TWI311779B - Substrate processing apparatus and processing method thereof - Google Patents
Substrate processing apparatus and processing method thereof Download PDFInfo
- Publication number
- TWI311779B TWI311779B TW092116810A TW92116810A TWI311779B TW I311779 B TWI311779 B TW I311779B TW 092116810 A TW092116810 A TW 092116810A TW 92116810 A TW92116810 A TW 92116810A TW I311779 B TWI311779 B TW I311779B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- processing
- liquid
- recovery
- processed
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 191
- 238000003672 processing method Methods 0.000 title claims description 15
- 239000007788 liquid Substances 0.000 claims description 143
- 238000011084 recovery Methods 0.000 claims description 128
- 238000011282 treatment Methods 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 24
- 230000004888 barrier function Effects 0.000 claims description 15
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000004064 recycling Methods 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- 210000003813 thumb Anatomy 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims 2
- 239000002023 wood Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 description 69
- 230000007246 mechanism Effects 0.000 description 20
- 239000003814 drug Substances 0.000 description 13
- 239000003595 mist Substances 0.000 description 6
- 230000002378 acidificating effect Effects 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 4
- 229940079593 drug Drugs 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002181151A JP2004031400A (ja) | 2002-06-21 | 2002-06-21 | 基板処理装置及びその処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200405451A TW200405451A (en) | 2004-04-01 |
| TWI311779B true TWI311779B (en) | 2009-07-01 |
Family
ID=29996621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092116810A TWI311779B (en) | 2002-06-21 | 2003-06-20 | Substrate processing apparatus and processing method thereof |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20050244579A1 (enExample) |
| EP (1) | EP1536460A4 (enExample) |
| JP (1) | JP2004031400A (enExample) |
| KR (1) | KR100704594B1 (enExample) |
| CN (1) | CN100380601C (enExample) |
| TW (1) | TWI311779B (enExample) |
| WO (1) | WO2004001828A1 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1727191A1 (en) * | 2004-03-12 | 2006-11-29 | Sipec Corporation | Substrate processing equipment |
| JP4531612B2 (ja) * | 2005-03-31 | 2010-08-25 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| KR100752246B1 (ko) | 2005-03-31 | 2007-08-29 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 기판처리방법 |
| KR100993311B1 (ko) * | 2005-04-01 | 2010-11-09 | 에프에스아이 인터내쇼날 인크. | 하나 이상의 처리 유체로 마이크로일렉트로닉 작업물을 처리하는 장치용 이동 및 중첩 가능한 배플들을 포함하는 소형 덕트 시스템 |
| JP4796902B2 (ja) * | 2005-07-11 | 2011-10-19 | 芝浦メカトロニクス株式会社 | 基板のスピン処理装置 |
| JP2009520362A (ja) * | 2005-12-16 | 2009-05-21 | ソリッド ステイト イクイップメント コーポレイション | 化学的分離の装置及び方法 |
| JP4637741B2 (ja) * | 2005-12-28 | 2011-02-23 | 株式会社ジェイ・イー・ティ | 基板処理装置 |
| JP2007311446A (ja) * | 2006-05-17 | 2007-11-29 | Realize Advanced Technology Ltd | 洗浄装置 |
| CN101484974B (zh) | 2006-07-07 | 2013-11-06 | Fsi国际公司 | 用于处理微电子工件的设备和方法以及遮挡结构 |
| KR100797081B1 (ko) * | 2006-08-24 | 2008-01-22 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
| JP4763567B2 (ja) * | 2006-10-03 | 2011-08-31 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP2008141010A (ja) * | 2006-12-01 | 2008-06-19 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| KR100824306B1 (ko) * | 2006-12-22 | 2008-04-22 | 세메스 주식회사 | 기판 처리 장치 |
| KR100872877B1 (ko) * | 2007-03-06 | 2008-12-10 | 세메스 주식회사 | 기판 처리 장치 |
| WO2009020524A1 (en) | 2007-08-07 | 2009-02-12 | Fsi International, Inc. | Rinsing methodologies for barrier plate and venturi containment systems in tools used to process microelectronic workpieces with one or more treatment fluids, and related apparatuses |
| CN102683249B (zh) | 2008-05-09 | 2015-06-17 | 泰尔Fsi公司 | 用于处理微电子工件的系统 |
| JP5084639B2 (ja) | 2008-06-30 | 2012-11-28 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
| CN101958228B (zh) * | 2009-07-13 | 2012-06-20 | 弘塑科技股份有限公司 | 具有移动式泄液槽的清洗蚀刻机台 |
| JP2012044213A (ja) * | 2011-10-26 | 2012-03-01 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP5693438B2 (ja) | 2011-12-16 | 2015-04-01 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
| US10707099B2 (en) | 2013-08-12 | 2020-07-07 | Veeco Instruments Inc. | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle |
| CN107093567B (zh) * | 2016-02-18 | 2019-08-06 | 顶程国际股份有限公司 | 环状液体收集装置 |
| TWI656594B (zh) * | 2016-12-15 | 2019-04-11 | 辛耘企業股份有限公司 | 基板處理裝置 |
| WO2018200398A1 (en) | 2017-04-25 | 2018-11-01 | Veeco Precision Surface Processing Llc | Semiconductor wafer processing chamber |
| CN109570126B (zh) * | 2018-12-27 | 2021-06-22 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | 多级药品回收的单片清洗装置 |
| JP2024060970A (ja) * | 2022-10-20 | 2024-05-07 | 東京エレクトロン株式会社 | カップ、液処理装置及び液処理方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0434902Y2 (enExample) * | 1987-01-13 | 1992-08-19 | ||
| JPH0724396A (ja) * | 1993-07-12 | 1995-01-27 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| US5608943A (en) * | 1993-08-23 | 1997-03-11 | Tokyo Electron Limited | Apparatus for removing process liquid |
| JP3116297B2 (ja) * | 1994-08-03 | 2000-12-11 | 東京エレクトロン株式会社 | 処理方法及び処理装置 |
| TW306011B (enExample) * | 1995-04-19 | 1997-05-21 | Tokyo Electron Co Ltd | |
| US5843527A (en) * | 1995-06-15 | 1998-12-01 | Dainippon Screen Mfg. Co., Ltd. | Coating solution applying method and apparatus |
| US5725663A (en) * | 1996-01-31 | 1998-03-10 | Solitec Wafer Processing, Inc. | Apparatus for control of contamination in spin systems |
| TW357389B (en) * | 1996-12-27 | 1999-05-01 | Tokyo Electric Ltd | Apparatus and method for supplying process solution to surface of substrate to be processed |
| JP4043593B2 (ja) * | 1998-04-30 | 2008-02-06 | 東芝松下ディスプレイテクノロジー株式会社 | 基板処理装置 |
| JPH11333354A (ja) * | 1998-05-27 | 1999-12-07 | Sumitomo Precision Prod Co Ltd | 回転式基板処理装置 |
| JP3929192B2 (ja) * | 1998-12-21 | 2007-06-13 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| TW504776B (en) * | 1999-09-09 | 2002-10-01 | Mimasu Semiconductor Ind Co | Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism |
| JP4426036B2 (ja) * | 1999-12-02 | 2010-03-03 | 東京エレクトロン株式会社 | 基板処理装置 |
-
2002
- 2002-06-21 JP JP2002181151A patent/JP2004031400A/ja active Pending
-
2003
- 2003-06-20 WO PCT/JP2003/007849 patent/WO2004001828A1/ja not_active Ceased
- 2003-06-20 US US10/516,949 patent/US20050244579A1/en not_active Abandoned
- 2003-06-20 KR KR1020047020752A patent/KR100704594B1/ko not_active Expired - Fee Related
- 2003-06-20 EP EP03733530A patent/EP1536460A4/en not_active Withdrawn
- 2003-06-20 CN CNB038174138A patent/CN100380601C/zh not_active Expired - Fee Related
- 2003-06-20 TW TW092116810A patent/TWI311779B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100704594B1 (ko) | 2007-04-10 |
| JP2004031400A (ja) | 2004-01-29 |
| CN1672245A (zh) | 2005-09-21 |
| WO2004001828A1 (ja) | 2003-12-31 |
| TW200405451A (en) | 2004-04-01 |
| CN100380601C (zh) | 2008-04-09 |
| EP1536460A1 (en) | 2005-06-01 |
| KR20050016598A (ko) | 2005-02-21 |
| US20050244579A1 (en) | 2005-11-03 |
| EP1536460A4 (en) | 2009-07-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |