TWI424522B - Apparatus for processing a substrate - Google Patents

Apparatus for processing a substrate Download PDF

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Publication number
TWI424522B
TWI424522B TW100100871A TW100100871A TWI424522B TW I424522 B TWI424522 B TW I424522B TW 100100871 A TW100100871 A TW 100100871A TW 100100871 A TW100100871 A TW 100100871A TW I424522 B TWI424522 B TW I424522B
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Taiwan
Prior art keywords
substrate
drying
coating
air supply
module
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TW100100871A
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Chinese (zh)
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TW201140737A (en
Inventor
Seung-Won Ham
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Semes Co Ltd
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Publication of TW201140737A publication Critical patent/TW201140737A/en
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Publication of TWI424522B publication Critical patent/TWI424522B/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/168Finishing the coated layer, e.g. drying, baking, soaking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • B65G49/065Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like

Description

基板處理裝置Substrate processing device

本發明是有關於一種處理基板的裝置,且特別是有關於一種形成與乾燥光阻劑膜於一平板顯示器的裝置。This invention relates to a device for processing a substrate, and more particularly to a device for forming and drying a photoresist film on a flat panel display.

一般而言,電子電路圖案形成於如半導體基板及平坦玻璃的平板顯示裝置之基板上。該電子電路圖案通常要經過一連串程序,像是沉積(deposition)、光蝕(photolithography)、化學蝕刻(etching)及清洗(cleaning)程序,才能使其一步步形成於基板上。In general, an electronic circuit pattern is formed on a substrate of a flat panel display device such as a semiconductor substrate and flat glass. The electronic circuit pattern is typically subjected to a series of processes, such as deposition, photolithography, chemical etching, and cleaning, to form it step by step on the substrate.

特別是光蝕程序包含了使光阻劑膜塗佈於基板上的塗佈程序,使光阻劑膜乾燥的乾燥程序,軟烘烤(soft baking)程序使光阻劑膜硬化,曝光程序將光罩圖案(reticle pattern)移轉至光阻劑膜上,顯影程序使光阻圖案於基板上顯現,高溫烘烤程序將光阻劑膜完全硬化。In particular, the photo-etching process includes a coating process for applying a photoresist film on a substrate, a drying process for drying the photoresist film, and a soft baking process to harden the photoresist film, and the exposure process will be performed. The reticle pattern is transferred to the photoresist film, the development process causes the photoresist pattern to appear on the substrate, and the high temperature baking process completely hardens the photoresist film.

光蝕程序中的每個程序單元在各自的機台模組上進行,而基板常要藉由運送機器人往來各個機台模組。舉例來說,基板在塗佈機台模組完成光阻劑膜塗佈後就要藉由運送機器人將其送至乾燥機台模組進行乾燥程序。Each program unit in the photo-etching process is performed on a respective machine module, and the substrate is often transported by the robot to each machine module. For example, after the coating machine module is coated with the photoresist film, the substrate is sent to the drying machine module for drying process by the transport robot.

然而,經由光蝕程序的基板,一旦大量生產必然會因為高費用的運送機器人而造成高成本的問題。此外,當運送機器人被用於運送基板往來各程序的機台模組,基板的生產速度便很難提升,且各程序的機台模組彼此間也很難一起有系統地操作。However, the substrate through the photo-etching process, once mass-produced, inevitably causes a high cost problem due to the high cost of transporting the robot. In addition, when the transport robot is used to transport the substrate modules of the respective substrates, the production speed of the substrates is difficult to increase, and the machine modules of the respective programs are also difficult to systematically operate with each other.

有鑑於此,本發明的目的就是在提供一種處理裝置,用以在基板上形成光阻劑膜並能水平運送,不需要運送機器人。In view of the above, it is an object of the present invention to provide a processing apparatus for forming a photoresist film on a substrate and capable of horizontal transportation without the need to transport the robot.

根據本發明的實施例,提出一基板處理裝置,包括一塗佈模組以及一乾燥模組,塗佈模組用以將光阻劑膜塗佈至基板上並水平移動基板至運送方向。乾燥模組鄰近於塗佈模組,用以使直接運送自塗佈模組之基板上的光阻劑膜乾燥。According to an embodiment of the invention, a substrate processing apparatus is provided, comprising a coating module and a drying module, wherein the coating module is used to apply a photoresist film onto the substrate and horizontally move the substrate to the transport direction. The drying module is adjacent to the coating module for drying the photoresist film directly on the substrate of the coating module.

根據本發明的實施例,塗佈模組包括一塗佈空氣供應器、一運送單元、一噴嘴,塗佈空氣供應器用以提供空氣至基板,以使基板能漂浮於空氣中,運送單元用以循運送方向水平運送漂浮的基板,噴嘴位於塗佈空氣供應器上方,並循實質上垂直於運送方向的噴嘴方向延伸。光阻劑膜材料將以噴嘴供應至基板。According to an embodiment of the invention, the coating module comprises a coating air supply, a transport unit, a nozzle, and a coating air supply for supplying air to the substrate, so that the substrate can float in the air, and the transport unit is used for The floating substrate is transported horizontally in the direction of transport, the nozzle being located above the coating air supply and extending in a nozzle direction substantially perpendicular to the transport direction. The photoresist film material will be supplied to the substrate as a nozzle.

根據本發明的實施例,塗佈空氣供應器包括一多孔板(perforated plate),有空氣通過的多數個孔洞。此外,塗佈空氣供應器更包括一多孔質薄板(porous plate),有空氣通過的多數個孔隙;一側邊障壁(side barrier),用以圍起此多孔質薄板的側面。According to an embodiment of the invention, the coating air supply comprises a perforated plate with a plurality of holes through which air passes. In addition, the coating air supply further includes a porous plate having a plurality of pores through which air passes, and a side barrier for enclosing the side of the porous sheet.

根據本發明的實施例,運送單元包括多數個真空夾盤(vacuum chuck),利用真空壓力固定在此基板的邊緣部份。尤其,此運送單元運送基板至乾燥模組內部。According to an embodiment of the invention, the transport unit includes a plurality of vacuum chucks that are secured to the edge portions of the substrate by vacuum pressure. In particular, the transport unit transports the substrate to the interior of the drying module.

根據本發明的實施例,運送單元包括多數個滾輪,用以支撐此基板兩側邊緣部份並且沿著運送方向直線排列。According to an embodiment of the invention, the transport unit includes a plurality of rollers for supporting both side edge portions of the substrate and linearly aligned along the transport direction.

根據本發明的實施例,提出一乾燥模組,包括一乾燥室,其包括一接收此基板的乾燥空間;一位於乾燥室內的乾空氣供應器,用以供應空氣至基板,以使基板漂浮於空氣中;一位於乾空氣供應器上方的托架,用以支撐基板於乾燥室中;以及一真空單元,用以供應一真空壓力至乾燥室內部,使基板上的光阻劑膜藉由乾燥室內部的真空而乾燥。According to an embodiment of the invention, a drying module is provided, comprising a drying chamber comprising a drying space for receiving the substrate; a dry air supply in the drying chamber for supplying air to the substrate to float the substrate In the air; a bracket above the dry air supply for supporting the substrate in the drying chamber; and a vacuum unit for supplying a vacuum pressure to the interior of the drying chamber to dry the photoresist film on the substrate The inside of the room is vacuumed and dried.

根據本發明的實施例,乾空氣供應器包括一多孔板,其包括多數個孔洞,用以讓空氣通過;一多孔質薄板,其包括多數個孔隙,用以讓空氣通過;一側邊障壁,用以圍起多孔質薄板的側面。According to an embodiment of the invention, the dry air supply comprises a perforated plate comprising a plurality of holes for passage of air; a porous sheet comprising a plurality of apertures for passage of air; A barrier that encloses the side of the porous sheet.

根據本發明的實施例,乾燥模組更包括一運送單元,用以水平運送漂浮的基板至運送方向。運送單元包括多數個真空夾盤,利用真空壓力固定在基板的邊緣部份。此外,運送單元包括多數個滾輪,用以支撐基板兩側邊緣部份並且沿著運送方向直線排列。According to an embodiment of the invention, the drying module further includes a transport unit for horizontally transporting the floating substrate to the transport direction. The transport unit includes a plurality of vacuum chucks that are secured to the edge portions of the substrate by vacuum pressure. Further, the transport unit includes a plurality of rollers for supporting both side edge portions of the substrate and linearly aligned along the transport direction.

根據本發明的實施例,乾燥室包括一入口與一出口,入口用以使基板沿著運送方向通過進入乾燥室,出口用以使基板沿著運送方向通過離開乾燥室。其中,入口與出口包括一閘閥(gate valve),用以將乾燥室的乾燥空間自外界隔離。According to an embodiment of the invention, the drying chamber includes an inlet for passing the substrate in the conveying direction into the drying chamber, and an outlet for passing the substrate away from the drying chamber in the conveying direction. Wherein, the inlet and the outlet include a gate valve for isolating the drying space of the drying chamber from the outside.

根據本發明的實施例,提出一托架,包括多數個位於乾空氣供應器上方的支撐插腳,支撐插腳可向上及向下移動,當基板被運送進入或離開乾燥室時,可避免被支撐插腳所阻礙。In accordance with an embodiment of the present invention, a bracket is provided that includes a plurality of support pins located above the dry air supply, the support pins being movable up and down to avoid being supported when the substrate is transported into or out of the drying chamber Obstructed.

根據本發明的實施例,處理裝置包括一塗佈模組與一乾燥模組。基板被水平運送,從裝載機經過塗佈模組與乾燥模組至卸載機。尤其,基板是直接自塗佈模組運送到乾燥模組。在塗佈模組與乾燥模組中,塗佈空氣供應器與乾燥空氣供應器分別空氣至基板,以使基板漂浮於空氣中,並也由個別的運送單元循運送方向運送。也就是說,基板在處理裝置中以線性型態(in-line type)進行,減少了製程時間。According to an embodiment of the invention, the processing device comprises a coating module and a drying module. The substrate is transported horizontally from the loader through the coating module and the drying module to the unloader. In particular, the substrate is transported directly from the coating module to the drying module. In the coating module and the drying module, the air supply and the dry air supply are respectively applied to the substrate to float the substrate in the air, and are also transported by the individual transport units in the transport direction. That is to say, the substrate is carried out in an in-line type in the processing apparatus, which reduces the processing time.

