TWI344392B - - Google Patents

Description

1344392 IX. Description of the Invention: [Technical Field] The present invention relates to an FPD (Flat Panel Display) such as an LCD (Liquid-Crystal Display), a PDP (Plasma Display Panel), or the like. A substrate processing apparatus that supplies various processing liquids and performs processing using a substrate such as a glass substrate, a glass substrate for a photomask, or a semiconductor substrate. [Prior Art] Conventionally, a device has been known which has a plurality of processing chambers, and performs a predetermined process on the substrate by supplying a processing liquid to the substrate in each processing chamber while transporting a substrate such as a glass substrate for LCD or PDP. . For example, Patent Document 1 discloses a device in which a peeling treatment chamber for peeling a photoresist film by supplying a peeling liquid to a substrate and a cleaning processing chamber for cleaning the substrate after the peeling treatment are provided adjacently. In such a device, it is considered that the processing liquid which is filled with the mist in the processing chamber accompanying the processing enters the adjacent processing by the opening for the substrate transfer (referred to as the adjacent processing chamber), and the adjacent processing chamber is The processing of the substrate brings various effects. For example, in the apparatus of the above Patent Document 1, the peeling liquid which has been used in the peeling treatment chamber is recovered and reused (recycling), but in consideration of this, if the mist of the cleaning liquid invades from the cleaning processing chamber to the peeling treatment In the chamber, the liquid quality of the stripping liquid is deteriorated. Therefore, in general, for example, as shown in Patent Document 2, the shutter is slid between the processing chambers, and the opening portion is opened only when the substrate is conveyed, thereby preventing the mist from entering the adjacent processing chamber. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2004-146414 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2000-58501 [Draft of the Invention] [Problems to be Solved by the Invention] However, even for A device is provided with a gate between the processing chambers. Since the opening is arbitrarily opened during the substrate transfer, the mist can easily pass through the opening and invade the adjacent processing chamber, thereby preventing the intrusion of the mist into the adjacent processing chamber. There is still room for improvement. Further, it is considered that the mist adhered to the gate when the opening is closed may be scattered into the adjacent processing chamber when the shutter is actuated. In particular, in the configuration of Patent Document 2, the gate is poured into the processing chamber side due to the rotation of the gate around the horizontal axis. Since it can be inverted, the attached mist or the like easily scatters when the gate is actuated (especially when it is open), and this needs to be improved. Further, in a device in which a plurality of processing chambers are adjacent, the intrusion of the mist from any of the processing chambers into the other processing chamber becomes a problem, and the opposite is often to some extent. For example, in the apparatus of Patent Document 1, when the peeling liquid is prevented from being deteriorated, it is necessary to prevent the mist from intruding from the cleaning processing chamber to the peeling processing chamber, and conversely, the intrusion of the peeling liquid (fogging liquid) into the cleaning chamber is not completed. problem. Therefore, in order to prevent the intrusion of the mist, it is preferable to discuss the countermeasures after considering the above. The present invention has been made in view of the above problems, and an object thereof is to provide a substrate processing apparatus which more effectively prevents intrusion of a mist-like processing liquid into an adjacent processing chamber. [Means for Solving the Problems] 132063.doc In order to solve the above problems, the basic configuration of the substrate processing apparatus of the present invention is as follows: a wet processing in which a substrate is supplied with a processing liquid to perform a specific wet treatment on the substrate. , and! Opening and ejecting a substrate with respect to the wet processing chamber by an opening for the earth plate to be formed on the partition wall of the wet processing chamber, the substrate processing apparatus includes a shutter mechanism that opens and closes the above The opening portion and the air flow forming means "including a nozzle member disposed outside the wet processing chamber, and when at least the opening is opened, gas is ejected from the nozzle member to form an air flow toward the opening. According to the substrate processing apparatus, when the opening portion is opened by the door opening mechanism, the gas is ejected from the nozzle member mainly when the substrate passes through the opening, thereby forming an airflow toward the opening in the wet processing chamber. And the action of the air pressure prevents the treatment liquid (fog liquid) that has passed through the opening portion from flowing out of the wet processing chamber to the outside. Therefore, it is possible to prevent the mist from flowing out more than the previous device & which uses only the door mechanism to open and close the opening. Further, in the substrate processing apparatus, preferably, the door closing mechanism includes a fourth door mechanism and a second door mechanism, and the door mechanism includes opening and closing from an indoor side of the wet processing chamber. The second door closing mechanism of the opening portion includes a shutter body that opens and closes the opening from an outdoor side of the wet processing chamber, and an upper forming mechanism that feeds the substrate through the opening from the nozzle member Thereby, a gas flow flowing from the chamber of the wet processing chamber to the indoor side is formed on the surface of the substrate. 51 132063.doc 1344392 According to the above configuration, since the gate device (the first gate mechanism) is also provided in the wet processing chamber, it is difficult for the mist liquid to adhere to the gate body of the gate structure (second gate mechanism) of the wet processing chamber. on. Therefore, it is possible to effectively stop the mist attached to the second shutter mechanism or the dry matter from scattering to the outdoor side of the wet processing chamber when the shutter mechanism is actuated. Further, when the substrate passes through the opening portion, the air current flowing through the indoor side of the wet processing chamber is formed on the surface of the substrate by the air flow forming means, thereby more reliably preventing the mist processing chamber from flowing out. The specific configuration includes, for example, an adjacent processing chamber that communicates with the wet processing chamber via the opening, and performs pre-treatment or post-processing of the wet processing on the substrate. In this case, The second shutter mechanism and the nozzle member are provided in the adjacent processing chamber. According to the above configuration, it is possible to effectively prevent the mist from scattering into the adjacent processing chamber during the operation of the shutter and the mist to pass through the opening during the substrate transfer to enter the adjacent processing chamber. Further, in the substrate processing apparatus as described above, the apparatus further includes a door closing control unit that closes the closed state of the opening by the shutter body and opens the shutter body to a specific retracted position. The driving state of each of the shutter mechanisms is switched between the open states of the openings. When the substrate passes through the openings, the gate control mechanism switches the first shutter mechanism from the closed state to the open state. 2 The gate mechanism is switched from the closed state to the open state. According to the above configuration, the second shutter mechanism on the outdoor side is always switched to the open state of 132063.doc 1344392 at the time of the substrate conveyance, so that the first shutter mechanism on the indoor side of the wet processing chamber is always opened, thereby effectively preventing the mist. Attached to the second gate door body. In this case, it is preferable to further include an air flow forming control unit that controls the air flow forming mechanism to supply the gas in synchronization with the operation of switching the first shutter mechanism from the closed state to the open state. . According to the above configuration, since the supply of the gas is started simultaneously with the opening of the opening, it is more effective to prevent the mist from flowing out of the wet processing chamber.

Further, in the substrate processing apparatus according to the above aspect, at least the second shutter mechanism of the shutter mechanism slides the shutter body along a wall surface of the partition wall to open and close the opening . Thus, according to the configuration in which the shutter body is slid along the wall surface of the partition wall, the shutter body does not shake as much as the so-called reversible opening and closing structure. Therefore, even if it is assumed that the mist has adhered to the gate body, it is difficult to cause The mist is scattered.

Preferably, the adjacent processing chamber further includes: an I preliminary chamber formed to surround the opening portion in the processing chamber; And a preparatory gas mechanism for exhausting the ambient gas in the preparation chamber. According to the above configuration, even if the second door mechanism opens to the opening portion, even if the mist adhered to the door closing body has scattered or passed through the opening portion, the wet processing chamber phase 丨I ρ θ λ 2 + + The side has been inserted into the adjacent processing chamber side, and the mist is quickly discharged from the preliminary chamber to the outside. 132063.doc 1344392 Further, in the substrate processing apparatus of the present invention, the following constitution may be added to the above basic configuration. . In other words, the wet processing chamber has a first processing chamber and a second processing chamber which are arranged in the substrate transporting direction, and the processing chambers are used to separate the substrates in each processing chamber. #湿处理,^__t ifc H >C F1 Λ- rfe 〇> The relationship between the mutually different treatment liquids is required to suppress the mixing of one of the treatment liquids during the substrate treatment. The liquid is provided with an intermediate chamber between the i-th processing chamber and the second processing chamber, and as the opening, an old mouth portion is provided on the wall of the i-th processing chamber and the intermediate chamber, and is in the middle a second opening is provided in the partition wall between the chamber and the second processing chamber, and a door mechanism for opening and closing the opening of the second opening 2 is provided as the door mechanism, and the airflow forming mechanism is configured The nozzle member is provided in the intermediate chamber, and the gas is ejected from the nozzle member to form an airflow toward the target opening, and the target opening is an opening of the correction opening and the second opening. An opening portion between the processing chamber and the intermediate chamber using the other processing liquid is used as the object opening, and the substrate processing apparatus is further provided with an intermediate chamber exhausting mechanism, the nozzle of the airflow forming mechanism The intermediate chamber is exhausted by the exhaust gas π at a position between the member and the opening of the object. Here, the concept of 'household' and stomach's "different treatment liquids" is that, in addition to the treatment liquids having different properties (attributes), the treatment liquids having different properties and different types, and the properties and types are common, and only the concentration is common. Different treatment liquids, etc. According to the substrate processing apparatus, the i-th processing chamber and the second processing k (four) 132063.doc -11. 1344392 f have an opening portion (the target opening portion) on the processing chamber side using the other processing liquid. When it is opened, the nozzle member provided in the intermediate chamber is ejected toward the target opening, and as a result, the mist (other-treatment liquid) is prevented from flowing out from the target opening. Further, even when the mist liquid has flowed out a certain amount, the mist is discharged from the towel compartment to the outside by the intermediate chamber exhaust mechanism. At this time, since the exhaust port is provided at a position between the nozzle member and the opening of the object, the mist which has flowed out is quickly discharged. Therefore, it is effective to prevent the above-mentioned mist from invading the other processing chamber (i.e., using the processing chamber having the above-described processing liquid), thereby preventing the other processing liquid from being mixed into one of the above treatment liquids. Further, in the substrate processing apparatus, preferably, a knife partition wall is disposed in the intermediate chamber to partition the inside of the intermediate chamber into a nozzle chamber including the nozzle member, and the object opening The oxygen in the portion and the exhaust port to the nozzle member causes the oxygen to pass through the opening for substrate transfer provided on the partition wall, and is discharged to the exhaust chamber side. According to the above configuration, even when a plurality of mists 16 pass through the opening portion of the object, it is possible to effectively prevent the mist from diffusing toward the other processing chamber side by using the partition wall. Therefore, it is possible to more effectively prevent the above-mentioned mist from intruding into the above other processing chamber. Further, it is preferable that the airflow forming means supplies a gas to the substrate passing through the target opening σ from the nozzle member, thereby forming an airflow flowing from the intermediate chamber side to the processing chamber side along the substrate surface. According to the above configuration, while the substrate passes through the target opening portion, a flow of air flowing from the intermediate chamber side to the processing chamber side is formed on the surface of the substrate 132038.doc • 12· 1344392 to effectively prevent the mist from flowing from the processing chamber along the substrate. Flow out. Further, in the above apparatus, the mutually different processing liquids are processing liquids of the same type different in degree, and the processing liquid of the concentration is the user in the first processing chamber, and the nozzle member is provided in the above The opening portion serves as the target opening portion and discharges gas to the opening portion. In this apparatus, the same treatment is carried out in each of the processing chambers. However, as a result of the configuration of the device, it is effective to prevent the low-concentration mist (treatment liquid) from flowing out of the second processing chamber and entering the first treatment. room. Therefore, it is possible to effectively prevent the low-temperature mist from being mixed into the high-concentration treatment liquid to make the treatment liquid diluted. This configuration is particularly useful for the rupture of the following means: the processing chamber venting means for exhausting the first processing chamber, and the trapping mechanism for collecting the mist contained in the exhaust gas #, that is, when the mist (high-concentration mist) contained in the exhaust gas is collected and reused, the above-mentioned apparatus is used to effectively prevent the high concentration of the collected 'reuse'. The advantage of the treatment liquid being diluted.

According to the substrate processing apparatus of claim 12 of the present invention, when the substrate passes through the opening or the like, gas is ejected from the nozzle member, and under the action of the air pressure, the passage portion is prevented from passing through the opening portion. The treatment liquid (fog liquid) flows out of the wet processing chamber to the outside. Therefore, it is possible to more reliably prevent the mist from flowing out than the prior art device which uses only the shutter mechanism to open and close the opening portion. In particular, according to the substrate processing apparatus of claims 2 to 7, a door mechanism is also disposed in the wet processing chamber, and it is difficult for the mist to adhere to the shutter of the wet processing chamber. It is effective to prevent the mist or dry matter adhering to the wet door mechanism from scattering to the outdoor side of the wet processing chamber when the gate is actuated. Further, the substrate processing apparatus according to the claims 8 to 12 is configured as: the wet processing chamber! A middle portion is provided between the processing chamber and the second processing chamber. The nozzle member is provided in the intermediate chamber, and the gas is ejected toward the target opening portion, and the intermediate chamber is exhausted by the exhaust mechanism. Therefore, the sigh is made When the mist liquid has flowed out from the opening of the object, the delta mist can be quickly discharged from the middle 4 to the outside, and the mist can be effectively prevented from flowing from one of the first and second processing chambers to the other. A treatment chamber invades. [Embodiment] A preferred embodiment of the present invention will be described with reference to the drawings. <First Embodiment> Fig. 1 shows an example of a substrate processing apparatus of the present invention. As shown in the figure

The substrate processing apparatus is a process processing apparatus that performs a specific process on the substrate S in a predetermined order while transporting the substrate s. This figure schematically shows a part thereof. As shown in the figure, the substrate processing apparatus includes a wet processing unit 2 that supplies a chemical liquid (processing liquid) to the substrate S, performs a specific chemical liquid processing, and performs a dry cleaning treatment on the substrate S as a pretreatment thereof. Each of the processing units 1、β has a box-shaped sealed processing chamber 10 and 2, respectively. These processes are 10 to 20 in common with the partition walls 11 and are adjacent to each other, and communicate with each other through the opening portions 1 la for substrate transfer formed on the partition walls u. The opening Ua is formed in a widthwise direction (a direction orthogonal to the conveying direction of the substrate S, in the figure, a vertical 132063.doc -14-1344392 on the large surface A λ , D ) of the paper surface, and is formed in an elongated rectangular shape, and is formed The size is required for the substrate s to pass. In addition, when the field β and the "upstream side" and the "downstream side" are described below, it means the side based on the conveyance direction of the substrate 8. The inside of the "processing chamber 1" is configured such that a plurality of conveying rollers 5' are provided at a predetermined interval, and the substrate S is conveyed in a horizontal posture by the driving of the conveying rollers 5.

