TWI303849B - - Google Patents

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Publication number
TWI303849B
TWI303849B TW095127955A TW95127955A TWI303849B TW I303849 B TWI303849 B TW I303849B TW 095127955 A TW095127955 A TW 095127955A TW 95127955 A TW95127955 A TW 95127955A TW I303849 B TWI303849 B TW I303849B
Authority
TW
Taiwan
Prior art keywords
substrate
liquid
curtain
unit
curtain forming
Prior art date
Application number
TW095127955A
Other languages
English (en)
Chinese (zh)
Other versions
TW200715389A (en
Inventor
Yamamoto Satoshi
Matsumoto Takao
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200715389A publication Critical patent/TW200715389A/zh
Application granted granted Critical
Publication of TWI303849B publication Critical patent/TWI303849B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW095127955A 2005-10-14 2006-07-31 Substrate processing apparatus TW200715389A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005300616 2005-10-14
JP2006054644A JP4668088B2 (ja) 2005-10-14 2006-03-01 基板処理装置

Publications (2)

Publication Number Publication Date
TW200715389A TW200715389A (en) 2007-04-16
TWI303849B true TWI303849B (enExample) 2008-12-01

Family

ID=38156040

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127955A TW200715389A (en) 2005-10-14 2006-07-31 Substrate processing apparatus

Country Status (4)

Country Link
JP (1) JP4668088B2 (enExample)
KR (1) KR100817980B1 (enExample)
CN (1) CN1947871B (enExample)
TW (1) TW200715389A (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100883298B1 (ko) * 2007-06-08 2009-02-11 아프로시스템 주식회사 상하 분리가능한 평판 디스플레이 세정장치
JP2009147260A (ja) * 2007-12-18 2009-07-02 Dainippon Screen Mfg Co Ltd 基板処理装置
KR101296659B1 (ko) * 2008-11-14 2013-08-14 엘지디스플레이 주식회사 세정 장치
KR101034374B1 (ko) * 2008-11-28 2011-05-16 세메스 주식회사 기판 세정 장치 및 방법
KR200451730Y1 (ko) 2008-12-29 2011-01-11 주식회사 케이씨텍 세정장치의 오토셔터
CN101847567B (zh) * 2009-03-26 2012-02-29 北京京东方光电科技有限公司 清洗基板的装置
CN101954358B (zh) * 2010-05-06 2012-07-04 东莞宏威数码机械有限公司 平移式基板清洗装置
DE102010024840B4 (de) * 2010-06-23 2016-09-22 Eisenmann Se Trockner
CN102357479A (zh) * 2011-07-19 2012-02-22 廖启明 应用于线路板生产的环保节水处理系统、装置及处理方法
CN102626695B (zh) * 2011-09-28 2015-04-08 北京京东方光电科技有限公司 基板清洗系统
TWI612568B (zh) * 2012-05-17 2018-01-21 Ebara Corp 基板洗淨裝置
JP6133120B2 (ja) 2012-05-17 2017-05-24 株式会社荏原製作所 基板洗浄装置
CN103406302B (zh) * 2013-08-23 2015-08-12 深圳市华星光电技术有限公司 基于紫外线的清洗方法及清洗装置
CN105665397A (zh) * 2016-03-17 2016-06-15 东旭科技集团有限公司 液晶玻璃基板清洗设备和方法
CN205692805U (zh) * 2016-05-09 2016-11-16 合肥鑫晟光电科技有限公司 基板处理设备
CN108239736B (zh) * 2016-12-23 2024-02-23 无锡市斯威克科技有限公司 一种光伏用反光焊带的脉冲风刀
CN108993960A (zh) * 2017-06-07 2018-12-14 丁保粮 一种气液喷淋清洗机
CN108325900B (zh) * 2017-09-19 2021-02-02 福建晟哲自动化科技有限公司 一种液晶面板清洗设备
CN207793414U (zh) * 2017-12-06 2018-08-31 北京铂阳顶荣光伏科技有限公司 具有防气体飘逸功能的板材镀膜设备
CN109047074B (zh) * 2018-08-26 2021-02-26 东莞市金盘模具配件有限公司 一种精密模具加工用表面清洗装置
CN109248878B (zh) * 2018-08-31 2020-10-13 深圳市华星光电技术有限公司 一种清洗平台以及清洗方法
CN110681666A (zh) * 2019-08-09 2020-01-14 江苏迪佳电子有限公司 一种电容触摸屏加工装置
JP7312738B2 (ja) * 2020-12-11 2023-07-21 芝浦メカトロニクス株式会社 基板処理装置
CN113154862B (zh) * 2021-02-26 2022-07-15 东莞汇和电子有限公司 一种电子线路板装配活塞干燥风刀
CN113020080A (zh) * 2021-03-30 2021-06-25 苏州阿洛斯环境发生器有限公司 一种定向线性双流体清洗方法及装置
CN113020079A (zh) * 2021-03-30 2021-06-25 苏州阿洛斯环境发生器有限公司 一种定向双流体清洗方法
CN116000042A (zh) * 2022-12-21 2023-04-25 芜湖东旭光电科技有限公司 玻璃基板预清洗装置
CN115947119B (zh) * 2023-03-14 2023-05-23 合肥光微光电科技有限公司 一种光学玻璃生产自动化输送设备
CN116765015A (zh) * 2023-05-19 2023-09-19 上海新阳半导体材料股份有限公司 电子元件处理装置
CN117772739A (zh) * 2023-12-05 2024-03-29 湖南邵虹特种玻璃股份有限公司 一种基板玻璃预湿机的防水汽向外泄漏设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5564159A (en) * 1994-05-26 1996-10-15 The John Treiber Company Closed-loop multistage system for cleaning printed circuit boards
JP3171807B2 (ja) * 1997-01-24 2001-06-04 東京エレクトロン株式会社 洗浄装置及び洗浄方法
KR100232593B1 (ko) * 1997-01-24 1999-12-01 구자홍 Pdp용박리장치및그방법
KR100237210B1 (ko) * 1997-07-22 2000-01-15 구자홍 플라스마 디스플레이 패널용 세정 시스템
JPH11121427A (ja) * 1997-10-13 1999-04-30 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100542299B1 (ko) * 1998-04-23 2006-04-14 비오이 하이디스 테크놀로지 주식회사 포토레지스트의 에지부 제거 장치
DE10130999A1 (de) * 2000-06-29 2002-04-18 D M S Co Multifunktions-Reinigungsmodul einer Herstellungseinrichtung für Flachbildschirme und Reinigungsgerät mit Verwendung desselben
JP2004074021A (ja) * 2002-08-19 2004-03-11 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板洗浄ユニット
JP2004273984A (ja) * 2003-03-12 2004-09-30 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2004335838A (ja) * 2003-05-09 2004-11-25 Shin Etsu Handotai Co Ltd 洗浄装置、洗浄システム及び洗浄方法

Also Published As

Publication number Publication date
JP2007134665A (ja) 2007-05-31
KR100817980B1 (ko) 2008-03-31
CN1947871A (zh) 2007-04-18
JP4668088B2 (ja) 2011-04-13
KR20070041320A (ko) 2007-04-18
CN1947871B (zh) 2010-12-08
TW200715389A (en) 2007-04-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees