JP5445612B2 - Exposure apparatus, exposure method, and device manufacturing method - Google Patents

Description

  The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing method for exposing a substrate by irradiating a substrate with exposure light via a liquid.

Semiconductor devices and liquid crystal display devices are manufactured by a so-called photolithography technique in which a pattern formed on a mask is transferred onto a photosensitive substrate. An exposure apparatus used in this photolithography process has a mask stage for supporting a mask and a substrate stage for supporting a substrate, and a mask pattern is transferred via a projection optical system while sequentially moving the mask stage and the substrate stage. It is transferred to the substrate. In recent years, in order to cope with higher integration of device patterns, higher resolution of the projection optical system is desired. The resolution of the projection optical system becomes higher as the exposure wavelength used is shorter and the numerical aperture of the projection optical system is larger. Therefore, the exposure wavelength used in the exposure apparatus is shortened year by year, and the numerical aperture of the projection optical system is also increasing. The mainstream exposure wavelength is 248 nm of the KrF excimer laser, but the 193 nm of the shorter wavelength ArF excimer laser is also being put into practical use.
Also, when performing exposure, the depth of focus (DOF) is important as well as the resolution. The resolution R and the depth of focus δ are each expressed by the following equations.

R = k ₁ · λ / NA (1)
δ = ± k ₂ · λ / NA ² (2)
Here, λ is the exposure wavelength, NA is the numerical aperture of the projection optical system, and k ₁ and k ₂ are process coefficients. From the equations (1) and (2), it can be seen that the depth of focus δ becomes narrower when the exposure wavelength λ is shortened and the numerical aperture NA is increased in order to increase the resolution R.

  If the depth of focus δ becomes too narrow, it becomes difficult to match the substrate surface with the image plane of the projection optical system, and the margin during the exposure operation may be insufficient. Therefore, as a method for substantially shortening the exposure wavelength and increasing the depth of focus, for example, a liquid immersion method disclosed in Patent Document 1 below has been proposed. In this immersion method, a space between the lower surface of the projection optical system and the substrate surface is filled with a liquid such as water or an organic solvent to form an immersion region, and the wavelength of exposure light in the liquid is 1 / n of that in air. (Where n is the refractive index of the liquid, which is usually about 1.2 to 1.6), the resolution is improved, and the depth of focus is expanded about n times.

International Publication No. 99/49504

  Incidentally, as shown in the schematic diagram of FIG. 18, the edge region E of the substrate P may be exposed even in an exposure apparatus that employs a liquid immersion method. In this case, a part of the projection region 100 protrudes outside the substrate P, and the exposure light is also irradiated onto the substrate table 120 holding the substrate P. In the case of immersion exposure, a liquid immersion area is formed so as to cover the projection area 100, but when the edge area E is exposed, a part of the liquid immersion area protrudes outside the substrate P, Arranged on the substrate table 120. When various measurement members and measurement sensors are arranged around the substrate P on the substrate table 120, an immersion region is arranged on the substrate table 120 in order to use these measurement members and measurement sensors. Sometimes it is done. When a part of the liquid immersion area is arranged on the substrate table 120, there is a high possibility that the liquid remains on the substrate table 120. Due to the vaporization, for example, the environment (temperature, humidity) where the substrate P is placed is changed. There is a possibility that the exposure accuracy may deteriorate due to fluctuation, thermal deformation of the substrate table 120, or fluctuation of the optical path environment of various measurement light for measuring the position information of the substrate P. Further, after the remaining liquid is vaporized, a watermark (water mark) remains, which may cause contamination of the substrate P and the liquid, and may cause various measurement errors.

  The present invention has been made in view of such circumstances, and provides an exposure apparatus, an exposure method, and a device manufacturing method capable of preventing liquid from remaining and maintaining good exposure accuracy and measurement accuracy. Objective.

  In order to solve the above-described problems, the present invention adopts the following configuration corresponding to FIGS. 1 to 17 shown in the embodiment. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  The exposure apparatus (EX) of the present invention holds the substrate (P) in the exposure apparatus that exposes the substrate (P) by irradiating the substrate (P) with exposure light (EL) through the liquid (1). The substrate table (PT) is provided, and the substrate table (PT) is provided with a replaceable member (30) having at least a part of the surface (30A) of which is liquid repellent.

  The device manufacturing method of the present invention is characterized by using the above-described exposure apparatus.

  According to the present invention, since the liquid repellent member provided on the substrate table is provided to be replaceable, it can be replaced with a new liquid repellent member when the liquid repellent property of the member deteriorates. . Therefore, it can suppress that a liquid remains, and even if it remains, the liquid can be collect | recovered smoothly. Therefore, it is possible to prevent exposure accuracy and measurement accuracy from being deteriorated due to the remaining liquid, and it is possible to manufacture a device that can exhibit desired performance.

  The exposure method of the present invention is an exposure method in which exposure light (EL) is irradiated onto a substrate (P) through a projection optical system (PL) and a liquid (1), and the substrate (P) is subjected to immersion exposure. The substrate (P) is held by the substrate holding member (30), and the substrate holding member (30) has a flat portion (30A) that is substantially flush with the surface of the substrate (P) around the substrate (P). The substrate holding member (30) holding the substrate (P) is carried into the substrate stage (PST, PT), the substrate (P) carried on the substrate stage (PST, PT) is subjected to immersion exposure, and the immersion is performed. After the exposure is completed, the substrate holding member (30) holding the substrate (P) is unloaded from the substrate stage (PST, PT).

  The device manufacturing method of the present invention is characterized by using the exposure method described above.

  According to the present invention, a substrate holding member having a flat portion around a substrate is carried into and out of the substrate stage together with the substrate, so that the substrate holding member can be easily exchanged with the substrate stage together with the substrate. For example, even when the liquid repellency of the substrate holding member deteriorates, it can be easily replaced. In addition, since the substrate holding member has a flat portion around the substrate, when the substrate holding member is carried into the substrate stage together with the substrate and the edge region of the substrate is subjected to immersion exposure, the liquid immersion region Even if a part of the substrate protrudes outside the substrate, the shape of the immersion area is maintained by the flat part, and immersion exposure is performed with the liquid held well under the projection optical system without causing the liquid to flow out. Can do. Therefore, deterioration of exposure accuracy is prevented, and a device that exhibits desired performance can be manufactured.

  An exposure apparatus (EX) of the present invention is an exposure apparatus that exposes a substrate (P) by irradiating the substrate (P) with exposure light (EL) through the liquid (1), and an image of a pattern on the substrate. A projection optical system (PL) for projecting; and a movable stage (PST) movable relative to the projection optical system (PL); at least a part of the movable stage (PST) is liquid repellent A member (30, PH, 300, 400, 500) is provided, and the liquid repellent member is replaceable.

  According to the present invention, since the liquid repellent member provided on the moving stage is provided to be replaceable, it can be replaced with a new member when the liquid repellent property of the member deteriorates. The moving stage may be, for example, a substrate stage that holds and moves the substrate, or a measurement stage that includes measurement members such as various reference members and measurement sensors. Alternatively, both the substrate stage and the measurement stage may be provided as the moving stage. Furthermore, a plurality of substrate stages or a plurality of measurement stages may be provided as the moving stage.

  The exposure method of the present invention is an exposure method in which exposure light (EL) is irradiated onto a substrate (P) through a liquid (1) to perform immersion exposure on the substrate (P): the liquid (1) To at least a part of the substrate (P); irradiating the substrate (P) with exposure light (EL) through the liquid to subject the substrate to immersion exposure; and supplying the liquid The part of the exposure apparatus (30, 300, 400, 500) different from the substrate has liquid repellency, and the part of the exposure apparatus (30, 300, 400, 500) having the liquid repellency is changed to its liquid repellency. It includes replacement according to liquid deterioration.

    According to the present invention, although the portion of the exposure apparatus having liquid repellency is deteriorated by irradiation with ultraviolet light, the portion is replaced in accordance with the deterioration, so that the liquid can be prevented from remaining or leaking due to the deterioration. it can. The replacement of the part may be performed periodically, or may be performed based on the result of estimating or observing the deterioration state for each part.

  According to the present invention, it is possible to perform exposure processing while suppressing the outflow of liquid, and it is possible to prevent liquid from remaining, so that immersion exposure can be performed with high exposure accuracy.

It is a schematic block diagram which shows one Embodiment of the exposure apparatus of this invention. It is a schematic plan view which shows a liquid supply mechanism and a liquid recovery mechanism. It is a top view of a substrate table. It is a top view of the substrate table of the state holding the substrate. It is sectional drawing of a substrate table. It is a schematic diagram which shows that each member is detachable with respect to a substrate table. It is a schematic diagram which shows an example of operation | movement of the exposure apparatus of this invention. It is a schematic diagram which shows an example of operation | movement of the exposure apparatus of this invention. It is a top view which shows the board | substrate holding member currently conveyed by the conveying apparatus. It is sectional drawing which shows another Example of a substrate table. It is a schematic block diagram which shows another embodiment of the exposure apparatus of this invention. It is a figure which shows another Example of a board | substrate holding member. It is a schematic diagram which shows another example of operation | movement of the exposure apparatus of this invention. It is a schematic block diagram which shows another embodiment of the exposure apparatus of this invention. It is a schematic block diagram which shows another embodiment of the exposure apparatus of this invention. It is a schematic block diagram which shows another embodiment of the exposure apparatus of this invention. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device. It is a schematic diagram for demonstrating the conventional subject.

  The exposure apparatus according to the present invention will be described below with reference to the drawings. FIG. 1 is a schematic block diagram showing an embodiment of an exposure apparatus according to the present invention.

  In FIG. 1, an exposure apparatus EX uses a mask stage MST for supporting a mask M, a substrate stage PST for supporting a substrate P via a substrate table PT, and a mask M supported by the mask stage MST with exposure light EL. The overall operation of the illumination optical system IL that illuminates, the projection optical system PL that projects and exposes the pattern image of the mask M illuminated by the exposure light EL onto the substrate P supported by the substrate stage PST, and the overall operation of the exposure apparatus EX And a control device CONT.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to improve the resolution by substantially shortening the exposure wavelength and substantially increase the depth of focus. A liquid supply mechanism 10 for supplying the liquid 1 to the substrate P, and a liquid recovery mechanism 20 for recovering the liquid 1 on the substrate P. In the present embodiment, pure water is used as the liquid 1. The exposure apparatus EX transfers at least a part of the substrate P including the projection area AR1 of the projection optical system PL by the liquid 1 supplied from the liquid supply mechanism 10 while at least transferring the pattern image of the mask M onto the substrate P. The liquid immersion area AR2 is formed (locally). Specifically, the exposure apparatus EX fills the liquid 1 between the optical element 2 at the tip of the projection optical system PL and the surface (exposure surface) of the substrate P, and between the projection optical system PL and the substrate P. The pattern image of the mask M is projected onto the substrate P through the liquid 1 and the projection optical system PL, and the substrate P is exposed.

  Here, in the present embodiment, as the exposure apparatus EX, scanning exposure is performed in which the pattern formed on the mask M is exposed to the substrate P while the mask M and the substrate P are synchronously moved in different directions (reverse directions) in the scanning direction. A case where an apparatus (so-called scanning stepper) is used will be described as an example. In the following description, the direction that coincides with the optical axis AX of the projection optical system PL is the Z-axis direction, the synchronous movement direction (scanning direction) between the mask M and the substrate P in the plane perpendicular to the Z-axis direction is the X-axis direction, A direction (non-scanning direction) perpendicular to the Z-axis direction and the X-axis direction is defined as a Y-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively. Here, the “substrate” includes a semiconductor wafer coated with a photoresist, which is a photosensitive material, and the “mask” includes a reticle on which a device pattern to be reduced and projected on the substrate is formed.

The illumination optical system IL illuminates the mask M supported by the mask stage MST with the exposure light EL. From the exposure light source, the optical integrator that equalizes the illuminance of the light beam emitted from the exposure light source, and the optical integrator. A condenser lens for condensing the exposure light EL, a relay lens system, a variable field stop for setting the illumination area on the mask M by the exposure light EL in a slit shape, and the like. A predetermined illumination area on the mask M is illuminated with the exposure light EL having a uniform illuminance distribution by the illumination optical system IL. The exposure light EL emitted from the illumination optical system IL is, for example, far ultraviolet light (DUV light) such as emission lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp. Alternatively, vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In this embodiment, ArF excimer laser light is used. As described above, the liquid 1 in this embodiment is pure water, and can be transmitted even if the exposure light EL is ArF excimer laser light. The pure water can also transmit bright ultraviolet rays (g-rays, h-rays, i-rays) and far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm).

  The mask stage MST supports the mask M, and can move two-dimensionally in a plane perpendicular to the optical axis AX of the projection optical system PL, that is, in the XY plane, and can be slightly rotated in the θZ direction. The mask stage MST is driven by a mask stage driving device MSTD such as a linear motor. The mask stage driving device MSTD is controlled by the control device CONT. A movable mirror 50 is provided on the mask stage MST. A laser interferometer 51 is provided at a position facing the moving mirror 50. The two-dimensional position and rotation angle of the mask M on the mask stage MST are measured in real time by the laser interferometer 51, and the measurement result is output to the control device CONT. The control device CONT drives the mask stage driving device MSTD based on the measurement result of the laser interferometer 51, thereby positioning the mask M supported by the mask stage MST.

  The projection optical system PL projects and exposes the pattern of the mask M onto the substrate P at a predetermined projection magnification β, and includes a plurality of optical elements including an optical element (lens) 2 provided at the front end portion on the substrate P side. These optical elements are supported by a lens barrel PK. In the present embodiment, the projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4 or 1/5. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. The projection optical system PL may be any of a reflective system that does not include a refractive element, a refractive system that does not include a reflective element, and a catadioptric system that includes a refractive element and a reflective element. The optical element 2 at the tip of the projection optical system PL of the present embodiment is detachably (replaceable) with respect to the lens barrel PK, and the liquid 1 in the liquid immersion area AR2 comes into contact with the optical element 2. .

  The optical element 2 is made of meteorite. Since meteorite has high affinity with water, the liquid 1 can be brought into close contact with almost the entire liquid contact surface 2a of the optical element 2. That is, in this embodiment, since the liquid (water) 1 having high affinity with the liquid contact surface 2a of the optical element 2 is supplied, the adhesion between the liquid contact surface 2a of the optical element 2 and the liquid 1 is set. The optical path between the optical element 2 and the substrate P can be reliably filled with the liquid 1. The optical element 2 may be quartz having a high affinity with water. Further, the liquid contact surface 2a of the optical element 2 may be subjected to a hydrophilization (lyophilic treatment) to further increase the affinity with the liquid 1. Further, since the vicinity of the tip of the lens barrel PK is in contact with the liquid (water) 1, at least the vicinity of the tip is formed of a metal resistant to rust such as Ti (titanium).

  The substrate stage PST supports the substrate P. The Z stage 52 that holds the substrate P via the substrate table PT, the XY stage 53 that supports the Z stage 52, and the base 54 that supports the XY stage 53, It has. The substrate table PT holds the substrate P, and is provided on the substrate stage PST (Z stage 52). The substrate stage PST is driven by a substrate stage driving device PSTD such as a linear motor. The substrate stage driving device PSTD is controlled by the control device CONT. By driving the Z stage 52, the position in the Z-axis direction (focus position) of the substrate P held by the substrate table PT and the position in the θX and θY directions are controlled. Further, by driving the XY stage 53, the position of the substrate P in the XY direction (position in a direction substantially parallel to the image plane of the projection optical system PL) is controlled. That is, the Z stage 52 controls the focus position and tilt angle of the substrate P to align the surface of the substrate P with the image plane of the projection optical system PL by the autofocus method and the auto leveling method, and the XY stage 53 is the substrate P. Is positioned in the X-axis direction and the Y-axis direction. Needless to say, the Z stage and the XY stage may be provided integrally. As the configuration of the autofocus / leveling detection system, for example, the one disclosed in JP-A-8-37149 can be used.

  A movable mirror 55 is provided on the substrate stage PST (substrate table PT). A laser interferometer 56 is provided at a position facing the movable mirror 55. The two-dimensional position and rotation angle of the substrate P on the substrate stage PST (substrate table PT) are measured in real time by the laser interferometer 56, and the measurement result is output to the control device CONT. The controller CONT positions the substrate P supported by the substrate stage PST by driving the substrate stage drive device PSTD based on the measurement result of the laser interferometer 56.

  A substrate alignment system 350 that detects an alignment mark on the substrate P or a reference mark (described later) provided on the substrate stage PST (substrate table PT) is disposed above the vicinity of the substrate stage PST (substrate table PT). Yes. Further, in the vicinity of the mask stage MST, a mask alignment that uses light having the same wavelength as the exposure light EL and detects a reference mark on the substrate stage PST (substrate table PT) via the mask M and the projection optical system PL. A system 360 is provided. As the configuration of the substrate alignment system 350, the one disclosed in JP-A-4-65603 can be used, and the configuration of the mask alignment system 360 is disclosed in JP-A-7-176468. Can be used.

  On the substrate table PT, a plate member 30 surrounding the substrate P held on the substrate table PT is provided. The plate member 30 is a member different from the substrate table PT, is provided so as to be detachable from the substrate table PT, and can be exchanged. The plate member 30 has a flat surface (flat portion) 30A that is substantially flush with the surface of the substrate P held by the substrate table PT. The flat surface 30A is arranged around the substrate P held by the substrate table PT. Furthermore, a second plate member 32 having a flat surface 32A that is substantially flush with the flat surface 30A of the plate member 30 is provided outside the plate member 30 on the substrate table PT. The second plate member 32 is also provided so as to be removable from the substrate table PT and can be exchanged.

  The liquid supply mechanism 10 supplies a predetermined liquid 1 onto the substrate P, and flows to the first liquid supply unit 11 and the first liquid supply unit 11 and the second liquid supply unit 12 that can supply the liquid 1. A first supply member 13 having a supply port 13 </ b> A that is connected via a supply pipe 11 </ b> A having a path and supplies the liquid 1 delivered from the first liquid supply unit 11 onto the substrate P, and a second liquid supply unit 12. And a second supply member 14 having a supply port 14A for supplying the liquid 1 delivered from the second liquid supply unit 12 onto the substrate P. The first and second supply members 13 and 14 are disposed close to the surface of the substrate P, and are provided at different positions in the surface direction of the substrate P. Specifically, the first supply member 13 of the liquid supply mechanism 10 is provided on one side (−X side) in the scanning direction with respect to the projection area AR1, and the second supply member 14 is provided on the other side (+ X side). ing.

  Each of the first and second liquid supply units 11 and 12 includes a tank for storing the liquid 1, a pressurizing pump and the like (both not shown), and the supply pipes 11 </ b> A and 12 </ b> A and the supply members 13 and 14. The liquid 1 is supplied onto the substrate P via each. The liquid supply operations of the first and second liquid supply units 11 and 12 are controlled by the control device CONT, and the control device CONT uses the liquids per unit time on the substrate P by the first and second liquid supply units 11 and 12. The supply amount can be controlled independently. In addition, each of the first and second liquid supply units 11 and 12 has a liquid temperature adjusting mechanism, and the liquid 1 having substantially the same temperature (for example, 23 ° C.) as the temperature in the chamber in which the apparatus is accommodated is substrate. P is supplied on P. Note that the tanks, pressure pumps, and temperature adjustment mechanisms of the first and second liquid supply units 11 and 12 are not necessarily provided in the exposure apparatus EX, and the facilities such as a factory in which the exposure apparatus EX is installed are substituted. You can also

  The liquid recovery mechanism 20 recovers the liquid 1 on the substrate P, and includes first and second recovery members 23 and 24 having recovery ports 23A and 24A arranged close to the surface of the substrate P. First and second liquid recovery sections 21 and 22 connected to first and second recovery members 23 and 24 via recovery pipes 21A and 22A having flow paths, respectively. The first and second liquid recovery units 21 and 22 include, for example, a vacuum system (a suction device) such as a vacuum pump, a gas-liquid separator, a tank for storing the recovered liquid 1 (both not shown), The liquid 1 on the substrate P is recovered through the first and second recovery members 23 and 24 and the recovery tubes 21A and 22A. The liquid recovery operation of the first and second liquid recovery units 21 and 22 is controlled by the control device CONT, and the control device CONT can control the liquid recovery amount per unit time by the first and second liquid recovery units 21 and 22. is there. Note that the vacuum system, the gas-liquid separator, and the tank of the first and second liquid recovery units 21 and 22 are not necessarily provided in the exposure apparatus EX, and the facilities such as a factory in which the exposure apparatus EX is installed are substituted. You can also

  FIG. 2 is a plan view showing a schematic configuration of the liquid supply mechanism 10 and the liquid recovery mechanism 20. As shown in FIG. 2, the projection area AR <b> 1 of the projection optical system PL is set in a slit shape (rectangular shape) whose longitudinal direction is the Y-axis direction (non-scanning direction), and the liquid immersion area filled with the liquid 1. AR2 is formed on a part of the substrate P so as to include the projection area AR1. The first supply member 13 of the liquid supply mechanism 10 for forming the immersion area AR2 of the projection area AR1 is provided on one side (−X side) in the scanning direction with respect to the projection area AR1, and the second supply member 14 is provided. Is provided on the other side (+ X side).

  Each of the first and second supply members 13 and 14 is formed in a substantially arc shape in plan view, and the size of the supply ports 13A and 14A in the Y-axis direction is at least larger than the size of the projection area AR1 in the Y-axis direction. It is set to be. The supply ports 13A and 14A formed in a substantially arc shape in plan view are arranged so as to sandwich the projection area AR1 in the scanning direction (X-axis direction). The liquid supply mechanism 10 supplies the liquid 1 simultaneously on both sides of the projection area AR1 via the supply ports 13A and 14A of the first and second supply members 13 and 14.

  Each of the first and second recovery members 23 and 24 of the liquid recovery mechanism 20 has recovery ports 23A and 24A that are continuously formed in an arc shape so as to face the surface of the substrate P. The first and second recovery members 23 and 24 arranged so as to face each other form a substantially annular recovery port. The recovery ports 23A and 24A of the first and second recovery members 23 and 24 are arranged so as to surround the first and second supply members 13 and 14 of the liquid supply mechanism 10 and the projection area AR1.

  The liquid 1 supplied onto the substrate P from the supply ports 13A and 14A of the first and second supply members 13 and 14 is between the lower end surface of the front end portion (optical element 2) of the projection optical system PL and the substrate P. Supplied to spread out. Further, the liquid 1 that has flowed out of the first and second supply members 13 and 14 with respect to the projection area AR1 is disposed outside the projection area AR1 with respect to the first and second supply members 13 and 14. It is recovered from the recovery ports 23A and 24A of the first and second recovery members 23 and 24.

  In the present embodiment, when the substrate P is scanned and exposed, the liquid supply amount per unit time supplied from the front of the projection area AR1 in the scanning direction is set to be larger than the liquid supply amount supplied on the opposite side. For example, when the exposure processing is performed while moving the substrate P in the + X direction, the control device CONT sets the amount of liquid from the −X side (that is, the supply port 13A) to the projection area AR1 from the + X side (that is, the supply port 14A). On the other hand, when the exposure process is performed while moving the substrate P in the −X direction, the amount of liquid from the + X side is made larger than the amount of liquid from the −X side with respect to the projection area AR1. Further, with respect to the scanning direction, the liquid recovery amount per unit time before the projection area AR1 is set to be smaller than the liquid recovery amount on the opposite side. For example, when the substrate P is moving in the + X direction, the recovery amount from the + X side (that is, the recovery port 24A) with respect to the projection area AR1 is made larger than the recovery amount from the −X side (that is, the recovery port 23A).

  Note that the mechanism for locally forming the liquid immersion area AR2 on the substrate P (substrate stage PST) is not limited to the above, and for example, US Patent Publication No. 2004/020782 and International Publication No. 2004/055803. It is also possible to adopt the mechanism disclosed in the above.

