TWI586613B - Adsorption platform manufacturing method and adsorption platform - Google Patents

Description

Adsorption platform manufacturing method and adsorption platform

The present invention relates to a method for processing a groove (a slit for cutting) on a substrate of a brittle material such as glass, tantalum, ceramic (LTCC substrate, etc.) or a compound semiconductor (hereinafter collectively referred to as a substrate) When the scribed groove is broken, the manufacturing method and the adsorption platform of the adsorption platform for holding the substrate are adsorbed.

In the adsorption stage used in the substrate processing apparatus such as the scribing device or the rupturing device, as shown in FIG. 6, a plurality of air suction holes 11 are opened in the metal platen 10 toward the substrate mounting surface 12. . Each of the air suction holes 11 is connected to a manifold 11a of the hollow space at a lower portion of the platen, and is suctioned from the air suction hole 11 through the vacuum pump P provided outside, and is adsorbed and placed on the substrate. The substrate W of the surface 12 is placed.

Further, in the stage in which the air suction hole 11 is provided in the metal platen 10, there is an adsorption platform as shown in FIG. 7 which is improved in order to improve the adhesion of the substrate placed on the substrate mounting surface. The adsorption platform is formed along the edge of each end surface of the substrate mounting surface 12 of the platen 10, and the trough 13 having an inverted T shape is processed in a manner of drawing a trajectory of a quadrilateral (a track of a closed curve), and the T is inverted in the cross section. In the gutter groove 13, the non-breathable cushioning material 14 having a quadrangular shape in plan view is embedded in a state in which the top portion thereof is slightly exposed. Further, at the time of substrate processing, the edge of the substrate W is brought into contact with the positioning reference pin 15 that is erected on the substrate mounting surface 12 to be positioned, and the substrate W is placed on the top surface of the buffer material 14. In this state, when suction is performed from the air suction hole 11, the substrate W is attracted to the substrate mounting surface 12 of the platen 10 while compressing the cushioning material 14. Thereby, even if the substrate W is slightly distorted or bent, it can be formed throughout The air suction holes 11 are uniformly connected to the entire area.

In the case where the platen 10 is provided with a plurality of adsorption platforms of the air suction holes 11, when the sheet-like thin substrate is placed on the adsorption platform and processed, it is necessary to adsorb the substrate with an appropriate adsorption force (attractive force). When the adsorption force is too strong, the substrate (the workpiece) is recessed in the portion of the air suction hole 11. Once such a depression occurs, for example, in the process of pressing the cutter wheel against the surface of the substrate and rotating, the processing quality is deteriorated due to the upward movement of the cutter wheel, and in addition, in the processing using the laser beam, the focus of the beam is The positional shift or the decrease in the irradiation power density causes the processing quality to deteriorate. Further, when the substrate is wrinkled due to the depression at the time of adsorption, the processing quality of the portion after the expansion due to the wrinkles is deteriorated for the same reason as described above.

Therefore, it is necessary to adsorb the substrate with an appropriate adsorption force, and to prevent the occurrence of irregularities on the surface of the substrate as much as possible. The appropriate adsorption force varies depending on the material or thickness of the substrate to be processed. Specifically, for example, the more the substrate is soft and the thickness is thinner, the more the adsorption force must be weakened. In order to achieve proper adsorption, it is necessary to make the air suction holes small in diameter and weaken the respective adsorption forces, and increase the number of holes to ensure the adsorption force as a whole. In order to adsorb a sheet-like substrate having a thickness of about several tens of μm without causing unevenness, it is necessary to process a plurality of air suction holes having a very small aperture at a high density, but this processing has a limit.

Therefore, a substrate mounting portion for forming a platform by using a porous ceramic plate having a plurality of small holes vertically and horizontally has been used together with the above-described metal adsorption platform (see Patent Document 1). Since the porous portion of the porous ceramic plate has a very small pore diameter, the adsorption force of one hole is weak and the local substrate is not depressed, but the entire surface of the porous ceramic plate abutting the substrate is adsorbed. The force for adsorbing the entire substrate is sufficient, and it is effective as an adsorption platform for fixing a thin substrate.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2001-138095

However, since the material of the ceramic plate is relatively brittle, especially the porous ceramic material Since the brittleness is high, it is difficult to precisely process the complicated groove of the inverted T-shaped groove as shown in Fig. 7 described above, or the screw hole for screwing the reference pin. Accordingly, it is an object of the present invention to provide a porous ceramic plate as an adsorption surface of an adsorption platform, and to perform complicated processing such as a cross-sectional inverted T-shaped groove in which a cushioning material is partially embedded in a suction surface. A method for producing an adsorption platform, and an adsorption platform obtained by the production method.

In order to achieve the above object, the following technical means are employed in the present invention. That is, in the manufacturing method of the adsorption platform of the present invention, the adsorption platform is formed of a porous ceramic material and is used as a laminate on the substrate mounting surface, and is bonded to a laminate having a plurality of air suction holes penetrating up and down. Above, and depressurizing by means of a vacuum exhausting means communicating with the air suction hole, thereby absorbing and holding the substrate placed on the substrate mounting surface; the manufacturing method of the adsorption platform is as follows The bottom groove is formed into a closed curve shape under the upper plate; the through groove having a groove width narrower than the groove width of the lower groove penetrates from the upper surface of the upper plate to the lower groove and the groove is cut into an inverted T-shaped groove. Forming the closed curve, thereby dividing the upper plate into a central member and a frame member that become an adsorption region; coating the inner side of the frame member with a non-breathable coating material (for example, epoxy resin) And a side surface of the center member; and placing the center member of the upper layer on the middle of the middle plate in a state of being embedded in the frame member, and positioning the center member to the frame member by installing the jig After the heart, the upper plate and the plies bonded.

According to the breaking method of the present invention, the lower groove is first processed under the upper plate, and then the through groove having a narrow groove width narrower than the groove of the lower groove is processed, thereby separating the upper plate into the frame member and the central member at a time, and It is combined again and attached to the top of the middle panel. Thereby, for example, even if the porous ceramic material which is difficult to process is a material, the inverted T-shaped groove can be formed with high precision. Further, when the upper layer is separated into the frame member and the center member, the inner side surface of the frame member and the non-air permeable coating material (for example, epoxy resin) on the outer side surface of the center member can be easily applied, thereby preventing The decrease in adsorption force (attraction) due to leakage from the inverted T-shaped groove.

In the manufacturing method of the present invention, it is preferable to comprise a step of: after the upper layer and the intermediate layer are joined by an adhesive (for example, an epoxy resin), the air suction hole from the middle layer Below it, the adhesive layer facing the upper layer of the air suction hole and the intermediate layer is cut and removed. Thereby, the drop in attraction caused by the subsequent layer can be avoided.

In the manufacturing method of the present invention, preferably, the reference pin insertion hole that is coaxially disposed on the upper plate and the intermediate plate is processed, and the diameter of the insertion hole of the intermediate plate is formed to be larger than the upper layer. Inserting a through hole into the plate, filling the insert hole of the middle plate with a filling material of the synthetic resin, and after joining the upper plate to the middle plate, processing the pin hole for the reference pin in the filling material . Thereby, even if the intermediate plate is formed of a ceramic material which is difficult to perform small threading, the position of the reference pin insertion hole of the upper plate can be matched and the pin hole for inserting the reference pin can be accurately processed.

In addition, the adsorption platform of the present invention is composed of an upper layer plate formed of a porous ceramic material and having a top surface as a substrate mounting surface, and a middle layer plate bonded to the lower surface of the upper layer plate and having a plurality of air suction holes penetrating up and down; a frame-shaped lower layer plate is joined to the lower surface of the middle layer plate, and a hollow space is formed at a central portion so as not to block an opening at a lower end side of the air suction hole; and a bottom plate And being attached to the lower surface of the lower layer; the upper layer is formed by a frame member that is separated by a groove that passes through the upper and lower sides, has an inverted T-shaped cross section, and is closed in a plan view, and is formed by the central member. And being bonded to the upper surface of the middle plate, the inner side surface of the frame member separated by the groove and the outer side surface of the center member are covered by a non-breathable coating material, and the hollow space of the lower layer plate is The external suction air source (vacuum exhaust means) is connected. The adsorption platform of the present invention is used in a state in which the lower layer is placed on the bottom plate of the processing apparatus. Thereby, the following adsorption platform can be provided: even if the upper layer is a porous ceramic, the substrate mounting surface of the upper layer can be formed with a groove having an inverted T-shaped cross section and forming a closed curve, and can be prevented from coming from the bottom. Leakage of the T-shaped groove results in a decrease in attractive force.

