WO2013129599A1 - Non-contact suction plate - Google Patents

Non-contact suction plate Download PDF

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Publication number
WO2013129599A1
WO2013129599A1 PCT/JP2013/055491 JP2013055491W WO2013129599A1 WO 2013129599 A1 WO2013129599 A1 WO 2013129599A1 JP 2013055491 W JP2013055491 W JP 2013055491W WO 2013129599 A1 WO2013129599 A1 WO 2013129599A1
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WO
WIPO (PCT)
Prior art keywords
holder
porous pad
sealed space
pad
suction
Prior art date
Application number
PCT/JP2013/055491
Other languages
French (fr)
Japanese (ja)
Inventor
清隆 藤平
Original Assignee
株式会社タンケンシールセーコウ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社タンケンシールセーコウ filed Critical 株式会社タンケンシールセーコウ
Priority to CN201380010718.2A priority Critical patent/CN104137247B/en
Priority to JP2013542287A priority patent/JP5512052B2/en
Priority to KR1020147024329A priority patent/KR101697839B1/en
Publication of WO2013129599A1 publication Critical patent/WO2013129599A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the present invention relates to a non-contact suction disk, and more particularly, to a non-contact suction disk in which the work surface is lifted by pressurized air and the work is sucked by suction at the same time.
  • a so-called vacuum tweezers is known as an apparatus for handling a workpiece having a very thin thickness such as a semiconductor wafer, a glass substrate for FPD, and the like.
  • the vacuum tweezers handle the workpiece in contact with the workpiece, there are problems such as applying stress to the workpiece.
  • Patent Documents 1 and 2 As a device that handles non-contacted workpieces such as glass substrates for FPDs in a non-contact manner without applying stress or the like, pressurized air is ejected from the pores of the porous plate to float the workpiece, Devices that transport on a plate have been proposed (for example, Patent Documents 1 and 2).
  • Bernoulli chucking using the so-called “Bernoulli principle” has been proposed as a device that can hold a thin work piece in a contactless downward direction.
  • the compressed air from the air compressor is blown along the lower surface while swirling in the recess formed in the lower surface of the chucking.
  • This is a device that generates buoyancy and sucks and holds a thin workpiece such as a semiconductor wafer on the lower surface of chucking in a non-contact manner.
  • the present invention has been made to solve such problems, and provides a non-contact suction disk capable of holding and sucking a thin workpiece at a predetermined position or holding and sucking it downward. Objective.
  • a non-contact suction disk for adsorbing a thin plate-shaped object to be adsorbed in a non-contact state A plate-like porous pad in which a plurality of air holes extending through in the thickness direction are formed in the adsorption fixing region; A first sealed space disposed adjacent to the back surface of the porous pad; A second sealed space isolated from the first sealed space; Communicating means for communicating the second sealed space and the vent hole; A non-contact suction disk is provided.
  • the first sealed space is communicated with the pressurized air source, and the second sealed space is communicated with the suction decompression source, so that the pressurized air is discharged from the pores on the surface of the porous pad. Air can be sucked from the vents on the surface of the porous pad while jetting.
  • the work can be floated on the surface of the porous pad with pressurized air while being held at a predetermined position by suction.
  • a thin workpiece such as a semiconductor wafer is held and adsorbed at a predetermined position on the surface of the porous pad facing upward, or downward on the lower side of the surface of the porous pad facing downward. It can be held and adsorbed without contact. Since the suction pressure (decompression) and the supply pressure (pressurization) can be adjusted independently, the gripping force and the levitation force can be controlled. Therefore, adjustment of the floating gap is also possible.
  • a plate-like holder having a surface laminated on the back side of the porous pad, and a recess that forms the first sealed space with the back side of the porous pad;
  • a base that is laminated on the back side of the holder and forms a second sealed space between the back side of the holder, and
  • the holder has a communication hole that has one end connected to the air hole of the porous pad during the lamination and the other end opened to the back surface of the holder and functions as the communication means.
  • the holder includes a plurality of island-shaped protrusions including a flat top portion that comes into contact with the back surface of the porous pad at the position of the back side opening ends of the plurality of vent holes,
  • the communication hole extends through the protrusion,
  • the space between the protrusions is the first sealed space.
  • the base includes a plurality of island-shaped protrusions provided on the surface with flat tops that contact the back surface of the holder during the connection,
  • the space between the protrusions is a pressure reducing flow path, and the other end of the communication hole is in fluid communication with the pressure reducing flow path.
  • the plurality of protrusions have a rectangular cross-sectional shape and are arranged in a grid pattern.
  • the first sealed space is formed as a grid-like flow path for pressurized air. According to such a configuration, the pressurized air can be uniformly ejected from the pores of the porous pad.
  • the decompression grooves are arranged in a lattice pattern. According to such a structure, pressurized air can be uniformly ejected from the vent hole of the porous pad.
  • the other end of the communication hole is in fluid communication with the pressure reducing groove at the intersection of the lattice-shaped pressure reducing grooves. According to such a configuration, it is possible to efficiently perform suction from the communication hole.
  • Laminated on the back side of the porous pad comprising a plate-like holder having a through hole corresponding to the vent of the porous pad, Furthermore, it is laminated on the back side of the holder, and includes a base that forms a second sealed space between the back side of the holder, A recess forming the first sealed space is formed between the holder and the back surface of the porous pad, The air hole of the porous pad is connected to the through hole of the holder and functions as the communication means.
  • a frame member having an annular portion disposed between the holder and the base;
  • the second sealed space is formed by an internal space of the annular portion.
  • a ventilation hole of the porous pad penetrates the island-shaped protrusion.
  • the first sealed space is a space for pressurized air;
  • the second sealed space is a decompression space.
  • the air holes are distributed and arranged over the entire surface of the porous pad, According to such a configuration, the entire surface of the porous pad can be used as an adsorption fixing region.
  • the porous pad is made of porous carbon.
  • a non-contact suction disk capable of holding and sucking a thin workpiece at a predetermined position or holding and sucking it downward.
  • FIG. 4 is a surface obtained by enlarging a part of a cross section taken along line IV-IV in FIG. 3. It is a top view of the holder of the non-contact suction disk of FIG. It is a bottom view of the holder of the non-contact suction disk of FIG. It is a top view of the base of the non-contact suction disk of FIG. It is a bottom view of the modification of the holder of a non-contact suction disk.
  • FIG. 1 It is a bottom view of another modification of the holder of a non-contact suction disk. It is typical sectional drawing for demonstrating the state of the adsorption
  • FIG. 1 is an exploded perspective view of the non-contact suction disk 1 according to the first embodiment of the present invention.
  • the non-contact suction disk 1 of this embodiment is a non-contact suction for sucking a thin plate-like object (work) such as a semiconductor wafer, a glass substrate for FPD, for example, a semiconductor wafer having a thickness of 100 ⁇ m or less in a non-contact state It is a board.
  • the non-contact suction disk 1 is a disk-shaped porous pad 2 having a work suction area on the upper surface, and an approximately holding the porous pad 2 from the lower side (back side).
  • a disk-shaped pad holder 4 and a substantially disk-shaped base 6 connected to the back side of the holder 4 are provided.
  • the porous pad 2 is made of breathable porous carbon.
  • the material of the porous pad 2 is not limited to breathable porous carbon, and other breathable porous materials such as porous SiC / porous alumina can also be used.
  • FIG. 2 is a top view of the porous pad 2
  • FIG. 3 is a bottom view of the porous pad 2.
  • a plurality of suction holes (vent holes) 8 are formed in the porous pad 2. As shown in FIGS. 2 and 3, the suction holes 8 are arranged in a lattice pattern over substantially the entire surface of the porous pad 2, that is, in a state of being arranged on the intersections of the grids. Yes. In the present embodiment, the interval between the suction holes 8 is set to about 25 mm.
  • FIG. 4 is a surface obtained by enlarging a part of the cross section along the line VI-VI in FIG.
  • the suction holes 8 are formed so as to extend through the respective porous pads 2 in the thickness direction.
  • the suction hole 8 has a small diameter portion 8a having a diameter of about 0.6 mm on the surface 2a side of the porous pad 2, and a large diameter portion 8b having a diameter of about 4 mm on the back surface 2b side of the porous pad 2, and the small diameter portion 8a and the large diameter.
  • the portion 8b is connected by a tapered portion 8c that tapers toward the surface 2a of the porous pad 2.
  • a connecting hole 10 through which a fastener such as a screw for connecting the porous pad to the pad holder 4 or the like is inserted is formed in the peripheral portion of the porous pad 2.
  • FIG. 5 is a top view of the pad holder 4, and FIG. 6 is a bottom view of the pad holder 4.
  • the pad holder 4 is a substantially disk-shaped member that holds the porous pad 2 from the lower side (back side), and is formed of a metal material such as an aluminum alloy, for example.
  • the pad holder 4 can also be formed of a resin such as CFRP / PEEK.
  • an annular rising portion 12 is formed on the outer periphery of the upper surface of the pad holder 4.
  • the rising portion 12 is configured such that the inner diameter is slightly larger than the outer diameter of the porous pad 2 and the height is slightly lower than the thickness of the porous pad 2.
  • the upper surface 2 a of the porous pad 2 is slightly more than the top surface of the rising portion 12 of the pad holder 4. It will be in the state arranged above.
  • grooves 14 having a rectangular cross section are formed in a lattice shape (a grid pattern), and a portion delimited by the grooves 14 is crossed.
  • the surface is a square island-shaped protrusion 16.
  • the island-shaped protrusions 16 form a grid-like arrangement along with the grooves 14 arranged in a grid pattern (a grid-like pattern).
  • the top surface of each protrusion 14 is flat, and a communication hole 18 that penetrates the pad holder 4 in the thickness direction is formed in the center.
  • the porous pad 2 and the pad holder 4 are bonded and fixed by an adhesive in a state where the porous pad 2 is disposed in the space inside the rising portion 12 of the pad holder 4.
  • the porous pad 2 and the pad holder 4 are further connected and fixed to each other by a fastener such as a bolt.
  • the protruding portion 14 When the porous pad 2 is disposed in the space inside the rising portion 12 of the pad holder 4, the protruding portion 14 has an open end of the large diameter portion 8 b of the suction hole 8 on the back surface 2 b of the porous pad 2. It is comprised so that it may contact
  • a sealed space (first sealed space) is formed by the groove 14 and the porous pad 2 covering the groove 14.
  • the communication hole 18 has substantially the same diameter as the large diameter portion 8 b of the suction hole 8 of the porous pad 2, and the porous pad 2 is in a space inside the rising portion 12 of the pad holder 4 at a predetermined angular position.
  • each suction port 8 formed in the porous pad 2 is arranged in the thickness direction.
  • the sealed space (first sealed space) formed by the groove 14 communicates with the external space of the pad holder 4, and pressurized air is introduced into this sealed space (first sealed space).
  • a pressurized air inlet 20 is formed for this purpose.
  • the pressurized air is formed by the groove 14 and the porous pad 2 from the pressurized air inlet 20.
  • the pressurized air penetrates into the pores of the porous pad 2 constituting the upper surface of the sealed space (first sealed space), passes through the porous pad 2, It will be ejected from the entire surface of the porous pad 2.
  • FIG. 7 is a top view of the base 6.
  • the base 6 is a substantially disk-shaped member connected to the back side of the holder 4 and is formed of a metal material such as an aluminum alloy, for example.
  • the base 6 can also be formed of a resin such as CFRP / PEEK.
  • the base 6 has substantially the same diameter as the pad holder 4, and base grooves 22 having a rectangular cross section are formed in a lattice shape on a flat upper surface. Therefore, when the flat back surface of the pad holder 4 and the upper surface of the base 6 are joined, the lattice-shaped base groove 22 and the back surface of the pad holder 4 that covers the lattice-shaped base groove 22 (second sealed space). Will be formed.
  • the base groove 22 is configured such that when the pad holder 4 and the base 6 are joined at a predetermined angular position, the lattice-shaped base groove 22 is aligned with the communication hole 18 formed in the pad holder 4 in the thickness direction. Has been.
  • the suction hole 8 of the porous pad 2 passes through the communication hole 18 of the pad holder 4. , It communicates with the intersection of the lattice-shaped sealed space (second sealed space) formed between the base 6 and the pad holder 4.
  • a vacuum hole 24 that is a through hole for allowing the base groove 22 to communicate with a vacuum source outside the base 6 is formed on the outer periphery of the base 6.
  • the pad holder 4 and the base 6 are connected by a connecting tool such as a screw or a bolt.
  • a groove is formed along the outer periphery of the upper surface of the base 6, and an O-ring is disposed in the groove so that the lattice-shaped base groove 22 of the base 6 is in an airtight state, so that the pad holder 4 and the base 6 Can be linked.
  • the structure which connects the pad holder 4 and the base 6 with an adhesive agent may be sufficient.
  • the pressurized air is supplied from the pressurized air inlet 20 to the groove 14.
  • a sealed space first sealed space formed by the porous pad 2 and vacuum suction is performed from the vacuum hole 24 of the base 6, so that the workpiece is adsorbed on the porous pad 2 in a non-contact manner.
  • the lattice-shaped base groove 22 is formed on the upper surface of the base 6 and the second sealed space is formed by the base groove 22.
