593090 、發明顯八二：:厂 •.......... · .....: * .................二：… (翻闘麵目：翻麵之飾觀、技術、贿、鶴放及献簡單說明) 【發明所屬之技術領域】 本發明係有關於一種搬送式基板處理裝置，係使用於適 用在液晶顯不裝置用玻璃基板之製造中。 【先前技術】 被使用在液晶顯示裝置之玻璃基板係爲，藉由在作爲素 材之玻璃基板表面上反覆實施蝕刻、剝離等化學處理所製 造的。此種基板處理裝置係大區分爲乾式與濕式，濕式係 被區分爲間歇式與饋紙式。而饋紙式更被細分爲定位置旋 轉式與藉由輥輪搬送等之搬送式。 在該等基板處理裝置中，搬送式之物其基本構造係形成 爲將基板於水平方向進行搬送，而一面將處理液供給至基 板之表面，因呈高效率故而過去以來係被使用在触刻處理 或剝離處理中。 在搬送式基板處理裝置中，基板係依序通過承接部（載 入部）、避液部、藥液處理部、洗淨部、以及除液部。在藥 液處理部中，將由被配置在基板搬送線之上方的晴嘴來吐 出飩刻液、剝離液等藥液，藉由將基板通過該藥液中而使 藥液供給至基板之表面整體。藉由此種藥液處理，而使基 板之表面接受選擇性的化學處理。 不過，被配置在藥液處理部之上游側、亦即爲配置在藥 液處理部與承接部之間的避液部’其目的係爲用以防止以 - 7- 593090 下游側之藥液處理部所使用之藥液、更甚者爲藥液處理部 內之藥液環境氣體侵入至具備有複雜承接機構之上游側的 承接部，換言之，其係作爲一種緩衝器（緩衝部）。 爲了達成此種目的，避液部內並非僅有被吸附呈負壓 狀，避液部之全長係爲了足以完全收容基板，而被設定呈 大於基板之長度，並且，在設於其前壁及後壁上之基板入 口及基板出口方面爲配備有閘門（s hu t t e r )。而當開啓入 口、而出口爲呈封閉狀態下，當基板進入至避液部內時， 暫時停止基板且封閉入口。之後，開啓出口，使基板由避 液部朝下游側之藥液處理部進出。藉由在此種時間點下操 作基板之搬送、以及入口與出口之閘門，便可暫時性的迴 避使承接部直接連結至藥液處理部之事態，形成可防止因 藥液而造成承接部內之污染。 然而，在實際的操作作業中，縱使更加2重、3重之兼 顧，其現況仍是無法防止以藥液所造成承接部內之污染。 其最大原因係在於，基板在通過出口而由避液部侵入至藥 液處理部的途中，在藥液處理部這方面係開始進行藥液之 吐出，造成傳遞至基板上面，大量之藥液侵入到避液部中， 而使避液部充滿了藥液環境氣體，縱使將避液部內排氣呈 負壓狀，亦可判斷在開放入口時，並無法避免由避液部朝 向承接部之藥液環境氣體的侵入。 當基板完全送出避液部，倘若判斷成由封閉出口之閘門 開始而著手在藥液處理部中之藥液吐出時便可抑制朝向避 液部之藥液的侵入、亦可抑制承接部內之污染，不過，另 - 8 - 593090 一方面卻使得藥液之吐出開始延遲，造成藥液處理部增長 之在傳輸性、設備規模上極大的問題。 本發明之目的係爲提供一種搬送式基板處理裝置，即使 將基板由避液部之出口通過的時間點下’開始下游側之藥 液處理部之藥液吐出操作，係可有效地防止上游側之承接 部的藥液污染。 【發明內容】 爲了達成上述目的，本發明之搬送式基板處理裝置係 爲，使基板朝水平方向搬送、通過多數的處理部，以多數 處理部中至少1個進行藥液處理，同時，將避液部設在藥 液處理部之上游側的搬送式基板處理裝置中，其特徵在於， 將前述避液部內以至少1個隔牆而在基板搬送方向上區隔 呈多數室，所設置之排氣裝置係爲，除了前述避液部內之 最上游側之室內以外，爲將至少1個室內呈負壓狀地進行 吸附。 在本發明之搬送式基板處理裝置中，除了在避液部中之 多數室內中之最上游側之室內以外，使至少1個室內吸附 呈負壓狀。在2室的情況下則將下游側之室內吸附呈負壓 狀。在3室以上的情況下，除了最上游側之室內以外，使 2個以上之室內之至少1個吸附呈負壓狀。藉此，使最上 游側之室內經常地維持潔淨的環境氣體，且在與避液部之 上游側連接之部分爲形成有經常潔淨之區域。其結果，用 以防止在避液部之上游側中之污染。 有關於多數室之壓力管理，係以將在避液部中之最上游 -9 - 593090 側之室內管理呈常壓或正壓者爲佳。此外，將避液部於基 板搬送方向上區隔呈3個以上之室，除了避液部中之最上 游側之室內及最下游側之室內以外，以將至少1個之室內 吸附呈負壓狀者爲佳。在此，不僅是將特定之室內管理呈 負壓狀，在由避液部中之最上游側之室內至最下游側之室 內的期間，亦可有效地使壓力呈階段性的減低。 有關分隔避液部之隔牆方面，係以將隔牆位置設定呈， 將避液部於基板搬送方向上區隔呈3個以上之室，而基板 前端在到達至下游側之藥液處理部中之藥液吐出開始位置 的時間點下，基板之後端爲脫離在避液部中之最上游側之 室內，更佳爲，以將隔牆位置設定呈，當基板之前端在到 達於藥液處理部中之藥液吐出開始位置的時間點下，使基 板之後端進入在避液部中之最下游側之室內。 藉此，以下流側之藥液處理部所吐出之藥液，係傳遞至 基板之上面、而不致有侵入最上游側之室內之虞，且可更 加有效地防止避液部之上游側中之污染。 此外，將基板暫時收容至避液部內，爲了避免避液部之 上游側與下游側連通之事態，係以將避液部之全長設成大 於基板之長度，且將閘門裝配在避液部之基板入口及基板 出口上者爲佳。 【實施方式】 以下，依據圖式詳細說明本發明之實施例。 本實施例之基板處理裝置，係爲一種使用在液晶顯示裝 置用玻璃基板之製造的蝕刻裝置。此種基板處理裝置係如 - 1 0 - 593090 第1圖所示，具備有朝向基板1 0之搬送方向依序配置的承 接部2 0、避液部3 0、藥液處理部4 0、洗淨部5 0、以及除 液部60。各部係分別裝備有將基板1 0呈水平支撐、且朝 水平方向進行搬送之多數的搬送輥輪2 1、3 1、4 1、5 1、6 1。 被設置在承接部20與藥液處理部40之間、以作爲緩衝 器（緩衝部）之避液部3 0係如第1圖與第2圖所示，藉由2 個隔牆32a、32b而在基板10之搬送方向上分隔區隔呈3 室33a、33b、33c。在被設於上游側之承接部20間之隔牆 的入口上，係裝配有開閉式之閘門34a。同樣的，在被設 於下游側之藥液處理部40間之隔牆的出口上，亦裝配有開 閉式之閘門34b。此外，在前述隔牆32a、32b上，係設有 使基板1 0通過之縫狀的通過口。 鄰接於上游側之承接部20之上游側的第1室33a係形 成爲潔淨室，且構成爲被管理呈若干正壓狀。中央之第2 室3 3b係形成爲，由被設於底面之排氣口 35而使內部構成 吸附排氣呈負壓狀。鄰接於下游側之藥液處理部40之第3 室33c係爲，爲了排出由藥液處理部40所侵入之藥液（在 此係爲蝕刻液），而形成爲將排液口 36設在底面之構造。 避液部20之全長L1係大於基板10之長度L2。此外， 在由第2個隔牆3 2b至下游側之藥液處理部40中之藥液吐 出開始位置爲止的距離L3，係被設定呈大於基板1 0之長 度L2。 在藥液處理部40中，由上方將藥液（在此係爲蝕刻液） 供給至基板1 0之上面的噴嘴單元42係爲，被設置在以位 -11- 593090 於基板1 〇之搬送線之上方。 在洗淨部50方面，由上方將純水呈噴灑狀地散佈於基 板1 0之上面的第1噴灑單元5 2、以及由下方將純水呈噴 灑狀地散佈於基板1 0之下面的第2噴灑單元5 3，係被設 置呈夾持基板1 0之搬送線。 在除液部60方面，所設有之上下一對之氣刀用的縫狀 噴嘴62、63，係被配置呈由上下夾持基板1 0之搬送線。 上側之縫狀噴嘴62係呈全幅地跨越基板1 0之上面、藉由 將空氣呈薄膜狀地進行吹附，而由洗淨後之基板1 0之上面 除去水滴、水分。下側之縫狀噴嘴6 3係呈全幅地跨越基板 1 0之下面、藉由將空氣呈薄膜狀地進行吹附，而由洗淨後 之基板10之下面除去水滴、水分。上下之縫狀噴嘴62、63 係爲了提昇水滴、水分之除去效率，在側面所視爲朝基板 1 0之搬送方向上游側傾斜、在平面所視爲朝側方傾斜。 在本實施例之基板處理裝置中，藉由將基板1 0依序通 過承接部20、避液部30、藥液處理部40、洗淨部50、以 及除液部60，而在基板1 〇之上面實施藥液處理（在此係爲 鈾刻處理），在洗淨上下面後進行乾燥處理。 當基板10由承接部20朝避液部30進入時，將兩部操 作呈朝向分隔閘34a爲開啓方向，便使入口開啓。此時爲 使中央之第2室33b排氣呈負壓狀。此外，分隔避液部30 與藥液處理部40之閘門34b係朝關閉方向操作，而封閉出 口。在此狀態下，基板10係進入至避液部30內。