As shown in the figure, the preparation chamber 12 surrounding the opening portion ua is formed inside the processing chamber 1 (corresponding to the adjacent processing chamber of the present invention) of the pretreatment portion. Thereby, a part of the space including the opening portion lu in the processing chamber 1 is separated from the space other than the space.

The wall surface facing the partition wall in the preliminary chamber 12 is configured such that the passage opening 12a of the substrate S is formed, and the substrate S passes through the passage opening 12a and passes through the preliminary chamber 12. Further, in the preliminary chamber 12, an exhaust passage 12b is connected to the ceiling portion thereof. The exhaust passage 12b is led out to the outside of the processing chamber 1b and connected to the negative pressure pump 13 or the like, whereby the ambient gas in the preliminary chamber 12 is always exhausted. Further, in the present embodiment, the exhaust passage 12b, the negative pressure pump 13, and the like correspond to the preliminary chamber exhausting mechanism of the present invention. In the preliminary chamber 12, a shutter device 14 (corresponding to the second shutter mechanism of the present invention) that opens and closes the opening i la is provided. The shutter device 14 is composed of a shutter body 15 for opening and closing the opening portion 11a from the front processing portion i side, and a driving mechanism for driving the shutter body 15. The shutter body 15 has a flat plate shape elongated in the width direction, and the entirety 132063.doc -15-1344392 is composed of a material having chemical resistance. The driving mechanism is configured such that the closing door 5 moves down the wall of the partition wall 11. Specifically, as shown in FIG. 2, it is configured to have a guide member 16 for guiding the shutter body n along the partition wall u. The racks m disposed on the guide member 16 are respectively spliced to the racks 16a and (10). a drive shaft 17 of the pinion gears i7a, i7b; and a motor 18 for driving the drive shaft 17, etc.; in response to the forward and reverse rotation drive of the drive shaft 17, the shutter body 15 is closed at the position of the opening portion a (Fig. 1 The position shown by the line) is retracted to move between the position where the opening π portion 11a is opened (the position indicated by the two-point lock line in the figure!) is lower than the opening portion 11 & In the following description, the state in which the shutter portion 15 closes the opening portion 11a is referred to as the "closed state" of the shutter device 14, and the gate body 15 is retracted below the opening portion to open the opening portion 1a. The state is referred to as the "open state" of the shutter device 14. In the processing chamber 10, a pair of upper and lower air nozzles 19a, 19b (corresponding to the nozzle member of the present invention) are provided at a position immediately following the upstream side of the preliminary chamber 12. The air nozzles 19a and 19b are configured by so-called slit nozzles having slit-like openings that continuously or intermittently extend in the width direction, and are opposite to the upper and lower faces of the substrate S during the conveyance period. The gas is ejected in a strip shape in the oblique direction from the upstream side to the downstream side (that is, toward the wet processing unit 2 side). In the present embodiment, a so-called CDA (clean dry air, hereinafter abbreviated as "air") whose cleanliness and temperature and humidity have been adjusted to a specific level is ejected. "i" the air nozzles 19a, 19b are connected to an air supply source outside the drawing via an air supply pipe 19 having a solenoid valve or the like, and are supplied from the respective air in accordance with the control of the I32063.doc solenoid valve or the like. In the present embodiment, the air nozzles 19a and 19b, the air supply pipe 19, the air supply source, and the like are equivalent to the airflow formation of the present invention. On the other hand, in the processing chamber 20 (corresponding to the wet processing chamber of the present invention) of the wet processing unit 2, a plurality of chemical liquid nozzles 22 for supplying a chemical liquid to the substrate s are provided. The nozzle 22 is composed of a so-called spray nozzle that ejects the chemical liquid in a mist form, and is disposed in a predetermined arrangement on the upper portion of the transport roller 5. The chemical liquid nozzle 22 is configured to pass through a chemical liquid having a solenoid valve or the like. The supply pipe 23 is connected to an air supply source outside the drawing, and the switching of the spraying and stopping of the chemical liquid from each of the chemical liquid nozzles 22 and the adjustment of the chemical liquid discharging amount are performed in accordance with the control of the electromagnetic valve or the like. In the processing chamber 20, a door closing device 24 (corresponding to the first gate mechanism of the present invention) for opening and closing the opening portion from the wet processing unit 2 side is provided separately from the shutter device 14. Take the rest of your life ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Further, the configuration is such that the opening portion of the opening portion 11a is closed by the shutter main body 25, and the opening portion J is retracted below the opening portion 11a.彳The state of the incense must be changed by the knife (the solid solenoid and the two-point lock line I32063.doc 1344392, etc., the solenoid valves, the brake devices 14, 24, the motor 18, etc. are all connected to the controller 6' The controller 6 collectively performs (4). In particular, the substrate processing unit transfers the substrate to the wet processing unit 2, and under the control of the controller 6, the opening of the opening portion u is caused by the shutter devices 14 and 24. And the actions such as closing are performed in the order shown in FIG. 3, thereby preventing The mist-like chemical liquid intrudes from the wet processing unit 2 to the front processing unit. Hereinafter, this will be described. In addition, in the present embodiment, the controller 6 corresponds to the door control of the present invention. The mechanism and the airflow forming control means. In the apparatus, during the processing of the substrate S, the shutter devices 14 and 24 of the processing units 1 and 2 are driven and controlled to be in a closed state as indicated by the solid line in Fig. 。. When the chambers 10 and 20 are in a non-connected state, the mist-like chemical liquid (hereinafter simply referred to as "fog liquid") generated on the side of the wet processing unit 2 during the processing of the substrate s is prevented from entering the front processing unit 1 side. When the processing of the substrate S in each of the processing units 2 and 2 is completed, the substrate s in the wet processing unit 2 is carried out to the next step, and the substrate s of the pre-processing unit 搬 is transported to the wet processing unit 2. At this time, when the substrate S is transported from the pretreatment unit 1 to the wet processing unit 2, operations such as opening and closing of the opening portion 11a are performed in the order shown in FIG. First, when the substrate S that has been continuously transported by the sensor outside the figure has reached a specific position on the upstream side of the air nozzles 19a and 19b, the shutter device 14 of the preprocessing unit 1 is switched to the open state. Then, when the shutter device 14 is completely opened, the shutter device 24 of the wet processing unit 2 is switched to the open state, and air is ejected from the air nozzles 19 & ' 132063.doc -18· 1344392 Thus, the substrate S—through the preparation chamber 12, passes through the opening on the one hand

Ha is moved from the pre-processing unit (processing unit 10) to the wet processing unit 2 (processing unit 20) 〇° Further, when the opening 11a is opened in this way, the mist may pass from the wet processing unit 2 side. The opening portion 11a intrudes into the front processing portion 丨 side, but as a result of sucking and venting the ambient gas in the preliminary chamber 12 as described above, the mist liquid is led out through the exhaust passage 12b. Also, when the substrate § is being prepared

At the time of the chamber 12, the air discharged from the air nozzles 19a and 19b forms airflow from the upstream side toward the downstream side along the upper and lower surfaces of the substrate S. As a result, the mist is prevented from passing through the opening portion 11a to the processing chamber 1 The intrusion and the mist flow through the passage port 12a and flow to the upstream side. Therefore, the mist does not intrude into the upstream side from the preparation chamber 12, thereby preventing substantial intrusion of the mist into the forward processing portion 1.

