TWI665146B - Non-contact transferring device and non-contact suction plate - Google Patents
Non-contact transferring device and non-contact suction plate Download PDFInfo
- Publication number
- TWI665146B TWI665146B TW104143334A TW104143334A TWI665146B TW I665146 B TWI665146 B TW I665146B TW 104143334 A TW104143334 A TW 104143334A TW 104143334 A TW104143334 A TW 104143334A TW I665146 B TWI665146 B TW I665146B
- Authority
- TW
- Taiwan
- Prior art keywords
- contact
- flow path
- pressurized gas
- gas flow
- chuck
- Prior art date
Links
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manipulator (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
Abstract
本發明提供一種可細微地控制工件之非接觸吸著狀態的非接觸搬送裝置及非接觸吸著盤等的非接觸吸著裝置。 The present invention provides a non-contact transfer device capable of finely controlling a non-contact suction state of a workpiece, and a non-contact suction device such as a non-contact suction plate.
根據本發明,可提供一種非接觸搬送裝置,是將薄板狀的工件以非接觸狀態吸著而加以搬送,該非接觸搬送裝置係具備:沿著搬送方向排列的第1及第2非接觸吸著盤,第1及第2非接觸吸著盤分別具備:矩形的多孔質墊,呈格子狀地配置有朝厚度方向貫穿而延伸的複數個吸引孔;以及矩形的保持器,與多孔質墊的背面連結,在表面形成有格子狀的加壓氣體流路,以及由加壓氣體流路劃分之排列成格子狀的複數個島狀部分,並且具備與吸引孔相對應設置且朝厚度方向貫穿島狀部分而延伸的連通孔,與多孔質墊連結時,係以連通孔與多孔質墊之吸引孔連通的狀態,使島狀部分之頂面密接在多孔質墊之背面,配置在搬送方向上游側的第1非接觸吸著盤的保持器之格子狀的加壓氣體流路,係在與配置在搬送方向下游側的第2非接觸吸著盤的連接區域中,至少一部份以配置成朝向與搬送方 向正交的方向延伸的端部寬方向流路為終端。 According to the present invention, it is possible to provide a non-contact conveying device that sucks and transports a thin plate-shaped workpiece in a non-contact state, and the non-contact conveying device includes first and second non-contact suctions arranged along a conveying direction. The first and second non-contact suction pads each include a rectangular porous pad having a plurality of suction holes extending in a thickness direction and arranged in a grid pattern, and a rectangular holder and a porous pad. The back side is connected, and a grid-shaped pressurized gas flow path is formed on the surface, and a plurality of island-shaped portions arranged in a grid shape are divided by the pressurized gas flow path. When the communication hole extending from the shape part is connected to the porous pad, the top surface of the island-shaped part is closely contacted with the back surface of the porous pad in a state where the communication hole communicates with the suction hole of the porous pad, and is arranged upstream of the conveying direction. The grid-like pressurized gas flow path of the holder of the first non-contact chuck on the side is connected to at least a part of the connection area with the second non-contact chuck on the downstream side of the conveying direction. Arranged in the conveying direction toward the The wide flow path at the end portion extending in the orthogonal direction is terminated.
Description
本發明是關於非接觸搬送裝置及非接觸吸著盤,更詳言之是關於一種以非接觸狀態搬送薄板狀的工件的非接觸搬送裝置、以及以非接觸狀態吸著薄板狀的工件的非接觸吸著盤。 The present invention relates to a non-contact conveying device and a non-contact chuck, and more particularly, to a non-contact conveying device for conveying a thin-plate-like workpiece in a non-contact state, and a Touch the chuck.
就使半導體晶圓、FPD用玻璃基材等厚度較薄的工件懸浮而進行處理的非接觸吸著裝置而言,已知有引用文獻1的懸浮台。該懸浮台是在多孔質板的表面同時進行利用加壓空氣的工件之懸浮以及利用吸引的工件之非接觸吸著,藉此使工件在多孔質板上懸浮而加以搬送等。 As a non-contact chuck device for suspending and processing a thin workpiece such as a semiconductor wafer and a glass substrate for FPD, a levitation table cited in Document 1 is known. The suspension table is used for suspending a workpiece by pressurized air and non-contact suction by sucking the workpiece at the same time on the surface of the porous plate, thereby suspending the workpiece on the porous plate and transferring it.
又,就其他的非接觸吸著裝置而言,已知有引用文獻2的非接觸吸著盤。該非接觸吸著盤是在多孔質板的表面同時進行加壓空氣的噴出及吸引,以實現使薄板狀工件在多孔質板上懸浮並加以保持的非接觸吸著。 In addition, as another non-contact chuck device, a non-contact chuck disk cited in Document 2 is known. The non-contact chuck is a non-contact chuck in which a thin plate-like workpiece is suspended and held on a porous plate while pressurized air is sprayed and sucked on the surface of the porous plate simultaneously.
這些非接觸吸著裝置及非接觸吸著盤由於可不傷害薄板狀工件地使其懸浮而加以搬送或保持等,因此是在加工FPD用玻璃基材等的薄板狀工件時相當有效的 裝置。 These non-contact chuck devices and non-contact chucks are effective for processing thin plate-shaped workpieces, such as glass substrates for FPD, because they can be transported or held without damaging the thin plate-shaped workpiece. Device.
[專利文獻1]日本特開2007-27495號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2007-27495
[專利文獻2]日本專利第5512052號公報 [Patent Document 2] Japanese Patent No. 5512052
上述專利文獻1所記載的懸浮台(非接觸搬送裝置)是用來搬送LCD用玻璃基板等的薄板狀工件,但是搬送距離短,而且是由一片多孔質板形成。因此,在使用如上述的懸浮台長距離地搬送薄板狀工件,或是搬送大尺寸的薄板狀工件時,必須將複數片多孔質板在搬送方向連續並列而配置。 The levitation table (non-contact transfer device) described in the above-mentioned Patent Document 1 is used to transfer a thin plate-shaped workpiece such as a glass substrate for LCD, but the transfer distance is short and it is formed of a single porous plate. Therefore, when a thin plate-like workpiece is transported over a long distance using a suspension table as described above, or a large-sized thin plate-like workpiece is transferred, a plurality of porous plates must be continuously arranged in parallel in the transfer direction.
然而,這種構造中,工件在從上游側的多孔質板朝向下游側的多孔質板移送時,在朝搬送方向並列配置的兩片多孔質板的連接部位,會有工件的前端會向下方位移之情況。 However, in this structure, when the workpiece is transferred from the upstream porous plate to the downstream porous plate, the front end of the workpiece may be directed downward at the connection portion of the two porous plates arranged side by side in the conveying direction. Case of displacement.
由於這種下方位移之情況,會產生工件本身變形以致工件無法順利移送至下游側的多孔質板上等的問題。尤其,在厚度未滿0.5mm的超薄工件中,這種問題尤為顯著。 Due to such a downward displacement, there is a problem that the workpiece itself is deformed so that the workpiece cannot be smoothly transferred to the porous plate on the downstream side. This problem is particularly significant in ultra-thin workpieces with a thickness of less than 0.5 mm.
又,專利文獻2所記載的非接觸吸著盤係如上所述,使LCD用玻璃基板等的薄板狀工件在多孔質板上 懸浮並加以保持。 In addition, as described above, the non-contact chuck disk described in Patent Document 2 has a thin plate-shaped workpiece such as a glass substrate for LCD on a porous plate. Suspend and keep.
然而,上述非接觸吸著盤並無法改變從多孔質板的表面噴出的加壓空氣的噴出形態。亦即,無法局部改變從多孔質板的表面噴出的加壓空氣的噴出狀態。因此只能使薄板狀工件以同一狀態懸浮。具體而言,例如,無法使同一薄板狀工件以平板狀、凸形狀或凹形狀等不同的形狀懸浮並加以保持。 However, the above-mentioned non-contact chuck cannot change the ejection form of the pressurized air ejected from the surface of the porous plate. That is, the ejection state of the pressurized air ejected from the surface of the porous plate cannot be locally changed. Therefore, only thin plate-like workpieces can be suspended in the same state. Specifically, for example, the same thin plate-like workpiece cannot be suspended and held in different shapes such as a flat plate shape, a convex shape, or a concave shape.
亦即,習知技術的非接觸搬送裝置、非接觸吸著盤等的非接觸吸著裝置並無法細微地控制工件的非接觸吸著狀態。 That is, the non-contact suction device of the conventional technology, such as a non-contact transfer device and a non-contact suction tray, cannot finely control the non-contact suction state of a workpiece.
本發明係鑑於這種問題點而完成者,其目的在於提供一種可細微地控制工件之非接觸吸著狀態的非接觸搬送裝置及非接觸吸著盤等的非接觸吸著裝置。 The present invention has been made in view of such problems, and an object thereof is to provide a non-contact conveying device capable of finely controlling a non-contact suction state of a workpiece, and a non-contact suction device such as a non-contact suction plate.
詳言之,本發明係為了解決上述問題而完成者,其目的在於提供一種非接觸搬送裝置,其係具備朝搬送方向連續排列複數片多孔質板的構造,同時工件朝向下游側的多孔質板移送時,可抑制工件之前端部的下方位移。 Specifically, the present invention has been made in order to solve the above problems, and an object thereof is to provide a non-contact conveying device having a structure in which a plurality of porous plates are continuously arranged in a conveying direction, and a porous plate having a workpiece facing the downstream side. During the transfer, downward movement of the front end of the workpiece can be suppressed.
詳言之,本發明之另一目的在於提供一種非接觸吸著盤,可局部改變從多孔質墊的表面噴出的加壓空氣之噴出狀態。 Specifically, another object of the present invention is to provide a non-contact chuck which can locally change the state of the pressurized air ejected from the surface of the porous pad.
根據本發明,可提供一種非接觸搬送裝置,是將薄板狀的工件以非接觸狀態吸著並加以搬送,該 非接觸搬送裝置係具備沿著前述搬送方向排列的第1及第2非接觸吸著盤,前述第1及第2非接觸吸著盤分別具備:矩形的多孔質墊,呈格子狀地配置有朝厚度方向貫穿而延伸的複數個吸引孔;以及矩形的保持器,與前述多孔質墊的背面連結,在表面形成有格子狀的加壓氣體流路,以及由該加壓氣體流路劃分之排列成格子狀的複數個島狀部分,並且具備與前述吸引孔相對應而設置且朝厚度方向貫穿前述島狀部分而延伸的連通孔,與前述多孔質墊連結時,係以前述連通孔與前述多孔質墊的吸引孔連通的狀態,使前述島狀部分之頂面密接在前述多孔質墊之背面,配置在搬送方向上游側的前述第1非接觸吸著盤的保持器之格子狀的加壓氣體流路,係在與配置在搬送方向下游側的前述第2非接觸吸著盤的連接區域中,至少一部份以配置成朝向與前述搬送方向正交的方向延伸的端部寬方向流路為終端。 According to the present invention, it is possible to provide a non-contact conveying device that sucks and transports a thin-plate-like workpiece in a non-contact state. The non-contact transfer device includes first and second non-contact chucks arranged along the transfer direction, and the first and second non-contact chucks each include a rectangular porous pad arranged in a grid pattern. A plurality of suction holes extending through the thickness direction; and a rectangular holder connected to the back surface of the porous pad, a grid-shaped pressurized gas flow path is formed on the surface, and the pressurized gas flow path is divided by the pressurized gas flow path. A plurality of island-shaped portions arranged in a grid shape, and provided with corresponding communication holes provided in correspondence with the suction holes and extending through the island-shaped portions in a thickness direction, and connected to the porous pad by the communication holes and In a state where the suction holes of the porous pad are communicated, the top surface of the island-shaped portion is in close contact with the back surface of the porous pad, and the grid of the holder of the first non-contact suction pad arranged on the upstream side in the conveying direction is grid-like The pressurized gas flow path is connected to the second non-contact chuck disposed at the downstream side of the conveying direction, and at least a part of the pressurizing gas flow path is arranged to be orthogonal to the conveying direction. Extending in the width direction of the terminal end portion of the flow passage.
根據這種構造,可細微地控制工件的非接觸吸著狀態。詳言之,上游側的非接觸吸著盤的加壓氣體流路係在與下游側的非接觸吸著盤的連接區域中,是以配置成朝向與搬送方向正交的方向延伸的端部寬方向流路為終端。因此,薄板狀的工件係從第1非接觸吸著盤移送至第2非接觸吸著盤時,可藉由從第1非接觸吸著盤的端部寬方向流路送入連接區域的多孔質墊的細孔而在連接區域 從多孔質墊噴出的高壓氣體向上方頂起,可適當地控制工件的高度。 According to this structure, the non-contact suction state of the work can be finely controlled. In detail, the pressurized gas flow path of the non-contact chuck on the upstream side is an end portion arranged to extend in a direction orthogonal to the conveyance direction in the connection area with the non-contact chuck on the downstream side. The wide flow path is the end. Therefore, when a thin plate-shaped workpiece is transferred from the first non-contact chuck to the second non-contact chuck, the porous part can be fed into the connection area through a wide flow path from the end of the first non-contact chuck. Pores The high-pressure gas sprayed from the porous pad is pushed upward to appropriately control the height of the workpiece.
根據本發明的其他較佳樣態,前述第2非接觸吸著盤的保持器之格子狀的加壓氣體流路係在與前述第1非接觸吸著盤的連接區域中,至少一部份以配置成朝向前述搬送方向延伸的端部搬送方向流路為終端。 According to another preferred aspect of the present invention, at least a part of the grid-shaped pressurized gas flow path of the holder of the second non-contact chuck is connected to the first non-contact chuck. The end conveyance direction flow path arrange | positioned so that it may extend toward the said conveyance direction is a terminal.
根據這種構造,第2非接觸吸著盤在搬送方向最上游側的部分中,加壓氣體從多孔質墊的表面的噴出量變得比第1非接觸吸著盤之搬送方向最下游的部分中的加壓氣體的噴出量少,因此可抑制移送至第2非接觸吸著盤的工件過度向上方抬起。 According to this structure, the ejection amount of the pressurized gas from the surface of the porous pad in the portion of the second non-contact chuck on the most upstream side in the conveying direction is lower than the portion of the first non-contact chuck in the conveyance direction. Since the amount of the pressurized gas to be ejected is small, it is possible to prevent the workpiece transferred to the second non-contact chuck from being excessively lifted upward.