當基板 1 0完全進入避液部3 0內後，該基板1 0係暫時停止、在此 - 12 - 593090 期間爲先將聞門34a關閉’其次再開啓閘門34b。藉由此 種動作來迴避承接部20與藥液處理部40直接連接之事態。 當閘門34b開啓後再度開始基板1 〇之搬送，基板1 〇係 由避液部3 0而朝藥液處理部40送出。且基板1 〇之前端爲 在到達噴嘴單元42之時間點下開始藥液之吐出。 當開始藥液之吐出後，傳送至基板1 0之上面的藥液係 大量的侵入至避液部3 0。不過，在開始藥液之吐出的時間 點下，基板1 0之後端係完全地進入第3室3 3 c。因此，大 量侵入避液部3 0之藥液係僅侵入至第3室3 3 c，而不會侵 入至第1室33a與第2室33b。侵入至第3室33c之藥液 係藉由被儲存在第3室3 3 c之純水所稀釋，而由排液口 3 6 逐步朝外部排出。 此時，使第1室3 3a管理呈正壓狀、將第2室33b吸附 呈負壓狀。因此，由第3室33c直接、或是由藥液處理部 40經由第3室33c而將藥液之蒸氣侵入第2室33b，同時， 亦形成有由第1室33a朝向第2室33b之氣流。因而迴避 藥液或其蒸氣侵入至第1室3 3 a之事態。亦即，與承接部 2 0連接之第1室3 3 a係形成爲由氣、液兩面觀之爲維持經 常潔淨之區域。故而形成爲均無藥液環境氣體侵入承接部 20之危險性。 如此，將被配置在承接部20之下游側之避液部3〇分成 3室，將中央之第2室33b吸附呈負壓狀的同時，極力要 求傳遞基板10之上面的藥液爲不致侵入至第2室33b或上 游側之第1室3 3 a，藉此，而可將不受到藥液污染而經常 -1 3 _ 593090 呈潔淨狀之區域形成在與避液部30內之承接部20的部分。 藉此’基板無須等待由避液部3 0脫離，基板1 0係無關於 由通過避液部30之出口途中至開始於藥液處理部40中之 藥液吐出，而可完全地防止由承接部2 0內之藥液所造成之 污染。 另外’當構成爲基板1 〇爲結束通過避液部3〇之出口、 由封閉其閘門34b開始進行藥液處理時，形成爲必須要有 較藥液處理部40內之噴嘴單元42更爲前方、且超越基板 1 〇之長度的空間，而造成裝置之大型化。此外，增長處理 時間、惡化傳輸性。 此外，上述實施例雖係爲蝕刻裝置，不過同樣地亦可適 用在剝離裝置方面。 〔產業上利用之可能性〕 如上述說明所述，本發明之基板處理裝置係爲，使基板 朝水平方向搬送、通過多數之處理部，以多數處理部中之 至少1個來進行藥液處理的同時，將避液部設於藥液處理 部之上游側的搬送室基板裝置中，其中，將前述避液部內 藉由多數之隔牆而於基板搬送方向區隔呈多數室，除了前 述避液部內之最上游側之室內以外，至少將1個室內吸附 呈負壓狀，藉此，即使室由通過避液部之出口的階段下開 始於下游側之藥液處理部的噴灑等藥液散佈操作，亦可有 效地防止上游側之承接部的藥液污染。 【圖式簡單說明】 第1圖所示係本發明一實施例之基板處理裝置之槪略側 一 14 一 593090 面圖。 第2圖所示係避液部之槪略平面圖。 【主要部分之代表符號說明】 L 1 :避液部之全長 L 2 ·長度 L3 :距離 1 0 :基板 2 0 :承接部 2 1、3 1 :搬送輥輪 3 0 :避液部 32a、32b :隔牆 33a :第1室 33b :第2室 33c :第3室 3 4 a、3 4 b :閘門 3 5 :排氣口 3 6 :排液口 40 :藥液處理部 41、5 1、6 1 :搬送輥輪 42 :噴嘴單元 50 :洗淨部 5 2 :噴灑單元 60 :除液部 62、63 :縫狀噴嘴 -15 -593090 、 Inventive display 82 :: Factory • ............. · .....: * ....... Two: (turn Face: Decorative view, technology, bribes, cranes, and offering simple instructions) [Technical field to which the invention belongs] The present invention relates to a transportable substrate processing device, which is suitable for use in liquid crystal display devices Manufacturing of glass substrates. [Prior art] A glass substrate used in a liquid crystal display device is manufactured by repeatedly performing chemical treatments such as etching and peeling on the surface of a glass substrate as a raw material. This type of substrate processing apparatus is largely divided into a dry type and a wet type, and a wet type is divided into a batch type and a paper feed type. The paper feed type is further subdivided into fixed position rotary type and conveying type such as roller conveying. In these substrate processing apparatuses, the basic structure of the conveying type is to transport the substrate in a horizontal direction, while supplying the processing liquid to the surface of the substrate. Because of its high efficiency, it has been used in the past. Processing or peeling. In the transfer type substrate processing apparatus, the substrate is sequentially passed through the receiving section (loading section), the liquid avoiding section, the chemical liquid processing section, the cleaning section, and the liquid removing section. In the chemical liquid processing section, a chemical liquid such as an engraving liquid and a peeling liquid is discharged from a clear nozzle disposed above the substrate transfer line, and the chemical liquid is supplied to the entire surface of the substrate by passing the substrate through the chemical liquid. . With this chemical treatment, the surface of the substrate is subjected to a selective chemical treatment. However, the "liquid avoiding section" which is arranged upstream of the chemical solution processing section, that is, disposed between the chemical solution processing section and the receiving section, is for preventing the chemical solution processing on