The substrate S is continuously conveyed, and when the substrate s is completely carried into the processing chamber 20 of the wet processing unit 2, the opening portion is closed in the reverse order to the above. In other words, the shutter device 24 of the wet processing unit 2 is switched to the closed state, and the air is prevented from being ejected from the air nozzle core at the same time, and thereafter, the gate device 14 of the front processing unit 1 is switched to the closed state. Thereby, the processing of the substrate s is started in each of the following sections 1 and 2. According to the substrate processing apparatus described above, the pre-processing unit ' is configured to form the preliminary chamber 12 so as to surround the opening portion 11a, and to suck and exhaust the ambient gas of the preliminary chamber 12 And the air nozzle 193 is placed on the upstream side of the preliminary chamber 12, and the air sprayed from the air nozzle core, 1% 132063.doc • 19-1344392 is used during the opening of the air nozzle 193; A gas flow is formed along the lower two sides of the substrate s. Therefore, 'effectively prevent the mist from passing through the opening portion 11a and invading (or clawing out) to the processing chamber _ or the mist flowing out through the opening port 2a to the upstream side, and 'even if the mist passes through the opening mountain and has When it intrudes into the preliminary chamber 12, the mist also rapidly passes through the exhaust passage 12b and is discharged to the outside. Therefore, the intrusion of the mist from the wet processing unit 2 to the front processing unit 1 is effectively prevented. Further, the substrate processing apparatus is configured such that not only the processing chamber 10 of the preprocessing unit but also the shutter device is provided in the wet processing unit 2, and the shutter body 25 is also opened from the wet processing unit 2 side. The opening portion 11a is closed, whereby the mist is effectively prevented from adhering to the shutter body 15 on the side of the pretreatment portion. That is, it is effective to prevent the mist from adhering to the shutter body 15 on the pretreatment portion 1 side during the closing of the opening portion lu. In particular, in this device, as shown in FIG. 3, when the opening portion 丨u is to be opened, the shutter device 14 on the side of the pre-processing portion is first switched to the open state, and then the shutter device 24 on the wet processing portion 2 side is switched. In the open state, when the opening 1 la is to be closed, the shutter device 24 on the wet processing unit 2 side is first switched to the closed state, and then the shutter device 14 on the side of the preprocessing unit is switched to the closed state. Therefore, there is no state in which the shutter body on the side of the pretreatment unit 1 individually blocks the opening portion 11a. Therefore, the mist is effectively prevented from adhering to the door body 15 between the pretreatment portion 1 side. Further, as described above, each of the shutter devices 14 and 24 is configured to open and close the opening Ua by sliding the shutter bodies 15 and 25 up and down along the partition wall 11, so that the shutter body does not resemble a reversible gate device. If the mist is attached to the gate body 丨5, 25, it is difficult to cause the mist to scatter with the opening and closing operations. Therefore, the situation in which the mist adhered to the shutter main body 15 is scattered into the processing chamber 10 of the pretreatment portion 在 at the time of opening the opening portion 11a is alleviated, and as a result, the mist is effectively prevented from being processed forward from the wet processing portion 2. Departmental invasion. Further, the substrate processing apparatus ’ described above may have the following configuration as its specific configuration. For example, in the present embodiment, the example in which the present invention is applied to prevent the mist from entering the front processing unit from the wet processing unit 2 has been described. However, the present invention can also be applied to the wet processing unit 2 and the above. In the relationship between the processing units. For example, FIG. 4 shows an example thereof. In the apparatus, the opening portion 11a for substrate transfer is formed in the partition wall u between the processing chamber 2 of the wet processing unit 2 and the processing chamber 3 of the post-processing unit 3 (the boundary wall). Further, the substrate s is passed through the opening 11a, and is transported from the wet processing unit 2 side to the post-processing unit 3 side. As shown in the figure, a shutter mechanism 24 (corresponding to the i-th gate mechanism of the present invention) is provided in the processing chamber 2 of the wet processing unit 2, and is provided in the processing chamber 3 of the post-processing unit 3 Gate device 14 (corresponding to the second gate mechanism of the present invention). The gate devices 41 and 24 have the same configuration as the shutter devices 14 and 24 of the above-described embodiment. Further, in the processing chamber 30 of the post-processing unit 3, the configuration is such that the preliminary chamber 12' is provided so as to surround the opening portion 11a, and the inside of the preliminary chamber 12' is sucked and discharged through the exhaust passage i2b. gas. Further, air nozzles 19a, 19b are provided in the preliminary chamber 12' (through the port 12a') immediately following the downstream side, and are formed by the air ejected from the air nozzles 19a', 19b during the transport of the substrate s. Along the base 132063.doc -21 - the upper surface of the plate S and facing the wet gate device〗 4, 24, 黧 π & σ side of the flow of air. Further, the drive control of 24 or the like is replaced by the operation of the door closing device U as follows: the wide processing unit is performed in the subsequent order. In addition, it is possible to prevent the effect of the same effect as that of the above-described embodiment from being effectively prevented from being generated from the wet processing unit 2_ behind the substrate processing liquid mist as shown in FIG. In the shutter devices 14 and 24 of the above-described embodiment, the shutter body 15 and the wall 11 are slid by the driving mechanism formed by the (4) and the pinion gears, but the gates are along the interval W v (four) bodies 15 and 25 The drive mechanism can also be used as a component other than the factory. For example, it is also possible to provide a configuration in which a screw shaft extending in the vertical direction is inserted into the door main bodies 15 and 25, and the door body Μ and Μ are vertically moved in accordance with the rotation of the screw shaft. Move on. Further, the intermediate devices 14 and 24 and (4) are limited to those in which the door bodies 15 and 25 of the above-described embodiment are slid along the partition wall 11 may be, for example, as shown in Fig. 5 (4). The shutter device 14 (24) shown in the figure has a shutter body 丨 5 (25) having a portion σ 15a (25a) which is substantially the same size as the opening portion 1 la. The shutter body 15 is supported by the bracket 31 which is divided (4) on the partition wall 11 via the parallel links 32, 32. A drive link 34 is integrally fixed to one of the parallel links 32, 32, and a rod 36a of the cylinder 36 is coupled to the front end of the link 34. Further, in a state where the rod of the air cylinder 36 is in the extended driving state, as shown in the figure, the shutter body 