W‧‧‧Substrate

A‧‧‧Adsorption platform

M‧‧‧Filling materials

1‧‧‧Upper board

1a‧‧‧Substrate mounting surface

1b‧‧‧ inverted T-shaped groove

1c‧‧‧frame components

1d‧‧‧central components

1e‧‧‧reference pin insertion hole

2‧‧‧ mid-layer board

2a‧‧‧Air suction hole

2b‧‧‧reference pin insertion hole

2c‧‧ ‧ pinhole

3‧‧‧lower board

3a‧‧‧ hollow space

4‧‧‧floor

4a‧‧‧Air holes

5‧‧‧Link bolt

6‧‧‧Pipe

7‧‧‧ cushioning material

8‧‧‧Related sales

8a‧‧‧Cylinder components

9‧‧‧Installation fixture

Figure 1 is a cross-sectional view showing the state of the adsorption platform of the present invention in use.

Fig. 2 is a perspective view showing a state in which the cushioning material of the adsorption platform of Fig. 1 is removed.

Figure 3 is an exploded perspective view of the adsorption platform of Figure 1.

Figure 4 is an explanatory view showing the manufacturing steps of the adsorption platform of Figure 1.

Figure 5 is a perspective view showing another embodiment of the adsorption platform of the present invention.

Figure 6 is a cross-sectional view showing an example of a conventional adsorption platform.

Figure 7 is a cross-sectional view showing another example of a conventional adsorption platform.

Hereinafter, the method for producing the adsorption platform of the present invention will be described in detail based on the drawings showing the embodiments thereof. 1 is a cross-sectional view showing a state in which the adsorption platform of the present invention is used, FIG. 2 is a perspective view of the adsorption platform, FIG. 3 is an exploded perspective view of the adsorption platform, and FIG. 4 is an explanatory view showing a manufacturing step of the adsorption platform.

The adsorption platform A is constructed by combining the upper plate 1, the intermediate plate 2, and the lower plate 3 (for example, by means of a screw clamp). The upper plate 1 is formed of a porous ceramic material having a plurality of minute small holes vertically and horizontally, and the upper surface thereof serves as a substrate mounting surface 1a. A groove 1b having an inverted T-shaped cross section is formed in a ring shape in the vicinity of each end edge of the substrate mounting surface 1a of the upper layer 1 in a manner of drawing a quadrilateral trajectory (closed curve) (hereinafter, referred to as an inverted T shape) Slot 1b). The inverted T-shaped groove 1b penetrates the upper and lower sides, whereby the upper plate 1 is divided into a frame member 1c which is divided by the inverted T-shaped groove 1b, and a center member 1d which becomes a substantially adsorption region, and is then The agent is bonded to the upper surface of the intermediate layer 2. The inner side surface 1c' of the divided frame member 1c and the outer side surface 1d' of the center member 1d are covered with a non-breathable coating material (for example, epoxy resin) (see Fig. 4). Thereby, leakage from the portion of the inverted T-shaped groove 1b (inflow of air) during decompression is prevented, and the adsorption force of the center member 1d which becomes the adsorption region is prevented from being weakened. Further, in the upper layer board 1, a reference pin 8 for positioning the substrate W to be processed on the substrate mounting surface 1a is provided. The The reference pin 8 passes through the pin insertion hole 1e (see FIG. 4) of the upper plate 1 and is inserted into the pin hole 2c of the intermediate plate 2. Further, as shown in Fig. 1(b), the reference pin 8 is screwed into the internal thread 8b of the tubular member 8a by the endless full-thread fixing screw 8c, and the front end of the headless full-thread fixing screw 8c is abutted against the pin. The bottom of the hole 2c is formed. It is formed by engaging a rotary tool such as a screwdriver or the like on the engaging portion 8d formed at the upper end of the endless full-thread fixing screw 8c, thereby rotating the headless full-thread fixing screw 8c up and down. The length of the reference pin 8 (the amount of protrusion from the upper panel 1) is adjusted.

The intermediate plate 2 is formed of a non-gas permeable inorganic ceramic material, and has a plurality of air suction holes 2a penetrating up and down at a position facing a region covered by the center member 1d of the upper plate 1.

The lower layer 3 is also formed of a non-gas permeable inorganic ceramic material and joined to the underside of the intermediate layer 2 by an adhesive. The lower deck 3 is formed in a shape of a four-frame shape in which the hollow space 3a formed by excavating the central portion is formed so as not to block the opening on the lower end side of the air suction hole 2a of the intermediate layer 2. The above-mentioned upper layer 1, middle layer 2, and lower layer 3 are formed of the same kind of ceramic material even if there is a difference between the porous ceramic material or the inorganic ceramic material. Therefore, if the layers are joined by an adhesive, the layer can be followed by The bonding is good and sure, and since the thermal expansion coefficients of the respective layers are equal, the accuracy can be maintained even if the temperature changes, and the overall thickness can be formed.

The bottom plate 4 is formed of a metal material such as iron, and the upper plate 1, the intermediate plate 2, and the lower plate 3 are joined to each other, and the connecting bolt 5 penetrating from the upper plate 1 is passed through (see FIGS. 2 and 3). ) is installed in such a manner that the layers are fastened to the bottom plate. The bottom plate 4 is provided with an air hole 4a that leads to the hollow space 3a of the lower plate 3, and the air hole 4a communicates with the vacuum exhaust device P such as a vacuum pump provided outside through the pipe 6.

In the processing of the substrate W, as shown in Figs. 1 and 2, the inverted T-shaped groove 1b of the upper layer 1 is placed in a state in which the buffer material 7 having a quadrangular shape in a plan view is embedded in a state where the top portion thereof is slightly exposed. The lower end of the cushioning material 7 is provided with an enlarged portion 7a, which is mandatory by the enlarged portion 7a The ground portion is pressed into the inverted T-shaped groove 1b, and the enlarged portion 7a is expanded in the groove 1b' below the width of the inverted T-shaped groove 1b, so that it is difficult to pull out the cushioning material 7. The substrate W to be processed is placed on the top surface of the cushioning material 7 while abutting the end edge of the substrate W against the positioning reference pin 8 standing on the substrate mounting surface 1a. In this state, when the vacuum exhaust device P is driven, the substrate W is attracted to the substrate mounting surface 1a of the stage while compressing the buffer material 7, and finally the entire surface is adsorbed. Thereby, even if the substrate is slightly distorted or deformed, it can be uniformly held and held throughout the entire area.

Next, a method of manufacturing the adsorption platform A will be described. First, as shown in Figs. 4(a) and 4(b), the lower surface of the upper layer 1 is processed by a NC (Numerical Control) cutting device or the like to form a groove 1b' below one of the inverted T-shaped grooves 1b. Next, as shown in FIG. 4(c), the groove width is narrower than the groove width of the lower groove 1b' so as to pass through from the upper surface of the upper plate 1 to the lower groove 1b' by a water-jet processing device. The through-groove 1b" is formed by the inverted T-shaped groove 1b formed thereby, and the upper layer 1 is divided into the frame member 1c and the center member 1d which becomes the adsorption region, as shown in Fig. 4 (d). a coating material (for example, an epoxy resin) covering the inner side surface 1c' of the divided frame member 1c and the outer side surface 1d' of the center member 1d. Further, in this stage, the upper layer is also preliminarily The frame member 1c of 1 is used to machine the through hole 1e into which the reference pin is inserted.