此外,處理裝置不需要運送機器人,相較於傳統處理裝置將大幅降低製造與維修成本。In addition, the processing device does not require a robot to be transported, which significantly reduces manufacturing and maintenance costs compared to conventional processing devices.

為了對本發明之上述及其他方面有更佳的瞭解,下文特舉範例性實施例,並配合所附圖式,作詳細說明如下:In order to provide a better understanding of the above and other aspects of the present invention, the following detailed description of the exemplary embodiments,

各種實施例將在以下做更詳細的說明,請參考繪示實施例之附圖。然而,本發明可以眾多不同形式來具體化,並不限定於這裡所說明的例子。相反地,這些實施例使本發明更加徹底與完整,並將其範圍傳達至更純熟的技術領域。在這些圖式中,各層與各區域間的尺寸與相對大小可能會誇張化使其更為清楚。Various embodiments will be described in more detail below, please refer to the accompanying drawings. However, the invention may be embodied in many different forms and is not limited to the examples described herein. On the contrary, the embodiments are intended to be thorough and complete, and the scope thereof In these figures, the size and relative size of the layers and regions may be exaggerated to make them clearer.

當一個元件或層被稱作在另一元件或層之“上(on)”、“連接(connected to)”或“耦接(coupled to)”於另一元件或層,表示此元件或層是直接或間接(有介於兩者之間的元件或層)連結於另一元件或層。相反地,當一元件或層被稱為“直接在上(directly on)”、“直接連接(directly connected to)”或“直接耦接(directly coupled to)”於另一元件或層,表示沒有任何元件或層介於之間。類似的標號係標示於類似的元件上。本文中使用“和/或(and/or)”包含相關元件中任一及所有元件的結合。When an element or layer is referred to as "on," "connected to" or "coupled to" to another element or layer, the element or layer It is directly or indirectly (with elements or layers in between) connected to another element or layer. Conversely, when an element or layer is referred to as "directly on", "directly connected to" or "directly coupled to" to another element or layer, Any component or layer is between. Like numbers are indicated on like elements. As used herein, "and/or" includes a combination of any and all of the elements.

我們也將瞭解到,儘管本說明書中使用第一、第二、第三等詞彙來描述不同的元件(elements)、部件(components)、區域(regions)、層(layers)和/或部分(sections),然而它們不該被這些詞彙所限制,這些詞彙只是用以區別彼此。因此,一個第一元件、部件、區域、層和/或部分可以用一個第二元件、部件、區域、層和/或部分來代替,並不會影響對本發明技術之理解。We will also understand that although the first, second, third, etc. words are used in this specification to describe different elements, components, regions, layers, and/or sections. ), however, they should not be limited by these words, these words are only used to distinguish each other. Thus, a first element, component, region, layer and/or portion may be replaced by a second element, component, region, layer and/or portion, and does not affect the understanding of the present invention.

描述空間關係,像是“在...之下”、“下方”、“在...之上”、“上方”等辭彙,是用來方便我們了解圖式中各元件或特徵之間的關係。我們也利用這些空間關係詞彙來描述圖式中的裝置與不同的操作方向。舉例來說,如果圖式中的裝置翻轉180度,此裝置原本被形容在另一元件或特徵“之下”或“下方”,現在可能會被形容在另一元件或特徵“之上”。因此,典型的“下方”詞彙此時便包含了“上方”與“下方”兩種方位。此裝置也可能轉向其他方位(旋轉90度或其他方位),而這些空間關係詞彙便隨之有不同的解釋。Describe the spatial relationship, such as "under", "below", "above", "above" and other vocabulary, to facilitate us to understand the elements or features in the schema Relationship. We also use these spatial relationship vocabulary to describe the devices in the schema and the different directions of operation. For example, if the device in the drawings is turned over 180 degrees, the device may be described as "under" or "under" another element or feature, and may be described as "above" another element or feature. Therefore, the typical "below" vocabulary now includes both "upper" and "lower" orientations. The device may also turn to other orientations (rotated 90 degrees or other orientations), and these spatially related terms will be interpreted differently.

於本說明書使用的專門用語只為了區別特定實施例而並非侷限本發明。在本文中,除非有清楚地指示,否則單數型態的詞彙像“某一(a or an)”及“該(the)”亦含有多數的意義。需要更進一步了解的是,當本說明書中出現“包括(comprises or comprising)”是為了明確指示表述特徵(stated features)、整體(integers)、步驟(steps)、操作方式(operations)、元件(elements)、及/或成分(components),但並不排除其他特徵、整體、步驟、操作方式、元件、及/或成分存在其中。The specific terms used in the specification are for the purpose of distinguishing the particular embodiments. In this document, singular forms of vocabulary such as "a or an" and "the" also have a meaning of a majority unless clearly indicated. It needs to be further understood that when "comprises or including" appears in this specification, it is intended to clearly indicate the stated features, the integraters, the steps, the operations, the elements. And/or components, but do not exclude other features, integers, steps, modes of operation, components, and/or components.

本說明書中實施例之剖面圖式,是理想化的實施例(與中間結構)。也就是說,與圖式狀態像是製造技術及/或容許範圍有所差異的結果是可能發生的。因此,實施例不該被解讀為限制本發明於特定狀態或區域中,而應包含如製造技術所造成之外型的差異性。舉例來說,某一圖式為矩形的植入區,通常有圓形或弧形的特徵,及/或在邊界有植入濃度梯度,而不是將植入區與非植入區直接區分為兩區塊。同樣地,由植入所形成的埋入區,可能產生一些介於埋入區與植入表面間的植入。因此,圖式中的形狀是出於自然、直觀地繪製,這些形狀並非指示某一區域的真正形狀,也沒有要將本發明範圍侷限。The cross-sectional views of the embodiments of the present specification are idealized embodiments (and intermediate structures). That is, results that are different from the state of the drawing, such as manufacturing techniques and/or tolerances, may occur. Therefore, the examples should not be construed as limiting the invention in the particular state or region, but should include the s For example, a pattern is a rectangular implanted region that typically has a circular or curved feature and/or has an implant concentration gradient at the border instead of directly distinguishing the implanted region from the non-implanted region. Two blocks. Similarly, implants formed by implantation may result in some implantation between the buried region and the implanted surface. Therefore, the shapes in the drawings are drawn naturally and intuitively, and these shapes are not intended to indicate the true shape of an area, nor are they intended to limit the scope of the invention.

除非有其他定義,所有於本發明中提及的詞彙(含技術與科學詞彙)皆與一般常識與先前技術有相同意義。更進一步來說,如一般字典內所定義的詞彙,應該被解釋作符合相關技術背景的意義,且除非本說明書有明確地定義,否則不會將詞彙解釋為理想化或過於正式的意義。Unless otherwise defined, all vocabulary (including technical and scientific terms) referred to in the present invention have the same meaning as common general knowledge and prior art. Furthermore, vocabulary as defined in a general dictionary should be interpreted as conforming to the relevant technical background, and unless the specification is explicitly defined, the vocabulary will not be interpreted as an idealized or overly formal meaning.

以下實施例將詳細說明附加圖式的意義。The following examples will explain the meaning of the additional drawings in detail.

第1圖繪示依據本發明一實施例之基板處理裝置。在下文中,此基板處理裝置將簡稱作處理裝置。FIG. 1 is a diagram showing a substrate processing apparatus according to an embodiment of the present invention. Hereinafter, this substrate processing apparatus will be simply referred to as a processing apparatus.

參照第1圖,處理裝置10與本發明概念之實施例一致,包括塗佈模組100、乾燥模組200、裝載機20、卸載機30。塗佈模組100用以將光阻劑膜塗佈至基板2上,乾燥模組200用以乾燥基板2上之光阻劑膜,裝載機20用以將基板2載入塗佈模組100,卸載機30用以將基板2自乾燥模組200中載出。舉例來說,基板可能包括半導體基板,像是半導體裝置中的晶圓片以及平面顯示面板的玻璃基板。Referring to Fig. 1, the processing apparatus 10 is identical to the embodiment of the present invention and includes a coating module 100, a drying module 200, a loader 20, and an unloader 30. The coating module 100 is used to apply a photoresist film to the substrate 2, the drying module 200 is used to dry the photoresist film on the substrate 2, and the loader 20 is used to load the substrate 2 into the coating module 100. The unloader 30 is used to carry the substrate 2 from the drying module 200. For example, the substrate may include a semiconductor substrate such as a wafer in a semiconductor device and a glass substrate of a flat display panel.

舉例說明,基板2可能在塗佈模組100中經歷塗佈加工,接著自塗佈模組100中直接被運送移動至乾燥模組200,並未使用任何像是運送機器人的額外構件。For example, the substrate 2 may undergo a coating process in the coating module 100, and then directly transported from the coating module 100 to the drying module 200 without using any additional components such as a transport robot.

塗佈模組100將基板2水平移動至運送方向,並供應了光阻劑膜成份於移動中的基板2上,因此在基板2上形成了光阻劑膜。The coating module 100 horizontally moves the substrate 2 to the transport direction and supplies the photoresist film composition on the moving substrate 2, so that a photoresist film is formed on the substrate 2.

第2圖及第3圖繪示依據本發明第1圖中的第一實施例之處理裝置之塗佈模組示意圖。第2圖為第1圖中之處理裝置之塗佈模組的平面示意圖,而第3圖為第1圖中之處理裝置之塗佈模組的剖面示意圖。2 and 3 are schematic views showing a coating module of a processing apparatus according to a first embodiment of the first embodiment of the present invention. Fig. 2 is a plan view schematically showing a coating module of the processing apparatus in Fig. 1, and Fig. 3 is a schematic cross-sectional view showing a coating module of the processing apparatus in Fig. 1.