根據本發明之其他較佳樣態,前述第1非接觸吸著盤的保持器之格子狀的加壓氣體流路係在與前述第2非接觸吸著盤的連接區域中,至少一部份以配置成朝向前述搬送方向延伸的端部搬送方向流路為終端。 According to another preferred aspect of the present invention, at least a part of the grid-shaped pressurized gas flow path of the holder of the first non-contact chuck is in a connection area with the second non-contact chuck. The end conveyance direction flow path arrange | positioned so that it may extend toward the said conveyance direction is a terminal.
根據這種構造,第1非接觸吸著盤在搬送方向最下游側的部分中,加壓氣體從多孔質墊的表面的噴出量變得比第2非接觸吸著盤之搬送方向最上游的部分中的加壓氣體的噴出量少,因此可抑制移送至第2非接觸吸著盤的工件的前端過度向上方抬起。 According to this structure, the ejection amount of the pressurized gas from the surface of the porous pad in the portion of the first non-contact chuck on the most downstream side in the conveying direction is higher than that in the portion of the second non-contact chuck in the conveyance direction. Since the amount of the pressurized gas to be ejected is small, the tip of the workpiece transferred to the second non-contact chuck can be prevented from being excessively lifted upward.
根據本發明的其他較佳樣態,前述第2非接觸吸著盤的保持器之格子狀的加壓氣體 流路係在與前述第1非接觸吸著盤的連接區域中,至少一部份以配置成與前述搬送方向正交而延伸的端部寬方向流路為終端。 According to another preferred aspect of the present invention, the grid-like pressurized gas of the holder of the second non-contact chuck is described above. The flow path is at the end of at least a part of the connection region with the first non-contact chuck which is arranged at an end wide direction flow path which extends orthogonally to the conveying direction.
根據本發明的其他較佳樣態,前述第1非接觸吸著盤的保持器之格子狀的加壓氣體流路係在與前述第2非接觸吸著盤的連接區域中,至少一部份以配置成與前述搬送方向正交而延伸的端部寬方向流路為終端。 According to another preferred aspect of the present invention, at least a part of the grid-shaped pressurized gas flow path of the holder of the first non-contact chuck is in a connection area with the second non-contact chuck. A terminal wide-direction flow path arranged so as to extend orthogonal to the conveying direction is terminated.
根據本發明的其他較佳樣態,前述第1及第2非接觸吸著盤的保持器之格子狀的加壓氣體流路係具備交互配置之以閉鎖的矩形部分為終端的部分以及以開放的矩形部分為終端的部分,前述第1及第2非接觸吸著盤係配置成一方的非接觸吸著盤的前述加壓氣體流路之開放的矩形部分,沿著搬送方向,相對於另一方的非接觸吸著盤的前述加壓氣體流路之閉鎖的矩形部分整齊排列。 According to another preferred aspect of the present invention, the grid-shaped pressurized gas flow paths of the holders of the first and second non-contact chucks are provided with a closed rectangular portion as an end portion and an open portion The rectangular portion is the terminal portion. The first and second non-contact chucks are arranged as one open rectangular portion of the pressurized gas flow path of one non-contact chuck, along the transport direction, relative to the other. The closed rectangular portions of the pressurized gas flow path of one non-contact chuck are aligned in a regular manner.
根據本發明的其他較佳樣態,前述第1非接觸吸著盤的保持器係具備與前述加壓氣體流路分開的獨立加壓氣體流路。 According to another preferred aspect of the present invention, the holder of the first non-contact chuck is provided with an independent pressurized gas flow path separated from the pressurized gas flow path.
根據本發明的其他較佳樣態,前述第1非接觸吸著盤的獨立加壓氣體流路係在與前述第2非接觸吸著盤的連接區域中,設在前述加壓氣體流路的終端部的側緣側。 According to another preferred aspect of the present invention, the independent pressurized gas flow path of the first non-contact chuck is provided in the connection area with the second non-contact suction disc, and is provided in the pressurized gas flow path. The side edge side of the terminal part.
根據這種構造,便可使供應至獨立加壓氣 體流路的加壓空氣的流量、壓力等成為與供應至加壓氣體流路的加壓氣體的流量、壓力不同的值,因此在與第2非接觸吸著盤的連接區域中,可獨立控制從多孔質墊噴出的加壓氣體的流量等。 According to this structure, supply to independent pressurized gas can be made The flow rate, pressure, and the like of the pressurized air in the body flow path are different from the flow rate and pressure of the pressurized gas supplied to the pressurized gas flow path. Therefore, it can be independent in the connection area with the second non-contact chuck. The flow rate of the pressurized gas discharged from the porous pad is controlled.
根據本發明的其他較佳樣態,前述第2非接觸吸著盤的保持器係具備與前述加壓氣體流路分開的獨立加壓氣體流路。 According to another preferred aspect of the present invention, the holder of the second non-contact chuck is provided with an independent pressurized gas flow path separate from the pressurized gas flow path.
根據本發明的其他較佳樣態,前述第2非接觸吸著盤的獨立加壓氣體流路係在與前述第1非接觸吸著盤的連接區域中,設在前述加壓氣體流路的終端部的側緣側。 According to another preferred aspect of the present invention, the independent pressurized gas flow path of the second non-contact chuck is provided in the connection area with the first non-contact suction disc, and is provided in the pressurized gas flow path. The side edge side of the terminal part.
根據這種構造,便可使供應至獨立加壓氣體流路的加壓空氣的流量、壓力等成為與供應至加壓氣體流路的加壓氣體的流量、壓力不同的值,因此在與第1非接觸吸著盤的連接區域中,可獨立控制從多孔質墊噴出的加壓氣體的流量等。 According to this structure, the flow rate and pressure of the pressurized air supplied to the independent pressurized gas flow path can be made different from the flow rate and pressure of the pressurized gas supplied to the pressurized gas flow path. 1 In the connection area of the non-contact chuck, the flow rate and the like of the pressurized gas discharged from the porous pad can be independently controlled.
根據本發明的其他較佳樣態,前述多孔質墊係具備形成不同於前述吸引孔之吸引狀態的獨立吸引孔。 According to another preferred aspect of the present invention, the porous pad is provided with an independent suction hole formed in a suction state different from the suction hole.
根據本發明的其他較佳樣態,前述獨立吸引孔係配置在一方的非接觸吸著盤之與另一方的非接觸吸著盤的連接區域。 According to another preferred aspect of the present invention, the independent suction hole is disposed in a connection region between one non-contact chuck and the other non-contact chuck.
根據本發明的其他較佳樣態,前述第1及第2非接觸吸著盤配置成相互接觸。 According to another preferred aspect of the present invention, the first and second non-contact chucks are disposed in contact with each other.
根據本發明的其他較佳樣態,前述第1及第2非接觸吸著盤配置成相互分開。 According to another preferred aspect of the present invention, the first and second non-contact chucks are arranged to be separated from each other.
根據這種構造,從第1非接觸吸著盤移送至第2非接觸吸著盤時,工件的前端會向上方頂起,之後,在形成於第1及第2非接觸吸著盤之間的間隙,因為本身重量而向下方推壓,因此可在維持高度位置的狀態下移送至第2非接觸吸著盤。 According to this structure, when moving from the first non-contact chuck to the second non-contact chuck, the leading end of the workpiece is pushed upward, and then formed between the first and second non-contact chucks. The gap is pushed downward due to its own weight, so it can be transferred to the second non-contact suction plate while maintaining the height position.
根據本發明的其他較佳樣態,可提供一種非接觸吸著盤,是將薄板狀的工件以非接觸狀態吸著,該非接觸吸著盤係具備:矩形的多孔質墊,配置有在厚度方向貫穿而延伸的複數個吸引孔;以及保持器,與前述多孔質墊的背面連結,在表面形成有加壓氣體流路,以及由該加壓氣體流路劃分的複數個島狀部分,並且具備相對於前述吸引孔整齊排列且朝厚度方向貫穿前述島狀部分而延伸的連通孔,與前述多孔質墊連結時,係以前述連通孔與前述多孔質墊的吸引孔連通的狀態,使前述島狀部分之頂面密接在前述多孔質墊之背面,前述保持器更在前述表面形成有與前述加壓氣體流路分開的獨立加壓氣體流路。 According to another preferred aspect of the present invention, a non-contact chuck can be provided for absorbing a thin plate-shaped workpiece in a non-contact state. The non-contact chuck is provided with a rectangular porous pad arranged at a thickness of A plurality of suction holes extending in a direction; and a retainer connected to the back surface of the porous pad, a pressurized gas flow path formed on the surface, and a plurality of island-shaped portions divided by the pressurized gas flow path, and The communication holes are arranged in a regular manner with respect to the suction holes and extend through the island-like portion in the thickness direction. When connected to the porous pad, the communication holes communicate with the suction holes of the porous pad to connect the suction holes to the suction holes of the porous pad. The top surface of the island-shaped portion is in close contact with the back surface of the porous pad, and the retainer is formed with an independent pressurized gas flow path separated from the pressurized gas flow path on the surface.
根據這種構造,可細微地控制工件的非接觸吸著狀態。詳言之,可使加壓氣體流路內所供應的加壓空氣的壓力及/或流量與供應至獨立加壓氣體流路的加壓空氣的壓力及/或流量獨立。因此,可改變從多孔質墊的表面噴出的加壓空氣的流量分布。藉由該流量分布的改變, 便能以平板狀保持,或是以凸形狀或凹形狀保持同一形狀的薄板工件。 According to this structure, the non-contact suction state of the work can be finely controlled. Specifically, the pressure and / or flow rate of the pressurized air supplied in the pressurized gas flow path can be made independent of the pressure and / or flow rate of the pressurized air supplied to the independent pressurized gas flow path. Therefore, the flow rate distribution of the pressurized air sprayed from the surface of the porous pad can be changed. With this change in traffic distribution, It can be held in a flat plate shape, or a thin plate workpiece with the same shape in a convex shape or a concave shape.
根據本發明的其他較佳樣態,前述獨立加壓氣體流路係配置成與前述非接觸吸著盤的緣部相鄰。 According to another preferred aspect of the present invention, the independent pressurized gas flow path is arranged adjacent to an edge portion of the non-contact absorbing disk.
根據本發明的其他較佳樣態,前述多孔質墊係具備形成不同於前述吸引孔之吸引狀態的獨立吸引孔。 According to another preferred aspect of the present invention, the porous pad is provided with an independent suction hole formed in a suction state different from the suction hole.
根據本發明的其他較佳樣態,前述獨立加壓氣體流路係形成複數個,各獨立加壓氣體流路係相互分開。 According to another preferred aspect of the present invention, the aforementioned independent pressurized gas flow paths are formed in a plurality, and each of the independent pressurized gas flow paths is separated from each other.
根據本發明的其他較佳樣態,可提供一種具備上述非接觸吸著盤的非接觸搬送裝置。 According to another preferred aspect of the present invention, a non-contact conveying device including the above-mentioned non-contact chuck can be provided.
根據本發明的其他較佳樣態,相鄰配置的前述非接觸吸著盤係配置成前述緣部彼此相鄰。 According to another preferred aspect of the present invention, the non-contact chucks arranged adjacently are arranged so that the edges are adjacent to each other.
根據這種構造,在非接觸吸著盤彼此連接的區域附近,可與其他區域獨立地控制從多孔質墊的表面噴出的加壓空氣的量,因此可抑制搬送中的工件從一方的非接觸吸著盤移送至與其相鄰的另一方的非接觸吸著盤時發生的高度的變動等。 According to this structure, the amount of pressurized air sprayed from the surface of the porous pad can be controlled independently of other areas in the vicinity of the area where the non-contact chucks are connected to each other. Therefore, non-contact of the workpiece during transportation can be suppressed Changes in height, etc., that occur when the chuck is transferred to a non-contact chuck adjacent to the other side.
根據本發明,能夠提供一種可細微地控制工件的非接觸吸著狀態的非接觸搬送裝置及非接觸吸著盤 等的非接觸吸著裝置。 According to the present invention, it is possible to provide a non-contact conveying device and a non-contact suction disc capable of finely controlling a non-contact suction state of a workpiece. And other non-contact sorption devices.
又,根據本發明,可提供一種具備朝搬送方向連續排列複數片多孔質板的構造,且在工件移送至下游側的多孔質板之際,可抑制工件的前端部之下方位移的非接觸搬送裝置。 Furthermore, according to the present invention, it is possible to provide a non-contact conveyance structure having a structure in which a plurality of porous plates are continuously arranged in the conveying direction, and a downward displacement of a front end portion of a workpiece can be suppressed when a workpiece is moved to the downstream porous plate Device.
又再者,根據本發明,可提供一種可局部改變從多孔質墊的表面噴出的加壓空氣的噴出狀態的非接觸吸著盤。 Furthermore, according to the present invention, it is possible to provide a non-contact chuck capable of locally changing the state of ejection of the pressurized air ejected from the surface of the porous pad.