the downstream side of-7-593090. The medicinal solution used by the Ministry, or even the medicinal solution ambient gas in the medicinal solution processing section, invades the receiving section on the upstream side with a complex receiving mechanism, in other words, it serves as a buffer (buffer section). In order to achieve this purpose, the liquid avoidance part is not only attracted to negative pressure. The full length of the liquid avoidance part is set to be larger than the length of the substrate in order to fully accommodate the substrate. The entrance and exit of the substrate on the wall are equipped with shutters. When the inlet is opened and the outlet is in a closed state, when the substrate enters the liquid-repellent portion, the substrate is temporarily stopped and the inlet is closed. After that, the outlet is opened to allow the substrate to enter and exit from the liquid-avoiding section toward the chemical processing section on the downstream side. By operating the substrate transfer and the gates at the entrance and exit at this point in time, it is possible to temporarily avoid the situation where the receiving unit is directly connected to the medicinal solution processing unit, and it is possible to prevent the inside of the receiving unit from being caused by the medicinal solution. Pollution. However, in actual operation, even if the two-layer and three-layer are taken into consideration, the current situation is still unable to prevent the contamination in the receiving part caused by the medicinal solution. The biggest reason is that the substrate is intruded from the liquid avoiding section to the chemical solution processing section through the outlet, and the chemical solution processing section starts to spit out the chemical solution, which causes the transfer to the substrate and a large amount of chemical solution invades. To the liquid-repellent part, and the liquid-repellent part is filled with the chemical liquid ambient gas. Even if the exhaust in the liquid-repellent part is in a negative pressure, it can be judged that when the inlet is opened, the medicine from the liquid-repellent part to the receiving part cannot be avoided. Intrusion of liquid ambient gas. When the substrate is completely sent out of the liquid avoidance section, if it is judged to start from the gate that closes the exit, and the medical solution in the liquid solution processing section is discharged, the invasion of the liquid solution toward the liquid avoidance section can be suppressed, and the contamination in the receiving section can be suppressed. However, on the other hand, 593090 delayed the discharge of the medicinal solution on the one hand, which caused the problems of increasing the transportability and equipment scale of the medicinal solution processing department. An object of the present invention is to provide a transfer-type substrate processing apparatus capable of effectively preventing an upstream side even if a chemical liquid discharge operation of a downstream side chemical liquid processing unit is started at a point in time when a substrate is passed through an exit of the liquid avoidance unit. Contamination of the medicinal solution in the receiving section. [Summary of the Invention] In order to achieve the above-mentioned object, the transfer type substrate processing apparatus of the present invention transports a substrate in a horizontal direction, passes through a plurality of processing sections, and performs chemical liquid processing in at least one of the plurality of processing sections. The