CN106444299B - A kind of DMD structures multiaxis may move light path direct write exposure machine - Google Patents

A kind of DMD structures multiaxis may move light path direct write exposure machine Download PDF

Info

Publication number
CN106444299B
CN106444299B CN201611025071.2A CN201611025071A CN106444299B CN 106444299 B CN106444299 B CN 106444299B CN 201611025071 A CN201611025071 A CN 201611025071A CN 106444299 B CN106444299 B CN 106444299B
Authority
CN
China
Prior art keywords
stomata
light path
direct write
exposure machine
dmd
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201611025071.2A
Other languages
Chinese (zh)
Other versions
CN106444299A (en
Inventor
李显杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Yingsu integrated circuit equipment Co., Ltd
Original Assignee
JIANGSU YINGSU PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGSU YINGSU PHOTOELECTRIC TECHNOLOGY Co Ltd filed Critical JIANGSU YINGSU PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority to CN201611025071.2A priority Critical patent/CN106444299B/en
Publication of CN106444299A publication Critical patent/CN106444299A/en
Application granted granted Critical
Publication of CN106444299B publication Critical patent/CN106444299B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention discloses a kind of DMD structures multiaxis may move light path direct write exposure machine, belong to direct write exposure technique field.The DMD structures multiaxis of the present invention may move light path direct write exposure machine, and mainly vacuum cup structure is improved, when solve thing problems, such as to produce platelet due to gas leakage and caused by suction deficiency.Further, the gas cell distribution on sucker for it is middle dredge, it is four careful, effectively prevented the problem of board edge tilts, saved stomata quantity, reduce cost.The DMD structures multiaxis of the present invention may move light path direct write exposure machine, can produce 55 inches of super large plate;And multigroup moving parts are connected below sucker, the kinematic axis of multigroup moving parts is synchronized with the movement, and improves exposure accuracy and the stability of operation.Meanwhile subregion contraposition focus method improves and may insure that image exposure position is accurate, image exposure understands.

