TW201713508A - Vacuum bonding device - Google Patents

Abstract

A vacuum bonding device is disclosed. The vacuum bonding device includes a vacuum chamber, a first holder, a second holder and an ultraviolet scanner (UV scanner). The vacuum chamber includes a chamber body and a cover. The first holder, which includes a load base for fixing a first substrate, is disposed at the bottom of the vacuum chamber. The second holder is disposed at the top of the vacuum chamber and is penetrated through the cover. The second holder includes an adsorption device for fixing a second substrate. The UV scanner is disposed between the first holder and the second holder. The ultraviolet light is irradiated to the thin film glue applied on the first substrate. The second substrate is moved toward the first substrate by adjusting the height of the adsorption device through a motor, and a pressing device is inflated so as to move up the load base. Thus, the first substrate and the second substrate are bonded tightly.

Description

Vacuum bonding device

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a vacuum bonding apparatus, and more particularly to a vacuum welding apparatus having an ultraviolet light scanner that utilizes ultraviolet light on a film adhesive to closely bond a first substrate and a second substrate.

Among the products having a multi-layer structure, for the adhesion, lamination, or formation of various thin films on the substrate, it is often necessary to perform a bonding process between the substrates or the films to bond two identical or different substrates. Together, to achieve the structure required for the product. In order to improve the bonding quality when the substrate is bonded, many bonding processes will move the substrate to a dust-free or vacuum environment to prevent the impurities or contaminants in the general environment from affecting the bonding effect, especially the bonding. The adhesive between the two substrates is more susceptible to environmental influences and changes the material properties, which results in poor bonding and affects the quality of the finished product.

In the conventional vacuum bonding device or machine, most of the upper and lower substrates are fixed by clamping or clamping, and the adhesive is applied to the substrate, and then the two substrates are sealed after vacuuming the machine. Close contact for bonding. In view of the existing vacuum laminating device, the method of fixing the substrate is inconvenient, and it is relatively difficult to pick and place the substrate. At the same time, for the adhesive of different characteristics, if further processing, such as heating or illumination, is required, the adhesive property can be exhibited. This is also impossible with conventional vacuum bonding devices. In addition, although the machine can seal the vacuum, when there are contact between the two substrates, there are still gaps or bubbles, how to avoid these defects, improve the quality of the fit and the same surname, is the most important design of this vacuum bonding device. purpose.

Therefore, in order to solve the above problems, the present invention designs a vacuum bonding apparatus to improve the lack of the prior art, thereby enhancing the industrial use and utilization.

In view of the above-mentioned problems of the prior art, it is an object of the present invention to provide a vacuum bonding apparatus for solving the problem that the conventional vacuum bonding apparatus cannot be improved in the bonding efficiency and the bonding quality.

According to one aspect of the present invention, a vacuum bonding apparatus is provided, the vacuum bonding apparatus comprising a vacuum chamber, a first carrier, a second carrier, and a UV scanner. The vacuum chamber comprises a chamber body and an upper cover, and the upper cover is mounted on the chamber body to form a sealed space inside the chamber body, and the gas in the vacuum chamber is drawn out to be in a vacuum state. The first carrier is disposed at the bottom of the vacuum chamber and includes a carrier base and a pressurizing device. The carrier base is disposed on the top surface of the first carrier, and the first substrate is fixed on the carrier base by using the fixture. The pressing device is disposed inside the first carrier and is in direct contact with the bearing base. The pressing device is connected to the first pipe, and the gas is injected through the first pipe, so that the pressing device increases the height of the bearing base. The second carrier is disposed at the top of the vacuum chamber and is disposed on the upper cover, and includes an adsorption device and a motor. The adsorption device is disposed on a side of the second carrier facing the first carrier, the surface of the adsorption device includes a plurality of vent holes, is connected to the second pipe, and the second substrate is placed on the surface, and the plurality of ventilations are performed by the second pipe The gas of the hole is extracted to adsorb the second substrate to the adsorption device. The motor is disposed on the second carrier and connected to the adsorption device by the upper and lower shafts, and the motor drives the upper and lower shafts to adjust the height of the adsorption device. The ultraviolet light scanner is disposed inside the vacuum chamber between the first carrier and the second carrier, and the ultraviolet light scanner irradiates the film glue coated on the first substrate with ultraviolet light. After the ultraviolet light scanner irradiates the ultraviolet light, the adsorption device is driven by the motor to move the second substrate toward the first substrate and contact the first substrate, and then inject the gas into the pressing device to raise the bearing base, thereby enabling the first A substrate is in close contact with the second substrate.

