KR100704594B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR100704594B1
KR100704594B1 KR1020047020752A KR20047020752A KR100704594B1 KR 100704594 B1 KR100704594 B1 KR 100704594B1 KR 1020047020752 A KR1020047020752 A KR 1020047020752A KR 20047020752 A KR20047020752 A KR 20047020752A KR 100704594 B1 KR100704594 B1 KR 100704594B1
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KR
South Korea
Prior art keywords
substrate
recovery
processing
liquid
recovery tank
Prior art date
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Expired - Fee Related
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KR1020047020752A
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English (en)
Korean (ko)
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KR20050016598A (ko
Inventor
마츠자와미노루
나가사카미치오
Original Assignee
리아라이즈·아도반스토테쿠노로지 가부시키가이샤
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Application filed by 리아라이즈·아도반스토테쿠노로지 가부시키가이샤 filed Critical 리아라이즈·아도반스토테쿠노로지 가부시키가이샤
Publication of KR20050016598A publication Critical patent/KR20050016598A/ko
Application granted granted Critical
Publication of KR100704594B1 publication Critical patent/KR100704594B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
KR1020047020752A 2002-06-21 2003-06-20 기판 처리 장치 및 기판 처리 방법 Expired - Fee Related KR100704594B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00181151 2002-06-21
JP2002181151A JP2004031400A (ja) 2002-06-21 2002-06-21 基板処理装置及びその処理方法

Publications (2)

Publication Number Publication Date
KR20050016598A KR20050016598A (ko) 2005-02-21
KR100704594B1 true KR100704594B1 (ko) 2007-04-10

Family

ID=29996621

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020047020752A Expired - Fee Related KR100704594B1 (ko) 2002-06-21 2003-06-20 기판 처리 장치 및 기판 처리 방법

Country Status (7)

Country Link
US (1) US20050244579A1 (enExample)
EP (1) EP1536460A4 (enExample)
JP (1) JP2004031400A (enExample)
KR (1) KR100704594B1 (enExample)
CN (1) CN100380601C (enExample)
TW (1) TWI311779B (enExample)
WO (1) WO2004001828A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1727191A1 (en) * 2004-03-12 2006-11-29 Sipec Corporation Substrate processing equipment
JP4531612B2 (ja) * 2005-03-31 2010-08-25 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
KR100752246B1 (ko) 2005-03-31 2007-08-29 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
KR100993311B1 (ko) * 2005-04-01 2010-11-09 에프에스아이 인터내쇼날 인크. 하나 이상의 처리 유체로 마이크로일렉트로닉 작업물을 처리하는 장치용 이동 및 중첩 가능한 배플들을 포함하는 소형 덕트 시스템
JP4796902B2 (ja) * 2005-07-11 2011-10-19 芝浦メカトロニクス株式会社 基板のスピン処理装置
JP2009520362A (ja) * 2005-12-16 2009-05-21 ソリッド ステイト イクイップメント コーポレイション 化学的分離の装置及び方法
JP4637741B2 (ja) * 2005-12-28 2011-02-23 株式会社ジェイ・イー・ティ 基板処理装置
JP2007311446A (ja) * 2006-05-17 2007-11-29 Realize Advanced Technology Ltd 洗浄装置
CN101484974B (zh) 2006-07-07 2013-11-06 Fsi国际公司 用于处理微电子工件的设备和方法以及遮挡结构
KR100797081B1 (ko) * 2006-08-24 2008-01-22 세메스 주식회사 기판 처리 장치 및 방법
JP4763567B2 (ja) * 2006-10-03 2011-08-31 大日本スクリーン製造株式会社 基板処理装置
JP2008141010A (ja) * 2006-12-01 2008-06-19 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100824306B1 (ko) * 2006-12-22 2008-04-22 세메스 주식회사 기판 처리 장치
KR100872877B1 (ko) * 2007-03-06 2008-12-10 세메스 주식회사 기판 처리 장치
WO2009020524A1 (en) 2007-08-07 2009-02-12 Fsi International, Inc. Rinsing methodologies for barrier plate and venturi containment systems in tools used to process microelectronic workpieces with one or more treatment fluids, and related apparatuses
CN102683249B (zh) 2008-05-09 2015-06-17 泰尔Fsi公司 用于处理微电子工件的系统
JP5084639B2 (ja) 2008-06-30 2012-11-28 芝浦メカトロニクス株式会社 スピン処理装置
CN101958228B (zh) * 2009-07-13 2012-06-20 弘塑科技股份有限公司 具有移动式泄液槽的清洗蚀刻机台
JP2012044213A (ja) * 2011-10-26 2012-03-01 Dainippon Screen Mfg Co Ltd 基板処理装置
JP5693438B2 (ja) 2011-12-16 2015-04-01 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
US10707099B2 (en) 2013-08-12 2020-07-07 Veeco Instruments Inc. Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle
CN107093567B (zh) * 2016-02-18 2019-08-06 顶程国际股份有限公司 环状液体收集装置
TWI656594B (zh) * 2016-12-15 2019-04-11 辛耘企業股份有限公司 基板處理裝置
WO2018200398A1 (en) 2017-04-25 2018-11-01 Veeco Precision Surface Processing Llc Semiconductor wafer processing chamber
CN109570126B (zh) * 2018-12-27 2021-06-22 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 多级药品回收的单片清洗装置
JP2024060970A (ja) * 2022-10-20 2024-05-07 東京エレクトロン株式会社 カップ、液処理装置及び液処理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183010A (ja) * 1998-12-21 2000-06-30 Dainippon Screen Mfg Co Ltd 基板処理装置