  • the upper surface of the base is a flat surface and the back surface of the pad holder is formed.
  • a configuration in which a second sealed space is formed between the pad holder and the base by forming a recess or a groove may be employed.
  • FIG. 8 is a bottom view of a modified pad holder 4 ′ for such a configuration.
  • a thin cylindrical recess 22 ' is formed on the bottom surface of the pad holder 4'.
  • the pad holder 4 ' has a lower surface joined to a disk-shaped base having a flat upper surface, and the pad holder 4' and the base are separated by a flat upper surface of the base and a thin cylindrical recess 22 '.
  • a thin (low height) cylindrical second sealed space is formed.
  • a vacuum hole (not shown) communicating with the recess 22 ′ is formed in the side wall of the pad holder 4 ′.
  • FIG. 9 is a bottom view of another modified pad holder 4 ′′ for such a configuration.
  • the bottom surface of the pad holder 4 ′′ has a grid-like groove. 22 "is formed.
  • This pad holder 4 ′′ also has a disk-shaped base whose lower surface is flat on the upper surface and is joined between the pad holder 4 ′′ and the base by the flat upper surface of the base and the lattice-like grooves 22 ′′.
  • a second sealed space is formed by a groove-like groove.
  • FIG. 10 is a schematic cross-sectional view for explaining the state of the workpiece W being sucked and fixed (non-contact suction) by the non-contact suction plate 1.
  • the workpiece W floated on the surface (suction surface) 8a of the pad by vacuum suction from the vacuum hole 24 of the base 6 which is performed simultaneously with the introduction of the pressurized air passes through the communication hole 18 of the pad holder 4.
  • the suction holes 8 of the porous pad 2 as indicated by an arrow V, and at a position separated by a predetermined distance G from the suction surface 8a where the buoyancy by the pressurized air and the suction force by the vacuum suction are balanced. Will be.
  • the non-contact suction disk 1 By adjusting the buoyancy due to pressurized air (air amount and air pressure) and the suction force due to vacuum suction, the non-contact suction disk 1 is inverted, that is, the suction surface 2a of the porous pad 2 faces downward. In this state, the workpiece W can be sucked and fixed below the suction surface 2a in a non-contact state.
  • FIGS. 11 to 19 are drawings showing each process of workpiece conveyance by the workpiece conveyance device 50 using the non-contact suction disk 1.
  • the workpiece transfer device 50 is a so-called horizontal articulated “material handling” robot.
  • the work transfer device 50 includes a column 52, a first arm 56 having a base end rotatably connected to the upper end of the column 52 via a shoulder joint 54, and a elbow joint 58 rotated to the distal end of the first arm 56.
  • a second arm 60 whose base end is freely connected and a hand portion 64 whose base end is rotatably connected to the tip of the second arm 60 via a wrist joint 62 are provided.
  • the non-contact suction disk 1 of the above embodiment is attached to the lower surface of the hand portion 64 with the suction surface 2a facing downward.
  • the workpiece W is sucked and held on the first processing device 66 by the suction device 70 on the first processing device 66.
  • the first and second arms 56 and 60 of the work transporting device 50 are extended in the direction of the first processing device 66 and attached to the hand unit 64. 1 is disposed above the work W held by suction on the first processing device 66 (FIG. 12).
  • the column 52 is contracted, and the non-contact suction disk 1 or the like is lowered to a height position where the workpiece W can be sucked (FIG. 13).
  • pressurized air and vacuum suction to the non-contact suction board 1 are started, the suction operation of the suction device 70 of the first processing device 66 is stopped, and the workpiece W is suction-fixed on the non-contact suction board 1 side ( FIG. 14).
  • the column 52 is contracted, and the non-contact suction plate 1 and the like are lowered to a height position where the suction device 72 of the second processing device 68 can suck the workpiece W sucked and fixed to the non-contact suction plate 1.
  • FIG. 17 the suction operation of the suction device 72 of the second processing device 68 is started, the pressurized air and the vacuum suction to the non-contact suction board 1 are stopped, and the workpiece W is sucked by the suction device 72 of the second processing device 68. Further, the arm is returned to the initial position to complete the transfer operation (FIG. 19).
  • the workpiece W is sucked from the suction holes distributed over the entire suction surface while blowing the pressurized air from the entire suction surface and floating the workpiece, so that a large stress is applied to the workpiece.
  • the workpiece can be sucked and fixed at a predetermined position in a non-contact state without being applied.
  • FIG. 20 is an exploded perspective view from above of the non-contact suction disk 100 according to the second embodiment of the present invention
  • FIG. 21 is an exploded perspective view from below of the non-contact suction disk 100 according to the second embodiment of the present invention.
  • the non-contact suction disk 100 of the present embodiment is a thin plate-like object (work) such as a semiconductor wafer or a glass substrate for FPD, for example, a thickness of 100 ⁇ m, like the non-contact suction disk 1 of the first embodiment.
  • This is a non-contact suction disk for sucking the following semiconductor wafers in a non-contact state.
  • the non-contact suction disk 100 includes a disk-like porous pad 102 having a workpiece suction region on the upper surface, and a lower side (back side) of the porous pad 102.
  • a substantially disc-shaped pad holder 104 that is held from the bottom, and a substantially disc-shaped base 106 disposed on the back side of the pad holder 104.
  • a frame member 108 having an annular portion 108a is disposed between the pad holder 104 and the base 106.
  • the porous pad 102 is formed of breathable porous carbon, like the porous pad 2 of the non-contact suction disk 1.
  • the material of the porous pad 102 is not limited to the breathable porous carbon, and other breathable porous materials such as porous SiC / porous alumina can be used.
  • the porous pad 102, the disk portion 104a of the pad holder 104, the annular portion 108a of the frame member 108, and the disk portion 106a of the base 106 have substantially the same outer diameter.
  • the porous pad 102, the disk portion 104a of the pad holder 104, the annular portion 108a of the frame member 108, and the disk portion 106a of the base 106 are laminated, fixed by an adhesive, and non-coated.
  • a contact suction disk 100 is formed.
  • the pad holder 104, the base 106, and the frame member 108 are respectively provided with rectangular handle portions 104b, 106b, and 108b having substantially the same contour extending outward from the disk portion or the annular portion.
  • the pad holder 104, the base 106, and the frame member 108 are made of an aluminum alloy metal material, a resin such as CFRP / PEEK, or the like.
  • a plurality of suction holes (vent holes) 109 are formed in the porous pad 102.
  • the suction hole 109 is disposed over substantially the entire surface of the porous pad 102.
  • a positioning hole 110 for connecting the porous pad to the pad holder 4 or the like is formed in the peripheral portion of the porous pad 102.
  • an annular hanging portion 112 is formed on the outer peripheral edge of the lower surface of the porous pad 102.
  • the hanging portion 112 is configured such that the outer diameter is substantially equal to the outer diameter of the disk portion 104 b of the pad holder 104. That is, a disk-shaped recess is formed on the lower surface of the porous pad 102.
  • a sealed space first sealed space
  • a groove 114 having a rectangular cross section is formed in an inner region of the drooping portion 112 on the lower surface of the porous pad 102, and a portion delimited by the groove 114 is an island-like protrusion 116 having a square cross section.
  • the island-shaped protrusions 116 form a grid-like arrangement along with the grooves 114 arranged in a grid pattern (a grid-like pattern).
  • the top surface of each protrusion 114 is flat, and a suction hole 109 penetrating the porous pad 102 in the thickness direction is disposed at the center.
  • a sealed space (first sealed space) formed between the upper surface of the pad holder 104 and the lower surface of the porous pad 102. Is a sealed space partitioned by island-shaped protrusions 116.
  • the pad holder 104 has a through hole 118 that penetrates the pad holder 104 in the thickness direction.
  • Each through-hole 118 has substantially the same diameter as the suction hole 109 of the porous pad 102, and when the pad holder 104 is disposed at a predetermined angular position on the porous pad 102, the suction hole 109 of the porous pad 102. Are arranged to line up.
  • the disk portion of the pad holder 104, the annular portion of the frame member 108, and the disk portion of the base 106 have substantially the same outer diameter, the disk portion of the pad holder 104, the annular portion of the frame member 108, and the base portion
  • the height between the disk portion of the pad holder 104 and the disk portion of the base 106 is substantially equal to the thickness of the frame member 108.
  • a sealed space (second sealed space) is formed.
  • a sealed space (second sealed space) between the disk portion of the pad holder 104 and the disk portion of the base 106 communicates with the suction hole 109 of the porous pad 102 through the through hole 118 of the pad holder 104.
  • each suction hole of the porous pad 102 is passed through the through hole 118 of the pad holder 104. Suction is performed from 109, and the work on the porous pad 102 can be adsorbed toward the porous pad 102.
  • suction long holes 120 and 122 and a pressurizing long hole 124 extending in substantially parallel are formed in the handle portion 108b of the frame member 108.
  • the suction long holes 120 and 123 on both sides communicate with the inner space surrounded by the annular portion 108 a of the frame member 108 on the inner end side. Therefore, in the assembled state of the non-contact suction disk 100, the suction long holes 120 and 122 are communicated with the sealed space (second sealed space) between the disk part of the pad holder 104 and the disk part of the base 106.
  • a plurality of reinforcing members 126 are arranged in a sealed space (second sealed space) between the disk part of the pad holder 104 and the disk part of the base 106.
  • the reinforcing member 126 has substantially the same thickness as the frame member 108.
  • the reinforcing member 126 is sandwiched between the lower surface of the disk portion 104a of the pad holder 104 and the upper surface of the disk portion 106a of the base 106 in the assembled state of the non-contact suction disk 100, and the disk portion 104a of the pad holder 104
  • the sealed space (second sealed space) between the base 106 and the disk portion 106a is depressurized, it functions as a reinforcing material that suppresses the collapse of the sealed space (second sealed space) in the thickness direction.
  • the non-contact suction disk 100 of this embodiment includes an upper plate 128 and a lower plate 130.
  • the upper plate 128 and the lower plate 130 have substantially the same rectangular shape as the pad holder 104, the base 106, and the handle portions 104b, 106b, and 108b of the frame member 108, and the handle portion 104b in the assembled state of the non-contact suction disk 100.
  • 106b and 108b are sandwiched from above and below.
  • the upper plate 128 and the lower plate 130 have screw holes 132 and 134 at four corners.
  • these screw holes correspond to the corresponding screw holes formed at the four corners of the handle portions 104b, 106b, 108b of the pad holder 104, the base 106, and the frame member 108, 136, 138, 140, the handle portions 104b, 106b, and 108b in a stacked state are attached to the upper plate 128 by inserting screws (not shown) through these screw holes 132, 136, 138, 140, and 134, respectively.
  • the lower plate 130 are sandwiched.
  • the lower plate 130 is formed with two suction openings 142 and 144 penetrating in the thickness direction and a pressure opening 146.
  • the suction openings 142 and 144 formed on the side are formed in the handle portion 108b of the frame member 108 through the suction passages 148 and 150 that penetrate the handle portion 106b of the base 106 in the assembled state of the non-contact suction disk 100.
  • the suction elongated holes 120 and 122 communicate with each other, and further communicate with a sealed space (second sealed space) between the disk portion of the pad holder 104 and the disk portion of the base 106.
  • the pressurization opening 146 is a pressurization long hole formed in the handle portion 108b of the frame member 108 via the pressurization passage 152 penetrating the handle portion 106b of the base 106 in the assembled state of the non-contact suction board 100. It communicates with the outer side portion of 124.
  • the inner side (annular portion side) portion of the pressurizing elongated hole 124 is disposed via a pressurizing passage 154 that penetrates the handle portion 104b of the pad holder 104 and is disposed above in the assembled state of the non-contact suction disk 100. In this way, it communicates with a sealed space (first sealed space) formed between the upper surface of the pad holder 104 and the lower surface of the porous pad 102.
  • the pressurized air is sealed between the upper surface of the pad holder 104 and the lower surface of the porous pad 102 (first space). Into the sealed space) and ejected from the surface through the pores of the porous pad 102.
  • the work can be sucked and fixed under the suction surface in a non-contact state.
  • the disk portion 104a of the pad holder 104, the annular portion 108a of the frame member 108, and the disk portion 106a of the base 106 are aligned with the positioning holes 110 of the porous pad 102 in the assembled state of the non-contact suction disk 100.
  • a plurality of positioning holes 156, 158, and 160 are respectively formed.
  • the porous pad 102, the disk part 104a of the pad holder 104, the annular part 108a of the frame member 108 so that the positioning holes 110, 156, 158, 160 are aligned
  • the disk portion 106a of the base 106 is laminated, and pins (not shown) are inserted into the aligned positioning holes 110, 156, 158, 160, and the porous pad 102, the pad holder 104, the frame member 108, and the base 106 are positioned relative to each other. Then, these are bonded and fixed.
  • the pin has a length that protrudes upward from the surface of the porous pad 102, and is not removed after the assembly of the non-contact suction disk 100, and the workpiece adsorbed on the surface of the porous pad 102 is the porous pad 102 It serves as a stopper that prevents sliding off the surface.
  • the non-contact suction disk of the first embodiment has a configuration in which the suction holes 8 are provided in a lattice shape in the disk-shaped porous pad 2, but as shown in FIG. 22, the disk-shaped porous pad You may use the porous pad which has arrange
  • a plurality of suction holes 8 ′′ may be arranged in a rectangular porous pad 2 ′′ in a lattice shape or in an annular shape. In this case, a rectangular pad holder 4 ′′ or the like is used.
  • the positions of the suction holes (vent holes) of the porous pad, the communication holes of the pad holder, and the like are appropriately changed corresponding to the positions of the suction holes of the porous pad.
  • the first sealed space is a pressurized space and the second sealed space is a decompressed space.
  • the pressurized portion and the decompressed portion are replaced, and the first sealed space is the decompressed space
  • the second sealed space may be a pressurized space.
  • the base groove 22 having a rectangular cross section is formed in a lattice shape on the flat upper surface of the base 6, and the base groove 22 becomes the second sealed space. That is, an island-shaped protrusion similar to the island-shaped protrusion 16 on the upper surface of the pad holder 4 is formed between the lattice-shaped base grooves 22.
  • the entire upper surface of the base 6 ′ may be a recess so that the second sealed space 22 ′ is not divided into island-shaped protrusions.
  • Non-contact suction board 2 Porous pad 4: Pad holder 6: Base 8: Suction hole (vent hole) 10: Connecting hole 12: Rising part 14: Groove 16: Protruding part 18: Communication hole 20: Pressurized air inlet 22: Base groove 24: Vacuum hole

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Abstract

Provided is a non-contact suction plate that is capable of holding/suctioning a workpiece of low thickness at a specified position, or of holding/suctioning said workpiece facing downward. This non-contact suction plate (1) is characterized by: being provided with a plate-shaped porous pad (2) and multiple island-shaped projecting portions (16); being provided with a holder and a base (6); and through-holes (18) being formed in the projecting portions during coupling. Multiple ventilation holes (8) are formed in a suction securing area in said plate-shaped porous pad (2), said ventilation holes (8) penetrating and extending in the thickness direction. Said multiple island-shaped projecting portions (16): are the plate-shaped holder (4), which couples with the back surface of the porous pad and forms a first sealed space with the back surface of the porous pad; and are provided with flat top portions that during coupling, contact the back surface of the porous pad at the positions of the back-surface aperture ends of the multiple ventilation holes. In said holder, the space between the island-shaped projections forms the first sealed space. The surface of said base (6) is coupled to the back surface of the holder. Said base (6) is provided so as to form a second sealed space with the back surface of the holder. During coupling, one end of each of said through-holes (18) lines up with each back-surface aperture end of the ventilation holes, and each of said through-holes (18) connects a ventilation hole and the second sealed space.

Description

非接触吸着盤Non-contact suction board
　本発明は、非接触吸着盤に関し、詳細には、吸着面において、加圧空気によるワークの浮上と吸引によるワークの吸着とが同時に行われる非接触吸着盤に関する。 The present invention relates to a non-contact suction disk, and more particularly, to a non-contact suction disk in which the work surface is lifted by pressurized air and the work is sucked by suction at the same time.
　半導体ウエハ、ＦＰＤ用ガラス基材等の厚さが極めて薄いワークを取扱う装置として、所謂真空ピンセットが知られている。しかしながら、真空ピンセットは、ワークに接触した状態で、ワークを取り扱うため、ワークに応力を与える等の問題がある。 A so-called vacuum tweezers is known as an apparatus for handling a workpiece having a very thin thickness such as a semiconductor wafer, a glass substrate for FPD, and the like. However, since the vacuum tweezers handle the workpiece in contact with the workpiece, there are problems such as applying stress to the workpiece.
　また、ＦＰＤ用ガラス基材等の厚さが極めて薄いワークに応力等を与えることなく非接触で取り扱う装置として、多孔質板の細孔から加圧空気を噴出させワークを浮上させて、多孔質板上で搬送する装置が提案されている（例えば、特許文献１、２）。 In addition, as a device that handles non-contacted workpieces such as glass substrates for FPDs in a non-contact manner without applying stress or the like, pressurized air is ejected from the pores of the porous plate to float the workpiece, Devices that transport on a plate have been proposed (for example, Patent Documents 1 and 2).
特開２００８－１１０８５２号公報JP 2008-110852 A 特開２０１１－０８４３５２号公報JP 2011-084352 A
　特許文献１および２の装置は、多孔質材料の板状体（ステージ）からエアを噴出させ、板状体上でワークを浮上させる一方、板状体の一部からエアを吸引することにより、厚さが極めて薄いワークを、平面性維持しつつ、ステージ上を非接触状態で搬送している。 In the devices of Patent Documents 1 and 2, air is ejected from a plate-like body (stage) of a porous material and the work is floated on the plate-like body, while air is sucked from a part of the plate-like body, A workpiece that is extremely thin is conveyed in a non-contact state on the stage while maintaining flatness.
　上述した半導体ウエハ、ＦＰＤ用ガラス基材等の厚さが極めて薄いワークの処理工程では、ワークを搬送路上を搬送する以外に、ワークをステージ上の所定位置の保持すること、ワークを或る位置で持ち上げて他の位置に移動させること等が必要となる。
　しかしながら、特許文献１および２の装置は、このような要請に応えることができなかった。 In the process of processing a workpiece with a very thin thickness, such as the above-described semiconductor wafer, FPD glass substrate, etc., in addition to transporting the workpiece on the transport path, holding the workpiece at a predetermined position on the stage, It is necessary to lift it up and move it to another position.
However, the devices of Patent Documents 1 and 2 have not been able to meet such a request.
　一方、薄いワークを非接触で下向きに吸着保持できる装置として、所謂「ベルヌーイの原理」を利用したベルヌーイチャッキングが提案されている。このベルヌーイチャッキングは、エアコンプレッサからの加圧空気を、チャッキングの下面に形成された凹部内で旋回させながら下面に沿って吹き出させることにより、凹部の真下の領域で吸着力を、その周囲で浮力を生じさせ、半導体ウエハ等の薄いワークをチャッキングの下側面に非接触で吸着保持する装置である。 On the other hand, Bernoulli chucking using the so-called “Bernoulli principle” has been proposed as a device that can hold a thin work piece in a contactless downward direction. In this Bernoulli chucking, the compressed air from the air compressor is blown along the lower surface while swirling in the recess formed in the lower surface of the chucking. This is a device that generates buoyancy and sucks and holds a thin workpiece such as a semiconductor wafer on the lower surface of chucking in a non-contact manner.
　しかしながら、このベルヌーイチャッキングは、形成できる凹部の数が制限されるため、吸引力・浮力の発生が局所的となり、比較的、サイズが大きな薄いワークを、反り、歪み等の無い平らな状態で吸着保持することができなかった。 However, in this Bernoulli chucking, since the number of recesses that can be formed is limited, the generation of suction force and buoyancy becomes local, and relatively large thin workpieces can be flattened without warping or distortion. It could not be adsorbed and held.
　本発明は、このような問題点を解決するためになされたものであり、厚さが薄いワークを所定位置に保持吸着、または下向きに保持吸着することができる非接触吸着盤を提供することを目的とする。 The present invention has been made to solve such problems, and provides a non-contact suction disk capable of holding and sucking a thin workpiece at a predetermined position or holding and sucking it downward. Objective.
　本発明によれば、
　薄板状の被吸着物を非接触状態で吸着する非接触吸着盤であって、
　厚さ方向に貫通して延びる複数の通気孔が吸着固定領域に形成された板状の多孔質パッドと、
　前記多孔質パッドの裏面に隣接して配置された第１密閉空間と、
　前記第１密閉空間と隔離された第２密閉空間と、
　前記第２密閉空間と前記通気孔とを連通させる連通手段と、を備えている、
　ことを特徴とする非接触吸着盤が提供される。 According to the present invention,
A non-contact suction disk for adsorbing a thin plate-shaped object to be adsorbed in a non-contact state,
A plate-like porous pad in which a plurality of air holes extending through in the thickness direction are formed in the adsorption fixing region;
A first sealed space disposed adjacent to the back surface of the porous pad;
A second sealed space isolated from the first sealed space;
Communicating means for communicating the second sealed space and the vent hole;
A non-contact suction disk is provided.
　このような構成によれば、例えば、第１密閉空間を加圧空気源に連通させ、第２密閉空間を吸引減圧源に連通させることにより、多孔質パッドの表面の細孔から加圧空気を噴出させつつ、多孔質パッドの表面の通気孔から空気を吸引することができる。この結果、多孔質パッドの表面上に、ワークを、吸引により所定位置に保持しながら加圧空気で浮上させることができる。この結果、半導体ウエハ等の厚さが薄いワークを、上方を向いた多孔質パッドの表面上の所定位置に非接触で保持吸着、または下方を向けた多孔質パッドの表面の下側で下向きに非接触で保持吸着することができる。
　吸引圧力(減圧)と給気圧力(加圧)を独立して調整できるため、把持力と浮上力を制御可能としている。そのため、浮上隙間の調整も可能である。 According to such a configuration, for example, the first sealed space is communicated with the pressurized air source, and the second sealed space is communicated with the suction decompression source, so that the pressurized air is discharged from the pores on the surface of the porous pad. Air can be sucked from the vents on the surface of the porous pad while jetting. As a result, the work can be floated on the surface of the porous pad with pressurized air while being held at a predetermined position by suction. As a result, a thin workpiece such as a semiconductor wafer is held and adsorbed at a predetermined position on the surface of the porous pad facing upward, or downward on the lower side of the surface of the porous pad facing downward. It can be held and adsorbed without contact.
Since the suction pressure (decompression) and the supply pressure (pressurization) can be adjusted independently, the gripping force and the levitation force can be controlled. Therefore, adjustment of the floating gap is also possible.
　本発明の他の好ましい態様によれば、
　表面が前記多孔質パッドの裏面側に積層され、該多孔質パッドの裏面との間に前記第１密閉空間を構成する凹所を備えた板状のホルダと、
　前記ホルダの裏面側に積層され、該ホルダの裏面との間に第２密閉空間を形成するベースと、を備え、
　前記ホルダが、一端が前記積層時に前記多孔質パッドの通気孔に接続され他端が該ホルダの裏面に開口し前記連通手段として機能する連通孔を有している。 According to another preferred embodiment of the invention,
A plate-like holder having a surface laminated on the back side of the porous pad, and a recess that forms the first sealed space with the back side of the porous pad;
A base that is laminated on the back side of the holder and forms a second sealed space between the back side of the holder, and
The holder has a communication hole that has one end connected to the air hole of the porous pad during the lamination and the other end opened to the back surface of the holder and functions as the communication means.
　本発明の他の好ましい態様によれば、
　前記ホルダが、前記複数の通気孔の裏面側開口端の位置で前記多孔質パッドの裏面に当接する平坦な頂部を備えた複数の島状の突出部を備え、
　前記連通孔が前記突出部を貫通して延び、
　前記突出部の間の空間が前記第１密閉空間とされる。 According to another preferred embodiment of the invention,
The holder includes a plurality of island-shaped protrusions including a flat top portion that comes into contact with the back surface of the porous pad at the position of the back side opening ends of the plurality of vent holes,
The communication hole extends through the protrusion,
The space between the protrusions is the first sealed space.
　本発明の他の好ましい態様によれば、
　前記ベースが、表面に、前記連結時に前記ホルダの裏面に当接する平坦な頂部を備えた複数の島状の突出部を備え、
　該突出部の間の空間が減圧用流路とされ、前記連通孔の他端が該減圧用流路と流体連通する。 According to another preferred embodiment of the invention,
The base includes a plurality of island-shaped protrusions provided on the surface with flat tops that contact the back surface of the holder during the connection,
The space between the protrusions is a pressure reducing flow path, and the other end of the communication hole is in fluid communication with the pressure reducing flow path.
　本発明の他の好ましい態様によれば、
　前記複数の突出部が、矩形の横断面形状を有し、碁盤の目状に配置されている、
　前記第１密閉空間が、格子状の加圧空気用流路として形成されている。
　このような構成によれば、多孔質パッドの細孔から均一に加圧空気を噴出させることができる。 According to another preferred embodiment of the invention,
The plurality of protrusions have a rectangular cross-sectional shape and are arranged in a grid pattern.
The first sealed space is formed as a grid-like flow path for pressurized air.
According to such a configuration, the pressurized air can be uniformly ejected from the pores of the porous pad.
　本発明の他の好ましい態様によれば、
　前記減圧溝が格子状に配置されている。
　このような構成によれば、多孔質パッドの通気孔から均一に加圧空気を噴出させることができる。 According to another preferred embodiment of the invention,
The decompression grooves are arranged in a lattice pattern.
According to such a structure, pressurized air can be uniformly ejected from the vent hole of the porous pad.
　本発明の他の好ましい態様によれば、
　前記連通孔の他端が前記格子状の減圧用溝の交点で、該減圧用溝と流体連通している。
　このような構成によれば、効率良く、連通孔からの吸引を行うことが可能となる。 According to another preferred embodiment of the invention,
The other end of the communication hole is in fluid communication with the pressure reducing groove at the intersection of the lattice-shaped pressure reducing grooves.
