200837515 九、發明說明 【發明所屬之技術領域】 本發明是關於將被塗佈於被處理基板上的塗佈液以減 壓狀態進行乾燥的減壓乾燥裝置。 【先前技術】 此種減壓乾燥裝置是例如使用於在液晶顯示器（LCD) 等的平板顯示器（FPD)製造的微影成像工程中，預先烘乾 塗佈於被處理基板（玻璃基板等）上的光阻液之前用以進行 乾燥。 傳統的減壓乾燥裝置是例如記載於專利文獻1，具有 :上面開口的托盤式底淺容器型的下部腔，及氣密地密接 或可嵌合地構成於該下部腔的上面的蓋狀上部腔。在下部 腔中配設有平台，而將基板水平地載置於該平台上之後， 關閉腔（將上部腔密接於下部腔）進行減壓乾燥處理。欲將 基板搬入出至腔之際，則以起重機等上昇上部腔而開放腔 ，又爲了裝載/卸載，作成以氣缸等適當地上昇平台。又 ，基板的搬入出或是裝載/卸載，是在減壓乾燥裝置周圍 藉由進行基板的搬運的外部搬運機器手臂的操作所進行。 又，在平台上面突出設有多數支撐針腳，而基板是成爲被 載置於此些支撐針腳的狀態。 專利文獻：特開2000-181079 【發明內容】 -5- 200837515 傳統的減壓乾燥裝置，是如上述地，每當將基板搬入 出於腔時，作成上下移動（開閉）上部腔，惟隨著基板的大 型化，在此種裝置構造上產生種種不方便。亦即，當基板 的尺寸如LCD基板地一邊超過如2 m的大小，則腔也顯 著地變大型化而僅上部腔就成爲2公噸以上的重要，而需 要大規模的昇降機構，依振動大的發塵問題或對於作業人 員的安全上問題逐漸顯在化。又，搬運機器手臂也逐漸大 型化，惟成爲很難水平地保持大基板進行搬運，而藉由將 剛塗佈光阻之後的基板以如大扇子般地彎曲狀態進行搬運 ，成爲在減壓乾燥裝置的腔的基板搬入出或裝載/卸載之 際容易產生偏位或相撞或破損等的誤差。又，在腔中，基 板是在從平台上面突出的針腳上受到減壓乾燥處理之故， 因而也有針腳跡轉印到基板上的光阻膜的問題。 本發明是鑑於如上述的傳統技術的問題點而創作者， 其目的是在於提供有效率、安全且順利地進行被處理基板 的搬入出，而且有效果地防止轉印跡附著於基板上的塗佈 膜的減壓乾燥裝置。 爲了達成上述目的，本發明的減壓乾燥裝置，屬於在 被處理基板上的塗佈液以減壓狀態施以乾燥處理的減壓乾 燥裝置，其特徵爲：具有：備有用以以大約水平狀態收容 上述基板的空間的可減壓的腔；及在上述乾燥處理中，用 以以密閉狀態真空排氣上述腔內的空間的第1排氣機構； 及在上述腔內具有用以載置上述基板的上面，且在該上面 具有用以噴出浮起上述基板的氣體的多數氣體噴出孔的平 -6 - 200837515 台；及經由穿通上述平台中的氣體線路用以將基板浮起用 的氣體供應於上述氣體噴出孔的氣體供應部；及用以真空 排氣上述氣體線路的第2排氣機構，進行上述乾燥處理時 ’將上述氣體線路連接於上述第2排氣機構而將上述基板 載置於上述平台上面，進行上述基板的搬入出時，將上述 氣體線路連接於上述氣體供應部而在上述平台上浮起上述 基板。 在上述的裝置構成中，減壓乾燥處理中，是藉由第1 排氣機構進行真空排氣腔內空間，而且藉由第2排氣機構 真空排氣穿通平台內部的浮起氣體線路，而將被處理基板 載置於平台上面。在基板與平台之間沒有部分性或局部性 的接觸部位之故，因而在基板上的塗佈膜不會有發生接觸 部位的轉印跡之虞。又，在平台上浮起基板而以較佳平流 進行基板的搬入出之故，因而不必使用搬運臂的搬運機器 手臂，不會有將基板如扇子般地變曲而在裝載/卸載之際 產生偏位或相撞，破損等的誤差。又，在基板的搬入出之 際，也不需要開閉腔的上蓋的操作，而也解決發塵的問題 或安全上的問題。 又，在本發明的較佳的一態樣中，平台的上面是具有 比基板還小，而比基板的製品領域還大的尺寸。藉由此， 減壓乾燥處理中，將平台上面接觸於基板的製品領域全面 ，而在基板搬入出時可將搬運手段接觸或卡止於從平台朝 外面露出的基板的兩側端部（非製品領域）。 又，作爲本發明的較佳的態樣，氣體噴出孔作爲一定 -7- 200837515 密度之細孔形成於平台，或是平台的上面爲以多孔質物質 所構成。將氣體噴出孔作成細孔，可有效果地減低從平台 側給與基板上的塗佈膜的熱性影響的偏差。 又，依照本發明的較佳的一態樣，將用以將基板以小 滾子從腔的外面搬入到腔中的搬入口，及用以以小滾子搬 還從腔中搬出到腔外面的搬出口設置於腔的側壁部，而將 用以開閉搬入口及搬出口的閘門機構設於腔側壁部的外面 。這時候，搬入口及搬出口是基板以小滾子搬運勉強通過 的大小就可以之故，因而可將閘門機構作成小型。搬入口 及搬出口是可互相相對而分別設於腔的側壁部，惟以一個 搬入出口也可兼用。 又，依照本發明的較佳一態樣，設有用以將基板以平 流搬運搬入出於腔的搬運機構。基板爲矩形時，該搬運機 構是具有分別接觸於露出在平台的兩側的基板的兩側端部 而朝基板搬運方向移動基板的一對搬運線路。較佳爲該搬 運線爲在平台的兩側具有分別朝基板搬運方向以所定間距 配置在一列的複數個側滾子。 又，爲了順利的進行基板的搬入出，較佳爲在該搬運 機構中，在平台與搬入口之間，或平台與搬出口之間，具 有朝基板搬運方向排列配置的1支或複數內部小滾子的構 成或是也可採用在搬入口的外面或搬出口的外面具有朝基 板搬運方向排列配置的1支或複數支的外部小滾子的構成 〇 又，依照本發明的較佳一態樣，在腔內設有用以將平 -8- 200837515 台予以昇降移動或昇降變位的平台昇降機構。在此種構成 中，進行乾燥處理時，將平台藉由平台昇降機構上昇至第 1高度位置成爲基板從搬運線路朝上方隔離而被載置於平 台上面，而進行基板的搬入出時，將平台藉由平台昇降機 構下降至第2高度位置成爲基板從平台朝上方隔離而令兩 側端部被載置於搬運線路也可以。 依照本發明的減壓乾燥裝置，藉由如上述的構成及作 用，有效率，安全且順利地進行被處理基板的搬入出，而 且可有效果地防止轉印跡附著於基板上的塗佈膜。 【實施方式】 以下，參照所附圖式來說明本發明的較佳實施形態。 第1圖是表示作爲可適用本發明的減壓乾燥裝置的一 構成例的塗佈顯像處理系統。該塗佈顯像處理系統1 0是 設置於潔淨室內，例如將矩形的玻璃基板作爲被處理基板 ’在LCD製造過程中，進行微影成像工程中的洗淨，光 阻塗佈’預先烘乾，顯像及事後烘乾等的一連串的處理者 。曝光處理是以鄰接於該系統的外部曝光裝置1 2所進行 〇 該塗佈顯像處理系統1 0，是在中心部配置橫長的處 理站（P/S)16’而在其長度方向（X方向）兩端部配置晶盒站 (C/S)14 及介面站（i/f)18 。 晶盒站（C/S)14是系統1〇的晶盒搬入出口，具備：多 段地重疊基板G而將可收容複數枚的晶盒C朝水平的一 -9 - 200837515 方向（Y方向）排列可載置4個的晶盒平台20，及對於該平 台2 0上的晶盒C進行基板G的取放的搬運機構22。搬運 機構22是具有以1枚單位可保持基板G的搬運臂22a， 在X，Y，Z，0的4軸可動作，成爲可進行鄰接的製程 站（P/S)16側與基板G的交接。 處理站（P/S)16是在朝水平的系統長度方向（X方向）延 伸的平行且反方向的一對線路A，B依處理流程或工程順 序配置各處理部。 更詳細地，在從晶盒站（C/S)14朝介面站（I/F)18側的 上游部的處理線路A，有搬入單元（IN PASS) 24，洗淨處 理部26，第1熱性處理部28，塗佈處理部30及第2熱性 處理部32沿著第1平流搬運路34從上游側依該順序一列 地配置。 更詳細地，搬入單元（IN PASS)24是構成從晶盒站 (C/S) 14的搬運機構22接受未處理的基板G，而以所定節 拍可投入在第1平流搬運路34。洗淨處理部26是沿著第 1平流搬運路34從上游側依序地設置激元UV照射單元 (E-UV)36及刷洗洗淨單元（SCR)38。第1熱性處理部28 是從上游側依序地設置附著單元（AD)40及冷卻單元 (COL)42 〇塗佈處理部30是從上游側依序地設置光阻塗佈 單元（COT)44及減壓乾燥單元（VD)46。第2熱性處理部 32是從上游側依序地設置預先烘乾單元（PRE-BAKE)48及 冷卻單元（COL) 50。在位於第2熱性處理部32的下游側旁 的第1平流搬運路34的終點設有通單元（P AS S)52。以平 -10- 200837515 流被搬運在第1平流搬運路34上的基板g,是成爲從該 終點的通單元（PASS)52被交到介面站（I/F)18。 一方面，在從介面站（I / F) 1 8側朝晶盒站（c / s ) 1 4側的 下游部的處理線路B，有顯像單元（DEV) 54，事後烘乾單 元（POST-BAKE)56，冷卻單元（COL)58，檢查單元（AP)6〇 及搬出單元（OUT-PAS S)62沿著第2平流搬運路64從上游 側依該順序一列地配置。在此，事後烘乾單元（P0ST-PASS)56及冷卻單元（COL)58是構成第3熱性處理部66。 搬出單元（OUT PASS)62，是構成從第2平流搬運路64 1 枚1枚地接受經處理的基板G，而交給晶盒站（c / s ) 1 4的 搬運機構22。 在兩處理線路A，B間設有補助搬運空間6 8，而以1 枚單位可水平地可載置基板G的梭7 0藉由驅動機構成爲 在處理線路方向（X方向）可朝雙方向移動。 介面站（I/F)18是具有用以進行上述第丨及第2平流 搬運路34，64或鄰接的曝光裝置12與基板G的交接的 搬運裝置72，而在該搬運裝置72的周圍配置旋轉平台 (R/S)74及周邊裝置76。旋轉平台（R/S)74是在水平面內 旋轉基板G的平台，被使用在與曝光裝置1 2的交接之際 ，爲了變換長方形的基板G的方向。周邊裝置7 6，將例 如翻料裝置（TITLER)或周邊曝光裝置（EL)等連接於第2平 流搬運路64。 在第2圖表示對於該塗佈顯像處理系統的1枚基板g 的全工程的處理順序。首先，在晶盒站（C/S)14中，搬運 -11 - 200837515 機構22，從平台20上的任一個晶盒C取出1枚基板G， 而將該取出的基板G搬入到處理站（P/S)16的處理線路A 側的搬入單元（IN PASS )24(步驟S1)。基板G是從搬入單 元（IN PASS)24被移載或被投入到第1平流搬運路34上 〇 被投入到第1平流搬運路34的基板G，是最初在洗 淨處理部26中藉由激光UV照射單元（E-UV)36及刷洗洗 淨單元（SCR)38依次施以紫外線洗淨處理及刷洗洗淨處理 (步驟S2、S3)刷洗洗淨單元（SCR)38是對於水平地移動平 流搬運路3 4上的基板G，藉由施以毛刷洗淨或吹風洗淨 而從基板表面去除粒子狀污垢，之後施以沖洗處理，最後 使用氣刀等進行乾燥基板 G。當完成刷洗洗淨單元 (SCR)38的一連串洗淨處理，則基板G是直接經第1平流 搬運路3 4而通過第1熱性處理部2 8。 在第1熱性處理部2 8中，基板G是最初在附著單元 (AD)40施以蒸汽狀HMDS的附著處理，把被處理面被疏 水化（步驟S4)。完成該附著處理之後，基板G是在冷卻 單元（COL)42被冷卻到所定的基板溫度（步驟S5)。然後， 基板G是經第1平流搬運路3 4而被搬入到塗佈處理部3 0 〇 在塗佈處理部3 0中，基板G是最初在光阻塗佈單元 (COT)44直接以平流藉由使用開縫噴嘴的無旋轉法，俾將 光阻液塗佈在基板上面（被處理面），之後立即以下游側旁 的減壓乾燥單元（VD)46藉由減壓受到常溫的乾燥處理（步 -12- 200837515 驟 S6)。 從塗佈處理部3 0出來的基板G，是經第1平流搬運 路34而通過第2熱性處理部32。在第2熱性處理部32 中，基板G是最初在預先焙乾單元（PRE-BAKE)48，作爲 光阻塗佈後的熱處理或曝光前的熱處理受到預先烘乾（步 驟S 7)。藉由該預先烘乾，使得殘留在基板G上的光阻膜 中的溶劑蒸發而被除去，而被強化對於基板的光阻膜的密 接性。之後，基板G是在冷卻單元（COL)50被冷卻到所定 的基板溫度（步驟S 8)。然後基板G是從第1平流搬運路 34終點的通單元（PSAA)52被領取到介面站（I/F)18的搬運 裝置72。 在介面站（I/F)18中，基板G是在旋轉平台74受到例 如90度的方向變換後被搬入到周邊裝置76的周邊曝光裝 置（EE)，在該裝置受到在顯像時除去附著於基板G的周邊 部的光阻所用的曝光之後，被送到旁邊的曝光裝置12(步 驟 S9)。 在曝光裝置12中，所定的電路圖案被曝光在基板G 上的光阻。之後完成圖案曝光的基板G，是當從曝光裝置 12回到介面（I/F)l 8時（步驟S 9)，則首先被搬入到周邊裝 置76的翻料裝置（TITLER)，而在該處所定資訊被記載於 基板上的所定部位（步驟S 10)。之後，基板G是藉由搬運 裝置72被搬入到舖設於處理站（P/S)16的處理線路B側的 第2平流搬運路64的顯像單元（DEV)54的起點。 如此，基板G這次是朝處理線路B的下游側被搬運 -13- 200837515 在第2平流搬運路64上。在最初的顯像單元（DEV)54中 ，基板G是在以平流被搬運的期間施以顯像，沖洗乾燥 的一*連串的顯像處理（步驟S11)。 在顯像單元（DEV)完成一連串的顯像處理的基板G， 是直接放在第2平流搬運路64而依次通過第3熱性處理 部66及檢查單元（AP)60。在第3熱性處理部66中，基板 G是最初在事後烘乾單元（P〇ST-BAKE)56，作爲顯像處理 後的熱處理受到事後烘乾（步驟S 1 2)。藉由該事後烘乾， 把殘留在基板G上的光阻膜的顯像液蒸發而被除去，可 強化對於基板的光阻圖案的密接性。之後，基板G是在 冷卻單元（COL)58被冷卻成所定的基板溫度（步驟S13)。 在檢查單元（AP)60中，針對於基板G上的光阻圖案進行 非接觸的線寬檢查或膜質，膜厚檢查等（步驟S 1 4 )。 檢測單元（OUT PASS )62是從第2平流搬運路64接受 完成全工程的處理的基板G，而交給晶盒站（c / S ) 1 4的搬 運機構22。在晶盒站（C/S) 14側，搬運機構22爲將從搬 出單元（OUT PASS)62所接受的經處理的基板G收容在任 一個（通常爲原來）的晶盒C(步驟S1)。 在該塗佈顯像處理系統1 0中，可將本發明適用於塗 佈處理部30內的減壓乾燥單元（VD)，以下，依照第3圖 及第9圖，詳述本發明的較佳實施形態的塗佈處理部3 〇 內的減壓乾燥單元（VD)46的構成及作用。 第3圖是表示該實施形態的塗佈處理部3 0的全體構 成的俯視圖。第4圖至第8圖是表示減壓乾燥單元（VD)46 -14- 200837515 的構成，而第4圖是表示其俯視圖，第5圖及第6圖是表 示其局部斷面側面圖，第7圖及第8圖是表示其局部斷面 背面圖。第9圖是表示設於減壓乾燥單元（VD)46的平台 內部的構造的擴大斷面圖。 在第3圖中，光阻塗佈單元（COT) 44是具有：構成第 1平流搬運路34(第1圖）的一部分或一區間的浮起式平台 80，及將在該平台80上浮在空中的基板G搬運到平台長 度方向（X方向）的基板搬運機構82，及在被搬運在平台 80上的基板G上面供應光阻液的光阻噴嘴84，及在塗佈 處理期間更新光阻噴嘴84的噴嘴更新部86。 在平台80的上面設有將所定的氣體（例如空氣）朝上 方噴射的多數氣體噴射孔88，構成藉由從此些氣體噴射 孔8 8所噴射的氣體的壓力，使得基板G從平台上面浮起 一定高度。 基板搬運機構82是具備：隔著平台80朝X方向延 伸的一對導軌90A，90B，及沿著此些導軌90A，90B可 往復移動的滑件92，及設置於滑件92成爲在平台80上 可裝卸地保持基板G的兩側端部的吸附墊等的基板保持 構件（未圖示），利用直進移動機構（未圖示）朝搬運方向（X 方向）移動滑件92，而在平台80上構成可進行基板G的 浮起搬運。 光阻噴嘴84是朝與搬運方向（X方向）正交的水平方 向（Y方向）橫斷平台80上方而延伸的長形噴嘴，成爲在 所定的塗佈位置通過其正下方的基板G上面，由開縫狀 -15- 200837515 吐出口帶狀地吐出光阻液。又，光阻噴嘴8 4是構成與支 撐該噴嘴的噴嘴支撐構件94 —*體地朝X方向可移動，且 朝Z方向可昇降，而成爲可移動在上述塗佈位置與噴嘴更 新部8 6之間。 噴嘴更新部86是具備：在平台80上方的所定位置被 保持在支撐構件9 6，作爲塗佈處理所用的初步準備而用 以將光阻液吐出於光阻噴嘴84所用的初給處理部98，及 將光阻噴嘴84的光阻吐出口保持在爲了防止乾燥之目的 溶劑蒸汽的環境中的噴嘴總線1 00，及除去附著於光阻噴 嘴84的光阻吐出口近旁的光阻所用的噴嘴洗淨機構1〇2 〇 在此，說明光阻塗佈單元（COT)44的主要作用。首先 ，藉由前段的第1熱性處理部2 8 (第1圖），例如把以小滾 子搬運所送來的基板G搬入到被設定在平台80上的前端 側，在該處所待機的滑件92保持基板G而接受。在平台 8〇上，基板G是受到由氣體噴射口 88所噴射的氣體（空 氣）壓力而以大約水平的姿勢保持浮起狀態。 然後，滑件92 —面保持基板一面向減壓乾燥單元 (VD)46側朝搬運方向（X方向）移動，當基板G通過光阻 噴嘴84下方之際，藉由光阻噴嘴84向基板G的上面帶 狀地吐出光阻液，而在基板G上從基板前端向後端如舖 上絨毯般地把光阻液的液膜形成於一面。如此地被塗佈光 阻液的基板G，是其後也藉由滑件92在平台80上被浮起 搬運，跨越平台8 0的後端而換乘到下述的小滾子搬運路 -16- 200837515 1 04，在該處被解除利用滑件92的保持。換乘到小滾子搬 運路1 04的基板G，是由此開始，如下述地以小滾子搬運 移動小滾子搬運路1 04上而被搬入到後段的減壓乾燥單元 (VD)46。 將經塗佈處理的基板G如上述地送出到減壓乾燥單 元（VD)46側之後，滑件92是爲了接受下一基板G而回到 平台80的前端側搬入部。又，光阻噴嘴84是當完成1次 或複數次塗佈處理，則從塗佈位置（光阻液吐出位置）移動 到噴嘴更新部86，而在該處進行噴嘴洗淨或初給處理等 的更新或預先準備之後，回到塗佈位置。 如第3圖所示地，在光阻塗佈單元（COT)44的平台80 的延長線上（下游側），舖設有構成第1平流搬運路34(第 1圖）的一部分或一區間的小滾子搬運路1 04。該小滾子搬 運路104是連續到減壓乾燥單元（VD)46的腔106中。 在減壓乾燥單元（VD)46周圍，除了從光阻塗佈單元 (COT)44 —直延伸到腔106中爲止的上述搬入側小滾子搬 運路104之外，還在腔106的內部舖設有浮起式滾子搬運 路108，而且舖設從腔106中一直到後段的處理部（第2 熱性處理部32)爲止的搬出側小滾子搬運路110。 搬入側小滾子搬運路1 04，是構成從光阻塗佈單元 (COT)44的平台80接受浮起搬運的延長所搬出的基板G 而以小滾子搬運送到減壓乾燥單元（VD)46的腔106。浮起 式滾子搬運路1〇8是構成將從搬入側小滾子搬運路104以 小滾子搬運路1 以小滾子搬運所運送的基板G以相同 -17- 200837515 速度的浮起式滾子搬運被拉進到腔106內，同時將在腔 1 06內經減壓乾燥處理的基板G以浮起式滾子搬運送出到 腔1 06外（後段）。搬出側小滾子搬運路1 1 〇是構成將藉由 浮起式滾子搬運路1 〇8以浮起式滾子搬運所送出的經處理 的基板G以相同速度的小滾子搬運被拉出到腔1 06外而 被運送到的第2熱性處理部3 2。 如第3圖及第8圖所示地，減壓乾燥單元（VD)46的 腔106是被形成較扁平的長方體，而在其中具有可水平地 收容基板G的空間。在該腔106的搬運方向（X方向）中互 相相對的一對（上游側及下游側）的腔側壁，分別設有基板 G以平流好容易通過的大小地所形成的開縫狀搬入口 1 1 2 及搬出口 114。又，用以開閉此些的搬入口 112及搬出口 1 14的閘門機構1 16，1 18被安裝於腔106的外壁、腔106 的上面部或上蓋1 20是對維修用成爲可拆下。 各閘門機構1 1 6，1 1 8是省略圖示，惟具備：可氣密 地封閉開縫狀搬入出口 1 1 2 ’ 1 1 4的蓋體（閥體），及將該 蓋體昇降移動在與搬入出口 H2’ 114水平地相對的垂直 往動位置及比該位置還低的垂直從復動位置之間的第1氣 缸，及將蓋體水平移動在對於搬入出口 112，114氣密地 密接的水平往動位置及隔離或分離的水平復動位置之間的 第2氣缸。 浮起式滾子搬運路1〇8是由水平且可昇降地配置於腔 1 0 6內的中心部的扁平，矩形的平台1 2 2，及將從搬入口 1 12朝搬出口 1 14的基板搬運方向（X方向）作爲前方而配 -18- 200837515 置於平台122的左右兩側的滾子搬運路124L，124R所構 成。 如第4圖所示地，在平台1 22上面形成有以一樣的密 度形成有多數或無數氣體噴出孔126。在減壓乾燥單元 (VD)46進行基板G的搬入出之際，在平台122上爲了浮 起基板G而成爲由各氣體噴出孔126以適當壓力噴出氣 體（例如空氣）。平台1 22的上面是與基板G同形的矩形， 具有比基板G還小，而比基板G的製品領域還大的尺寸 。一般，在LCD用的玻璃基板有所定寬度（例如20〜30 mm寬度）的邊緣領域設定在基板上面（被處理面）的周緣部 ，而在比邊緣領域還內側的有效領域亦即製品領域形成有 LCD元件。製品領域爲必須保證光阻膜的品質的保證領域 。通常，將基板G定心而載置於平台1 22的上面時，則 選定平台122的上面尺寸成爲基板G的各邊比平台122 的各邊僅朝外露出1 5 mm至20 mm。 如第9圖所示地，在平台122中，邀有空洞的氣體緩 • · V - 衝室128。該氣體緩衝室128，是連通於平台上面的氣體 噴出孔126，而且連通於平台下面的配管130。如下述地 ，氣體噴出孔1 26是爲了確實地防止對光阻膜的熱性影響 的偏差或發生轉印跡作成細孔或微細孔較佳。圖示的構成 例，是在平台122的上面板122a下面形成鏜孔127，而 在該鏜孔1 27的薄頂面中心穿孔細徑或微細徑（較佳爲φ 1 · 3 mm以下）的氣體噴出孔1 2 6。在氣體緩衝室1 2 8內， 設有用以防止上面板122a彎曲的柱子132在適當部位。 -19- 200837515 配管130是從腔106外被拉入，而配合平台122的昇降而 一起地成爲昇降或伸縮的狀態。爲了穿通配管1 3 0，形成 於腔1 06的底壁的穴是藉由封閉構件1 3 1被封閉。 在腔106外，配管130是經由氣體供應管134穿通於 浮起用氣體供應部136，而且經由排氣管138也穿通於真 空排氣裝置140。在氣體供應管134及排氣管138分別設 有開閉閥（電磁閥）142，144。浮起用氣體供應部136是由 壓縮機或工廠用力的壓縮空氣源及調整器等所構成，俾送 出所定壓力的壓縮空氣。真空排氣裝置140是具有真空泵 ，具有經排氣管1 3 8，從大氣壓狀態真空抽吸配管1 3 0及 平台122內的氣體緩衝室128成爲所定真空度的減壓狀態 的功能。 爲了昇降移動平台1 22，隔著所定間隔配置複數個氣 缸146於腔106下面而作爲昇降驅動源，將腔106的底壁 經由在垂直方向可昇降移動地貫通的支撐軸148，有氣缸 146的活塞桿被連接於平台122。爲了穿通各支撐軸148 ，形成於腔1 〇 6的底壁的穴是藉由具有引導功能的封閉構 件1 5 0被封閉。 如第4圖及第7圖所示地，在平台122的左右兩側朝 基板搬運方向（X方向）延伸的一對滾子搬運路124L，124R ，是分別朝同方向以一定間隔將多數側滾子1 52配置成一 列。各側滾子1 5 2是由圓板體或圓柱體所構成，從其中心 部朝 Y方向外側水平地延伸的滾子支撐軸1 5 4是在其中 間部藉由軸承1 5 6可旋轉地被支撐，而且在其前端部經由 -20- 200837515 磁鐵式傘齒輪158被連接於共通驅動軸16〇。右側滾子搬 運路124R的驅動軸160是經由驅動帶輪164,確動皮帶 1 6 6及從動帶輪1 6 9被連接於被安裝於腔1 〇 6外的旋轉驅 動源的電動機162。左側滾子搬運路124L的驅動軸160， 是在腔1 〇 6內經由分別構成搬入側小滾子搬運路1 04及搬 出側小滾子搬運路1 1 0的一'部分的小滾子1 7 2，1 7 4成爲 從右側驅動軸1 60傳動旋轉驅動力。作爲其他構成例，也 可將左側滾子搬運路124L的驅動軸160作成連接於與上 述電動機1 62不相同的旋轉驅動源的構成。 如第4圖及第7圖所示地，滾子搬運路124L，12 4R 的各側滾子1 5 2，是基板G從搬入側滾子搬運路1 04被送 進到平台106上之際，或是基板G從平台106上被送出 到搬出側滾子搬運路1 之際，把露出於平台1〇6的Y 方向外側的基板兩端部配置在載置於側滾子1 5 2上的z方 向及Y方向的位置。在與基板G接觸的側滾子1 5 2的外 周面裝設有止滑上有效的橡膠製的0形環152a也可以（第 7圖）。 如第5圖所示地’在腔1 06的底壁形成有排氣口 1 6 1 一處或複數處。在此些排氣口 163是經由排氣管165連接 有真空排氣裝置140 °真空排氣裝置140是具有經排氣管 165，從大氣壓狀態真空軸引腔106內而作成所定真空度 的減壓狀態的功能。在排氣管1 6 5設有開閉閥（電磁閥 )1 67 ° 在腔106內的兩端部’亦即在搬入口 112及搬出口 -21 - 200837515 1 1 4附近比小滾子搬運路1 04，1 1 0還低的位置，設有朝 Υ方向延伸的氮氣噴出管168。此些氮氣噴出管168，是 例如燒結金屬粉末所成的多孔質中空管所構成，經由氣體 供應管170 (第4圖）被連接於氮氣供應源（未圖示）。完成 減壓乾燥處理之後，仍密閉腔1 06而從減壓狀態恢復成大 氣壓狀態之際，此些氮氣噴出管168成爲從全周面噴出氮 氣。 構成搬入側小滾子搬運路1 04的小滾子1 72，是在對 應於搬入口 1 12的高度位置朝基板搬運方向（X方向）隔著 適當間隔配置成一列，其中，設於腔1 〇6外的小滾子 172Α是經由適當的傳動機構被連接於專用於驅動電動機 。而腔106內的滾子172Β是如上述地，經由與滾子搬運 路124L，124R的側滾子152共通的驅動軸160被連接於 共通的驅動電動機1 6 2。 構成搬出側小滾子搬運路1 1 〇的小滾子1 74，也是在 對應於搬出口 1 14的高度位置朝基板搬運方向（X方向）隔 著適當間隔配置成一列，其中，設於腔1 0 6外的小滾子 1 74Α是經由適當的傳動機構被連接於專用於驅動電動機 。而腔1 0 6內的滾子1 7 4 B是如上述地，經由與滾子搬運 路124L，124R的側滾子152共通的驅動軸160被連接於 共通的驅動電動機1 6 2。 以下，說明該實施形態的減壓乾燥單元（VD)46的作 用。 如上述地，在上游側旁的光阻塗佈單元（C〇T)44被塗 -22- 200837515 佈光阻液的基板G ’是以平流從平台8 0上的浮起搬運換 移到搬入側小滾子搬運路1 04。然後，如第5圖所示地’ 基板G是以小滾子搬運而移動在搬入側小滾子搬運路1 〇4 上，不久從其搬入口 112進入到減壓乾燥單元（VD)46的 腔1 06中。此時，閘門機構1 1 6是打開著搬入口 1 1 2。 腔106內的浮起式滾子搬運路108，也進行與搬入側 小滾子搬運路1 04的小滾子搬運動作在時機上合適的同一 搬運速度的浮起式滾子搬運動作。爲此，作成斷開開閉閥 1 44，接通開閉閥1 42，藉由氣體浮起用氣體供應部1 3 6 經由氣體供應管1 3 4及配管1 3 0俾將壓縮空氣送進平台 122內的氣體緩衝室128，而藉由平台上面的氣體噴出孔 126以所定壓力噴出空氣。又，起動電動機162，以一定 旋轉速度旋轉左側及右側滾子搬運路124L，124R的所有 側滾子1 5 2。藉由此，如第5圖及第7圖所示地，從搬入 口 112進入的基板G，是在平台122上從氣體噴出孔126 所受到的空氣壓力浮起，而從平台1 22露出於左右外側的 基板兩側端部分別坐在左側及右側滾子搬運路1 24L， 124R的側滾子152上，而藉由側輥152的旋轉以平流朝 基板搬運方向（X方向）被搬運。 以，如上述地，前段或從上游側旁的光阻塗佈單元 (COT)44須接受減壓乾燥處理的基板G被搬進到腔106時 ，與此同時（或正要搬入之前）地，如第5圖所示地，在腔 1 06內剛受到減壓乾燥處理的先行基板G藉由浮起式滾子 搬運路1 0 8及搬出側小滾子搬運路1 1 〇上所連續的等速度 -23- 200837515 的平流搬運，從搬出口 1 14搬出到腔106外而直接被搬運 到後段或下游側旁的第2熱性處理部32(第1圖）。基板G 是在搬入出時以大約均勻的壓力從平台1 2 2的上面（細徑 又密的氣體噴出孔1 2 6)接受浮起用的空氣流之故，因而 基板G上的光阻膜從平台1 22側接受的熱性影響的偏差 小，實質上可忽略。 如上述地，在光阻塗佈單元（COT)44被塗佈光阻液的 基板G，藉由搬入側小滾子搬運路1 04及浮起式滾子搬運 路108上的連續性平流搬運被搬進減壓乾燥單元（VD)46 的腔1 0 6。剛搬進之後，起動閘門機構1 1 6，1 1 8，分別封 閉至今打開的搬入口 112及搬出口 114，進行密閉腔106 〇 之後，斷開浮起用氣體供應管134的開閉閥142而停 止平台122上面（氣體噴出孔126)的空氣噴出，同時往動 昇降氣缸14 6，得基板G的背面或下面從滾子搬運路 124L，1 24R的側滾子152朝上方離開，且將平台122僅 上昇所定衝程把基板G上面與腔1 0 8的頂面之距離間隔（ 間隙）D成爲所定値的高度位置。又，上述間隙D是會影 響到流在基板G上的氣體流速甚至於光阻膜的乾燥速度 的因數或參數。 如上述地連動平台122的上昇移動，接通排氣管138 ，165的開閉閥144，167，而將浮起氣體線路130，128 及腔1 06內空間連接於真空排氣裝置1 40。接通開閉閥 144，167的時機是同時也可以，惟通常是將浮起氣體線 -24- 200837515 路130，128側的開閉閥144的關閉作成較早較佳。如此 ，基板G是在往動（上昇）高度位置，基板背面立即以接觸 的狀態被載置在平台122上面，而腔106內的空間是當然 而浮起氣體線路130，128中也被真空氣排。 如上述地，在腔106內，基板G被放置在減壓環境 中，則從基板G上的光阻液膜令溶劑（稀釋劑）在常溫下有 效率地蒸發，而成爲適當地乾燥的光阻膜。該減壓乾燥處 理中，是平台122的平坦上面接觸於基板G的製品領域 全面之故，因而使得基板製品領域內的溫度分佈成爲大約 均勻，而不會有轉印跡發生在基板G的製品領域內之虞 。又，設於平台1 22上面的氣體噴出孔1 26是細孔或微細 孔，而且以一樣的密度分佈於一面之故，因而不會影響到 基板製品領域內的溫度分佈。 上述減壓乾燥處理是當經過一定時間，或是當腔106 內的壓力達到設定値，則在該情形下完成，而停止真空排 氣裝置140的排氣動作，並將排氣管138，165的開閉閥 144，167作成斷開。替代地，由氮氣噴出管168將氮氣 流進腔106內。之後，室內壓力上昇至大氣壓之後，才起 動（復動）閘門機構1 16，1 1 8而打開搬入口 1 12及搬出口 1 1 4。與此前後，接通浮起供應管丨3 4的開閉閥1 42，由 浮起用氣體供應部1 3 6經由氣體供應管1 3 4及配管1 3 0， 將壓縮空氣送進平台122內的氣體緩衝室128，而由平台 上面的氣體噴出孔136以所定壓力噴出空氣。一方面，復 動昇降氣缸146，俾將平台122僅下降所定衝程至在平台 -25- 200837515 1 22上所浮起的基板G的背面或下面跨在滾子搬運路 124L，124R的側滾子152的高度位置。 剛進行之後，在浮起式滾子搬運路1 〇 8及搬出側小滾 子搬運路1 1 〇上開如同一速度的平流搬運動作，剛接受減 壓處理的該當基板G是藉由浮起式滾子搬運及小滾子搬 運從搬出口 1 1 4被搬出，直接以平流被搬運到後段的第2 熱性處理部32(第1圖）。如第5圖所示地，來自光阻塗佈 單元（COY)44的後續基板G，藉由搬入側小滾子搬運路 104及浮起式滾子搬運路108上的連續性平流搬運，從搬 入口 112可搬進腔106內。 如上述地，該減壓乾燥單元（VD)46，是將須接受減壓 乾燥處理的基板G以小滾子搬運及浮起式滾子搬運搬進 腔106中，而將在腔106內經減壓乾燥處理的基板G藉 由浮起式滾子搬運及小滾子搬運作成搬出至腔1 06外之故 ，因而在基板對於腔1 06的搬入出中，不必使用搬運臂的 搬運機械手臂，而將基板如扇子地彎曲而在裝載/卸載之 際不會發生偏位或相撞，破損等的錯誤。又，穿通設於腔 1 0 6的側壁的開發狀態搬入口 1 1 2及搬出口 1 1 4來進行基 板G的搬入出之故，因而也不需要開閉（昇降）有1〜2噸以 上的腔1 〇 6的上蓋1 2 0的操作，沒有依大振動的發塵問題 ，而也可確保對於作業人員的安全性。又，滾子搬運路中 ，平台122的上面接觸於基板G的製品領域全面之故， 因而接觸構件的轉印跡不會發生在基板G的製品領域內 之虞。 -26- 200837515 以上針對於較佳實施形態來說明本發明，惟本發明是 並不被限定於上述實施形態，而在其技術思想的範圍內可 做各種變形。 例如，在浮起式滾子搬運路1 0 8中，也可以以朝基板 搬運方向（X方向）延伸的皮帶搬運路來代用設於平台122 的左右兩側的滾子搬運路124L，124R。或是，在基板G 的搬入出時，以吸附墊結合基板G的兩側端部而朝基板 搬運方向（X方向）搬運基板G，減壓乾燥處理中爲從基板 G分別離該吸附墊的搬運機構也可以。又，作爲浮起式滾 子搬運路1 08的搬運手段也可使用外部搬運機器手臂的搬 運臂。這時候，必須加大搬入出口 1 1 2，1 1 4使得搬運臂 也與基板G —起通過。 又，平台1 22的上面爲如上述實施形態的穿孔板，也 可以以具有多數細孔的多孔質物質所構成。上述實施形態 是以共通（同一）的真空排氣裝置140進行腔106內空間的 真空排氣與浮起用氣體線路1 3 0，1 2 8的真空排氣，惟以 其他獨立的真空排氣裝置進行也可以。 上述的實施形態的減壓乾燥單元（VD)40的腔106，是 在搬運方向相對的一對腔側壁分別設置搬入口 1 1 2及搬出 口 114，成爲基板G穿通腔106的構成。但是，也可以以 設腔1 06的一側壁的1個搬入出口兼用搬入口與搬出口的 構成，這時候，也可作成搬入滾子搬運路1 04與搬出側小 滾子搬運路1 1 〇的共用化。 本發明的被處理基板是並不被限定於LCD用的玻璃 -27- 200837515 基板者’也可以爲其他的平板顯示器用基板，或半導體晶 圓、CD基板、光置幕、印刷基板等。減壓乾燥處理對象 的塗佈液也並不被限定於光阻液，也可以爲例如層間絕緣 材料、介質材料、配線材料等的處理液。 【圖式簡單說明】 H 1 Η是表示本發明可適用的塗佈顯像處理系統的構 成的俯視圖。 第2圖是表示上述塗佈顯像處理系統的處理順序的流 程圖。 第3圖是表示實施形態的塗佈處理部的全體構成的俯 視圖。 第4圖是表示實施形態的減壓乾燥單元的構成的俯視 圖。 第5圖是表示實施形態的減壓乾燥單元的搬入出時的 各部狀態的局部斷面側面圖。 第6圖是表示實施形態的減壓乾燥單元的滾子搬運路 中的各部狀態的局部斷面側面圖。 第7圖是表示實施形態的減壓乾燥單元的搬入出時的 各部狀態的局部斷面側面圖。 第8圖是表示實施形態的減壓乾燥單元的減壓乾燥裝 置中的各部狀態的局部斷面側面圖。 第9圖是表示實施形態的平台內部的構造的擴大斷面 圖。 -28- 200837515 【主要元件符號說明】 1 〇 :塗佈顯像處理系統 3 0 :塗佈處理部 46 :減壓乾燥單元（VD) 104 :搬入側小滾子搬運路 106 :腔 108 :浮起式滾子搬運路 1 1 0 :搬出側小滾子搬運路 1 1 2 :搬入口 1 14 :搬出口 1 1 6，1 1 8 :閘門機構 122 :平台 124L，124R :滾子搬運路 126 :氣體噴出孔 1 2 8 :氣體緩衝室 130 :配管 1 3 4 :氣體供應管 1 3 6 :浮起用氣體供應部 1 3 8，1 6 5 :排氣管 140 :真空排氣裝置 142 ， 144 ， 167 :開閉閥 146 :氣缸 152 :側滾子 -29- 200837515 1 6 2 :電動 172(172A ， 174(174A ， 機 172B):搬入側滾子搬運路的小滾子 174B):搬出側滾子搬運路的小滾子 -30-200837515 IX. [Technical Field] The present invention relates to a vacuum drying apparatus that dries a coating liquid applied onto a substrate to be processed in a reduced pressure state. [Prior Art] Such a reduced-pressure drying device is used, for example, in a lithography imaging project manufactured by a flat panel display (FPD) such as a liquid crystal display (LCD). It is pre-baked and dried before being applied to the photoresist on the substrate to be processed (glass substrate, etc.). A conventional vacuum drying apparatus is described, for example, in Patent Document 1. Has : a lower chamber of the tray-type shallow container type that is open above, And a lid-shaped upper chamber that is airtightly attached or can be fitted to the upper surface of the lower chamber. A platform is arranged in the lower chamber. After the substrate is placed horizontally on the platform, The chamber is closed (the upper chamber is in close contact with the lower chamber) and dried under reduced pressure. When you want to move the substrate into the cavity, Then, the upper chamber is raised by a crane or the like to open the cavity. Also for loading/unloading, The platform is appropriately raised by a cylinder or the like. Again, Carrying in or out of the substrate, loading/unloading, This is carried out by the operation of the external transport robot that carries the substrate around the vacuum drying device. also, Most support pins are highlighted on the platform. The substrate is placed in such a state as to support the pins. Patent literature: JP-A-2000-181079 [Summary content] -5- 200837515 Conventional vacuum drying device, Is as above, Whenever the substrate is moved into the cavity, Make the upper chamber move up and down (open and close), However, as the substrate is enlarged, A variety of inconveniences arise in the construction of such devices. that is, When the size of the substrate is as large as, for example, 2 m on the side of the LCD substrate, Then, the cavity is also significantly enlarged, and only the upper chamber becomes important for 2 metric tons or more. And need a large-scale lifting mechanism, The problem of dusting due to vibration or the safety of the operator is gradually becoming apparent. also, The handling robot is also gradually enlarged. However, it becomes difficult to maintain a large substrate for handling horizontally. And by carrying the substrate just after the photoresist is applied, the substrate is bent like a large fan, When the substrate of the cavity of the vacuum drying apparatus is loaded or unloaded or loaded/unloaded, errors such as offset, collision, or breakage are likely to occur. also, In the cavity, The substrate is subjected to decompression drying on the pins protruding from the top of the platform. Therefore, there is also a problem that the stitch traces are transferred to the photoresist film on the substrate. The present invention has been made in view of the problems of the conventional techniques as described above, Its purpose is to provide efficient, Safely and smoothly carry in and out of the substrate to be processed, Further, it is effective to prevent the transfer drying film from adhering to the coating film on the substrate. In order to achieve the above objectives, The reduced-pressure drying device of the present invention, The coating liquid belonging to the substrate to be treated is subjected to a drying treatment decompression drying apparatus under reduced pressure. Its characteristics are: have: A decompressible cavity for accommodating a space of the substrate in an approximately horizontal state; And in the above drying treatment, a first exhaust mechanism for evacuating a space in the chamber in a sealed state; And having a surface on the substrate in which the substrate is placed, And a flat -6 - 200837515 having a plurality of gas ejection holes for ejecting a gas for floating the substrate; And supplying a gas for floating the substrate to the gas supply portion of the gas ejection hole via a gas line passing through the platform; And a second exhaust mechanism for evacuating the gas line by vacuum, When the drying process is performed, the gas line is connected to the second exhaust mechanism, and the substrate is placed on the platform. When the substrate is carried in and out, The gas line is connected to the gas supply unit to float the substrate on the stage. In the above device configuration, In the vacuum drying process, The vacuum exhaust chamber is opened by the first exhaust mechanism. And the second exhaust mechanism vacuum exhausts through the floating gas line inside the platform, The substrate to be processed is placed on the platform. There is no partial or local contact between the substrate and the platform. Therefore, the coating film on the substrate does not have a flaw in the transfer of the contact portion. also, Floating the substrate on the platform to carry out the substrate in a better advection, Therefore, it is not necessary to use the carrying arm of the carrying arm, There will be no deflection of the substrate as a fan and a misalignment or collision at the time of loading/unloading. Errors such as breakage. also, When the substrate is moved in and out, There is also no need to open and close the upper cover of the chamber, It also solves the problem of dusting or safety. also, In a preferred aspect of the invention, The top of the platform is smaller than the substrate. It is larger than the field of the substrate. By this, In the vacuum drying process, The field of products that contact the substrate on the substrate is comprehensive, On the other hand, when the substrate is carried in and out, the transport means can be brought into contact with or locked to both end portions (non-product areas) of the substrate exposed from the stage toward the outside. also, As a preferred aspect of the present invention, The gas ejection hole is formed on the platform as a pore of a certain density of -7-200837515. Or the top of the platform is made of porous material. Making a gas jet hole into a fine hole, It is possible to effectively reduce the deviation of the thermal influence from the platform side to the coating film on the substrate. also, According to a preferred aspect of the present invention, a transfer port for moving the substrate from the outside of the cavity into the cavity with a small roller, And a carrying port for carrying out the small roller and carrying it out of the cavity to the outside of the cavity, and is disposed at a side wall portion of the cavity, The shutter mechanism for opening and closing the inlet and the outlet is provided outside the side wall portion of the chamber. At this moment, The entrance and the exit are the size of the substrate that can be barely transported by small rollers. Therefore, the shutter mechanism can be made small. The entrance and the exit are mutually opposite and are respectively disposed on the side wall of the cavity. Only one move in and out can also be used. also, According to a preferred aspect of the present invention, A transport mechanism for transporting the substrate into the cavity in a flush flow is provided. When the substrate is rectangular, The transport mechanism has a pair of transport lines that move to the substrate transport direction by contacting the both end portions of the substrate exposed on both sides of the platform. Preferably, the transport line has a plurality of side rollers arranged on one side of the platform at a predetermined pitch in the substrate transport direction. also, In order to smoothly carry in and out of the substrate, Preferably in the handling mechanism, Between the platform and the entrance, Or between the platform and the exit, The configuration may include one or a plurality of internal small rollers arranged in the direction in which the substrate is conveyed, or one or a plurality of external small rolls arranged in the outer surface of the inlet or the outside of the outlet. The composition of the child, again, According to a preferred aspect of the present invention, A platform lifting mechanism for lifting, lifting or lifting the flat -8-200837515 is provided in the cavity. In this configuration, When drying, The platform is raised to the first height position by the platform lifting mechanism, and the substrate is separated from the conveying line and placed on the platform. When the substrate is carried in and out, The platform is lowered to the second height position by the platform lift mechanism so that the substrate is separated upward from the platform, and the both end portions may be placed on the transport line. a vacuum drying apparatus according to the present invention, By the constitution and function as described above, Efficient, Safely and smoothly carry out the loading and unloading of the substrate to be processed, Moreover, it is possible to effectively prevent the transfer film from adhering to the coating film on the substrate. [Embodiment] Hereinafter, Preferred embodiments of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a view showing a coating development processing system as a configuration example of a vacuum drying apparatus to which the present invention is applicable. The coating development processing system 10 is installed in a clean room. For example, a rectangular glass substrate is used as a substrate to be processed ’ in the LCD manufacturing process, Washing in the lithography imaging project, Photoresist coating 'pre-drying, A series of processors such as imaging and drying afterwards. The exposure processing is performed by the external exposure device 12 adjacent to the system. The coating development processing system 10, A horizontally long processing station (P/S) 16' is disposed in the center portion, and a cassette station (C/S) 14 and an interface station (i/f) 18 are disposed at both ends in the longitudinal direction (X direction). The crystal box station (C/S) 14 is the cassette loading and unloading port of the system 1〇. have: The substrate G is stacked in a plurality of stages, and the plurality of crystal cassettes C can be accommodated in a horizontal direction of -9 - 200837515 (Y direction), and four cassette stages 20 can be placed. And a transport mechanism 22 for picking and placing the substrate G on the cassette C on the platform 20. The transport mechanism 22 has a transport arm 22a that can hold the substrate G in one unit, At X, Y, Z, The 4 axes of 0 can be operated. It is a transfer of the adjacent process station (P/S) 16 side and the substrate G. The processing station (P/S) 16 is a pair of lines A extending in parallel and in the opposite direction to the horizontal system length direction (X direction), B Configure each processing unit according to the processing flow or engineering order. In more detail, In the processing line A from the crystal cassette station (C/S) 14 toward the upstream side of the interface station (I/F) 18 side, There is a loading unit (IN PASS) 24, Washing unit 26, The first heat treatment unit 28, The coating processing unit 30 and the second heat treatment unit 32 are arranged one after another in the order from the upstream side along the first smooth flow conveyance path 34. In more detail, The carry-in unit (IN PASS) 24 is configured to receive an unprocessed substrate G from the transport mechanism 22 of the cassette station (C/S) 14. On the other hand, the first convection conveyance path 34 can be input at a predetermined tempo. The cleaning processing unit 26 sequentially supplies the excimer UV irradiation unit (E-UV) 36 and the scrubbing cleaning unit (SCR) 38 along the first advection conveying path 34 from the upstream side. The first heat treatment unit 28 is provided with an attachment unit (AD) 40 and a cooling unit (COL) 42 in this order from the upstream side. The coating processing unit 30 sequentially sets the photoresist coating unit (COT) 44 from the upstream side. And a reduced pressure drying unit (VD) 46. The second heat treatment unit 32 is provided with a pre-drying unit (PRE-BAKE) 48 and a cooling unit (COL) 50 in this order from the upstream side. A through unit (P AS S) 52 is provided at the end of the first advection conveying path 34 located on the downstream side of the second heat treatment unit 32. The substrate g conveyed on the first advection conveyance path 34 by the flow of the flat-10-200837515, The pass unit (PASS) 52 from the end point is handed over to the interface station (I/F) 18. on the one hand, On the processing line B from the interface station (I / F) 1 8 toward the downstream portion of the cassette station (c / s) 1 4 side, With imaging unit (DEV) 54, Post-mortem drying unit (POST-BAKE) 56, Cooling unit (COL) 58, The inspection unit (AP) 6A and the unloading unit (OUT-PAS S) 62 are arranged in a row from the upstream side along the second advection conveying path 64. here, The post-drying unit (P0ST-PASS) 56 and the cooling unit (COL) 58 constitute the third heat treatment unit 66. Move out the unit (OUT PASS) 62, It is configured to receive the processed substrate G from one of the second advection conveyance paths 64, one by one, The handling mechanism 22 is handed to the cassette station (c / s) 14. On both processing lines A, There is a supplementary handling space in room B. On the other hand, the shuttle 70 which can horizontally mount the substrate G in one unit can be moved in both directions in the processing line direction (X direction) by the drive mechanism. The interface station (I/F) 18 has means for performing the above-described third and second advection transportation paths 34, 64 or a transfer device 72 that interfaces the adjacent exposure device 12 with the substrate G, A rotating platform (R/S) 74 and a peripheral device 76 are disposed around the conveying device 72. The rotating platform (R/S) 74 is a platform for rotating the substrate G in a horizontal plane. When used at the intersection with the exposure device 12 In order to change the direction of the rectangular substrate G. Peripheral device 7 6, For example, a turning device (TITLER) or a peripheral exposure device (EL) or the like is connected to the second advancing conveying path 64. Fig. 2 shows the processing procedure for the entire process of one substrate g of the coating development processing system. First of all, In the Crystal Box Station (C/S) 14, Handling -11 - 200837515 Agency 22, One substrate G is taken out from any one of the cassettes C on the platform 20, The taken-out substrate G is carried into the carry-in unit (IN PASS) 24 on the processing line A side of the processing station (P/S) 16 (step S1). The substrate G is transferred from the loading unit (IN PASS) 24 or is placed on the first smooth flow conveyance path 34, and is placed on the substrate G of the first flow-through conveyance path 34. First, in the cleaning processing unit 26, the laser ultraviolet irradiation unit (E-UV) 36 and the brush cleaning unit (SCR) 38 are sequentially subjected to ultraviolet cleaning treatment and brush cleaning processing (step S2). S3) The scrubbing cleaning unit (SCR) 38 is for moving the substrate G on the advancing conveying path 34 horizontally, Remove particulate dirt from the surface of the substrate by applying a brush or a blower. Afterwards, rinse treatment is applied. Finally, the substrate G is dried using an air knife or the like. When a series of washing processes of the scrubbing cleaning unit (SCR) 38 are completed, Then, the substrate G passes through the first heat treatment portion 28 directly through the first smooth flow path 34. In the first heat treatment unit 28, The substrate G is an adhesion treatment in which the vapor deposition HMDS is initially applied to the attachment unit (AD) 40. The treated surface is hydrophobized (step S4). After the attachment process is completed, The substrate G is cooled to a predetermined substrate temperature in the cooling unit (COL) 42 (step S5). then, The substrate G is carried into the coating processing unit 30 经 via the first smooth flow path 34, and is applied to the coating processing unit 30. The substrate G is a non-rotation method in which the slit coating nozzle is directly used in the photoresist coating unit (COT) 44 directly by using a slit nozzle. 涂布 Applying a photoresist solution on the substrate (the treated surface), Immediately thereafter, it is subjected to a normal temperature drying treatment by a reduced pressure drying unit (VD) 46 on the downstream side by a reduced pressure (step -12-200837515, step S6). The substrate G from the coating processing unit 30, The second heat treatment unit 32 passes through the first advection passage 34. In the second heat treatment unit 32, The substrate G is initially in a pre-baked unit (PRE-BAKE) 48, The heat treatment after the photoresist coating or the heat treatment before the exposure is pre-baked (step S7). With the pre-drying, The solvent remaining in the photoresist film remaining on the substrate G is evaporated and removed. The adhesion to the photoresist film of the substrate is enhanced. after that, The substrate G is cooled to a predetermined substrate temperature in the cooling unit (COL) 50 (step S8). Then, the substrate G is a transport device 72 that is picked up from the communication unit (PSAA) 52 at the end of the first advection transport path 34 to the interface station (I/F) 18. In the interface station (I/F) 18, The substrate G is a peripheral exposure device (EE) that is carried into the peripheral device 76 after the rotating stage 74 is subjected to a direction change of, for example, 90 degrees. After the apparatus is exposed to the exposure for removing the photoresist attached to the peripheral portion of the substrate G at the time of development, It is sent to the adjacent exposure device 12 (step S9). In the exposure device 12, The predetermined circuit pattern is exposed to the photoresist on the substrate G. After completing the pattern exposure of the substrate G, When returning from the exposure device 12 to the interface (I/F) 18 (step S9), Then, it is first carried into the turning device (TITLER) of the peripheral device 76, The information determined at this place is recorded on a predetermined portion on the substrate (step