Description

A kind of DMD structures multiaxis may move light path direct write exposure machine
Technical field
The present invention relates to a kind of DMD structures multiaxis may move light path direct write exposure machine, belong to direct write exposure technique field.
Background technology
PCB (printed circuit board (PCB)) is the supporter of electronic component, while is also the carrier of electronic component electrical connection. Common PCB production equipments have traditional exposure machine, polygon prism structure laser direct-writing exposure machine, the exposure of DMD structures laser direct-writing Machine etc..Image directly can be imaged by laser direct-writing exposure machine on pcb board, relative to traditional exposure machine, it is not necessary to use The film, the image of formation are apparent.
With functional requirement more and more higher of the market to pcb board, pcb board also becomes to become increasingly complex, and system compatibility is got over It is high, it is sometimes necessary to the very big substrate of size, still, 48 inches of super large plate to be more than for width, is not had also in the prior art The technology and equipment that can be processed with high quality.Traditional exposure machine can produce super large plate, but its machining accuracy is poor, does not reach The requirement of high density, thin space;Polygon prism structure laser direct-writing exposure machine can not realize the movement of light path, whole plate necessary one at present Secondary shaping, when processing is more than 48 inches of super large plates, its equipment complete machine width is up to more than 3m, and equipment size is excessively huge, It is difficult to the door by general workshop, it is very heavy;Therefore polygon prism structure LDI can not produce the pcb board of more than 48 inches of width. Conventional DMD structure laser direct-writing exposure machines, because the size Breadth Maximum that its sucker can expose is only 24 inches, therefore also without Super large plate of the method production more than 48 inches.
If the method for the size that can be exposed by increasing sucker prepares DMD structure laser direct-writing exposure machines, by institute The vacuum cup size needed is bigger, and sometimes more than 55 inches, there are the following problems for meeting:(1) when the pcb board exposed When actual size is smaller, and sucker structure supports larger vacuum range, the region for being not covered with plank, can produce Lou Gas, influence absorption of the sucker to substrate;(2) tilted due to might have corner during substrate transport, if pull of vacuum is inadequate, Sucker, which can not inhale plank, puts down, and influences whether to expose the quality of pcb board, substrate can be caused to scrap.To solve this problem, at present Method have three kinds:
Method one:Directly ignore the problem, but can require very high to client factory pcb board, plank not usually, can back and forth Return and plank is bent manually, have a strong impact on production efficiency.
Method two:For various sizes of plank, different sucker backing plates is designed.The hole covering model of vacuum is inhaled on backing plate Enclose, it is in the same size with plank.This method is simple, and operation is somewhat troublesome, but when producing 55 inches of plank, it is necessary to change 55 inches of backing plate, difficulty are multiplied, and change the time of backing plate, can increase by 150%~200%, have a strong impact on production efficiency.
Method three:Do not covered for plank and vacuumize region, blocked with article, conventional is to cut the used film. This method very economical material benefit, but it is pretty troublesome, and different size of pcb board is, it is necessary to the film be cut into different sizes, for a long time Get off, the film accumulation after the cutting of board producing region can be caused, the size for finding needs also bothers.
As can be seen here, generally use changes the suitable sucker of size in the prior art or searching shape size is suitably useless The film is abandoned to block the mode of air leakage point, can all substantially reduce production efficiency.
In addition, in PCB factories, large-sized plank such as 52*40 inches is very big, carries trouble, it is possible to cause plank Generation partial loop variation;When plank is very thin, plank can typically be broken manually flat;Plank is thicker, such as more than 3mm, after deformation Recover relatively difficult.In addition, when actual exposure produces, substrate is to be positioned over by artificial dragging on sucker, during this not It may accomplish completely accurately, more or less all can have an anglec of rotation with electronics shelves image, can so be made in actual exposure The problems such as into image offset;3rd, in conventional exposure, CCD camera crawl sub- 4 hole positions in periphery of pcb board, according to 4 hole positions, lead to Cross CCD camera and find most clear focal plane, determine optimal focal plane and exposure focal length, complete to focus on, will be burnt with this in exposure process It is exposed on the basis of face, still, in practical situations both, plank will not be in preferable horizontal plane state, can in some regions It is able to can produce raised or recessed, whole substrate is in placement process it is possible that tilting, these situations can cause some regions Focused during exposure inaccurate, have a strong impact on the quality of production.
To sum up, current DMD structure laser direct-writing exposure machine presence can not produce super large plate, vacuum cup gas leakage, exposure During focusing and the problems such as position inaccurate it is urgently to be resolved hurrily.
The content of the invention
For problem above, the DMD structure multiaxises the invention provides vacuum cup and containing the vacuum cup may move Light path direct write exposure machine, focusing and positioning in super large plate, vacuum cup gas leakage, exposure process can not be produced to solve prior art The problems such as inaccurate.