  3 is a plan view of the substrate table PT as viewed from above, and FIG. 4 is a plan view of the substrate table PT holding the substrate P as viewed from above. 3 and 4, the movable mirror 55 is disposed at two mutually perpendicular edges of the substrate table PT having a rectangular shape in plan view. In addition, a recess 31 is formed in the substantially central portion of the substrate table PT, and a substrate holder PH constituting a part of the substrate table PT is disposed in the recess 31, and the substrate P is held by the substrate holder PH. The Around the substrate P (substrate holder PH), there is provided a plate member 30 having a flat surface 30A having the same height (level) as the surface of the substrate P. The plate member 30 is an annular member and is disposed so as to surround the substrate holder PH (substrate P). The plate member 30 is formed of a material having liquid repellency such as a fluoride such as polytetrafluoroethylene (Teflon (registered trademark)). Since the plate member 30 having the flat surface 30A substantially flush with the surface of the substrate P is provided around the substrate P, the image plane side of the projection optical system PL can be used even when the edge region E of the substrate P is subjected to immersion exposure. The liquid immersion area AR2 can be formed satisfactorily.

  If the immersion area AR2 can be formed so that the optical path space on the image plane side of the projection optical system PL is filled with the liquid 1, there is a step between the surface of the substrate P and the flat surface 30A of the plate member 30. For example, the flat surface 30A may be lower than the surface of the substrate P in the Z direction.

  As shown in FIGS. 1, 3 and 4, a second plate member 32 is provided outside the plate member 30 (substrate holder PH) on the substrate table PT. The second plate member 32 has a flat surface 32A having substantially the same height (the same surface) as the surface of the substrate P and the flat surface 30A of the plate member 30, and other than the substrate holder PH (substrate P) and the plate member 30. Is provided so as to cover the whole area of the upper surface of the substrate table PT. The second plate member 32 is also formed of a material having liquid repellency such as polytetrafluoroethylene.

  Note that the contact angle of the liquid 1 on the surface of the flat surface 30A of the plate member 30 and the contact angle of the liquid 1 on the surface of the flat surface 32A of the second plate member 32 are respectively in the initial state before the exposure light EL is irradiated. 110 ° is abnormal.

A plurality of openings 32K, 32L, and 32N are formed at predetermined positions of the second plate member 32. A reference member 300 is disposed in the opening 32K. The reference member 300 is provided with a reference mark PFM detected by the substrate alignment system 350 and a reference mark MFM detected by the mask alignment system 360 in a predetermined positional relationship.
Further, the upper surface 301A of the reference member 300 is substantially flat and may be used as a reference surface for a focus / leveling detection system. Further, the upper surface 301A of the reference member 300 is provided at substantially the same height (level) as the surface of the substrate P, the surface (flat surface) 30A of the plate member 30, and the surface (flat surface) 32A of the second plate member 32. Yes. The reference member 300 is formed in a rectangular shape in plan view, and a gap K is formed between the reference member 300 disposed in the opening 32K and the second plate member 32. In the present embodiment, the gap K is, for example, about 0.3 mm.

In the opening 32L, an uneven illuminance sensor 400 as disclosed in, for example, Japanese Patent Application Laid-Open No. 57-117238 is disposed as an optical sensor. The upper surface 401A of the illuminance unevenness sensor 400 is a substantially flat surface, and is provided at substantially the same height (level) as the substrate P surface, the surface 30A of the plate member 30, and the surface 32A of the second plate member 32. On the upper surface 401A of the illuminance unevenness sensor 400, a pinhole portion 470 through which light can pass is provided.
Of the upper surface 401A of the light transmissive upper plate 401, the portions other than the pinhole portion 470 are covered with a light shielding material such as chromium. The uneven illuminance sensor 400 (upper plate 401) is formed in a rectangular shape in plan view, and a gap L is provided between the uneven illuminance sensor 400 (upper plate 401) disposed in the opening 32L and the second plate member 32. Is formed. In the present embodiment, the gap L is, for example, about 0.3 mm.

The opening 32N is provided with an aerial image measurement sensor 500 as disclosed in, for example, JP-A-2002-14005 as an optical sensor. An upper surface 501A of the upper plate 501 of the aerial image measurement sensor 500 is a substantially flat surface, and may be used as a reference surface of a focus / leveling detection system. The surface of the substrate P, the surface 30 </ b> A of the plate member 30, and the surface 32 </ b> A of the second plate member 32 are provided at substantially the same height (level). On the upper surface 501A of the aerial image measurement sensor 500, a slit portion 570 capable of passing light is provided.
Of the upper surface 501A of the light transmissive upper plate 501, the portions other than the slit portion 570 are covered with a light shielding material such as chromium. The aerial image measurement sensor 500 (upper plate 501) is formed in a rectangular shape in plan view, and a gap N is formed between the aerial image measurement sensor 500 (upper plate 501) and the opening 32N. . In the present embodiment, the gap N is approximately the same as the manufacturing tolerance of the outer shape of the substrate P, for example, approximately 0.3 mm. Thus, the upper surface of the substrate table PT holding the substrate P is substantially flush with the entire surface.

  If the liquid immersion area AR2 can be formed so that the optical path space on the image plane side of the projection optical system PL is filled with the liquid 1, the flat surface 30A of the plate member 30 and the surface 32A of the second plate member 32 are used. There may be a step between the upper surface 301A of the reference member 300, the upper surface 401A of the illuminance unevenness sensor 400, and the upper surface 501A of the aerial image measurement sensor 500.

  Although not shown, the substrate table PT is also provided with a dose sensor (illuminance sensor) as disclosed in, for example, Japanese Patent Laid-Open No. 11-16816, and is formed on the second plate member 32. Arranged in the opening.

  Note that the measuring instrument mounted on the substrate table PT is not limited to the one described above, and various measuring instruments can be mounted as necessary. For example, the wavefront aberration measuring instrument may be disposed on the substrate table PT. Wavefront aberration measuring instruments are disclosed in, for example, International Publication No. 99/60361 (corresponding European Patent Publication No. 1,079,223) and US Pat. No. 6,650,399, which are designated in To the extent permitted by the laws and regulations of the selected country, the contents of these documents are incorporated into the text. Of course, a measuring instrument need not be mounted on the substrate table PT.

  Further, the flat surface 30A formed in an annular shape in the plate member 30 is formed to have a width that is at least larger than the projection area AR1 (see FIG. 4). Thereby, when the edge region E of the substrate P is exposed, the exposure light EL is not irradiated to the second plate member 32. Thereby, the deterioration of the liquid repellency of the second plate member 32 due to the exposure light irradiation can be suppressed, and the replacement frequency of the second plate member 32 is made lower than the replacement frequency of the plate member 30. Can do. Furthermore, the width of the flat surface 30A is preferably larger than the liquid immersion area AR2 formed on the image plane side of the projection optical system PL. Accordingly, when the edge region E of the substrate P is subjected to immersion exposure, the immersion region AR2 is disposed on the flat surface 30A of the plate member 30 and is not disposed on the second plate member 32. Therefore, the immersion region AR2 This prevents the liquid 1 from entering the gap G, which is the gap between the plate member 30 and the second plate member 32. Needless to say, the width of the flat surface 30A of the plate member 30 is not limited to these, and may be smaller than the liquid immersion area AR2.

  As shown in FIG. 3 and FIG. 5 which is an enlarged cross-sectional view of the main part of the substrate table PT holding the substrate P, the substrate holder PH constituting a part of the substrate table PT includes a substantially annular peripheral wall portion 33, A plurality of support portions 34 provided on the base portion 35 inside the peripheral wall portion 33 and supporting the substrate P, and a plurality of suction ports 41 arranged between the support portions 34 and holding the substrate P by suction are provided. I have. The support portion 34 and the suction port 41 are uniformly arranged inside the peripheral wall portion 33. In the figure, the upper end surface of the peripheral wall portion 33 has a relatively wide width, but actually has only a width of about 1 to 2 mm. In addition, the base portion 35 is provided with a hole portion 71 in which an elevating member 70 made of a pin member for elevating the substrate P is disposed. In this embodiment, the raising / lowering member 70 is provided in each of three places. The elevating member 70 is moved up and down by a driving device (not shown), and the control device CONT controls the elevating operation of the elevating member 70 via the driving device.

  Further, as shown in FIG. 5, a plurality of suction holes 72 for sucking and holding the plate member 30 with respect to the substrate table PT are provided at positions facing the lower surface of the plate member 30 on the upper surface of the substrate table PT. Is provided. Further, the substrate table PT is provided with elevating members 74 made of pin members for elevating the plate member 30 with respect to the substrate table PT at a plurality of positions (here, three locations). The elevating member 74 is moved up and down by a driving device (not shown), and the control device CONT controls the elevating operation of the elevating member 74 through the driving device (see FIG. 7D). Further, although not shown, a suction hole for sucking and holding the second plate member 32 with respect to the substrate table PT is provided at a position facing the lower surface of the second plate member 32 on the upper surface of the substrate table PT. A plurality are provided. The substrate table PT is provided with a plurality of elevating members that elevate and lower the second plate member 32 with respect to the substrate table PT.

  Since the second plate member 32 has a low replacement frequency as described above, the second plate member 32 may be fixed by screwing or the like instead of being suction-held on the substrate table PT, and the replacement operation may be performed manually. Further, the second plate member 32 may not be exchangeable. However, when using the reference member 300, the illuminance unevenness sensor 400, or the like, if the second plate member 32 is irradiated with the exposure light EL or the light having the same wavelength as the exposure light, the surface of the second plate member 32 is exposed. The liquid repellency may be deteriorated, and the same replacement frequency as that of the plate member 30 may be required.

  4 and 5, a predetermined gap A is formed between the side surface PB of the substrate P held by the substrate holder PH (substrate table PT) and the plate member 30.

FIG. 5 is an enlarged cross-sectional view of a main part of the substrate table PT holding the substrate P. In FIG. 5, a substrate holder PH for holding the substrate P is disposed inside the recess 31 of the substrate table PT.
The substrate table PT is formed such that when the substrate holder PH is disposed in the recess 31, the upper end surface 34A of the substrate holder PH is higher than the mounting surface PTa for the plate member 30 and the second plate member 32 of the substrate table PT. Has been. The peripheral wall portion 33 and the support portion 34 are provided on a substantially disc-shaped base portion 35 that constitutes a part of the substrate holder PH. Each of the support portions 34 has a trapezoidal shape in sectional view, and the substrate P is held by the upper end surfaces 34 </ b> A of the plurality of support portions 34 with the back surface PC thereof. Further, the upper surface 33A of the peripheral wall portion 33 is a flat surface. The height of the peripheral wall portion 33 is lower than the height of the support portion 34, and a gap B is formed between the substrate P and the peripheral wall portion 33. The gap B is smaller than the gap A between the plate member 30 and the side surface PB of the substrate P. A gap C is formed between the inner side surface 36 of the recess 31 and the side surface 37 of the substrate holder PH facing the inner side surface 36. Here, the diameter of the substrate holder PH is smaller than the diameter of the substrate P, and the gap A is smaller than the gap C. In this embodiment, the substrate P is not formed with a notch (orientation flat, notch, etc.) for alignment, the substrate P is substantially circular, and the gap A is 0.1 mm over the entire circumference. Since it is about 1.0 mm in this embodiment and about 0.3 mm, inflow of liquid can be prevented.
In addition, when the notch part is formed in the board | substrate P, the shape according to the notch part of the plate member 30 or the surrounding wall part 33 is provided, such as providing a projection part in the plate member 30 or the surrounding wall part 33 according to the notch part. You can do it. By doing so, the gap A can be secured between the substrate P and the plate member 30 even in the cutout portion of the substrate P.

  An inner step portion 30D is formed inside the plate member 30, and a support surface 30S facing the lower surface PB of the edge portion of the substrate P is formed by the inner step portion 30D. The plate member 30 can support the lower surface PB of the edge portion of the substrate P by the support surface 30S. Here, as shown in FIG. 5, there is a gap between the lower surface of the edge portion of the substrate P held by the substrate holder PH and the support surface 30S of the plate member 30 held by the mounting surface PTa of the substrate table PT. A gap D is formed. Thereby, it is possible to avoid the inconvenience that the plate member 30 (support surface 30S) hits the lower surface of the edge portion of the substrate P and the edge portion of the substrate P warps upward.