1‧‧‧非接觸吸著盤 1‧‧‧ non-contact chuck
2‧‧‧多孔質墊 2‧‧‧ porous pad
2a‧‧‧上表面 2a‧‧‧upper surface
4‧‧‧墊保持器 4‧‧‧ pad holder
6‧‧‧基座 6‧‧‧ base
8‧‧‧吸引孔 8‧‧‧ suction hole
8a‧‧‧小徑部 8a‧‧‧ Trail
8b‧‧‧大徑部 8b‧‧‧large diameter section
12‧‧‧立起部 12‧‧‧ Stand
14‧‧‧加壓氣體流路(溝槽) 14‧‧‧ Pressurized gas flow path (groove)
16‧‧‧島狀突起部 16‧‧‧ island-shaped protrusion
18‧‧‧連通孔 18‧‧‧ communication hole
20‧‧‧加壓空氣入口 20‧‧‧Pressurized air inlet
22‧‧‧基座溝槽 22‧‧‧ base groove
24‧‧‧真空孔 24‧‧‧Vacuum hole
30、30’‧‧‧非接觸搬送裝置 30, 30 ’‧‧‧ non-contact transfer device
32、32’‧‧‧第1非接觸吸著盤 32, 32’‧‧‧‧The first non-contact chuck
34、34’‧‧‧第2非接觸吸著盤 34, 34’‧‧‧ 2nd non-contact chuck
36‧‧‧端部寬方向流路 36‧‧‧End wide flow path
40、40’‧‧‧非接觸搬送裝置 40, 40 ’‧‧‧ non-contact transfer device
42、42’‧‧‧第1非接觸吸著盤 42, 42’‧‧‧‧The first non-contact chuck
44、44’‧‧‧第2非接觸吸著盤 44, 44 ’‧‧‧ 2nd non-contact chuck
46、46’‧‧‧端部寬方向流路 46, 46’‧‧‧ end wide flow path
50、50’‧‧‧非接觸搬送裝置 50, 50 ’‧‧‧ non-contact transfer device
52、52’‧‧‧第1非接觸吸著盤 52、52’‧‧‧‧The first non-contact chuck
54、54’‧‧‧第2非接觸吸著盤 54, 54 ’‧‧‧ 2nd non-contact chuck
56、56’‧‧‧端部寬方向流路 56, 56’‧‧‧ end wide flow path
58、58’‧‧‧端部搬送方向流路 58, 58’‧‧‧ end part direction flow path
60、60’、60”‧‧‧非接觸搬送裝置 60, 60 ’, 60” ‧‧‧ non-contact transfer device
62、62’‧‧‧第1非接觸吸著盤 62, 62 ’‧‧‧ the first non-contact chuck
62”、64”‧‧‧追加非接觸吸著盤 62 ”, 64” ‧‧‧ additional non-contact chucks
64、64’‧‧‧第2非接觸吸著盤 64, 64 ’‧‧‧ 2nd non-contact chuck
66、66’、66”‧‧‧端部寬方向流路 66, 66 ’, 66” ‧‧‧ end wide direction flow path
68、68’、68”‧‧‧端部搬送方向流路 68, 68 ’, 68” ‧‧‧ end-portal direction flow path
70、80、90‧‧‧非接觸搬送裝置(懸浮裝置) 70, 80, 90‧‧‧ non-contact transfer device (suspending device)
92‧‧‧第1非接觸吸著盤 92‧‧‧The first non-contact chuck
94‧‧‧第2非接觸吸著盤 94‧‧‧ 2nd non-contact chuck
96‧‧‧獨立加壓氣體流路 96‧‧‧ Independent pressurized gas flow path
98‧‧‧獨立吸引孔 98‧‧‧ Independent suction hole
100‧‧‧吸引溝槽 100‧‧‧ Attraction groove
102‧‧‧獨立加壓氣體流路 102‧‧‧ Independent pressurized gas flow path
104‧‧‧獨立加壓氣體流路 104‧‧‧ Independent pressurized gas flow path
106‧‧‧獨立加壓氣體流路 106‧‧‧ Independent pressurized gas flow path
108‧‧‧獨立加壓氣體流路 108‧‧‧ Independent pressurized gas flow path
120‧‧‧非接觸吸著盤 120‧‧‧ non-contact chuck
122‧‧‧多孔質墊 122‧‧‧Porous pad
124‧‧‧吸引孔 124‧‧‧ suction hole
126‧‧‧加壓氣體流路(溝槽) 126‧‧‧Pressurized gas flow path (groove)
128‧‧‧獨立加壓氣體流路 128‧‧‧ independent pressurized gas flow path
130‧‧‧非接觸吸著盤 130‧‧‧ Non-contact suction cup
132‧‧‧第1加壓氣體流路 132‧‧‧The first pressurized gas flow path
134‧‧‧第2加壓氣體流路 134‧‧‧Second pressurized gas flow path
136‧‧‧第1吸引孔 136‧‧‧1st suction hole
138‧‧‧第2吸引孔 138‧‧‧Second suction hole
140‧‧‧第3吸引孔 140‧‧‧3rd suction hole
第1圖是本發明之較佳實施形態的非接觸搬送裝置所使用的非接觸吸著盤的分解立體圖。 FIG. 1 is an exploded perspective view of a non-contact chuck used in a non-contact transfer device according to a preferred embodiment of the present invention.
第2圖是用來說明利用第1圖之非接觸吸著盤進行工件W之吸著固定(非接觸吸著)的狀態的示意剖面圖。 FIG. 2 is a schematic cross-sectional view for explaining a state in which the workpiece W is suction-fixed (non-contact-sucked) using the non-contact suction plate of FIG. 1.
第3圖是顯示本發明之第1實施形態的非接觸搬送裝置中的非接觸吸著盤的配置之圖。 Fig. 3 is a diagram showing the arrangement of a non-contact chuck in the non-contact transfer device according to the first embodiment of the present invention.
第4圖是顯示第1實施形態之變形例的非接觸搬送裝置中的非接觸吸著盤的配置之圖。 Fig. 4 is a diagram showing the arrangement of a non-contact chuck in a non-contact transfer device according to a modification of the first embodiment.
第5圖是顯示本發明之第2實施形態的非接觸搬送裝置中的非接觸吸著盤的配置之圖。 Fig. 5 is a diagram showing the arrangement of a non-contact chuck in a non-contact transfer device according to a second embodiment of the present invention.
第6圖是顯示第2實施形態之變形例的非接觸搬送裝置中的非接觸吸著盤的配置之圖。 Fig. 6 is a diagram showing the arrangement of a non-contact chuck in a non-contact transfer device according to a modification of the second embodiment.
第7圖是顯示本發明之第3實施形態的非接觸搬送裝置中的非接觸吸著盤的配置之圖。 Fig. 7 is a diagram showing the arrangement of a non-contact chuck in a non-contact transfer device according to a third embodiment of the present invention.
第8圖是顯示第3實施形態之變形例的非接觸搬送裝置中的非接觸吸著盤的配置之圖。 Fig. 8 is a diagram showing the arrangement of a non-contact chuck in a non-contact transfer device according to a modification of the third embodiment.
第9圖是顯示本發明之第4實施形態的非接觸搬送裝置中的非接觸吸著盤的配置之圖。 Fig. 9 is a view showing the arrangement of a non-contact chuck in a non-contact transfer device according to a fourth embodiment of the present invention.
第10圖是顯示第4實施形態之變形例的非接觸搬送裝置中的非接觸吸著盤的配置之圖。 Fig. 10 is a diagram showing the arrangement of a non-contact chuck in a non-contact transfer device according to a modification of the fourth embodiment.
第11圖是顯示非接觸搬送裝置中的非接觸吸著盤的配置例之圖。 Fig. 11 is a diagram showing an example of the arrangement of a non-contact chuck in a non-contact transfer device.
第12圖是顯示非接觸搬送裝置中的非接觸吸著盤的其他配置例之圖。 Fig. 12 is a view showing another arrangement example of the non-contact chuck in the non-contact transfer device.
第13圖是顯示非接觸搬送裝置的其他構成例之圖。 FIG. 13 is a diagram showing another configuration example of the non-contact transfer device.
第14圖是顯示本發明之第5實施形態的非接觸搬送裝置中的非接觸吸著盤及其配置之圖。 Fig. 14 is a diagram showing a non-contact chuck and its arrangement in a non-contact transfer device according to a fifth embodiment of the present invention.
第15圖是用來說明第5實施形態之非接觸吸著盤的構造的示意剖面圖。 Fig. 15 is a schematic cross-sectional view for explaining the structure of a non-contact chuck according to a fifth embodiment.
第16圖是顯示本發明之第5實施形態的非接觸搬送裝置中的非接觸吸著盤的變形例之圖。 Fig. 16 is a diagram showing a modification of the non-contact chuck in the non-contact transfer device according to the fifth embodiment of the present invention.
第17圖是顯示本發明之第5實施形態的非接觸搬送裝置中的非接觸吸著盤的其他變形例之圖。 Fig. 17 is a view showing another modified example of the non-contact chuck in the non-contact transfer device according to the fifth embodiment of the present invention.
第18圖是顯示本發明之第5實施形態的非接觸搬送裝置中的非接觸吸著盤的其他變形例之圖。 Fig. 18 is a view showing another modification of the non-contact chuck in the non-contact transfer device according to the fifth embodiment of the present invention.
第19圖是顯示本發明之第5實施形態的非接觸搬送裝置中的非接觸吸著盤的其他變形例之圖。 Fig. 19 is a view showing another modified example of the non-contact chuck in the non-contact transfer device according to the fifth embodiment of the present invention.
第20圖是顯示本發明之其他非接觸吸著盤的平面圖。 Fig. 20 is a plan view showing another non-contact chuck of the present invention.
第21圖是顯示本發明的其他非接觸吸著盤的平面圖。 Fig. 21 is a plan view showing another non-contact chuck of the present invention.
以下,說明本發明之較佳實施形態的非接觸搬送裝置所使用的非接觸吸著盤的構造。第1圖是本發明之較佳實施形態的非接觸搬送裝置所使用的非接觸吸著盤的分解立體圖,第2圖是用來說明利用第1圖之非接觸吸著盤進行工件W之吸著固定(非接觸吸著)的狀態的示意剖面圖。 The structure of a non-contact chuck used in a non-contact transfer device according to a preferred embodiment of the present invention will be described below. FIG. 1 is an exploded perspective view of a non-contact chuck used in a non-contact transfer device according to a preferred embodiment of the present invention, and FIG. 2 is a diagram for explaining suction of a workpiece W using the non-contact chuck of FIG. 1. It is a schematic cross-sectional view of the state of being held (non-contacted).
本發明之較佳實施形態所使用的非接觸吸著盤具有類似在國際公開WO2013/129599號公報所記載的非接觸吸著盤的基本構造,適合用來對半導體晶圓、FPD用玻璃基材等的薄板狀工件,尤其是厚度0.3至0.4mm左右的液晶顯示器用玻璃板等的薄板狀工件進行非接觸吸著。並且也適合用來對厚度0.1mm左右的玻璃板、厚度0.05mm的薄膜等超薄的工件進行非接觸吸著。 The non-contact chuck used in the preferred embodiment of the present invention has a basic structure similar to the non-contact chuck described in International Publication No. WO2013 / 129599, and is suitable for semiconductor wafers and glass substrates for FPD. And other thin plate-like workpieces, especially thin plate-like workpieces such as glass plates for liquid crystal displays having a thickness of about 0.3 to 0.4 mm, are non-contacted. It is also suitable for non-contact suction of ultra-thin workpieces such as glass plates with a thickness of about 0.1mm and films with a thickness of 0.05mm.
非接觸吸著盤1是如第1圖所示,具備:在表面具有工件之非接觸吸著區域的矩形的多孔質墊2;從多孔質墊2的下側(背側)保持多孔質墊2的矩形的墊保持器4;以及與墊保持器4之背側連結的矩形的基座6。 As shown in FIG. 1, the non-contact chuck 1 includes a rectangular porous pad 2 having a non-contact absorbing area of a workpiece on the surface, and a porous pad is held from the lower side (back side) of the porous pad 2. 2 rectangular pad holder 4; and a rectangular base 6 connected to the back side of the pad holder 4.
多孔質墊2是由透氣性的多孔質炭形成。多孔質墊2的材料並不限於透氣性的多孔質炭,亦可使用其他透氣性的多孔質材料,例如多孔質碳化矽、多孔質氧化鋁等。 The porous pad 2 is made of air-permeable porous carbon. The material of the porous pad 2 is not limited to air-permeable porous carbon, and other air-permeable porous materials, such as porous silicon carbide and porous alumina, may also be used.
多孔質墊2的透過量以0.4至2Nml/min/mm2左右為佳 (多孔質墊2的厚度為5mm、壓力為0.1MPa時)。 The permeation amount of the porous pad 2 is preferably about 0.4 to 2 Nml / min / mm 2 (when the thickness of the porous pad 2 is 5 mm and the pressure is 0.1 MPa).
在多孔質墊2形成有複數個吸引孔8。如第1圖所示,吸引孔8是遍及多孔質墊2的大致全面排列成格子狀,也就是以配置在圍棋盤的方眼中央的狀態來排列。本實施形態中,吸引孔8的間隔設定在25mm左右。 A plurality of suction holes 8 are formed in the porous pad 2. As shown in FIG. 1, the suction holes 8 are arranged substantially in a grid pattern throughout the porous pad 2, that is, they are arranged in a state of being arranged in the center of the square eyes of the go board. In this embodiment, the interval between the suction holes 8 is set to about 25 mm.
吸引孔8是以朝厚度方向貫穿各多孔質墊2而延伸的方式形成。本實施形態中,吸引孔8是將多孔質墊2的表面側設為直徑0.6mm左右的小徑部8a,將多孔質墊2的背面側設為直徑4mm左右的大徑部。小徑部8a與大徑部8b是透過朝向多孔質墊2之表面形成前端尖細狀的圓錐部而連結。 The suction holes 8 are formed so as to extend through the porous pads 2 in the thickness direction. In this embodiment, the suction hole 8 is a small-diameter portion 8a having a diameter of about 0.6 mm on the surface side of the porous pad 2 and a large-diameter portion having a diameter of about 4 mm on the back side of the porous pad 2. The small-diameter portion 8a and the large-diameter portion 8b are connected by forming a tapered tip with a tapered tip toward the surface of the porous pad 2.
藉由這種構造,當吸引孔8的大徑部8b被減壓吸引時,來自在多孔質墊之表面側開口的吸引孔8的小徑部8a的空氣被吸引,形成有吸引孔8的多孔質墊2的表面區域便成為進行工件之非接觸吸著固定的非接觸吸著固定區域。 With this structure, when the large-diameter portion 8b of the suction hole 8 is suction-reduced under reduced pressure, air from the small-diameter portion 8a of the suction hole 8 opened on the surface side of the porous pad is suctioned, and the suction hole 8 is formed. The surface area of the porous pad 2 becomes a non-contact suction-fixation area for non-contact suction-fixation of the workpiece.
如上所述,墊保持器4是從下側(背側)保持多孔質墊2的矩形構件,例如由鋁合金等的金屬材料形成。亦可由強化碳纖維‧聚醚醚酮(CFRP‧PEEK)等的樹脂形成墊保持器4。 As described above, the pad holder 4 is a rectangular member that holds the porous pad 2 from the lower side (back side), and is formed of a metal material such as an aluminum alloy. The pad holder 4 may be formed of a resin such as reinforced carbon fiber, polyetheretherketone (CFRP, PEEK).
