JP5961064B2 - Suction table manufacturing method and suction table - Google Patents

Description

  The present invention processes a scribe groove (cutting groove) on a brittle material substrate (hereinafter collectively referred to as a substrate) such as glass, silicon, ceramic (LTCC substrate, etc.), compound semiconductor, etc. The present invention relates to a method of manufacturing a suction table for sucking and holding the substrate when breaking along the surface and a suction table.

  As shown in FIG. 6, the suction table used in the substrate processing apparatus such as a scribing device or a break device is formed by opening a large number of air suction holes 11 toward the substrate mounting surface 12 in a metal base plate 10. It has been known. Each air suction hole 11 is connected to a hollow space manifold 11a at the bottom of the base plate, and is sucked from the air suction hole 11 via the manifold 11a by the vacuum pump P provided outside and placed on the substrate placement surface 12. The substrate W is sucked.

Further, in the table in which the air suction hole 11 is provided in the metal base plate 10, there is a suction table as shown in FIG. 7 which is improved in order to improve the adhesion of the substrate placed on the substrate mounting surface.
This suction table is processed so that a groove 13 having an inverted T-shaped cross section draws a square locus (closed curve locus) along the vicinity of each edge of the substrate mounting surface 12 of the base plate 10. A non-breathable cushioning material 14 framed in a quadrangular shape in a plan view is fitted into the inverted T-shaped groove 13 in a state where the top is slightly exposed. When processing the substrate, the substrate W is placed on the top surface of the cushioning material 14 by positioning the substrate W against the positioning reference pin 15 erected on the substrate mounting surface 12. When sucked from the air suction hole 11 in this state, the substrate W is sucked to the substrate mounting surface 12 of the base plate 10 while compressing the cushion material 14. As a result, even if the substrate W is slightly distorted or curved, it can be evenly adhered over the entire area where the air suction holes 11 are formed.

  In the case of a suction table in which a large number of air suction holes 11 are provided in the base plate 10, when processing a sheet-like thin substrate placed on the suction table, the substrate can be sucked with an appropriate suction force (suction force). is necessary. If the suction force is too strong, the substrate (workpiece) is recessed at the air suction hole 11. When such a dent occurs, for example, in the process of rolling by pressing the cutter wheel against the substrate surface, due to the vertical movement of the cutter wheel, and in the process using a laser beam, the position shift of the beam focus and the irradiation power density Processing quality deteriorates due to the decrease. Further, if the substrate is wrinkled due to dents during adsorption, the processing quality of the wrinkled portion deteriorates for the same reason as described above.

  Therefore, it is necessary to suck the substrate with an appropriate suction force and prevent the unevenness of the substrate surface as much as possible. The appropriate adsorption force varies depending on the material and thickness of the substrate to be processed. Specifically, for example, a substrate having a softer material and a thinner thickness must weaken the adsorption force. For proper suction, it is necessary to reduce the air suction holes to reduce the individual suction force and increase the number of holes to ensure the overall suction force. In order to adsorb a sheet-like substrate having a thickness of about several tens of μm so that unevenness does not occur, a large number of air suction holes having a very small hole diameter must be processed at a high density, but there is a limit to the processing. .

Therefore, a substrate mounting portion of a table formed of a porous ceramic plate having countless small holes vertically and horizontally has been conventionally used together with the metal suction table described above (see Patent Document 1).
Since the pore diameter of the porous part of the porous ceramic plate is sufficiently small, the adsorption force by one hole is weak and local dent does not occur, but it adsorbs the entire surface where the porous ceramic plate and the substrate are in contact In addition, the force for adsorbing the entire substrate is sufficient, and it is effective as an adsorption table for fixing a thin substrate.

JP 2001-138095 A

However, the material of the ceramic plate is fragile, and especially the porous ceramic material is highly brittle. Therefore, a complicated groove such as the inverted T-shaped groove shown in FIG. 7 or a screw hole for screwing the reference pin is used. It was difficult to process precisely.
Therefore, the present invention enables a complicated processing such as a cross-section inverted T-shaped groove for fitting a cushion material to a part of the suction surface while using a porous ceramic plate as the suction surface of the suction table. It is an object of the present invention to provide a method for manufacturing a suction table and a suction table obtained by the manufacturing method.