According to such a configuration, it is possible to efficiently perform suction from the communication hole.
　本発明の他の態様によれば、
　前記多孔質パッドの裏面側に積層され、前記多孔質パッドの通気孔に対応する貫通孔を備えた板状のホルダを備え、
　さらに、前記ホルダの裏面側に積層され、該ホルダの裏面との間に第２密閉空間を形成するベースを備え、
　前記多孔質パッドの裏面に前記ホルダとの間に前記第１密閉空間を構成する凹所が形成され、
　前記多孔質パッドの通気孔が前記ホルダの貫通孔に連結され前記連通手段として機能する。 According to another aspect of the invention,
Laminated on the back side of the porous pad, comprising a plate-like holder having a through hole corresponding to the vent of the porous pad,
Furthermore, it is laminated on the back side of the holder, and includes a base that forms a second sealed space between the back side of the holder,
A recess forming the first sealed space is formed between the holder and the back surface of the porous pad,
The air hole of the porous pad is connected to the through hole of the holder and functions as the communication means.
　本発明の他の好ましい態様によれば、
　前記ホルダと前記ベースとの間に配置される環状部を有する枠部材を備え、
　前記第２密閉空間が、前記環状部の内部空間によって形成される。 According to another preferred embodiment of the invention,
A frame member having an annular portion disposed between the holder and the base;
The second sealed space is formed by an internal space of the annular portion.
　前記多孔質パッドの凹所に、前記ホルダの表面に当接する平坦な頂部を備えた複数の島状の突出部を備え、
　前記多孔質パッドの通気孔が、前記島状の突出部を貫通している。 In the recess of the porous pad, provided with a plurality of island-like protrusions provided with a flat top that contacts the surface of the holder,
A ventilation hole of the porous pad penetrates the island-shaped protrusion.
　本発明の他の好ましい態様によれば、
　前記第１密閉空間が加圧空気用空間部であり、
　前記第２密閉空間が減圧用空間部である。 According to another preferred embodiment of the invention,
The first sealed space is a space for pressurized air;
The second sealed space is a decompression space.
　本発明の他の好ましい態様によれば、
　前記通気孔が、前記多孔質パッドの表面全体に分散して配置されている、
　このような構成によれば、多孔質パッドの表面全体を、吸着固定領域として使用できる。 According to another preferred embodiment of the invention,
The air holes are distributed and arranged over the entire surface of the porous pad,
According to such a configuration, the entire surface of the porous pad can be used as an adsorption fixing region.
　本発明の他の好ましい態様によれば、
　前記多孔質パッドが、多孔質カーボンで形成されている。 According to another preferred embodiment of the invention,
The porous pad is made of porous carbon.
　本発明によれば、厚さが薄いワークを所定位置に保持吸着、または下向きに保持吸着することができる非接触吸着盤が提供される。 According to the present invention, there is provided a non-contact suction disk capable of holding and sucking a thin workpiece at a predetermined position or holding and sucking it downward.
本発明の第１実施形態の非接触吸着盤の分解斜視図である。It is a disassembled perspective view of the non-contact suction disk of 1st Embodiment of this invention. 図１の非接触吸着盤の多孔質パッドの上面図である。It is a top view of the porous pad of the non-contact suction disk of FIG. 図１の非接触吸着盤の多孔質パッドの底面図である。It is a bottom view of the porous pad of the non-contact suction disk of FIG. 図３のIV－IV線に沿った断面の一部分を拡大した面面である。FIG. 4 is a surface obtained by enlarging a part of a cross section taken along line IV-IV in FIG. 3. 図１の非接触吸着盤のホルダの上面図である。It is a top view of the holder of the non-contact suction disk of FIG. 図１の非接触吸着盤のホルダの底面図である。It is a bottom view of the holder of the non-contact suction disk of FIG. 図１の非接触吸着盤のベースの上面図である。It is a top view of the base of the non-contact suction disk of FIG. 非接触吸着盤のホルダの変形例の底面図である。It is a bottom view of the modification of the holder of a non-contact suction disk. 非接触吸着盤のホルダのもう一つの変形例の底面図である。It is a bottom view of another modification of the holder of a non-contact suction disk. 図１の非接触吸着盤によるワークＷの吸着固定（非接触吸着）の状態を説明するための模式的な断面図である。It is typical sectional drawing for demonstrating the state of the adsorption | suction fixation (non-contact adsorption | suction) of the workpiece | work W by the non-contact adsorption | suction board of FIG. 図１の非接触吸着盤を使用したワーク搬送装置によるワーク搬送の各工程を示す図面である。It is drawing which shows each process of the workpiece conveyance by the workpiece conveyance apparatus using the non-contact suction disk of FIG. 図１の非接触吸着盤を使用したワーク搬送装置によるワーク搬送の各工程を示す図面である。It is drawing which shows each process of the workpiece conveyance by the workpiece conveyance apparatus using the non-contact suction disk of FIG. 図１の非接触吸着盤を使用したワーク搬送装置によるワーク搬送の各工程を示す図面である。It is drawing which shows each process of the workpiece conveyance by the workpiece conveyance apparatus using the non-contact suction disk of FIG. 図１の非接触吸着盤を使用したワーク搬送装置によるワーク搬送の各工程を示す図面である。It is drawing which shows each process of the workpiece conveyance by the workpiece conveyance apparatus using the non-contact suction disk of FIG. 図１の非接触吸着盤を使用したワーク搬送装置によるワーク搬送の各工程を示す図面である。It is drawing which shows each process of the workpiece conveyance by the workpiece conveyance apparatus using the non-contact suction disk of FIG. 図１の非接触吸着盤を使用したワーク搬送装置によるワーク搬送の各工程を示す図面である。It is drawing which shows each process of the workpiece conveyance by the workpiece conveyance apparatus using the non-contact suction disk of FIG. 図１の非接触吸着盤を使用したワーク搬送装置によるワーク搬送の各工程を示す図面である。It is drawing which shows each process of the workpiece conveyance by the workpiece conveyance apparatus using the non-contact suction disk of FIG. 図１の非接触吸着盤を使用したワーク搬送装置によるワーク搬送の各工程を示す図面である。It is drawing which shows each process of the workpiece conveyance by the workpiece conveyance apparatus using the non-contact suction disk of FIG. 図１の非接触吸着盤を使用したワーク搬送装置によるワーク搬送の各工程を示す図面である。It is drawing which shows each process of the workpiece conveyance by the workpiece conveyance apparatus using the non-contact suction disk of FIG. 本発明の第２実施形態の非接触吸着盤の上方からの分解斜視図である。It is a disassembled perspective view from the upper part of the non-contact suction disk of 2nd Embodiment of this invention. 本発明の第２実施形態の非接触吸着盤の下方からの分解斜視図である。It is a disassembled perspective view from the lower part of the non-contact suction disk of 2nd Embodiment of this invention. 他の構成を有する多孔質パッドの上面図である。It is a top view of the porous pad which has another structure. 他の構成を有する多孔質パッドの上面図である。It is a top view of the porous pad which has another structure. 他の構成を有する多孔質パッドの上面図である。It is a top view of the porous pad which has another structure. 他の構成を有するベースの上面図である。It is a top view of the base which has another structure.
　以下、図面を参照して、本発明の実施形態の非接触吸着盤について説明する。
　先ず、本発明の第１実施形態の非接触吸着盤の構成について説明する。図１は、本発明の第１実施形態の非接触吸着盤１の分解斜視図である。 Hereinafter, a non-contact suction disk according to an embodiment of the present invention will be described with reference to the drawings.
First, the structure of the non-contact suction disk of 1st Embodiment of this invention is demonstrated. FIG. 1 is an exploded perspective view of the non-contact suction disk 1 according to the first embodiment of the present invention.
　本実施形態の非接触吸着盤１は、半導体ウエハ、ＦＰＤ用ガラス基材等の薄板状の被吸着物（ワーク）、例えば、厚さ１００μｍ以下の半導体ウエハを非接触状態で吸着する非接触吸着盤である。非接触吸着盤１は、図１に示されているように、上面にワークの吸着領域を備えた円板状の多孔質パッド２と、多孔質パッド２を下側（裏側）から保持する略円板状のパッドホルダ４と、ホルダ４の裏側に連結される略円板状のベース６とを備えている。 The non-contact suction disk 1 of this embodiment is a non-contact suction for sucking a thin plate-like object (work) such as a semiconductor wafer, a glass substrate for FPD, for example, a semiconductor wafer having a thickness of 100 μm or less in a non-contact state It is a board. As shown in FIG. 1, the non-contact suction disk 1 is a disk-shaped porous pad 2 having a work suction area on the upper surface, and an approximately holding the porous pad 2 from the lower side (back side). A disk-shaped pad holder 4 and a substantially disk-shaped base 6 connected to the back side of the holder 4 are provided.
　多孔質パッド２は、通気性の多孔質カーボンで形成されている。多孔質パッド２の材料は、通気性の多孔質カーボンに限定されるものではなく、他の通気性の多孔質材料、例えばポーラスSiC・ポーラスアルミナ等を使用することもできる。 The porous pad 2 is made of breathable porous carbon. The material of the porous pad 2 is not limited to breathable porous carbon, and other breathable porous materials such as porous SiC / porous alumina can also be used.
　図２は、多孔質パッド２の上面図であり、図３は、多孔質パッド２の底面図である。
　多孔質パッド２には、複数の吸引孔（通気孔）８が形成されている。図２および図３に示されているように、吸引孔８は、多孔質パッド２の略全面に亘って、格子状に配列、すなわち碁盤の目の交点上に配置された状態で配列されている。本実施形態では、吸引孔８の間隔は２５ｍｍ程度に設定されている。 FIG. 2 is a top view of the porous pad 2, and FIG. 3 is a bottom view of the porous pad 2.
A plurality of suction holes (vent holes) 8 are formed in the porous pad 2. As shown in FIGS. 2 and 3, the suction holes 8 are arranged in a lattice pattern over substantially the entire surface of the porous pad 2, that is, in a state of being arranged on the intersections of the grids. Yes. In the present embodiment, the interval between the suction holes 8 is set to about 25 mm.
　図４は、図３のVI－VI線に沿った断面の一部分を拡大した面面である。図４に示されているように、吸引孔８は、各多孔質パッド２を厚さ方向に貫通して延びるように形成されている。吸引孔８は、多孔質パッド２の表面２ａ側が直径０．６ｍｍ程度の小径部８ａとされ、多孔質パッド２の裏面２ｂ側が直径４ｍｍ程度の大径部８ｂとされ、小径部８ａと大径部８ｂとが、多孔質パッド２の表面２ａに向かって先細るテーパ部８ｃによって連結されている。 FIG. 4 is a surface obtained by enlarging a part of the cross section along the line VI-VI in FIG. As shown in FIG. 4, the suction holes 8 are formed so as to extend through the respective porous pads 2 in the thickness direction. The suction hole 8 has a small diameter portion 8a having a diameter of about 0.6 mm on the surface 2a side of the porous pad 2, and a large diameter portion 8b having a diameter of about 4 mm on the back surface 2b side of the porous pad 2, and the small diameter portion 8a and the large diameter. The portion 8b is connected by a tapered portion 8c that tapers toward the surface 2a of the porous pad 2.
　このような構成によって、吸引孔８の大径部８ｂが減圧吸引されると、多孔質パッド２の表面２ａ側に開口した、吸引孔８の小径部８ａからの空気が吸引され、吸引孔８が形成されている多孔質パッド２の表面領域が、ワークの吸着固定が行われる吸着固定領域となる。 With such a configuration, when the large-diameter portion 8b of the suction hole 8 is sucked under reduced pressure, air from the small-diameter portion 8a of the suction hole 8 opened to the surface 2a side of the porous pad 2 is sucked, and the suction hole 8 The surface area of the porous pad 2 on which is formed becomes an adsorption fixing area where the workpiece is adsorbed and fixed.
　なお、多孔質パッド２の周縁部には、多孔質パッドをパッドホルダ４等に連結するねじ等の締結具が挿通される連結穴１０が形成されている。 Note that a connecting hole 10 through which a fastener such as a screw for connecting the porous pad to the pad holder 4 or the like is inserted is formed in the peripheral portion of the porous pad 2.
　図５は、パッドホルダ４の上面図であり、図６は、パッドホルダ４の底面図である。
　上述したように、パッドホルダ４は、多孔質パッド２を下側（裏側）から保持する略円板状の部材であり、例えば、アルミ合金等の金属材料で形成されている。パッドホルダ４は、CFRP・PEEKなどの樹脂で形成することもできる。 FIG. 5 is a top view of the pad holder 4, and FIG. 6 is a bottom view of the pad holder 4.
As described above, the pad holder 4 is a substantially disk-shaped member that holds the porous pad 2 from the lower side (back side), and is formed of a metal material such as an aluminum alloy, for example. The pad holder 4 can also be formed of a resin such as CFRP / PEEK.
　図１、図４、及び図５に示されているように、パッドホルダ４の上面には、外周縁に環状の立上がり部１２が形成されている。立ち上がり部１２は、内径が、多孔質パッド２の外径より若干大きく、高さが多孔質パッド２の厚さより若干低くなるように構成されている。 As shown in FIGS. 1, 4, and 5, an annular rising portion 12 is formed on the outer periphery of the upper surface of the pad holder 4. The rising portion 12 is configured such that the inner diameter is slightly larger than the outer diameter of the porous pad 2 and the height is slightly lower than the thickness of the porous pad 2.
　したがって、多孔質パッド２は、パッドホルダ４の立上がり部１２の内側の空間（凹部）に配置されると、多孔質パッド２の上面２ａが、パッドホルダ４の立上がり部１２の頂面より僅かに上方に配置された状態となる。 Therefore, when the porous pad 2 is disposed in the space (recessed portion) inside the rising portion 12 of the pad holder 4, the upper surface 2 a of the porous pad 2 is slightly more than the top surface of the rising portion 12 of the pad holder 4. It will be in the state arranged above.
　また、パッドホルダ４の上面（凹部の底面）の立上がり部１２の内側領域には、格子状（碁盤の目状）に断面矩形の溝１４が形成され、溝１４によって区切られた部分は、横断面が正方形の島状の突出部１６とされている。島状の突出部１６は、格子状（碁盤の目状）に配置された溝１４とともに、碁盤の目状の配置を構成している。
　各突出部１４の頂面は平坦であり、中央に、パッドホルダ４を厚さ方向に貫通する連通孔１８が穿孔されている。 Further, in the inner region of the rising portion 12 on the upper surface (bottom surface of the recess) of the pad holder 4, grooves 14 having a rectangular cross section are formed in a lattice shape (a grid pattern), and a portion delimited by the grooves 14 is crossed. The surface is a square island-shaped protrusion 16. The island-shaped protrusions 16 form a grid-like arrangement along with the grooves 14 arranged in a grid pattern (a grid-like pattern).
The top surface of each protrusion 14 is flat, and a communication hole 18 that penetrates the pad holder 4 in the thickness direction is formed in the center.
　多孔質パッド２とパッドホルダ４とは、多孔質パッド２がパッドホルダ４の立上がり部１２の内側の空間内に配置された状態で、接着剤によって接合され固定される。多孔質パッド２とパッドホルダ４とは、さらに、ボルト等の締結具によって、互いに連結固定される。 The porous pad 2 and the pad holder 4 are bonded and fixed by an adhesive in a state where the porous pad 2 is disposed in the space inside the rising portion 12 of the pad holder 4. The porous pad 2 and the pad holder 4 are further connected and fixed to each other by a fastener such as a bolt.
　突出部１４は、多孔質パッド２がパッドホルダ４の立上がり部１２の内側の空間内に配置されたとき、頂面が多孔質パッド２の裏面２ｂの吸引孔８の大径部８ｂの開口端の周囲の領域に、気密状態で当接するように構成されている。 When the porous pad 2 is disposed in the space inside the rising portion 12 of the pad holder 4, the protruding portion 14 has an open end of the large diameter portion 8 b of the suction hole 8 on the back surface 2 b of the porous pad 2. It is comprised so that it may contact | abut in the airtight state to the area | region of around.
　この結果、多孔質パッド２がパッドホルダ４の立上がり部１２の内側の空間に接着剤で固定されると、多孔質パッド２の裏面とパッドホルダ４の上面との間に、格子状に配置された溝１４とこの溝１４を覆う多孔質パッド２によって、密閉空間（第１密閉空間）が形成される。 As a result, when the porous pad 2 is fixed to the space inside the rising portion 12 of the pad holder 4 with an adhesive, the porous pad 2 is arranged in a lattice shape between the back surface of the porous pad 2 and the upper surface of the pad holder 4. A sealed space (first sealed space) is formed by the groove 14 and the porous pad 2 covering the groove 14.
　連通孔１８は、多孔質パッド２の吸引孔８の大径部８ｂと略同一の直径を有し、多孔質パッド２がパッドホルダ４の立上がり部１２の内側の空間に、所定の角度位置に収容されたとき、多孔質パッド２に形成された各吸引口８と厚さ方向に整列するように構成されている。
　この結果、多孔質パッド２が、所定の角度位置で、パッドホルダ４の立上がり部１２の内側の空間に収容されると、多孔質パッド２の吸引口８とパッドホルダ４の連通孔１８とが流体連通する。 The communication hole 18 has substantially the same diameter as the large diameter portion 8 b of the suction hole 8 of the porous pad 2, and the porous pad 2 is in a space inside the rising portion 12 of the pad holder 4 at a predetermined angular position. When accommodated, each suction port 8 formed in the porous pad 2 is arranged in the thickness direction.
As a result, when the porous pad 2 is accommodated in the space inside the rising portion 12 of the pad holder 4 at a predetermined angular position, the suction port 8 of the porous pad 2 and the communication hole 18 of the pad holder 4 are formed. Fluid communication.
　パッドホルダ４の外周には、溝１４によって形成された密閉空間（第１密閉空間）と、パッドホルダ４の外部空間とを連通し、この密閉空間（第１密閉空間）に加圧空気を導入するための加圧空気入口２０が形成されている。 On the outer periphery of the pad holder 4, the sealed space (first sealed space) formed by the groove 14 communicates with the external space of the pad holder 4, and pressurized air is introduced into this sealed space (first sealed space). A pressurized air inlet 20 is formed for this purpose.
　この結果、多孔質パッド２を、パッドホルダ４の立上がり部１２の内側の空間に収容し接着固定した状態で、加圧空気入口２０から加圧空気を溝１４と多孔質パッド２によって形成された密閉空間（第１密閉空間）に導入すると、加圧空気が、密閉空間（第１密閉空間）の上面を構成する多孔質パッド２の細孔に侵入し、多孔質パッド２を透過して、多孔質パッド２の表面全体から噴出することになる。 As a result, in a state where the porous pad 2 is accommodated and fixed in the space inside the rising portion 12 of the pad holder 4, the pressurized air is formed by the groove 14 and the porous pad 2 from the pressurized air inlet 20. When introduced into the sealed space (first sealed space), the pressurized air penetrates into the pores of the porous pad 2 constituting the upper surface of the sealed space (first sealed space), passes through the porous pad 2, It will be ejected from the entire surface of the porous pad 2.
　図７は、ベース６の上面図である。上述したように、ベース６は、ホルダ４の裏側に連結される略円板状の部材であり、例えば、アルミ合金等の金属材料で形成されている。ベース６も、CFRP・PEEKなどの樹脂で形成することができる。 FIG. 7 is a top view of the base 6. As described above, the base 6 is a substantially disk-shaped member connected to the back side of the holder 4 and is formed of a metal material such as an aluminum alloy, for example. The base 6 can also be formed of a resin such as CFRP / PEEK.
　図１、及び図７に示されているように、ベース６は、パッドホルダ４と略同一径を有し、平坦な上面に断面矩形のベース溝２２が格子状に形成されている。したがって、パッドホルダ４の平坦な裏面とベース６の上面とが接合されると、格子状のベース溝２２とこれを覆うパッドホルダ４の裏面とによって、格子状の密閉空間（第２密閉空間）が形成されることになる。 1 and 7, the base 6 has substantially the same diameter as the pad holder 4, and base grooves 22 having a rectangular cross section are formed in a lattice shape on a flat upper surface. Therefore, when the flat back surface of the pad holder 4 and the upper surface of the base 6 are joined, the lattice-shaped base groove 22 and the back surface of the pad holder 4 that covers the lattice-shaped base groove 22 (second sealed space). Will be formed.
　ベース溝２２は、パッドホルダ４とベース６が所定の角度位置で接合されたとき、格子状のベース溝２２が、パッドホルダ４に形成された連通孔１８と厚さ方向に整列するように構成されている。 The base groove 22 is configured such that when the pad holder 4 and the base 6 are joined at a predetermined angular position, the lattice-shaped base groove 22 is aligned with the communication hole 18 formed in the pad holder 4 in the thickness direction. Has been.
　このような構成により、多孔質パッド２とパッドホルダ４とベース６とが、所定の角度位置で連結されると、多孔質パッド２の吸引孔８が、パッドホルダ４の連通孔１８を介して、ベース６とパッドホルダ４の間に形成された、格子状の密閉空間（第２密閉空間）の交点に連通することになる。 With such a configuration, when the porous pad 2, the pad holder 4, and the base 6 are connected at a predetermined angular position, the suction hole 8 of the porous pad 2 passes through the communication hole 18 of the pad holder 4. , It communicates with the intersection of the lattice-shaped sealed space (second sealed space) formed between the base 6 and the pad holder 4.
　また、ベース６の外周には、ベース溝２２をベース６の外部の真空源と連通させるための貫通孔である真空孔２４が形成されている。
　このような構成によって、多孔質パッド２とパッドホルダ４とベース６とを、所定の角度位置で連結した状態で、真空孔２４から真空吸引を行うと、パッドホルダ４の連通孔１８を介して、多孔質パッド２の各吸引孔８から吸引が行われ、多孔質パッド２上のワークを多孔質パッド２に向けて吸着することができる。 Further, a vacuum hole 24 that is a through hole for allowing the base groove 22 to communicate with a vacuum source outside the base 6 is formed on the outer periphery of the base 6.
With this configuration, when vacuum suction is performed from the vacuum hole 24 in a state where the porous pad 2, the pad holder 4, and the base 6 are connected at a predetermined angular position, via the communication hole 18 of the pad holder 4. Suction is performed from each suction hole 8 of the porous pad 2, and the work on the porous pad 2 can be adsorbed toward the porous pad 2.
　パッドホルダ４とベース６とは、ねじ、ボルト等の連結具によって連結されている。ベース６の上面の外周に沿って溝を形成し、この溝内にＯリングを配置することによって、ベース６の格子状のベース溝２２が気密状態となるようにして、パッドホルダ４とベース６とを連結することができる。また、パッドホルダ４とベース６とを接着剤で連結する構成でもよい。 The pad holder 4 and the base 6 are connected by a connecting tool such as a screw or a bolt. A groove is formed along the outer periphery of the upper surface of the base 6, and an O-ring is disposed in the groove so that the lattice-shaped base groove 22 of the base 6 is in an airtight state, so that the pad holder 4 and the base 6 Can be linked. Moreover, the structure which connects the pad holder 4 and the base 6 with an adhesive agent may be sufficient.
　このような構成を有する非接触吸着盤は、使用時には、多孔質パッド２とパッドホルダ４とベース６とを所定の角度位置で連結した状態で、加圧空気入口２０から加圧空気を溝１４と多孔質パッド２によって形成された密閉空間（第１密閉空間）に導入し、且つベース６の真空孔２４から真空吸引を行うことによって、多孔質パッド２上でワークを非接触吸着する。 In the non-contact suction disk having such a configuration, when the porous pad 2, the pad holder 4, and the base 6 are connected at a predetermined angular position, the pressurized air is supplied from the pressurized air inlet 20 to the groove 14. Are introduced into a sealed space (first sealed space) formed by the porous pad 2 and vacuum suction is performed from the vacuum hole 24 of the base 6, so that the workpiece is adsorbed on the porous pad 2 in a non-contact manner.
　さらに、撓んだワーク(被吸着物)でも吸着面にならわせて、平坦化させることができる。 Furthermore, even a bent work (object to be adsorbed) can be flattened according to the adsorption surface.
　上記実施形態は、ベース６の上面に格子状のベース溝２２を形成し、このベース溝２２によって第２密閉空間を形成する構成であるが、ベースの上面を平坦面とし、パッドホルダの裏面に凹部または溝を形成することによって、パッドホルダとベースとの間に第２密閉空間を形成する構成でもよい。 In the above embodiment, the lattice-shaped base groove 22 is formed on the upper surface of the base 6 and the second sealed space is formed by the base groove 22. However, the upper surface of the base is a flat surface and the back surface of the pad holder is formed. A configuration in which a second sealed space is formed between the pad holder and the base by forming a recess or a groove may be employed.
　図８は、このような構成のための変形例のパッドホルダ４’の底面図である。図８に示されているように、パッドホルダ４’の底面には、薄い円柱状の凹所２２’が形成されている。
　このパッドホルダ４’は、下面が、上面が平坦な円板状のベースと接合され、ベースの平坦な上面と、薄い円柱状の凹所２２’とによって、パッドホルダ４’とベースとの間の薄い（高さが低い）円柱状の第２密閉空間が形成される。このパッドホルダ４’の側壁には、凹所２２’に連通する真空孔（図示せず）が形成されている。 FIG. 8 is a bottom view of a modified pad holder 4 ′ for such a configuration. As shown in FIG. 8, a thin cylindrical recess 22 'is formed on the bottom surface of the pad holder 4'.
The pad holder 4 'has a lower surface joined to a disk-shaped base having a flat upper surface, and the pad holder 4' and the base are separated by a flat upper surface of the base and a thin cylindrical recess 22 '. A thin (low height) cylindrical second sealed space is formed. A vacuum hole (not shown) communicating with the recess 22 ′ is formed in the side wall of the pad holder 4 ′.