在墊保持器4的上面,在外周緣形成有壁狀的立起部12。立起部12構成為內緣的尺寸比多孔質墊2的外緣的尺寸稍大,高度比多孔質墊2的厚度稍低。 A wall-shaped rising portion 12 is formed on the outer surface of the pad holder 4. The rising portion 12 is configured such that the size of the inner edge is slightly larger than the size of the outer edge of the porous pad 2 and the height is slightly lower than the thickness of the porous pad 2.
因此,多孔質墊2被配置在墊保持器4的立 起部12之內側的空間(凹部)時,便形成多孔質墊2的上表面2a配置在比墊保持器4之立起部12的頂面稍微上方的狀態。 Therefore, the porous pad 2 is arranged in a standing position of the pad holder 4. When the space (recessed portion) inside the raised portion 12 is formed, the upper surface 2 a of the porous pad 2 is arranged slightly above the top surface of the raised portion 12 of the pad holder 4.
此外,本發明亦可為不具備立起部12的構造。 In addition, the present invention may have a structure without the rising portion 12.
又,在墊保持器4的上面(凹部的底面)的內側區域,格子狀(圍棋盤的方眼狀)地形成有剖面呈矩形的溝槽(加壓氣體流路)14,由溝槽14劃分的部分係排列成正方格子狀且橫剖面為大致正方形的島狀突起部16。島狀突起部16與配置成格子狀(圍棋盤的方眼狀)的溝槽14一起構成圍棋盤的方眼狀構造。各突起部16的頂面平坦,在中央開設有朝厚度方向貫穿墊保持器4的連通孔18。 Further, grooves (pressurized gas flow paths) 14 having a rectangular cross section are formed in a grid (a square shape of a go board) in the inner area of the upper surface (bottom surface of the recessed portion) of the pad holder 4 and divided by the grooves 14. The portions are arranged in the form of a square lattice and the island-shaped protrusions 16 having a substantially square cross section. The island-shaped protrusions 16 form a square-eye structure of the go board together with the grooves 14 arranged in a grid shape (the square-eye shape of the go board). The top surface of each protrusion 16 is flat, and a communication hole 18 is formed in the center and penetrates the pad holder 4 in the thickness direction.
此外,由溝槽14構成的加壓氣體流路係一體連通,以全體作為一個流路而發揮功能。 In addition, the pressurized gas flow path system formed by the grooves 14 communicates integrally and functions as a single flow path as a whole.
又,本發明中的格子樣態不限於上述例子的正方格子。再者,島狀突起部的橫剖面形狀並不限於如突起部16的大致正方形,亦可為其他的長方形、三角形、多角形、圓形等。 In addition, the lattice pattern in the present invention is not limited to the square lattice of the above example. In addition, the cross-sectional shape of the island-shaped protrusion is not limited to a substantially square shape such as the protrusion 16, and may be other rectangles, triangles, polygons, circles, or the like.
多孔質墊2與墊保持器4是在多孔質墊2配置在墊保持器4的立起部12之內側的空間內的狀態下,利用接著劑等接合並固定。未具備立起部12的構造時,則是在多孔質墊2與墊保持器4積層的狀態下,利用接著劑等接合並固定。 The porous pad 2 and the pad holder 4 are joined and fixed with an adhesive or the like in a state where the porous pad 2 is disposed in a space inside the rising portion 12 of the pad holder 4. When the structure without the rising portion 12 is provided, the porous pad 2 and the pad holder 4 are laminated and bonded and fixed with an adhesive or the like.
突起部16係在多孔質墊2配置在墊保持器4的立起部12之內側的空間內時,構成為頂面會以氣密狀 態抵接於多孔質墊2之背面的吸引孔8的大徑部8b之開口端周圍的區域。 When the protruding portion 16 is located in the space inside the rising portion 12 of the pad holder 4 of the porous pad 2, the top surface is configured to be airtight. The state abuts on the area around the open end of the large-diameter portion 8b of the suction hole 8 on the back surface of the porous pad 2.
結果,當多孔質墊2利用接著劑固定在墊保持器4的立起部12之內側的空間時,在多孔質墊2的背面與墊保持器4的上面之間,便形成由配置成格子狀的溝槽14以及覆蓋該溝槽14的多孔質墊2劃分成的閉鎖空間(加壓氣體流路)。 As a result, when the porous pad 2 is fixed in the space inside the rising portion 12 of the pad holder 4 with an adhesive, a grid is arranged between the back surface of the porous pad 2 and the upper surface of the pad holder 4. A closed space (pressurized gas flow path) defined by the groove 14 in the shape of a groove and the porous pad 2 covering the groove 14.
連通孔18係具有與多孔質墊2之吸引孔8的大徑部8b大致相同的直徑,當多孔質墊2被收容在墊保持器4的立起部12之內側的空間內的預定位置時,構成為與形成在多孔質墊2的各吸引孔8在厚度方向整齊排列。 The communication hole 18 has a diameter substantially the same as that of the large-diameter portion 8 b of the suction hole 8 of the porous pad 2 when the porous pad 2 is accommodated in a predetermined position in a space inside the rising portion 12 of the pad holder 4. It is configured to be aligned in the thickness direction with each suction hole 8 formed in the porous pad 2.
結果,多孔質墊2被收容在墊保持器4的立起部12之內側的空間時,多孔質墊2的吸引孔8與墊保持器4的連通孔18會流體性連通。 As a result, when the porous pad 2 is accommodated in the space inside the rising portion 12 of the pad holder 4, the suction hole 8 of the porous pad 2 and the communication hole 18 of the pad holder 4 are in fluid communication.
在墊保持器4中形成有用以使由溝槽14形成的加壓氣體流路全體與外部空間連通,且用以將加壓空氣導入該加壓氣體流路的加壓空氣入口20。 The pad holder 4 is formed with a pressurized air inlet 20 for communicating the entire pressurized gas flow path formed by the groove 14 with an external space, and for introducing pressurized air into the pressurized gas flow path.
藉由這種構造,在將多孔質墊2收容在墊保持器4的立起部12之內側的空間並且接著固定的狀態下,從加壓空氣入口20導入加壓空氣時,所導入的加壓空氣,即供應至加壓氣體流路全體的加壓空氣,會進入構成加壓氣體流路之上面的多孔質墊2的細孔,並透過多孔質墊2再從多孔質墊2的表面全體噴出。 With this structure, when the porous pad 2 is housed in a space inside the rising portion 12 of the pad holder 4 and then fixed, when the pressurized air is introduced from the pressurized air inlet 20, Pressurized air, that is, pressurized air supplied to the entire pressurized gas flow path, enters the pores of the porous pad 2 forming the upper surface of the pressurized gas flow path, passes through the porous pad 2 and passes from the surface of the porous pad 2 All squirting.
此時,在下方配置有格子狀的溝槽14(加壓 氣體流路)的多孔質墊2的表面部分,比起在下方沒有配置溝槽14(加壓氣體流路)的部分,會有量更多的加壓空氣或是更高壓的加壓空氣噴出。 At this time, a grid-like groove 14 (pressurized) is arranged below (Gas flow path) The surface portion of the porous pad 2 may have a larger amount of pressurized air or a higher pressure than the portion where the groove 14 (pressurized gas flow path) is not disposed below. .
基座6是與墊保持器4之背側連結的矩形的構件,例如由鋁合金等的金屬材料形成。基座6也可由CFRP‧PEEK等的樹脂形成。 The base 6 is a rectangular member connected to the back side of the pad holder 4 and is formed of a metal material such as an aluminum alloy. The base 6 may be formed of a resin such as CFRP · PEEK.
如第1圖所示,基座6具有與墊保持器4大致相同的尺寸,在平坦的上面格子狀地形成有剖面呈矩形的基座溝槽22。因此,當墊保持器4的平坦的背面與基座6的上面接合時,由格子狀的基座溝槽22以及覆蓋該溝槽的墊保持器4的背面便形成格子狀的閉鎖空間。 As shown in FIG. 1, the base 6 has approximately the same size as the pad holder 4, and a flat base surface has a rectangular base groove 22 formed in a rectangular cross section. Therefore, when the flat back surface of the pad holder 4 is joined to the upper surface of the base 6, a grid-shaped locking space is formed by the grid-shaped base groove 22 and the back surface of the pad holder 4 covering the groove.
基座溝槽22是配置成當墊保持器4與基座6接合時,格子狀的基座溝槽22的交點會與形成在墊保持器4的連通孔18在厚度方向整齊排列。 The base groove 22 is arranged such that when the pad holder 4 and the base 6 are joined, the intersection of the grid-shaped base groove 22 and the communication hole 18 formed in the pad holder 4 are aligned in the thickness direction.
藉由這種構造,當多孔質墊2與墊保持器4以及基座6連結時,多孔質墊2的吸引孔8會經由墊保持器4的連通孔18,與形成在基座6與墊保持器4之間的格子狀的閉鎖空間的交點連通。 With this structure, when the porous pad 2 is connected to the pad holder 4 and the base 6, the suction hole 8 of the porous pad 2 passes through the communication hole 18 of the pad holder 4 and is formed in the base 6 and the pad. The intersections of the grid-shaped lock spaces between the holders 4 communicate with each other.
又,在基座6的外圍形成有使基座溝槽22與基座6之外部的真空源連通用的貫穿孔,即真空孔24。 A vacuum hole 24 is formed in the periphery of the susceptor 6 as a through hole for communicating the susceptor groove 22 with a vacuum source outside the susceptor 6.
藉由這種構造,在多孔質墊2、墊保持器4以及基座6連結的狀態下,從真空孔24進行真空吸引時,經由墊保持器4的連通孔18,從多孔質墊2的各吸引孔8進行吸引,可將多孔質墊2上的工件朝向多孔質墊2吸引。 With this structure, when the porous pad 2, the pad holder 4, and the base 6 are connected, vacuum suction is performed from the vacuum hole 24 through the communication hole 18 of the pad holder 4 from the porous pad 2. Each suction hole 8 sucks the workpiece on the porous pad 2 toward the porous pad 2.
此外,各吸引孔8是與格子狀的閉鎖空間連通,因此各吸引孔的吸引狀態是相同的。 In addition, since each suction hole 8 communicates with a grid-shaped closed space, the suction state of each suction hole is the same.
墊保持器4與基座6是利用螺絲、螺栓等的連結具而連結。藉由沿著基座6之上面的外周形成溝槽,並在該溝槽內配置O環,可使基座6的格子狀的基座溝槽22形成閉鎖狀態地將墊保持器4及基座6連結。又,亦可為利用接著劑來連結墊保持器4及基座6的構造。 The pad holder 4 and the base 6 are connected by a connection tool such as a screw or a bolt. By forming a groove along the outer periphery of the upper surface of the base 6 and arranging an O-ring in the groove, the grid-shaped base groove 22 of the base 6 can be locked to the pad holder 4 and the base. Block 6 link. It is also possible to adopt a structure in which the pad holder 4 and the base 6 are connected by an adhesive.
具有這種構造的非接觸吸著盤在使用時,是在多孔質墊2、墊保持器4以及基座6連結的狀態下,從加壓空氣入口20將加壓空氣導入由溝槽14及多孔質墊2形成的加壓氣體流路,並且從基座6的真空孔進行真空吸引,藉此可在使工件於多孔質墊2上懸浮的狀態下,進行所要吸著的工件的非接觸吸著。 When a non-contact chuck having such a structure is used, the porous pad 2, the pad holder 4, and the base 6 are connected, and the pressurized air is introduced from the pressurized air inlet 20 into the grooves 14 and The pressurized gas flow path formed by the porous pad 2 and vacuum suction are performed from the vacuum holes of the base 6, thereby enabling non-contacting of the workpiece to be sucked while the workpiece is suspended on the porous pad 2. Suck.
接下來,依據第2圖,針對非接觸吸著詳加說明。 Next, non-contact adsorption will be described in detail based on FIG. 2.
如上所述,使用時,從由墊保持器4的溝槽14及多孔質墊2形成的加壓氣體流路外部的壓縮空氣源導入加壓空氣時,加壓空氣會通過多孔質墊2的細孔進入多孔質墊2內,並且如第2圖的箭頭P所示,從多孔質墊2的上表面2a噴出。如第2圖的箭頭P所示,藉由噴出的加壓空氣,工件W會從墊2的上表面(吸著面)2a懸浮。 As described above, during use, when pressurized air is introduced from a compressed air source outside the pressurized gas flow path formed by the grooves 14 of the pad holder 4 and the porous pad 2, the pressurized air passes through the porous pad 2. The pores enter the porous pad 2 and are ejected from the upper surface 2 a of the porous pad 2 as indicated by an arrow P in FIG. 2. As indicated by an arrow P in FIG. 2, the workpiece W is suspended from the upper surface (suction surface) 2 a of the pad 2 by the ejected pressurized air.
另一方面,藉由與加壓空氣之導入同時進行的從基座6的真空孔24的真空吸引,在墊的表面(吸著面)上懸浮的工件W會從多孔質墊2的各吸引孔8如箭頭V 所示被吸引。結果,工件W會從利用加壓空氣所產生的浮力與利用真空吸引產生的吸引力取得平衡的吸著面2a起,被非接觸吸著固定於向上方僅離開預定距離G的位置。 On the other hand, by the vacuum suction from the vacuum hole 24 of the base 6 simultaneously with the introduction of the pressurized air, the workpieces W suspended on the surface (suction surface) of the pad are attracted from each of the porous pads 2. Hole 8 as arrow V Shown attracted. As a result, the workpiece W is fixed to a position away from the suction surface 2a upward by a predetermined distance G from the suction surface 2a in which the buoyancy generated by the pressurized air and the attractive force generated by the vacuum suction are balanced.
吸引孔8的間隔可在例如25至8mm的範圍適當變更。間隔越小,吸著精度就越為提升。例如,將間隔從20mm變更成12mm時,精度會變成1.5倍。 The interval of the suction holes 8 can be appropriately changed in a range of, for example, 25 to 8 mm. The smaller the interval, the higher the pickup accuracy. For example, when the interval is changed from 20mm to 12mm, the accuracy becomes 1.5 times.
又,吸引孔8的小徑部8a的直徑可在例如0.8至0.1mm的範圍適當變更。直徑越小,吸著精度就越為提升。例如,將直徑從0.6mm變更成0.3mm時,精度會變成1.5倍。 The diameter of the small-diameter portion 8a of the suction hole 8 can be appropriately changed in a range of, for example, 0.8 to 0.1 mm. The smaller the diameter, the more accurate the pick-up accuracy. For example, if the diameter is changed from 0.6 mm to 0.3 mm, the accuracy will be 1.5 times.
再者,剖面呈矩形的溝槽(加壓氣體流路)14的寬度可在例如8.0至1.0mm的範圍適當變更。寬度越小,吸著精度就越為提升。例如,將寬度從4.0mm變更成2.0mm時,精度會變成1.5倍。 The width of the groove (pressurized gas flow path) 14 having a rectangular cross section can be appropriately changed in a range of, for example, 8.0 to 1.0 mm. The smaller the width, the more accurate the pick-up accuracy. For example, if you change the width from 4.0mm to 2.0mm, the accuracy will be 1.5 times.
藉由將吸引孔8的間隔、吸引孔8的小徑部8a的直徑以及加壓氣體流路14的寬度變更成上述的較小值,厚度0.1mm的玻璃(工件)之吸著保持時的預定距離G的差異會變成1/3至1/4左右,提高了吸著精度。並且,若是厚度0.05mm的薄膜,則吸著保持時的預定距離G的差異變成1/4至1/5左右。 By changing the interval between the suction holes 8, the diameter of the small-diameter portion 8 a of the suction holes 8, and the width of the pressurized gas flow path 14 to the smaller values described above, the glass (workpiece) with a thickness of 0.1 mm is held by suction. The difference in the predetermined distance G becomes about 1/3 to 1/4, which improves the adsorption accuracy. Moreover, if it is a thin film having a thickness of 0.05 mm, the difference in the predetermined distance G at the time of suction holding becomes about 1/4 to 1/5.
使用這種構造的非接觸吸著盤構成本發明之非接觸搬送裝置時,可附加使懸浮的工件W沿著吸著面2a移動的機器手臂等。 When the non-contact suction device of the present invention is configured using the non-contact suction plate having such a structure, a robot arm or the like for moving the suspended workpiece W along the suction surface 2a can be added.
接下來,針對本發明之較佳樣態的非接觸 搬送裝置加以說明。 Next, a non-contact for a preferred aspect of the present invention The transport device will be described.
本發明之非接觸搬送裝置中,藉由將具有如非接觸吸著盤1這種基本構造的非接觸吸著盤朝工件搬送方向排列而形成搬送路徑,在該搬送路徑上使薄板狀的工件懸浮並吸著,並利用機器手臂等的移送手段沿著搬送路徑搬送工件。 In the non-contact conveying device of the present invention, a non-contact suction plate having a basic structure such as the non-contact suction plate 1 is arranged in a workpiece conveying direction to form a conveying path, and a thin plate-like workpiece is formed on the conveying path. Suspend and suck, and transport the workpiece along the transport path using transport means such as a robot arm.
第3圖是顯示本發明之第1實施形態的非接觸搬送裝置30中的非接觸吸著盤的配置之圖。此外,第3圖的箭頭A所示的方向是工件搬送方向。 FIG. 3 is a diagram showing the arrangement of the non-contact chuck in the non-contact transfer device 30 according to the first embodiment of the present invention. The direction shown by the arrow A in FIG. 3 is the workpiece conveyance direction.
第3圖所示的第1實施形態的非接觸搬送裝置30中,沿著搬送方向,以接觸狀態排列有搬送方向上游側的第1非接觸吸著盤32及搬送方向下游側的第2非接觸吸著盤34。 In the non-contact transfer device 30 of the first embodiment shown in FIG. 3, the first non-contact suction tray 32 upstream of the transfer direction and the second non-contact downstream of the transfer direction are arranged in a contact state along the transfer direction. Contact the suction plate 34.
第1及第2非接觸吸著盤32、34具備與上述非接觸吸著盤1同樣的構造,在最上部的多孔質墊2以正方格子狀形成有吸引孔8。再者,如多孔質墊2上的虛線所示(以下在其他實施形態的圖面中亦同),在多孔質墊2的下方的墊保持器形成有格子狀的加壓氣體流路14。 The first and second non-contact suction pads 32 and 34 have the same structure as the non-contact suction pad 1 described above, and suction holes 8 are formed in the uppermost porous pad 2 in a square grid shape. In addition, as shown by a dotted line on the porous pad 2 (the same applies to the drawings of other embodiments hereinafter), a grid-shaped pressurized gas flow path 14 is formed in the pad holder below the porous pad 2.
本實施形態中,第1及第2非接觸吸著盤32、34的加壓氣體流路14係在第1及第2非接觸吸著盤32、34相互接觸的接觸部(連接區域)中,以配置成沿著第1及第2非接觸吸著盤32、34彼此相對向的邊(亦即與搬送方向正交的方向之寬方向)延伸的端部寬方向流路36為終端。 In this embodiment, the pressurized gas flow path 14 of the first and second non-contact chucks 32 and 34 is in a contact portion (connection area) where the first and second non-contact chucks 32 and 34 contact each other. The end wide direction flow path 36 is arranged to extend along the sides (that is, the width direction of the direction orthogonal to the conveying direction) of the first and second non-contact suction pads 32 and 34 facing each other.
再者,在第1及第2非接觸吸著盤32、34各個中,設在最靠近接觸部之側的吸引孔8、8之間的距離d1,設定成比第1及第2非接觸吸著盤32、34中的吸引孔間的距離d2還要長。 In addition, in each of the first and second non-contact suction pads 32 and 34, the distance d1 between the suction holes 8, 8 provided on the side closest to the contact portion is set to be longer than the first and second non-contact suction pads. The distance d2 between the suction holes in the suction pads 32 and 34 is longer.
根據這種構造,第1及第2非接觸吸著盤32、34之連接部中的吸引孔8的間隔會比其他部分的間隔大,而且,格子狀的加壓氣體流路14是以配置成朝寬方向延伸的端部流路36為終端,因此從第1非接觸吸著盤32移送至第2非接觸吸著盤34時,工件,尤其是工件前端會大幅地浮起。 According to this structure, the interval between the suction holes 8 in the connection portion between the first and second non-contact suction pads 32 and 34 is larger than the interval between the other portions, and the grid-shaped pressurized gas flow path 14 is arranged. The end flow path 36 extending in the wide direction is the end. Therefore, when moving from the first non-contact chuck 32 to the second non-contact chuck 34, the workpiece, especially the front end of the workpiece, largely floats.
第4圖是顯示第1實施形態之變形例的非接觸搬送裝置30’中的非接觸吸著盤32’、34’的配置之圖。此外,第4圖中,箭頭A所示的方向亦為工件搬送方向。 Fig. 4 is a view showing the arrangement of the non-contact suction pads 32 'and 34' in the non-contact transfer device 30 'according to a modification of the first embodiment. In addition, in FIG. 4, a direction indicated by an arrow A is also a workpiece conveyance direction.
第4圖所示的非接觸搬送裝置30’除了搬送方向上游側的第1非接觸吸著盤32’與搬送方向下游側的第2非接觸吸著盤34’沿著搬送方向分開達預定距離而排列之外,具備與非接觸搬送裝置30相同的構造。 The non-contact transfer device 30 'shown in FIG. 4 is separated from the first non-contact suction plate 32' on the upstream side in the transfer direction and the second non-contact suction plate 34 'on the downstream side in the transfer direction by a predetermined distance along the transfer direction. Other than the arrangement, it has the same structure as the non-contact transfer device 30.
此外,本說明書中,在搬送方向分開預定距離而排列的狀態也包含在「連接」的態樣中。 In addition, in the present specification, a state in which they are arranged apart from each other by a predetermined distance in the conveying direction is also included in a “connected” aspect.
這種構造中,從第1非接觸吸著盤32’移送至第2非接觸吸著盤34’時,工件,尤其是工件前端也會大幅地浮起。因此,可有效應用於在第1非接觸吸著盤32’與第2非接觸吸著盤34’的交界的間隙或間隙的下方配置感測器等的機器的構造等。 In this structure, when moving from the first non-contact chuck 32 'to the second non-contact chuck 34', the workpiece, especially the leading end of the workpiece, also largely floats. Therefore, it can be effectively applied to the structure of a device or the like in which a sensor or the like is arranged at or below the gap between the first non-contact chuck 32 'and the second non-contact chuck 34'.
第5圖是顯示本發明之第2實施形態的非接觸搬送裝置40中的非接觸吸著盤的配置之圖。此外,第5圖的箭頭A所示的方向是工件搬送方向。 Fig. 5 is a diagram showing the arrangement of a non-contact chuck in a non-contact transfer device 40 according to a second embodiment of the present invention. The direction indicated by the arrow A in FIG. 5 is the workpiece conveyance direction.
第5圖所示的第2實施形態的非接觸搬送裝置40中,搬送方向上游側的第1非接觸吸著盤42及搬送方向下游側的第2非接觸吸著盤44是沿著搬送方向以接觸狀態排列。 In the non-contact conveying device 40 of the second embodiment shown in FIG. 5, the first non-contact suction plate 42 on the upstream side in the conveying direction and the second non-contact suction plate 44 on the downstream side in the conveying direction are along the conveying direction. Arranged in contact.
第1及第2非接觸吸著盤42、44具備與上述非接觸吸著盤1同樣的構造,在最上部的多孔質墊2以正方格子狀形成有吸引孔8。再者,如多孔質墊2上的虛線所示,在多孔質墊2的下方的墊保持器形成有格子狀的加壓氣體流路14。 The first and second non-contact chucks 42 and 44 have the same structure as the non-contact chuck 1 described above, and suction holes 8 are formed in the uppermost porous pad 2 in a square grid shape. In addition, as shown by a dotted line on the porous pad 2, a grid-like pressurized gas flow path 14 is formed in the pad holder below the porous pad 2.
本實施形態中,第1及第2非接觸吸著盤42、44的加壓氣體流路14係在第1及第2非接觸吸著盤42、44相互接觸的接觸部(連接區域)中,以配置成朝寬方向延伸的端部寬方向流路46為終端。 In this embodiment, the pressurized gas flow path 14 of the first and second non-contact chucks 42 and 44 is in a contact portion (connection area) where the first and second non-contact chucks 42 and 44 are in contact with each other. A terminal wide direction flow path 46 arranged to extend in the wide direction is used as a terminal.
再者,本實施形態中,端部流路46的寬度設定為4mmm左右,比加壓氣體流路14的其他部分狹窄。 In addition, in this embodiment, the width of the end flow path 46 is set to about 4 mm, which is narrower than other parts of the pressurized gas flow path 14.
第6圖是顯示第2實施形態之變形例的非接觸搬送裝置40’中的非接觸吸著盤42’、44’的配置之圖。此外,第6圖中,箭頭A所示的方向亦為工件搬送方向。 Fig. 6 is a view showing the arrangement of the non-contact suction plates 42 'and 44' in the non-contact transfer device 40 'according to a modification of the second embodiment. In addition, in FIG. 6, a direction indicated by an arrow A is also a workpiece conveyance direction.
第6圖所示的非接觸搬送裝置40’除了搬送方向上游側的第1非接觸吸著盤42’與搬送方向下游側的第2非接觸吸著盤44’沿著搬送方向離開達預定距離而排列之外,具備與非接觸搬送裝置40相同的構造。 The non-contact transfer device 40 'shown in FIG. 6 is apart from the first non-contact suction plate 42' on the upstream side in the transfer direction and the second non-contact suction plate 44 'on the downstream side in the transfer direction. Other than the arrangement, it has the same structure as the non-contact transfer device 40.
根據這種構造,從第1非接觸吸著盤42’移送至第2非接觸吸著盤44’時,工件的前端會朝向上方被頂起,之後,在形成於第1及第2非接觸吸著盤42’、44’之間的間隙,因為本身重量而向下方推壓,因此可在維持高度位置的狀態下移送至第2非接觸吸著盤44’。 According to this structure, when moving from the first non-contact chuck 42 'to the second non-contact chuck 44', the tip of the workpiece is lifted upward, and then formed on the first and second non-contact chucks. The gap between the suction pads 42 ′ and 44 ′ is pushed downward due to its own weight, so it can be transferred to the second non-contact suction pad 44 ′ while maintaining the height position.
第7圖是顯示本發明之第3實施形態的非接觸搬送裝置50中的非接觸吸著盤的配置之圖。此外,第7圖的箭頭A所示的方向是工件搬送方向。 Fig. 7 is a diagram showing the arrangement of a non-contact chuck in a non-contact transfer device 50 according to a third embodiment of the present invention. The direction indicated by the arrow A in FIG. 7 is the workpiece conveyance direction.
第7圖所示的第3實施形態的非接觸搬送裝置50中,搬送方向上游側的第1非接觸吸著盤52及搬送方向下游側的第2非接觸吸著盤54沿著搬送方向以接觸狀態排列。 In the non-contact transfer device 50 according to the third embodiment shown in FIG. 7, the first non-contact suction tray 52 on the upstream side in the transfer direction and the second non-contact suction tray 54 on the downstream side in the transfer direction follow the transfer direction. The contact states are arranged.
第1及第2非接觸吸著盤52、54具備與上述非接觸吸著盤1同樣的構造,在最上部的多孔質墊2以正方格子狀形成有吸引孔8。再者,如多孔質墊2上的虛線所示,在多孔質墊2的下方的墊保持器形成有格子狀的加壓氣體流路14。 The first and second non-contact chucks 52 and 54 have the same structure as the non-contact chuck 1 described above, and suction holes 8 are formed in the uppermost porous pad 2 in a square grid shape. In addition, as shown by a dotted line on the porous pad 2, a grid-like pressurized gas flow path 14 is formed in the pad holder below the porous pad 2.
本實施形態中,搬送方向上游側的第1非接觸吸著盤52的保持器之格子狀的加壓氣體流路係在第1及第2非接觸吸著盤52、54相互接觸的接觸部(連接區域)中,以配置成朝寬方向延伸的端部寬方向流路56為終端。 In the present embodiment, the grid-shaped pressurized gas flow path of the holder of the first non-contact chuck 52 on the upstream side in the conveying direction is at the contact portion where the first and second non-contact chucks 52 and 54 contact each other. In the (connection region), the end wide direction flow path 56 arranged so as to extend in the wide direction is terminated.