  In order to achieve the above object, the present invention takes the following technical means. That is, in the method for manufacturing the suction table of the present invention, the upper layer plate made of a porous ceramic material and having the upper surface as the substrate mounting surface is formed on the upper surface of the middle layer plate having a number of air suction holes penetrating vertically. A suction table manufacturing method for sucking and holding a substrate placed on the substrate placement surface by reducing pressure by a vacuum evacuation unit joined and communicated with the air suction hole, wherein the suction table is formed on a lower surface of the upper layer plate. A step of processing the lower groove into a closed curve shape, a through groove having a groove width narrower than the groove width of the lower groove is passed through the lower groove from the upper surface of the upper plate, and a groove having an inverted T-shaped cross section is processed into the closed curve shape, thereby A step of dividing the upper layer plate into a center member and a frame member serving as an adsorption area, and an inner surface of the frame member and an outer surface of the center member are covered with a non-breathable coating material (for example, epoxy resin). After the center member of the upper layer plate is fitted in the frame member, the upper member is placed on the upper surface of the middle layer plate, and the center member is positioned at the center of the frame member by a mounting jig. And the process of joining.

According to the dividing method of the present invention, the lower groove is first processed on the lower surface of the upper layer plate, and then the upper layer plate is once processed into the frame member and the center member by processing a through groove having a groove width narrower than the groove width of the lower groove. These are recombined and bonded to the upper surface of the middle layer plate. As a result, even if a brittle porous ceramic material that is difficult to process is a raw material, it is possible to accurately form an inverted T-shaped groove.
In addition, when the upper layer plate is separated into the frame member and the center member, the non-breathable coating material (for example, epoxy resin) can be easily coated on the inner surface of the frame member and the outer surface of the center member. A decrease in adsorption force (suction force) due to leakage from the inverted T-shaped groove can be prevented.

In the manufacturing method of the present invention, after joining the upper layer plate and the middle layer plate with an adhesive (for example, epoxy resin), the upper layer plate and the middle layer facing the air suction hole from below the air suction hole of the middle layer plate It is good to set it as the structure including the process of cutting and removing the contact bonding layer with a board.
Thereby, the fall of attraction | suction by an adhesive layer can be avoided.

In the manufacturing method of the present invention, the reference pin insertion hole provided coaxially in the upper layer plate and the middle layer plate is processed, and the diameter of the insertion hole of the middle layer plate is formed larger than the insertion hole of the upper layer plate. Preferably, a synthetic resin filler is filled in the insertion hole of the intermediate layer plate, and after the upper layer plate is joined to the intermediate layer plate, a pin hole for a reference pin is processed in the filler.
Thereby, even if the middle layer plate is formed of a ceramic material that is difficult to thread, the pin hole for inserting the reference pin can be accurately processed in accordance with the position of the reference pin insertion hole of the upper layer plate. .

The suction table of the present invention is formed of a porous ceramic material and has an upper layer plate whose upper surface is a substrate mounting surface, and a large number of air that is bonded to the lower surface of the upper layer plate and penetrates vertically. An intermediate layer plate having a suction hole, a frame-shaped lower layer plate that is bonded to the lower surface of the intermediate layer plate, and that forms a hollow space in the central portion so that the opening on the lower end side of the air suction hole is not blocked; A base plate attached to the lower surface of the lower layer plate, wherein the upper layer plate is formed of a frame member and a center member that are vertically penetrated, and whose cross section is divided by a groove having an inverted T shape and a plan view. The inner surface of the frame member and the outer surface of the center member, which are joined to the upper surface of the intermediate layer plate and separated by the groove, are covered with a non-breathable coating material, and the hollow space of the lower layer plate is external Suction air It has a configuration which is communicated with the (evacuation means). The suction table of the present invention is used in a state where the lower layer plate is installed on the base plate of the processing apparatus.
As a result, even if the upper layer plate is a porous ceramic, it is possible to form a groove having an inverted T-shaped cross section and a closed curve on the substrate mounting surface of the upper layer plate with high processing accuracy, and from the inverted T-shaped groove. It is possible to provide a suction table that prevents a reduction in suction force due to leakage.

Sectional drawing which shows the state at the time of use of the adsorption | suction table which concerns on this invention. The perspective view which shows the state which removed the cushion material of the adsorption | suction table of FIG. The disassembled perspective view of the adsorption | suction table of FIG. Explanatory drawing which shows the manufacturing process of the adsorption | suction table of FIG. The perspective view which shows the other Example of the adsorption | suction table which concerns on this invention. Sectional drawing which shows an example of the conventional suction table. Sectional drawing which shows another example of the conventional adsorption | suction table.