　図９は、このような構成のためのもう一つの変形例のパッドホルダ４”の底面図である。図９に示されているように、パッドホルダ４”の底面には、格子状の溝２２”が形成されている。
　このパッドホルダ４”も、下面が、上面が平坦な円板状のベースが接合され、ベースの平坦な上面と、格子状の溝２２”とによって、パッドホルダ４”とベースとの間に格子状の溝による第２密閉空間が形成される。このパッドホルダ４”の側壁にも、格子状の溝２２”に連通する真空孔（図示せず）が形成されている。 FIG. 9 is a bottom view of another modified pad holder 4 ″ for such a configuration. As shown in FIG. 9, the bottom surface of the pad holder 4 ″ has a grid-like groove. 22 "is formed.
This pad holder 4 ″ also has a disk-shaped base whose lower surface is flat on the upper surface and is joined between the pad holder 4 ″ and the base by the flat upper surface of the base and the lattice-like grooves 22 ″. A second sealed space is formed by a groove-like groove. A vacuum hole (not shown) communicating with the lattice-like groove 22 "is also formed on the side wall of the pad holder 4".
　図１０は、非接触吸着盤１によるワークＷの吸着固定（非接触吸着）の状態を説明するための模式的な断面図である。 FIG. 10 is a schematic cross-sectional view for explaining the state of the workpiece W being sucked and fixed (non-contact suction) by the non-contact suction plate 1.
　上述したように、使用時に、パッドホルダ４の溝１４と多孔質パッド２とによって形成された密閉空間に外部の圧縮空気源から加圧空気を導入すると、加圧空気は、多孔質パッド２の細孔を通して多孔質パッド２内に侵入し、図１０に矢印Ｐで示すように、多孔質パッド２の表面２ａから噴出する。この図１０に矢印Ｐで示すように噴出する加圧空気によって、ワークＷはパッドの表面（吸着面）８ａ上で浮上させられる。 As described above, when pressurized air is introduced from an external compressed air source into the sealed space formed by the groove 14 of the pad holder 4 and the porous pad 2 during use, the pressurized air is absorbed by the porous pad 2. It penetrates into the porous pad 2 through the pores and is ejected from the surface 2a of the porous pad 2 as indicated by an arrow P in FIG. The workpiece W is floated on the surface (suction surface) 8a of the pad by the pressurized air ejected as shown by an arrow P in FIG.
　一方、加圧空気の導入と同時に行われる、ベース６の真空孔２４から真空吸引によって、パッドの表面（吸着面）８ａ上で浮上させられているワークＷは、パッドホルダ４の連通孔１８を介して、多孔質パッド２の各吸引孔８から矢印Ｖで示すように吸引され、加圧空気による浮力と真空吸引による吸引力が釣り合う吸着面８ａから所定距離Ｇだけ離れた位置で、吸着固定されることになる。 On the other hand, the workpiece W floated on the surface (suction surface) 8a of the pad by vacuum suction from the vacuum hole 24 of the base 6 which is performed simultaneously with the introduction of the pressurized air passes through the communication hole 18 of the pad holder 4. Through the suction holes 8 of the porous pad 2 as indicated by an arrow V, and at a position separated by a predetermined distance G from the suction surface 8a where the buoyancy by the pressurized air and the suction force by the vacuum suction are balanced. Will be.
　加圧空気（空気量と空気圧）による浮力と、真空吸引による吸引力とを調整することによって、非接触吸着盤１を反転させた状態、すなわち多孔質パッド２の吸着面２ａが下方を向いた状態で、吸着面２ａの下側にワークＷを非接触状態で吸着固定させることもできる。 By adjusting the buoyancy due to pressurized air (air amount and air pressure) and the suction force due to vacuum suction, the non-contact suction disk 1 is inverted, that is, the suction surface 2a of the porous pad 2 faces downward. In this state, the workpiece W can be sucked and fixed below the suction surface 2a in a non-contact state.
　次に、本実施形態の非接触吸着盤１を使用したワーク搬送装置によるワーク搬送について説明する。
　図１１乃至図１９は、非接触吸着盤１を使用したワーク搬送装置５０によるワーク搬送の各工程を示す図面である。 Next, the workpiece conveyance by the workpiece conveyance apparatus using the non-contact suction disk 1 of this embodiment is demonstrated.
FIGS. 11 to 19 are drawings showing each process of workpiece conveyance by the workpiece conveyance device 50 using the non-contact suction disk 1.
　図１１乃至図１９に示されているように、ワーク搬送装置５０は、いわゆる水平多関節式の「マテハン」ロボットである。
　ワーク搬送装置５０は、カラム５２と、カラム５２の上端に肩関節５４を介して回転自在に基端が連結された第１アーム５６と、第１アーム５６の先端に肘関節５８を介して回転自在に基端が連結された第２アーム６０と、第２アーム６０の先端に手首関節６２を介して回転自在に基端が連結されたハンド部６４とを備えている。ハンド部６４の下面には、上記実施形態の非接触吸着盤１が吸着面２ａを下方に向けた状態で取付けられている。 As shown in FIGS. 11 to 19, the workpiece transfer device 50 is a so-called horizontal articulated “material handling” robot.
The work transfer device 50 includes a column 52, a first arm 56 having a base end rotatably connected to the upper end of the column 52 via a shoulder joint 54, and a elbow joint 58 rotated to the distal end of the first arm 56. A second arm 60 whose base end is freely connected and a hand portion 64 whose base end is rotatably connected to the tip of the second arm 60 via a wrist joint 62 are provided. The non-contact suction disk 1 of the above embodiment is attached to the lower surface of the hand portion 64 with the suction surface 2a facing downward.
　次に、ワーク搬送装置５０によって、第１の処理装置６６から第２の処理装置６８にワークＷを搬送する動作について説明する。
　ワークWは、図１１に示されるように、第１の処理装置６６上の吸着装置７０によって、第１の処理装置６６上に吸着保持されている。本実施形態の搬送工程では、先ず、ワーク搬送装置５０の第１および第２のアーム５６、６０を、第１の処理装置６６方向に伸張させ、ハンド部６４に取付けられている非接触吸着盤１を、第１の処理装置６６上に吸着保持されているワークＷの上方に配置する（図１２）。 Next, an operation of transporting the workpiece W from the first processing device 66 to the second processing device 68 by the workpiece transport device 50 will be described.
As shown in FIG. 11, the workpiece W is sucked and held on the first processing device 66 by the suction device 70 on the first processing device 66. In the transporting process of the present embodiment, first, the first and second arms 56 and 60 of the work transporting device 50 are extended in the direction of the first processing device 66 and attached to the hand unit 64. 1 is disposed above the work W held by suction on the first processing device 66 (FIG. 12).
　次いで、カラム５２を縮め、非接触吸着盤１等を、ワークＷを吸着可能な高さ位置まで降下させる（図１３）。次いで、非接触吸着盤１への加圧空気と真空吸引を開始し、第１の処理装置６６の吸着装置７０の吸着動作を停止させ、ワークＷを非接触吸着盤１側に吸着固定する（図１４）。 Next, the column 52 is contracted, and the non-contact suction disk 1 or the like is lowered to a height position where the workpiece W can be sucked (FIG. 13). Next, pressurized air and vacuum suction to the non-contact suction board 1 are started, the suction operation of the suction device 70 of the first processing device 66 is stopped, and the workpiece W is suction-fixed on the non-contact suction board 1 side ( FIG. 14).
　次いで、カラム５２を延ばし（図１５）、さらに、肩関節５４を中心にアーム全体を回転させ、非接触吸着盤１を第２の処理装置６８の上方に移動させる（図１６）。 Next, the column 52 is extended (FIG. 15), the entire arm is rotated around the shoulder joint 54, and the non-contact suction disk 1 is moved above the second processing device 68 (FIG. 16).
　さらに、カラム５２を縮め、第２の処理装置６８の吸着装置７２が、非接触吸着盤１に吸着固定されているワークＷを吸着可能な高さ位置まで、非接触吸着盤１等を降下させる（図１７）。次いで、第２の処理装置６８の吸着装置７２の吸着動作を開始するとともに、非接触吸着盤１への加圧空気と真空吸引を停止し、ワークＷを第２の処理装置６８の吸着装置７２に吸着させ（図１８）、さらに、アームを初期位置に戻し搬送作業を完了する（図１９）。 Further, the column 52 is contracted, and the non-contact suction plate 1 and the like are lowered to a height position where the suction device 72 of the second processing device 68 can suck the workpiece W sucked and fixed to the non-contact suction plate 1. (FIG. 17). Next, the suction operation of the suction device 72 of the second processing device 68 is started, the pressurized air and the vacuum suction to the non-contact suction board 1 are stopped, and the workpiece W is sucked by the suction device 72 of the second processing device 68. Further, the arm is returned to the initial position to complete the transfer operation (FIG. 19).
　上述したような非接触吸着盤によれば、吸着面全体から加圧空気を吹き出してワークを浮上させつつ、吸着面全体に分布する吸引孔からワークＷを吸引するので、ワークに多大な応力をかけることなく、非接触状態でワークを所定位置に吸着固定できる。 According to the non-contact suction disk as described above, the workpiece W is sucked from the suction holes distributed over the entire suction surface while blowing the pressurized air from the entire suction surface and floating the workpiece, so that a large stress is applied to the workpiece. The workpiece can be sucked and fixed at a predetermined position in a non-contact state without being applied.
　次に、本発明の第２実施形態の非接触吸着盤の構成について説明する。図２０は、本発明の第２実施形態の非接触吸着盤１００の上方からの分解斜視図であり、図２１は、本発明の第２実施形態の非接触吸着盤１００の下方からの分解斜視図である。 Next, the configuration of the non-contact suction disk according to the second embodiment of the present invention will be described. FIG. 20 is an exploded perspective view from above of the non-contact suction disk 100 according to the second embodiment of the present invention, and FIG. 21 is an exploded perspective view from below of the non-contact suction disk 100 according to the second embodiment of the present invention. FIG.
　本実施形態の非接触吸着盤１００は、第１実施形態の非接触吸着盤１と同様に、半導体ウエハ、ＦＰＤ用ガラス基材等の薄板状の被吸着物（ワーク）、例えば、厚さ１００μｍ以下の半導体ウエハを非接触状態で吸着する非接触吸着盤である。 The non-contact suction disk 100 of the present embodiment is a thin plate-like object (work) such as a semiconductor wafer or a glass substrate for FPD, for example, a thickness of 100 μm, like the non-contact suction disk 1 of the first embodiment. This is a non-contact suction disk for sucking the following semiconductor wafers in a non-contact state.
　非接触吸着盤１００は、図２０、および図２１に示されているように、上面にワークの吸着領域を備えた円板状の多孔質パッド１０２と、多孔質パッド１０２を下側（裏側）から保持する略円板状のパッドホルダ１０４と、パッドホルダ１０４の裏側に配置される略円板状のベース１０６とを備えている。
　非接触吸着盤１００では、パッドホルダ１０４とベース１０６との間に、環状部分１０８ａを備えた枠部材１０８が配置されている。 As shown in FIGS. 20 and 21, the non-contact suction disk 100 includes a disk-like porous pad 102 having a workpiece suction region on the upper surface, and a lower side (back side) of the porous pad 102. A substantially disc-shaped pad holder 104 that is held from the bottom, and a substantially disc-shaped base 106 disposed on the back side of the pad holder 104.
In the non-contact suction disk 100, a frame member 108 having an annular portion 108a is disposed between the pad holder 104 and the base 106.
　多孔質パッド１０２は、非接触吸着盤１の多孔質パッド２と同様に通気性の多孔質カーボンで形成されている。多孔質パッド１０２の材料も、通気性の多孔質カーボンに限定されるものではなく、他の通気性の多孔質材料、例えばポーラスSiC・ポーラスアルミナ等を使用することもできる。 The porous pad 102 is formed of breathable porous carbon, like the porous pad 2 of the non-contact suction disk 1. The material of the porous pad 102 is not limited to the breathable porous carbon, and other breathable porous materials such as porous SiC / porous alumina can be used.
　多孔質パッド１０２と、パッドホルダ１０４の円盤部分１０４ａと、枠部材１０８の環状部分１０８ａと、ベース１０６の円盤部分１０６ａは、略同一の外径を有している。そして、本実施態様では、多孔質パッド１０２と、パッドホルダ１０４の円盤部分１０４ａと、枠部材１０８の環状部分１０８ａと、ベース１０６の円盤部分１０６ａとが、積層され、接着剤によって固定されて非接触吸着盤１００を形成している。 The porous pad 102, the disk portion 104a of the pad holder 104, the annular portion 108a of the frame member 108, and the disk portion 106a of the base 106 have substantially the same outer diameter. In this embodiment, the porous pad 102, the disk portion 104a of the pad holder 104, the annular portion 108a of the frame member 108, and the disk portion 106a of the base 106 are laminated, fixed by an adhesive, and non-coated. A contact suction disk 100 is formed.
　また、パッドホルダ１０４と、ベース１０６と、枠部材１０８は、円盤部分あるいは環状部分から外方に向かって延びる略同一輪郭の矩形のハンドル部１０４ｂ、１０６ｂ、１０８ｂを、それぞれ、備えている。 Further, the pad holder 104, the base 106, and the frame member 108 are respectively provided with rectangular handle portions 104b, 106b, and 108b having substantially the same contour extending outward from the disk portion or the annular portion.
　パッドホルダ１０４と、ベース１０６と、枠部材１０８とは、アルミ合金の金属材料、CFRP・PEEKなどの樹脂等で形成されている。 The pad holder 104, the base 106, and the frame member 108 are made of an aluminum alloy metal material, a resin such as CFRP / PEEK, or the like.
　多孔質パッド１０２には、複数の吸引孔（通気孔）１０９が形成されている。吸引孔１０９は、多孔質パッド１０２の略全面に亘って、配置されている。 A plurality of suction holes (vent holes) 109 are formed in the porous pad 102. The suction hole 109 is disposed over substantially the entire surface of the porous pad 102.
　なお、多孔質パッド１０２の周縁部には、多孔質パッドをパッドホルダ４等に連結する際の位置決め穴１１０が形成されている。 Note that a positioning hole 110 for connecting the porous pad to the pad holder 4 or the like is formed in the peripheral portion of the porous pad 102.
　図２１に示されているように、多孔質パッド１０２の下面には、外周縁に環状の垂下部１１２が形成されている。垂下部１１２は、外径が、パッドホルダ１０４の円盤部１０４ｂの外径と略等しくなるように構成されている。すなわち、多孔質パッド１０２の下面には、円盤状の凹所が形成されていることになる。この結果、パッドホルダ１０４上に多孔質パッド１０２を積層すると、パッドホルダ１０４の上面と多孔質パッド１０２の下面との間に、密閉空間（第１密閉空間）が形成されることになる。 As shown in FIG. 21, an annular hanging portion 112 is formed on the outer peripheral edge of the lower surface of the porous pad 102. The hanging portion 112 is configured such that the outer diameter is substantially equal to the outer diameter of the disk portion 104 b of the pad holder 104. That is, a disk-shaped recess is formed on the lower surface of the porous pad 102. As a result, when the porous pad 102 is stacked on the pad holder 104, a sealed space (first sealed space) is formed between the upper surface of the pad holder 104 and the lower surface of the porous pad 102.
　多孔質パッド１０２の下面の垂下部１１２の内側領域には、断面矩形の溝１１４が形成され、溝１１４によって区切られた部分は、横断面が正方形の島状の突出部１１６とされている。島状の突出部１１６は、格子状（碁盤の目状）に配置された溝１１４とともに、碁盤の目状の配置を構成している。各突出部１１４の頂面は平坦であり、中央に、多孔質パッド１０２を厚さ方向に貫通する吸引孔１０９が配置されている。 A groove 114 having a rectangular cross section is formed in an inner region of the drooping portion 112 on the lower surface of the porous pad 102, and a portion delimited by the groove 114 is an island-like protrusion 116 having a square cross section. The island-shaped protrusions 116 form a grid-like arrangement along with the grooves 114 arranged in a grid pattern (a grid-like pattern). The top surface of each protrusion 114 is flat, and a suction hole 109 penetrating the porous pad 102 in the thickness direction is disposed at the center.
　島状の突出部１１６の厚さは、垂下部１１２の高さと略同一であるので、パッドホルダ１０４の上面と多孔質パッド１０２の下面との間に形成される密閉空間（第１密閉空間）は、島状の突出部１１６によって区切られた密閉空間となる。 Since the thickness of the island-shaped protrusion 116 is substantially the same as the height of the hanging part 112, a sealed space (first sealed space) formed between the upper surface of the pad holder 104 and the lower surface of the porous pad 102. Is a sealed space partitioned by island-shaped protrusions 116.
　また、パッドホルダ１０４には、パッドホルダ１０４を厚さ方向に貫通する貫通孔１１８が穿孔されている。各貫通孔１１８は、多孔質パッド１０２の吸引孔１０９と略同一の直径を有し、パッドホルダ１０４が多孔質パッド１０２に所定の角度位置で配置されたとき、多孔質パッド１０２の吸引孔１０９に整列するように配置されている。 The pad holder 104 has a through hole 118 that penetrates the pad holder 104 in the thickness direction. Each through-hole 118 has substantially the same diameter as the suction hole 109 of the porous pad 102, and when the pad holder 104 is disposed at a predetermined angular position on the porous pad 102, the suction hole 109 of the porous pad 102. Are arranged to line up.
　この結果、多孔質パッド１０２が、パッドホルダ１０４と積層されると、多孔質パッド１０２の吸引孔１０９とパッドホルダ１０４の貫通孔１１８とが流体連通する。 As a result, when the porous pad 102 is laminated with the pad holder 104, the suction hole 109 of the porous pad 102 and the through hole 118 of the pad holder 104 are in fluid communication.
　上述したように、パッドホルダ１０４の円盤部分と枠部材１０８の環状部分とベース１０６の円盤部分とは略同一の外径であるので、パッドホルダ１０４の円盤部分と枠部材１０８の環状部分とベース１０６の円盤部分とが整列状態で積層されて非接触吸着盤１００とされると、パッドホルダ１０４の円盤部分とベース１０６の円盤部分の間に、枠部材１０８の厚さに略等しい高さを有する密閉空間（第２密閉空間）が形成される。このパッドホルダ１０４の円盤部分とベース１０６の円盤部分の間に密閉空間（第２密閉空間）は、パッドホルダ１０４の貫通孔１１８を介して、多孔質パッド１０２の吸引孔１０９に連通することになる。 As described above, since the disk portion of the pad holder 104, the annular portion of the frame member 108, and the disk portion of the base 106 have substantially the same outer diameter, the disk portion of the pad holder 104, the annular portion of the frame member 108, and the base portion When the disk portion 106 is stacked in an aligned state to form the non-contact suction disk 100, the height between the disk portion of the pad holder 104 and the disk portion of the base 106 is substantially equal to the thickness of the frame member 108. A sealed space (second sealed space) is formed. A sealed space (second sealed space) between the disk portion of the pad holder 104 and the disk portion of the base 106 communicates with the suction hole 109 of the porous pad 102 through the through hole 118 of the pad holder 104. Become.
　この結果、パッドホルダ１０４の円盤部分とベース１０６の円盤部分の間に密閉空間（第２密閉空間）を真空吸引すると、パッドホルダ１０４の貫通孔１１８を介して、多孔質パッド１０２の各吸引孔１０９から吸引が行われ、多孔質パッド１０２上のワークを多孔質パッド１０２に向けて吸着することができる。 As a result, when the sealed space (second sealed space) is vacuum-sucked between the disk portion of the pad holder 104 and the disk portion of the base 106, each suction hole of the porous pad 102 is passed through the through hole 118 of the pad holder 104. Suction is performed from 109, and the work on the porous pad 102 can be adsorbed toward the porous pad 102.
　また、本実施態様の非接触吸着盤１００では、枠部材１０８のハンドル部１０８ｂに、略平行に延びる吸引長孔１２０、１２２、と加圧長孔１２４が形成されている。両側部の吸引長孔１２０、１２３は、内端側が、枠部材１０８の環状部１０８ａに囲まれた内部空間に連通している。従って、非接触吸着盤１００の組み立て状態では、吸引長孔１２０、１２２が、パッドホルダ１０４の円盤部分とベース１０６の円盤部分の間の密閉空間（第２密閉空間）に連通される。 Further, in the non-contact suction disk 100 of the present embodiment, suction long holes 120 and 122 and a pressurizing long hole 124 extending in substantially parallel are formed in the handle portion 108b of the frame member 108. The suction long holes 120 and 123 on both sides communicate with the inner space surrounded by the annular portion 108 a of the frame member 108 on the inner end side. Therefore, in the assembled state of the non-contact suction disk 100, the suction long holes 120 and 122 are communicated with the sealed space (second sealed space) between the disk part of the pad holder 104 and the disk part of the base 106.
　さらに、本実施態様の非接触吸着盤１００では、パッドホルダ１０４の円盤部分とベース１０６の円盤部分の間の密閉空間（第２密閉空間）に、複数の補強部材１２６が、配置されている。補強部材１２６は、枠部材１０８と略同一の厚さを有している。この結果、非接触吸着盤１００の組み立て状態で補強部材１２６は、パッドホルダ１０４の円盤部分１０４ａの下面とベース１０６の円盤部分１０６ａの上面とに間に挟持され、パッドホルダ１０４の円盤部分１０４ａとベース１０６の円盤部分１０６ａとの間の密閉空間（第２密閉空間）が減圧された際、この密閉空間（第２密閉空間）が厚さ方向に潰れることを抑制する補強材として機能する。 Furthermore, in the non-contact suction disk 100 of this embodiment, a plurality of reinforcing members 126 are arranged in a sealed space (second sealed space) between the disk part of the pad holder 104 and the disk part of the base 106. The reinforcing member 126 has substantially the same thickness as the frame member 108. As a result, the reinforcing member 126 is sandwiched between the lower surface of the disk portion 104a of the pad holder 104 and the upper surface of the disk portion 106a of the base 106 in the assembled state of the non-contact suction disk 100, and the disk portion 104a of the pad holder 104 When the sealed space (second sealed space) between the base 106 and the disk portion 106a is depressurized, it functions as a reinforcing material that suppresses the collapse of the sealed space (second sealed space) in the thickness direction.
　さらにまた、本実施形態の非接触吸着盤１００は、上板１２８と下板１３０を備えている。上板１２８と下板１３０は、パッドホルダ１０４とベース１０６と枠部材１０８のハンドル部１０４ｂ、１０６ｂ、１０８ｂと略同一の矩形形状を有し、非接触吸着盤１００の組み立て状態で、ハンドル部１０４ｂ、１０６ｂ、１０８ｂを上下から挟持する。 Furthermore, the non-contact suction disk 100 of this embodiment includes an upper plate 128 and a lower plate 130. The upper plate 128 and the lower plate 130 have substantially the same rectangular shape as the pad holder 104, the base 106, and the handle portions 104b, 106b, and 108b of the frame member 108, and the handle portion 104b in the assembled state of the non-contact suction disk 100. 106b and 108b are sandwiched from above and below.
　上板１２８と下板１３０は、四隅にねじ穴１３２、１３４を有している。これらのねじ穴は、非接触吸着盤１００の組み立て状態では、パッドホルダ１０４とベース１０６と枠部材１０８のハンドル部１０４ｂ、１０６ｂ、１０８ｂの四隅に形成されている対応するねじ穴と１３６、１３８、１４０と上下方向に整列し、これらの各ねじ穴、１３２，１３６、１３８、１４０、および１３４に、図示しないネジが挿通されることによって、積層状態のハンドル部１０４ｂ、１０６ｂ、１０８ｂを上板１２８と下板１３０が挟持する。 The upper plate 128 and the lower plate 130 have screw holes 132 and 134 at four corners. In the assembled state of the non-contact suction disk 100, these screw holes correspond to the corresponding screw holes formed at the four corners of the handle portions 104b, 106b, 108b of the pad holder 104, the base 106, and the frame member 108, 136, 138, 140, the handle portions 104b, 106b, and 108b in a stacked state are attached to the upper plate 128 by inserting screws (not shown) through these screw holes 132, 136, 138, 140, and 134, respectively. And the lower plate 130 are sandwiched.
　下板１３０には、厚さ方向に貫通する２つの吸引開口１４２、１４４と、加圧開口１４６とが形成されている。側方に形成された吸引開口１４２、１４４は、非接触吸着盤１００の組み立て状態では、ベース１０６のハンドル部１０６ｂを貫通する吸引通路１４８、１５０を介して、枠部材１０８のハンドル部１０８ｂに形成された吸引長孔１２０、１２２に連通し、さらに、パッドホルダ１０４の円盤部分とベース１０６の円盤部分の間の密閉空間（第２密閉空間）に連通する。 The lower plate 130 is formed with two suction openings 142 and 144 penetrating in the thickness direction and a pressure opening 146. The suction openings 142 and 144 formed on the side are formed in the handle portion 108b of the frame member 108 through the suction passages 148 and 150 that penetrate the handle portion 106b of the base 106 in the assembled state of the non-contact suction disk 100. The suction elongated holes 120 and 122 communicate with each other, and further communicate with a sealed space (second sealed space) between the disk portion of the pad holder 104 and the disk portion of the base 106.
　一方、加圧開口１４６は、非接触吸着盤１００の組み立て状態では、ベース１０６のハンドル部１０６ｂを貫通する加圧通路１５２を介して、枠部材１０８のハンドル部１０８ｂに形成された加圧長孔１２４の外方側部に連通する。 On the other hand, the pressurization opening 146 is a pressurization long hole formed in the handle portion 108b of the frame member 108 via the pressurization passage 152 penetrating the handle portion 106b of the base 106 in the assembled state of the non-contact suction board 100. It communicates with the outer side portion of 124.
　さらに、加圧長孔１２４の内方側（環状部分側）部は、非接触吸着盤１００の組み立て状態で上方に配置される、パッドホルダ１０４のハンドル部１０４ｂを貫通する加圧通路１５４を介して、パッドホルダ１０４の上面と多孔質パッド１０２の下面との間に形成された密閉空間（第１密閉空間）に連通する。 Further, the inner side (annular portion side) portion of the pressurizing elongated hole 124 is disposed via a pressurizing passage 154 that penetrates the handle portion 104b of the pad holder 104 and is disposed above in the assembled state of the non-contact suction disk 100. In this way, it communicates with a sealed space (first sealed space) formed between the upper surface of the pad holder 104 and the lower surface of the porous pad 102.
