TW201900299A - Non-contact sucker made in laser deposition and non-contact sucker device - Google Patents

Abstract

A non-contact sucker provided in the present invention is made in laser deposition to form a sucker body and a plurality of jet holes. The non-contact sucker has a thin structure in a predetermined suction direction. A non-contact sucker device made in laser deposition is also provided in the present invention, comprising a holding member, and non-contact suckers disposed on the holding member. The non-contact sucker made in laser deposition is provided with a thin structure in which the holding member is connected in a predetermined suction direction. The non-contact sucker is formed with a plurality of jet holes. The holding member attracts a substrate in a non-contact manner in the suction direction by injecting a gas stream from the jet hole of the non-contact sucker.

Description

Non-contact suction cup manufactured by laser laminated method and non-contact suction cup device

The present invention relates to a suction cup and a suction cup device, and more particularly to a non-contact suction cup manufactured by a laser laminate method and a non-contact suction cup device.

Semiconductor wafers are usually composed of a single crystal material formed of a compound of cerium or a plurality of elements, and are widely used in the manufacture of electronic component materials. In the semiconductor wafer manufacturing method, the molten material is first drawn into a single-crystal cylindrical ingot, and then sliced into a substrate shape and polished to obtain a desired thickness. However, with the technological development of the semiconductor industry, the thickness of semiconductor wafers is usually limited to the order of millimeters for better performance and smaller product volume. Such a thin thickness causes the wafer to be easily warped. Especially when the wafer is placed on the wafer cassette, since there is no other leveling device to flatten the wafer, the wafer may have a large warpage in the cassette.

In order not to damage the wafer, the robot is usually moved by a robotic arm equipped with a non-contact suction cup. Even so, even a non-contact robotic arm can accidentally touch and damage the wafer due to the thickness of the suction cup for wafers that are warped in the wafer cassette.

In addition, since the non-contact type suction cup utilizes the principle of air flow to adsorb the wafer, the design of the nozzle hole on the non-contact type suction cup is quite complicated. The orifice is usually formed in the suction hole by means of a perforation. However, the size of the non-contact suction cup is relatively small, so that it is difficult to manufacture and costly.

Accordingly, in order to solve the above problems, it is an object of the present invention to provide a non-contact type suction cup and a non-contact type suction cup apparatus which are manufactured by a laser laminated method.

The technical means adopted by the present invention to solve the problems of the prior art is to provide a non-contact type suction cup which is manufactured by a laser laminate to form a suction cup body and a plurality of spray holes, the non-contact suction cup being at a preset It has a thin structure in the direction of adsorption.

In an embodiment of the invention, a non-contact type suction cup is provided, the non-contact type suction cup having a thickness of 1.2 mm or less in the adsorption direction.

In an embodiment of the invention, a non-contact type suction cup is provided, the thickness of the non-contact type suction cup in the adsorption direction being 0.5 mm or less.

The technical means for solving the problems of the prior art provides a non-contact suction cup device manufactured by a laser laminate method, comprising: a holding member; and a non-contact suction cup disposed on the holding member The non-contact suction cup has a thin structure connecting the holding members in a predetermined adsorption direction by means of a laser laminate, and the non-contact suction cup is formed with a plurality of spray holes, wherein the suction member is formed by The gas stream is ejected from the nozzle hole of the non-contact type suction cup, and a substrate is non-contactly adsorbed in the adsorption direction.

In an embodiment of the present invention, there is provided a non-contact type suction cup device manufactured by a laser lamination method, the non-contact type suction cup having a thickness of 1.2 mm or less in the adsorption direction.

In an embodiment of the present invention, there is provided a non-contact type suction cup device manufactured by a laser lamination method, the non-contact type suction cup having a thickness of 0.5 mm or less in the adsorption direction.

In an embodiment of the invention, there is provided a non-contact suction cup device manufactured by a laser laminate method, the suction member being V-shaped having two fork tip members projecting forward.

In an embodiment of the present invention, a non-contact type suction cup device manufactured by a laser laminate method is provided. The non-contact type suction cups are disposed in the plurality of non-contact type suction cups, and the holding member is formed by the plurality of non-contacting members. The jet orifice of the contact chuck injects a gas stream, and the substrate is non-contactly adsorbed in the adsorption direction.

In an embodiment of the present invention, a non-contact suction cup device manufactured by a laser laminate method is provided. The adsorption surfaces of the plurality of non-contact suction cups are located in a coplanar manner, and the holding members are separated by the plurality of non-contact types. The suction of the suction cup flattens the substrate.

In an embodiment of the invention, a non-contact suction cup device manufactured by a laser lamination method is provided, further comprising a moving member connected to the holding member to transfer the substrate.

Through the technical means adopted by the present invention, the non-contact type suction cup manufactured by the laser lamination method can be directly designed and formed, and no additional chiseling orifice is needed, which greatly increases the manufacturing success rate, reduces the production cost, and improves the manufacturing process. In addition, the non-contact type suction cup can be made lighter in weight and thinner in thickness, which facilitates transport of the substrate without causing accidental damage to the substrate. Moreover, under the same load, the holding member can be arranged with more and denser non-contact suction cups, so that the non-contact suction cup device can more uniformly adsorb and level the substrate.

The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.

Hereinafter, embodiments of the present invention will be described based on Figs. 1 to 2 . This description is not intended to limit the embodiments of the invention, but is an embodiment of the invention.

As shown in FIGS. 1 and 2, the non-contact suction cup device 100 includes a holding member 1 and a plurality of non-contact suction cups 2.

As shown in FIG. 2, a plurality of non-contact suction cups 2 are disposed on the holding member 1, and the non-contact suction cups 2 have a connecting suction member in a predetermined adsorption direction V by means of a laser laminate. 1 thin structure. The non-contact type suction cup 2 is manufactured by a laser laminate to form a plurality of spray holes 21 and a suction cup body 22, and the suction member 1 ejects air flow from the plurality of non-contact suction cups 2, The adsorption direction V adsorbs a substrate W non-contactly. The substrate W may be a wafer that has not been cut, or a sheet-like crystal grain carrier in a fan-out process (a plurality of crystal grains are bonded to one carrier), and the present invention is not limited thereto.

Since the non-contact type suction cup 2 is formed by means of a laser laminate, the nozzle hole 21 is not formed by drilling, drilling, or the like, but the nozzle hole is reserved directly in the form of a laser layer. 21 spaces. In other words, the non-contact suction cup 2 completed by the laser lamination does not require individual secondary processing, and there is no problem that the perforation fails or the perforation is too difficult, and the process can be further simplified and the production cost can be reduced. .

In the present embodiment, the non-contact type suction cup 2 is a white Nuo suction cup, and the suction member 1 sprays airflow toward the periphery of the suction cup by the nozzle holes 21 of the plurality of white Nuo suction cups 2, and adsorbs along the periphery of the suction cup by the Bainuoli principle. The substrate V is non-contactly adsorbed in the direction V. However, the present invention is not limited thereto, and the non-contact type suction cup 2 may be other types of non-contact type suction cups, such as a cyclone type suction cup.

In the present embodiment, the non-contact type suction cups 2 are plural and have a small area, and are disposed at a plurality of positions of the holding member 1. However, the present invention is not limited thereto, and the non-contact type suction cup 2 may be of a single one and have a large area, for example, a size matching the holding member 1 to cover the holding member 1, and the holding member 1 is self-contained. The jet hole 21 of the contact chuck 2 ejects a gas stream, and the substrate W is non-contactly adsorbed in the adsorption direction V.

Preferably, the non-contact type suction cup 2 has a thickness in the adsorption direction V of 1.2 mm or less.

Preferably, the thickness of the non-contact type suction cup 2 in the adsorption direction V is 0.5 mm or less.

Preferably, the adsorption surfaces of the plurality of non-contact suction cups 2 are located in a coplanar plane, so that the holding member 1 flattens the substrate W by the suction of the plurality of non-contact suction cups 2.