參照第2圖及第3圖,第一實施例的塗佈模組100包含一塗佈空氣供應器102、一第一運送單元104、一噴嘴106。塗佈空氣供應器102用以供應空氣至基板2,以使基板2能漂浮於空氣中,第一運送單元104用以保持與運送基板2於運送方向,噴嘴106,用以供應光阻劑膜材料至運送中的基板2上。Referring to FIGS. 2 and 3, the coating module 100 of the first embodiment includes a coating air supply 102, a first transport unit 104, and a nozzle 106. The coating air supply 102 is for supplying air to the substrate 2 so that the substrate 2 can float in the air, the first transport unit 104 is for holding and transporting the substrate 2 in the transport direction, and the nozzle 106 is for supplying the photoresist film. The material is placed on the substrate 2 in transit.

噴嘴106位於塗佈空氣供應器102上方,並以實質上垂直於運送方向的噴嘴方向延伸。噴嘴方向與運送方向可定義出一與基板2平行之平面。噴嘴106有一開縫(未標示),光阻劑膜材料藉由開縫供應至基板2。多數個開縫排在噴嘴方向上,當基板2由第一運送單元104循運送方向運送,光阻劑膜材料便提供至基板2上。The nozzle 106 is positioned above the coating air supply 102 and extends in a nozzle direction substantially perpendicular to the direction of transport. The nozzle direction and the transport direction define a plane parallel to the substrate 2. The nozzle 106 has a slit (not shown) to which the photoresist film material is supplied to the substrate 2. A plurality of slits are arranged in the nozzle direction, and when the substrate 2 is transported by the first transport unit 104 in the transport direction, the photoresist film material is supplied onto the substrate 2.

塗佈空氣供應器102包括一多孔板108,多孔板108具有多數個孔洞108a。多孔板108位於噴嘴106之下並連接一空氣源110。舉例來說,多孔板108可連接一空氣分歧管112並界定一緩衝空間112a,再連接空氣源110。因此,孔洞108a便和緩衝空間112a連通,空氣可自空氣源110穿過緩衝空間112a與孔洞108a流至基板2的背面。舉例來說,空氣源110可包含一氣動泵(pneumatic pump)與空氣槽,經由一空氣管110a連接空氣源110。一控制閥(未標示)附於空氣管110a上,用以控制穿過多孔板108的空氣流(air flux)。The coating air supply 102 includes a perforated plate 108 having a plurality of holes 108a. The perforated plate 108 is located below the nozzle 106 and is connected to an air source 110. For example, the perforated plate 108 can be coupled to an air manifold 112 and define a buffer space 112a that is coupled to the air source 110. Therefore, the hole 108a communicates with the buffer space 112a, and air can flow from the air source 110 through the buffer space 112a and the hole 108a to the back surface of the substrate 2. For example, the air source 110 can include a pneumatic pump and an air tank connected to the air source 110 via an air tube 110a. A control valve (not shown) is attached to the air tube 110a for controlling air flux through the perforated plate 108.

多孔板108可包括一金屬,像是鋁。孔洞108a直徑約為0.1mm至2.3mm。相鄰的孔洞108a可藉由一大約10mm 至150mm的間隙距離分開。當孔洞108a直徑大於2.3mm,由於空氣穿過孔洞108a,可能造成接近孔洞108a的基板2溫度改變。基板2的溫度變化會降低在基板2上之光阻劑膜4的一致性,因此第一孔洞142a的直徑要小於2.3mm。The perforated plate 108 can comprise a metal such as aluminum. The hole 108a has a diameter of about 0.1 mm to 2.3 mm. Adjacent holes 108a can be separated by a gap distance of about 10 mm to 150 mm. When the diameter of the hole 108a is larger than 2.3 mm, the temperature of the substrate 2 close to the hole 108a may be changed due to the passage of air through the hole 108a. The temperature change of the substrate 2 reduces the uniformity of the photoresist film 4 on the substrate 2, so the diameter of the first holes 142a is less than 2.3 mm.

第一運送單元104可固定漂浮於空氣中的基板2之邊緣部份,並水平運送基板2於運送方向。多孔板108的寬度小於基板2,因此基板2兩側邊部分不會被多孔板108蓋住。The first transport unit 104 can fix the edge portion of the substrate 2 floating in the air and horizontally transport the substrate 2 in the transport direction. The width of the perforated plate 108 is smaller than that of the substrate 2, so that the side portions of the substrate 2 are not covered by the perforated plate 108.

舉例來說,第一運送單元104可包括多數個真空夾盤114,藉由真空壓力吸附基板2之兩側邊。真空夾盤114被固定在位於多孔板108兩側的一對線性馬達116上,因此真空夾盤114可藉由線性馬達116沿著運送方向被移動。在一改良的例子中,真空夾盤114被一驅動機構(a driving mechanism)移動,驅動機構包括一線性運動導件(a linear motion guide)、一滾珠螺桿(a ball screw)及一球塊(a ball block)。雖然沒有在圖式中表示,第一運送單元可被固定於框架100a上。For example, the first transport unit 104 can include a plurality of vacuum chucks 114 that adsorb the sides of the substrate 2 by vacuum pressure. The vacuum chuck 114 is fixed to a pair of linear motors 116 located on both sides of the perforated plate 108, so that the vacuum chuck 114 can be moved in the conveying direction by the linear motor 116. In a modified example, the vacuum chuck 114 is moved by a driving mechanism that includes a linear motion guide, a ball screw, and a ball block (a ball screw). a ball block). Although not shown in the drawings, the first transport unit may be fixed to the frame 100a.

尤其,第一運送單元104可將基板2自塗佈模組100中運送至乾燥模組200內部。舉例來說,線性馬達116包括二階式線性機構(two-stepped linear mechanism)因此真空夾盤114可循運送方向被移動至乾燥模組200內部。線性馬達116包括一第一線性機構(a first linear mechanism)以及一第二線性機構(a second linear mechanism)。第一線性機構用來在塗佈模組100中的基板2,第二線性機構用來將基板2自塗佈模組100連續移動至乾燥模組200。In particular, the first transport unit 104 can transport the substrate 2 from the coating module 100 to the interior of the drying module 200. For example, the linear motor 116 includes a two-stepped linear mechanism such that the vacuum chuck 114 can be moved into the interior of the drying module 200 in the transport direction. The linear motor 116 includes a first linear mechanism and a second linear mechanism. The first linear mechanism is used for the substrate 2 in the coating module 100, and the second linear mechanism is used to continuously move the substrate 2 from the coating module 100 to the drying module 200.

噴嘴106被固定在位於塗佈空氣供應器102上方的一起重架100b上,且噴嘴106循噴嘴方向延伸。起重架100b可相對於框架100a做水平方向移動。尤其,起重架100b包括一起重架臂100c,起重架臂100c位於塗佈氣體供應器102上方並循噴嘴方向延伸,而噴嘴106被固定於起重架臂100c上一較低處。因此,當起重架100b之起重架臂100c沿著運送方向被移動,噴嘴106亦隨之移動。起重架臂100c和噴嘴106可藉由一馬達與一滾珠螺桿朝運送方向移動。The nozzle 106 is fixed to the cohesion 100b above the coating air supply 102, and the nozzle 106 extends in the nozzle direction. The gantry 100b is horizontally movable with respect to the frame 100a. In particular, the gantry 100b includes a retracting arm 100c that is positioned above the coating gas supply 102 and extends in the direction of the nozzle, while the nozzle 106 is secured to a lower portion of the gantry arm 100c. Therefore, when the hoisting arm 100c of the hoisting frame 100b is moved in the conveying direction, the nozzle 106 is also moved. The gantry arm 100c and the nozzle 106 are movable in a transport direction by a motor and a ball screw.

可進一步設置一清潔單元(未標示)於塗佈空氣供應器106上方,用以清潔噴嘴106。起重架106b可循水平或垂直方向移動噴嘴106以達清潔目的。A cleaning unit (not labeled) may be further disposed over the coating air supply 106 for cleaning the nozzles 106. The gantry 106b can move the nozzle 106 in a horizontal or vertical direction for cleaning purposes.

光阻劑膜材料通過噴嘴106噴灑至基板2,塗佈空氣供應器102使基板2漂浮於空氣並由第一運送單元104循運送方向運送基板2。The photoresist film material is sprayed to the substrate 2 through the nozzle 106, and the coating air supplier 102 floats the substrate 2 to the air and transports the substrate 2 by the first transport unit 104 in the transport direction.

第4圖繪示本發明第2圖及第3圖中的第一修改實施例之塗佈空氣供應器之剖面圖。Fig. 4 is a cross-sectional view showing a coating air supply device according to a first modified embodiment of Figs. 2 and 3 of the present invention.

參照第4圖,第一修改塗佈空氣供應器120包括一多孔質薄板122及一圍起多孔質薄板122的側邊障壁124,多孔質薄板122包括一孔隙材料。因此,藉由側邊障壁124可防止空氣自多孔質薄板122側面滲漏。Referring to Fig. 4, the first modified coating air supply 120 includes a porous sheet 122 and a side barrier 124 surrounding the porous sheet 122. The porous sheet 122 includes a porous material. Therefore, air is prevented from leaking from the side of the porous thin plate 122 by the side barrier 124.

多孔質薄板122由碳及不鏽鋼組成,並經燒結程序形成。多孔質薄板122包括多數個直徑10μm至100μm的細孔。The porous sheet 122 is composed of carbon and stainless steel and is formed by a sintering process. The porous thin plate 122 includes a plurality of fine pores having a diameter of 10 μm to 100 μm.

多孔質薄板122藉由空氣分歧管112連接至空氣源110。空氣分歧管112與空氣源110有相同的結構,如第2圖及第3圖所示,因此關於空氣分歧管112與空氣源110更細節的描述將被省略。The porous sheet 122 is connected to the air source 110 by an air manifold 112. The air manifold 112 has the same structure as the air source 110, as shown in Figs. 2 and 3, so a more detailed description of the air manifold 112 and the air source 110 will be omitted.

第5圖繪示本發明第2圖及第3圖中的第二修改實施例之塗佈空氣供應器之剖面圖。Fig. 5 is a cross-sectional view showing a coating air supply device according to a second modified embodiment of Figs. 2 and 3 of the present invention.