liquid part is provided in a transfer type substrate processing apparatus on the upstream side of the chemical liquid processing part, wherein the liquid avoiding part is divided into a plurality of chambers in the substrate conveying direction by at least one partition wall, and the row is provided. The air device is configured to adsorb at least one room in a negative pressure state except for the room on the most upstream side in the liquid-repellent portion. In the transfer-type substrate processing apparatus of the present invention, at least one of the indoor chambers is adsorbed in a negative pressure state except in the indoor chamber on the most upstream side of most of the liquid-repellent chambers. In the case of two chambers, the downstream chamber is adsorbed in a negative pressure. In the case of three or more chambers, at least one of the two or more chambers is adsorbed in a negative pressure state except for the chamber on the most upstream side. Thereby, the room on the uppermost side is constantly maintained in a clean ambient gas, and a portion that is connected to the upstream side of the liquid-repellent portion is a region that is often cleaned. As a result, it is used to prevent contamination in the upstream side of the liquid-repellent portion. Regarding the pressure management of most rooms, the room management on the -9-593090 side of the most upstream side of the liquid avoiding section is preferably a normal pressure or a positive pressure. In addition, the liquid-repellent portion is divided into three or more rooms in the substrate conveying direction, and at least one of the rooms is negatively adsorbed except for the room on the most upstream side and the room on the most downstream side of the liquid-repellent portion. Those who are in good shape are better. Here, not only the specific room management is in negative pressure, but also the pressure can be effectively reduced stepwise during the period from the room on the most upstream side to the room on the most downstream side of the liquid-repellent section. As for the partition wall that separates the liquid avoidance section, the position of the partition wall is set to separate the liquid avoidance section into three or more rooms in the substrate conveying direction, and the front end of the substrate reaches the chemical liquid processing section on the downstream side. At the time point when the medicine solution is ejected from the starting position, the rear end of the substrate is detached from the room on the most upstream side in the liquid avoidance section. It is more preferable to set the position of the partition wall so that when the front end of the substrate reaches the medicine solution At the point in time when the chemical solution is ejected from the processing section, the rear end of the substrate is caused to enter the chamber located on the most downstream side of the liquid avoidance section. Thereby, the chemical liquid discharged from the chemical liquid processing section on the downstream side is transmitted to the upper surface of the substrate without risk of entering the room on the most upstream side, and the liquid on the upstream side of the liquid avoiding section can be more effectively prevented Pollution. In addition, the substrate is temporarily housed in the liquid-repellent portion. In order to prevent the upstream side and the downstream side of the liquid-repellent portion from communicating, the total length of the liquid-repellent portion is set to be longer than the length of the substrate, and the gate is assembled in the liquid-repellent portion. The substrate inlet and substrate outlet are preferred. [Embodiment] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The substrate processing apparatus of this embodiment is an etching apparatus manufactured by using a glass substrate for a liquid crystal display device. Such a substrate processing apparatus is shown in FIG.