再者,搬送方向下游側的第2非接觸吸著盤54的保持器之格子狀的加壓氣體流路係在第1及第2非接觸吸著盤52、54相互接觸的接觸部(連接區域)中,以朝搬送方向延伸的端部搬送方向流路58為終端。 In addition, the grid-like pressurized gas flow path of the holder of the second non-contact chuck 54 on the downstream side in the conveying direction is at a contact portion (connection between the first and second non-contact chucks 52 and 54 that is in contact with each other) In the area), the end conveyance direction flow path 58 extending in the conveyance direction is terminated.
再者,第1及第2非接觸吸著盤52、54以第7圖的狀態接觸配置時,在第1及第2非接觸吸著盤52、54各個中,設在最靠近接觸部之側的吸引孔8、8之間的距離d3設定成與在第1及第2非接吸著盤52、54內相鄰的吸引孔間的距離相等。 When the first and second non-contact chucks 52 and 54 are arranged in contact with each other in the state shown in FIG. The distance d3 between the suction holes 8 and 8 on the side is set to be equal to the distance between the suction holes adjacent in the first and second non-contact suction plates 52 and 54.
根據這種構造,從第1非接觸吸著盤52到第2非接觸吸著盤54,吸引孔8以大致相等的間距設置,並且吸引孔8與寬方向的加壓氣體流路交互配置,因此工件可在維持高度位置的狀態下,從第1非接觸吸著盤52移送至第2非接觸吸著盤54。 According to this structure, the suction holes 8 are provided at substantially equal intervals from the first non-contact suction plate 52 to the second non-contact suction plate 54, and the suction holes 8 are alternately arranged with a wide-direction pressurized gas flow path. Therefore, the workpiece can be transferred from the first non-contact chuck 52 to the second non-contact chuck 54 while maintaining the height position.
第8圖是顯示第3實施形態之變形例的非接觸搬送裝置50’中的非接觸吸著盤52’、54’的配置之圖。此外,第8圖中,箭頭A所示的方向亦為工件搬送方向。 Fig. 8 is a view showing the arrangement of the non-contact chucks 52 'and 54' in the non-contact transfer device 50 'according to a modification of the third embodiment. In addition, in FIG. 8, a direction indicated by an arrow A is also a workpiece conveyance direction.
第8圖所示的非接觸搬送裝置50’除了第1非接觸吸著盤52’及第2非接觸吸著盤54’沿著搬送方向分開達預定距離而排列之外,具備與第7圖的非接觸搬送裝置50相同的構造。 The non-contact transfer device 50 'shown in FIG. 8 includes the first non-contact suction plate 52' and the second non-contact suction plate 54 'arranged along the conveyance direction by a predetermined distance, and is equipped with the non-contact transfer device 50' shown in FIG. The non-contact transfer device 50 has the same structure.
第9圖是顯示本發明之第4實施形態的非接觸搬送裝置60中的非接觸吸著盤62、64的配置之圖。此外,第9圖的箭頭A所示的方向是工件搬送方向。 Fig. 9 is a diagram showing the arrangement of the non-contact chucks 62 and 64 in the non-contact transfer device 60 according to the fourth embodiment of the present invention. The direction shown by the arrow A in FIG. 9 is the workpiece conveyance direction.
第9圖所示的第4實施形態的非接觸搬送裝置60中,第1非接觸吸著盤62及第2非接觸吸著盤64是沿著搬送方向以接觸狀態排列。 In the non-contact transfer device 60 according to the fourth embodiment shown in FIG. 9, the first non-contact suction plate 62 and the second non-contact suction plate 64 are arranged in a contact state along the transfer direction.
第1及第2非接觸吸著盤62、64具備與上 述非接觸吸著盤1同樣的構造,在最上部的多孔質墊2以正方格子狀形成有吸引孔8。再者,如多孔質墊2上的虛線所示,在多孔質墊2的下方的墊保持器形成有格子狀的加壓氣體流路14。 The first and second non-contact chucks 62, 64 are provided above The non-contact chuck 1 has the same structure, and suction holes 8 are formed in the uppermost porous pad 2 in a square grid shape. In addition, as shown by a dotted line on the porous pad 2, a grid-like pressurized gas flow path 14 is formed in the pad holder below the porous pad 2.
本實施形態中,第1及第2非接觸吸著盤62、64中,吸引孔及寬方向的加壓氣體流路係在寬方向(亦即與搬送方向正交的方向)之一側(第9圖下側)與另一側(第9圖上側),在搬送方向上錯開半個間距而配置。 In this embodiment, in the first and second non-contact suction pads 62 and 64, the suction hole and the wide-direction pressurized gas flow path are on one side of the wide direction (that is, a direction orthogonal to the conveying direction) ( The lower side in FIG. 9) and the other side (upper side in FIG. 9) are arranged so as to be shifted by a half pitch in the conveying direction.
而且,本實施形態中,第1非接觸吸著盤62的墊保持器之格子狀的加壓氣體流路係在寬方向的一側(第9圖下側)是以朝寬方向延伸的端部寬方向流路66為終端,而在寬方向的另一側(第9圖上側)是以朝搬送方向延伸的端部搬送方向流路68為終端。 Furthermore, in this embodiment, the grid-shaped pressurized gas flow path of the pad holder of the first non-contact suction pad 62 is on one side (lower side in FIG. 9) extending in the width direction. The partial width direction flow path 66 is a terminal, and the other side (upper side in FIG. 9) of the width direction is terminated by an end conveyance direction flow path 68 extending in the conveyance direction.
亦即,本實施形態中,第1非接觸吸著盤62的墊保持器之格子狀的加壓氣體流路係在寬方向的一側(第9圖下側)是以閉鎖的矩形部分為終端,而在寬方向的另一側(第9圖上側)是以朝向搬送方向下游側開放的矩形部分為終端。 That is, in this embodiment, the grid-shaped pressurized gas flow path of the pad holder of the first non-contact suction pad 62 is on one side in the wide direction (the lower side in FIG. 9) with a closed rectangular portion as The terminal is terminated on the other side in the wide direction (upper side in FIG. 9) with a rectangular portion opened toward the downstream side in the conveying direction.
結果,第1非接觸吸著盤62中,加壓氣體流路配置成交錯狀。 As a result, in the first non-contact suction pad 62, the pressurized gas flow paths are arranged in a staggered manner.
再者,本實施形態中,第2非接觸吸著盤64的保持器之格子狀的加壓氣體流路係在寬方向的一側(第9圖下側)是以朝搬送方向延伸的端部搬送方向流路68為終端,而在寬方向的另一側(第9圖上側)是以朝寬方向 延伸的端部寬方向流路66為終端。 Furthermore, in this embodiment, the grid-shaped pressurized gas flow path of the holder of the second non-contact chuck 64 is on one side (lower side in FIG. 9) extending in the transport direction in the width direction. The flow direction 68 in the partial conveying direction is the end, and the other side in the wide direction (the upper side in FIG. 9) is in the wide direction. The extended end wide direction flow path 66 is a terminal.
亦即,本實施形態中,第2非接觸吸著盤64的墊保持器之格子狀的加壓氣體流路係在寬方向的一側(第9圖上側)是以閉鎖的矩形部分為終端,而在寬方向的另一側(第9圖下側)是以朝向搬送方向上游側開放的矩形部分為終端。 That is, in this embodiment, the grid-shaped pressurized gas flow path of the pad holder of the second non-contact suction pad 64 is on one side in the wide direction (upper side in FIG. 9) with the closed rectangular portion as an end. The other side in the wide direction (lower side in Fig. 9) is terminated by a rectangular portion that is open toward the upstream side in the conveying direction.
結果,第2非接觸吸著盤64中,加壓氣體流路亦配置成交錯狀。 As a result, in the second non-contact suction pad 64, the pressurized gas flow paths are also arranged in a staggered manner.
再者,本實施形態中,第1非接觸吸著盤62及第2非接觸吸著盤64係如第9圖所示,以配置成交錯狀的加壓氣體流路相對互補地配置的方式排列。 Furthermore, in the present embodiment, the first non-contact chuck disc 62 and the second non-contact chuck disc 64 are arranged so as to be relatively complementary to each other as shown in FIG. arrangement.
亦即,上游側的第1非接觸吸著盤62的加壓氣體流路之閉鎖的矩形部分係沿著搬送方向,對於下游側的第2非接觸吸著盤64的加壓氣體流路之朝向搬送方向上游側開放的矩形部分整齊排列。而且,上游側的第1非接觸吸著盤62的加壓氣體流路之朝向搬送方向下游側開放的矩形部分係沿著搬送方向,對於下游側的第2非接觸吸著盤64的加壓氣體流路之閉鎖的矩形部分整齊排列。 That is, the closed rectangular portion of the pressurized gas flow path of the first non-contact chuck disc 62 on the upstream side is along the conveying direction, and the pressurized gas flow path of the second non-contact chuck disc 64 on the downstream side The rectangular portions that are open toward the upstream side in the conveying direction are neatly arranged. Further, the rectangular portion of the pressurized gas flow path of the first non-contact chuck disc 62 on the upstream side that is open toward the downstream side of the conveyance direction is pressed along the transport direction to press the second non-contact chuck disc 64 on the downstream side. The closed rectangular sections of the gas flow path are arranged neatly.
根據這種構造,在第1及第2非接觸吸著盤62、64的連接部中,吸引孔與寬方向的加壓氣體流路是以等間距配置,因此工件也可在維持高度位置的狀態下,從第1非接觸吸著盤62移送至第2非接觸吸著盤64。 According to this structure, in the connection portion of the first and second non-contact suction pads 62 and 64, the suction holes and the pressurized gas flow path in the wide direction are arranged at equal intervals, so that the workpiece can be maintained at a high position. In the state, the first non-contact chuck 62 is transferred to the second non-contact chuck 64.
第10圖是顯示第4實施形態之變形例的非接觸搬送裝置60’中的非接觸吸著盤62’、64’的配置之圖。 此外,第10圖中,箭頭A所示的方向亦為工件搬送方向。 Fig. 10 is a diagram showing the arrangement of the non-contact suction pads 62 'and 64' in the non-contact transfer device 60 'according to a modification of the fourth embodiment. In addition, in FIG. 10, the direction shown by the arrow A is also the workpiece conveyance direction.
第10圖所示的非接觸搬送裝置60’除了搬送方向上游側的第1非接觸吸著盤62’及搬送方向下游側的第2非接觸吸著盤64’沿著搬送方向分開達預定距離而排列之外,具備與非接觸搬送裝置60相同的構造。 The non-contact transfer device 60 'shown in FIG. 10 is separated from the first non-contact suction plate 62' on the upstream side in the transfer direction and the second non-contact suction plate 64 'on the downstream side in the transfer direction by a predetermined distance along the transfer direction. Other than the arrangement, it has the same structure as the non-contact transfer device 60.
這種構造中,在第1及第2非接觸吸著盤62’、64’的連接部中,能夠以等間距配置吸引孔及寬方向的加壓氣體流路,因此,工件也可在維持高度位置的狀態下,從第1非接觸吸著盤62’移送至第2非接觸吸著盤64’。 In this structure, the suction holes and the wide-direction pressurized gas flow paths can be arranged at equal intervals in the connection portions of the first and second non-contact suction pads 62 'and 64', so that the workpiece can be maintained In the state of the height position, it is transferred from the first non-contact chuck 62 'to the second non-contact chuck 64'.
第11圖及第12圖是顯示非接觸搬送裝置中的非接觸吸著盤的其他配置例之圖。 11 and 12 are diagrams showing other arrangement examples of the non-contact chuck in the non-contact transfer device.
第11圖的非接觸搬送裝置70是使非接觸吸著盤的長邊沿著工件的搬送方向配置,排列成八行二列。該構造中,非接觸吸著盤的列與列之間是分開的,搬送方向中的加壓氣體流路的關係形成與第4圖之樣態相同的配置。 The non-contact conveying device 70 of FIG. 11 arranges the long sides of the non-contact chucks along the conveying direction of the work, and arranges them in eight rows and two columns. In this structure, the rows of the non-contact chucks are separated from each other, and the relationship of the flow path of the pressurized gas in the conveying direction is the same as that shown in FIG. 4.
第12圖的非接觸搬送裝置80是使非接觸吸著盤的短邊沿著工件的搬送方向配置,排列成二行四列。該構造中,非接觸吸著盤的列與列之間是分開的,加壓氣體流路的配置形成與第4圖之樣態同樣的配置。 The non-contact conveying device 80 of FIG. 12 arranges the short sides of the non-contact chucks along the conveying direction of the work, and arranges them in two rows and four columns. In this structure, the rows of the non-contact chucks are separated from each other, and the arrangement of the pressurized gas flow paths is the same as that shown in FIG. 4.
第11圖及第12圖所示的非接觸搬送裝置70、80具備配置在非接觸吸著盤之上下游的複數個懸浮裝置90。該懸浮裝置90是例如藉由從多孔質板噴出的加壓空氣使工件懸浮的方式的構造。 The non-contact transfer devices 70 and 80 shown in FIGS. 11 and 12 include a plurality of levitation devices 90 arranged above and below the non-contact chuck. The suspension device 90 has a structure that suspends a workpiece by pressurized air sprayed from a porous plate, for example.
非接觸搬送裝置70、80中,各非接觸吸著盤是藉由呈筏狀地連結固定在複數根桿子上,或是固定在大型基板上等而排列成預定狀態。 In the non-contact transfer devices 70 and 80, the non-contact suction pads are arranged in a predetermined state by being fixed in a raft shape to a plurality of poles or fixed to a large substrate.
這些非接觸搬送裝置70、80中,以接觸狀態配置在某些非接觸吸著盤之寬方向側方的其他非接觸吸著盤,係在位於某些非接觸吸著盤側的側緣部(側方側的接觸區域),加壓氣體流路是以朝向與非接觸吸著盤之長邊方向正交的方向(W方向)延伸的溝槽(寬方向溝槽)為終端。以第13圖為例來說明該構造。 Among these non-contact transfer devices 70 and 80, other non-contact suction pads arranged in a contact state on the lateral side of some of the non-contact suction pads are attached to the side edges on the side of some non-contact suction pads. (The contact area on the lateral side), the pressurized gas flow path ends in a groove (wide groove) extending in a direction (W direction) orthogonal to the long-side direction of the non-contact chuck. This structure will be described using FIG. 13 as an example.