Hereinafter, a suction table manufacturing method according to the present invention will be described in detail with reference to the drawings showing embodiments thereof.
FIG. 1 is a cross-sectional view showing a state in use of the suction table according to the present invention, FIG. 2 is a perspective view of the suction table, FIG. 3 is an exploded perspective view of the suction table, and FIG. It is explanatory drawing which shows a manufacturing process.

The suction table A is configured by combining the upper layer plate 1, the middle layer plate 2, and the lower layer plate 3 (for example, by screwing).
The upper layer plate 1 is formed of a porous ceramic material having countless fine holes in the vertical and horizontal directions, and the upper surface is a substrate mounting surface 1a. A groove 1b having an inverted T-shaped cross section (hereinafter referred to as an inverted T-shaped groove 1b) is formed in a loop shape along the vicinity of each edge of the substrate mounting surface 1a of the upper layer plate 1 so as to draw a square locus (closed curve). Has been. The inverted T-shaped groove 1b penetrates up and down, so that the upper layer plate 1 is divided into a frame member 1c divided by the inverted T-shaped groove 1b and a center member 1d serving as a substantial adsorption area. It is joined to the upper surface of 2 with an adhesive. The inner surface 1c ′ of the divided frame member 1c and the outer surface 1d ′ of the center member 1d are covered with a non-breathable coating material (for example, epoxy resin) (see FIG. 4). This prevents leakage (inflow of air) from the portion of the inverted T-shaped groove 1b during decompression, and prevents the suction force of the center member 1d serving as the suction area from weakening.
Further, the upper layer plate 1 is provided with a reference pin 8 used for positioning when the substrate W to be processed is placed on the substrate placement surface 1a. The reference pin 8 passes through the pin insertion hole 1e (see FIG. 4) of the upper layer plate 1 and is inserted into the pin hole 2c of the middle layer plate 2.
As shown in FIG. 1B, the reference pin 8 is formed such that a female screw 8c is screwed into an inner screw 8b of the cylindrical member 8a, and the tip of the female screw 8c is in contact with the bottom of the pin hole 2c. Yes. By engaging and rotating a rotating tool such as a screwdriver with an engaging portion 8d formed at the upper end of the female screw 8c, the female screw 8c is moved up and down to the length of the reference pin 8 (from the upper plate 1). (Projection amount) is adjusted.

  The middle layer plate 2 is formed of a non-breathable inorganic ceramic material, and includes a plurality of air suction holes 2a penetrating vertically at a position facing the region covered by the center member 1d of the upper layer plate 1.

The lower layer plate 3 is also formed of an inorganic ceramic material having no air permeability, and is bonded to the lower surface of the middle layer plate 2 with an adhesive. The lower layer plate 3 has a rectangular frame shape in which a hollow space 3a is formed by hollowing out the central portion so as not to block the opening on the lower end side of the air suction hole 2a of the intermediate layer plate 2.
Since the upper layer plate 1, the middle layer plate 2, and the lower layer plate 3 are formed of the same kind of ceramic material regardless of whether they are a porous ceramic material or an inorganic ceramic material, these layers can be joined with an adhesive. Since the adhesiveness is good and can be reliably bonded, and the thermal expansion coefficient of each layer is the same, the accuracy can be maintained even when the temperature changes, and the overall weight can be reduced.

  The base plate 4 is made of a metal material such as iron, and receives the upper layer plate 1, the middle layer plate 2 and the lower layer plate 3 joined to each other on its upper surface, and a connecting bolt 5 penetrating from the upper layer plate 1 (see FIG. 2 and FIG. 3). ) And the base plate are attached so as to be fastened. The base plate 4 is provided with an air hole 4 a that communicates with the hollow space 3 a of the lower layer plate 3, and the air hole 4 a communicates with a vacuum exhaust device P such as a vacuum pump provided outside via a pipe 6. .

When processing the substrate W, as shown in FIGS. 1 and 2, the cushion material 7 framed in a square shape in a plan view is fitted into the inverted T-shaped groove 1 b of the upper layer plate 1 with its top portion slightly exposed. . The lower end of the cushion material 7 is provided with a large portion 7a. By forcibly pushing the large portion 7a into the inverted T-shaped groove 1b, the large portion 7a swells in the wide lower groove 1b ′ of the inverted T-shaped groove 1b. This makes it difficult for the cushion material 7 to come off.
The substrate W to be processed is placed on the top surface of the cushion material 7 while positioning by positioning the edge of the substrate W against the positioning reference pins 8 erected on the substrate placement surface 1a. When the vacuum evacuation device P is driven in this state, the substrate W is sucked to the substrate mounting surface 1a of the table while compressing the cushion material 7, and eventually the entire surface is adsorbed. Thereby, even if there is some distortion or deformation in the substrate, it is possible to hold the substrate evenly over the entire area.

Next, a manufacturing method of the suction table A will be described.
First, as shown in FIGS. 4A and 4B, a lower groove 1b ′, which is a part of the inverted T-shaped groove 1b, is processed on the lower surface of the upper layer plate 1 with an NC cutting device or the like. Next, as shown in FIG. 4C, a through groove 1b ″ having a groove width narrower than the groove width of the lower groove 1b ′ is processed by being penetrated from the upper surface of the upper layer plate 1 to the lower groove 1b ′ by a water jet machining apparatus. 4 (d), the upper layer plate 1 is divided into a frame member 1c and a center member 1d serving as an adsorption area by the inverted T-shaped groove 1b formed thereby. The inner surface 1c ′ of 1c and the outer surface 1d ′ of the center member 1d are covered with a non-breathable coating material (for example, epoxy resin), and the frame member 1c of the upper layer board 1 has a through hole for inserting a reference pin. 1e is also processed at this stage.

  Further, as shown in FIG. 4 (e), the middle layer plate 2 is arranged so as to be coaxial with the numerous air suction holes 2 a penetrating vertically and the reference pin insertion hole 1 e of the upper layer plate 1. The reference pin insertion hole 2b having a diameter larger than 1e is processed. As shown in FIG. 4 (f), a rectangular frame-like shape having a hollow space 3 a that is hollowed out at the center so as not to block the lower end opening of the air suction hole 2 a of the intermediate layer plate 2 on the lower surface of the intermediate layer plate 2. The lower layer plate 3 is joined with an adhesive. Thereafter, the resin M is filled in the reference pin insertion hole 2b of the intermediate layer plate 2.

Next, as shown in FIG. 4G, the center member 1d of the upper layer plate 1 is placed on the upper surface of the middle layer plate 2 in a state where the center member 1d is disposed inside the frame member 1c. Then (for example, a square frame-shaped mounting jig 9 is inserted into the inverted T-shaped groove 1b in plan view), the center member 1d is positioned at the center of the frame member 1c, and the upper layer plate 1 and the middle layer plate 2 are bonded. Join with agent. Thereafter, a drill is inserted from below the air suction hole 2a of the middle layer plate 2, and the adhesive layer between the upper layer plate 1 and the middle layer plate 2 facing the air suction hole 2a is removed by cutting to ensure air permeability.
Next, as shown in FIG. 4 (h), the pin hole 2 c for inserting the reference pin 8 into the filler M is processed according to the position of the reference pin insertion hole 1 e of the upper layer plate 1.

  After the upper layer plate 1, the middle layer plate 2, and the lower layer plate 3 are joined through the above steps, the lower plate 3 is placed on the base plate 4 provided with the air holes 4a so that the lower surface of the lower layer plate 3 is in close contact with the connecting bolt 5 ( 2), the upper layer plate 1, the middle layer plate 2, the lower layer plate 3 and the base plate 4 are fastened. The holes for inserting the connecting bolts 5 may be provided in advance at the processing stage of each member. However, in terms of accuracy and the like, it is better to provide the middle and lower layers integrally after bonding.

  As described above, the lower groove 1b ′ is first processed on the lower surface of the upper layer plate 1, and then the through groove 1b ″ having a groove width narrower than the groove width of the lower groove 1b ′ is processed, whereby the upper layer plate 1 is once framed. 1c and center member 1d are separated and recombined so that they are attached to the upper surface of the middle layer plate 2 to accurately form a complex inverted T-shaped groove 1b even if the material is a porous ceramic material. Further, when the upper layer plate 1 is separated into the frame member 1c and the center member 1d, it leaks into the inner side surface 1c 'of the frame member 1c and the outer side surface 1d' of the center member 1d (inflow of air). ) Can be easily coated with a coating material.