-1 0-593090 as shown in Fig. 1. It includes a receiving section 20, a liquid avoiding section 30, a chemical processing section 40, and a washing device, which are sequentially arranged toward the conveying direction of the substrate 10. The clean section 50 and the liquid removal section 60. Each department is equipped with a plurality of transfer rollers 21, 3 1, 4 1, 5 1, 6 1 that support the substrate 10 horizontally and transfer the substrates in a horizontal direction. The liquid-repellent section 30, which is provided between the receiving section 20 and the medicinal-solution processing section 40 as a buffer (buffer section), is shown in Figs. 1 and 2 with two partition walls 32a, 32b. In the conveying direction of the substrate 10, the partitions are divided into three compartments 33a, 33b, and 33c. An opening-and-closing gate 34a is installed at the entrance of the partition wall between the receiving portions 20 provided on the upstream side. Similarly, an opening-and-closing gate 34b is also installed at the exit of the partition wall between the chemical liquid processing section 40 provided on the downstream side. The partition walls 32a and 32b are provided with slit-shaped passage openings through which the substrate 10 passes. The first chamber 33a adjacent to the upstream side of the receiving portion 20 on the upstream side is formed as a clean room, and is configured to be managed to have a certain positive pressure. The second chamber 3 3b in the center is formed by the exhaust port 35 provided on the bottom surface so that the internal structure adsorbs the exhaust gas into a negative pressure. The third chamber 33c adjacent to the chemical liquid processing section 40 on the downstream side is formed so that the liquid discharging port 36 is provided in order to discharge the chemical liquid (here, an etching liquid) invaded by the chemical liquid processing section 40. Structure of the bottom surface. The total length L1 of the liquid avoiding portion 20 is larger than the length L2 of the substrate 10. In addition, the distance L3 from the second partition wall 32b to the chemical liquid discharge start position in the chemical liquid processing section 40 on the downstream side is set to a length L2 longer than the substrate 10. In the chemical liquid processing unit 40, the nozzle unit 42 that supplies the chemical liquid (here, the etching liquid) to the upper surface of the substrate 10 from above is disposed at a position of -11-593090 and transported to the substrate 10 Above the line. In the cleaning unit 50, the first spraying unit 5 2 that sprays pure water on the upper surface of the substrate 10 from above and the first spraying unit 5 that sprays pure water on the bottom of the substrate 10 from the bottom. 