15 is slidably connected to the partition wall 11 in a state where the opening portion 11a and the opening 15a are vertically displaced, thereby opening The part a is closed under the action of the gate body 15322.doc -22- 1344392. On the other hand, when the rod of the cylinder 36 is in the retracted driving state, as shown in Fig. 5(b), the gate body 15 is away The direction of the partition wall u moves in parallel, thereby opening the opening portion 丨la. Then, in a state in which the opening portion 11a is thus opened, the opening 15& of the shutter main body 15 is arranged side by side with the opening portion 11a in the substrate conveying direction, whereby the month b can be passed through the opening 15a. Substrate s. According to the above-described shutter devices 14 and 24, the opening and closing of the opening 11a are performed in a state in which the shutter bodies 15 and 25 are held. Therefore, the shutter device 14 and the like of the above-described embodiment are the same as During the operation, it is difficult for the mist to scatter, and therefore, it is possible to effectively prevent the mist from entering the forward processing unit 1 due to the scattering. Further, in the present invention, as the specific configuration of the shutter devices 14 and 24, the former reversible type is not excluded, but the inverted gate structure causes fogging as compared with the structure in which the shutter body is slid or moved in parallel. Since the liquid is easily scattered, it is preferable to use a configuration in which the shutter bodies 15 and 25 are slid or moved in parallel from the viewpoint of preventing the mist from scattering when the shutter is actuated. Further, in the above-described embodiment and the example of FIG. 4, the pre-processing unit 丨 and the post-processing unit 3 are provided with the preliminary chambers 12 and 12, but this is for quickly discharging the openings 11a and 11a from the outside. The mist is infiltrated, for example, the amount of the mist generated in the wet processing unit 2 is small, and when the mist is relatively difficult to enter into the front processing unit 1 and the post-processing unit 3, the preparation chamber 12 may be omitted. 12, and the exhaust passages 12b and 12b are configured such that the air nozzles 19a, 19b, 19a, and 19b are disposed in the vicinity of the openings 11a and 11a. 132063.doc • 23 · 1344392 Further, in the above embodiment and FIG. 4, an example in which the present invention is applied to a substrate processing apparatus in which the preprocessing unit i or the post processing unit 3 is adjacent to the wet processing unit 2 has been described. However, the present invention can also be applied to the non-neighboring two front parts! Or the device of the post-processing unit 3. In other words, the present invention can also be applied to a substrate processing apparatus having a configuration in which only a transfer parent is provided on the upstream side and the downstream side of the wet processing unit, and the substrate is transported while being processed in the wet processing unit. The substrate 3 is transported from the opening only while the substrate 8 is being transported by the transport roller while the substrate 3 is placed on the front and rear (four) substrates 3 or the partition wall of the wet processing unit. Second, in the wet processing unit, 'specific processing is performed, and then the transport roller is reversely driven to carry out the substrate s from the opening. Further, α is configured such that the pretreatment unit or the post-processing unit is adjacent to the wet processing unit, and (4) is configured as follows: the earth sheet processing apparatus, that is, the substrate processing is not performed in the pre-processing unit and the post-processing unit depending on the type of the substrate. The present invention can also be applied to only the through-base reduction device. Fields, and, <Second Embodiment> Fig. 6 shows a substrate processing apparatus according to a second embodiment. The substrate processing apparatus shown in the figure schematically shows a part of a process processing apparatus that performs a specific process on the substrate 3 in a predetermined order while transporting the substrate 3, and specifically, a resist film to be formed on the substrate § The composition of the stripping step. The substrate processing apparatus shown in FIG. 1 includes a second peeling processing chamber 51 (corresponding to the first processing of the present month) and a second peeling processing chamber 53 (which are supplied to the substrate s and supplied with the peeling liquid (processing liquid)). Corresponding to the second aspect of the present invention, J32063.doc -24-1344392, and the intermediate chamber 52 interposed between the processing chambers 5, 53. The first separation processing chamber 51 and the intermediate chamber 52 share a partition wall 61 and are adjacent to each other. Further, the intermediate chamber 52 and the second peeling processing chamber 53 share a partition wall 63 and are adjacent to each other, and are formed through the partition walls 61 and 63. The openings 61a and 63a for substrate transfer (corresponding to the i-th opening and the second opening of the present invention, respectively) communicate with each other. Each of the openings 61a and 63a is formed in a shape of an elongated rectangular shape in the width direction (a direction orthogonal to the substrate 8, which is a direction perpendicular to the plane of the paper), and is formed to be sufficient and necessary for passing the substrate S. size. The inside of each of the processing chambers 51 and 53 and the intermediate chamber 52 is configured such that a plurality of conveying rollers 5 are provided at a predetermined interval, and the substrate S is driven by the rollers 5 under the driving of the conveying rollers 5. The transport path is transported in a horizontal direction in the direction of the arrow in the figure. In each of the processing chambers 51 and 53, a plurality of stripping liquid nozzles 70 and 80 for supplying the stripping liquid to the substrate 3 are provided, and each of the stripping liquid nozzles 7 and 80 is sprayed by the stripping liquid. The spray nozzles are configured to be disposed at a position above the transport roller 5 in a specific arrangement. The peeling liquid nozzle 70 of the first peeling processing chamber 51 is connected to the first liquid tank 73 via the first liquid supply pipe 71, and is driven by the pump 72 disposed on the third liquid supply pipe 71 and the electromagnetics outside the drawing. Under the control of a valve or the like, the stripping liquid supplied from the first liquid tank 73 is received and the stripping liquid is supplied to the substrate. On the other hand, the peeling liquid nozzle 80 of the second peeling processing chamber 53 is connected to the second liquid tank 83 via the second liquid supply pipe 81, and is driven by the pump 82 interposed in the second liquid supply pipe 81. The stripping liquid supplied from the second liquid tank 83 is received under the control of an external solenoid valve or the like, and the stripping liquid can be supplied to the substrate 8. That is, 132063.doc -25-1344392, in each of the liquid tanks 73, 83, the same type of chaotropic liquid having different concentrations is contained in the gossip knife. Specifically, the first liquid tank 73 contains a high concentration of the stripping liquid. Thus, in each of the treatments to 51, 53, the stripping A ic Q ^ JLti ^ —* with different concentrations is used.