Further, in the intermediate plate 2, as shown in Fig. 4(e), the plurality of air suction holes 2a penetrating the upper and lower sides are coaxial with the reference pin insertion holes 1e of the upper plate 1, and are processed larger than the insertion holes 1e. The reference pin of the diameter is inserted into the through hole 2b. Below the intermediate plate 2, as shown in Fig. 4(f), the hollow space is formed by excavating the central portion so as not to block the opening of the lower end of the air suction hole 2a of the intermediate plate 2 by adhesive bonding. 3a of the fourth frame under the border plate 3. Thereafter, the resin pin M is filled in the reference pin insertion hole 2b of the intermediate plate 2.

Next, as shown in FIG. 4(g), the center member 1d of the upper plate 1 is placed on the upper surface of the intermediate plate 2 in a state of being disposed inside the frame member 1c. Further, (for example, a manner in which the mounting jig 9 having a four-frame shape in a plan view is inserted into the inverted T-shaped groove 1b) 1d is positioned at the center of the frame member 1c, and the upper layer 1 and the intermediate layer 2 are joined by an adhesive. Thereafter, a drill is inserted from below the air suction hole 2a of the intermediate layer 2, and the material layer facing the upper layer 1 and the intermediate layer 2 of the air suction hole 2a is cut and removed to ensure gas permeability. Next, as shown in FIG. 4(h), the processing is performed by aligning the pin hole 2c into which the reference pin 8 is inserted into the filling material M to the position of the reference pin insertion hole 1e of the upper layer 1.

After the upper layer 1, the intermediate layer 2, and the lower layer 3 are joined by the above steps, the lower surface of the lower layer 3 is placed in close contact with the bottom plate 4 having the air holes 4a, and the bolts 5 are connected by reference (refer to 2) The upper plate 1, the intermediate plate 2, the lower plate 3, and the bottom plate 4 are fastened. The hole through which the connecting bolt 5 is inserted may be provided in advance in the processing stage of each member. However, in terms of accuracy and the like, it is preferable to integrally provide the intermediate layer and the lower layer.

As described above, the lower groove 1b' is first processed under the upper plate 1, and then the through groove 1b" having a groove width narrower than that of the lower groove 1b' is processed, whereby the upper plate 1 is once separated into a frame member. 1c and the center member 1d, and reassembling and bonding them to the upper surface of the intermediate layer 2, whereby even if the material is a porous ceramic material, the complicated inverted T-shaped groove 1b can be formed with high precision. When the upper plate 1 is separated into the frame member 1c and the center member 1d, the coating material for preventing leakage (inflow of air) can be easily applied to the inner side surface 1c' of the frame member 1c and the outer side surface 1d' of the center member 1d.

Further, in the above embodiment, an embodiment in which only one central quadrangular member 1d which is a substantial suction region of the upper layer 1 and an inverted T-shaped groove 1b surrounding the periphery thereof are formed, but the embodiment may be A plurality of two or more are formed, for example, as shown in FIG. 5, four adsorption regions are formed on the same plane.

Although the representative embodiments of the present invention have been described above, the present invention is not necessarily limited to the above embodiments. For example, the intermediate layer 2 and the lower layer 3 may be formed of a metal material such as iron instead of the inorganic ceramic. Further, although the illustration is omitted, the lower layer 3 may be omitted, and the hollow space of the air suction hole 2a that turns on the middle plate 2 may be formed in the bottom plate 4. Tube) and connect the space to the vacuum exhaust unit P. Further, in the present invention, appropriate modifications and changes can be made without departing from the scope of the invention.

The present invention can be utilized for adsorbing and holding an adsorption platform of the substrate when processing a brittle material substrate such as glass, tantalum, ceramic (for example, LTCC) or a compound semiconductor.

