JP6068915B2 - Resin sticking device - Google Patents

Description

  The present invention relates to an apparatus for attaching a resin to a circular plate-shaped workpiece.

  In the manufacturing process of a semiconductor wafer or the like, a cylindrical ingot is sliced with a wire saw to form a disk-shaped plate workpiece. At the time of this slicing, warpage and undulation are formed on the plate-like workpiece.

  Warpage and waviness formed on the plate-like workpiece are removed by grinding. Specifically, a resin film is formed on one side of a plate-like workpiece on which warpage or undulation is formed, the one side on which this resin film is formed is held on a table, and the opposite surface is ground, and then the resin film Then, the ground surface is held on a table and the surface from which the resin film has been removed is ground. In such a technique, as a method of forming a resin film on one side of a plate-like workpiece, a resin is applied to one side of a plate-like workpiece on which warpage or undulation is formed, and the surface on which the resin is applied has a substantially horizontal holding surface. Hold the stage to expose the surface that is not coated with resin, press the surface that is not coated with resin with a pressure pad, separate the pressure pad, and then cure the resin by irradiating the resin with ultraviolet light A method is proposed in US Pat.

JP 2009-148866 A

  However, the above method has a problem that if the area of the plate-like workpiece to which the liquid resin is applied is large, the time required for expanding the liquid resin in proportion to the area of the plate-like workpiece increases.

  The present invention has been made in view of the above circumstances, and solves the problem of enabling the liquid resin applied to a plate-like workpiece to be expanded in a short time regardless of the area of the plate-like workpiece. There is a problem to be solved.

The present invention provides a holding means having a holding surface for sucking and holding the upper surface of a circular plate-shaped workpiece, a moving means for moving the holding means in a direction perpendicular to the holding surface, and a placement facing the holding surface A placing table having a surface as an upper surface; sheet placing means for placing a sheet on the placing surface of the placing table; and an upper surface of the sheet placed on the placing surface by the sheet placing means A resin supply means for supplying a liquid resin to the substrate, and when the liquid resin is expanded when the distance between the lower surface of the plate-like workpiece held by the holding surface by the lowering means and the placement surface becomes a predetermined interval. A resin pasting device comprising at least a designating part for designating a resin expansion position of the holding means, wherein the holding means is lowered to the resin expansion position by the moving means, and the holding surface of the holding means is The outer periphery and the outer periphery of the mounting surface are connected and sealed. And an outer peripheral connection portion forming the resin expansion chamber, and a negative pressure means for negative pressure inside the resin expansion chamber which is sealed by the outer peripheral connecting portion, the outer peripheral connecting portion, with respect to the holding surface The holding means is provided with a pressing portion that presses the liquid resin, and the negative pressure means is formed on the outer peripheral side of the holding surface that holds the plate-like workpiece. a suction port that, the suction port and the suction source and the suction passage for communicating the opening and closing valve for opening and closing the suction passage is disposed in the suction passage, is composed of, the pressing portion presses the liquid resin pressure When a change is detected, suction from the suction port is started to spread the liquid resin to the outer peripheral side of the plate-like workpiece .

  The resin sticking apparatus according to the present invention includes a peripheral connection portion that forms a sealed resin expansion chamber by connecting the outer peripheral portion of the holding surface of the holding means and the outer peripheral portion of the mounting surface, and negative pressure on the resin expansion chamber. And a suction port is disposed on the outer peripheral side of the holding surface, so that the liquid resin supplied to the upper surface of the sheet by suction from the suction port can be obtained. Since it can be spread to the outer peripheral side of the plate-like workpiece, the liquid resin can be expanded over the entire lower surface of the plate-like workpiece in a short time even for a plate-like workpiece having a large area.

It is a perspective view which shows the structure of a resin sticking apparatus. (A) is sectional drawing which shows the state which dripped liquid resin on a sheet | seat, (b) is sectional drawing which shows the state after liquid resin was dripped on a sheet | seat. It is sectional drawing which shows the state which descends the holding means which hold | maintained the plate-shaped workpiece toward the liquid resin dripped at the sheet | seat. It is sectional drawing which shows the state which presses liquid resin while holding | maintenance means descend | falls, and connects the outer peripheral connection part of a holding means to the outer peripheral part of a mounting table, and forms the sealed resin expansion chamber. It is sectional drawing which shows the state which descends a holding means to the resin expansion position designated by the designation | designated part. It is sectional drawing which shows the state which stops a moving means and expands liquid resin to the outer peripheral side of a plate-shaped workpiece | work by making the negative pressure in a resin expansion chamber and the suction from a suction port. It is sectional drawing which shows the state which hardens liquid resin and makes a holding means leave | separate from a plate-shaped workpiece.

  A resin sticking apparatus 1 shown in FIG. 1 includes a device base 2 extending in the Y-axis direction, and a roll in which a sheet 12 onto which liquid resin is dropped is wound in a roll shape at the front of the device base 2 in the Y-axis direction. The sheet supply means 10 including the unit 11 is provided.

  A support base 4 is disposed adjacent to the apparatus base 2, and a sheet placing means 20 is disposed on the support base 4. The sheet placing unit 20 includes an arm 21 extending in a direction orthogonal to the Y-axis direction (X-axis direction) and a clamp portion 22 attached to the arm 21. The clamp unit 22 can clamp the sheet 12 wound around the roll unit 11 and pull the sheet 12 in the Y-axis direction and place the sheet 12 on the mounting table 30 formed on the apparatus base 2.

  A circular placement surface 31 is disposed at the center of the placement table 30 shown in FIG. The placement surface 31 is made of, for example, quartz glass. A ring-shaped suction part 32 is disposed on the outer periphery of the mounting surface 31. The suction part 32 is made of, for example, stainless steel. A plurality of suction ports 33 are formed in the suction portion 32 in the circumferential direction, and the sheet 12 placed on the placement surface 31 can be sucked and held from below.

  A column 3 extending in the Z-axis direction is erected on the rear portion of the apparatus base 2 in the Y-axis direction. A holding means 40 is disposed in front of the column 3 via a moving means 50. The holding means 40 shown in FIG. 3 includes a circular wheel 41 and a holding portion 42 that sucks and holds the upper surface of a circular workpiece. The lower surface side of the holding portion 42 is a holding surface 43 that sucks and holds the workpiece, and faces the mounting surface 31 of the mounting table 30. Further, the holding means 40 includes a pressing portion 45 connected to the holding portion 42, a suction path 46 communicating with the suction source 9, and a valve 47 disposed in the suction path 46.

  As shown in FIG. 1, the moving means 50 includes a ball screw 51 extending in the Z-axis direction, a motor 52 connected to one end of the ball screw 51, a pair of guide rails 53 extending in parallel to the ball screw 51, and one surface. The holding means 40 is connected, and the raising / lowering board 54 provided with a nut on the other surface side is provided. The elevating plate 54 has a nut provided on the other surface screwed into the ball screw 51 and a side portion in sliding contact with the pair of guide rails 52. When the ball screw 51 is rotated by being driven by the motor 52, the moving means 50 moves the elevating plate 54 in the Z-axis direction along the pair of guide rails 53, thereby moving the elevating plate in a direction perpendicular to the holding surface 43. The holding means 40 connected to 54 can be raised and lowered.

  In the vicinity of the placement surface 31 of the placement table 30, a resin supply means 60 including a supply port 61 for supplying a liquid resin is disposed. As shown in FIG. 2, the resin supply means 60 can supply an appropriate amount of the liquid resin 5 from the supply port 61 toward the placement surface 31.

  A resin curing means 70 for curing the liquid resin 5 is disposed below the mounting table 30 shown in FIG. The resin curing means 70 includes a plurality of UV lamps 71 that emit ultraviolet light, and the liquid resin 5 can be cured.

  As shown in FIG. 3, the moving unit 50 includes a holding unit 40 that has a predetermined distance between the lower surface Wb of the plate-like workpiece W held by the holding surface 43 of the holding unit 40 and the placement surface 31. A designation unit 6 for designating a resin expansion position as a position is connected. That is, the resin expansion position refers to the height position P1 of the lower surface Wb of the plate-like workpiece W when the liquid resin 5 is pressed by the holding means 40 that is driven by the moving means 50 and descends. The position P1 can be specified so that the distance between P1 and the position P2 of the placement surface 31 is a predetermined distance H.