In the vicinity of the partition wall 61 in the first peeling processing chamber 51, the pair of air knives 74 and 74 are removed from the upper and lower air knives 74, 4, and the air knives 74 and 74 are removed from the transport path. The slit nozzles of the elongated discharge ports extending in the width direction and the length of the field and extending in the longitudinal direction are disposed on the upper and lower sides of the transport path such that the respective discharge ports are located on the transport path side and are still upstream. . Each of the air knives M and _ is connected to the air supply source outside the drawing by the air supply pipe 76, and receives the air of a specific flow rate supplied from the air supply source and can eject the substrate S under the operation of a solenoid valve or the like outside the drawing. The air.

In addition, the first peeling processing chamber 51 is provided with a shutter device 75 that opens and closes the opening 61a, and the second peeling processing chamber 53 is provided with a shutter that opens and closes the opening 63a. Device 85. Each of the shutter devices 75'85 has a shutter body 75a, 85a and a drive mechanism, wherein the shutter bodies 75a, 85a are integrally formed of a chemically-formed material and formed into a flat plate shape elongated in the width direction. The driving mechanism drives the shutter bodies 75a and 85a, respectively, and uses a motor as a driving source. The driving mechanism causes the shutter bodies 75a and 85a to move downward along the wall of the partition walls 6 and Μ, respectively, so that the opening portion can be opened and closed. 6U, 63a. Further, as the drive mechanism, the illustration is omitted, and for example, the same mechanism as the above-described shutter devices 14 and 24 of the second embodiment is used. In the above-mentioned intermediate chamber 52, the intermediate chamber 52 is partitioned into an upstream side nozzle chamber 52a and a downstream side exhaust chamber 52b by a partition wall 62 having an opening portion 62a for substrate conveyance. . λ is provided in the nozzle chamber 52a by the up-and-down air knifes 86 and 86 (nozzle members), and the air knife 86 86 is disposed between the transport paths. Each of the air knives is connected to the air supply source via an air supply pipe 87, and receives air in a specific flow supplied from the air supply source under operation of a magnetic valve or the like outside the figure, and is provided on the substrate S. The air is ejected. Each of the air knives % and (4) is constituted by a slit nozzle which is substantially the same as the slit nozzles disposed in the ith peeling processing chamber 51, and is disposed such that the discharge port is located on the transport path side and slightly toward the downstream side. According to this configuration, the air ejected from the air knives 86 and 86 passes through the opening 62a and is ejected toward the second peeling process chamber 53 side, that is, toward the opening 63a side, and during the transport of the substrate 8, along the substrate § Air flows flowing to the second peeling processing chamber 53 side are formed on the upper and lower surfaces. Further, in the actual palladium form, the air knives 86 and 86, the air supply pipe 87, the air supply source, and the like correspond to the air flow forming mechanism of the present invention. On the other hand, in the exhaust chamber 52b, an exhaust pipe 91 is connected to the ceiling portion. The exhaust pipe 91 is connected to the negative pressure pump 92 via a filter, a solenoid valve or the like outside the drawing, whereby the environment in the intermediate chamber 52 is passed through the exhaust port 90 formed on the ceiling surface of the exhaust chamber 52b. The gas can be vented. Further, in the present embodiment, the exhaust port 90, the exhaust pipe 91, the negative pressure pump 92, and the like correspond to the intermediate chamber exhaust mechanism of the present invention. Further, in the exhaust chamber 52b, a shutter device 88 for opening and closing the opening portion 63a from the intermediate chamber 52 side is provided. The gate device (9) is configured to be substantially the same as the above-described shutter devices 75 and 85, and is opened from the intermediate chamber 52 side by the shutter body 88a moving downward along the partition wall 63 on the wall surface of the intermediate chamber 52 side. The opening portion 63a is closed. Further, in the present embodiment, the shutter devices 75, 85, and 88 correspond to the shutter mechanism of the present invention. The solenoid valves provided in the liquid supply pipes 71 and 81, the air supply pipes 76 and 87, and the exhaust gas 91, and the motors of the drive mechanisms of the shutter devices 75, 85, and 88 are all electrically connected to each other as a drive. The controller 6' of the control device is collectively controlled by the controller 6. Further, at the time of substrate transfer, under the control of the controller 6, the opening and closing of the openings 61a and 63a and the ejection of air by the shutter devices 75, 85, and 88 are in the order shown in FIG. In this way, the mist-like peeling liquid (hereinafter, simply referred to as "fog liquid") is prevented from entering the first peeling processing chamber 51 from the second peeling processing chamber 53. This will be described below. In the apparatus, during the processing of the substrate S, as shown by the solid line in FIG. 6, the opening portions 61 & 63, are closed by the shutter devices 75, 85, 88, whereby the first peeling treatment chamber 5 is used. 1. The intermediate chamber 5 2 and the second peeling treatment chamber 53 are in a non-connected state ′ to prevent the mist generated in each of the processing units 51 and 53 from diffusing to the outside. Further, the intermediate chamber 52 (exhaust chamber 52b) is always exhausted through the above-described exhaust port 90. When the processing of the substrate s in each of the processing chambers 51, 53 is completed, the substrate S of the second peeling processing chamber 53 is carried out to the next step, and the substrate S-side of the second peeling processing chamber 51 is passed through the intermediate chamber 52. It is conveyed to the 2nd peeling process chamber 53. When the substrate S is transferred from the first peeling processing chamber 51 to the second peeling processing chamber 53, the openings 61a and 63a are opened and closed in the order shown in Fig. 7 132063.doc • 28· 1344392 and the like. First, when the substrate s is transported to a specific position in the first peeling process chamber 51, and the front end of the substrate 8 is detected by the sensor outside the figure, the air knife 74'74 starts to eject air' and the shutter device is actuated. When the opening portion 61a is opened, the substrate S is carried out from the second peeling processing chamber 51 through the opening 61a, and the substrate S is removed by the air ejected from the air knives 74, 74 in association with the unloading. Stripping solution, etc. Then, in the intermediate chamber 52 (nozzle chamber 52a), the air knife % and % start to eject the working gas, and thereafter, the shutter device 88 on the intermediate chamber 52 side and the shutter device 85 on the second peeling processing chamber 53 side are sequentially When the opening portion 63a is opened, the substrate s is moved into the second peeling and processing chamber 53 through the intermediate chamber 52. At this time, when air is ejected from the air knives 86 and 86, the air passes through the opening 62a formed in the partition wall 62 and is blown toward the opening 63a, thereby suppressing the mist from the second peeling process chamber μ. Flow out. Then, as shown in Fig. 8, while the substrate S is transported into the second peeling treatment chamber 53 through the opening 63a, the air ejected from the air knives %, 86 is formed above and below the substrate S. The airflow (the solid arrow in the figure) flowing to the downstream side on both sides flows through the opening 63a and flows into the second peeling processing chamber 53, thereby preventing the mist from flowing out of the second peeling processing chamber 53. Furthermore, open the mouth. During the period in which the crucible 63a is opened, it is considered that some mist liquid will flow out from the second peeling processing chamber 53 to the intermediate chamber 52, but the mist will pass through the exhaust gas in the exhaust chamber 5沘. The exhaust port 9 〇 is discharged to the outside (see a broken line arrow in FIG. 8 ) to thereby prevent the mist from flowing out of the intermediate chamber 52 , that is, to prevent the mist from entering the first peeling processing chamber 51 . 132063.doc -29- 1344392 When the substrate s is continuously conveyed in this manner, when the substrate s is accidentally carried out from the i-th peeling processing chamber, air is ejected from the air knives 74 and 74, and the shutter device 75 is actuated, and the opening 61a is closed. Then, the substrate s is further conveyed, and when the loading of the substrate $ into the second peeling processing chamber 53 is completed, that is, the substrate is detected by the sensor disposed outside the drawing in the second peeling processing chamber 53 At the rear end, when the shutter device on the side of the second peeling processing chamber 53 is actuated, the opening portion 63a is closed, and thereafter, the shutter device 88 on the intermediate chamber 52 side is actuated and mounted in the closed position, and the gas is stopped from the gas. The blades 86, 86 eject air. Thereby, the processing of the substrate 3 is started in each of the processing chambers 51, 53. As described above, in the substrate processing apparatus of the second embodiment, the intermediate chamber 52 is provided between the second peeling processing chamber 51 and the second peeling processing chamber 53, and is provided in the opening portion 63a while being opened. The air knife % and 86 of the intermediate chamber 52 discharge air to the opening portion. Therefore, the mist is effectively prevented from flowing out of the second peeling processing chamber 53, and even if the mist is passed from the (10) treatment chamber 53 When the opening portion 63a has flowed out to the intermediate chamber 52, the mist is also exhausted from the intermediate chamber 52 to the outside, thereby preventing the intrusion into the i-th peeling processing chamber 51. Therefore, it is possible to prevent the problem that the low-concentration mist generated in the second 'J' treatment to the fifth portion enters the first peeling treatment chamber 51, thereby diluting the high-concentration stripping liquid of the first peeling treatment chamber 51. Therefore, the processing of the first peeling processing chamber 51 can be affected. In addition, the substrate processing apparatus is configured such that a partition wall 62' is provided in the intermediate chamber to partition the inside of the intermediate chamber 52 into the nozzle chamber 52 on the upstream side and the exhaust side on the downstream side to 52b, while allowing air to pass from The nozzle chamber 52a side is ejected through the opening 62a, and exhausts the inside of the exhaust