1‧‧‧Upper board

1a‧‧‧Substrate mounting surface

1b‧‧‧ inverted T-shaped groove

1b'‧‧‧ trough

1b"‧‧‧through slot

1c‧‧‧frame components

1c'‧‧‧ inside the frame member

1d‧‧‧central components

1d'‧‧‧ outside the center member

1e‧‧‧reference pin insertion hole

2‧‧‧ mid-layer board

2a‧‧‧Air suction hole

2b‧‧‧reference pin insertion hole

2c‧‧ ‧ pinhole

3‧‧‧lower board

3a‧‧‧ hollow space

4‧‧‧floor

4a‧‧‧Air holes

6‧‧‧Pipe

7‧‧‧ cushioning material

7a‧‧‧Expanded

8‧‧‧Related sales

9‧‧‧Installation fixture

M‧‧‧Filling materials

P‧‧‧vacuum pump (vacuum exhaust)

Claims (8)

The invention relates to a method for manufacturing an adsorption platform, which is formed of a porous ceramic material and has a top layer as a substrate mounting surface, and is bonded to a top surface of a plurality of air suction holes which penetrate the upper and lower sides, and The vacuum exhausting means that communicates with the air suction hole is decompressed, thereby absorbing and holding the substrate placed on the substrate mounting surface, and is characterized by the following steps: under the upper layer The lower groove is formed into a closed curve shape; the through groove having a groove width narrower than the groove width of the lower groove penetrates from the upper surface of the upper plate to the lower groove, and the groove having the inverted T-shaped cross section is processed into the closed curve shape, thereby Separating the upper plate into a central member and a frame member that become an adsorption region; coating an inner side surface of the frame member and an outer side surface of the center member by a non-breathable coating material; and a central member of the upper plate The upper layer is joined to the middle layer plate by being placed on the upper surface of the middle plate in a state of being embedded in the frame member, and positioning the center member at the center of the frame member by the mounting jig. The manufacturing method of the adsorption platform of claim 1, wherein the method comprises the steps of: after joining the upper plate and the middle plate by an adhesive, facing the air from below the suction hole of the middle plate; The upper layer of the upper and lower layers of the suction hole are cut and removed. The manufacturing method of the adsorption platform according to claim 1 or 2, wherein the method comprises the steps of: forming a hollow space at the central portion for opening to the lower end of the air suction hole under the middle plate; Framed under the laminate. The method for producing an adsorption platform according to claim 1 or 2, wherein the intermediate layer and the lower layer are formed of a ceramic material having no gas permeability. The method for producing an adsorption platform according to the third aspect of the invention, wherein the intermediate layer and the lower layer are formed of a ceramic material having no gas permeability. The manufacturing method of the adsorption platform of claim 4, wherein the reference pin insertion hole coaxially disposed on the upper plate and the middle plate is processed; and the diameter of the insertion hole of the middle plate is formed. a filler material larger than the insertion hole of the upper layer, and a filling material of the synthetic resin is filled in the insertion hole of the middle layer, and after the upper layer is joined to the middle layer, the filling material processing reference is Pin hole for pinning. The manufacturing method of the adsorption platform of claim 5, wherein the reference pin insertion hole disposed coaxially on the upper plate and the middle plate is processed; and the diameter of the insertion hole of the middle plate is formed. a filler material larger than the insertion hole of the upper layer, and a filling material of the synthetic resin is filled in the insertion hole of the middle layer, and after the upper layer is joined to the middle layer, the filling material processing reference is Pin hole for pinning. An adsorption platform comprising: an upper plate formed of a porous ceramic material and having an upper surface as a substrate mounting surface; and a middle plate joined to the lower surface of the upper plate and having a plurality of air suction holes penetrating up and down; a frame-shaped lower layer plate is joined to the lower surface of the middle layer plate, and a hollow space is formed at a central portion so as not to block an opening at a lower end side of the air suction hole; and a bottom plate Attached to the underside of the lower deck; the upper deck is provided by the upper and lower sides, the cross section is inverted T-shaped and is used for processing the substrate The buffer material is embedded in a plan view and is formed by closing the curved groove and forming the frame member and the center member, and is joined to the upper surface of the middle plate, and the inner side surface of the frame member separated by the groove and The outer side of the center member is covered by a non-breathable coating material, and the hollow space of the lower layer is in communication with the vacuum exhaust means.