First purpose of the present invention is to provide a kind of vacuum cup, the vacuum cup, including suction cup main body and vacuum Generating means;A number of stomata, each each one relay of correspondence in promoting the circulation of qi hole are distributed in suction cup main body in terms of rows and columns Device, each row stomata also each one relay of correspondence;Air vent switch is each connected between stomata and vacuum generating device;Stomata The relay and the relay of the stomata column that switch is expert at the stomata simultaneously are connected.
In one embodiment of the invention, the air vent switch is located at the vacuum that stomata is connected with vacuum generating device On pipeline.
In one embodiment of the invention, the relay is electromagnetic switch.
In one embodiment of the invention, the air vent switch is connected with master control device.
In one embodiment of the invention, the stomata is in middle thin, four careful distribution shapes in suction cup main body Formula.
In one embodiment of the invention, the line space of the stomata and column pitch are by suction cup main body centre to both sides In the form of uniformly successively decreasing.
In one embodiment of the invention, positioned at suction cup main body central region stomata line space or column pitch most Greatly 1-3 inches, positioned at the minimum 5-8mm of line space or column pitch of the stomata of suction cup main body fringe region.
In one embodiment of the invention, positioned at suction cup main body central region stomata line space or column pitch most Greatly 0.5-3.5 inches, positioned at the minimum 3-6mm of line space or column pitch of the stomata of suction cup main body fringe region.
In one embodiment of the invention, opening shape of the stomata in suction cup main body can be circular, ellipse The arbitrary shape such as circle, square, rectangle, for example, it is circular.Using square or rectangular opening shape, its opening edge The linear shape of edge, it is easier to being equally that the substrate edges that edge is linear agree with.
In one embodiment of the invention, aperture area of the stomata in suction cup main body is 10mm2~ 500mm2
In one embodiment of the invention, the Breadth Maximum of the suction cup main body is 55 inches.
In one embodiment of the invention, the card of the suction cup main body is integral card or by polylith card group Conjunction forms.
In one embodiment of the invention, the card of the suction cup main body is formed by two pieces of big disk assembleds of grade.
In one embodiment of the invention, the suction cup main body can be divided into chuck support structure and backing plate, also may be used With the integral structure that to be backing plate be integrated with chuck support structure.When suction cup main body is that chuck support structure and backing plate separate Structure when, backing plate is arranged on chuck support structure surface, and pad surfaces are designed with equally distributed stomata, be below backing plate with The vacuum air-channel of stomata connection.
Second object of the present invention is to provide the device of the vacuum cup containing the present invention.
In one embodiment of the invention, described device can be various types of exposure machines.
The removable light path of DMD structures multiaxis that third object of the present invention is to provide the vacuum cup containing the present invention is straight Write exposure machine.
In one embodiment of the invention, the DMD structures multiaxis, which may move light path direct write exposure machine, also includes branch Support structure, DMD structures, DMD structure steppings axle, multiple moving parts;Each moving parts include a scanning Y-axis and one rises Z axis drops;Vacuum cup is located above moving parts.
In the present invention, multiaxis refers to there are two or more moving parts, and moving parts are by a scanning Y-axis and a lifting Z Axle forms;It is removable, refer to that DMD structures can move with the sliding block of DMD structure stepping axles along guide rail;It is the multiple, refer to Two or more, including two.
In one embodiment of the invention, it is DMD structures that the DMD structures multiaxis, which may move light path direct write exposure machine, Twin shaft may move light path direct write exposure machine, contain two moving parts.
In one embodiment of the invention, the scanning Y-axis is below lifting Z axis;
In one embodiment of the invention, the lifting Z axis connection of the vacuum cup and moving parts.
In one embodiment of the invention, it is set up in parallel between the multiple moving parts along X-direction.
In one embodiment of the invention, the number of the multiple moving parts is two.
In one embodiment of the invention, the card of the suction cup main body of the vacuum cup be integral card or by Polylith disk assembled forms.When being formed by polylith disk assembled, every piece of card corresponds to one or more moving parts.
In one embodiment of the invention, the suction cup main body of the vacuum cup is by the size identical disk of left and right two Face, which merges, to be formed;Each corresponding moving parts of card.
In one embodiment of the invention, any connection is not taken between described two cards, or using ball pivot Chain structure connects, or using Hard link.
In one embodiment of the invention, the supporting construction is gantry structure.
In one embodiment of the invention, the DMD structures are arranged on DMD structure stepping axles, can be tied with DMD The sliding block of structure stepping axle moves along guide rail.
Fourth object of the present invention is to provide a kind of subregion contraposition focus method, especially vacuum cup of the invention DMD structures multiaxis may move a kind of subregion contraposition focus method of light path direct write exposure machine, to solve in production process due to putting The problem of positioning caused by the inaccurate deformation with plank of plate is forbidden and focusing is forbidden.
The subregion contraposition focus method of the present invention, i.e. 4 subregions focus on automatically and localization method, comprise the following steps:
(1) before exposure, after the coordinate of the positioning hole at four angles of CCD camera crawl pcb board, with electronics shelves graphic file In corresponding positioning hole coordinate be compared, establish the actual corresponding relation of electronics shelves figure and pcb board;If CCD camera The positioning hole coordinate of crawl is consistent with corresponding coordinate in electronics shelves graphic file, then carries out step (2);If CCD camera The positioning hole coordinate of crawl and corresponding coordinate in electronics shelves graphic file are inconsistent, then are adjusted electronics shelves graphic file Whole to be allowed to be consistent with the positioning hole coordinate of CCD camera crawl, the original position of light path exposure also determines therewith, continues Step (2);
(2) before exposure, it is M × N number of subregion by region division to be exposed;
(3) the optimal focal plane distance per four summits of sub-regions is calculated respectively;If the optimal focal plane on this four summits The maximum difference of distance is then used as this within the error range of permission using the average value of the optimal focal plane distance on this four summits The focal plane distance of subregion exposure;If the maximum difference of the optimal focal plane distance on this four summits is not in the error range of permission Within, then the subregion is further subdivided into A × B two level subregion, calculates the optimal of each four summits of two level subregion Focal plane distance, repeats this step, until the optimal focal plane distance in per sub-regions is in error range.
In one embodiment of the invention, light path exposes since original position, into different subregions at different levels When, if optimal focal plane distance is different, the optimum exposure focal plane of the subregion will be arrived by lifting Z axis adjustment height, so as to protect Demonstrate,prove all exposure areas to expose in optimal focal plane, ensure that the line width uniformity of whole plate, and exposure quality.
In one embodiment of the invention, the determination method of the optimal focal plane is:PCB is identified using CCD camera The aperture in the hole on plate, if the aperture recognized and the aperture of reality are inconsistent, by changing the height of lifting Z axis, phase up and down The diameter of machine ceaselessly identifying hole, find out after lifting Z axis moves complete stroke, it is high closest to the lifting shaft corresponding to actual diameter Degree, this height is exactly optimal focal plane corresponding to the hole.
Advantages of the present invention and effect:
(1) DMD structures multiaxis of the invention may move light path direct write exposure machine, and mainly vacuum cup structure is changed Enter.The vacuum cup of the present invention is the vacuum cup of automation, and chuck surface is distributed with a series of stomata, had above stomata When pcb board covers, stomata closed-circuit working, when there is no pcb board covering above stomata, stomata closure, it is small to efficiently solve production During plate, caused by due to gas leakage the problem of suction deficiency.Further, the gas cell distribution on sucker for it is middle dredge, it is four careful, Both so that different size of pcb board is when placing, there is stomata marginal portion all the time, effectively prevents the problem of board edge tilts, The place of too many stomata can not be needed to save stomata quantity in centre again, reduce cost, improve efficiency.
(2) DMD structures multiaxis of the invention may move light path direct write exposure machine, and exposure machine sucker width can be arranged to 55 Inch, can produce 55 inches of super large plate, at the same and can ensure high accuracy, high density, fine rule away from etc. demand;And connect below sucker Multigroup moving parts are connect, the kinematic axis of multigroup moving parts is synchronized with the movement, and improves exposure accuracy and the stability of operation, exposure For line spacing up to less than 30 microns, ill-exposed rate drops to less than 0.1%.
(3) subregion contraposition focus method provided by the invention, before pcb board exposure, 4 subregions is carried out and focuses on and determines Position, it can be ensured that image exposure position is accurate, can control bit errors below 12 microns, image exposure understands.
(4) DMD structures multiaxis of the invention may move light path direct write exposure machine, drive of the DMD structures in DMD structure stepping axles Under dynamic, it can in transverse direction move freely, extend horizontal exposure range, the flexible property of exposure be increased, not by stepping On the moving parts that axle is arranged below, avoid when doing more physical exercises component while moving, the motion being likely to occur in transverse direction is not Stationary problem, avoiding may bring exposure inaccurate, or even the situation of product rejection occurs;Using doing more physical exercises, component designs, Vacuum cup is possessed multiple strong points, sucker is had more preferable stability in motion process, while avoid unimodule from supporting The unstable problem of connection being likely to occur during larger sucker.
Brief description of the drawings
Fig. 1 is the vacuum cup structural representation of the present invention;Wherein, 1 suction cup main body, 3 stomatas, 4 relays, 6 master controls Device;
Fig. 2 is the vacuum generating device and stomata connection diagram of the vacuum cup of the present invention;Wherein, 2 vacuum fill Put, 5 air vent switch;
Fig. 3 is that traditional vacuum cup places the structural representation after substrate;Wherein, 14 substrate;
Fig. 4 is that the vacuum cup of the present invention places a kind of structural representation after substrate;
Fig. 5 is a kind of structural representation after the substrate position on the vacuum cup of the adjustment present invention;
Fig. 6 is that the DMD structures twin shaft of the vacuum cup containing the present invention may move light path direct write exposure machine;Wherein, 7 support Structure, 8DMD structures, 9DMD structure steppings axle, 10 vacuum cups;12 scanning Y-axis, 13 lifting Z axis;
Fig. 7 is image corresponding relation schematic diagram before contraposition;
Fig. 8 is image corresponding relation schematic diagram after contraposition;
Fig. 9 is subregion Focus Exposure region division schematic diagram;
Figure 10 is to repartition to divide schematic diagram behind exposure area.
Specific embodiment
DMD structures:A whole set of complete light path system using DMD as core devices, including LASER Light Source, DMD, optical frames The parts such as piece form.