  An inner step 32D is formed on the inner side of the second plate member 32, and an outer step is formed on the outer side of the plate member 30 so as to correspond to the shape of the inner step 32D of the second plate member 32. 30F is formed. As a result, a part of the plate member 30 is placed on a part of the second plate member 32. A predetermined gap G is formed between the outer surface of the plate member 30 and the inner surface of the second plate member 32. The gap G in the present embodiment is, for example, about 0.3 mm, and the surface is sandwiched between the plate member 30 made of polytetrafluoroethylene having liquid repellency and the second plate member 32. Even if the liquid immersion area is formed at the boundary with the second plate member 32, the liquid can be prevented from entering the gap G.

Photoresist (photosensitive material) 90 is applied to the surface PA, which is the exposure surface of the substrate P.
In this embodiment, the photosensitive material 90 is a photosensitive material for ArF excimer laser (for example, TARF-P6100 manufactured by Tokyo Ohka Kogyo Co., Ltd.) and has liquid repellency (water repellency), and its contact angle is 70. It is about ~ 80 °.

  In the present embodiment, the side surface PB of the substrate P is subjected to liquid repellent treatment (water repellent treatment). Specifically, the photosensitive material 90 having liquid repellency is also applied to the side surface PB of the substrate P. Thereby, it is possible to prevent liquid from entering from the gap A between the plate member 30 having a liquid-repellent surface and the side surface of the substrate P. Further, the photosensitive material 90 is also applied to the back surface PC of the substrate P and subjected to a liquid repellent treatment.

  In the present embodiment, the placement surface PTa and the inner side surface 36 of the substrate table PT have liquid repellency. Furthermore, a part of the surface of the substrate holder PH is also subjected to a liquid repellent treatment to be liquid repellent. In the present embodiment, of the substrate holder PH, the upper surface 33A and the side surface 37 of the peripheral wall portion 33 have liquid repellency. As the liquid repellent treatment of the substrate table PT and the substrate holder PH, for example, a liquid repellent material such as a fluorine resin material or an acrylic resin material is applied, or a thin film made of the liquid repellent material is attached. As the liquid repellent material for making it liquid repellent, a material insoluble in the liquid 1 is used. Note that the entire substrate table PT and substrate holder PH may be formed of a material having liquid repellency (such as a fluorine-based resin).

  The first space 38 surrounded by the peripheral wall portion 33 of the substrate holder PH is made negative pressure by the suction device 40. The suction device 40 is formed inside the base portion 35, a plurality of suction ports 41 provided on the upper surface of the base portion 35 of the substrate holder PH, a vacuum portion 42 including a vacuum pump provided outside the substrate table PT, and a plurality of suction ports 40. Each of the suction ports 41 and a vacuum channel 42 are provided. The suction ports 41 are respectively provided at a plurality of predetermined positions other than the support portion 34 on the upper surface of the base portion 35. The suction device 40 sucks gas (air) inside the first space 38 formed between the peripheral wall portion 33, the base portion 35, and the substrate P supported by the support portion 34, and this first space 38. The substrate P is sucked and held on the support portion 34 by making the pressure negative. Since the gap B between the back surface PC of the substrate P and the upper surface 33A of the peripheral wall portion 33 is small, the negative pressure in the first space 38 is maintained.

  The liquid 1 that has flowed into the second space 39 between the inner side surface 36 of the recess 31 and the side surface 37 of the substrate holder PH is recovered by the recovery unit 60. In the present embodiment, the recovery unit 60 includes a tank 61 that can store the liquid 1 and a flow path 62 that is provided inside the substrate table PT and connects the space 39 and the external tank 61. The inner wall surface of the flow path 62 is also subjected to liquid repellent treatment. The liquid that has flowed into the space 39 is temporarily held on the substrate stage PST (substrate table PT) and discharged at a predetermined timing to an external tank or the like provided separately from the substrate stage PST. Good.

  The substrate table PT is formed with a flow path 45 that connects the second space 39 between the inner side surface 36 of the recess 31 and the side surface 37 of the substrate holder PH and a space outside the substrate table PT (atmospheric space). Yes. Gas (air) can flow between the second space 39 and the outside of the substrate table PT via the flow path 45, and the second space 39 is set to substantially atmospheric pressure.

  As shown in FIG. 6, the substrate holder PH, the plate member 30, and the second plate member 32 are independent components and are detachably attached to the substrate table PT. The contact surface 57 of the substrate table PT with the substrate holder PH is liquid repellent and liquid repellent, and the back surface 58 of the substrate holder PH, which is a contact surface with respect to the substrate table PT, is also liquid repellent and liquid repellent. It has sex. As described above, the liquid repellent treatment for the contact surface 57 and the back surface 58 can be performed by applying a liquid repellent material such as a fluorine resin material or an acrylic resin material.

  Next, a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described with reference to the schematic diagrams of FIGS.

  As shown in FIG. 7A, the plate member 30 is held by suction on the mounting surface PTa of the substrate table PT, and the second plate member 32 is also held by suction on the mounting surface PTa of the substrate table PT. . Then, the substrate P to be exposed is carried into the substrate table PT by the transfer arm (transfer device) 80. At this time, the elevating member 70 is raised, and the transfer arm 80 passes the substrate P to the elevating member 70 that is rising. The elevating member 74 is not raised. The elevating member 70 holds the substrate P delivered from the transfer arm 80 and descends. Accordingly, as shown in FIG. 7B, the substrate P is arranged inside the plate member 30 and is held by the substrate table PT (substrate holder PH). Then, as shown in FIG. 7C, the control device CONT supplies and recovers the liquid 1 by the liquid supply mechanism 10 and the liquid recovery mechanism 20, and the substrate P held by the substrate table PT and the projection optical system PL. The liquid immersion area AR2 of the liquid 1 is formed therebetween. Then, the control device CONT irradiates the substrate P with the exposure light EL via the projection optical system PL and the liquid 1, and performs immersion exposure while moving the substrate stage PST supporting the substrate P.

  By exposing the edge region E of the substrate P, the exposure light EL is irradiated onto the flat surface 30A of the plate member 30, and the liquid repellency of the flat surface 30A may deteriorate due to the irradiation of the exposure light EL. When the liquid repellency of the flat surface 30A is deteriorated, the liquid 1 in the liquid immersion area AR2 disposed on the flat surface 30A is likely to remain, which causes inconveniences such as causing an environmental change on which the substrate P is placed. Accordingly, the control device CONT responds to the deterioration of the liquid repellency of the plate member 30 (flat surface 30A) by replacing the plate member 30 with the new liquid repellency with a new plate member 30 (having sufficient liquid repellency). Replace with.

  Specifically, after the immersion exposure process is completed, the liquid 1 remaining on the substrate P or the flat surface 30A is recovered using the liquid recovery mechanism 20 or the like, and then the control is performed as shown in FIG. The device CONT lifts the elevating member 74 after releasing the suction and holding of the plate member 30. At this time, the suction holding of the substrate P by the substrate holder PH is also released. The elevating member 74 rises while supporting the lower surface of the plate member 30. At this time, the elevating member 70 does not rise. As a result, the plate member 30 is separated from the substrate table PT. At this time, since the support surface 30S of the plate member 30 supports the lower surface PB of the edge portion of the substrate P, the substrate P rises together with the plate member 30 and leaves the substrate table PT. As described above, the elevating member 74 constituting the detaching mechanism that detaches the plate member 30 from the substrate table PT can detach the plate member 30 from the substrate table PT together with the substrate P. Then, the transfer arm 80 enters between the plate member 30 raised by the elevating member 74 and the substrate table PT, and supports the lower surface of the plate member 30. Then, the transfer arm 80 carries the plate member 30 holding the substrate P out of the substrate table PT (substrate stage PST).

  The carried plate member 30 is replaced with a new plate member 30. Then, as shown in FIG. 8A, the control device CONT carries in a new plate member 30 holding the substrate P to be exposed to the substrate table PT (substrate stage PST) using the transfer arm 80. . At this time, the elevating member 74 is raised, and the transfer arm 80 passes the plate member 30 holding the substrate P to the ascending / lowering member 74. The elevating member 70 is not raised. The elevating member 74 holds and lowers the plate member 30 delivered from the transfer arm 80. Thereby, as shown in FIG. 8B, the plate member 30 holding the substrate P is arranged inside the second plate member 32 and is held by the substrate table PT (substrate holder PH). Then, as shown in FIG. 8C, the control device CONT supplies and recovers the liquid 1 by the liquid supply mechanism 10 and the liquid recovery mechanism 20, and the substrate P held by the substrate table PT and the projection optical system PL. The liquid immersion area AR2 of the liquid 1 is formed therebetween. Then, the control device CONT irradiates the substrate P with the exposure light EL via the projection optical system PL and the liquid 1, and performs immersion exposure while moving the substrate stage PST supporting the substrate P.

  When the liquid repellency of the plate member 30 has not yet deteriorated, after the liquid immersion exposure is completed, the liquid 1 remaining on the substrate P or the like is recovered using the liquid recovery mechanism 20 or the like, and then the control device CONT After releasing the suction and holding on the substrate P, the elevating member 70 is raised as shown in FIG. At this time, the plate member 30 is held by suction on the substrate table PT. The elevating member 70 rises while supporting the lower surface of the substrate P. At this time, the elevating member 74 does not rise. As a result, the substrate P is separated from the substrate table PT. Then, the transfer arm 80 enters between the substrate P raised by the elevating member 70 and the substrate table PT, and supports the lower surface of the substrate P. Then, the transfer arm 80 carries the substrate P out of the substrate table PT (substrate stage PST).

  As the transfer arm 80, a transfer arm for transferring the plate member 30 and a transfer arm for transferring the substrate P may be provided separately. However, as shown in FIG. Since the support surface 80A is formed to be large so that both the substrate P and the plate member 30 can be brought into contact with each other, both the substrate P and the plate member 30 can be supported. Both P and the plate member 30 can be conveyed.

  As described above, since the liquid-repellent plate members 30 and 32 provided on the substrate table PT are provided to be replaceable, a new plate member is obtained when the liquid repellency of the plate members 30 and 32 is deteriorated. The liquid repellency on the substrate table PT can be maintained only by exchanging with 30 and 32. When a liquid repellent material is applied to make the upper surfaces of the plate members 30 and 32 on the substrate table PT liquid-repellent, or when the plate members 30 and 32 are formed of a liquid repellent material, exposure light is irradiated. Then, the liquid repellency may deteriorate. In particular, when, for example, a fluorine-based resin is used as the liquid repellent material and ultraviolet light is used as the exposure light, the liquid repellency of the plate members 30 and 32 tends to deteriorate (easily lyophilic). Then, the liquid tends to remain on the plate members 30 and 32.

  On the other hand, in this embodiment, when the liquid repellency of the plate members 30 and 32 is deteriorated, the plate members 30 and 32 are replaced with new ones.

  Therefore, the liquid 1 can be prevented from remaining on the substrate table PT, and even if it remains, the liquid 1 can be smoothly recovered using the liquid recovery mechanism 20 or the like. Therefore, it is possible to prevent exposure accuracy from being deteriorated due to the remaining liquid 1, and to manufacture a device that can exhibit desired performance.

  Further, the plate member 30 having the flat portion 30A around the substrate P is carried into and out of the substrate table PT together with the substrate P, so that the plate member 30 can be easily exchanged with the substrate table PT together with the substrate P. can do. Further, since the plate member 30 has a flat surface 30A around the substrate P, when the plate member 30 is carried into the substrate table PT together with the substrate P and the edge region E of the substrate P is subjected to immersion exposure, Even if a part of the liquid immersion area AR2 of the liquid 1 protrudes outside the substrate P, the shape of the liquid immersion area AR2 is maintained by the flat surface 30A, and the image plane of the projection optical system PL does not cause the liquid 1 to flow out. Liquid immersion exposure can be performed while the liquid 1 is favorably held on the side.

  Since the inner step portion 30D is provided inside the plate member 30 to form the support surface 30S and the edge portion of the substrate lower surface PC can be supported, the plate member 30 can be simply held and moved. The substrate P can be moved together with 30. In addition, the inner step portion 30D forms a bent corner portion in a sectional view in the gap between the plate member 30 and the substrate P, so that the liquid 1 enters the gap A between the plate member 30 and the substrate P. Even in this case, the bent corner portion functions as a seal portion, and it is possible to prevent inconvenience that the liquid 1 enters the back surface PB side of the substrate P or the substrate stage PST (substrate table PT). Further, since the side surface PB of the substrate P is also subjected to the liquid repellent treatment, the infiltration of the liquid 1 from the gap A between the side surface PB of the substrate P and the plate member 30 can be further prevented.

  In addition, since the back surface PC of the substrate P and the upper surface 33A of the peripheral wall portion 33 facing the substrate P are made liquid repellent, it is possible to prevent the inconvenience of the liquid 1 entering the first space 38 through the gap B. Therefore, it is possible to avoid the inconvenience of the liquid 1 flowing into the suction port 41 and to perform the exposure process with the substrate P being satisfactorily held by suction.

  Further, in the present embodiment, the liquid repellent treatment is applied to the back surface 58 of the substrate holder PH that can be attached to and detached from the substrate table PT, and the contact surface 57 of the substrate table PT with the substrate holder PH, whereby the second space Even when the liquid 1 flows into 39, the inflow of the liquid 1 between the back surface 58 of the substrate holder PH and the contact surface 57 of the Z stage 52 can be suppressed. Therefore, it is possible to prevent the occurrence of rust on the back surface 58 of the substrate holder PH and the contact surface 57 of the substrate table PT. In addition, when the liquid 1 enters between the back surface 58 of the substrate holder PH and the contact surface 57 of the substrate table PT, a situation occurs in which the substrate holder PH and the Z stage 52 are difficult to adhere and separate from each other. This makes it easier to separate.

  Further, as the attachment / detachment mechanism for attaching / detaching the plate member 30 to / from the substrate table PT, the lifting member 74 as the lifting device and the suction hole 72 as the suction holding device for sucking and holding the plate member 30 are provided. The replacement operation of the member 30 can be performed smoothly, and the new plate member 30 after replacement can be favorably held on the substrate table PT.

  Further, the inner step 32D is formed inside the second plate member 32, and the outer step 30F is formed outside the plate member 30, so that the gap between the plate member 30 and the second plate member 32 is also increased. Since the bent corner portion is formed in the cross-sectional view, even when the liquid 1 enters from the gap G, the bent corner portion functions as a seal portion, and the inconvenience of reaching the inside of the substrate table PT can be prevented.

  Further, since the outer step portion 30F of the plate member 30 can be supported by the inner step portion 32D of the second plate member 32, if the second plate member 32 is sucked and held by the substrate table PT, the plate member 30 becomes the first member. Since it is supported by the two-plate member 32, it does not necessarily have to be held by the substrate table PT. Therefore, as shown in the schematic diagram of FIG. 10, a space portion (surrounding) 130 can be formed in a region of the substrate table PT facing the plate member 30, and the substrate table PT (substrate stage PST) can be reduced in weight. Can be achieved.

  Further, since the substrate P is transported by the transport arm 80 while being held by the plate member 30, the substrate P is supported by the plate member 30 over a relatively wide area. Therefore, even if the substrate P is enlarged, for example, the substrate P can be conveyed while being held by the plate member 30 to suppress the bending (warp) of the substrate P.

  In addition, when the liquid repellency of the flat surface 32A of the second plate member 32 is deteriorated and the second plate member 32 is replaced, the second plate member 32 supports the plate member 30. After the immersion exposure, the transfer arm 80 may be used to carry out the substrate P and the plate member 30 together. In this case, similarly to the elevating member 74, an elevating member for elevating the second plate member 32 may be provided. Further, the plate member 30 and the second plate member 32 may be separately carried out and carried in without providing the inner step portion 32D of the second plate member 32. In this case, you may further provide the conveyance mechanism for carrying out and carrying in the 2nd plate member 32. FIG.

In addition, the replacement timing of the plate members 30 and 32 is determined according to the deterioration of the liquid repellency of the flat surfaces 30A and 32A as described above. As a timing for exchanging the plate members 30 and 32, for example, the plate members 30 and 32 can be exchanged at predetermined intervals such as every predetermined number of processed substrates or every predetermined time interval. Alternatively, the relationship between the irradiation amount (irradiation time, illuminance) of the exposure light EL and the liquid repellency level of the plate members 30 and 32 is obtained in advance by experiments and simulations, and based on the obtained results, The timing for exchanging 32 may be set. Evaluation of the deterioration of the liquid repellency is performed by, for example, observing the flat surfaces 30A and 32A with a microscope or visually, suspending a droplet on the evaluation surface and observing the state of the droplet visually or with a microscope, or contact of a droplet This can be done by measuring the corners.
Such an evaluation is recorded in advance in the control device CONT in relation to the integrated dose of ultraviolet rays such as exposure light, whereby the life of the plate members 30, 32, that is, the replacement time (timing) is controlled from that relationship. The device CONT can be determined.

  Further, the exposure apparatus EX uses an integrator sensor (not shown) that can measure the intensity of the exposure light EL irradiated to the image plane side of the projection optical system PL, and uses the exposure light EL irradiated to the plate members 30 and 32. The integrated dose can be determined. The control device CONT irradiates the plate member 30 and the plate member 32 based on the position information of the substrate stage PST measured using the laser interferometer 56 and the intensity information of the exposure light EL measured using the integrator sensor. Since the intensity and irradiation time (number of irradiation pulses) of the exposed exposure light EL can be measured, the integrated irradiation amount of the exposure light EL applied to the plate member 30 and the plate member 32 is obtained based on the measurement result. be able to. An integrator sensor for measuring the intensity of the exposure light EL is disclosed in, for example, US Pat. No. 5,728,495 and US Pat. No. 5,591,958.

  In the present embodiment, the control device CONT determines whether or not the plate members 30 and 32 need to be replaced based on the contact angle of the liquid on the upper surfaces 30A and 32A of the plate members 30 and 32. For example, when it is estimated that the contact angle of the liquid has decreased to a predetermined angle (for example, 100 °) or less based on the usage time of the plate members 30 and 32, the cumulative irradiation amount of ultraviolet light, and the like, the plate members 30 and 32 It is determined that replacement is necessary. Alternatively, the contact angle of the liquid 1 on the surfaces 30A and 32A of the plate members 30 and 32 is a predetermined angle (for example, 10 °) or more from the initial state based on the usage time of the plate members 30 and 32, the cumulative irradiation amount of ultraviolet light, and the like. When it is estimated that the plate member has been lowered, it is determined that the plate members 30 and 32 need to be replaced.

  The deterioration of the liquid repellency of the plate members 30 and 32 may not be judged by the control device CONT of the exposure apparatus EX. For example, the host computer in the factory where the exposure apparatus EX is installed and the exposure apparatus EX. May be connected so that various data can be exchanged, and the determination may be made by the host computer.

  Further, when the liquid recovery mechanism 20 has a high liquid recovery capability, there is a possibility that the liquid can be sufficiently recovered even if the liquid repellency of the plate members 30 and 32 is deteriorated. In consideration of the relationship between the liquid recovery capability and the deterioration of the liquid repellency (decrease in the contact angle), the replacement timing of the plate members 30 and 32 can be determined.

  In addition, the speed and degree of deterioration of the liquid repellency varies depending not only on the exposure time of the exposure light EL but also on factors such as the material, liquid, exposure wavelength, temperature, etc. that provide the liquid repellency. It is good to have prepared. The same applies to the replacement time of other members to which liquid repellency described below is given.

  In this embodiment, the plate members 30 and 32 are made of, for example, polytetrafluoroethylene, which is a liquid repellent material, but may be formed of other liquid repellent materials. Further, for example, the plate members 30 and 32 are formed of a predetermined metal, and the surface of the metal plate member 30 is coated with a liquid repellent material having liquid repellency (polytetrafluoroethylene or the like). May be. Further, as the coating region of the liquid repellent material, the entire surface of the plate members 30 and 32 may be coated, or only a part of the region requiring liquid repellency such as the flat surface 30A may be coated. May be.

  Of course, the plate member 30 and the second plate member 32 may be provided as separate members, or may be coated using different liquid repellent materials. Further, it is not necessary that all the surfaces of the plate member 30 and the second plate member 32 have a liquid repellency at a uniform level, and a portion having a strong liquid repellency may be provided partially. Further, it is not necessary that all surfaces of the plate member 30 and the second plate member 32 have the same liquid repellency deterioration durability, and the deterioration durability of the portion where the exposure light irradiation amount is large is higher than that of other portions. You may make it strengthen. For example, it is preferable that the surface of the plate member 30 has a stronger deterioration durability than the surface of the second plate member 32.

  In the present embodiment, it has been described that when replacing the plate member 30, the plate member 30 is carried out together with the substrate P, but of course, only the plate member 30 may be carried into and out of the substrate table PT. .

  Further, the plate member 30 can be exchanged by using the elevating member 74 and the conveying arm 80, but the elevating member 74 and the conveying arm 80 capable of conveying the plate member 30 are not necessarily required, and an operator manually operates. The plate member 30 may be exchanged. Moreover, in the above-mentioned embodiment, although the plate member 30 and the 2nd plate member 32 are provided integrally, respectively, you may divide | segment each so that it can replace | exchange partially. As a result, it is possible to frequently replace only the portion where the liquid repellency is severely deteriorated.

  Alternatively, the plate member 30 and the plate member 32 may be formed as one plate member and held on the substrate table PT.

  In the present embodiment, the substrate holder PH and the substrate table PT are detachable, but the substrate holder PH may be provided integrally with the substrate table PT.

  In this embodiment, the photosensitive material 90 is applied to the entire surface of the front surface PA, the side surface PB, and the back surface PC of the substrate P for liquid repellent treatment, but the region where the gap A is formed, that is, the side surface of the substrate P. The liquid repellent treatment may be performed only on the region where the PB and the gap B are formed, that is, the region facing the upper surface 33A of the peripheral wall portion 33 in the back surface PC of the substrate P. Furthermore, if the gap A is sufficiently small and the liquid repellency (contact angle) of the material applied for the liquid repellent treatment is sufficiently large, the liquid 1 may flow into the second space 39 through the gap A. Therefore, the back surface PC of the substrate P forming the gap B may not be subjected to the liquid repellent treatment, and only the side surface PB of the substrate P may be subjected to the liquid repellent treatment. Of course, it is also possible to use a substrate P that is not subjected to any liquid repellent treatment on the front surface PA, the side surface PB, and the back surface PC.

  In the present embodiment, the height of the peripheral wall portion 33 is lower than the height of the support portion 34, and a gap B is formed between the back surface PC of the substrate P and the upper surface 33A of the peripheral wall portion 33. The back surface PC and the upper surface 33A of the peripheral wall portion 33 may contact each other.

  In the present embodiment, the liquid repellent photosensitive material 90 is applied as the liquid repellent treatment for the side surface PB and the back surface PC of the substrate P. However, the liquid repellent properties other than the photosensitive material 90 are applied to the side surface PB and the back surface PC. A predetermined material having water repellency may be applied. For example, a protective layer called a top coat layer (a film that protects the photosensitive material 90 from a liquid) may be applied to the upper layer of the photosensitive material 90 applied to the surface PA that is the exposure surface of the substrate P. The layer forming material (for example, a fluorine-based resin material) has a liquid repellency (water repellency) at a contact angle of about 110 °, for example. Therefore, the top coat layer forming material may be applied to the side surface PB and the back surface PC of the substrate P. Of course, a material having liquid repellency other than the photosensitive material 90 and the material for forming the top coat layer may be applied.

  In the present embodiment, a fluorine resin material or an acrylic resin material is applied as a liquid repellent treatment for the substrate table PT or the substrate holder PH. However, the photosensitive material or the top coat layer forming material is used as the substrate table. You may make it apply | coat to PT and the substrate holder PH, and conversely make it apply | coat the material used for the liquid-repellent process of the substrate stage PST and the substrate holder PH to the side surface PB and back surface PC of the board | substrate P. Good.