2 The spraying unit 5 3 is provided as a transfer line holding the substrate 10. In the liquid removal section 60, slit-shaped nozzles 62 and 63 for the air knife of the upper and lower pairs are provided as a transfer line for holding the substrate 10 up and down. The upper slit-shaped nozzle 62 spans the entire surface of the substrate 10, blows air in a thin film form, and removes water droplets and water from the surface of the substrate 10 after cleaning. The slit-shaped nozzle 63 on the lower side is across the lower surface of the substrate 10 in full width, and air is blown in a thin film shape, and water droplets and moisture are removed from the lower surface of the substrate 10 after cleaning. The upper and lower slit-shaped nozzles 62 and 63 are inclined toward the upstream side of the substrate 10 in the conveying direction when viewed from the side, and are inclined toward the side when viewed from the plane in order to improve the removal efficiency of water droplets and moisture. In the substrate processing apparatus of this embodiment, the substrate 10 is passed through the receiving section 20, the liquid avoiding section 30, the chemical liquid processing section 40, the cleaning section 50, and the liquid removing section 60 in this order. The upper part is treated with a chemical solution (in this case, a uranium etching process), and the upper and lower parts are washed and then dried. When the substrate 10 enters from the receiving portion 20 toward the liquid-repellent portion 30, the two operations are opened toward the partition gate 34a to open the entrance. At this time, the second chamber 33b in the center is in a negative pressure. In addition, the shutter 34b separating the liquid avoiding portion 30 and the chemical liquid processing portion 40 is operated in the closing direction to close the outlet. In this state, the substrate 10 enters the liquid-repellent portion 30. After the substrate 10 completely enters the liquid-repellent portion 30, the substrate 10 is temporarily stopped. During this period, the door 34a is closed first, and then the shutter 34b is opened. By this operation, the situation in which the receiving section 20 and the chemical liquid processing section 40 are directly connected is avoided. After the shutter 34b is opened, the transfer of the substrate 10 is resumed, and the substrate 10 is sent out from the liquid-avoiding portion 30 toward the chemical liquid processing portion 40. And the front end of the substrate 10 is to start the discharge of the chemical solution at the time point when the nozzle unit 42 is reached. When the discharge of the medicinal solution is started, a large amount of the medicinal solution transferred onto the substrate 10 penetrates into the liquid-avoiding section 30. However, at the time point when the discharge of the medicinal solution was started, the end system after the substrate 10 completely entered the third chamber 3 3 c. Therefore, a large amount of the medicinal solution that has penetrated into the liquid-repellent portion 30 only penetrates into the third chamber 3 3 c, and does not penetrate into the first chamber 33a and the second chamber 33b. The medicinal solution that has penetrated into the third chamber 33c is diluted with pure water stored in the third chamber 3 3c, and is gradually discharged to the outside through the drain port 3 6. At this time, the first chamber 33a is managed in a positive pressure state, and the second chamber 33b is adsorbed in a negative pressure state. Therefore, the vapor of the medicinal solution penetrates the second chamber 33b directly from the third chamber 33c or the medicinal solution processing unit 40 via the third chamber 33c, and at the same time, the second chamber 33b is formed from the first chamber 33a to the second chamber 33b airflow. Therefore, the situation where the medicinal solution or its vapor enters the first chamber 3 3 a is avoided. That is, the first chamber 3 3a connected to the receiving portion 20 is formed as a region