參照第5圖,第二修改塗佈空氣供應器130包括一多孔板132,多孔板132有多數個孔洞132a使空氣得以穿過,用以供應空氣至基板2。多孔板132包括多數個開縫134,每個開縫中皆有一惰輪(idle roller)置於其中。惰輪136可支撐基板2以防止基板2偏離。此外,一置於開縫134中的運送輪可藉由一額外驅動機構所驅動,因此基板2也可藉由運送輪循運送方向運送,如同我們所知的先前技術。Referring to Fig. 5, the second modified coating air supply 130 includes a perforated plate 132 having a plurality of holes 132a for allowing air to pass therethrough for supplying air to the substrate 2. The perforated plate 132 includes a plurality of slits 134, each having an idle roller disposed therein. The idler 136 can support the substrate 2 to prevent the substrate 2 from being deflected. In addition, a transport wheel placed in the slit 134 can be driven by an additional drive mechanism so that the substrate 2 can also be transported by transport in a round-robin transport direction, as is known in the prior art.

多孔板132也可以第4圖中,位於第二修改空氣供應器130中的多孔質薄板122代替。在這個實例中,一內側障壁更能防止空氣自開縫134之內測側面滲漏。也可設置一外側障壁包圍多孔質薄板122側面,用以防止空氣自多孔質薄板122的孔隙滲漏。The perforated plate 132 can also be replaced by a porous sheet 122 located in the second modified air supply 130 in FIG. In this example, an inner barrier prevents leakage of air from the inner side of the slit 134. An outer barrier may also be provided to surround the side of the porous sheet 122 to prevent air from leaking from the pores of the porous sheet 122.

第6圖及第7圖繪示本發明第2圖及第3圖中的塗佈空氣供應器之第三修改實施例。第6圖為塗佈空氣供應器之第三修改實施例的平面示意圖,而第7圖為塗佈空氣供應器之第三修改實施例的剖面示意圖。Fig. 6 and Fig. 7 show a third modified embodiment of the coating air supply in Figs. 2 and 3 of the present invention. Fig. 6 is a plan view schematically showing a third modified embodiment of the coating air supply, and Fig. 7 is a schematic sectional view showing a third modified embodiment of the coating air supply.

參照第6圖與第7圖,第三修改塗佈空氣供應器140包括一多孔板142,多孔板142有多數個第一孔洞142a與第二孔洞142b。第一孔洞142a使空氣得以穿過,用以供應空氣至基板2,第二孔洞142b使空氣得以穿過,使空氣自介於基板2與多孔板142間的空隙區域排放。Referring to Figures 6 and 7, the third modified coating air supply 140 includes a perforated plate 142 having a plurality of first and second holes 142a, 142b. The first hole 142a allows air to pass through to supply air to the substrate 2, and the second hole 142b allows air to pass therethrough to discharge air from a gap region between the substrate 2 and the perforated plate 142.

多孔板142的第一孔洞142a連接一空氣源144。舉例來說,多孔板142可連接一空氣分歧管146並界定一緩衝空間146a,空氣分歧管146再藉由一空氣管144a連接空氣源144。空氣源144可包含一氣動泵(pneumatic pump)、一空氣槽與一第一控制閥,以控制穿過多孔板142之第一孔洞142a的空氣流(air flux)。The first aperture 142a of the perforated plate 142 is coupled to an air source 144. For example, the perforated plate 142 can be coupled to an air manifold 146 and define a buffer space 146a that is coupled to the air source 144 by an air tube 144a. The air source 144 can include a pneumatic pump, an air slot, and a first control valve to control air flow through the first aperture 142a of the perforated plate 142.

多孔板142可包括一金屬,像是鋁。第一孔洞142a直徑約為0.1mm至2.3mm。若第一孔洞142a直徑大於2.3mm,由於空氣穿過第一孔洞142a,可能造成接近孔洞142a的基板2溫度改變。基板2的溫度變化會降低在基板2上之光阻劑膜4的一致性,因此第一孔洞142a的直徑要小於2.3mm。The perforated plate 142 may comprise a metal such as aluminum. The first hole 142a has a diameter of about 0.1 mm to 2.3 mm. If the first hole 142a has a diameter greater than 2.3 mm, the temperature of the substrate 2 near the hole 142a may be changed due to the passage of air through the first hole 142a. The temperature change of the substrate 2 reduces the uniformity of the photoresist film 4 on the substrate 2, so the diameter of the first holes 142a is less than 2.3 mm.

第二孔洞142b可連接一排氣分歧管148,因此介於基板2與多孔板142間之空隙區域的空氣可排放至排氣分歧管148。排氣分歧管148以排氣管149a連接排氣單元149。一第二控制閥(未標示)設置於排氣管149a上,用以控制排放空氣流(exhaustion air flux)。透過第二孔洞142b的空氣排放可增加基板2的運送可信度(transfer reliability)。The second hole 142b can be connected to an exhaust manifold 148, so that air interposed between the gap between the substrate 2 and the perforated plate 142 can be discharged to the exhaust manifold 148. The exhaust manifold 148 is connected to the exhaust unit 149 by an exhaust pipe 149a. A second control valve (not shown) is disposed on the exhaust pipe 149a for controlling the exhaust air flux. The air discharge through the second holes 142b can increase the transfer reliability of the substrate 2.

第8圖及第9圖繪示本發明第2圖及第3圖中的塗佈空氣供應器之第四修改實施例。第8圖為塗佈空氣供應器之第四修改實施例的平面示意圖,而第9圖為塗佈空氣供應器之第四修改實施例的剖面示意圖。Fig. 8 and Fig. 9 show a fourth modified embodiment of the coating air supply in Figs. 2 and 3 of the present invention. Fig. 8 is a plan view schematically showing a fourth modified embodiment of the coating air supply, and Fig. 9 is a schematic sectional view showing a fourth modified embodiment of the coating air supply.

參照第8圖與第9圖,第四修改塗佈空氣供應器150包括一多孔質薄板151及圍起多孔質薄板151的多數個側邊障壁152,多孔質薄板151包括一孔隙材料。因此,藉由側邊障壁152可防止空氣自多孔質薄板151之側面滲漏。Referring to Figures 8 and 9, the fourth modified coating air supply 150 includes a porous sheet 151 and a plurality of side barriers 152 enclosing the porous sheet 151. The porous sheet 151 includes a porous material. Therefore, air is prevented from leaking from the side of the porous sheet 151 by the side barrier 152.

多孔質薄板151可由碳及不鏽鋼組成,並經燒結程序形成。多孔質薄板151包括多數個直徑10μm至100μm的細孔。The porous sheet 151 may be composed of carbon and stainless steel and formed by a sintering process. The porous sheet 151 includes a plurality of fine pores having a diameter of 10 μm to 100 μm.

多孔質薄板151可連接一空氣分歧管156並界定一緩衝空間156a,空氣分歧管156再以一空氣管154a連接空氣源154。The porous sheet 151 can be connected to an air branch pipe 156 and define a buffer space 156a. The air branch pipe 156 is connected to the air source 154 by an air pipe 154a.

此外,多孔質薄板151包括多數個排氣孔洞151a,因此介於基板2與多孔質薄板151間之空隙區域的空氣可透過排氣孔洞151a排放。排氣孔洞151a連接排氣分歧管158,而排氣分歧管158以排氣管159a連接排氣單元159。透過排氣孔洞151a排放空氣可增加基板2的運送可信度(transfer reliability)。Further, the porous thin plate 151 includes a plurality of exhaust holes 151a, so that air interposed between the gaps between the substrate 2 and the porous thin plate 151 can be discharged through the exhaust holes 151a. The exhaust hole 151a is connected to the exhaust manifold 158, and the exhaust manifold 158 is connected to the exhaust unit 159 by the exhaust pipe 159a. Discharging air through the exhaust holes 151a increases the transfer reliability of the substrate 2.

第10圖及第11圖繪示依據本發明第1圖中處理裝置的塗佈模組之第二修改實施例。第10圖為第1圖中處理裝置之塗佈模組的平面示意圖,而第11圖為第1圖中處理裝置之塗佈模組的剖面示意圖。10 and 11 illustrate a second modified embodiment of the coating module of the processing apparatus according to Fig. 1 of the present invention. Fig. 10 is a plan view schematically showing a coating module of the processing apparatus in Fig. 1, and Fig. 11 is a schematic cross-sectional view showing a coating module of the processing apparatus in Fig. 1.

參照第10圖與第11圖,第二實施例的塗佈模組300包括一塗佈空氣供應器302、一運送單元304、一噴嘴306。塗佈空氣供應器302用以供應空氣至基板2,使基板2漂浮於空氣中,運送單元304用以固定與運送漂浮的基板2於運送方向中,噴嘴306用以供應光阻劑膜材料於運送中的基板2上。Referring to FIGS. 10 and 11, the coating module 300 of the second embodiment includes a coating air supply 302, a transport unit 304, and a nozzle 306. The coating air supply 302 is used to supply air to the substrate 2 to float the substrate 2 in the air, the transport unit 304 is used to fix and transport the floating substrate 2 in the transport direction, and the nozzle 306 is used to supply the photoresist film material. On the substrate 2 in transit.

參照第2圖至第10圖,塗佈空氣供應器302皆擁有相同的結構與外型,因此關於塗佈空氣供應器302更細節的描述將被省略。尤其,運送方向與噴嘴方向直接與第2圖及第3圖相同。Referring to Figures 2 through 10, the coating air supply 302 has the same structure and appearance, so a more detailed description of the coating air supply 302 will be omitted. In particular, the transport direction and the nozzle direction are directly the same as in FIGS. 2 and 3 .

噴嘴306被固定在位於塗佈空氣供應器302上方的一起重架300b上並循噴嘴方向延伸,起重架300b可相對於框架300a做水平方向移動。尤其,起重架300b包括一起重架臂300c,起重架臂300c位於塗佈氣體供應器302上方並循噴嘴方向延伸,而噴嘴306被固定於起重架臂300c上一較低處。因此,當起重架300b之起重架臂300c沿著運送方向被移動,噴嘴306亦隨之移動。起重架臂300c與噴嘴106可藉由一馬達與一滾珠螺桿朝運送方向移動。The nozzle 306 is fixed to the re-frame 300b above the coating air supply 302 and extends in the nozzle direction, and the gantry 300b is horizontally movable with respect to the frame 300a. In particular, the gantry 300b includes a retracting arm 300c that is positioned above the coating gas supply 302 and extends in the direction of the nozzle, while the nozzle 306 is secured to a lower portion of the gantry arm 300c. Therefore, when the gantry arm 300c of the gantry 300b is moved in the conveying direction, the nozzle 306 also moves. The gantry arm 300c and the nozzle 106 are movable in a transport direction by a motor and a ball screw.