  The top coat layer is often provided to prevent the liquid 1 in the liquid immersion area AR2 from penetrating the photosensitive material 90. For example, an adhesion trace (so-called watermark) of the liquid 1 is formed on the top coat layer. Even if formed, by removing the topcoat layer after immersion exposure, a predetermined process such as a development process can be performed after the watermark is removed together with the topcoat layer. Here, when the topcoat layer is formed of, for example, a fluorine-based resin material, it can be removed using a fluorine-based solvent. This eliminates the need for a device for removing the watermark (for example, a substrate cleaning device for removing the watermark) and the like, and with a simple configuration such as removing the topcoat layer with a solvent, a predetermined process is performed after the watermark is removed. Can be performed satisfactorily. In the above-described embodiment, the plate members 30 and 32 are held on the substrate table PT by a vacuum suction method, but other chuck mechanisms such as an electromagnetic chuck mechanism may be used.

  Next, another embodiment of the present invention will be described. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  11A and 11B are diagrams showing the substrate holder PH that is attached to and detached from the substrate table PT (substrate stage PST). FIG. 11A is a side sectional view, and FIG. 11B is a view in which the substrate holder PH is removed. It is the top view which looked at subsequent substrate table PT from the upper part.

  As shown in FIG. 11, the substrate table PT is provided on the upper surface (holding surface for the substrate holder PH) with a recess 157 into which the substrate holder PH can be fitted, and the substrate holder provided in the recess 157 and disposed in the recess 157. A plurality of vacuum suction holes 158 for sucking and holding PH and a flow path 159 described later provided in the recess 157 are provided. By fitting the substrate holder PH into the recess 157, the substrate table PT and the substrate holder PH are positioned. The vacuum suction hole 158 constitutes a part of a chuck mechanism that holds the substrate holder PH disposed in the recess 157, and is connected to a vacuum device (not shown). The driving of the vacuum device is controlled by the control device CONT. The control device CONT controls the vacuum device, and performs suction holding and holding release on the substrate holder PH of the substrate table PT via the vacuum suction hole 158. By releasing the holding, the substrate holder PH and the substrate table PT can be separated, and the substrate holder PH can be exchanged.

  Here, the substrate table PT has been described as holding the substrate holder PH by vacuum suction. However, the substrate holder PH may be held and released by another chuck mechanism such as an electromagnetic chuck mechanism. Here, the positioning of the substrate table PT and the substrate holder PH has been described as being performed using the recess 157. For example, the positional relationship between the substrate holder PH and the substrate table PT is optically detected, and the detection result The substrate holder PH may be positioned at a predetermined position with respect to the substrate table PT.

  The substrate holder PH has a recess 150 for placing the substrate P, and a flat surface 30A that is substantially flush with the surface of the substrate P placed in the recess 150. The flat surface 30A is provided in an annular shape around the substrate P. A side wall 151 higher than the flat surface 30A is formed around the flat surface 30A. The side wall 151 is formed in an annular shape continuously around the flat surface 30A, and the liquid 1 can be held inside the side wall 151 (on the substrate P or the flat surface 30A).

  The substrate holder PH is formed of a liquid repellent material such as polytetrafluoroethylene. The substrate holder PH is made of, for example, a predetermined metal, and a liquid repellent material (such as polytetrafluoroethylene) having liquid repellency is coated on at least the flat surface 30A of the metal substrate holder PH. You may do it. Of course, a liquid repellent material may be coated over the entire surface of the metal substrate holder PH.

The transfer arm 80 can transfer the substrate holder PH removed from the substrate table PT.
For example, the transfer arm 80 unloads the substrate holder PH holding the substrate P after the exposure processing from the substrate table PT (substrate stage PST), and replaces the substrate holder PH with another substrate holder PH. Thereafter, the substrate holder PH can be loaded into the substrate table PT. The transfer arm 80 can carry only the substrate holder PH when carrying the substrate holder PH into the substrate table PT, or can carry in the substrate holder PH that holds the substrate P before the exposure processing. it can.

  12A and 12B are views showing the substrate holder PH. FIG. 12A is a side sectional view, and FIG. 12B is a plan view seen from above.

In FIG. 12, the substrate holder PH includes a side wall 151 that can hold the liquid 1 described above, a plurality of convex portions 161 formed on the bottom surface portion PHT of the concave portion 150, and a vacuum formed on the upper end surface of the convex portion 161. And an adsorption hole 162. The upper end surface of the convex portion 161 is a flat surface, and the substrate holder PH supports the substrate P by the upper end surfaces of the plurality of convex portions 161 and holds the substrate P by suction through the vacuum suction holes 162. Here, the convex portion 161 is provided at each of a plurality of predetermined positions of the bottom surface portion PHT of the concave portion 150 of the substrate holder PH so as not to bend the supported substrate P.
By supporting the substrate P with the convex portion 161, a separation portion 164 is formed between the substrate P and the bottom surface portion PHT of the substrate holder PH. In the present embodiment, the planar view shape of the substrate holder PH is substantially circular, but may be rectangular.

Further, when the substrate table PT and the substrate holder PH are connected, the vacuum suction hole 162 of the substrate holder PH is a flow provided on the upper surface of the substrate table PT via the flow path 162A formed in the substrate holder PH. It is connected to a path 159 (see FIG. 11B, etc.).
The flow path 159 is connected to the vacuum device, and the control device CONT drives the vacuum device to project the substrate table PT through the flow path 159, the flow path 162A of the substrate holder PH, and the vacuum suction hole 162. The substrate P supported by the part 161 is sucked and held. Here, each of the flow paths 162A is provided with a valve portion 162B composed of an electromagnetic valve or the like that is driven under the control of the control device CONT, so that the opening / closing operation of the flow path 162A can be remotely operated. Yes. The controller CONT controls the valve portion 162B when the vacuum device is driven to open the flow channel 162A, and closes the flow channel 162A when the vacuum device is stopped. Therefore, after the suction operation with respect to the substrate P through the vacuum suction hole 162, driving of the vacuum device is stopped and the flow path 162A is closed by the valve portion 162B so that the negative pressure of the flow path 162A is maintained. It has become. Therefore, even when the substrate table PT and the substrate holder PH are separated, the substrate holder PH can maintain the suction holding with respect to the substrate P by setting the flow path 162A to a negative pressure.

  Next, the operation of the exposure apparatus EX having the above-described configuration will be described with reference to the schematic diagram of FIG.

  As shown in FIG. 13A, the substrate holder PH holding the substrate P to be exposed is carried into the substrate table PT together with the substrate P by the transfer arm (transfer device) 80. As shown in FIG. 13B, the substrate holder PH is disposed so as to be fitted in a recess 157 provided in the substrate table PT, and is held by a chuck mechanism having a vacuum suction hole 158. Then, the control device CONT drives the vacuum device to hold the substrate P by vacuum suction via the flow path 159, the flow path 162A, and the vacuum suction hole 162 (not shown in FIG. 13). At this time, the valve portion 162B opens the flow path 162A. And as shown in FIG.13 (c), the control apparatus CONT supplied and collect | recovered the liquid 1 with the liquid supply mechanism 10 and the liquid collection | recovery mechanism 20, and was hold | maintained via the substrate holder PH on the substrate table PT. An immersion area AR2 for the liquid 1 is formed between the substrate P and the projection optical system PL. Then, the control device CONT irradiates the substrate P with the exposure light EL via the projection optical system PL and the liquid 1, and moves the substrate P held on the substrate table PT (substrate stage PST) via the substrate holder PH. Then, immersion exposure is performed. At this time, since the vacuum suction hole 162 is blocked by the substrate P held by suction, even if the liquid 1 is supplied, it does not enter the vacuum suction hole 162. Further, the side wall 151 of the substrate holder PH prevents the liquid 1 on the substrate P or the flat surface 30A from flowing out of the substrate holder PH.

  After the immersion exposure of the substrate P, the control device CONT recovers the liquid 1 remaining on the substrate P or the flat surface 30A using the liquid recovery mechanism 20 or the like. Next, the control device CONT releases the holding of the substrate holder PH by the chuck mechanism including the vacuum suction hole 158 and closes the flow path 162A using the valve portion 162B. Then, as shown in FIG. 13 (d), the control unit CONT unloads (unloads) the substrate holder PH, which has held the substrate P after the exposure processing, from the substrate table PT together with the substrate P by the transfer arm 80. ) When the substrate holder PH and the substrate table PT are separated, as described with reference to FIG. 12, the flow path 162A connected to the vacuum suction hole 162 that sucks and holds the substrate P is closed by the valve portion 162B and is negatively pressurized. Since the state is maintained, the suction holding to the substrate P by the upper end surface of the convex portion 161 is maintained. Further, when the substrate P is transported together with the substrate holder PH, even if the liquid 1 remains on the substrate P or the flat surface 30A, the remaining liquid 1 does not flow out through the flow path 162A. Further, since the remaining liquid 1 is held inside the side wall 151, it does not flow out of the substrate holder PH and scatter in the transport path.

  The unloaded substrate holder PH is replaced with a new substrate holder PH. Then, the control apparatus CONT carries in a new substrate holder PH holding the substrate P to be exposed to the substrate table PT (substrate stage PST) using the transfer arm 80 (see FIG. 13).

  Thus, also in this embodiment, since the substrate holder PH is exchanged, the substrate P can be held by the substrate holder PH whose surface is liquid repellent.

  By the way, in the said embodiment, it demonstrates so that the member (plate member 30, the 2nd plate member 32, substrate holder PH) which has the flat surface 30A around the board | substrate P may be replaced | exchanged according to the deterioration of the liquid repellency. However, it is desirable that the members other than the plate member 30 (substrate holder PH) provided on the substrate table PT have a liquid-repellent surface, and can be replaced according to the deterioration of the liquid repellency. Good. In particular, the surface of the member that comes into contact with the liquid 1 is desirably liquid repellant, and may be exchanged according to the deterioration of the liquid repellency. Specifically, the constituent member of the reference member 300 and the constituent members of the optical sensors 400 and 500 that are used by forming a liquid immersion region on the surface can also be exchanged.

  FIG. 14 is a cross-sectional view showing the reference member 300 provided on the substrate table PT. In FIG. 14, the reference member 300 includes an optical member 301 made of glass (clear serum), and reference marks MFM and PFM formed on the upper surface 301 </ b> A of the optical member 301. The reference member 300 is mounted on the substrate table PT, and as described above, is disposed in the opening 32K provided in the second plate member 32 and exposes the upper surface 301A. The reference member 300 (optical member 301) is detachable from the substrate table PT and can be replaced. When re-mounting the reference member 300 at a predetermined position on the substrate table PT, the reference member 300 and the substrate table PT are provided with concavities and convexities or male and female members that fit together to position the reference member 300 with respect to the substrate table PT. be able to. Alternatively, a magnet and a material attracted thereto may be embedded in the reference member 300 and the substrate table PT so that the reference member 300 can be positioned with respect to the substrate table PT by magnetic force. Alternatively, the reference member may be positioned on the substrate table PT by a vacuum suction force. Note that quartz may be used as the optical member 301.

  A gap K of, for example, about 0.3 mm is provided between the reference member 300 and the opening 32K. The upper surface 301A of the optical member 301 (reference member 300) is substantially flat, and is substantially the same height (level) as the surface of the substrate P, the surface 30A of the plate member 30, and the surface 32A of the second plate member 32. Is provided.

In the second plate member 32, the vicinity of the reference member 300 is thinned, and the end on the reference member 300 side of the thinned portion 32S is bent downward to form a bent portion 32T. Further, a wall portion 310 protruding upward is formed on the substrate table PT.
The wall portion 310 is provided outside the bent portion 32T with respect to the reference member 300, and is continuously formed so as to surround the reference member 300 (bend portion 32T). The outer side surface 32Ta of the bent portion 32T and the inner side surface 310A of the wall portion 310 are opposed to each other, and the inner side surface 32Tb of the bent portion 32T is opposed to the side surface 301B of the optical member 301 (reference member 300). Each of the side surface 301B of the optical member 301, the inner side surface 32Tb and the outer side surface 32Ta of the bent portion 32T, and the inner side surface 310A and the upper end surface 310B of the wall portion 310 are flat surfaces. Further, the thin portion 32S including the bent portion 32T of the second plate member 32 and the wall portion 310 are slightly separated from each other, and a predetermined gap (gap) is formed therebetween.