  In the above-described embodiment, the center member 1d having a rectangular shape in plan view which is a substantial suction area of the upper layer plate 1 and only one inverted T-shaped groove 1b surrounding the periphery thereof are shown. It is also possible to form two or more plural, for example, four suction areas on the same plane as shown in FIG.

  While typical examples of the present invention have been described above, the present invention is not necessarily limited to the above embodiments. For example, the middle layer plate 2 and the lower layer plate 3 can be formed of a metal material such as iron instead of the inorganic ceramic. Although not shown, the lower layer plate 3 is omitted, and a hollow space (manifold) that leads to the air suction hole 2a of the middle layer plate 2 is formed in the base plate 4 so that this space is connected to the vacuum exhaust device P. It may be. Others The present invention can be appropriately modified and changed within the scope of achieving the object and without departing from the scope of the claims.

  INDUSTRIAL APPLICABILITY The present invention can be used for an adsorption table that adsorbs and holds a substrate when processing a brittle material substrate such as glass, silicon, ceramic (for example, LTCC), and a compound semiconductor.

W Substrate A Adsorption table M Filler 1 Upper layer plate 1a Substrate mounting surface 1b Reverse T-shaped groove 1c Frame member 1d Center member 1e Reference pin insertion hole 2 Middle layer plate 2a Air suction hole 2b Reference pin insertion hole 2c Pin hole 3 Lower layer plate 3a Hollow space 4 Base plate 4a Air hole 5 Connection bolt 6 Piping 7 Cushion material 8 Reference pin 8a Cylindrical member 9 Mounting jig

Claims (6)

An upper layer plate formed of a porous ceramic material and having an upper surface as a substrate mounting surface is joined to the upper surface of a middle layer plate having a number of air suction holes penetrating vertically and communicated with the air suction holes. A suction table manufacturing method for sucking and holding a substrate placed on the substrate placement surface by reducing the pressure by an exhaust means,
Processing the lower groove on the lower surface of the upper layer plate into a closed curve; and
A through member having a narrower groove width than the width of the lower groove is penetrated from the upper surface of the upper layer plate to the lower groove, and a groove having an inverted T-shaped cross section is processed into the closed curve, whereby the upper layer plate serves as a suction area. And a step of dividing into a frame member,
Coating the inner surface of the frame member and the outer surface of the center member with a non-breathable coating material;
After the center member of the upper layer plate is fitted in the frame member, the center member is placed on the upper surface of the middle layer plate and positioned at the center of the frame member by a mounting jig, and then the upper layer plate and the middle layer plate are joined together. And a process of
Manufacturing method of the adsorption table. After joining the upper layer plate and the middle layer plate with an adhesive,
The method for manufacturing a suction table according to claim 1, further comprising the step of cutting and removing an adhesive layer between the upper layer plate and the middle layer plate facing the air suction hole from below the suction hole of the middle layer plate.   3. The suction table according to claim 1, further comprising a step of joining a frame-like lower layer plate formed with a hollow space in a central portion for opening a lower end of the air suction hole to a lower surface of the middle layer plate. Production method.   The suction table manufacturing method according to any one of claims 1 to 3, wherein the intermediate layer plate and the lower layer plate are formed of a ceramic material having no air permeability. Processing the reference pin insertion hole provided coaxially in the upper layer plate and the middle layer plate,
After the diameter of the insertion hole of the intermediate layer plate is formed larger than the insertion hole of the upper layer plate, the insertion hole of the intermediate layer plate is filled with a synthetic resin filler, and the upper layer plate is joined to the intermediate layer plate The suction table manufacturing method according to claim 4, wherein a pin hole for a reference pin is processed in the filler. An upper layer plate formed of a porous ceramic material and having an upper surface as a substrate mounting surface;
A middle layer plate joined to the lower surface of the upper layer plate and having a number of air suction holes penetrating vertically;
A frame-like lower layer plate which is bonded to the lower surface of the middle layer plate and forms a hollow space in the central portion so that the opening on the lower end side of the air suction hole is not blocked;
It consists of a base plate attached to the lower surface of the lower layer plate,
Wherein the upper layer plate, formed from the frame member and the center member to a groove penetrating in the vertical cross section inverted T-shape and a plan view is found separated by a closed curve shaped groove for fitting the cushioning material middle layer The inner surface of the frame member and the outer surface of the center member separated by the groove are covered with a non-breathable coating material, and the hollow space of the lower plate is used as a vacuum exhaust means. A suction table characterized by being connected.

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