chamber 52b. Therefore, under the action of the 132063.doc • 30-1344392 partition wall 62, the second peeling process chamber 53 is more effectively prevented. The mist liquid that has been released is diffused to the upstream side, and as a result, the mist is prevented from entering the first detachment treatment chamber 51. <Third Embodiment> Fig. 9 shows an example of a substrate processing apparatus according to a third embodiment. The substrate processing apparatus according to the third embodiment is a modification of the second embodiment, and is applied to a second peeling treatment chamber 53 using a stripping liquid having a higher concentration than the first peeling processing chamber 51. . In addition, the basic configuration of the substrate processing apparatus is the same as that of the substrate processing apparatus of the second embodiment. Therefore, the same components as those of the second embodiment are denoted by the same reference numerals, and their description will be omitted. The differences between the embodiments will be described. As shown in the figure, the processing tank apparatus is configured such that an exhaust chamber 52b is provided on the upstream side of the intermediate chamber 52, and a nozzle chamber 52a is provided on the downstream side, and the air knives 86 and 86 are disposed such that Each of the discharge ports is located on the side of the transport path and slightly toward the upstream side. Further, a shutter device 89 is provided in the exhaust chamber 52b, and the shutter device 89 opens and closes the opening portion 61a of the partition wall ο from the intermediate chamber 52 side. The shutter device 89 is configured to be substantially the same as the shutter devices 75 and 85, and the shutter body 89a is moved downward along the wall surface of the partition wall 61 on the intermediate chamber 52 side, whereby the opening portion 61a can be opened and closed from the intermediate chamber 52 side. . Further, in the apparatus, the shutter device 88 which opens and closes the opening 63a of the partition 63 from the side of the intermediate chamber is not provided in the apparatus from the first peeling processing chamber 51 to the second peeling processing chamber.搬 When the substrate S is transported, the openings 61a and 63a are opened and closed in the order of 132063.doc 31 1344392 shown in FIG. 1A according to the control of the controller 6. First, in the first peeling processing chamber 51. When the substrate S is transported to a specific position, the air knives 74, 74 start to eject air, and the idler device 89 on the intermediate chamber side is actuated to install the shutter body 89a at the position where the opening portion can be opened (in At this time, the opening portion 61a is started to eject air by the door closing device blade -86, and then, in the door closing device 丄: the lower opening portion 6U is opened, and the opening and the opening are opened by the door device 85. This 'substrate S is carried out from the first peeling processing chamber 51 through the opening (4), and the peeling liquid on the air/base'S discharged from the air knives 74 and 74 is carried out along with the unloading. The air knife opens: spray: milk' then the air will pass through the partition wall 6 2, the opening portion is blown toward the opening portion 61a', thereby suppressing the flow of the mist from the first peeling processing chamber 51: and "the substrate s passes through the opening 61a and is peeled off from the ith ==3" The air ejected from the air knives 86, 86 forms a milk flow that is "moved" along the base portion 61a, and the air flow passes through the opening peeling treatment in the first peeling processing chamber 51, thereby preventing the mist from coming out of the first stage door. In addition, it is considered to be in the opening portion 6. The opened second two T will pass through the first stripping processing chamber 51 to the intermediate chamber - the exhaust port - 90^ 气 气By discharging to the outside, the fog is prevented from entering the second peeling process chamber 53. m continues to transport the substrate s, and when the substrate S is removed from the second peeling place, When the operation chamber 51 is closed by the opening portion 6U and the shutter device 75 on the side of the chamber 51 is closed, a is closed, and air is ejected from the air knives 74 and 74, and 132062.doc •32· 1344392 is on the intermediate chamber 52 side. The shutter device 89 is actuated and attached to the closed position. Then, the substrate S is further conveyed, and the substrate S is moved to the second peeling processing chamber 53. At the end of the loading, the shutter device 85 is actuated, and the opening 63a is closed, and the air is ejected from the air knives 86 and 86. The substrate processing apparatus according to the third embodiment is provided with an air knife provided in the intermediate chamber 52. 86 and 86, the air is ejected toward the opening 61a, so that the mist is effectively prevented from flowing out of the first peeling process chamber 5, and even if the mist is passed from the first peeling processing chamber 51 through the opening 61a, it flows out to the middle. In the case of 52, the mist is also exhausted to the outside from the intermediate chamber $2, thereby preventing the intrusion into the second peeling processing chamber 53. Therefore, according to the device, it is possible to prevent the low-concentration mist generated in the first peeling treatment chamber 5 from entering the second peeling chamber 53 and diluting the stripping liquid in the second peeling chamber 53. This affects the peeling treatment in the second peeling treatment chamber 53. Further, as a specific configuration of the substrate processing apparatus according to the second and third embodiments, the following configuration may be employed. For example, in the second and third embodiments, the partition wall 62' is provided in the intermediate chamber 52 to divide the inside into the nozzle chamber 52a and the exhaust chamber 52b, but the partition wall 62 may be omitted. . However, the configuration in which the partition wall 62 is provided is as described above, 'even in the case where the low-fluid mist has flowed out into the intermediate chamber 52,' can effectively prevent the mist from being treated to a high-concentration stripping liquid. Ventilation on the side of the chamber. Therefore, it is preferable to provide the partition wall 62 from the viewpoint of more reliably preventing the low-concentration mist from entering the stripping chamber on the high-concentration side. 132063.doc -33- The substrate processing apparatus according to the second embodiment may be configured as follows: an example of the step t: an exhaust device for exhausting the exhaust gas from the processing chamber 51; a s chamber exhaust mechanism), and a trap device (corresponding to the trap mechanism of the present invention) that collects the mist (high-concentration mist) contained in the exhaust gas to be exhausted and will have been trapped When the mist liquid that has arrived is recovered in the liquid tank 73, it is considered that when the mist liquid is collected and reused, it is considered that if the mist liquid of a low concentration intrudes into the first peeling treatment chamber 51, the mist liquid of a low concentration is used. The trapping device is trapped by the trapping device, so the stripping solution is easily diluted. On the other hand, when the apparatus configuration shown in FIG. 6 is employed, it is possible to effectively prevent the low-concentration mist from entering the first peeling treatment chamber 5j. Therefore, it is particularly suitable for collecting and reusing a high-concentration mist. The above device. In this case, in the substrate processing apparatus of the third embodiment, the high-concentration mist is collected and reused in the second peeling chamber 53. Further, in the second and third embodiments, the substrate treatment in which the separation treatment is performed in each of the processing chambers 51 and 53 using the same treatment liquid having the same concentration has been described. However, the present invention is not limited thereto. For example, it is also applied to a substrate processing apparatus which performs etching processing on a substrate in each processing chamber without using a residual liquid having a different concentration. Further, in addition to the treatment liquid of the same type in which the concentration is different from each other in each of the processing chambers, the invention may be applied to a treatment liquid having different properties (properties, which are generally treated as objects) and different types of treatment liquids. And a device using a treatment liquid having different properties (property), for example, a stripping treatment using a stripping liquid in a processing chamber on the upstream side, and a cleaning treatment using pure water in a processing chamber on the downstream side. 132063.doc -34- 1344392 Further, in the above-described third to third embodiments, the case where the processing is performed on the substrate S while the plate is being conveyed in a horizontal posture is described. The present invention is also applicable to the processing of the substrate S while transporting the substrate 8 in an inclined posture (for example, an attitude of "tilting from the cooker side to the other side in a direction orthogonal to the conveyance direction of the substrate") Device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic block diagram showing an example of a substrate processing apparatus (the second embodiment) of the present invention. Fig. 2 is a perspective view showing the configuration of each of the gate devices of the pretreatment unit and the wet processing unit. Fig. 3 is a view showing an operation sequence of a shutter device or the like when the substrate is transferred from the pre-processing unit to the wet processing unit. Fig. 4 is a schematic block diagram showing another example of the substrate processing apparatus of the present invention. Figs. 5(a) and 5(b) are side views showing other configurations of the gate devices of the pretreatment unit and the wet processing unit. Fig. 6 is a schematic block diagram showing a substrate processing apparatus (second embodiment) of the present invention. Fig. 7 is a view for explaining an operation procedure of a door or the like when the substrate is transferred from the first peeling processing chamber to the second peeling processing chamber. Fig. 8 is a view showing a state in which the substrate is transferred from the first peeling processing chamber to the second peeling processing chamber. Fig. 9 is a schematic block diagram showing a substrate processing apparatus (third embodiment) of the present invention. 132063.doc -35- 1344392 Fig. 10 is a view for explaining an operation procedure of a shutter or the like when the substrate is transferred from the first peeling processing chamber to the second peeling processing chamber. [Description of main component symbols] 1 2 Pretreatment section Wet processing section 10 ' 20 Processing chamber 11a Opening section 14 ' 24 Gate device 15 and 25 Gate body 19a ' 19b Air nozzle S Substrate 132063.doc -36 -