  Of the upper surface 301A and the side surface 301B of the optical member 301, at least the region facing the bent portion 32T, the inner side surface 310A of the wall portion 310, and the upper end surface 310B are liquid-repellent. As described above, the liquid repellent treatment can be performed by applying a liquid repellent material such as a fluorine resin material or an acrylic resin material.

  Further, the liquid 1 that has flowed into the space 370 between the bent portion 32T (wall portion 310) of the second plate member 32 and the reference member 301 is recovered by the recovery portion 380. In the present embodiment, the recovery unit 380 is provided in the substrate table PT, and connects the space 370 and the gas-liquid separator 381, the vacuum system 383, the gas-liquid separator 381 including a tank capable of storing the liquid 1. And a flow path 382. The inner wall surface of the flow path 382 is also subjected to liquid repellent treatment.

In the reference member 300 described above, for example, a configuration in which the reference mark detection operation is performed in a state where the liquid immersion area AR2 of the liquid 1 is formed on the upper surface 301A is conceivable, but the upper surface 301A is liquid repellent. After completion of the reference mark detection operation, the liquid 1 in the liquid immersion area AR2 on the upper surface 301A can be recovered well, and the inconvenience that the liquid 1 remains can be prevented.
In addition, since the side surface 301B of the optical member 301 is liquid repellent and the inner side surface 32Tb of the bent portion 32T facing the side surface 301B is also liquid repellent, it is difficult for the liquid 1 to enter the gap K. . Therefore, inconvenience that the liquid 1 enters the space 370 can be prevented. Even if the liquid 1 enters the space 370, the liquid 1 can be recovered well by the recovery unit 380. Further, even if the liquid 1 enters the space 370, the inner side surface 310A and the upper end surface 310B of the wall portion 310 are liquid repellent, and the second plate portion 32 (bending portion 32T) facing the wall portion 310 is also provided. Since it is liquid repellent, it is possible to prevent the liquid 1 that has entered the space 370 from entering the substrate table PT beyond the wall portion 310 and causing rust and the like. As described above, the wall portion 310 has a function as a liquid diffusion preventing wall that prevents the liquid 1 from diffusing. Further, in the gap between the second plate member 32 and the wall portion 310, a bent corner portion is formed in a sectional view by the bent portion 32T, and the bent corner portion functions as a seal portion. Infiltration of the liquid 1 can be reliably prevented.

  Since the reference member 300 (the optical member 301) is replaceable, when the liquid repellency is deteriorated, the new reference member 300 (having sufficient liquid repellency) and the plate member 30 can be used. Replace it.

  When the reference member 300 is used, the mark portion is locally irradiated with measurement light. Therefore, a plurality of the same reference marks are formed on the reference member 300 so that the surface of the mark portion has liquid repellency. If it deteriorates, other reference marks may be used, or these marks may be used alternately for each measurement in order to reduce the liquid repellent deterioration rate. As a result, the replacement frequency of the reference member 300 can be reduced. This is particularly effective because the portion including the reference mark MFM where the measurement light having the same exposure wavelength is used is rapidly deteriorated in liquid repellency.

FIG. 15 is a cross-sectional view showing the illuminance unevenness sensor 400 provided on the substrate table PT. In FIG. 15, the illuminance unevenness sensor 400 includes an upper plate 401 made of quartz glass or the like, and an optical element 402 made of quartz glass or the like provided under the upper plate 401. In the present embodiment, the upper plate 401 and the optical element 402 are integrally provided. In the following description, the upper plate 401 and the optical element 402 are appropriately referred to as an “optical member 404”.
In addition, the upper plate 401 and the optical element 402 are supported on the substrate table PT via the support portion 403. The support portion 403 has a continuous wall portion surrounding the optical member 404. As described above, the illuminance unevenness sensor 400 is disposed in the opening 32L provided in the second plate member 32 and exposes the upper surface 401A. The optical member 404 including the upper plate 401 and the optical element 402 can be attached to and detached from the substrate table PT. When the optical member 404 is remounted at a predetermined position on the substrate table PT, the optical member 404 and the substrate table PT are provided with concavities and convexities or male and female members that fit together to position the optical member 404 with respect to the substrate table PT. be able to. Alternatively, a magnet and a material attracted thereto may be embedded in the optical member 404 and the substrate table PT so that the optical member 404 can be positioned with respect to the substrate table PT by magnetic force. Alternatively, the reference member may be positioned on the substrate table PT by a vacuum suction force.

  On the upper plate 401, a pinhole portion 470 through which light can pass is provided. Further, a portion of the upper plate 401 other than the pinhole portion 470 is provided with a thin film 460 containing a light shielding material such as chromium. In the present embodiment, an optical member made of quartz glass is also provided inside the pinhole portion 470, whereby the thin film 460 and the pinhole portion 470 are flush with each other, and the upper surface 401A is a flat surface. .

  An optical sensor 450 that receives light that has passed through the pinhole portion 470 is disposed below the optical member 404. The optical sensor 450 is mounted on the substrate table PT. The optical sensor 450 outputs a light reception signal to the control device CONT. Here, a space 405 surrounded by the support portion 403, the substrate table PT, and the optical member 404 is a substantially sealed space, and the liquid 1 does not enter the space 405. Note that an optical system (optical element) may be disposed between the optical member 404 and the optical sensor 450.

  A gap L of, for example, about 0.3 mm is provided between the illuminance unevenness sensor 400 including the optical member 404 and the support portion 403 and the opening 32L. The upper surface 401A of the illuminance unevenness sensor 400 is a substantially flat surface, and is provided at substantially the same height (level) as the substrate P surface, the surface 30A of the plate member 30, and the surface 32A of the second plate member 32.

In the second plate member 32, the vicinity of the illuminance unevenness sensor 400 is thinned, and the end of the thinned portion 32S on the illuminance unevenness sensor 400 side is bent downward to form a bent portion 32T. Further, a wall portion 310 protruding upward is formed on the substrate table PT. The wall portion 310 is provided outside the bending portion 32T with respect to the illuminance unevenness sensor 400, and is continuously formed so as to surround the illuminance unevenness sensor 400 (bending portion 32T). The outer side surface 32Ta of the bent portion 32T and the inner side surface 310A of the wall portion 310 face each other, and the inner side surface 32Tb of the bent portion 32T faces the optical member 404 of the illuminance unevenness sensor 400 and the side surface 401B of the support portion 403. . Each of the side surface 401B, the inner side surface 32Tb and the outer side surface 32Ta of the bent portion 32T, and the inner side surface 310A and the upper end surface 310B of the wall portion 310 are flat surfaces.
Further, the thin portion 32S including the bent portion 32T of the second plate member 32 and the wall portion 310 are slightly separated from each other, and a predetermined gap (gap) is formed therebetween.

  Of the upper surface 401A and the side surface 401B of the illuminance unevenness sensor 400, at least the region facing the bent portion 32T, the inner side surface 310A and the upper end surface 310B of the wall portion 310 are subjected to liquid repellent treatment and become liquid repellent. As described above, the liquid repellent treatment can be performed by applying a liquid repellent material such as a fluorine resin material or an acrylic resin material.

  Further, the liquid 1 that has flowed into the space 470 between the bent portion 32T (side portion 310) of the second plate member 32 and the illuminance unevenness sensor 400 is recovered by the recovery portion 480. In the present embodiment, the recovery unit 480 is provided inside the substrate table PT and connects the space 470 and the gas-liquid separator 481, the vacuum system 483, the gas-liquid separator 481 including a tank that can store the liquid 1. And a flow path 482. The inner wall surface of the flow path 482 is also subjected to a liquid repellent treatment.

  In the illuminance unevenness sensor 400 described above, for example, in a state where the liquid immersion area AR2 of the liquid 1 is formed on the upper surface 401A, pinhole portions are sequentially formed at a plurality of positions in the irradiation area (projection area) irradiated with the exposure light EL. 470 is moved. Since the upper surface 401A is liquid repellent, the liquid 1 in the liquid immersion area AR2 on the upper surface 401A can be recovered satisfactorily after the measurement of illuminance unevenness, and the inconvenience that the liquid 1 remains can be prevented. In addition, the side surface 401B of the illuminance unevenness sensor 400 (the optical member 404 and the support portion 403) is liquid repellent, and the inner side surface 32Tb of the bent portion 32T facing the side surface 401B is also liquid repellent. The liquid 1 is difficult to enter. Therefore, inconvenience that the liquid 1 enters the space 470 can be prevented. Even if the liquid 1 enters the space 470, the recovery unit 480 can recover the liquid 1 satisfactorily. Further, even if the liquid 1 enters the space 470, the inner side surface 310A and the upper end surface 310B of the wall portion 310 are liquid repellent, and the second plate portion 32 (bending portion 32T) facing the wall portion 310 is also provided. Since it is liquid repellent, it is possible to prevent the inconvenience that the liquid 1 that has entered the space 470 enters the substrate table PT beyond the wall portion 310 and causes rust and the like. In addition, a bent corner portion is formed in the gap between the second plate member 32 and the wall portion 310 in a sectional view by the bent portion 32T, and the bent corner portion functions as a seal portion. 1 can be surely prevented.

  Since the optical member 404 is replaceable, when its liquid repellency deteriorates, it may be replaced with a new optical member 404 (having sufficient liquid repellency) in the same manner as the plate member 30.

  Since the aerial image measurement sensor 500 has substantially the same configuration as the illuminance unevenness sensor 400, a detailed description thereof is omitted, but the aerial image measurement sensor 500 is also supported on the substrate table PT via a support portion. An optical member including a plate and an optical element is provided. On the upper surface 501A, a slit portion 570 capable of transmitting light and a thin film made of a light-shielding material covering other than the slit portion are provided. An optical sensor that receives light that has passed through the slit portion 570 is provided below the optical member. The optical member having the slit portion 570 can be replaced according to the deterioration of the liquid repellency.

  In the embodiment described with reference to FIG. 14 and FIG. 15 described above, the liquid 1 is prevented from entering by imparting liquid repellency to the surface of the member forming the gaps K and L. Not only the gap around the measuring member and the sensor but also the gap existing on the upper surface of the substrate table PT is given liquid repellency in the same manner, so that the liquid 1 can be prevented from entering the gap. Further, a seal member made of resin or the like may be disposed in the gaps K and L so as to prevent the liquid 1 from entering, or liquid (for example, vacuum grease or magnetic fluid) may be placed in the gaps K and L. The liquid 1 may be filled to have a liquid sealing function to prevent the liquid 1 from entering. In this case, it is preferable that the sealing liquid is difficult to dissolve in the liquid 1. Of course, it goes without saying that these liquid intrusion prevention measures may be used in combination.

  Further, the surfaces (liquid contact) of all measurement members (the optical member 301 of the reference member 300, the upper plate 401 of the optical sensor 400, the upper plate 501 of the optical sensor 500, etc.) mounted on the substrate stage PST (substrate table PT). It is not necessary to make the surface) liquid-repellent, and only a part of them may be liquid-repellent.

  Further, in the above-described embodiment, replacement is performed when the liquid repellency of the member surface is deteriorated. However, when replacing a certain member, it is also necessary to replace a member that is close to the replacement time at the same time. It may be.

  In order to collect liquid (water) more reliably, the surface of the substrate table PT, that is, the surface of the plate member 30, the second plate member 32, the surface of the reference member 300, etc. is in contact with the liquid (water). It is desirable that the angle be larger than 80 °, desirably 100 ° or more (the contact angle of the above-described polytetrafluoroethylene with respect to the liquid (water) is approximately 110 °).

  Further, it is desirable to use a photosensitive material (ArF exposure light resist) coated on the surface of the substrate P having a contact angle with respect to the liquid (water) of more than 80 °. Of course, when KrF excimer laser light is used as the exposure light, it is desirable to use a KrF exposure light resist having a contact angle with respect to the liquid of greater than 80 °.