Preferably, the pressurizing device can be a pressurized air bag or a pressurized air cylinder.

Preferably, one side of the upper cover can be mounted on the chamber body by a rotating shaft, and the upper cover is rotated and opened along the rotating shaft to expose the second carrier, and the upper cover is maintained at a preset angle when the upper cover is opened by the auxiliary lever support. .

Preferably, the vacuum chamber is connected to the vacuuming device by an evacuation pipe, and the gas in the vacuum chamber is evacuated to be in a vacuum state.

Preferably, the first substrate may comprise a glass substrate, a plastic substrate or a metal substrate.

Preferably, the second substrate may comprise a glass substrate, a plastic substrate or a metal substrate.

Preferably, the fixture is detachably mounted on the carrier base, and the position of the fixture is adjusted according to the size of the first substrate, so that the first substrate is fixed on the carrier base.

Preferably, the ultraviolet light scanner may comprise an ultraviolet light LED disposed on the crossbar of the vacuum chamber and connected to the scanner motor. The ultraviolet light LED is driven by the scanner motor to move along the crossbar to illuminate the film glue. Ultraviolet light.

Preferably, the film glue may comprise a UV curable glue.

Preferably, the vacuum bonding device may further comprise a dispenser disposed in the vacuum chamber, the dispensing port of the dispenser facing the first carrier, after the first substrate is fixed on the carrier base, on the first substrate The film is glued at the preset position.

Preferably, the vacuum bonding apparatus may further comprise a heater disposed in the vacuum chamber and facing the first carrier to heat the film glue coated on the first substrate.

As described above, the vacuum bonding apparatus according to the present invention may have one or more of the following advantages:

(1) The vacuum bonding device allows the user to conveniently and easily place the first substrate and the second substrate to be fitted, thereby providing a user's comfortable operating space and increasing the convenience of operating the vacuum bonding device.

(2) The vacuum bonding device can irradiate the film glue of the substrate in the sealed vacuum chamber to perform subsequent substrate bonding, reduce the influence of external environmental factors on the process, and reduce the probability of defects and defective products, further Improve the yield of the process.

(3) The vacuum bonding apparatus can use the first carrier and the second carrier to ensure that the first substrate and the second substrate can be accurately fixed and closely adhered during contact, thereby improving the bonding quality of the substrate.

The technical features, contents, advantages and advantages of the present invention will be understood by the reviewing committee, and the present invention will be described in detail with reference to the accompanying drawings. The subject matter is only for the purpose of illustration and description. It is not intended to be a true proportion and precise configuration after the implementation of the present invention. Therefore, the scope and configuration relationship of the attached drawings should not be interpreted or limited. First described.

Please refer to FIG. 1 , which is a schematic view of the vacuum bonding apparatus of the present invention. As shown, the vacuum bonding apparatus 1 includes a vacuum chamber 10, a first carrier 11, a second carrier 12, and an ultraviolet scanner 13. The vacuum chamber 10 can be a square chamber formed by the chamber body 100 and the upper cover 101. The chamber body 100 and the upper cover 101 can be made of stainless steel, and the upper cover 101 is mounted on one side of the chamber body 100 by the rotating shaft 103. The upper cover 101 can be flipped open upwards so that the processing space 104 inside the vacuum chamber 10 is exposed for the user to place the substrate. After the upper cover 101 covers the chamber body 100 and is locked, the processing space 104 inside the vacuum chamber 10 forms a closed space, and is connected to the vacuuming device by an evacuation pipe, and the gas in the vacuum chamber is extracted to make the processing space 104. Presenting a vacuum state. The vacuum state described herein is not necessarily a complete vacuum, and the internal air pressure is adjusted according to the precision required by the workpiece to form a processing space 104 close to a vacuum state.