PCB:Printed Circuit Board, printed circuit board (PCB), are important electronic units, are electronic components Supporter, it is the carrier of electronic component electrical connection.
Stepping axle:Light path is arranged on the motion parts of motor, for doing step motion.
Scan Y-axis:Also scan axis or Y-axis are, for doing the continuous scanning motion of constant speed.
Lift Z axis:Also lifting shaft or Z axis are, for controlling the lifting of sucker.
Sucker:For adsorbing, the objective table of fixed pcb board.
Here is that the present invention is specifically described.
Embodiment 1:Vacuum cup
The vacuum cup structure of the present invention is as shown in Figure 1-2.
Vacuum cup of the present invention, including suction cup main body 1 and vacuum generating device 2;In suction cup main body 1 in terms of rows and columns It is distributed a number of stomata 3, each each one relay 4 of correspondence in promoting the circulation of qi hole 3, each row stomata also each one relay of correspondence Device;Air vent switch 5 is each connected between stomata 3 and vacuum generating device 2;What air vent switch 5 was expert at the stomata simultaneously Relay connects with the relay of the stomata column.
Each relay is connected with master control device 6.Air vent switch is located at the vacuum tube that stomata is connected with vacuum generating device Lu Shang.The air vent switch can be electromagnetic switch.The stomata, can be uniformly distributed in suction cup main body.
Using such structure and connected mode, when vacuum cup works, a certain size substrate is placed on vacuum suction On disk, for the stomata row or stomata row for thering is substrate to cover, the relay path corresponding to the row or column;For certain stomata Speech, only when it is expert at and column corresponding to relay all make for path, the air vent switch of the stomata is just opened, and then Vacuum generating device and stomata UNICOM, stomata work.It is not closing by the air vent switch of substrate covering in the case of this State, so as to solve it is larger produce PCB using vacuum cup when existing leakage problem.
Embodiment 2:Vacuum cup
The vacuum cup of the present embodiment, it is made that and changes on the basis of the vacuum cup as shown in Figure 1-2 of embodiment 1 Enter.
The stomata 3 is in suction cup main body 1 in middle thin, four careful distribution forms.
Traditional vacuum cup, stomata is usually to use equally distributed form, may when producing less pcb board After substrate 14 is placed in suction cup main body, the lucky position in certain edge where substrate far from both sides stomata farther out (as shown in Figure 3) so that Cause the marginal portion to be tilted because there is no pull of vacuum, production is impacted.Dredged using this centre of the present invention, four After careful distribution form, as illustrated in figures 4-5, when smaller substrate is placed on vacuum cup, select substrate close to sucker Body rim is placed, now if the substrate edges of intermediate region are just from both sides stomata farther out in the suction cup main body, then It can select the substrate edges being moved in nearest a line or a row stomata and be allowed to cover just;Due to suction cup main body Surrounding stomata is closeer, and this movement will not cause phenomenon of another lateral edges of substrate from stomata farther out.
Alternatively, the line space of the stomata and column pitch by among suction cup main body to both sides in the form of uniformly successively decreasing.
Alternatively, positioned at suction cup main body central region stomata line space or column pitch be up to 1-3 inches, positioned at suction The minimum 5-8mm of line space or column pitch of the stomata of disc main body fringe region.Opening shape of the stomata in suction cup main body can To be the arbitrary shapes such as circle, ellipse, square, rectangle, for example, it is circular.Opening surface of the stomata in suction cup main body Product can be arbitrary, such as 10mm2~500mm2
Alternatively, the card of the suction cup main body is integral card or formed by polylith disk assembled.
Embodiment 3:DMD structures twin shaft may move light path direct write exposure machine
It is illustrated so that the DMD structures twin shaft containing two moving parts may move light path direct write exposure machine as an example.
As shown in fig. 6, it may move light path direct write exposure machine for the DMD structures twin shaft of the vacuum cup containing the present invention.
The DMD structures twin shaft, which may move light path direct write exposure machine, includes supporting construction 7, DMD structures 8, DMD structure steppings 9, one, axle or moving parts, vacuum cup 10;Each moving parts are by a scanning Y-axis 12 and 13 groups of a Z axis of lifting Into;Vacuum cup 10 is located above moving parts.
The DMD structures 8 are arranged on DMD structure steppings axle 9, can be as the sliding block of DMD structure steppings axle 9 is along guide rail Motion.The scanning Y-axis 12 is positioned at the lower section of lifting Z axis 13;The vacuum cup 10 is connected with the lifting Z axis 13 of moving parts. Vacuum cup, with scan Y-axis, lift Z axis 13 movement and corresponding change in location occurs.
Alternatively, the card of the suction cup main body of the vacuum cup is integral card.
Alternatively, it is set up in parallel between the multiple moving parts along X-direction, is uniformly distributed and is installed on vacuum cup 10 Lower section.By setting multiple moving parts, when producing larger pcb board, run simultaneously between each component, with single moving parts Compare, it is ensured that more preferable stability.
Alternatively, the multiple moving parts have 2.
Alternatively, the supporting construction is gantry structure.Framework for whole system supports, marble gantry structure Design feature can be very good to keep the stability of platform motion, and have good isolation property.
Embodiment 4:DMD structures twin shaft may move light path direct write exposure machine
It is illustrated so that the DMD structures twin shaft containing two moving parts may move light path direct write exposure machine as an example.
The DMD structures twin shaft of the present embodiment may move light path direct write exposure machine, is made that and changes on the basis of embodiment 3 Enter.
