TWI527747B - Non-contact adsorbing disk - Google Patents

Description

Non-contact suction plate

The present invention relates to a non-contact absorbing disk, and more particularly to a non-contact of the floating of the workpiece caused by the pressurized air on the adsorption surface and the adsorption of the workpiece due to the attraction. Suck the plate.

A vacuum tweezers is well known in the art for an apparatus for processing an extremely thin workpiece such as a semiconductor wafer or a glass substrate for an FPD (flat panel display). However, the vacuum tweezers handles the workpiece in a state in which the workpiece is in contact with the workpiece, and thus there is a problem that stress or the like is applied to the workpiece.

In addition, it is not possible to apply a stress or the like to a workpiece having a very small thickness such as a glass material for FPD, and a device for treating it in a non-contact state has proposed a method of making pressurized air from a porous plate. A device in which a hole is ejected to float a workpiece and is transported on a porous plate (for example, Patent Documents 1 and 2).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-110852

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2011-084352

In the devices of Patent Documents 1 and 2, air is ejected from a plate-like body (base) of a porous material to float the workpiece on the plate-like body, and air is sucked from a part of the plate-like body. The workpiece having an extremely small thickness is conveyed to the susceptor in a non-contact state while maintaining planarity.

In the processing of the extremely thin workpiece such as the semiconductor wafer or the FPD glass substrate, in addition to transporting the workpiece on the transport path, it is necessary to hold the workpiece on the susceptor. a predetermined position; a case where the workpiece is lifted at a certain position and moved to another position or the like.

However, the devices of Patent Documents 1 and 2 cannot respond to such a demand.

On the other hand, a device using a so-called "Binnuulli's law" has been proposed as a device in a non-contact state and capable of adsorbing and holding a thin workpiece downward. The white Nuo suction cup is such that the pressurized air from the air compressor is ejected along the lower side while being wound around the recess formed in the lower surface of the suction cup, thereby generating an adsorption force in a region directly under the concave portion to generate buoyancy around the concave portion. A device for adsorbing and holding a thin workpiece such as a semiconductor wafer on the lower side of the chuck in a non-contact state.

However, the number of recesses that can be formed in the white Nuclei suction cup is limited, so that the occurrence of attraction force and buoyancy becomes local, and it is impossible to process a large and thin size without being flattened, deformed, or the like. The substance is adsorbed and maintained.

The present invention has been made in order to solve such a problem, and an object thereof is to provide a non-contact absorbing disk which keeps a thin workpiece to be adsorbed at a predetermined position, or can be kept adsorbed downward.

According to the present invention, there is provided a non-contact absorbing disk for adsorbing a thin plate-shaped object to be adsorbed in a non-contact state, comprising: a plate-shaped porous pad extending in a thickness direction in the adsorption fixing region; a plurality of vent holes; the first sealed space is disposed adjacent to the back surface of the porous pad; the second sealed space is separated from the first sealed space; and the communication means is for the second sealed space and the vent hole The same.

According to this configuration, for example, the first sealed space is connected to the source of the pressurized air, and the second sealed space is communicated with the suction and pressure reducing source, whereby the pressurized air can be made from the pores on the front surface of the porous mat. When it is ejected, air is sucked from the vent hole on the front surface of the porous mat. As a result, on the front surface of the porous mat, the workpiece can be held at a predetermined position by suction and floated by the pressurized air. As a result, the workpiece having a small thickness such as a semiconductor wafer can be held in a non-contact state at a predetermined position on the front surface of the upward facing porous mat, or can be kept adsorbed in a downward-facing and non-contact state. On the lower side of the front side of the porous pad facing downward.

Since the suction pressure (decompression) and the supply pressure (pressure) can be individually adjusted, the holding force and the floating force can be controlled. Therefore, the floating gap can also be adjusted.

According to still another preferred aspect of the present invention, there is provided a plate-shaped support member having a positive-area layer on a back side of the porous mat and having a recess, the recess being formed between the recess and the back surface of the porous mat The first sealed space; and the base, the laminated layer on the back side of the support member, and the support member A second sealed space is formed between the back surfaces, and the support member has a through hole, wherein one end of the through hole is connected to the vent hole of the porous pad at the time of stacking, and the other end forms an opening on the back surface of the support member to As a function of the aforementioned communication means.

According to another preferred aspect of the present invention, the support device includes a plurality of island-shaped projecting portions, and the island-shaped projecting portions have a flat top portion, and are connected to the open end side of the plurality of vent holes. In the back surface of the porous mat, the through hole extends through the protruding portion, and a space between the protruding portions becomes the first sealed space.

According to another preferred aspect of the present invention, the base includes a plurality of island-shaped projecting portions on the surface, and the island-shaped projecting portions have a flat top portion that is coupled to the back surface of the support member during the connecting. The space between the protruding portions serves as a pressure reducing flow path, and the other end of the through hole is in fluid communication with the pressure reducing flow path.

According to another preferred aspect of the present invention, the plurality of protruding portions have a rectangular cross-sectional shape and are arranged in a mesh shape of a checkerboard, and the first sealed space is formed in a lattice-shaped flow path for pressurized air.