Claims (1)

1344392 Patent Application No. 2: A substrate processing apparatus having a wet processing chamber that supplies a processing liquid to a substrate and performs a specific wet processing on the substrate, and transports the substrate through a partition formed on the wet processing chamber In the wet processing chamber, the substrate is moved and carried out, and the substrate processing apparatus includes: a closing mechanism 'opening and closing the opening; and an airflow forming mechanism including The nozzle member outside the wet processing chamber is configured to eject a gas from the nozzle member at least when the opening is opened, thereby forming an airflow toward the opening. The substrate processing apparatus according to claim 1, wherein the shutter mechanism includes a first shutter mechanism and a second shutter mechanism. The first door mechanism includes a shutter that opens and closes the opening from an indoor side of the wet processing chamber. In the main body, the second shutter mechanism includes a shutter body that opens and closes the opening from an outdoor side of the wet processing chamber, and the airflow forming mechanism supplies a gas from the nozzle member to a substrate passing through the opening. The air flow flowing from the outdoor side to the indoor side of the wet processing chamber is formed on the surface. 3. The substrate processing apparatus of claim 2, wherein the mechanism and the nozzle member are. Having an adjacent processing chamber, the adjacent processing chamber communicates with the wet processing chamber via the opening portion and performs pre-treatment or post-processing of the wet processing on the substrate, and the adjacent processing chamber is equipped with the second idle gate 132063. The substrate processing apparatus of claim 2 or 3, wherein the step-by-step has a gate control mechanism that closes a closed state of the opening by the shutter body and retracts the shutter body to a specific When the retracted position is opened and the open state of the opening is opened, the driving state of each of the shutter mechanisms is switched and controlled, and when the substrate passes through the opening, the door control mechanism switches the closed state to the open state. Before the state, the second shutter mechanism is switched from the closed state to the open state. The substrate processing apparatus of claim 4, wherein the step further comprises an airflow forming control mechanism for controlling the airflow forming mechanism, and the airflow forming control mechanism starts to supply in synchronization with a switching operation of the self-closing state of the shutter mechanism toward the open state. gas. The substrate processing apparatus according to claim 2 or 3, wherein at least the second closing mechanism of each of the shutter mechanisms is configured to open and close the opening by sliding the shutter body along a wall surface of the partition wall. The substrate processing apparatus of the third aspect, wherein the adjacent processing chamber further comprises: a preliminary chamber formed in the processing chamber to surround the vicinity of the upper nozzle portion; and exhausting the ambient gas in the preparation chamber The spare room exhaust mechanism. The substrate processing apparatus according to claim 1, wherein the wet processing chamber is configured to have a processing chamber and a second processing chamber arranged in a substrate transporting direction, and different processing liquids are used in each processing chamber. In order to perform a specific wet-type treatment on the substrate, the relationship between the treatment liquids which are different from each other is required to prevent the treatment liquid on the other side from being mixed into the treatment liquid on one side during the substrate treatment. An intermediate chamber is provided between the first processing chamber and the second processing chamber, and as the opening, an old port is provided in a partition wall between the second processing chamber and the intermediate chamber, and the intermediate chamber is provided in the intermediate chamber a second opening is provided in the partition wall of the second processing chamber, and the shutter mechanism is provided with a shutter mechanism for opening and closing the first and second openings, respectively. The intermediate chamber includes the nozzle member, and the gas is ejected from the nozzle member to form an airflow toward the target opening, and the target opening is the i-th opening An opening portion on one of the second opening portion and the second processing chamber is an opening portion between the processing chamber and the intermediate chamber in which the processing liquid on the other side is used as the target opening portion, and the substrate processing device is further provided with the middle portion. The chamber exhausting means has an exhaust port at a position between the nozzle member of the airflow forming means and the target opening, and exhausts the intermediate chamber through the exhaust port. 9. The substrate processing apparatus according to claim 8, wherein the intermediate chamber is provided with a partition wall, thereby partitioning the inside of the intermediate chamber into a nozzle chamber including the nozzle member, and the object opening portion and the exhaust port. In the exhaust chamber, the nozzle member discharges gas through the opening for substrate transfer provided on the partition wall, and ejects upward on the exhaust chamber side of J44392 on the upper surface 132063.doc. The substrate processing apparatus according to claim 8 or 9, wherein the turbulent flow forming means supplies a gas from the substrate of the object opening portion from the nozzle member, thereby forming a process from the intermediate chamber side toward the substrate along the substrate surface Airflow flowing on the chamber side. The substrate processing apparatus according to claim 8 or 9, wherein the processing liquids of the same type having different processing liquid concentrations are different from each other, Further, the high-concentration treatment liquid is used in the second processing chamber, and the nozzle member discharges gas into the opening portion by using the second opening as the target opening. 12. The substrate processing apparatus of claim 11, comprising: a processing chamber exhausting chamber for the third processing chamber, a processing chamber, and a mist for containing the above-mentioned row rolling armor. Add it to the capture agency of the capture. 132063.doc