S10). after that, The substrate G is moved to the starting point of the developing unit (DEV) 54 of the second advancing conveying path 64 on the processing line B side of the processing station (P/S) 16 by the transport device 72. in this way, This time, the substrate G is conveyed toward the downstream side of the processing line B -13 - 200837515 on the second advection conveying path 64. In the original imaging unit (DEV) 54, The substrate G is imaged while being transported in an advection stream. A series of development processes of rinsing and drying are performed (step S11). a substrate G that performs a series of development processes in a developing unit (DEV), It is placed directly on the second advection conveying path 64 and sequentially passes through the third heat treatment unit 66 and the inspection unit (AP) 60. In the third heat treatment unit 66, The substrate G is initially in a post-drying unit (P〇ST-BAKE) 56, The heat treatment after the development treatment is subjected to post-baking (step S 1 2). By drying after the event, The developing solution of the photoresist film remaining on the substrate G is evaporated and removed. The adhesion to the photoresist pattern of the substrate can be enhanced. after that, The substrate G is cooled to a predetermined substrate temperature by a cooling unit (COL) 58 (step S13). In the inspection unit (AP) 60, Non-contact line width inspection or film quality for the photoresist pattern on the substrate G, Film thickness inspection or the like (step S 1 4 ). The detection unit (OUT PASS) 62 is a substrate G that receives the process of completing the entire process from the second advection conveyance path 64, And it is delivered to the transport mechanism 22 of the crystal cassette station (c / S) 14. On the side of the crystal box station (C/S) 14 The transport mechanism 22 accommodates the processed substrate G received from the carry-out unit (OUT PASS) 62 in any (usually original) crystal cassette C (step S1). In the coating development processing system 10, The present invention can be applied to a reduced-pressure drying unit (VD) in the coating treatment unit 30, the following, According to Figures 3 and 9, The configuration and action of the reduced-pressure drying unit (VD) 46 in the coating treatment unit 3 of the preferred embodiment of the present invention will be described in detail. Fig. 3 is a plan view showing the overall configuration of the coating processing unit 30 of the embodiment. 4 to 8 are views showing the constitution of a reduced-pressure drying unit (VD) 46 - 14 - 200837515, And Figure 4 shows its top view, Figures 5 and 6 show a partial cross-sectional side view, Fig. 7 and Fig. 8 are rear views showing a partial cross section thereof. Fig. 9 is an enlarged cross-sectional view showing the structure provided inside the platform of the reduced-pressure drying unit (VD) 46. In Figure 3, The photoresist coating unit (COT) 44 has: a floating platform 80 constituting a part of the first advection conveying path 34 (Fig. 1) or a section, And transporting the substrate G floating on the platform 80 to the substrate transport mechanism 82 in the longitudinal direction (X direction) of the platform, And a photoresist nozzle 84 for supplying a photoresist on the substrate G carried on the platform 80, And the nozzle refreshing portion 86 of the photoresist nozzle 84 is updated during the coating process. A plurality of gas injection holes 88 for spraying a predetermined gas (for example, air) upward are provided on the upper surface of the stage 80, The pressure of the gas injected from the gas injection holes 88 is constituted, The substrate G is caused to float from the top of the platform to a certain height. The substrate transport mechanism 82 is provided with: a pair of guide rails 90A extending in the X direction across the platform 80, 90B, And along the guide rails 90A, 90B reciprocable slider 92, And a substrate holding member (not shown) provided in the slider 92 as a suction pad or the like which detachably holds both end portions of the substrate G on the stage 80, Moving the slider 92 in the conveying direction (X direction) by a straight moving mechanism (not shown), On the platform 80, the floating conveyance of the substrate G can be performed. The photoresist nozzle 84 is an elongated nozzle that extends across the platform 80 in a horizontal direction (Y direction) orthogonal to the conveyance direction (X direction). It becomes the top of the substrate G directly below the predetermined coating position, The photoresist is spit out in a strip shape from the slit -15-200837515. also, The photoresist nozzle 84 is configured to be movable in the X direction with the nozzle support member 94 supporting the nozzle. And can move up and down in the Z direction. It becomes movable between the above-mentioned coating position and the nozzle refreshing portion 86. The nozzle update unit 86 is provided with: The predetermined position above the platform 80 is held at the support member 96. As a preliminary preparation for the coating process, the photoresist is used to discharge the photoresist to the preliminary processing portion 98 for the photoresist nozzle 84, And a nozzle bus 100 that holds the photoresist discharge port of the photoresist nozzle 84 in an environment of solvent vapor for the purpose of preventing drying, And a nozzle cleaning mechanism 1 〇 2 for removing the photoresist attached to the photoresist discharge port 84 of the photoresist nozzle 84. The main function of the photoresist coating unit (COT) 44 will be explained. First of all , By the first heat treatment unit 28 of the front stage (Fig. 1), For example, the substrate G conveyed by the small roller is carried to the front end side set on the stage 80, The slider 92 that is standing by at this place holds the substrate G and is accepted. On the platform 8〇, The substrate G is held in a floating state in an approximately horizontal posture by the pressure of the gas (air) injected from the gas injection port 88. then, The slider 92 is disposed to face the substrate (the direction of the decompression drying unit (VD) 46 and moves toward the conveying direction (X direction). When the substrate G passes under the photoresist nozzle 84, The photoresist is sputtered onto the upper surface of the substrate G by the photoresist nozzle 84, On the substrate G, a liquid film of a photoresist liquid is formed on one side from the front end to the rear end of the substrate, such as a carpet. The substrate G to which the photoresist is applied as such, It is also thereafter carried by the slider 92 on the platform 80, Transfer across the rear end of the platform 80 to the small roller handling path described below -16- 200837515 1 04, At this point, the holding of the slider 92 is released. Transfer to the substrate G of the small roller transport path 104, It’s starting from here, The small roller transport path 104 is transported by small rollers as described below, and is carried into the decompression drying unit (VD) 46 of the subsequent stage. After the coated substrate G is sent to the side of the reduced-pressure drying unit (VD) 46 as described above, The slider 92 is returned to the front end side loading portion of the stage 80 in order to receive the next substrate G. also, The photoresist nozzle 84 is completed once or a plurality of coating processes. Then, it moves from the coating position (photoresist discharge position) to the nozzle refreshing portion 86, After the nozzle cleaning or the initial processing or the like is updated or prepared in advance, Go back to the coating position. As shown in Figure 3, On the extension line (downstream side) of the stage 80 of the photoresist coating unit (COT) 44, A small roller transport path 104 that constitutes a part or a section of the first advection conveyance path 34 (Fig. 1) is laid. The small roller transport path 104 is continuous into the cavity 106 of the reduced pressure drying unit (VD) 46. Around the reduced pressure drying unit (VD) 46, In addition to the above-described carry-in side small roller transport path 104 extending straight from the photoresist coating unit (COT) 44 into the cavity 106, A floating roller handling path 108 is also laid in the interior of the cavity 106. Further, the carry-out small roller transport path 110 from the cavity 106 to the processing unit (second heat processing unit 32) in the subsequent stage is laid. Move into the side small roller handling road 1 04, It is a cavity 106 which is configured to receive the substrate G carried out by the extension of the floating conveyance from the stage 80 of the photoresist coating unit (COT) 44, and is transported to the reduced-pressure drying unit (VD) 46 by small rollers. The floating roller transport path 1〇8 is a floating type that constitutes the same -17-200837515 speed from the substrate G transported by the small roller transport path 1 by the small roller transport path 1 by the small roller transport path 104. Roller handling is pulled into the cavity 106, At the same time, the substrate G which has been subjected to the reduced-pressure drying treatment in the chamber 106 is conveyed by the floating roller to the outside of the chamber 106 (the rear stage). The transport-side small roller transport path 1 1 构成 is configured to transport the processed substrate G that is transported by the floating roller transport path 1 〇 8 by the floating roller, and is transported by the small roller at the same speed. The second heat treatment unit 32 that is transported to the outside of the chamber 106. As shown in Figures 3 and 8, The cavity 106 of the reduced pressure drying unit (VD) 46 is formed into a flattened rectangular parallelepiped. There is a space in which the substrate G can be horizontally accommodated. a pair of chamber side walls (upstream side and downstream side) facing each other in the conveying direction (X direction) of the chamber 106, Each of the substrates G is provided with a slit-like inlet 1 1 2 and a discharge port 114 which are formed in a size that is easy to pass. also, a shutter mechanism 116 for opening and closing such a transfer port 112 and a transfer port 1 14 1 18 is mounted on the outer wall of the cavity 106, The upper face or upper cover 120 of the cavity 106 is detachable for maintenance. Each gate mechanism 1 1 6, 1 1 8 is an illustration, Only have: The cover body (valve body) of the 1 1 2 ′ 1 1 4 can be hermetically sealed. And moving the lid up and down to the first cylinder between the vertical forward position horizontally opposed to the loading inlet H2' 114 and the vertical vertical moving position lower than the position. And moving the cover horizontally to the loading and exiting outlet 112, 114 second air cylinder between the horizontally moving position and the horizontally separated position of the isolated or separated airtightly. The floating roller handling path 1〇8 is flattened by a central portion that is horizontally and vertically movable in the cavity 106. Rectangular platform 1 2 2, And the roller conveyance path 124L which is placed on the left and right sides of the platform 122 from the loading port 1 12 toward the transfer port 1 14 in the substrate conveyance direction (X direction) as the front side, -18-200837515, Constructed by 124R. As shown in Figure 4, A plurality of or a plurality of gas ejection holes 126 are formed on the platform 1 22 at the same density. When the substrate G is carried in and out by the reduced pressure drying unit (VD) 46, In order to float the substrate G on the stage 122, a gas (for example, air) is ejected by the respective gas ejection holes 126 at an appropriate pressure. The upper surface of the platform 1 22 is a rectangle shaped like the substrate G. Has a smaller size than the substrate G, It is larger than the field of the substrate G. general, The edge area of the glass substrate for LCD having a predetermined width (for example, a width of 20 to 30 mm) is set on the periphery of the substrate (the surface to be processed). In the effective field on the inner side of the edge area, that is, the product area is formed with an LCD element. The field of products is a field of assurance that the quality of the photoresist film must be guaranteed. usually, When the substrate G is centered and placed on the top of the stage 1 22, Then, the upper surface of the selected stage 122 is such that each side of the substrate G is exposed outwardly by only 15 mm to 20 mm from each side of the stage 122. As shown in Figure 9, In platform 122, Inviting a hollow gas to slow down • V - flush chamber 128. The gas buffer chamber 128, Is a gas ejection hole 126 connected to the upper surface of the platform, Moreover, it is connected to the piping 130 below the platform. As described below, The gas ejection holes 1 26 are preferably used to reliably prevent variations in the thermal influence of the photoresist film or to cause the transfer to be formed into fine pores or fine pores. The composition of the diagram, A pupil 127 is formed under the upper panel 122a of the platform 122, On the other hand, at the center of the thin top surface of the bore 127, a gas discharge hole 1 2 6 having a small diameter or a fine diameter (preferably φ 1 · 3 mm or less) is bored. In the gas buffer chamber 1 28, A column 132 for preventing the upper panel 122a from being bent is provided at an appropriate portion. -19- 200837515 The pipe 130 is pulled in from the outside of the cavity 106. On the other hand, in conjunction with the lifting and lowering of the platform 122, it is in a state of lifting or contracting. In order to pass through the pipe 1 3 0, The hole formed in the bottom wall of the chamber 106 is closed by the closing member 131. Outside the cavity 106, The piping 130 is passed through the gas supply pipe 134 via the gas supply pipe 134. Further, the exhaust pipe 138 is also passed through the vacuum exhaust unit 140. An opening and closing valve (solenoid valve) 142 is provided in each of the gas supply pipe 134 and the exhaust pipe 138, 144. The floating gas supply unit 136 is composed of a compressed air source and a regulator for a compressor or a factory, and the like. 俾 Send compressed air at the specified pressure. The vacuum exhaust device 140 has a vacuum pump, With exhaust pipe 1 3 8, The vacuum suction pipe 130 from the atmospheric pressure state and the gas buffer chamber 128 in the stage 122 function as a reduced pressure state of a predetermined degree of vacuum. In order to lift the mobile platform 1 22, A plurality of cylinders 146 are disposed below the cavity 106 at predetermined intervals as a lifting drive source. The bottom wall of the chamber 106 is supported by a support shaft 148 that is vertically movable in a vertical direction. A piston rod having a cylinder 146 is coupled to the platform 122. In order to punch through the support shafts 148, The hole formed in the bottom wall of the chamber 1 is closed by the sealing member 150 having a guiding function. As shown in Figures 4 and 7, a pair of roller transport paths 124L extending in the substrate transport direction (X direction) on the left and right sides of the stage 122, 124R, The plurality of side rollers 1 52 are arranged in a row at regular intervals in the same direction. Each of the side rollers 1 5 2 is composed of a circular plate body or a cylindrical body. A roller support shaft 1 5 4 extending horizontally from the center portion toward the outside in the Y direction is rotatably supported at its intermediate portion by a bearing 156. Further, the front end portion is connected to the common drive shaft 16A via the -20-200837515 magnet bevel gear 158. The drive shaft 160 of the right roller transport path 124R is via the drive pulley 164. The actuating belt 166 and the driven pulley 169 are connected to a motor 162 that is mounted to a rotary drive source outside the chamber 1 〇 6. The drive shaft 160 of the left roller transport path 124L, The small roller 1 7 2 that constitutes a portion of the carry-side small roller transport path 104 and the carry-out small roller transport path 1 1 0 is formed in the chamber 1 〇 6 , 1 7 4 becomes the rotational driving force from the right drive shaft 1 60. As another configuration example, The drive shaft 160 of the left roller transport path 124L may be configured to be connected to a rotational drive source different from the motor 621. As shown in Figures 4 and 7, Roller handling road 124L, 12 4R side roller 1 5 2, When the substrate G is fed from the carry-in side roller transport path 104 to the stage 106, Or when the substrate G is sent out from the platform 106 to the carry-out side roller transport path 1, Both end portions of the substrate exposed to the outside in the Y direction of the stage 1〇6 are disposed at positions in the z direction and the Y direction which are placed on the side rollers 152. It is also possible to attach an O-ring 152a made of rubber which is effective in slip prevention to the outer peripheral surface of the side roller 152 which is in contact with the substrate G (Fig. 7). As shown in Fig. 5, the bottom wall of the chamber 106 is formed with one or a plurality of exhaust ports 161. The exhaust ports 163 are connected via a exhaust pipe 165. The vacuum exhaust device 140 has a gas exhaust pipe 165. From the atmospheric pressure state, the vacuum shaft is introduced into the chamber 106 to function as a decompressed state of a predetermined degree of vacuum. The exhaust pipe 165 is provided with an opening and closing valve (electromagnetic valve) 1 67 ° at both ends in the cavity 106, that is, near the transfer port 112 and the port 21 - 200837515 1 1 4 than the small roller transport path 1 04, 1 1 0 is still low, A nitrogen gas discharge pipe 168 extending in the direction of the weir is provided. These nitrogen gas discharge pipes 168, It is composed of, for example, a porous hollow tube made of sintered metal powder. It is connected to a nitrogen supply source (not shown) via a gas supply pipe 170 (Fig. 4). After the vacuum drying process is completed, While still closing the cavity 106 and returning to the atmospheric pressure state from the decompressed state, These nitrogen gas discharge pipes 168 eject nitrogen gas from the entire circumference. a small roller 1 72 constituting the small roller transport path 104 of the loading side, It is arranged in a row at an appropriate interval in the substrate conveyance direction (X direction) at a height position corresponding to the entrance 1 12 . among them, The small rollers 172, which are disposed outside the chamber 1 〇6, are connected to a dedicated drive motor via a suitable transmission mechanism. And the roller 172 in the cavity 106 is as described above, Via the roller handling road 124L, The drive shaft 160 common to the side rollers 152 of the 124R is connected to the common drive motor 162. a small roller 1 74 constituting the small roller transport path 1 1 搬 on the carry-out side, It is also arranged in a row at an appropriate interval in the substrate conveyance direction (X direction) at a height position corresponding to the outlet 1 14 . among them, The small rollers 1 74 设 disposed outside the cavity 1 0 6 are connected to the drive motor exclusively via a suitable transmission mechanism. And the roller 1 7 4 B in the cavity 1 0 6 is as described above, Via the roller handling road 124L, The drive shaft 160 common to the side rollers 152 of the 124R is connected to the common drive motor 162. the following, The action of the reduced-pressure drying unit (VD) 46 of this embodiment will be described. As mentioned above, The photoresist coating unit (C〇T) 44 on the upstream side is coated with -22-200837515. The substrate G' of the photoresist is transferred from the floating transport on the platform 80 to the small roller on the loading side. Handling road 1 04. then, As shown in Fig. 5, the substrate G is transported by small rollers and moved on the carry-in side small roller transport path 1 〇4. It is soon entered from its inlet 112 into the chamber 106 of the reduced pressure drying unit (VD) 46. at this time, The shutter mechanism 1 16 is open to the entrance 1 1 2 . a floating roller handling path 108 in the cavity 106, The floating roller conveying operation at the same conveying speed as the timing of the small roller conveying operation of the loading side small roller conveying path 104 is also performed. to this end, Open and close the valve 1 44, Open the on-off valve 14.2 The compressed air is fed into the gas buffer chamber 128 in the stage 122 via the gas supply pipe 1 3 4 and the pipe 1 3 0俾 by the gas floating gas supply unit 1 3 6 . The air is ejected at a predetermined pressure by the gas ejection holes 126 on the platform. also, Starting motor 162, Rotate the left and right roller handling paths 124L at a certain rotational speed, All the side rollers of the 124R are 1 5 2 . By this, As shown in Figures 5 and 7, The substrate G entering from the loading port 112, The air pressure received from the gas ejection hole 126 on the platform 122 floats, The two sides of the substrate exposed from the platform 1 22 on the left and right sides are respectively seated on the left and right roller carrying paths 1 24L, On the side roller 152 of the 124R, On the other hand, the side roller 152 is conveyed in a flat flow toward the substrate conveyance direction (X direction). To, As mentioned above, When the substrate G of the front stage or the photoresist coating unit (COT) 44 to be subjected to the reduced-pressure drying treatment is carried into the cavity 106, At the same time (or before moving in), As shown in Figure 5, The preceding substrate G which has just been subjected to the reduced-pressure drying treatment in the chamber 106 has a continuous flow of the constant velocity -23-200837515 by the floating roller transport path 1 0 8 and the carry-out small roller transport path 1 1 〇 Handling, The unloading port 1 14 is carried out to the outside of the chamber 106, and is directly transported to the second heat treatment unit 32 (Fig. 1) on the rear side or the downstream side. The substrate G is subjected to a floating air flow from the upper surface of the stage 1 2 2 (the fine-diameter gas discharge hole 1 2 6) at a substantially uniform pressure during the loading and unloading. Therefore, the deviation of the thermal effect of the photoresist film on the substrate G from the side of the stage 1 22 is small. Substantially negligible. As mentioned above, The substrate G to which the photoresist is applied to the photoresist coating unit (COT) 44, The conveyance side small roller conveyance path 104 and the floating roller conveyance path 108 are conveyed continuously into the cavity 1 0 6 of the decompression drying unit (VD) 46 by the continuous advection. Just after moving in, Starting gate mechanism 1 1 6, 1 1 8, The opening 112 and the opening 114 that have been opened so far are closed, respectively. After performing the closed chamber 106 ,, The opening and closing valve 142 of the floating gas supply pipe 134 is disconnected to stop the air from being ejected from the upper surface of the stage 122 (the gas ejection hole 126). Simultaneously moving the lifting cylinder 14 6 The back or bottom of the substrate G is taken from the roller carrying path 124L, 1 24R's side roller 152 leaves upwards, Further, the distance between the upper surface of the substrate G and the top surface of the cavity 108 (gap) D is set to a predetermined height position by raising the stage 122 only by the predetermined stroke. also, The above gap D is a factor or parameter which affects the flow rate of the gas flowing on the substrate G or even the drying speed of the photoresist film. Ascending the movement of the platform 122 as described above, Turn on the exhaust pipe 138, Opening and closing valve 144 of 165, 167, And the gas line 130 will be floated, The space inside the chamber 128 and the chamber 106 is connected to the vacuum exhaust unit 1 40. Turn on the on-off valve 144, The timing of 167 is also ok, However, it is usually the floating gas line -24- 200837515 road 130, The closing of the opening and closing valve 144 on the 128 side is preferably made earlier. in this way , The substrate G is at a moving (rising) height position, The back surface of the substrate is immediately placed on the platform 122 in a contact state. The space within the cavity 106 is of course the floating gas line 130, 128 is also discharged by vacuum gas. As mentioned above, In the cavity 106, The substrate G is placed in a reduced pressure environment, The solvent (diluent) is efficiently evaporated from the photoresist film on the substrate G at a normal temperature. It becomes a properly dried photoresist film. In the vacuum drying treatment, It is the whole field of the flat surface of the platform 122 that is in contact with the substrate G. Thus, the temperature distribution in the field of substrate products is made approximately