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JPH0434902Y2 (enExample) * 1987-01-13 1992-08-19
JPH0724396A (ja) * 1993-07-12 1995-01-27 Dainippon Screen Mfg Co Ltd 基板処理装置
US5608943A (en) * 1993-08-23 1997-03-11 Tokyo Electron Limited Apparatus for removing process liquid
JP3116297B2 (ja) * 1994-08-03 2000-12-11 東京エレクトロン株式会社 処理方法及び処理装置
TW306011B (enExample) * 1995-04-19 1997-05-21 Tokyo Electron Co Ltd
US5843527A (en) * 1995-06-15 1998-12-01 Dainippon Screen Mfg. Co., Ltd. Coating solution applying method and apparatus
US5725663A (en) * 1996-01-31 1998-03-10 Solitec Wafer Processing, Inc. Apparatus for control of contamination in spin systems
TW357389B (en) * 1996-12-27 1999-05-01 Tokyo Electric Ltd Apparatus and method for supplying process solution to surface of substrate to be processed
JP4043593B2 (ja) * 1998-04-30 2008-02-06 東芝松下ディスプレイテクノロジー株式会社 基板処理装置
JPH11333354A (ja) * 1998-05-27 1999-12-07 Sumitomo Precision Prod Co Ltd 回転式基板処理装置
TW504776B (en) * 1999-09-09 2002-10-01 Mimasu Semiconductor Ind Co Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism
JP4426036B2 (ja) * 1999-12-02 2010-03-03 東京エレクトロン株式会社 基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183010A (ja) * 1998-12-21 2000-06-30 Dainippon Screen Mfg Co Ltd 基板処理装置

Non-Patent Citations (1)

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Title
12183010

Also Published As

Publication number Publication date
JP2004031400A (ja) 2004-01-29
CN1672245A (zh) 2005-09-21
WO2004001828A1 (ja) 2003-12-31
TWI311779B (en) 2009-07-01
TW200405451A (en) 2004-04-01
CN100380601C (zh) 2008-04-09
EP1536460A1 (en) 2005-06-01
KR20050016598A (ko) 2005-02-21
US20050244579A1 (en) 2005-11-03
EP1536460A4 (en) 2009-07-29

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