating gas and liquid flowing from the adsorption hole. 16 · Exposure as described in item 1 of the scope of patent application The recovery device is equipped with a separator that separates the recovered liquid and the gas recovered with the liquid at the same time. 42 200425268 17 · The exposure device according to item 1 of the scope of patent application, which further includes The second recovery device 18 for recovering the liquid on the substrate above the substrate. The exposure device, such as the first item of the patent application scope, is provided with a liquid supply device for supplying liquid from above the substrate to the substrate, and for supplying the liquid to the substrate. Approximately all the liquid is recovered by the recovery device. 19 · An exposure device that transfers a pattern image onto a substrate through a liquid to expose the substrate, and includes: a projection optical system that projects the pattern image onto a substrate: a liquid supply device that is above the substrate Supply liquid; and a recovery device for recovering the liquid supplied by the liquid supply device; the recovery device does not recover liquid from above the substrate. 20 · An exposure device for transferring a pattern image onto a substrate through a liquid to expose the substrate, comprising: a projection optical system for projecting the pattern image onto the substrate; The suction system is provided with a suction port; and the recovery device is used to recover a liquid sucked from the suction port. 21 · The exposure device according to item 20 of the patent application range, wherein the recovery device 'separates the liquid and gas attracted from the suction port. 22 · The exposure device according to the scope of patent application No. 20, wherein the suction port is used to fix the object at a predetermined position. 23 · The exposure apparatus according to item 22 of the scope of patent application, further comprising a substrate stage, the object is a substrate, and the suction port is provided on the substrate stage for adsorbing and holding the substrate. 43 200425268 24 · An exposure device that transfers a pattern image onto a substrate through a liquid to expose the substrate, and is characterized by: a projection optical system that projects the pattern image onto a substrate; and a substrate stage that holds the A substrate; and a recovery device, at least a part of which is disposed on the substrate stage for liquid recovery. 25. The exposure device according to item 24 of the patent application range, wherein the recovery device recovers the liquid flowing to the back of the substrate. 26. The exposure apparatus according to item 24 of the patent application scope, wherein the recovery apparatus has a recovery section on the substrate stage. 27. The exposure apparatus according to item 26 of the patent application, wherein the substrate carrier has a holding portion for holding the back surface of the substrate, and the recovery device further includes another recovery portion in the holding portion. 28. The exposure apparatus of claim 24, wherein the recovery apparatus includes a liquid absorbing member. 29. The exposure apparatus according to item 24 of the scope of patent application, wherein the recovery unit has a groove portion provided on the substrate stage. 30. The exposure device according to item 24 of the patent application scope, wherein the recovery device has a separator for separating the recovered liquid and gas. 31. The exposure device according to item 24 of the patent application, wherein the liquid recovered by the recovery device is discharged when the substrate stage is moved to a predetermined position. 32. The exposure apparatus according to item 31 of the patent application scope, wherein the existing position includes a substrate exchange position. 200425268 33 · If the scope of patent application is "24-shaped exposure device", there is further an interferometer mirror provided on the substrate stage, and the liquid recovery part of the recovery device is located near the interferometer mirror. 34-A method for manufacturing a component, characterized in that it uses an exposure device in the scope of patent application. 35 · -An exposure method according to any one of 19, 20, and 24, wherein a pattern image is transferred to a substrate through a liquid to expose the substrate, and the method includes: supplying liquid to the projection from above the substrate A step of recovering the supplied liquid from the optical system and the substrate from a position lower than the substrate outside the substrate; and a step of exposing the substrate during the supply and recovery of the liquid. 36. The exposure method according to item 35 of the patent application scope, further comprising the step of recovering the supplied liquid from above the substrate. Pick up, schema: as next page 45