　使用時には、加圧開口１４６から外部の圧縮空気源から加圧空気を導入すると、加圧空気は、パッドホルダ１０４の上面と多孔質パッド１０２の下面との間に形成された密閉空間（第１密閉空間）に流入し、多孔質パッド１０２の細孔を通して表面から噴出する。 In use, when pressurized air is introduced from an external compressed air source through the pressurized opening 146, the pressurized air is sealed between the upper surface of the pad holder 104 and the lower surface of the porous pad 102 (first space). Into the sealed space) and ejected from the surface through the pores of the porous pad 102.
　一方、加圧空気の導入と同時に行われる、吸引開口１４２、１４４から真空吸引によって、多孔質パッド１０２の表面（吸着面）で浮上させられているワークは、多孔質パッド１０２の各吸引孔１０９から吸引され、加圧空気による浮力と真空吸引による吸引力が釣り合う吸着面から所定距離だけ離れた位置で、吸着固定されることになる。 On the other hand, the workpiece floated on the surface (suction surface) of the porous pad 102 by vacuum suction from the suction openings 142 and 144, which is performed simultaneously with the introduction of the pressurized air, is applied to each suction hole 109 of the porous pad 102. And is fixed by suction at a position away from the suction surface where the buoyancy by pressurized air and the suction force by vacuum suction are balanced.
　加圧空気（空気量と空気圧）による浮力と、真空吸引による吸引力とを調整することによって、非接触吸着盤１００を反転させた状態、すなわち多孔質パッド１０２の吸着面が下方を向いた状態で、吸着面の下側にワークを非接触状態で吸着固定させることもできる。 A state in which the non-contact suction disk 100 is inverted by adjusting the buoyancy by the pressurized air (air amount and air pressure) and the suction force by the vacuum suction, that is, the suction surface of the porous pad 102 is directed downward. Thus, the work can be sucked and fixed under the suction surface in a non-contact state.
　尚、パッドホルダ１０４の円盤部分１０４ａと、枠部材１０８の環状部分１０８ａと、ベース１０６の円盤部分１０６ａには、非接触吸着盤１００の組み立て状態で、多孔質パッド１０２の位置決め穴１１０と整列する、複数の位置決め穴１５６、１５８、１６０が、それぞれ、形成されている。 The disk portion 104a of the pad holder 104, the annular portion 108a of the frame member 108, and the disk portion 106a of the base 106 are aligned with the positioning holes 110 of the porous pad 102 in the assembled state of the non-contact suction disk 100. A plurality of positioning holes 156, 158, and 160 are respectively formed.
　非接触吸着盤１００を組み立てる際には、位置決め穴１１０、１５６、１５８、１６０が整列するように、多孔質パッド１０２と、パッドホルダ１０４の円盤部分１０４ａと、枠部材１０８の環状部分１０８ａと、ベース１０６の円盤部分１０６ａとを積層し、整列した位置決め穴１１０、１５６、１５８、１６０に図示しないピンを挿通し、多孔質パッド１０２とパッドホルダ１０４と枠部材１０８とベース１０６とを相互に位置決めして、これらを接着固定する。 When assembling the non-contact suction disk 100, the porous pad 102, the disk part 104a of the pad holder 104, the annular part 108a of the frame member 108, so that the positioning holes 110, 156, 158, 160 are aligned, The disk portion 106a of the base 106 is laminated, and pins (not shown) are inserted into the aligned positioning holes 110, 156, 158, 160, and the porous pad 102, the pad holder 104, the frame member 108, and the base 106 are positioned relative to each other. Then, these are bonded and fixed.
　また、ピンは、多孔質パッド１０２の表面から上方に突出する長さを有し、非接触吸着盤１００の組み立て後も取り外されず、多孔質パッド１０２の表面に吸着されたワークが多孔質パッドの表面から滑り落ちることを防止するストッパとなる。 Further, the pin has a length that protrudes upward from the surface of the porous pad 102, and is not removed after the assembly of the non-contact suction disk 100, and the workpiece adsorbed on the surface of the porous pad 102 is the porous pad 102 It serves as a stopper that prevents sliding off the surface.
　本発明の前記実施形態に限定されることなく、特許請求の範囲に記載された技術的思想の範囲内で種々の変更、変形が可能である。 The present invention is not limited to the above-described embodiment, and various changes and modifications can be made within the scope of the technical idea described in the claims.
　上記第１の実施形態の非接触吸着盤は、円板状の多孔質パッド２に格子状に吸引孔８を設けた構成であったが、図２２に示すように円板状の多孔質パッド２’に環状に吸引孔８’を配置した多孔質パッドを使用してもよい。
　また、図２３および図２４に示されているように、矩形の多孔質パッド２”に、格子状または環状に、複数の吸引孔８”を配置した構成でもよい。この場合、矩形のパッドホルダ４”等が使用される。 The non-contact suction disk of the first embodiment has a configuration in which the suction holes 8 are provided in a lattice shape in the disk-shaped porous pad 2, but as shown in FIG. 22, the disk-shaped porous pad You may use the porous pad which has arrange | positioned the suction hole 8 'to 2' cyclically | annularly.
As shown in FIGS. 23 and 24, a plurality of suction holes 8 ″ may be arranged in a rectangular porous pad 2 ″ in a lattice shape or in an annular shape. In this case, a rectangular pad holder 4 ″ or the like is used.
　上記図２２ないし図２４の例では、多孔質パッドの吸引孔の位置に対応して、多孔質パッドの吸引孔（通気孔）、およびパッドホルダの連通孔等の位置も適宜、変更される。 In the examples of FIGS. 22 to 24 described above, the positions of the suction holes (vent holes) of the porous pad, the communication holes of the pad holder, and the like are appropriately changed corresponding to the positions of the suction holes of the porous pad.
　さらに、上記実施形態は、第１密閉空間が加圧空間となり、第２密閉空間が減圧空間となる構成であったが、加圧部分と減圧部分を入れ替え、第１密閉空間を減圧空間とし、第２密閉空間を加圧空間とした構成でもよい。 Further, in the above embodiment, the first sealed space is a pressurized space and the second sealed space is a decompressed space. However, the pressurized portion and the decompressed portion are replaced, and the first sealed space is the decompressed space, The second sealed space may be a pressurized space.
　また、上記第１の実施形態では、ベース６の平坦な上面に断面矩形のベース溝２２が格子状に形成され、このベース溝２２が第２密閉空間となる構成であった。すなわち、格子状のベース溝２２の間に、パッドホルダ４の上面の島状の突出部１６と同様の島状の突出部が形成された構成である。しかしながら、図２５に示されているように、ベース６’の上面の全体を凹所とし、島状の突出部に区切られない一体的な第２密閉空間２２’とする構成でもよい。 Further, in the first embodiment, the base groove 22 having a rectangular cross section is formed in a lattice shape on the flat upper surface of the base 6, and the base groove 22 becomes the second sealed space. That is, an island-shaped protrusion similar to the island-shaped protrusion 16 on the upper surface of the pad holder 4 is formed between the lattice-shaped base grooves 22. However, as shown in FIG. 25, the entire upper surface of the base 6 ′ may be a recess so that the second sealed space 22 ′ is not divided into island-shaped protrusions.
１：非接触吸着盤
２：多孔質パッド
４：パッドホルダ
６：ベース
８：吸引孔（通気孔）
１０：連結穴
１２：立上がり部
１４：溝
１６：突出部
１８：連通孔
２０：加圧空気入口
２２：ベース溝
２４：真空孔 1: Non-contact suction board 2: Porous pad 4: Pad holder 6: Base 8: Suction hole (vent hole)
10: Connecting hole 12: Rising part 14: Groove 16: Protruding part 18: Communication hole 20: Pressurized air inlet 22: Base groove 24: Vacuum hole

Claims (9)

  1. 　薄板状の被吸着物を非接触状態で吸着する非接触吸着盤であって、
    　厚さ方向に貫通して延びる複数の通気孔が吸着固定領域に形成された板状の多孔質パッドと、
    　前記多孔質パッドの裏面に隣接して配置された第１密閉空間と、
    　前記第１密閉空間と隔離された第２密閉空間と、
    　前記第２密閉空間と前記通気孔とを連通させる連通手段と、を備えている、
    　ことを特徴とする非接触吸着盤。     A non-contact suction disk for adsorbing a thin plate-shaped object to be adsorbed in a non-contact state,
    A plate-like porous pad in which a plurality of air holes extending through in the thickness direction are formed in the adsorption fixing region;
    A first sealed space disposed adjacent to the back surface of the porous pad;
    A second sealed space isolated from the first sealed space;
    Communicating means for communicating the second sealed space and the vent hole;
    A non-contact suction board characterized by that.
  2. 　表面が前記多孔質パッドの裏面側に積層され、該多孔質パッドの裏面との間に前記第１密閉空間を構成する凹所を備えた板状のホルダと、
    　前記ホルダの裏面側に積層され、該ホルダの裏面との間に第２密閉空間を形成するベースと、を備え、
    　前記ホルダが、一端が前記積層時に前記多孔質パッドの通気孔に接続され他端が該ホルダの裏面に開口し前記連通手段として機能する連通孔を有している、
    　請求項１に記載の非接触吸着盤。     A plate-like holder having a surface laminated on the back side of the porous pad, and a recess that forms the first sealed space with the back side of the porous pad;
    A base that is laminated on the back side of the holder and forms a second sealed space between the back side of the holder, and
    The holder has a communication hole that has one end connected to the air hole of the porous pad during the lamination and the other end opened to the back surface of the holder and functions as the communication means.
    The non-contact suction disk according to claim 1.
  3. 　前記ホルダが、前記複数の通気孔の裏面側開口端の位置で前記多孔質パッドの裏面に当接する平坦な頂部を備えた複数の島状の突出部を備え、
    　前記連通孔が前記突出部を貫通して延び、
    　前記突出部の間の空間が前記第１密閉空間とされる、
    　請求項２に記載の非接触吸着盤。     The holder includes a plurality of island-shaped protrusions including a flat top portion that comes into contact with the back surface of the porous pad at the position of the back side opening ends of the plurality of vent holes,
    The communication hole extends through the protrusion,
    The space between the protrusions is the first sealed space.
    The non-contact suction disk according to claim 2.
  4. 　前記多孔質パッドの裏面側に積層され、前記多孔質パッドの通気孔に対応する貫通孔を備えた板状のホルダを備え、
    　さらに、前記ホルダの裏面側に積層され、該ホルダの裏面との間に第２密閉空間を形成するベースを備え、
    　前記多孔質パッドの裏面に前記ホルダとの間に前記第１密閉空間を構成する凹所が形成され、
    　前記多孔質パッドの通気孔が前記ホルダの貫通孔に連結され前記連通手段として機能する、
    　請求項１に記載の非接触吸着盤。     Laminated on the back side of the porous pad, comprising a plate-like holder having a through hole corresponding to the vent of the porous pad,
    Furthermore, it is laminated on the back side of the holder, and includes a base that forms a second sealed space between the back side of the holder,
    A recess forming the first sealed space is formed between the holder and the back surface of the porous pad,
    The air hole of the porous pad is connected to the through hole of the holder and functions as the communication means;
    The non-contact suction disk according to claim 1.
  5. 　前記ホルダと前記ベースとの間に配置される環状部を有する枠部材を備え、
    　前記第２密閉空間が、前記環状部の内部空間によって形成される、
    　請求項４に記載の非接触吸着盤。     A frame member having an annular portion disposed between the holder and the base;
    The second sealed space is formed by an internal space of the annular portion;
    The non-contact suction disk according to claim 4.
  6. 　前記多孔質パッドの凹所に、前記ホルダの表面に当接する平坦な頂部を備えた複数の島状の突出部を備え、
    　前記多孔質パッドの通気孔が、前記島状の突出部を貫通している、
    　請求項４または５に記載の非接触吸着盤。     In the recess of the porous pad, provided with a plurality of island-like protrusions provided with a flat top that contacts the surface of the holder,
    The air hole of the porous pad passes through the island-shaped protrusion.
    The non-contact suction disk according to claim 4 or 5.
  7. 　前記第１密閉空間が加圧空気用空間部であり、
    　前記第２密閉空間が減圧用空間部である、
    　請求項１ないし６のいずれか１項に記載の非接触吸着盤。     The first sealed space is a space for pressurized air;
    The second sealed space is a decompression space,
    The non-contact suction disk according to any one of claims 1 to 6.
  8. 　前記通気孔が、前記多孔質パッドの表面全体に分散して配置されている、
    　請求項１ないし７のいずれか１項に記載の非接触吸着盤。     The air holes are distributed and arranged over the entire surface of the porous pad,
    The non-contact suction disk according to any one of claims 1 to 7.
  9. 　前記多孔質パッドが、多孔質カーボンで形成されている、
    　請求項１乃至８のいずれか１項に記載の非接触吸着盤。     The porous pad is formed of porous carbon;
    The non-contact suction disk according to any one of claims 1 to 8.
PCT/JP2013/055491 2012-02-28 2013-02-28 Non-contact suction plate WO2013129599A1 (en)

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