  The outer peripheral portion 44 of the holding surface 43 shown in FIG. 3 is connected to the outer peripheral portion 44 and the outer peripheral portion of the mounting surface 31 by lowering the holding means 40 to form the resin expansion chamber 8 shown in FIG. An outer peripheral connection portion 7 is provided. The outer periphery connection part 7 becomes a structure which can be expanded-contracted, and can respond to the change of the resin expansion position (position P1) which the designation | designated part 6 designates. Although the outer periphery connection part 7 is formed in the bellows shape in this embodiment, it is not limited to this structure.

  A negative pressure unit 80 is disposed inside the holding unit 40. The negative pressure generating unit 80 is disposed in the suction port 81 formed on the outer peripheral side of the holding surface 43 that holds the workpiece, the suction path 82 that communicates the suction port 81 and the suction source 9, and the suction path 82. And an open / close valve 83 for opening and closing the suction passage 82. Then, after the resin expansion chamber 8 shown in FIG. 4 is formed, when the opening / closing valve 83 is opened along with the operation of the suction source 9, the inside of the resin expansion chamber 8 can be sucked from the suction port 81.

  Below, operation | movement of the resin sticking apparatus 1 is demonstrated. The plate-like workpiece W shown in FIG. 3 is a circular workpiece, and the material and the like are not particularly limited. In the plate-like workpiece W, the surface to which the liquid resin 5 is attached is the lower surface Wb, and the surface opposite to the lower surface Wb is the upper surface Wa. In addition, the designation | designated part 6 designates the position P1 used as a resin expansion position to the movement means 50 previously.

  In the sheet placement unit 20 shown in FIG. 1, the clamp unit 22 clamps the sheet 12 and moves in the Y-axis direction, and the sheet 12 is pulled out from the sheet supply unit 10, whereby the placement surface 31 of the placement table 30. Placed on. The sheet 12 is sucked and held by the suction unit 32.

  As shown in FIG. 2A, the resin supply unit 60 drops the liquid resin 5 from the supply port 61 onto the upper surface 12 a of the sheet 12. As the liquid resin 5, for example, an ultraviolet curable resin can be used. As shown in FIG. 2B, when an appropriate amount of the liquid resin 5 is deposited on the upper surface 12a of the sheet 12, the resin supply means 60 stops the supply of the liquid resin 5.

  Next, as shown in FIG. 3, the moving unit 50 rotates the ball screw 51 by driving the motor 52 in a state where the plate-like workpiece W is sucked and held on the holding surface 43 by the holding unit 40. Lower. As shown in FIG. 4, as the holding means 40 descends, the lower surface Wb of the plate-like workpiece W sucked and held by the holding means 40 eventually comes into contact with the liquid resin 5. When the holding means 40 is further lowered, the liquid resin 5 pressed in the Z-axis direction by the pressing portion 45 is expanded in the radial direction of the plate-like workpiece W.

  At this time, the outer peripheral connection portion 7 disposed on the outer peripheral portion 44 of the holding surface 43 abuts on the upper surface 12 a of the sheet 12 placed on the placement table 30 and is placed on the outer peripheral portion 44 of the holding surface 43. A sealed resin expansion chamber 8 is formed by connecting the outer peripheral portion of the surface 31.

  After the resin expansion chamber 8 is formed, the holding means 40 is further lowered. Then, as shown in FIG. 6, when the lower surface Wb of the plate-like workpiece W held by the holding means 40 coincides with the position P1, the interval between the position P1 and the position P2 of the placement surface 31 is a predetermined interval H. Therefore, the lowering operation of the holding means 40 by the moving means 50 is stopped.

  Next, in order to expand the liquid resin 5 over the entire lower surface Wb of the plate-like workpiece W, the open / close valve 83 is opened in the negative pressure unit 80 and the inside of the sealed resin expansion chamber 8 is sucked from the suction port 81. . As a result, the inside of the resin expansion chamber 8 is in a negative pressure state, and the liquid resin 5 is further expanded radially outward by suction from the suction port 81 formed on the outer peripheral side of the holding surface 43. The liquid resin 5 is expanded so as to cover the entire surface of Wb. Note that suction from the suction port 81 may be started when the pressing unit 45 detects a pressure change.