第13圖所示的構造是在構成第10圖之非接觸搬送裝置60’的各非接觸吸著盤62’、64’的側方,分別具備以接觸狀態配置有第1及第2追加非接觸吸著盤62”、64”的構造。 The structure shown in FIG. 13 includes sides of the non-contact suction plates 62 ′ and 64 ′ constituting the non-contact conveying device 60 ′ of FIG. 10, and the first and second additional non-contacts are arranged in a contact state. Structure for contact chucks 62 ", 64".
接觸配置於非接觸吸著盤62’、64’的第1追加非接觸吸著盤62”、64”,在一側的接觸區域,也就是與非接觸吸著盤62’、64’的接觸區域中,加壓流體溝槽(加壓氣體流路)14是以朝向與搬送方向正交的方向(W方向)延伸的溝槽(寬方向溝槽)66”為終端。 The first additional non-contact chucks 62 ", 64" disposed in contact with the non-contact chucks 62 ', 64' are in contact with the non-contact chucks 62 ', 64' on one side. In the region, the pressurized fluid groove (pressurized gas flow path) 14 terminates in a groove (wide-direction groove) 66 ″ extending in a direction (W direction) orthogonal to the conveying direction.
並且,在第1追加非接觸吸著盤62”、64”的另一側的接觸區域,也就是與第2追加非接觸吸著盤62”、64”的接觸區域中,加壓流體溝槽(加壓氣體流路)14是以朝搬送方向延伸的溝槽68”為終端。 In addition, in the contact area on the other side of the first additional non-contact suction pads 62 ", 64", that is, the contact area with the second additional non-contact suction pads 62 ", 64", the pressurized fluid groove (Pressurized gas flow path) 14 terminates in a groove 68 "extending in the conveying direction.
再者,接觸配置於第1追加非接觸吸著盤62”、64”之另一側的第2追加非接觸吸著盤62”、64”, 在與一側的接觸區域,也就是與第1追加非接觸吸著盤62”、64”的接觸區域中,加壓流體溝槽(加壓氣體流路)14是以朝向與搬送方向正交的方向(W方向)延伸的溝槽(寬方向溝槽)66”為終端。 Furthermore, the second additional non-contact chucks 62 ", 64" arranged on the other side of the first additional non-contact chucks 62 ", 64", In the contact area with one side, that is, the contact area with the first additional non-contact suction pads 62 ", 64", the pressurized fluid groove (pressurized gas flow path) 14 is oriented orthogonally to the conveying direction The groove (wide groove) 66 "extending in the direction (W direction) is the terminal.
並且,在第2追加非接觸吸著盤62”、64”的另一側,加壓流體溝槽14是以朝搬送方向延伸的溝槽68”為終端。 On the other side of the second non-contact suction pads 62 "and 64", the pressurized fluid groove 14 is terminated with a groove 68 "extending in the conveying direction.
該構造中,相鄰的非接觸吸著盤間的吸引孔8的寬方向(W方向)間隔d4設定成與同一非接觸吸著盤內的吸引孔8的寬方向(W方向)間隔d5大致相等。 In this structure, the width (W direction) interval d4 of the suction holes 8 between adjacent non-contact suction plates is set to be approximately d5 from the width (W direction) of the suction holes 8 in the same non-contact suction plate. equal.
亦即,非接觸吸著盤62’的第1追加非接觸吸著盤62”側的吸引孔8,與接觸配置在非接觸吸著盤62’的第1追加非接觸吸著盤62”的非接觸吸著盤62’側的吸引孔8之間的寬方向(W方向)間隔d4,構成為與各非接觸吸著盤62’、62”內的吸引孔8間的寬方向(W方向)間隔d5大致相等。 In other words, the first additional non-contact suction plate 62 ′ side suction hole 8 of the non-contact suction plate 62 ′ is in contact with the first additional non-contact suction plate 62 ″ arranged on the non-contact suction plate 62 ′. The wide direction (W direction) interval d4 between the suction holes 8 on the non-contact suction pad 62 'side is configured to be the wide direction (W direction) between the suction holes 8 in each of the non-contact suction pads 62', 62 ". The interval d5 is approximately equal.
又再者,彼此相等的上述d4、d5構成為也與非接觸吸著盤內相鄰的吸引孔8的長邊方向間隔d6相等。 Furthermore, the above-mentioned d4 and d5 which are equal to each other are also configured to be equal to the longitudinal direction interval d6 of the suction holes 8 adjacent to each other in the non-contact suction pad.
接下來,針對本發明之第5實施樣態的非接觸搬送裝置90加以說明。 Next, a non-contact transfer device 90 according to a fifth embodiment of the present invention will be described.
第14圖是顯示本發明之第5實施形態的非接觸搬送裝置90中的非接觸吸著盤92、94的配置之圖。此外,第14圖的箭頭A所示的方向是工件搬送方向。 FIG. 14 is a diagram showing the arrangement of the non-contact chucks 92 and 94 in the non-contact transfer device 90 according to the fifth embodiment of the present invention. The direction shown by the arrow A in FIG. 14 is the workpiece conveyance direction.
第14圖所示的第5實施形態的非接觸搬送裝置90 中,第1非接觸吸著盤92及第2非接觸吸著盤94是以沿著搬送方向分開達預定距離的狀態排列。 Non-contact transfer device 90 according to the fifth embodiment shown in FIG. 14 Here, the first non-contact chuck disc 92 and the second non-contact chuck disc 94 are arranged in a state of being separated by a predetermined distance along the conveyance direction.
第1及第2非接觸吸著盤92、94係具備與上述非接觸吸著盤1同樣的基本構造。在多孔質墊2下方的墊保持器4是如多孔質墊2上的虛線所示,形成有格子狀的加壓氣體流路14,又,第1及第2非接觸吸著盤92、94與上述非接觸吸著盤1同樣具備形成在多孔質墊上的複數個吸引孔8。 The first and second non-contact chucks 92 and 94 have the same basic structure as the non-contact chuck 1 described above. The pad holder 4 below the porous pad 2 is formed with a grid-shaped pressurized gas flow path 14 as shown by a dotted line on the porous pad 2, and the first and second non-contact suction pads 92 and 94 are formed. Similar to the non-contact chuck 1 described above, a plurality of suction holes 8 formed in a porous pad are provided.
與上述非接觸吸著盤1的不同點在於:第1及第2非接觸吸著盤92、94除了加壓氣體流路14之外,還具備與該加壓氣體流路14分開的獨立加壓氣體流路96;以及具備形成不同於吸引孔8之吸引狀態的獨立吸引孔98。 The difference from the above-mentioned non-contact chuck 1 is that the first and second non-contact chucks 92 and 94 are provided with separate pressurized gas flow path 14 in addition to the pressurized gas flow path 14. The pressurized gas flow path 96; and an independent suction hole 98 formed to form a suction state different from the suction hole 8.
以下,針對這些點詳加說明。 These points are explained in detail below.
如上所述,第5實施形態的非接觸搬送裝置所使用的第1及第2非接觸吸著盤92、94中,獨立加壓氣體流路96是在與另一方的非接觸吸著盤94、92的連接之側的緣部,形成為與搬送方向A正交而延伸。詳言之,在第1及第2非接觸吸著盤92、94中,各獨立加壓氣體流路96係設在與其他非接觸吸著盤94、92的連接區域中,加壓氣體流路14的終端部的端(前端)側。 As described above, among the first and second non-contact chucks 92 and 94 used in the non-contact transfer device of the fifth embodiment, the independent pressurized gas flow path 96 is in contact with the other non-contact chuck 94 The edge part on the side of connection of 92 and 92 is formed so as to extend orthogonally to the conveyance direction A. Specifically, in the first and second non-contact chucks 92 and 94, each of the independent pressurized gas flow paths 96 is provided in a connection area with other non-contact chucks 94 and 92, and the pressurized gas flows The end (front end) side of the terminal portion of the path 14.
各獨立加壓氣體流路96是如第15圖所示,由與溝槽14分開,也就是以不與加壓氣體流路14連通的狀態形成在墊保持器4的獨立給氣溝槽96所構成(第15圖 中,為了明確表示獨立給氣溝槽96,而省略非接觸吸著盤92中的其他構造)。結果,可對獨立加壓氣體流路96供應不同於加壓氣體流路14的流量、壓力的加壓流體。 Each of the independent pressurized gas flow paths 96 is separated from the groove 14 as shown in FIG. 15, that is, the independent gas supply grooves 96 formed in the pad holder 4 in a state where they are not in communication with the pressurized gas flow path 14. Composition (Figure 15 (In order to clearly show the independent air supply groove 96, other structures in the non-contact suction plate 92 are omitted). As a result, a separate pressurized gas flow path 96 can be supplied with a pressurized fluid having a flow rate and a pressure different from those of the pressurized gas flow path 14.
再者,第5實施形態的非接觸搬送裝置所使用的第1及第2非接觸吸著盤92、94中,排列在與另一方的非接觸吸著盤94、92連接之側的吸氣孔,構成為不同於其他吸引孔8之吸引狀態的獨立吸引孔98。詳言之,在第1及第2非接觸吸著盤92、94中,位在最靠近另一方非接觸吸著盤94、92側(前端側)的吸引孔構成為獨立吸引孔98。 In addition, among the first and second non-contact suction pads 92 and 94 used in the non-contact transfer device of the fifth embodiment, the suction is arranged on the side connected to the other non-contact suction pads 94 and 92. The hole is configured as an independent suction hole 98 different from the suction state of the other suction holes 8. Specifically, among the first and second non-contact suction pads 92 and 94, the suction holes located closest to the other non-contact suction pads 94 and 92 (front end side) are configured as independent suction holes 98.
各獨立吸引孔98是如第15圖所示,與不同於各吸引孔8所連通的基座6的基座溝槽22之吸引溝槽100連通(第15圖中,為了明確表示獨立吸引孔98、吸引溝槽100,而省略非接觸吸著盤94中的其他構造。)。結果,獨立吸引孔98可設為不同於其他吸引孔8的吸引狀態。 Each of the independent suction holes 98 communicates with a suction groove 100 different from the base groove 22 of the base 6 to which each suction hole 8 communicates, as shown in FIG. 15 (in FIG. 15, in order to clearly show the independent suction holes 98. Attract the groove 100, and omit other structures in the non-contact chuck 94.). As a result, the independent suction hole 98 can be set to a suction state different from the other suction holes 8.
根據這種構造,在朝搬送方向串聯配置的兩片非接觸吸著盤92、94的連接區域中,可實現不同於其他區域的吸引狀態。因此,可藉由適當調整對於加壓氣體流路14及獨立加壓氣體流路96的加壓氣體供應狀態,以及吸引孔8及獨立吸引孔98的吸引狀態,順利地進行在兩片非接觸吸著盤92、94間的薄板狀工件的移送等。 According to this structure, a suction state different from the other regions can be achieved in the connection region between the two non-contact suction pads 92 and 94 arranged in series in the conveying direction. Therefore, by appropriately adjusting the supply state of the pressurized gas to the pressurized gas flow path 14 and the independent pressurized gas flow path 96, and the suction states of the suction holes 8 and the independent suction holes 98, it is possible to smoothly perform the two non-contacts. Transfer of thin-plate-like workpieces between the chucks 92 and 94 and the like.
此外,第5實施形態的非接觸搬送裝置所使用的非接觸吸著盤92、94中,獨立加壓氣體流路96係在與另一方的非接觸吸著盤94、92連接之側的緣部,形成與搬送方向A正交而延伸。然而,本發明之非接觸搬送裝置 所使用的非接觸吸著盤的獨立加壓氣體流路96的構造不限於此。 In the non-contact suction pads 92 and 94 used in the non-contact transfer device of the fifth embodiment, the independent pressurized gas flow path 96 is located on the edge of the side connected to the other non-contact suction pads 94 and 92. The part is formed to extend orthogonally to the conveying direction A. However, the non-contact transfer device of the present invention The structure of the independent pressurized gas flow path 96 of the non-contact chuck used is not limited to this.
例如,亦可如第16圖所示,以延伸在非接觸吸著盤的整個周緣的方式,設有獨立加壓氣體流路102的構造,或是如第17圖所示,以沿著非接觸吸著盤之兩側緣延伸的方式,設有獨立加壓氣體流路104的構造。 For example, as shown in FIG. 16, a structure in which an independent pressurized gas flow path 102 is provided so as to extend over the entire periphery of the non-contact chuck, or as shown in FIG. 17, The structure of the pressurized gas flow path 104 is provided so as to extend on both sides of the contact pad.
第17圖的構造中,可獨立控制工件之兩側緣的浮力。因此,藉由相對縮小或加大工件之兩側緣的浮力,可使工件在與搬送方向正交的方向形成凸狀或凹狀,並以非接觸狀態加以吸著保持。 In the structure of FIG. 17, the buoyancy of both side edges of the workpiece can be controlled independently. Therefore, by relatively reducing or increasing the buoyancy on both sides of the workpiece, the workpiece can be formed into a convex or concave shape in a direction orthogonal to the conveying direction, and can be held in a non-contact state by suction.
再者,亦可如第18圖所示,以在非接觸吸著盤的寬方向中央朝長邊方向延伸的方式,設有獨立加壓氣體流路106的構造,或是如第19圖所示,在非接觸吸著盤之前端側區域的寬方向中央,設有矩形的獨立加壓氣體流路108的構造。 Furthermore, as shown in FIG. 18, a structure in which an independent pressurized gas flow path 106 is provided so as to extend in the long-side direction at the center of the wide direction of the non-contact suction pad, or as shown in FIG. 19 As shown in the figure, a rectangular independent pressurized gas flow path 108 is provided at the center in the wide direction of the front-end region of the non-contact chuck.
第18圖的構造中,可獨立控制工件之寬方向中央部的浮力。因此可藉由相對加大或縮小工件之寬方向中央部的浮力,使工件在與搬送方向正交的方向形成凸狀或凹狀,並以非接觸狀態加以吸著保持。 In the structure of FIG. 18, the buoyancy of the center portion in the width direction of the workpiece can be independently controlled. Therefore, by relatively increasing or reducing the buoyancy of the central portion in the width direction of the workpiece, the workpiece can be formed in a convex or concave shape in a direction orthogonal to the conveying direction, and can be held in a non-contact state by suction.