According to this configuration, the pressurized air can be uniformly discharged from the pores of the porous mat.

According to other desirable aspects of the present invention, The pressure reducing grooves are arranged in a lattice shape.

According to this configuration, the pressurized air can be uniformly discharged from the vent holes of the porous mat.

According to another preferred aspect of the present invention, the other end of the through hole is in fluid communication with the decompression groove at an intersection of the lattice-shaped decompression grooves.

According to this configuration, the suction can be efficiently performed from the through hole.

According to another aspect of the present invention, a support member having a plate shape is provided on the back side of the porous pad, and a through hole corresponding to the vent hole of the porous pad is provided, and a base is further provided. a second sealed space is formed between the back surface side of the support member and the back surface of the support member, and a concave portion is formed on the back surface of the porous pad, and the first sealed space is formed between the concave portion and the support member. The vent hole of the porous pad is connected to the through hole of the support member, and functions as the communication means.

According to another preferred aspect of the present invention, the frame member includes a ring portion disposed between the support member and the base, and the second sealed space is formed by an internal space of the annular portion.

a plurality of island-shaped protruding portions are provided in the recess of the porous pad, and the island-shaped protruding portions are provided with a flat top portion that is abutted against the front surface of the support device. The vent hole of the porous mat penetrates through the island-shaped projecting portion.

According to another preferred aspect of the present invention, the first sealed space is a pressurized air space portion, and the second closed space is a reduced pressure space portion.

According to another preferred aspect of the present invention, the vent hole is dispersedly disposed on the entire front surface of the porous mat, and according to such a configuration, the entire front surface of the porous mat can be used as an adsorption fixing region.

According to another preferred aspect of the invention, the porous mat is formed of porous carbon.

According to the present invention, there is provided a non-contact absorbing disk which keeps a thin workpiece to be adsorbed at a predetermined position or which can be kept adsorbed downward.

1‧‧‧ Non-contact suction tray

2‧‧‧Porous mat

2a‧‧‧ positive

2b‧‧‧back

4‧‧‧Cushion support

6‧‧‧Base

8‧‧‧Attraction hole (ventilation hole)

10‧‧‧Link hole

12‧‧‧ Uplift

14‧‧‧ trench

16‧‧‧Protruding

18‧‧‧Contact holes

20‧‧‧ pressurized air inlet

22‧‧‧Base groove

24‧‧‧vacuum hole

Fig. 1 is an exploded perspective view of the non-contact suction disk according to the first embodiment of the present invention.

Figure 2 is a top plan view of the porous pad of the non-contact suction disk of Figure 1.

Fig. 3 is a bottom view of the porous pad of the non-contact suction disk of Fig. 1.

Fig. 4 is an enlarged view of a portion of the cross section taken along line IV-IV of Fig. 3.

Figure 5 is a top plan view of the support for the non-contact sorption plate of Figure 1.

Figure 6 is a bottom view of the support of the non-contact sorption plate of Figure 1.

Figure 7 is a top plan view of the base of the non-contact sorption plate of Figure 1.

Figure 8 is a bottom view of a variation of the support for the non-contact sorption plate.

Figure 9 is a bottom view of another variation of the support for the non-contact suction disk.

Fig. 10 is a schematic cross-sectional view showing a state in which adsorption/fixation (non-contact adsorption) of the workpiece W is performed by the non-contact suction disk of Fig. 1.

Fig. 11 is a view showing the steps of carrying out the conveyance of the workpiece by the workpiece transporting apparatus using the non-contact suction disk of Fig. 1.

Fig. 12 is a view showing the steps of carrying out the conveyance of the workpiece by the workpiece transporting apparatus using the non-contact suction disk of Fig. 1.

Fig. 13 is a view showing the steps of carrying out the conveyance of the workpiece by the workpiece transporting apparatus using the non-contact suction disk of Fig. 1.

Fig. 14 is a view showing the steps of carrying out the conveyance of the workpiece by the workpiece transporting apparatus using the non-contact suction disk of Fig. 1.

Fig. 15 is a view showing the steps of carrying out the conveyance of the workpiece by the workpiece transporting apparatus using the non-contact suction disk of Fig. 1.

Fig. 16 is a view showing the steps of carrying out the conveyance of the workpiece by the workpiece transporting apparatus using the non-contact suction disk of Fig. 1.

Fig. 17 is a view showing the steps of carrying out the conveyance of the workpiece by the workpiece transporting apparatus using the non-contact suction disk of Fig. 1.

Fig. 18 is a view showing the steps of carrying out the conveyance of the workpiece by the workpiece transporting apparatus using the non-contact suction disk of Fig. 1.

Fig. 19 is a view showing the steps of carrying out the conveyance of the workpiece by the workpiece transporting apparatus using the non-contact suction disk of Fig. 1.

Figure 20 is a view showing the non-contact suction disk of the second embodiment of the present invention as seen from above An exploded perspective view.

Fig. 21 is an exploded perspective view of the non-contact suction disk according to the second embodiment of the present invention as seen from below.

Figure 22 is a top plan view of a porous pad having other configurations.

Figure 23 is a top plan view of a porous pad having other configurations.

Figure 24 is a top plan view of a porous pad having other configurations.

Figure 25 is a top plan view of a base having other configurations.

Hereinafter, a non-contact suction disk according to an embodiment of the present invention will be described with reference to the drawings.

First, the configuration of the non-contact suction disk according to the first embodiment of the present invention will be described. Fig. 1 is an exploded perspective view of the non-contact suction disk 1 according to the first embodiment of the present invention.

The non-contact suction disk 1 of the present embodiment adsorbs a thin plate-shaped object to be adsorbed (a workpiece) such as a semiconductor wafer or a glass substrate for FPD in a non-contact state, for example, a semiconductor wafer having a thickness of 100 μm or less. Non-contact suction plate. As shown in Fig. 1, the non-contact suction disk 1 is provided with a disk-shaped porous pad 2, which is provided with an adsorption region on the upper surface of the workpiece, and a substantially circular plate-shaped spacer support 4; The lower side (back side) holds the porous mat 2; and the slightly rounded base 6 is coupled to the back side of the holder 4.

The porous mat 2 is formed of a gas permeable porous carbon. The material of the porous mat 2 is not limited to the air-permeable porous carbon, and other air-permeable porous materials such as porous SiC or porous aluminum may be used.

Figure 2 is a top view of the porous pad 2, and Figure 3 is a porous pad. The bottom view of 2.

In the porous mat 2, a plurality of suction holes (vent holes) 8 are formed. Such as As shown in FIGS. 2 and 3, the suction holes 8 are arranged in a lattice shape almost throughout the porous mat 2, that is, in a state of being disposed at the intersection of the meshes of the checkerboard. In the present embodiment, the interval between the suction holes 8 is set to about 25 mm.

Figure 4 is a section along the line VI-VI of Figure 3 To expand the map. As shown in FIG. 4, the suction holes 8 are formed so as to extend through the porous mat 2 in the thickness direction. The suction hole 8 is a small-diameter portion 8a having a diameter of about 0.6 mm on the front surface 2a side of the porous mat 2, and a large-diameter portion 8b having a diameter of about 4 mm on the back surface 2b side of the porous mat 2 so as to face the porous mat 2 The tapered portion 8c whose front surface 2a is tapered and the tapered portion 8c connects the small diameter portion 8a and the large diameter portion 8b.

With such a configuration, if the large diameter portion 8b of the suction hole 8 is subjected to decompression suction In addition, the air from the small-diameter portion 8a of the suction hole 8 opened on the front surface 2a side of the porous mat 2 is attracted, and the surface area of the porous mat 2 formed by the suction hole 8 is adsorbed and fixed by the workpiece. Fixed area.

Further, a connection hole 10 is formed in a peripheral portion of the porous pad 2, and the connection hole 10 is formed. The connection hole 10 is a connector that can be inserted into a screw or the like that connects the porous pad to the pad holder 4 or the like.

Figure 5 is a top view of the pad support 4, and Figure 6 is a pad support. Hold the bottom view of 4.

As described above, the pad support 4 holds the porous pad from the lower side (back side) The member having a substantially round plate shape is formed of, for example, a metal material such as an aluminum alloy. The liner support 4 can also be formed of a resin such as carbon fiber-reinforced plastic (CFRP) or polyetheretherketone (PEEK).

As shown in FIGS. 1 , 4 , and 5 , an annular ridge portion 12 is formed on the outer peripheral edge of the pad support 4 . The raised portion 12 is configured such that the inner diameter is slightly larger than the outer diameter of the porous mat 2 and the height is slightly lower than the thickness of the porous mat 2.

Therefore, when the porous mat 2 is disposed in the space (concave portion) inside the raised portion 12 of the spacer holder 4, the upper surface 2a of the porous mat 2 is disposed slightly above the top surface of the raised portion 12 of the spacer holder 4. The state above.

Further, in the inner region of the ridge portion 12 of the upper surface of the spacer holder 4 (the bottom surface of the concave portion), a groove 14 having a rectangular cross section is formed in a lattice shape (mesh shape of the checkerboard), and is partitioned by the groove 14. The portion is an island portion 16 having a square cross section. The island-shaped projecting portion 16 is formed in a mesh-like arrangement of the checkerboard together with the grooves 14 arranged in a lattice shape (mesh shape of the checkerboard).

The top surface of each of the protruding portions 16 is flat, and a through hole 18 penetrating through the pad holder 4 in the thickness direction is formed in the center.

The porous pad 2 and the spacer support 4 are fixed by the adhesive bonding in a state in which the porous pad 2 is placed in the space inside the raised portion 12 of the pad holder 4. The porous pad 2 and the pad holder 4 are connected and fixed by a coupling member such as a bolt.

When the porous pad 2 is disposed in the space inside the raised portion 12 of the pad holder 4, the protruding portion 16 is in an airtight state and is in contact with the large diameter of the suction hole 8 on the back surface 2b of the porous pad 2. The portion around the open end of the portion 8b is configured.

As a result, when the porous pad 2 is fixed by the adhesive to the space inside the ridge portion 12 of the pad holder 4, it is arranged in a lattice between the back surface of the porous pad 2 and the upper surface of the pad holder 4. a groove 14 and covering the groove 14 The porous mat 2 forms a sealed space (first sealed space).

The through hole 18 has a diameter which is slightly the same as the large diameter portion 8b of the suction hole 8 of the porous pad 2, and the porous pad 2 is accommodated at a predetermined angular position in the space inside the ridge portion 12 of the pad holder 4. The through hole 18 is configured to be aligned with the respective suction ports 8 formed in the porous pad 2 in the thickness direction.

As a result, when the porous pad 2 is housed in the space inside the ridge portion 12 of the pad holder 4 at a predetermined angular position, the suction port 8 of the porous pad 2 is in fluid communication with the through hole 18 of the pad holder 4.

A pressurized air inlet 20 is formed on the outer circumference of the pad support 4, and a sealed space (first sealed space) formed by the groove 14 and an outer space of the pad support 4 are connected to introduce pressurized air thereto. Confined space (first closed space).

As a result, the porous pad 2 is housed and joined to the space inside the ridge portion 12 of the pad holder 4, and pressurized air is introduced from the pressurized air inlet 20 to the groove 14 and the porous pad 2 In the sealed space (first sealed space) formed, pressurized air invades into the pores of the porous mat 2 which constitutes the upper surface of the sealed space (first sealed space), and penetrates the porous mat 2 from the porous mat The front of 2 is squirted as a whole.

Figure 7 is a top view of the base 6. As described above, the base 6 is a substantially disk-shaped member that is coupled to the back side of the pad holder 4, and is formed of, for example, a metal material such as aluminum alloy. The base 6 may also be formed of a resin such as CFRP or PEEK.

As shown in FIGS. 1 and 7, the base 6 has a diameter slightly the same as that of the pad holder 4, and a flat groove 22 having a rectangular cross section is formed in a lattice shape on a flat upper surface. Therefore, when the flat back surface of the pad support 4 is joined to the upper surface of the base 6, the lattice-like base groove 22 and the pad covering the cover are supported. The back surface of the tool 4 has a lattice-shaped sealed space (second sealed space).

When the spacer groove 22 is engaged with the base 6 at a predetermined angular position, the lattice-shaped base groove 22 is aligned with the through hole 18 formed in the spacer support 4 in the thickness direction. Composition.

With such a configuration, when the porous pad 2, the pad holder 4, and the chassis 6 are connected at a predetermined angular position, the suction hole 8 of the porous pad 2 passes through the through hole 18 of the spacer holder 4, and It communicates with the intersection of the lattice-shaped sealed space (second closed space) formed between the base 6 and the spacer support 4.

Further, a vacuum hole 24, which is a through hole for allowing the base groove 22 to communicate with the external vacuum source of the base 6, is formed on the outer circumference of the base 6.

With such a configuration, when the porous pad 2, the spacer holder 4, and the chassis 6 are connected at a predetermined angle, when the vacuum suction is performed from the vacuum hole 24, the through hole 18 of the spacer holder 4 is passed through the through hole 18. The suction ports 8 of the porous mat 2 are attracted, and the workpiece on the porous mat 2 can be adsorbed toward the porous mat 2.

The pad support 4 and the base 6 are coupled by a coupling such as a screw or a bolt. A groove may be formed along the outer circumference of the upper surface of the base 6, and an O-ring is disposed in the groove, so that the lattice-like base groove 22 of the base 6 is in an airtight state, and the pad support 4 and the base are provided. 6 links. Further, a configuration in which the pad holder 4 and the base 6 are coupled by an adhesive may be used.

The non-contact suction disk having such a configuration is used in a state where the porous pad 2, the pad holder 4, and the base 6 are connected at a predetermined angular position in use, by being pressurized from the air inlet 20 The pressurized air is introduced into a sealed space (first sealed space) formed by the groove 14 and the porous pad 2, and vacuum suction is performed from the vacuum hole 24 of the base 6, whereby the porous pad 2 is non-contacted. Adsorption is added Work.

Further, even a curved workpiece (adsorbed material) can be made to conform to the adsorption surface to be flattened.

In the above embodiment, the lattice-shaped base groove 22 is formed on the upper surface of the base 6, and the second sealed space is formed through the base groove 22. However, the upper surface of the base may be a flat surface, and the spacer support may be used. A recess or groove is formed in the back surface to form a second sealed space between the pad holder and the base.

Fig. 8 is a bottom view of the pad holder 4' used as a variation of such a configuration. As shown in Fig. 8, a thin cylindrical recess 22' is formed on the bottom surface of the spacer holder 4'.

The pad support 4' is joined to the upper flat disc-shaped base below, and is formed between the pad support 4' and the base by the flat upper surface of the base and the thin cylindrical recess 22' A thin (low height) cylindrical second closed space. Here, the side wall of the gasket supporting member 4' is formed with a vacuum hole (not shown) communicating with the recess 22'.

Fig. 9 is a bottom view of a spacer holder 4" used as another variation of the configuration. As shown in Fig. 9, a lattice-like groove is formed on the bottom surface of the spacer holder 4". twenty two".

The pad support 4" is also joined to the upper flat disc-shaped base underneath, and a lattice is formed between the pad support 4" and the base by the flat upper surface of the base and the lattice-like groove 22" The second sealed space of the groove is formed by a side wall of the spacer support 4", and a vacuum hole (not shown) communicating with the lattice-like groove 22" is also formed.

Figure 10 is a view for explaining the workpiece to be processed by the non-contact suction disk 1. Schematic cross-sectional view of the state of adsorption fixation (non-contact adsorption) of W.

As mentioned above, when used, pressurized air is supplied from an external source of compressed air When introduced into the sealed space formed by the groove 14 of the spacer support 4 and the porous pad 2, pressurized air intrudes into the porous pad 2 through the pores of the porous pad 2, as shown in Fig. 10 As shown by P, it is ejected from the front surface 2a of the porous mat 2. As indicated by an arrow P in Fig. 10, the workpiece W is floated on the front surface (adsorption surface) 8a of the gasket by the pressurized air that is ejected.

On the other hand, by the introduction of pressurized air from the base 6 simultaneously The vacuum suction by the vacuum hole 24 causes the workpiece W floating on the front surface (adsorption surface) 8a of the spacer to pass through the through hole 18 of the spacer holder 4, as shown by the arrow V, and is subjected to the porous pad. Each of the suction holes 8 of the second 2 is attracted to the suction target 8a at a predetermined distance G from the suction surface 8a which is adsorbed and fixed only by the buoyancy caused by the pressurized air and the suction force caused by the vacuum suction.

Buoyancy caused by adjusting pressurized air (air volume and air pressure) In the state in which the non-contact suction disk 1 is inverted, that is, the adsorption surface 2a of the porous pad 2 faces downward, the workpiece W is adsorbed and fixed in a non-contact state. The lower side of the adsorption surface 2a.

Next, a description will be given of the use of the non-contact absorbing tray 1 of the present embodiment. The workpiece conveyance device conveys the workpiece.

Figures 11 through 19 show the use of non-contact absorbing tray 1 The workpiece conveyance device 50 performs a process of each workpiece conveyance.

As shown in Figs. 11 to 19, the workpiece conveying device 50 is The so-called horizontal multi-joint "material handling" robot.

The workpiece conveyance device 50 includes a column 52 and a first arm 56. The base end is rotatably coupled to the upper end of the column 52 via the shoulder joint 54 , and the second arm 60 is rotatably coupled to the distal end of the first arm 56 via the elbow joint 58 and the hand 64 . The proximal end is rotatably coupled to the distal end of the second arm 60 via the wrist joint 62. The non-contact suction disk 1 of the above-described embodiment is attached to the lower surface of the hand 64 with the suction surface 2a facing downward.

Next, the first processing will be described using the workpiece conveying device 50. The device 66 transports the workpiece W to the second processing device 68.

As shown in Fig. 11, the workpiece W is transmitted through the first processing device. The absorbing device 70 on the 66 is adsorbed and held on the first processing device 66. In the transporting step of the present embodiment, first, the first and second arms 56 and 60 of the workpiece conveying device 50 are extended in the direction of the first processing device 66, and the non-contact suction disk attached to the hand 64 is placed. 1. The upper portion of the workpiece W adsorbed and held by the first processing device 66 is disposed (Fig. 12).

Secondly, the column 52 is shortened, so that the non-contact absorbing plate 1 and the like are lowered to the The height position of the workpiece W is adsorbed (Fig. 13). Then, pressurized air and vacuum suction are applied to the non-contact suction disk 1, and the adsorption operation of the absorbing device 70 of the first processing device 66 is stopped, and the workpiece W is adsorbed and fixed to the non-contact absorbing plate 1 Side (Fig. 14).

Next, the post 52 is elongated (Fig. 15), and the shoulder joint 54 is used. The arm is rotated as a whole, and the non-contact suction disk 1 is moved to the upper side of the second processing device 68 (Fig. 16).

Then, the column 52 is shortened to the suction of the second processing device 68. The position 72 can adsorb the height position of the workpiece W adsorbed and fixed on the non-contact suction disk 1, and lower the non-contact suction disk 1 and the like (Fig. 17). Then, start the first (2) the adsorption operation of the absorbing device 72 of the processing device 68, and the application of the pressurized air and the vacuum suction to the non-contact absorbing disk 1 to stop the suction of the workpiece W on the absorbing device 72 of the second processing device 68 (the first) 18)), then return the arm to the initial position and end the transfer operation (Fig. 19).

According to the above non-contact suction disk, the entire pressure is discharged from the adsorption surface When the workpiece is floated, the workpiece W is sucked from the suction hole distributed over the entire adsorption surface, so that excessive stress is not applied to the workpiece, and the workpiece can be adsorbed and fixed in a non-contact state. Pre-determined location.

Next, a description will be given of a non-contact suction disk according to a second embodiment of the present invention. Composition. Fig. 20 is an exploded perspective view of the non-contact suction disk 100 according to the second embodiment of the present invention, and Fig. 21 is an exploded perspective view of the non-contact suction disk 100 according to the second embodiment of the present invention as seen from below.

The non-contact suction disk 100 of the present embodiment is the first embodiment Similarly, the non-contact absorbing disk 1 is affixed to a semiconductor wafer such as a semiconductor wafer or a FPD glass substrate, for example, a semiconductor wafer having a thickness of 100 μm or less in a non-contact state. Non-contact suction plate.

As shown in FIGS. 20 and 21, the non-contact absorbing disc 100 is provided The disk-shaped porous pad 102 is provided with an adsorption region on the upper surface of the workpiece; the substantially disk-shaped spacer support member 104 holds the porous pad 102 from the lower side (back side); The disc-shaped base 106 is disposed on the back side of the pad holder 104.

In the non-contact squeegee 100, the pad support 104 and the base Between 106, a frame member 108 having an annular portion 108a is disposed.

The porous mat 102 is in contact with the porous mat 2 of the non-contact absorbing tray 1 The same place is formed by a gas permeable porous carbon. The material of the porous pad 102 is not limited to As the porous porous carbon, other air-permeable porous materials such as porous SiC or porous aluminum may be used.

The porous pad 102, the disk portion 104a of the pad support 104, The annular portion 108a of the frame member 108, and the disk portion 106a of the base 106 have slightly the same outer diameter. Further, in the present embodiment, the porous pad 102, the disk portion 104a of the spacer holder 104, the annular portion 108a of the frame member 108, and the disk portion 106a of the base 106 are laminated, and then The agent is fixed to form the non-contact absorbing tray 100.

Furthermore, the pad support 104, the base 106, and the frame member 108 Each of the handle portions 104b, 106b, 108b having a substantially identical contour extending outward from the disk portion or the annular portion is provided.

The pad holder 104, the base 106, and the frame member 108 are A metal material of an aluminum alloy, a resin such as CFRP or PEEK, or the like is formed.

The porous mat 102 is formed with a plurality of suction holes (vent holes) 109. Suck The pilot hole 109 is disposed over the entire surface of the porous pad 102.

Further, a porous joint is formed on the peripheral portion of the porous mat 102. The pad is supported by the spacer hole 110 with a time of 4 or the like.

As shown in Fig. 21, under the porous pad 102, on the outer periphery An annular lower portion 112 is formed. The lower portion 112 is configured such that the outer diameter is slightly equal to the outer diameter of the disk portion 104b of the pad holder 104. That is, a disk-shaped recess is formed on the lower surface of the porous pad 102. As a result, when the porous pad 102 is laminated on the spacer support 104, a sealed space (first sealed space) is formed between the upper surface of the spacer support 104 and the lower surface of the porous pad 102.

In the inner region of the lower portion 112 of the lower surface of the porous pad 102, A groove 114 having a rectangular cross section is formed, and a portion partitioned by the groove 114 is an island-shaped projecting portion 116 having a square cross section. The island-shaped projections 116 are arranged in a mesh shape of the checkerboard together with the grooves 114 arranged in a lattice shape (mesh shape of the checkerboard). The top surface of each of the protruding portions 116 is flat, and a suction hole 109 penetrating the porous pad 102 in the thickness direction is disposed at the center.

Since the thickness of the island-shaped protruding portion 116 is slightly the same as the height of the hanging portion 112, the sealed space (first sealed space) formed between the upper surface of the spacer support 104 and the lower surface of the porous pad 102 is island-shaped. The constricted portion 116 is separated by a confined space.

Further, the spacer support 104 is perforated with a through hole 118 penetrating the spacer support 104 in the thickness direction. Each of the through holes 118 has a diameter slightly the same as that of the suction hole 109 of the porous pad 102, and is aligned with the suction hole 109 of the porous pad 102 when the spacer holder 104 is disposed at the predetermined position of the porous pad 102 at a predetermined angular position. Configured in a way.

As a result, when the porous pad 102 and the spacer support 104 are laminated, the suction hole 109 of the porous pad 102 is in fluid communication with the through hole 118 of the spacer holder 104.

As described above, the disk portion of the pad support 104, the annular portion of the frame member 108, and the disk portion of the base 106 have substantially the same outer diameter, so that the disk portion of the pad support 104, the frame member 108 When the annular portion and the disk portion of the base 106 are laminated in the aligned state to form the non-contact absorbing disk 100, between the disk portion of the pad holder 104 and the disk portion of the base 106, the frame member is formed. The sealed space of the thickness of 108 is slightly equal in height (second closed space). Between the disc portion of the pad support 104 and the disc portion of the base 106, the air is sealed The space (second sealed space) communicates with the suction hole 109 of the porous pad 102 via the through hole 118 of the spacer holder 104.

As a result, when the sealed space (second closed space) is vacuum-sucked between the disk portion of the spacer holder 104 and the disk portion of the base 106, the through hole 118 of the spacer support 104 is used to be porous. Each of the suction holes 109 of the pad 102 is sucked, and the workpiece on the porous pad 102 can be adsorbed to the porous pad 102.

Further, in the non-contact absorbing tray 100 of the present embodiment, the elongated portions 120, 122 and the pressurized long holes 124 which extend slightly in parallel are formed in the handle portion 108b of the frame member 108. The inner end sides of the suction long holes 120 and 122 on both side portions communicate with the inner space surrounded by the annular portion 108a of the frame member 108. Therefore, in the assembled state of the non-contact suction pad 100, the suction long holes 120, 122 are in a sealed space (second closed space) between the disk portion of the pad holder 104 and the disk portion of the base 106. .

Further, in the non-contact absorbing disk 100 of the present embodiment, a plurality of reinforcing members are disposed in a sealed space (second sealed space) between the disk portion of the spacer holder 104 and the disk portion of the base 106. Member 126. The reinforcing member 126 has a slightly the same thickness as the frame member 108. As a result, in the assembled state of the non-contact absorbing tray 100, the reinforcing member 126 is held between the lower surface of the disc portion 104a of the lining holder 104 and the upper surface of the disc portion 106a of the base 106, and the lining support When the sealed space (second closed space) between the disk portion 104a of the tool 104 and the disk portion 106a of the base 106 is decompressed, the reinforcing member that collapses in the thickness direction is suppressed as the sealed space (second sealed space). The function.

Further, the non-contact absorbing disk 100 of the present embodiment is provided with an upper plate 128 and lower plate 130. The upper plate 128 and the lower plate 130 have a rectangular shape which is slightly the same as the pad support 104, the base 106, and the handle portions 104b, 106b, and 108b of the frame member 108. In the assembled state of the non-contact absorbing plate 100, The handle portions 104b, 106b, and 108b are sandwiched up and down.

The upper plate 128 and the lower plate 130 have screw holes 132 at four corners. 134. The screw holes are screw holes 136 corresponding to the four corners of the handle portions 104b, 106b, and 108b of the pad holder 104, the base 106, and the frame member 108 in the assembled state of the non-contact suction pad 100. 138 and 140 are aligned in the up-and-down direction, and screws (not shown) are inserted into the screw holes 132, 136, 138, 140, and 134 to hold the laminated handle by the upper plate 128 and the lower plate 130. Portions 104b, 106b, and 108b.

Two suction openings penetrating in the thickness direction are formed on the lower plate 130 142, 144, and a pressurized opening 146. The suction openings 142, 144 formed on the side are formed in the assembled state of the non-contact suction pad 100, and are formed on the handle portion 108b of the frame member 108 via the suction passages 148, 150 of the handle portion 106b penetrating the base 106. The long holes 120, 122 are attracted, and communicate with the closed space (second closed space) between the disk portion of the pad support 104 and the disk portion of the base 106.

On the other hand, the pressurized opening 146 is attached to the non-contact absorbing tray 100. In the assembled state, the outer side portion of the pressurizing long hole 124 formed in the handle portion 108b of the frame member 108 is communicated via the pressurizing passage 152 penetrating the handle portion 106b of the base 106.

Further, the inner side (annular portion side) of the pressurizing long hole 124 is not In the assembled state in contact with the suction pad 100, the pressure passage 154 of the handle portion 104b of the spacer support 104 is disposed through the pad support 104. A sealed space (first sealed space) formed between the upper surface and the lower surface of the porous pad 102.

In use, the external compressed air source is introduced from the pressurized opening 146 In the case of pressurized air, the pressurized air flows into a sealed space (first sealed space) formed between the upper surface of the spacer support 104 and the lower surface of the porous pad 102, and is ejected from the front surface through the pores of the porous pad 102.

On the other hand, from the suction opening by simultaneous introduction with pressurized air The vacuum suction by 142 and 144 causes the workpiece to be floated on the front surface (adsorption surface) of the porous mat 102 to be attracted by the respective suction holes 109 of the porous mat 102, and is adsorbed and fixed only to the pressurized air. The buoyancy caused by the buoyancy and the attraction caused by the vacuum suction are at a predetermined distance G from the adsorption surface 8a.

Buoyancy caused by adjusting pressurized air (air volume and air pressure) In addition to the attraction of the vacuum suction, the workpiece can be adsorbed and fixed to the adsorption surface in a non-contact state in a state where the non-contact suction disk 100 is inverted, that is, the adsorption surface of the porous pad 102 faces downward. Lower side.

Further, in the disc portion 104a of the pad holder 104, the frame structure The annular portion 108a of the member 108 and the disk portion 106a of the base 106 are each formed with a plurality of positioning holes 156 aligned with the positioning holes 110 of the porous pad 102 in the assembled state of the non-contact suction pad 100, 158, 160.

When assembling the non-contact absorbing plate 100, the positioning holes 110, 156, 158, 160 alignment, the porous pad 102, the disk portion 104a of the pad holder 104, the annular portion 108a of the frame member 108, and the disk portion 106a of the base 106 are laminated, and the insertion portion (not shown) The porous pad 102, the pad holder 104, the frame member 108, and the base 106 are inserted into each other to be aligned with the aligned positioning holes 110, 156, 158, and 160, and the members are joined and fixed.

Furthermore, the lancet has a protrusion above the front surface of the porous pad 102. The length is not removed after the non-contact suction cup 100 is assembled, and the workpiece that has been adsorbed on the front surface of the porous mat 102 is prevented from slipping from the front surface of the porous mat.

The present invention is not limited to the foregoing embodiment, and is in the scope of patent application. Changes and changes can be made within the scope of the technical ideas described.

In the non-contact adsorption disk according to the first embodiment, the suction hole 8 is provided in a lattice shape on the disk-shaped porous pad 2. However, as shown in Fig. 22, a disk-shaped porous pad may be used. 2' is a porous pad in which the suction holes 8 are arranged annularly.

Further, as shown in Figs. 23 and 24, a plurality of suction holes 8" may be arranged in a lattice or a ring shape on the rectangular porous pad 2". At this time, a rectangular pad support 4" or the like is used.

In the examples of the above-described Figs. 22 to 24, the positions of the suction holes (vent holes) of the porous mat and the through holes of the spacer support are appropriately changed in accordance with the positions of the suction holes of the porous mat.

Further, in the above embodiment, the first sealed space is a pressurized space, and the second sealed space is a reduced pressure space. However, the pressurized portion and the reduced pressure portion may be replaced, and the first sealed space may be used as a reduced pressure space. The second sealed space is configured as a pressurized space.

Further, in the first embodiment described above, the base groove 22 having a rectangular cross section is formed in a lattice shape on the flat upper surface of the chassis 6, and the base groove 22 is a second sealed space. That is, an island-like projecting portion which is the same as the island-like projecting portion 16 on the upper surface of the pad holder 4 is formed between the lattice-like base grooves 22. to make. However, as shown in Fig. 25, the entire upper surface of the base 6' may be a recess, and the second sealed space 22' which is not partitioned by the island-shaped projecting portion may be formed.

1‧‧‧ Non-contact suction tray

2‧‧‧Porous mat

2a‧‧‧ positive

4‧‧‧Cushion support

6‧‧‧Base

8‧‧‧Attraction hole (ventilation hole)

10‧‧‧Link hole

12‧‧‧ Uplift

14‧‧‧ trench

16‧‧‧Protruding

18‧‧‧Contact holes

20‧‧‧ pressurized air inlet

22‧‧‧Base groove

24‧‧‧vacuum hole

Claims (6)

A non-contact absorbing plate for adsorbing a thin plate-shaped adsorbate in a non-contact state, comprising: a plate-shaped porous pad, wherein a plurality of vent holes extending in a thickness direction are formed in the adsorption fixing region; The first sealed space is adjacent to a space for pressurizing air disposed on a back surface of the porous mat; the second sealed space is a space for decompression separated from the first sealed space; and the communication means is configured to a sealed space communicating with the vent hole; a plate-shaped support member having a positive-area layer on a back side of the porous mat and having a recess, the recess being formed between the recess and the back surface of the porous mat a sealed space; and a base, the laminated layer is formed on the back side of the support member, and the second sealed space is formed between the back surface of the support member, and the support member includes a through hole, and the through hole is connected at one end of the laminated layer a vent hole of the porous pad, and an opening formed at the other end of the support member as a function of the aforementioned communication means; and a plurality of island-shaped protrusions, the island-like The outlet portion has a flat top portion, and is connected to the back surface of the porous pad at a position on the back end side of the plurality of vent holes, and the through hole extends through the protruding portion, and the space between the protruding portions becomes the aforementioned The first confined space. The non-contact suction disk according to claim 1, comprising a plate-shaped support member, the laminated layer being provided on the back side of the porous pad, and having the porous material The through hole corresponding to the vent hole of the pad further includes a base, and the laminated layer is formed on the back side of the support member, and a second sealed space is formed between the back surface of the support member, and a recess is formed on the back surface of the porous pad. The first sealing space is formed between the recess and the support member, and the vent hole of the porous pad is coupled to the through hole of the holder to function as the communication means. The non-contact suction disk according to claim 2, further comprising: a frame member having an annular portion disposed between the support member and the base, wherein the second sealed space is formed by the ring The internal space of the shape is formed. The non-contact absorbing plate according to the second or third aspect of the invention, wherein a plurality of island-shaped protruding portions are provided in the recess of the porous pad, and the island-shaped protruding portions are provided with The flat top of the front surface of the support member, the vent hole of the porous pad is inserted through the island-shaped protruding portion. The non-contact suction disk according to any one of claims 1 to 3, wherein the vent hole is dispersedly disposed on the entire front surface of the porous pad. The non-contact absorbing disk according to any one of claims 1 to 3, wherein the porous mat is formed of porous carbon.