The card of the suction cup main body of the vacuum cup is formed by polylith disk assembled;Corresponding one or more of every piece of card Individual moving parts.
Alternatively, the suction cup main body of the vacuum cup is merged by the size identical card of left and right two and formed;Each disk The corresponding moving parts in face.
Any connection is not taken between two cards of the composition suction cup main body, or is connected using ball pivot chain structure, Or using Hard link.
To produce the pcb board of 55*40 inches, limited because domestic processing technology is horizontal, can not produce that precision is high, area is big Sucker, therefore can only take the mode of two pieces of sucker card splicings.In the present invention, two pieces of left and right sucker, respectively with some numbers The screw of amount is fixed on corresponding Z axis mounting surface, and then the connected mode between two pieces of suckers, can there is following 3 kinds:
(1) any connection is not taken between sucker, the simple precision for relying on the Y-axis of platform courses two.Advantage be it is simple in construction, It is economical and practical, when producing less than 24 inches of plank, it is only necessary to expose a sucker scope, it is not necessary to which two suckers are all It is exposed, production plank size is more flexible, closer to client's use demand.
(2) connected between sucker using ball pivot chain structure, two sucker Z-directions can have the inconsistent situation of slight height, Y Uniformity is realized by platform courses in the motion process of direction.Advantage is unlocked once there is some Y-axis, passes through the company of two suckers Connect, another Y-axis can be driven to unlock, effectively avoid the damage of plank.Because two Z axis difference in height conventional methods can not be surveyed accurately It is poor more or less all to have certain altitude to micron level for amount.This method can effectively reduce that Z axis is highly inconsistent to be caused Situations such as stuck during existing Z axis motion;
(3) Hard link is used between sucker, i.e., is fixed two suckers with modes such as screws.Advantage is that whether Y-axis is dashed forward So power-off, or Z axis are highly inconsistent, are scrapped all without plank is caused.
Above-mentioned three kinds of connection methods, according to actual conditions one way in which can be selected to be attached.
Embodiment 5:Picture portion aligns and focus method
In traditional exposure process, position is there may be when PCB substrate is placed on vacuum cup and puts not positive ask Topic, if as shown in fig. 7, directly the actual figure being exposed in PCB substrate on electronics shelves graph exposure to substrate, will be may result in Shape and electronics shelves figure are inconsistent, so as to cause plank quality bad or scrap.In addition, in traditional exposure process, entirely Substrate is exposed using same focal plane distance, is adjusted without focusing;But in practical situations both, substrate will not In preferable horizontal plane state, raised or recessed, whole substrate possibility in placement process may be produced in some regions Inclination occurs, it is inaccurate that these situations can cause some regions to be focused when exposing, and has a strong impact on the quality of production.
The subregion contraposition focus method of the present invention, i.e. 4 subregions focus on automatically and localization method, as is seen in figs 7-10, bag Include following steps:
(1) before exposure, after the coordinate of the positioning hole at four angles of CCD camera crawl pcb board, with electronics shelves graphic file In corresponding positioning hole coordinate be compared, establish the actual corresponding relation of electronics shelves figure and pcb board;If CCD camera The positioning hole coordinate of crawl is consistent with corresponding coordinate in electronics shelves graphic file, then carries out step (2);If CCD camera The positioning hole coordinate of crawl and corresponding coordinate in electronics shelves graphic file are inconsistent, then are adjusted electronics shelves graphic file Whole to be allowed to be consistent with the positioning hole coordinate of CCD camera crawl, the original position of light path exposure also determines therewith, continues Step (2);
(2) before exposure, it is M × N number of subregion by region division to be exposed;
(3) the optimal focal plane distance per four summits of sub-regions is calculated respectively;If the optimal focal plane on this four summits The maximum difference of distance is then used as this within the error range of permission using the average value of the optimal focal plane distance on this four summits The focal plane distance of subregion exposure;If the maximum difference of the optimal focal plane distance on this four summits is not in the error range of permission Within, then the subregion is further subdivided into A × B two level subregion, calculates the optimal of each four summits of two level subregion Focal plane distance, repeats this step, until the optimal focal plane distance in per sub-regions is in error range.
Light path exposes since original position,, will if optimal focal plane distance is different during into different subregions at different levels The optimum exposure focal plane of the subregion is arrived by lifting Z axis adjustment height, so as to ensure all exposure areas in optimal focal plane Exposure, ensure that the line width uniformity of whole plate, and exposure quality.
The determination method of the optimal focal plane is:Using the aperture in the hole on CCD camera identification pcb board, if recognize Aperture and the aperture of reality are inconsistent, by changing the height of lifting Z axis up and down, the diameter of camera ceaselessly identifying hole, find out Lift after Z axis moves complete stroke, closest to the lifting shaft height corresponding to actual diameter, this height be exactly corresponding to the hole most Good focal plane.
Although the present invention is disclosed as above with preferred embodiment, it is not limited to the present invention, any to be familiar with this skill The people of art, without departing from the spirit and scope of the present invention, it can all do various change and modification, therefore the protection model of the present invention Enclose being defined of being defined by claims.