再者,亦可組合第17圖所示的構造及第18圖所示的構造,成為具備:沿著非接觸吸著盤之兩側緣延伸的獨立加壓氣體流路;以及寬方向中央朝長邊方向延伸的獨立加壓氣體流路的非接觸吸著盤。 Furthermore, the structure shown in FIG. 17 and the structure shown in FIG. 18 may be combined to provide: independent pressurized gas flow paths extending along both side edges of the non-contact suction pad; Non-contact suction pad with independent pressurized gas flow path extending in the long side direction.
這些獨立加壓氣體流路102、104、106、108 也與獨立加壓氣體流路100同樣地,是在墊保持器4中由與溝槽14分開,也就是不與加壓氣體流路14連通的狀態形成的獨立給氣溝槽所構成。 These independent pressurized gas flow paths 102, 104, 106, 108 Similarly to the independent pressurized gas flow path 100, the pad holder 4 is configured by an independent gas supply groove formed in a state separated from the groove 14, that is, not in communication with the pressurized gas flow path 14.
又,第16圖至第19圖所示的實施形態中,以配置在獨立加壓氣體流路周圍的吸引孔作為獨立吸引孔為佳。 In the embodiment shown in Figs. 16 to 19, it is preferable that the suction holes arranged around the independent pressurized gas flow path are independent suction holes.
根據這種構造,在形成有獨立加壓氣體流路、獨立吸引孔的區域中,可實現不同於其他區域的吸引狀態。 According to this structure, in a region where an independent pressurized gas flow path and an independent suction hole are formed, a suction state different from other regions can be achieved.
亦可將上述本發明之各實施形態及其變形例的非接觸搬送裝置所使用的非接觸吸著盤,作為以非接觸狀態保持工件用的非接觸吸著盤來單獨使用。 The non-contact chuck used in the non-contact transfer device of each of the embodiments of the present invention and its modification may be used alone as a non-contact chuck for holding a workpiece in a non-contact state.
接下來,針對本發明之其他樣態的非接觸吸著盤加以說明。 Next, other non-contact chucks of the present invention will be described.
第20圖是顯示本發明之其他樣態的非接觸吸著盤120的概略平面圖。第20圖所示的非接觸吸著盤120的外形為圓形,但是具備與上述非接觸吸著盤1同樣的基本構造,具備有多孔質墊122、墊保持器、及基座6。非接觸吸著盤120也與上述非接觸吸著盤1同樣地,非接觸地吸著薄板狀的工件,然而是作為薄板狀的工件吸著保持裝置單獨來使用。 Fig. 20 is a schematic plan view showing a non-contact chuck 120 according to another aspect of the present invention. The outer shape of the non-contact chuck 120 shown in FIG. 20 is circular, but has the same basic structure as the non-contact chuck 1 described above, and includes a porous pad 122, a pad holder, and a base 6. The non-contact chuck 120 sucks a thin-plate-shaped workpiece in a non-contact manner in the same manner as the non-contact chuck 1 described above, but is used alone as a thin-plate-shaped workpiece suction holding device.
非接觸吸著盤120也是在多孔質墊122形成有與非接觸吸著盤1的吸引孔8同樣的吸引孔124。並且,設有與非接觸吸著盤1之加壓氣體流路14同樣的加壓氣體 流路126。此外,非接觸吸著盤120中,如多孔質墊上的虛線所示,加壓氣體流路126係由環狀及放射狀部分一體構成。 The non-contact suction pad 120 also has a suction hole 124 formed in the porous pad 122 similarly to the suction hole 8 of the non-contact suction pad 1. In addition, the same pressurized gas as the pressurized gas flow path 14 of the non-contact chuck 1 is provided. Flow path 126. In addition, in the non-contact chuck 120, as shown by a dotted line on the porous pad, the pressurized gas flow path 126 is integrally formed of a ring-shaped and radial portion.
非接觸吸著盤120在墊保持器的周緣部設有與加壓氣體流路126分開的環狀獨立加壓氣體流路128。獨立加壓氣體流路128與第5實施形態的獨立加壓氣體流路96同樣地不與加壓氣體流路126連通,而是構成可供給不同於供給至加壓氣體流路126的加壓氣體的流量、壓力等的加壓氣體。 The non-contact suction pad 120 is provided with a ring-shaped independent pressurized gas flow path 128 that is separated from the pressurized gas flow path 126 at a peripheral portion of the pad holder. The independent pressurized gas flow path 128 is similar to the independent pressurized gas flow path 96 of the fifth embodiment in that it does not communicate with the pressurized gas flow path 126 and is configured to be capable of supplying a pressure different from that supplied to the pressurized gas flow path 126. Pressurized gas such as the flow rate and pressure of the gas.
結果,利用非接觸吸著盤120吸著保持圓形工件的情況,便可僅相對加強或減弱對工件之外緣部的吸引,以非接觸方式將工件吸著保持成凸狀或凹狀等。 As a result, by using the non-contact suction plate 120 to hold and hold a round workpiece, it is only possible to relatively strengthen or weaken the attraction of the outer edge of the workpiece, and to hold and hold the workpiece in a convex or concave shape in a non-contact manner. .
非接觸吸著盤120中,吸引孔124是全部形成相同的吸引狀態,但是亦可如上述第5實施樣態,將一部份的吸引孔作為獨立吸引孔的構造。 In the non-contact chuck 120, the suction holes 124 all form the same suction state. However, as in the fifth embodiment, a part of the suction holes may be used as a structure of independent suction holes.
第21圖是顯示上述本發明之其他樣態的非接觸吸著盤120之變形例的非接觸吸著盤130的圖。 FIG. 21 is a diagram showing a non-contact chuck 130 of a modified example of the non-contact chuck 120 in another aspect of the present invention.
第21圖所示的非接觸吸著盤130與非接觸吸著盤120不同之處在於:將非接觸吸著盤120中一體構成的加壓氣體流路126,分開成為中心部的第1加壓氣體流路132及徑向中間部的第2加壓氣體流路134,而可分別對其供給不同流量、壓力的加壓氣體。 The non-contact chuck 130 shown in FIG. 21 is different from the non-contact chuck 120 in that the pressurized gas flow path 126 integrally formed in the non-contact chuck 120 is divided into the first part of the central part. The pressurized gas flow path 132 and the second pressurized gas flow path 134 in the radial middle portion can be respectively supplied with pressurized gas having different flow rates and pressures.
再者,吸引孔也是構成為中心部的第1吸引孔136、徑向中間部的第2吸引孔138、以及徑向外側部的 第3吸引孔140分別成為獨立的吸引狀態。 In addition, the suction hole is also configured as a first suction hole 136 at the center portion, a second suction hole 138 at the radial middle portion, and a radially outer portion. Each of the third suction holes 140 is in an independent suction state.
根據這種構造,可藉由適當調整對於各加壓氣體流路的加壓氣體供給狀態、以及從各吸引孔的吸引狀態,使工件的吸著保持狀態最佳化。 According to this structure, the suction holding state of the workpiece can be optimized by appropriately adjusting the supply state of the pressurized gas to each of the pressurized gas flow paths and the suction state from each suction hole.
不限於本發明之前述實施形態,而可在申請專利範圍所記載的技術性思想的範圍內進行各種變更、變形。 It is not limited to the aforementioned embodiment of the present invention, and various changes and modifications can be made within the scope of the technical idea described in the scope of patent application.
此外,上述實施形態是使用加壓空氣作為加壓流體,但是亦可使用加壓後的其他流體,例如水、油、氮氣、氬氣等來取代加壓空氣。 In addition, in the above embodiment, pressurized air is used as the pressurized fluid, but other fluids that are pressurized, such as water, oil, nitrogen, argon, etc. may be used instead of pressurized air.
Claims (20)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014260764 | 2014-12-24 | ||
JP2014-260764 | 2014-12-24 | ||
JP2015243182A JP6949455B2 (en) | 2014-12-24 | 2015-12-14 | Non-contact transfer device and non-contact suction plate |
JP2015-243182 | 2015-12-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201634369A TW201634369A (en) | 2016-10-01 |
TWI665146B true TWI665146B (en) | 2019-07-11 |
Family
ID=56328133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104143334A TWI665146B (en) | 2014-12-24 | 2015-12-23 | Non-contact transferring device and non-contact suction plate |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP6949455B2 (en) |
KR (1) | KR102552128B1 (en) |
TW (1) | TWI665146B (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6949455B2 (en) * | 2014-12-24 | 2021-10-13 | 株式会社タンケンシールセーコウ | Non-contact transfer device and non-contact suction plate |
CN106743662A (en) * | 2017-03-30 | 2017-05-31 | 武汉华星光电技术有限公司 | Glass substrate conveyor structure |
US10513011B2 (en) * | 2017-11-08 | 2019-12-24 | Core Flow Ltd. | Layered noncontact support platform |
CN108508638B (en) * | 2018-03-15 | 2021-03-09 | 中电科风华信息装备股份有限公司 | Liquid crystal display carrying manipulator butt joint device |
JP6853520B2 (en) * | 2018-09-20 | 2021-03-31 | 株式会社Nsc | Floating transfer device |
US20200266092A1 (en) * | 2019-02-19 | 2020-08-20 | Corning Incorporated | Apparatuses and methods for non-contact holding and measurement of thin substrates |
CN110498233B (en) * | 2019-07-26 | 2021-04-27 | 江苏科技大学 | Two-dimensional non-contact conveying platform device |
CN110743882B (en) * | 2019-10-28 | 2021-11-23 | 衡阳海之波商贸有限公司 | Vertical conveying type glass cleaning and feeding mechanism |
WO2023063048A1 (en) | 2021-10-12 | 2023-04-20 | 日本製鉄株式会社 | Hot-stamp-molded object |
CN115156142B (en) * | 2022-05-30 | 2024-04-30 | 江苏亚电科技股份有限公司 | PSG water film spraying mechanism and photovoltaic silicon wafer water film attaching method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101872734A (en) * | 2009-04-21 | 2010-10-27 | 精工爱普生株式会社 | Suction hold hand, sucking and holding method and conveying device |
CN101872735A (en) * | 2009-04-23 | 2010-10-27 | 精工爱普生株式会社 | Attract holding device, sucking and holding method, conveying device and carrying method |
US20110061999A1 (en) * | 2008-05-13 | 2011-03-17 | Ho-Young Cho | Non-contact type of vacuum pad |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5512052B2 (en) * | 1972-12-12 | 1980-03-29 | ||
JPS5512052U (en) | 1978-07-11 | 1980-01-25 | ||
JP4307872B2 (en) * | 2003-03-18 | 2009-08-05 | オリンパス株式会社 | Board inspection equipment |
WO2006052919A1 (en) * | 2004-11-08 | 2006-05-18 | New Way Machine Components, Inc. | Non-contact porous air bearing and glass flattening device |
JP2007008644A (en) * | 2005-06-29 | 2007-01-18 | Ckd Corp | Conveying device for plate-like work |
JP4553376B2 (en) | 2005-07-19 | 2010-09-29 | 東京エレクトロン株式会社 | Floating substrate transfer processing apparatus and floating substrate transfer processing method |
JP2010260715A (en) * | 2009-04-07 | 2010-11-18 | Myotoku Ltd | Levitation unit and levitation device |
JP2010254453A (en) * | 2009-04-27 | 2010-11-11 | Myotoku Ltd | Floating device |
TWI527747B (en) * | 2012-02-28 | 2016-04-01 | 炭研軸封精工股份有限公司 | Non-contact adsorbing disk |
JP6949455B2 (en) * | 2014-12-24 | 2021-10-13 | 株式会社タンケンシールセーコウ | Non-contact transfer device and non-contact suction plate |
-
2015
- 2015-12-14 JP JP2015243182A patent/JP6949455B2/en active Active
- 2015-12-23 TW TW104143334A patent/TWI665146B/en active
- 2015-12-23 KR KR1020150184748A patent/KR102552128B1/en active IP Right Grant
-
2021
- 2021-07-07 JP JP2021112845A patent/JP2021167251A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110061999A1 (en) * | 2008-05-13 | 2011-03-17 | Ho-Young Cho | Non-contact type of vacuum pad |
CN101872734A (en) * | 2009-04-21 | 2010-10-27 | 精工爱普生株式会社 | Suction hold hand, sucking and holding method and conveying device |
CN101872735A (en) * | 2009-04-23 | 2010-10-27 | 精工爱普生株式会社 | Attract holding device, sucking and holding method, conveying device and carrying method |
Also Published As
Publication number | Publication date |
---|---|
KR20160078280A (en) | 2016-07-04 |
JP2021167251A (en) | 2021-10-21 |
JP6949455B2 (en) | 2021-10-13 |
KR102552128B1 (en) | 2023-07-06 |
TW201634369A (en) | 2016-10-01 |
JP2016121015A (en) | 2016-07-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI665146B (en) | Non-contact transferring device and non-contact suction plate | |
KR101697839B1 (en) | Non-contact suction plate | |
WO2017154085A1 (en) | Conveyance pad, and conveyance device and conveyance method using same | |
US8905680B2 (en) | Ultrathin wafer transport systems | |
TW201002596A (en) | Swirl flow forming body and non-contact conveying device | |
TWI675788B (en) | Substrate suspension transport device | |
JP2009032744A (en) | Bernoulli chuck | |
JP2024026194A (en) | Wafer transport device | |
KR101261313B1 (en) | Apparatus for aligning and pick up transporting of moving object | |
JP2011151233A (en) | Transfer mechanism | |
JP2006135083A (en) | Noncontact support apparatus | |
CN105731068B (en) | Non-contact transport apparatus and non-contact adhesion disk | |
JP4812660B2 (en) | Substrate handling equipment and substrate handling method | |
JP2016103626A (en) | Pad for transfer, transfer device employing the same, and transfer method | |
JP2002280439A (en) | Carrier device | |
JP5422680B2 (en) | Substrate holding device | |
JP6079529B2 (en) | Support mechanism and transfer device | |
JP2014047020A (en) | Levitation device | |
JP5987528B2 (en) | Ascent equipment | |
JPWO2015125756A1 (en) | Air bearing device and measuring device | |
GB2502617A (en) | Aligning and transporting workpieces using differential airflows | |
TW202336912A (en) | Suction gripping device and method for receiving and storing flat flexible substrates | |
JP2005191553A (en) | Workpiece levitation device | |
TW201900299A (en) | Non-contact sucker made in laser deposition and non-contact sucker device | |
JP2019102584A (en) | Substrate suction device |