一清潔單元(未標示)可進一步設置於塗佈空氣供應器306上方,用以清潔噴嘴306。起重架306b可循水平或垂直方向移動噴嘴306以達清潔目的。A cleaning unit (not shown) may be further disposed over the coating air supply 306 for cleaning the nozzle 306. The gantry 306b can move the nozzle 306 in a horizontal or vertical direction for cleaning purposes.

光阻劑膜材料通過噴嘴306噴灑至基板2,塗佈空氣供應器302使基板2漂浮於空氣中,並以一運送單元304循運送方向運送基板2。The photoresist film material is sprayed to the substrate 2 through the nozzle 306, and the coating air supply 302 floats the substrate 2 in the air, and transports the substrate 2 in a transport direction by a transport unit 304.

舉例來說,運送單元304包括多數個與基板2有部份接觸的滾輪312,滾輪312沿運送方向直線排列。滾輪312可與基板2之下表面邊緣部份接觸,因此基板2可隨滾輪312的滾動而運送。For example, the transport unit 304 includes a plurality of rollers 312 that are in partial contact with the substrate 2, and the rollers 312 are linearly aligned in the transport direction. The roller 312 can be in contact with the lower surface edge portion of the substrate 2, so that the substrate 2 can be carried with the rolling of the roller 312.

滾輪312被設置在一框架300a上,並以一驅動馬達314旋轉。滾輪312可藉一皮帶316彼此串接,且沿運送方向形成一滾子鏈(roller chain)。舉例來說,多數個皮帶輪(belt pulleys)318相鄰於滾輪312並與皮帶316接觸。尤其,一惰輪319彼此相鄰且被放置於滾輪312間,用以控制皮帶316的張力。在預設的實施例中,一對滾子鏈被設置於基板2的兩側邊。The roller 312 is disposed on a frame 300a and rotated by a drive motor 314. The rollers 312 may be coupled to each other by a belt 316 and form a roller chain in the conveying direction. For example, a plurality of belt pulleys 318 are adjacent to the rollers 312 and are in contact with the belt 316. In particular, an idler pulley 319 is adjacent to each other and placed between the rollers 312 for controlling the tension of the belt 316. In a preset embodiment, a pair of roller chains are disposed on both sides of the substrate 2.

儘管本實施例僅揭露位於基板兩側邊的一對驅動馬達314,但如同我們所知的先前技術,單一馬達也能用於驅動滾子鏈。舉例來說,驅動馬達的一旋轉軸可與通過塗佈空氣供應器302的兩滾子鏈連接。Although this embodiment only discloses a pair of drive motors 314 located on either side of the substrate, a single motor can be used to drive the roller chain, as is known in the prior art. For example, a rotating shaft of the drive motor can be coupled to the two roller chains that pass through the coating air supply 302.

再次參照第1圖,基板2上的光阻劑膜4可於乾燥模組200中乾燥。Referring again to FIG. 1, the photoresist film 4 on the substrate 2 can be dried in the drying module 200.

一乾燥程序於乾燥模組200中進行,用以乾燥光阻劑膜4。光阻劑膜中的溶劑在乾燥模組200中進行乾燥程序時被乾燥。舉例來說,光阻劑膜4可利用真空壓使其於乾燥程序中被乾燥。A drying process is performed in the drying module 200 to dry the photoresist film 4. The solvent in the photoresist film is dried while the drying process is performed in the drying module 200. For example, the photoresist film 4 can be dried in a drying process by vacuum pressing.

第12圖及第13圖繪示本發明第1圖中的處理裝置之第二實施例之乾燥模組之示意圖。第12圖為第1圖中處理裝置之乾燥模組的平面示意圖,而第13圖為第1圖中處理裝置之乾燥模組的剖面示意圖。12 and 13 are schematic views showing a drying module of a second embodiment of the processing apparatus in the first embodiment of the present invention. Figure 12 is a plan view of the drying module of the processing apparatus of Figure 1, and Figure 13 is a schematic cross-sectional view of the drying module of the processing apparatus of Figure 1.

參照第12圖及第13圖,第一實施例的乾燥模組200包括一乾燥室202、位於乾燥室202內的一乾空氣供應器204、位於乾空氣供應器204上方的一托架206、連接於乾燥室202的一真空單元208、一第二運送單元210。基板2上的光阻劑膜4於乾燥室202中被乾燥,乾空氣供應器204用以供應空氣至基板2,使基板2漂浮於空氣中,托架206用以支撐基板2,真空單元208用以乾燥基板2上的光阻劑膜4,第二運送單元210用以將完成乾燥後的基板2運送離開乾燥模組200。基板2藉第二運送單元由塗佈模組100運送至乾燥模組200,並且循同一方向運送離開乾燥模組200。Referring to Figures 12 and 13, the drying module 200 of the first embodiment includes a drying chamber 202, a dry air supply 204 located in the drying chamber 202, a bracket 206 above the dry air supply 204, and a connection. A vacuum unit 208 and a second transport unit 210 in the drying chamber 202. The photoresist film 4 on the substrate 2 is dried in the drying chamber 202, the dry air supply 204 is used to supply air to the substrate 2, the substrate 2 is floated in the air, the carrier 206 is used to support the substrate 2, and the vacuum unit 208 The photoresist film 4 is dried on the substrate 2, and the second transport unit 210 is used to transport the dried substrate 2 away from the drying module 200. The substrate 2 is transported by the coating module 100 to the drying module 200 by the second transport unit, and is transported away from the drying module 200 in the same direction.

乾燥室202內有一乾燥空間,而基板2上的光阻劑膜4於乾燥空間內乾燥。乾燥室202包括一入口202a與一出口202b彼此相對。具有光阻劑膜4的基板2通過入口202a被運送進入乾燥室202,並沿著同樣的運送方向通過出口202b被運送離開乾燥室202。也就是說,入口202a與出口202b沿著運送方向排列於同一直線上。當入口202a位於乾燥室202之一第一邊部分,出口202b即位於乾燥室202之一第二邊部分,第二邊部分與第一邊部分位置相對。入口202a與出口202b具有足夠讓基板2通過的寬度且垂直於運送方向(噴嘴方向)。也就是說,入口202a與出口202b的寬度大於基板2的寬度。此外,當塗佈模組100之第一運送單元104運送基板2進入乾燥模組200內部時,入口202a與出口202b提供一足夠的空間操作第一運送單元104。The drying chamber 202 has a dry space therein, and the photoresist film 4 on the substrate 2 is dried in a dry space. The drying chamber 202 includes an inlet 202a and an outlet 202b opposite each other. The substrate 2 having the photoresist film 4 is transported into the drying chamber 202 through the inlet 202a and transported away from the drying chamber 202 through the outlet 202b in the same transport direction. That is, the inlet 202a and the outlet 202b are arranged on the same straight line in the conveying direction. When the inlet 202a is located at a first side portion of the drying chamber 202, the outlet 202b is located at a second side portion of the drying chamber 202, and the second side portion is positioned opposite the first side portion. The inlet 202a and the outlet 202b have a width sufficient for the substrate 2 to pass and perpendicular to the conveying direction (nozzle direction). That is, the width of the inlet 202a and the outlet 202b is larger than the width of the substrate 2. In addition, when the first transport unit 104 of the coating module 100 transports the substrate 2 into the interior of the drying module 200, the inlet 202a and the outlet 202b provide a sufficient space to operate the first transport unit 104.

一真空壓力被應用於乾燥室202內,使基板2上的光阻劑膜4被乾燥,因此當基板2被送至乾燥室202中,乾燥室202便關閉。也就是說,入口202a與出口202b關閉,如此乾燥空間便與外界隔離。為此,入口202a與出口202b可有一滑門構件,像是一閘閥。入口202a與出口202b可循一基準點(base point)半旋轉(semi-rotation),以進行關閉或開啟。A vacuum pressure is applied to the drying chamber 202 to cause the photoresist film 4 on the substrate 2 to be dried, so that when the substrate 2 is sent to the drying chamber 202, the drying chamber 202 is closed. That is to say, the inlet 202a and the outlet 202b are closed, so that the dry space is isolated from the outside. To this end, the inlet 202a and the outlet 202b can have a sliding door member, such as a gate valve. The inlet 202a and the outlet 202b can be semi-rotated at a base point for closing or opening.

乾燥室202包括一下部,像是擁有多數個底部孔洞202c的一底板(a bottom panel),底板透過一下分歧管212連接一真空單元208,特別是底部孔洞202c透過下分歧管212連接至真空單元208。舉例來說,真空單元208包括一真空幫浦(未標示)與一控制閥(未標示),用以控制乾燥室202內的內部壓力。The drying chamber 202 includes a lower portion, such as a bottom panel having a plurality of bottom holes 202c. The bottom plate is connected to a vacuum unit 208 through a branch pipe 212. In particular, the bottom hole 202c is connected to the vacuum unit through the lower branch pipe 212. 208. For example, vacuum unit 208 includes a vacuum pump (not labeled) and a control valve (not labeled) for controlling internal pressure within drying chamber 202.

乾燥室202更可包括一上部,像是擁有多數頂部孔洞202d的一頂板(a top panel),頂板透過一上分歧管214連接一真空單元208,特別是頂部孔洞202d透過上分歧管214連接至真空單元208。當乾燥室202的內部壓力由於真空壓力僅應用於乾燥室202下部而變得不一致,真空壓力也會應用於乾燥室202上部,用以增加乾燥室202內部壓力的一致性。此外,有一附加多孔質薄板215在乾燥室202中被設置於基板2上方。The drying chamber 202 may further include an upper portion, such as a top panel having a plurality of top holes 202d. The top plate is connected to a vacuum unit 208 through an upper branch pipe 214. In particular, the top hole 202d is connected to the upper branch pipe 214 through the upper branch pipe 214. Vacuum unit 208. When the internal pressure of the drying chamber 202 becomes inconsistent due to the vacuum pressure applied only to the lower portion of the drying chamber 202, the vacuum pressure is also applied to the upper portion of the drying chamber 202 to increase the consistency of the internal pressure of the drying chamber 202. Further, an additional porous sheet 215 is disposed above the substrate 2 in the drying chamber 202.

乾燥空氣供應器204包括一具有多數個孔洞216a的多孔板216。舉例來說,多孔板216可連接一空氣分歧管218並界定一緩衝空間218a,再連接空氣源220。Dry air supply 204 includes a perforated plate 216 having a plurality of holes 216a. For example, the perforated plate 216 can be coupled to an air manifold 218 and define a buffer space 218a that is coupled to the air source 220.

多孔板216可包括一金屬,像是鋁。孔洞216a直徑約為0.1mm至2.3mm。相鄰的孔洞216a可藉由一大約10mm至150mm的間隙距離分開。The perforated plate 216 can comprise a metal such as aluminum. The hole 216a has a diameter of about 0.1 mm to 2.3 mm. Adjacent holes 216a can be separated by a gap distance of about 10 mm to 150 mm.

當乾燥程序於乾燥室202中進行時,托架206支撐基板2,使基板2位於乾空氣供應器204上方。一旦塗佈了光阻劑膜4的基板2被運送至乾燥室202內部,入口202a及出口202b便會關閉,且乾空氣供應器204所供應的空氣停止供應,於是乾燥室202中的乾燥空間便與外界隔離並形成真空。在此例中,基板2由托架206所支撐,也就是說,塗佈了光阻劑膜4的基板2穩定地置於托架206之 上,且光阻劑膜4的乾燥程序便在此真空氛圍下於乾燥室202內進行。When the drying process is performed in the drying chamber 202, the cradle 206 supports the substrate 2 such that the substrate 2 is positioned above the dry air supply 204. Once the substrate 2 coated with the photoresist film 4 is transported to the inside of the drying chamber 202, the inlet 202a and the outlet 202b are closed, and the air supplied from the dry air supply 204 is stopped, so that the drying space in the drying chamber 202 is dried. It is isolated from the outside world and forms a vacuum. In this example, the substrate 2 is supported by the cradle 206, that is, the substrate 2 coated with the photoresist film 4 is stably placed in the cradle 206. The drying process of the photoresist film 4 is carried out in the drying chamber 202 under the vacuum atmosphere.

舉例來說,托架206包含多數個支撐插腳,支撐插腳位於乾空氣供應器204上方。支撐插腳均勻地排列於乾空氣供應器上方,用以防止基板2產生缺陷。尤其,支撐插腳可向上及向下移動,當基板2被運送進入或離開乾燥室202時,可避免基板2被支撐插腳所阻礙。因此,當基板2被運送進入或離開乾燥室202時,支撐插腳向下移動而基板2被承載進入乾燥室202中,不會受到支撐插腳的任何阻礙。當乾燥程序在真空壓力下開始進行時,支撐插腳向上移動用以支撐基板2。For example, the bracket 206 includes a plurality of support pins that are positioned above the dry air supply 204. The support pins are evenly arranged above the dry air supply to prevent the substrate 2 from being defective. In particular, the support pins can be moved up and down, and when the substrate 2 is transported into or out of the drying chamber 202, the substrate 2 can be prevented from being obstructed by the support pins. Thus, as the substrate 2 is transported into or out of the drying chamber 202, the support pins move downward and the substrate 2 is carried into the drying chamber 202 without any obstruction by the support pins. When the drying process starts under vacuum pressure, the support pins are moved upward to support the substrate 2.

舉例來說,第二運送單元210固定漂浮於空氣中的基板2之邊緣部份,並將基板2沿著運送方向水平運送。多孔板216的寬度小於基板2,基板2的兩側邊部分不會被多孔板216蓋住。因此,第二運送單元210可用以固定基板2的側向邊緣部份。For example, the second transport unit 210 fixes the edge portion of the substrate 2 floating in the air and horizontally transports the substrate 2 in the transport direction. The width of the perforated plate 216 is smaller than that of the substrate 2, and the both side portions of the substrate 2 are not covered by the perforated plate 216. Therefore, the second transport unit 210 can be used to fix the lateral edge portion of the substrate 2.

舉例來說,第二運送單元210可包括多數個真空夾盤222,真空夾盤222藉由真空壓力吸附基板2之兩側邊。真空夾盤222被固定在位於多孔板216兩側的一對線性馬達224上,因此真空夾盤222藉由線性馬達224沿著運送方向被移動。在一改良的例子中,真空夾盤222可被一驅動機構(a driving mechanism)所移動,驅動機構包括一線性運動導件(a linear motion guide)、一滾珠螺桿(a ball screw)及一球塊(a ball block)。雖然沒有在圖式中表示,但第二運送單元可被固定於框架200a。For example, the second transport unit 210 may include a plurality of vacuum chucks 222 that adsorb both sides of the substrate 2 by vacuum pressure. The vacuum chuck 222 is fixed to a pair of linear motors 224 located on both sides of the perforated plate 216, so that the vacuum chuck 222 is moved in the transport direction by the linear motor 224. In a modified example, the vacuum chuck 222 can be moved by a driving mechanism including a linear motion guide, a ball screw, and a ball. A ball block. Although not shown in the drawings, the second transport unit may be fixed to the frame 200a.

第14圖繪示本發明第12圖及第13圖中的乾空氣供應器之一修改實施例之剖面圖。Figure 14 is a cross-sectional view showing a modified embodiment of a dry air supplier in Figures 12 and 13 of the present invention.

參照第14圖,修改乾空氣供應器230包括一多孔質薄板232及圍起多孔質薄板232的多數個側邊障壁234,此多孔質薄板232包括一孔隙材料。因此,藉由側邊障壁234可防止空氣自多孔質薄板232側面滲漏。Referring to Fig. 14, the modified dry air supply 230 includes a porous sheet 232 and a plurality of side barriers 234 enclosing the porous sheet 232. The porous sheet 232 includes a porous material. Therefore, air is prevented from leaking from the side of the porous sheet 232 by the side barrier 234.

多孔質薄板232可由碳及不鏽鋼組成,並經燒結程序形成。多孔質薄板232包括多數個直徑10μm至100μm的細孔。The porous sheet 232 may be composed of carbon and stainless steel and formed by a sintering process. The porous sheet 232 includes a plurality of fine pores having a diameter of 10 μm to 100 μm.

乾燥模組200中的乾空氣空供應器204,可用第二至第四修改塗佈空氣供應器130、140與150代替,細部描述參考第5圖至第9圖,如同我們所知的先前技術。The dry air supply 204 in the drying module 200 can be replaced with the second to fourth modified coating air supplies 130, 140 and 150, the details of which are described with reference to Figures 5 to 9, as is known prior art. .

第15圖及第16圖繪示本發明第1圖中的處理裝置之第二實施例之乾燥模組示意圖。第15圖為第1圖中處理裝置之乾燥模組的平面示意圖,而第16圖為第1圖中處理裝置之乾燥模組的剖面示意圖。15 and 16 are schematic views showing a drying module of a second embodiment of the processing apparatus in the first embodiment of the present invention. Figure 15 is a plan view of the drying module of the processing apparatus of Figure 1, and Figure 16 is a schematic cross-sectional view of the drying module of the processing apparatus of Figure 1.

參照第15圖及第16圖,第二實施例的乾燥模組400包括一乾燥室402、位於乾燥室402內的一乾空氣供應器404、位於乾空氣供應器404上方的一托架406、連接於乾燥室402的一真空單元408、一第二運送單元410。基板2上的光阻劑膜4於乾燥室402中乾燥,一乾空氣供應器404用以供應空氣至基板2,使基板2漂浮於空氣中,托架406用以支撐基板2,真空單元408用以乾燥基板2上的光阻劑膜4,第二運送單元410用以將完成乾燥後的基板2運送離開乾燥模組400。第二運送單元410將基板2自塗佈 模組100運送至乾燥模組400,並且循同一方向將基板2運送離開乾燥模組400。Referring to Figures 15 and 16, the drying module 400 of the second embodiment includes a drying chamber 402, a dry air supply 404 located in the drying chamber 402, a bracket 406 above the dry air supply 404, and a connection. A vacuum unit 408 and a second transport unit 410 in the drying chamber 402. The photoresist film 4 on the substrate 2 is dried in the drying chamber 402. A dry air supply 404 is used to supply air to the substrate 2, and the substrate 2 is floated in the air. The carrier 406 is used to support the substrate 2, and the vacuum unit 408 is used. The photoresist film 4 on the substrate 2 is dried, and the second transport unit 410 is used to transport the dried substrate 2 away from the drying module 400. The second transport unit 410 self-coats the substrate 2 The module 100 is transported to the drying module 400 and transports the substrate 2 away from the drying module 400 in the same direction.

乾燥室402內有一乾燥空間,基板2上的光阻劑膜4於乾燥空間內乾燥。乾燥室402包括一入口402a與一出口402b,入口402a與出口402b彼此相對。具有光阻劑膜4的基板2通過入口402a後,被運送進入乾燥室402,並沿著同樣的運送方向通過出口402b,被運送離開乾燥室402。本實施例中的乾燥室402與第12圖及第13圖中的乾燥室202具有相同的結構,因此關於乾燥室402的細節描述將省略。The drying chamber 402 has a dry space therein, and the photoresist film 4 on the substrate 2 is dried in a dry space. The drying chamber 402 includes an inlet 402a and an outlet 402b, and the inlet 402a and the outlet 402b are opposed to each other. The substrate 2 having the photoresist film 4 passes through the inlet 402a, is transported into the drying chamber 402, and is transported away from the drying chamber 402 through the outlet 402b in the same conveying direction. The drying chamber 402 in this embodiment has the same structure as the drying chamber 202 in FIGS. 12 and 13 , and thus a detailed description about the drying chamber 402 will be omitted.

乾空氣供應器404供應空氣至基板2,使基板2可漂浮於空氣中。一乾空氣供應器430連此接乾空氣供應器404。第12圖至第14圖中,乾空氣供應器204與修改乾空氣供應器230也適用於乾燥模組之第二實施例,如乾空氣供應器404一般。此外,乾燥模組400中的乾空氣空供應器404,可用第二至第四修改塗佈空氣供應器130、140與150代替,因此關於乾空氣供應器404的細節描述將省略。The dry air supply 404 supplies air to the substrate 2 so that the substrate 2 can float in the air. A dry air supply 430 is connected to the dry air supply 404. In Figures 12 through 14, the dry air supply 204 and the modified dry air supply 230 are also suitable for use in a second embodiment of a drying module, such as dry air supply 404. Further, the dry air air supply 404 in the drying module 400 may be replaced with the second to fourth modified coating air supplies 130, 140 and 150, and thus a detailed description about the dry air supplier 404 will be omitted.

當乾燥室402中進行乾燥程序時,托架406支撐基板2,使基板2位於乾空氣供應器404上方。托架406與第12圖中乾燥模組200之起重架206有相同的結構,因此關於乾燥室402的細節描述將省略。When the drying process is performed in the drying chamber 402, the carrier 406 supports the substrate 2 such that the substrate 2 is positioned above the dry air supply 404. The bracket 406 has the same structure as the gantry 206 of the drying module 200 in Fig. 12, and thus a detailed description about the drying chamber 402 will be omitted.

第二運送單元410包括多數個與基板2部份接觸的滾輪422,且滾輪422沿運送方向直線排列。舉例來說,滾輪422可與基板2之下表面邊緣部份接觸,使基板2可隨 滾輪422的滾動而運送。The second transport unit 410 includes a plurality of rollers 422 that are in partial contact with the substrate 2, and the rollers 422 are linearly arranged in the transport direction. For example, the roller 422 can be in contact with the edge portion of the lower surface of the substrate 2, so that the substrate 2 can follow The roller 422 is rolled and transported.

滾輪422被設置於乾燥室402的一側壁上,並藉一驅動馬達424旋轉。滾輪422可藉一皮帶426彼此串接,且沿運送方向形成一滾子鏈(a roller chain)。舉例來說,多數個皮帶輪(belt pulleys)428相鄰於滾輪422並與皮帶426接觸。尤其,一惰輪429彼此相鄰且被設置於滾輪422間,用以控制皮帶426的張力。在預設的實施例中,一對滾子鏈被設置於基板2的兩側邊。The roller 422 is disposed on a side wall of the drying chamber 402 and is rotated by a drive motor 424. The rollers 422 can be connected to each other by a belt 426 and form a roller chain in the conveying direction. For example, a plurality of belt pulleys 428 are adjacent to the rollers 422 and are in contact with the belt 426. In particular, an idler pulley 429 is adjacent to each other and disposed between the rollers 422 for controlling the tension of the belt 426. In a preset embodiment, a pair of roller chains are disposed on both sides of the substrate 2.

儘管本實施例僅揭露位於基板兩側邊的一對驅動馬達424,但單一馬達也能用於驅動滾子鏈,如同我們所知的先前技術。舉例來說,驅動馬達的旋轉軸可與通過塗佈空氣供應器404的兩滾子鏈連接。Although this embodiment only discloses a pair of drive motors 424 located on either side of the substrate, a single motor can also be used to drive the roller chain, as is known in the prior art. For example, the rotating shaft of the drive motor can be coupled to two roller chains that are passed through the coating air supply 404.

參照第1圖,一裝載機20被設置於緊鄰塗佈模組100,一卸載機30被設置於緊鄰乾燥模組200。裝載機20與卸載機30皆包括滾輪,用以使基板2循運送方向被運送。Referring to FIG. 1, a loader 20 is disposed adjacent to the coating module 100, and an unloader 30 is disposed adjacent to the drying module 200. Both the loader 20 and the unloader 30 include rollers for transporting the substrate 2 in the transport direction.

根據本發明的實施例,處理裝置包括一塗佈模組與一乾燥模組。基板被水平運送時,自裝載機進入,經過塗佈模組與乾燥模組後,被運送至卸載機。尤其,基板通過塗佈模組後是直接被運送到乾燥模組。在塗佈模組與乾燥模組中,塗佈空氣供應器與乾燥空氣供應器分別供應空氣至基板,使基板漂浮於空氣中,塗佈模組與乾燥模組之個別運送單元循運送方向運送基板。也就是說,基板在處理裝置中以線性型態(in-line type)被運送,減少了製程時間。According to an embodiment of the invention, the processing device comprises a coating module and a drying module. When the substrate is transported horizontally, it enters from the loader, passes through the coating module and the drying module, and is transported to the unloader. In particular, the substrate is transported directly to the drying module after passing through the coating module. In the coating module and the drying module, the coating air supply and the dry air supply respectively supply air to the substrate, so that the substrate floats in the air, and the individual transport units of the coating module and the drying module are transported in the transport direction. Substrate. That is, the substrate is transported in an in-line type in the processing device, reducing process time.

此外,處理裝置不需要運送機器人,相較於傳統之處 理裝置將大幅降低製造與維修成本。In addition, the processing device does not need to transport the robot, compared to the traditional The device will significantly reduce manufacturing and maintenance costs.