Claims (6)

1. a kind of DMD structures multiaxis may move light path direct write exposure machine, it is characterised in that the DMD structures multiaxis may move light Road direct write exposure machine includes supporting construction, DMD structures, DMD structure steppings axle, multiple moving parts, vacuum cup;Each motion Component includes a scanning Y-axis and a lifting Z axis;Vacuum cup is located above moving parts;
The vacuum cup includes suction cup main body and vacuum generating device;A fixed number is distributed in suction cup main body in terms of rows and columns The stomata of amount, each each one relay of correspondence in promoting the circulation of qi hole, each row stomata also each one relay of correspondence;Each stomata with it is true Air vent switch is connected between empty generating means;The relay and the stomata column that air vent switch is expert at the stomata simultaneously Relay connection, the air vent switch is located on the vacuum line that stomata is connected with vacuum generating device;
For the stomata in middle thin, four careful distribution forms in suction cup main body, the opening shape of stomata is square or long Square, the card of the suction cup main body is integral card or formed by polylith disk assembled.
2. DMD structures multiaxis according to claim 1 may move light path direct write exposure machine, it is characterised in that positioned at sucker The line space or column pitch of the stomata of main body central region are up to 0.5-3.5 inches, positioned at the gas of suction cup main body fringe region The minimum 3-6mm of line space or column pitch in hole.
3. DMD structures multiaxis according to claim 1 may move light path direct write exposure machine, it is characterised in that the multiple It is set up in parallel between moving parts along X-direction.
4. DMD structures multiaxis according to claim 1 may move light path direct write exposure machine, it is characterised in that the vacuum The suction cup main body of sucker is merged by the size identical card of left and right two to be formed;Each corresponding moving parts of card.
5. DMD structures multiaxis according to claim 4 may move light path direct write exposure machine, it is characterised in that described two Any connection is not taken between card, either using the connection of ball pivot chain structure or using Hard link.
6. the subregion contraposition that a kind of any described DMD structures multiaxises of claim 1-5 may move light path direct write exposure machine focuses on Method, it is characterised in that the described method comprises the following steps:
(1) before exposure, after the coordinate of the positioning hole at four angles of CCD camera crawl pcb board, with phase in electronics shelves graphic file Corresponding positioning hole coordinate is compared, and establishes the actual corresponding relation of electronics shelves figure and pcb board;If CCD camera captures Positioning hole coordinate it is consistent with corresponding coordinate in electronics shelves graphic file, then carry out step (2);If CCD camera captures Positioning hole coordinate and corresponding coordinate in electronics shelves graphic file it is inconsistent, then being adjusted electronics shelves graphic file makes With CCD camera crawl positioning hole coordinate be consistent, light path exposure original position also determine therewith, continue step (2);
(2) before exposure, it is M × N number of subregion by region division to be exposed;
(3) the optimal focal plane distance per four summits of sub-regions is calculated respectively;If the optimal focal plane distance on this four summits Maximum difference within the error range of permission, then the sub-district is used as using the average value of the optimal focal plane distance on this four summits The focal plane distance of domain exposure;If the maximum difference of the optimal focal plane distance on this four summits not permission error range it It is interior, then the subregion is further subdivided into A × B two level subregion, calculates optimal Jiao on each four summits of two level subregion Identity distance is from repeating this step, until per the optimal focal plane distance in sub-regions in error range.
CN201611025071.2A 2016-11-22 2016-11-22 A kind of DMD structures multiaxis may move light path direct write exposure machine Active CN106444299B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611025071.2A CN106444299B (en) 2016-11-22 2016-11-22 A kind of DMD structures multiaxis may move light path direct write exposure machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611025071.2A CN106444299B (en) 2016-11-22 2016-11-22 A kind of DMD structures multiaxis may move light path direct write exposure machine