  Next, as shown in FIG. 7, ultraviolet light is irradiated toward the liquid resin 5 expanded from the plurality of UV lamps 71 constituting the resin curing means 70. Thereby, the liquid resin 5 is cured and attached to the lower surface Wb of the plate-like workpiece W.

  After the liquid resin 5 is cured, the holding means 40 closes the valve 47 and releases the suction holding of the plate-like workpiece W held on the holding surface 43. Then, the holding means 40 is raised by the moving means 50, and the holding surface 43 is separated from the upper surface Wa of the plate-like workpiece W. It is also possible to set so that the suction holding of the plate-like workpiece W by the holding means 40 is automatically released after a predetermined suction time has elapsed.

  As described above, since the outer peripheral connection portion 7 is disposed on the outer peripheral portion 44 of the holding surface 43 in the resin sticking apparatus 1, the outer peripheral portion 44 of the holding surface 43 and the placement surface 31 are connected to the outer peripheral connection portion. By connecting with 7, a sealed resin expansion chamber 8 can be formed. In this state, the negative pressure means 80 disposed inside the holding means 40 is operated, whereby the inside of the resin expansion chamber 8 is sucked from the suction port 81, and the inside of the resin expansion chamber 8 is negatively pressurized. The plate-like workpiece W can be distributed to the outer peripheral side in the radial direction. Therefore, even when the area of the plate-like workpiece W is large, the liquid resin 5 can be expanded and adhered to the entire lower surface Wb of the plate-like workpiece W in a short time.

1: resin sticking device 2: device base 3: column 4: support base 5: liquid resin 6: designation portion 7: outer peripheral connection portion 8: resin expansion chamber 9: suction source 10: sheet supply means 11: roll portion 12: Sheet 12a: Upper surface 20: Sheet placement means 21: Arm 22: Clamp part 30: Placement table 31: Placement surface 32: Suction part 33: Suction port 40: Holding means 41: Wheel 42: Holding part 43: Holding surface 44: outer peripheral portion 45: pressing portion 46: suction path 47: valve 50: moving means 51: ball screw 52: motor 53: guide rail 54: lift plate 60: resin supply means 61: supply port 70: resin curing means 71: UV Lamp 80: Negative pressure generating means 81: Suction port 82: Suction passage 83: Opening / closing valve W: Plate-shaped workpiece Wa: Upper surface Wb: Lower surface

Claims (1)

A holding means having a holding surface for sucking and holding the upper surface of the circular plate-shaped workpiece; a moving means for moving the holding means in a direction perpendicular to the holding surface; and a mounting surface facing the holding surface as an upper surface. A mounting table, sheet mounting means for mounting a sheet on the mounting surface of the mounting table, and a liquid resin on the upper surface of the sheet mounted on the mounting surface by the sheet mounting means Resin supplying means for supplying, and resin of the holding means when the liquid resin is expanded when the interval between the lower surface of the plate-like workpiece held by the holding surface by the lowering of the holding means and the mounting surface becomes a predetermined interval A resin pasting device comprising at least a designation portion for designating an expansion position,
When the holding means is lowered to the resin expansion position by the moving means, the outer peripheral portion of the holding surface of the holding means and the outer peripheral portion of the mounting surface are connected to form a sealed resin expansion chamber. An outer periphery connecting part,
A negative pressure means for making the inside of the resin expansion chamber sealed by the outer peripheral connection portion a negative pressure, and
The outer peripheral connection portion is formed in a bellows shape that can expand and contract in a direction perpendicular to the holding surface,
The holding means includes a pressing portion that presses the liquid resin,
The negative pressure means includes a suction port formed on the outer peripheral side of the holding surface that holds the plate-like workpiece;
A suction path for communicating the suction port with a suction source;
An open / close valve disposed in the suction path to open and close the suction path ,
A resin sticking apparatus that starts suction from the suction port and spreads the liquid resin to the outer peripheral side of the plate-like workpiece when the pressing portion presses the liquid resin and detects a change in pressure .

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