Since the non-contact type suction cup 2 has a thin structure, it is lighter in weight and is advantageous in reducing the load of the holding member 1. On the other hand, this means that under the same load, the holding member 1 can be arranged with more and denser non-contact suction cups 2, so that the non-contact suction cup device 100 can more uniformly adsorb and level the substrate W. .

In the present embodiment, the holding member 1 is V-shaped and has two fork tip members projecting forward, and a plurality of non-contact suction cups 2 are respectively disposed on the two fork tip members. However, the present invention is not limited thereto, and the holding member 1 may have other suitable shapes and patterns. For example, the holding member 1 may have a plurality of forwardly projecting claws, each of which is singly disposed at a front end of the claws. The holding member 1 can also be a loading table, and a single or a plurality of non-contact suction cups 2 are provided. The two holding members 1 are opposite to each other in a vertical gravity direction to cooperatively adsorb the substrate W, so that the substrate W is stably located at two. The middle of the holding member 1.

Further, as shown in FIG. 1, the non-contact type suction cup device 100 of the present invention further includes a moving member 3 that connects the holding member 1 to transfer the substrate W.

In summary, the non-contact suction cup device manufactured by the laser laminate method of the present invention can solve the problem of the thickness of the suction cup of the prior art, and the non-contact type suction cup is thinner and more optimized, and the substrate is not facilitated. Causes accidental damage to the substrate.

The above description and description are only illustrative of the preferred embodiments of the present invention, and those of ordinary skill in the art can make other modifications in accordance with the scope of the invention as defined below and the description above, but such modifications should still be It is within the scope of the invention to the invention of the invention.

100‧‧‧ Non-contact suction cup device

1‧‧‧ holding member

2‧‧‧ Non-contact suction cups

21‧‧‧Spurs

22‧‧‧Sucker body

3‧‧‧Mobile components

V‧‧‧Adsorption direction

W‧‧‧Substrate

1 is a perspective view showing a non-contact type suction cup device manufactured by a laser lamination method according to an embodiment of the present invention. Fig. 2 is a side view showing a non-contact type suction cup device manufactured by a laser lamination method according to an embodiment of the present invention.

Claims (10)

A non-contact type suction cup is manufactured by laser lamination to form a suction cup body and a plurality of spray holes, and the non-contact suction cup has a thin structure in a predetermined adsorption direction. The non-contact type suction cup according to claim 1, wherein the non-contact type suction cup has a thickness of 1.2 mm or less in the adsorption direction. The non-contact type suction cup according to claim 1, wherein the non-contact type suction cup has a thickness of 0.5 mm or less in the adsorption direction. A non-contact suction cup device manufactured by a laser laminate method, comprising: a holding member; a non-contact type suction cup is disposed on the holding member, and the non-contact type suction cup has a thin structure connecting the holding members in a predetermined adsorption direction by means of a laser laminate, and the non-contact type suction cup is formed with a plurality of jet orifices, wherein the suction member non-contactly adsorbs a substrate in the adsorption direction by injecting a gas flow from the orifice of the non-contact chuck. A non-contact type suction cup device manufactured by the laser laminate method according to claim 4, wherein the non-contact type suction cup has a thickness of 1.2 mm or less in the adsorption direction. A non-contact type suction cup device manufactured by the laser laminate method according to claim 5, wherein the non-contact type suction cup has a thickness of 0.5 mm or less in the adsorption direction. A non-contact type suction cup device manufactured by the laser beam stacking method according to claim 4, wherein the holding member is V-shaped and has two fork tip members projecting forward. The non-contact type suction cup device manufactured by the method of claim 4, wherein the non-contact type suction cups are plural, disposed on the holding member, and the holding member is formed by the plurality of non-contact suction cups The jet orifice injects a gas stream, and the substrate is non-contactly adsorbed in the adsorption direction. The contactless chuck device manufactured by the laser beam stacking method according to claim 8, wherein the adsorption surface of the plurality of non-contact suction cups is located at a coplanar surface, and the suction member absorbs the suction force of the plurality of non-contact suction cups The substrate is leveled. The non-contact suction cup device manufactured by the laser laminate method according to claim 4, further comprising a moving member connected to the holding member to transfer the substrate.