Publications (2)

Publication Number Publication Date
CN106444299A CN106444299A (en) 2017-02-22
CN106444299B true CN106444299B (en) 2017-12-12

Family

ID=58221308

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611025071.2A Active CN106444299B (en) 2016-11-22 2016-11-22 A kind of DMD structures multiaxis may move light path direct write exposure machine

Country Status (1)

Country Link
CN (1) CN106444299B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107024842B (en) * 2017-06-16 2018-11-13 深圳市前海野马自动化设备有限公司 A kind of automatic contraposition device and exposure sources and its exposure method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103545174A (en) * 2012-07-16 2014-01-29 无锡华润上华科技有限公司 Photoetching focusing parameter testing method and system
CN103869627A (en) * 2012-12-11 2014-06-18 上海微电子装备有限公司 Focusing and leveling method used for projection photoetching machine
CN104137247A (en) * 2012-02-28 2014-11-05 炭研轴封精工有限公司 Non-contact suction plate
CN105182699A (en) * 2015-09-30 2015-12-23 合肥芯碁微电子装备有限公司 Double-mesa laser direct writing exposure machine and control method therefor
CN206331230U (en) * 2016-11-22 2017-07-14 江苏影速光电技术有限公司 A kind of DMD structures multiaxis may move light path direct write exposure machine

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060032037A1 (en) * 2004-08-13 2006-02-16 Dar-Wen Lo [assembling method and device thereof]
KR20140127438A (en) * 2013-04-24 2014-11-04 삼성디스플레이 주식회사 Substrate absorption device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104137247A (en) * 2012-02-28 2014-11-05 炭研轴封精工有限公司 Non-contact suction plate
CN103545174A (en) * 2012-07-16 2014-01-29 无锡华润上华科技有限公司 Photoetching focusing parameter testing method and system
CN103869627A (en) * 2012-12-11 2014-06-18 上海微电子装备有限公司 Focusing and leveling method used for projection photoetching machine
CN105182699A (en) * 2015-09-30 2015-12-23 合肥芯碁微电子装备有限公司 Double-mesa laser direct writing exposure machine and control method therefor
CN206331230U (en) * 2016-11-22 2017-07-14 江苏影速光电技术有限公司 A kind of DMD structures multiaxis may move light path direct write exposure machine

Also Published As

Publication number Publication date
CN106444299A (en) 2017-02-22

Similar Documents

Publication Publication Date Title
CN106325007B (en) A kind of more turntable driving axles may move polygon prism light path direct write equipment
CN105620050A (en) High-precision galvanometer error self-correcting device and high-precision galvanometer error self-correcting method based on machine vision
CN112697112B (en) Method and device for measuring horizontal plane inclination angle of camera
EP3264178B1 (en) Mask transmission device and transmission method
CN106444299B (en) A kind of DMD structures multiaxis may move light path direct write exposure machine
CN108406120A (en) The method and apparatus of laser carving through-hole is carried out to spray painting carbon fiber skin
CN105388707A (en) Drawing apparatus
CN104460237A (en) Position measuring apparatus, alignment apparatus, pattern drawing apparatus, and position measuring method
CN111830795A (en) Tool and method for detecting micro-bubbles in immersion flow field of immersion lithography machine
CN206331236U (en) A kind of many turntable driving axles may move polygon prism light path direct write equipment
JP2005085973A (en) Cutting device
CN106444298B (en) A kind of DMD structures single shaft fixed light path direct write exposure machine
CN206249004U (en) A kind of removable light path direct write exposure machine of DMD structures XY multiaxises
CN206331230U (en) A kind of DMD structures multiaxis may move light path direct write exposure machine
JP2020017653A (en) Alignment method
CN206249003U (en) A kind of removable light path direct write exposure machine of DMD structures XY single shafts
CN206649281U (en) A kind of more turntable driving axles fix polygon prism light path direct write equipment
CN207764553U (en) A kind of DMD structures single shaft fixed optical path direct write exposure machine
CN206331232U (en) A kind of many turntable driving axles of XYZ may move polygon prism light path direct write equipment
CN206331231U (en) A kind of single sweep drive shaft may move polygon prism light path direct write equipment
KR101552923B1 (en) Exposure apparatus
CN108303853A (en) A kind of removable light path direct write exposure machine of DMD structures XY multiaxises
CN206331235U (en) A kind of DMD structures single shaft may move light path direct write exposure machine
JP4436641B2 (en) Alignment method in cutting equipment
CN206363074U (en) A kind of single sweep drive shaft fixes polygon prism light path direct write equipment

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 221000 west side of Hengshan Road, Pizhou City, Xuzhou City, Jiangsu Province

Patentee after: Jiangsu Yingsu integrated circuit equipment Co., Ltd

Address before: 221300 Huashan Road, Pizhou Economic Development Zone, Jiangsu, China, Xuzhou

Patentee before: JIANGSU YINGSU PHOTOELECTRIC TECHNOLOGY Co.,Ltd.