綜上所述,雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

2‧‧‧基板2‧‧‧Substrate

4‧‧‧光阻劑膜4‧‧‧ photoresist film

10‧‧‧處理裝置10‧‧‧Processing device

20‧‧‧裝載機20‧‧‧Loader

30‧‧‧卸載機30‧‧‧Unloader

100、300‧‧‧塗佈模組100, 300‧‧‧ coating module

100a、200a、300a‧‧‧框架100a, 200a, 300a‧‧‧ frame

100b、300b‧‧‧起重架100b, 300b‧‧‧ lifting frame

100c、300c‧‧‧起重架臂100c, 300c‧‧‧ lifting arm

102、302‧‧‧塗佈空氣供應器102, 302‧‧‧ coated air supply

104‧‧‧第一運送單元104‧‧‧First shipping unit

106、306‧‧‧噴嘴106, 306‧‧‧ nozzle

108、132、142、216‧‧‧多孔板108, 132, 142, 216‧‧ ‧ multiwell plates

108a、132a、216a‧‧‧孔洞108a, 132a, 216a‧‧ holes

110、144、154、220、420‧‧‧空氣源110, 144, 154, 220, 420‧‧ air source

110a、144a、154a、220a‧‧‧空氣管110a, 144a, 154a, 220a‧‧‧ air tubes

112、146、156、218‧‧‧空氣分歧管112, 146, 156, 218‧‧‧ air manifold

112a、146a、156a、218a‧‧‧緩衝空間112a, 146a, 156a, 218a‧‧‧ buffer space

120‧‧‧第一修改塗佈空氣供應器120‧‧‧First modified coating air supply

122、151、215、232‧‧‧多孔質薄板122, 151, 215, 232‧‧‧ porous sheets

124、152、234‧‧‧側邊障壁124, 152, 234‧‧‧ side barriers

130‧‧‧第二修改塗佈空氣供應器130‧‧‧Second modified coating air supply

134‧‧‧開縫134‧‧‧ slit

136、429‧‧‧惰輪136, 429‧‧‧ idler

140‧‧‧第三修改塗佈空氣供應器140‧‧‧ Third modified coating air supply

142a‧‧‧第一孔洞142a‧‧‧First hole

142b‧‧‧第二孔洞142b‧‧‧Second hole

148、158‧‧‧排氣分歧管148, 158‧‧‧Exhaust manifold

149、159‧‧‧排氣單元149, 159‧‧‧ exhaust unit

149a、159a‧‧‧排氣管149a, 159a‧‧‧ exhaust pipe

150‧‧‧第四修改塗佈空氣供應器150‧‧‧Fourth modified coating air supply

151a‧‧‧排氣孔洞151a‧‧‧ Venting holes

200、400‧‧‧乾燥模組200, 400‧‧‧ dry module

202、402‧‧‧乾燥室202, 402‧‧‧ drying room

202a、402a‧‧‧入口202a, 402a‧‧‧ entrance

202b、402b‧‧‧出口202b, 402b‧‧‧Export

202c‧‧‧底部孔洞202c‧‧‧ bottom hole

202d‧‧‧頂部孔洞202d‧‧‧Top hole

204、230、404‧‧‧乾空氣供應器204, 230, 404‧‧ dry air supply

206、406‧‧‧托架206, 406‧‧‧ bracket

208、408‧‧‧真空單元208, 408‧‧‧vacuum unit

210、410‧‧‧第二運送單元210, 410‧‧‧Second transport unit

212‧‧‧下分歧管212‧‧‧Under the manifold

214‧‧‧上分歧管214‧‧‧Upper branch

222‧‧‧真空夾盤222‧‧‧vacuum chuck

224‧‧‧線性馬達224‧‧‧Linear motor

304‧‧‧運送單元304‧‧‧Transportation unit

312、422‧‧‧滾輪312, 422‧‧‧ Wheels

314、424‧‧‧驅動馬達314, 424‧‧‧ drive motor

316、426‧‧‧皮帶316, 426‧‧‧ belt

318、428‧‧‧皮帶輪318, 428‧‧‧ Pulley

第1圖繪示依據本發明一實施例之基板處理裝置;第2圖繪示依據本發明第1圖中的第一實施例之處理裝置之塗佈模組之平面示意圖;第3圖繪示依據本發明第1圖中的第一實施例之處理裝置之塗佈模組之剖面示意圖;第4圖繪示本發明第2圖及第3圖中的第一修改實施例之塗佈空氣供應器之剖面示意圖;第5圖繪示本發明第2圖及第3圖中的第二修改實施例之塗佈空氣供應器之剖面示意圖;第6圖繪示本發明第2圖及第3圖中的塗佈空氣供應器之第三修改實施例之平面示意圖;第7圖繪示本發明第2圖及第3圖中的塗佈空氣供應器之第三修改實施例之剖面示意圖;第8圖繪示本發明第2圖及第3圖中的塗佈空氣供應器之第四修改實施例之平面示意圖;第9圖繪示本發明第2圖及第3圖中的塗佈空氣供應器之第四修改實施例之剖面示意圖; 第10圖繪示依據本發明第1圖中處理裝置的塗佈模組之第二修改實施例之平面示意圖;第11圖繪示依據本發明第1圖中處理裝置的塗佈模組之第二修改實施例之剖面示意圖;第12圖繪示本發明第1圖中的處理裝置之第一實施例之乾燥模組之平面示意圖;第13圖繪示本發明第1圖中的處理裝置之第一實施例之乾燥模組之剖面示意圖;第14圖繪示本發明第12圖及第13圖中的乾空氣供應器之修改實施例之剖面示意圖;第15圖繪示本發明第1圖中的處理裝置之第二實施例之乾燥模組之平面示意圖;以及第16圖繪示本發明第1圖中的處理裝置之第二實施例之乾燥模組之剖面示意圖。1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention; and FIG. 2 is a plan view showing a coating module of a processing apparatus according to a first embodiment of the first embodiment of the present invention; A schematic cross-sectional view of a coating module of a processing apparatus according to a first embodiment of the present invention; and a fourth embodiment of the coating air supply of the first modified embodiment of the second and third aspects of the present invention. FIG. 5 is a schematic cross-sectional view showing a coating air supply device according to a second modified embodiment of the second and third embodiments of the present invention; and FIG. 6 is a second and third drawing of the present invention; FIG. 7 is a schematic cross-sectional view showing a third modified embodiment of the coating air supply device according to the second and third embodiments of the present invention; 2 is a plan view showing a fourth modified embodiment of the coated air supply device in the second and third embodiments of the present invention; and FIG. 9 is a view showing the coated air supply in the second and third embodiments of the present invention; A schematic cross-sectional view of a fourth modified embodiment; 10 is a plan view showing a second modified embodiment of a coating module of the processing apparatus according to the first embodiment of the present invention; and FIG. 11 is a view showing a coating module of the processing apparatus according to the first embodiment of the present invention. 2 is a schematic cross-sectional view of the modified embodiment; FIG. 12 is a plan view showing the drying module of the first embodiment of the processing apparatus of the first embodiment of the present invention; and FIG. 13 is a view showing the processing apparatus of the first embodiment of the present invention. 1 is a schematic cross-sectional view of a dry module of the first embodiment; FIG. 14 is a cross-sectional view showing a modified embodiment of the dry air supply of the 12th and 13th embodiments of the present invention; and FIG. 15 is a first view of the present invention. FIG. 16 is a schematic cross-sectional view showing a drying module of a second embodiment of the processing apparatus according to the first embodiment of the present invention.

2...基板2. . . Substrate

10...處理裝置10. . . Processing device

20...裝載機20. . . Loader

30...卸載機30. . . Unloader

100...塗佈模組100. . . Coating module

200...乾燥模組200. . . Drying module

Claims (16)

一種處理基板的裝置,包括:一塗佈模組,用以將一光阻劑膜塗佈於一基板上,其中該基板係循一運送方向以水平方式運送;以及一乾燥模組,該乾燥模組相鄰於該塗佈模組,用以將直接自該塗佈模組運送過來的該基板上之該光阻劑膜乾燥,其中該乾燥模組包括:一乾燥室,該乾燥室包括一接收該基板的乾燥空間,該乾燥室包括一底板及一頂板,該底板具有複數個底部孔洞,該頂板具有複數個頂部孔洞;以及一真空單元,用以供應一真空壓力至該乾燥室內部,使該基板上的光阻劑膜因乾燥室內部的真空而乾燥,其中,該底板之該些底部孔洞透過一下分歧管連接至該真空單元,該頂板之該些頂部孔洞透過一上分歧管連接至該真空單元。 An apparatus for processing a substrate, comprising: a coating module for coating a photoresist film on a substrate, wherein the substrate is transported horizontally in a transport direction; and a drying module, the drying The module is adjacent to the coating module for drying the photoresist film on the substrate directly transported from the coating module, wherein the drying module comprises: a drying chamber, the drying chamber includes Receiving a drying space of the substrate, the drying chamber comprises a bottom plate and a top plate, the bottom plate has a plurality of bottom holes, the top plate has a plurality of top holes, and a vacuum unit for supplying a vacuum pressure to the inside of the drying chamber The photoresist film on the substrate is dried by the vacuum inside the drying chamber, wherein the bottom holes of the bottom plate are connected to the vacuum unit through a branch pipe, and the top holes of the top plate pass through an upper manifold Connected to the vacuum unit. 如申請專利範圍第1項所述的裝置,其中該塗佈模組包括:一塗佈空氣供應器,用以提供一空氣使該基板漂浮於空氣中;一運送單元,用以循該運送方向水平運送漂浮的該基板;及一噴嘴,該噴嘴位於該塗佈空氣供應器上方且實質上循垂直於該運送方向之一噴嘴方向延伸,用以將光阻材料以該噴嘴供應至該基板。 The device of claim 1, wherein the coating module comprises: a coating air supply for providing an air to float the substrate in the air; and a transport unit for following the transport direction Horizontally transporting the floating substrate; and a nozzle positioned above the coating air supply and extending substantially in a direction perpendicular to the one of the conveying directions for supplying the photoresist material to the substrate. 如申請專利範圍第2項所述的裝置,其中該塗佈空 氣供應器包括:一多孔板,該多孔板包括複數個孔洞,用以讓空氣通過。 The device of claim 2, wherein the coating is empty The gas supply includes: a perforated plate including a plurality of holes for allowing air to pass therethrough. 如申請專利範圍第2項所述的裝置,其中該塗佈空氣供應器包括:一多孔質薄板,該多孔質薄板包括複數個孔洞,用以讓空氣通過;以及一側邊障壁,用以圍起該多孔質薄板的側面。 The apparatus of claim 2, wherein the coating air supply comprises: a porous sheet comprising a plurality of holes for allowing air to pass; and a side barrier for The side of the porous sheet is enclosed. 如申請專利範圍第2項所述的裝置,其中該運送單元包括:複數個真空夾盤,該些真空夾盤利用真空壓力,用以固定該基板之邊緣部份。 The apparatus of claim 2, wherein the transport unit comprises: a plurality of vacuum chucks that utilize vacuum pressure to secure an edge portion of the substrate. 如申請專利範圍第5項所述的裝置,其中該運送單元將該基板運送至該乾燥模組內部。 The device of claim 5, wherein the transport unit transports the substrate to the interior of the drying module. 如申請專利範圍第2項所述的裝置,其中該運送單元包括:複數個滾輪,用以支撐該基板兩側邊緣部份並且沿著運送方向直線排列。 The device of claim 2, wherein the transport unit comprises: a plurality of rollers for supporting both side edge portions of the substrate and linearly arranged along the transport direction. 如申請專利範圍第1項所述的裝置,其中該乾燥模組更包括:一乾空氣供應器,該乾空氣供應器位於該乾燥室內,用以供應空氣至該基板,使該基板漂浮於空氣中;以及一托架,該拖架位於該乾空氣供應器上方,用以支撐該基板於該乾燥室中。 The device of claim 1, wherein the drying module further comprises: a dry air supply, the dry air supply is located in the drying chamber for supplying air to the substrate, and floating the substrate in the air And a bracket above the dry air supply for supporting the substrate in the drying chamber. 如申請專利範圍第8項所述的裝置,其中該乾燥 空氣供應器包括:一多孔板,該多孔板包括複數個孔洞,用以讓空氣通過。 The device of claim 8, wherein the drying The air supply includes: a perforated plate including a plurality of holes for allowing air to pass therethrough. 如申請專利範圍第8項所述的裝置,其中該乾燥空氣供應器包括:一多孔質薄板,該多孔質薄板包括複數個孔隙,用以讓空氣通過;以及一側邊障壁,用以圍起該多孔質薄板的側面。 The apparatus of claim 8, wherein the dry air supply comprises: a porous sheet comprising a plurality of pores for allowing air to pass; and a side barrier for surrounding The side of the porous sheet is used. 如申請專利範圍第8項所述的裝備,其中該乾燥模組更包括:一運送單元,用以循該運送方向水平運送漂浮的該基板。 The equipment of claim 8, wherein the drying module further comprises: a transport unit for horizontally transporting the floating substrate in the transport direction. 如申請專利範圍第11項所述的裝置,其中該運送單元包括:複數個真空夾盤,該些真空夾盤利用真空壓力使該基板的邊緣部份固定。 The apparatus of claim 11, wherein the transport unit comprises: a plurality of vacuum chucks that fix the edge portions of the substrate by vacuum pressure. 如申請專利範圍第11項所述的裝置,其中該運送單元包括:複數個滾輪,該些滾輪沿著該運送方向直線排列,用以支撐該基板兩側邊緣部份。 The device of claim 11, wherein the transport unit comprises: a plurality of rollers arranged linearly along the transport direction for supporting both side edge portions of the substrate. 如申請專利範圍第8項所述的裝置,其中該乾燥室包括:一入口,用以使該基板沿著該運送方向通過並進入該乾燥室;一出口,用以使該基板沿著該運送方向通過並離開該 乾燥室。 The apparatus of claim 8, wherein the drying chamber comprises: an inlet for passing the substrate along the conveying direction and entering the drying chamber; and an outlet for causing the substrate to be transported along the same Direction through and leave the Drying room. 如申請專利範圍第14項所述的裝置,其中該入口與該出口包括:一閘閥,用以將該乾燥室的乾燥空間與外界隔離。 The device of claim 14, wherein the inlet and the outlet comprise: a gate valve for isolating the drying space of the drying chamber from the outside. 申請專利範圍第8項所述的裝置,其中該托架包括:複數個支撐插腳,該些支撐插腳位於該乾空氣供應器上方,並且可向上及向下移動,用以避免當該基板被運送進入或離開該乾燥室時,被該些支撐插腳所阻礙。The device of claim 8, wherein the bracket comprises: a plurality of support pins located above the dry air supply and movable upward and downward to avoid when the substrate is transported When entering or leaving the drying chamber, it is blocked by the support pins.
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