uniform. There is no such thing as a transfer of the mark in the field of the product of the substrate G. also, The gas ejection holes 126 provided on the upper surface of the platform 1 22 are fine holes or fine holes. And distributed to one side at the same density, Therefore, it does not affect the temperature distribution in the field of substrate products. The above vacuum drying treatment is when a certain period of time passes, Or when the pressure in the chamber 106 reaches the set threshold, Then complete in this situation, And the exhausting operation of the vacuum exhausting device 140 is stopped, And the exhaust pipe 138, 165 opening and closing valve 144, 167 is made disconnected. Alternatively, Nitrogen gas is introduced into the chamber 106 by a nitrogen sparging tube 168. after that, After the indoor pressure rises to atmospheric pressure, Start (reaction) gate mechanism 1 16, 1 1 8 and open the entrance 1 12 and the exit 1 1 4. Before and after, The opening and closing valve of the floating supply pipe 丨3 4 is turned on. The floating gas supply unit 1 3 6 passes through the gas supply pipe 1 3 4 and the pipe 1 3 0, Compressed air is fed into the gas buffer chamber 128 in the platform 122, The gas ejection holes 136 from the upper surface of the stage eject air at a predetermined pressure. on the one hand, Repetitive lifting cylinder 146, 俾 the platform 122 is only lowered by the predetermined stroke to the roller carrying path 124L across the back or bottom of the substrate G floating on the platform -25-200837515 1 22, The height position of the side roller 152 of the 124R. Just after the start, The floating roller conveying path 1 〇 8 and the carrying-out small roller conveying path 1 1 〇 are opened at the same speed as the advection conveying operation. The substrate G that has just been subjected to the pressure reduction treatment is carried out from the unloading port 1 1 4 by the floating roller conveyance and the small roller conveyance. It is conveyed directly to the second heat treatment unit 32 (first figure) in the subsequent stage in a flat flow. As shown in Figure 5, Subsequent substrate G from photoresist coating unit (COY) 44, The continuous advection conveyance on the side small roller transport path 104 and the floating roller transport path 108 is carried out. The inlet 112 can be moved into the chamber 106. As mentioned above, The reduced pressure drying unit (VD) 46, The substrate G to be subjected to the reduced-pressure drying treatment is carried into the cavity 106 by small roller conveyance and floating roller conveyance. On the other hand, the substrate G which has been subjected to the reduced-pressure drying treatment in the chamber 106 is transported out of the chamber 106 by the floating roller conveyance and the small roller conveyance. Therefore, in the loading and unloading of the substrate to the cavity 106, It is not necessary to use the handling arm of the carrying arm, When the substrate is bent like a fan, no offset or collision occurs during loading/unloading. Damages such as breakage. also, The development state of the side wall of the cavity 160 is inserted through the development port 1 1 2 and the outlet 1 1 4 to carry out the loading and unloading of the substrate G. Therefore, it is not necessary to open and close (lift) the upper cover 1 2 0 of the cavity 1 〇 6 of 1 to 2 tons or more. There is no problem of dusting according to large vibrations. It also ensures the safety of the operator. also, Roller handling, The upper surface of the platform 122 is in contact with the substrate G, and the product field is comprehensive. Thus, the transfer of the contact member does not occur in the field of the product of the substrate G. -26- 200837515 The present invention has been described above with respect to preferred embodiments, However, the present invention is not limited to the above embodiment. Various modifications can be made within the scope of its technical ideas. E.g, In the floating roller handling path 1 0 8 The roller transport path 124L provided on the left and right sides of the stage 122 may be replaced by a belt transport path extending in the substrate transport direction (X direction). 124R. Or, When the substrate G is carried in and out, The substrate G is transported in the substrate transport direction (X direction) by the adsorption pad bonding both end portions of the substrate G, In the vacuum drying treatment, a transport mechanism that separates the adsorption pad from the substrate G may be used. also, As the transport means of the floating roller transport path 108, the transport arm of the external transport robot can also be used. At this moment, Must move into the exit 1 1 2, 1 1 4 causes the carrier arm to pass through together with the substrate G. also, The upper surface of the platform 1 22 is a perforated plate as in the above embodiment. It may also be composed of a porous substance having a large number of pores. In the above embodiment, the vacuum exhausting means 140 for vacuum evacuation and floating of the space in the cavity 106 is performed by the common (same) vacuum exhausting device 140, 1 2 8 vacuum exhaust, It is also possible to use other independent vacuum exhaust devices. The cavity 106 of the reduced-pressure drying unit (VD) 40 of the above embodiment, The inlets 1 1 2 and the outlets 114 are respectively disposed on the pair of chamber side walls opposite to each other in the conveying direction. The substrate G is inserted into the cavity 106. but, It is also possible to provide a loading and unloading port and a transfer port for one of the side walls of the chamber 106. At this moment, It is also possible to share the roller transport path 104 and the carry-out small roller transport path 1 1 . The substrate to be processed of the present invention is not limited to the glass for LCD -27-200837515 substrate, and may be another substrate for flat panel display. Or semiconductor crystal, CD substrate, Light curtain, Printing a substrate or the like. The coating liquid to be dried under reduced pressure is not limited to the photoresist solution. It can also be, for example, an interlayer insulating material, Media material, A treatment liquid such as a wiring material. BRIEF DESCRIPTION OF THE DRAWINGS H 1 Η is a plan view showing a configuration of a coating development processing system to which the present invention is applicable. Fig. 2 is a flow chart showing the processing procedure of the above-described coating development processing system. Fig. 3 is a plan view showing the overall configuration of the coating treatment unit of the embodiment. Fig. 4 is a plan view showing the configuration of the reduced-pressure drying unit of the embodiment. Fig. 5 is a partial cross-sectional side view showing the state of each portion when the reduced-pressure drying unit of the embodiment is carried in and out. Fig. 6 is a partial cross-sectional side view showing a state of each portion in the roller conveying path of the reduced-pressure drying unit of the embodiment. Fig. 7 is a partial cross-sectional side view showing the state of each portion when the decompression drying unit of the embodiment is carried in and out. Fig. 8 is a partial cross-sectional side view showing the state of each portion in the reduced-pressure drying device of the reduced-pressure drying unit of the embodiment. Fig. 9 is an enlarged cross-sectional view showing the structure inside the platform of the embodiment. -28- 200837515 [Explanation of main component symbols] 1 〇 : Coating development processing system 3 0 : Coating treatment unit 46 : Decompression drying unit (VD) 104: Moving into the side small roller handling path 106 : Cavity 108: Floating roller handling road 1 1 0 : Move out the side small roller handling road 1 1 2 : Moving in 1 14 : Moving out 1 1 6, 1 1 8 : Gate mechanism 122 : Platform 124L, 124R : Roller handling road 126 : Gas ejection hole 1 2 8 : Gas buffer chamber 130: Piping 1 3 4 : Gas supply pipe 1 3 6 : Floating gas supply unit 1 3 8, 1 6 5 : Exhaust pipe 140 : Vacuum exhaust 142 144, 167 : Opening and closing valve 146 : Cylinder 152: Roller -29- 200837515 1 6 2 : Electric 172 (172A, 174 (174A, Machine 172B): Small rollers that move into the side roller handling path 174B): Small roller that moves out of the side roller handling path -30-