  In the above-described specific example, the substrate stage including the substrate table and the measurement member such as the reference member 300, the illuminance unevenness sensor 400, and the aerial image measurement sensor 500 is exemplified. The present invention can also be applied to an exposure apparatus having different stages. That is, the present invention also contemplates an exposure apparatus that includes an exposure stage that can move while holding a substrate to be processed such as a wafer, and a measurement stage that includes measurement members such as various reference members and measurement sensors. Yes. In this case, at least a part of the reference member and various measurement sensors arranged on the substrate stage PST in the above-described embodiment can be arranged on the measurement stage. An exposure apparatus provided with an exposure stage and a measurement stage is described, for example, in JP-A-11-135400.

  The present invention also provides a substrate stage (substrate table) for holding a substrate P as disclosed in JP-A-10-163099, JP-A-10-214783, JP-T 2000-505958, and the like. It can also be applied to two twin-stage type exposure apparatuses.

  FIG. 16 is a schematic block diagram of a twin stage type exposure apparatus according to the present invention. The twin stage type exposure apparatus includes first and second substrate stages PST1 and PST2 that can move independently on a common base 54, respectively. The first and second substrate stages PST1 and PST2 are substrate stages having structures and functions as described in relation to FIGS. 1 to 15, and have first and second substrate tables PT1 and PT2, respectively. The plate member 30 and the second plate member 32 are provided on the first and second substrate tables PT1 and PT2 in a replaceable manner. The twin stage type exposure apparatus has an exposure station ST1 and a measurement / exchange station ST2. The exposure station ST1 is provided with a projection optical system PL. The measurement / exchange station ST2 includes a substrate alignment system, A focus / leveling detection system is mounted (not shown in FIG. 16). Then, while the immersion exposure processing is being performed on the substrate P held on the first substrate table PT1 at the exposure station ST1, the substrate P is moved together with the plate member 30 at the measurement / exchange station ST2. The two-substrate stage PST2 (second substrate table PT2) is loaded / unloaded. In the measurement / exchange station ST2, a measurement operation (focus detection operation, alignment operation) is performed on the substrate P on the second substrate stage PST2 in parallel with the immersion exposure in the exposure station ST1, and the measurement operation is performed. After the completion, the second substrate stage PST2 moves to the exposure station ST2, and immersion exposure processing is performed on the substrate P on the second substrate stage PST.

  Thus, in the case of the twin stage type exposure apparatus, during the immersion exposure process in one stage, not only the substrate exchange and the measurement process can be performed in the other stage, but also the plate member 30 can be exchanged. Throughput of the exposure process can be improved.

  In each of the above embodiments, the plate member 30 and the like have been described as being exchanged according to the liquid repellency. However, for example, when the plate member 30 is damaged or contaminated for some reason, other than the deterioration of the liquid repellency. Needless to say, it can be exchanged according to the reason. For example, when the plate member 30 or the like has been in contact with the liquid 1 for a long time, the surface of the plate member 30 may deteriorate and the substance may be eluted, and the liquid 1 may be contaminated. The replacement time may be determined in consideration of surface degradation such as 30.

  The “contact angle” described in the above embodiment includes not only a static contact angle but also a dynamic contact angle.

  As described above, the liquid 1 in the present embodiment is composed of pure water. Pure water has an advantage that it can be easily obtained in large quantities at a semiconductor manufacturing factory or the like, and has no adverse effect on the photoresist, optical element (lens), etc. on the substrate P. In addition, pure water has no adverse effects on the environment, and since the impurity content is extremely low, it can be expected to clean the surface of the substrate P and the surface of the optical element provided on the front end surface of the projection optical system PL. . When the purity of pure water supplied from a factory or the like is low, the exposure apparatus may have an ultrapure water production device.

  The refractive index n of pure water (water) with respect to the exposure light EL having a wavelength of about 193 nm is said to be approximately 1.44. When ArF excimer laser light (wavelength 193 nm) is used as the light source of the exposure light EL, On the substrate P, the wavelength is shortened to 1 / n, that is, about 134 nm, and a high resolution can be obtained. Furthermore, since the depth of focus is enlarged by about n times, that is, about 1.44 times compared with that in the air, the projection optical system PL can be used when it is sufficient to ensure the same depth of focus as that in the air. The numerical aperture can be further increased, and the resolution is improved in this respect as well.

  As described above, when the liquid immersion method is used, the numerical aperture NA of the projection optical system may be 0.9 to 1.3. When the numerical aperture NA of the projection optical system becomes large in this way, the imaging performance may deteriorate due to the polarization effect with random polarized light conventionally used as exposure light. desirable. In that case, linearly polarized illumination is performed in accordance with the longitudinal direction of the line pattern of the mask (reticle) line-and-space pattern. From the mask (reticle) pattern, the S-polarized light component (TE-polarized light component), that is, the line pattern It is preferable that a large amount of diffracted light having a polarization direction component is emitted along the longitudinal direction. When the space between the projection optical system PL and the resist applied on the surface of the substrate P is filled with a liquid, the space between the projection optical system PL and the resist applied on the surface of the substrate P is filled with air (gas). Compared with the case where the transmittance of the diffracted light of the S-polarized component (TE-polarized component) contributing to the improvement of the contrast is high on the resist surface, the numerical aperture NA of the projection optical system exceeds 1.0. Even in this case, high imaging performance can be obtained. Further, it is more effective to appropriately combine a phase shift mask or an oblique incidence illumination method (particularly a die ball illumination method) or the like according to the longitudinal direction of the line pattern as disclosed in JP-A-6-188169.

  Further, for example, an ArF excimer laser is used as the exposure light, and a fine line and space pattern (for example, a line and space of about 25 to 50 nm) is formed on the substrate by using the projection optical system PL with a reduction magnification of about 1/4. When exposing on P, depending on the structure of the mask M (for example, the fineness of the pattern and the thickness of chrome), the mask M acts as a polarizing plate due to the Wave guide effect, and the P-polarized component (TM polarized light) that lowers the contrast. Since the diffracted light of the S-polarized component (TE-polarized component) is emitted from the mask M more than the diffracted light of the component), it is desirable to use the above-mentioned linearly polarized illumination, but the mask M is illuminated with random polarized light Even when the numerical aperture NA of the projection optical system PL is as large as 0.9 to 1.3, high resolution performance can be obtained. When an extremely fine line-and-space pattern on the mask M is exposed on the substrate P, the P-polarized component (TM-polarized component) is larger than the S-polarized component (TE-polarized component) due to the Wire Grid effect. For example, an ArF excimer laser is used as exposure light, and a line and space pattern larger than 25 nm is exposed on the substrate P using the projection optical system PL with a reduction magnification of about 1/4. In this case, since the diffracted light of the S polarization component (TE polarization component) is emitted from the mask M more than the diffracted light of the P polarization component (TM polarization component), the numerical aperture NA of the projection optical system PL is 0.9. High resolution performance can be obtained even when the value is as large as -1.3.

  Furthermore, not only linearly polarized illumination (S-polarized illumination) matched to the longitudinal direction of the line pattern of the mask (reticle) but also a circle centered on the optical axis as disclosed in JP-A-6-53120. A combination of the polarization illumination method that linearly polarizes in the tangential (circumferential) direction and the oblique incidence illumination method is also effective. In particular, when a mask (reticle) pattern includes not only a line pattern extending in a predetermined direction but also a plurality of line patterns extending in different directions, the same is disclosed in Japanese Patent Laid-Open No. 6-53120. In addition, by using the polarization illumination method that linearly polarizes in the tangential direction of the circle centered on the optical axis and the annular illumination method, high imaging performance can be obtained even when the numerical aperture NA of the projection optical system is large. it can.

  In the present embodiment, the optical element 2 is attached to the tip of the projection optical system PL, and the optical characteristics of the projection optical system PL, for example, aberration (spherical aberration, coma aberration, etc.) can be adjusted by this lens. The optical element attached to the tip of the projection optical system PL may be an optical plate used for adjusting the optical characteristics of the projection optical system PL. Alternatively, it may be a plane parallel plate that can transmit the exposure light EL.

  When the pressure between the optical element at the tip of the projection optical system PL generated by the flow of the liquid 1 and the substrate P is large, the optical element is not exchangeable but the optical element is moved by the pressure. It may be fixed firmly so that there is no.

  In the present embodiment, the space between the projection optical system PL and the surface of the substrate P is filled with the liquid 1. For example, the liquid is obtained with a cover glass made of a plane parallel plate attached to the surface of the substrate P. 1 may be satisfied.

  The exposure apparatus to which the above-described immersion method is applied is configured to expose the substrate P by filling the optical path space on the exit side of the terminal optical element 2 of the projection optical system PL with liquid (pure water). As disclosed in International Publication No. 2004/019128, the optical path space on the incident side of the terminal optical element 2 of the projection optical system PL may be filled with liquid (pure water).

Although the liquid 1 of the present embodiment is water, a liquid other than water may be, for example, when the light source of exposure light EL is an F ₂ laser, the F ₂ laser beam is not transmitted through water The liquid 1 may be, for example, a fluorinated fluid such as perfluorinated polyether (PFPE) or fluorinated oil that can transmit F ₂ laser light. In this case, the lyophilic treatment is performed by forming a thin film with a substance having a molecular structure having a small polarity including fluorine, for example, in a portion in contact with the liquid 1. In addition, as the liquid 1, there are other materials that are transmissive to the exposure light EL, have a refractive index as high as possible, and are stable with respect to the photoresist applied to the projection optical system PL and the surface of the substrate P (for example, Cedar). Oil) can also be used. Also in this case, the surface treatment is performed according to the polarity of the liquid 1 to be used.

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise. The present invention can also be applied to a step-and-stitch type exposure apparatus that partially transfers at least two patterns on the substrate P.

  Further, in the above-described embodiment, an exposure apparatus that locally fills the liquid between the projection optical system PL and the substrate P is employed. However, the present invention is disclosed in JP-A-6-124873 and JP-A-10. The present invention can also be applied to an immersion exposure apparatus that exposes a substrate by immersing the entire surface of the substrate to be exposed as disclosed in Japanese Patent No. -303114.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing reticles or masks.

  When using a linear motor (see USP5,623,853 or USP5,528,118) for the substrate stage PST and mask stage MST, use either the air levitation type using air bearings or the magnetic levitation type using Lorentz force or reactance force. Also good. Each stage PST, MST may be a type that moves along a guide, or may be a guideless type that does not have a guide.

  As a driving mechanism for each stage PST, MST, a planar motor that drives each stage PST, MST by electromagnetic force with a magnet unit having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil facing each other is provided. It may be used. In this case, either one of the magnet unit and the armature unit may be connected to the stages PST and MST, and the other of the magnet unit and the armature unit may be provided on the moving surface side of the stages PST and MST.

  As described in JP-A-8-166475 (USP 5,528,118), the reaction force generated by the movement of the substrate stage PST is not transmitted to the projection optical system PL, but mechanically using a frame member. You may escape to the floor (ground).

  As described in JP-A-8-330224 (US S / N 08 / 416,558), a frame member is used so that the reaction force generated by the movement of the mask stage MST is not transmitted to the projection optical system PL. May be mechanically released to the floor (ground).

  As described above, the exposure apparatus EX according to the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 17, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Manufacturing step 203, exposure processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

  DESCRIPTION OF SYMBOLS 1 ... Liquid, 10 ... Liquid supply mechanism, 20 ... Liquid recovery mechanism, 30 ... Plate member, 30A ... Flat surface (flat part), 72 ... Adsorption hole (desorption mechanism), 74 ... Lifting member (desorption mechanism), AR1 ... Projection area, AR2 ... Immersion area, EL ... Exposure light, EX ... Exposure apparatus, P ... Substrate, PL ... Projection optical system, PST ... Substrate stage, PT ... Substrate table

Claims (1)

In an exposure apparatus that exposes the substrate by irradiating the substrate with exposure light through a liquid,
A substrate table for holding the substrate;
An exposure apparatus in which a liquid repellent member is provided on the substrate table so that at least a part of the surface of the substrate table is replaceable.

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