maintained from the gas and liquid sides to maintain constant cleanliness. Therefore, there is no danger that any chemical liquid ambient gas will enter the receiving portion 20. In this way, the liquid-repellent portion 30 disposed on the downstream side of the receiving portion 20 is divided into three chambers, and the second central chamber 33b is adsorbed in a negative pressure state, and it is strongly requested that the chemical solution on the substrate 10 be transmitted so as not to penetrate By going to the second chamber 33b or the first chamber 3 3 a on the upstream side, it is possible to form a clean region that is not contaminated by the medicinal solution and often -1 3 _ 593090 in the receiving portion with the liquid-repellent portion 30 20 parts. In this way, the substrate does not need to wait for the liquid to escape from the liquid avoiding section 30, and the substrate 10 does not have to pass through the exit of the liquid avoiding section 30 to the start of the chemical solution in the chemical solution processing section 40, and can completely prevent the Pollution caused by the medicinal solution in Department 20. In addition, when the substrate 10 is configured to finish passing through the exit of the liquid-avoiding section 30 and the chemical liquid processing is started by closing its shutter 34b, it must be formed to be more forward than the nozzle unit 42 in the chemical liquid processing section 40. And the space beyond the length of the substrate 10, resulting in a larger device. In addition, it increases processing time and deteriorates transmission performance. In addition, although the above-mentioned embodiment is an etching apparatus, the same applies to a peeling apparatus. [Possibility of Industrial Utilization] As described above, the substrate processing apparatus of the present invention transports a substrate in a horizontal direction, passes through a plurality of processing sections, and performs chemical solution processing in at least one of the plurality of processing sections. At the same time, the liquid-repellent portion is provided in the transfer chamber substrate device upstream of the chemical liquid processing portion, wherein the liquid-repellent portion is divided into a plurality of chambers in the substrate conveying direction by a plurality of partition walls, except for the aforesaid liquid-repellent portion. At least one of the rooms outside the room on the most upstream side in the liquid portion is adsorbed to a negative pressure, so that even if the room passes through the exit of the liquid-avoiding portion, the liquid starts to be sprayed on the downstream portion of the liquid-medicine processing portion, and the like. The spreading operation can also effectively prevent the liquid contamination of the receiving portion on the upstream side. [Brief description of the drawings] FIG. 1 is a schematic side view of a substrate processing apparatus according to an embodiment of the present invention. Figure 2 is a schematic plan view of the liquid-avoiding section. [Description of representative symbols of main parts] L 1: Full length L 2 of the liquid-repellent part · Length L 3: Distance 1 0: Substrate 2 0: Receiving part 2 1, 3 1: Transport roller 3 0: Liquid-repellent parts 32 a, 32 b : Partition wall 33a: First room 33b: Second room 33c: Third room 3 4 a, 3 4 b: Gate 3 5: Exhaust port 3 6: Drain port 40: Chemical solution processing section 41, 5 1. 6 1: Transfer roller 42: Nozzle unit 50: Washing section 5 2: Spray unit 60: Liquid removing section 62, 63: Slit nozzle -15-