The first carrier 11 is disposed at the bottom of the vacuum chamber 10 as a mount for placing the substrate, and includes a carrier base 110 and a pressurized air bag 111. The carrier base 110 is disposed on the top surface of the first carrier 11 such that the first substrate 112 can be placed on the carrier base 110. In addition, the detachable jig 113 can also be disposed on the carrying base 110. The jig 113 adjusts the placement space on the pedestal 110 to conform to the first substrate 112 of different sizes. As shown in the figure, two adjustable jigs 113 are disposed on the carrier base 110, so that the bearing surface is divided into three equal parts to simultaneously place three pieces of the first substrate 112, and the first step is adjusted by the jig 113. The substrate 112 is fixed. The first substrate described herein may be a substrate of different materials, including a glass substrate, a plastic substrate or a metal substrate, and may be applied to the carrier base 110. A pressing device 111 is further disposed inside the first carrier 11. The pressing device 111 can be a pressurized air bag or a pressurized air cylinder. The pressing device 111 is in direct contact with the bearing base 110 and is connected by the first pipe 114. The air pressure device for injecting gas can inject gas through the first duct 114 when the bonding is performed, and the pressurized airbag 111 is filled with gas and then expanded to the surroundings or pushed upward, thereby pushing the carrying base 110 upward to raise the height.

The second carrier 12 is disposed at the top of the vacuum chamber 10 with respect to the first carrier 11 and is disposed on the upper cover 101. Therefore, when the upper cover 101 is opened, the second carrier 12 is simultaneously turned outward. The user is convenient to place the substrate on the second carrier 12, and the second carrier 12 is prevented from blocking the processing space 104 when the first carrier 11 is placed on the substrate, thereby increasing the convenience of operation. The second carrier includes an adsorption device 120 and a motor 121 for adjusting the height of the adsorption device. The adsorption device 120 is disposed under the upper cover 101, that is, the second carrier 12 faces one side of the first carrier 11, and the motor 121 is disposed on the upper cover 101. Above, the adsorption device 120 and the motor 121 are connected by the movable upper and lower shafts 122. The upper and lower shafts 122 pass through the upper cover 101, and the upper and lower shafts 122 are driven by the motor 121 to adjust the height of the adsorption device 120. The adsorption device 120 is provided with a plurality of vent holes toward the surface of the first carrier 11 and is connected to the second pipe. When the second substrate 123 is placed on the surface of the adsorption device 120, the second pipe is connected to the air suction device, and the plurality of pipes are connected to the air pumping device. The gas in the vent holes is sucked out to be in a vacuum state or near a vacuum state, and the second substrate 123 is fixed to the surface of the adsorption device 120 by the difference in air pressure between the two sides of the second substrate 123. The fixing step can be performed in a general environment, that is, when the upper cover 101 is opened, the second carrier 12 is turned over and the user can easily place the second substrate 123 on the adsorption device 120 to start the air suction device. When it is fixed, when the upper cover 101 is closed and the adsorption device 120 is turned downward, the second substrate 123 has been fixed without falling. The second substrate 123 described herein may be a substrate or a film of the same or different material as the first substrate 112, such as a glass substrate, a plastic substrate or a metal substrate.

The ultraviolet light scanner 13 is disposed inside the vacuum chamber 10 and disposed between the first carrier 11 and the second carrier 12 and includes one or more ultraviolet light sources. As shown in the figure, the vacuum chamber 10 can be provided with a cross bar 130 spanning the two side walls. The cross bar 130 is provided with a slide rail. The ultraviolet light scanner is mounted on the slide rail and connected to the scanner motor 131. The device 13 can be moved along the sliding rail to each of the first substrates 112 by the scanner motor 131, and the film glue coated on the first substrate 112 is irradiated with ultraviolet light. The film glue used here can be UV-cured. Glue and UV curable adhesive can have different viscosity and curing time according to the material of the bonded substrate. The irradiation condition of the ultraviolet scanner 13 can be adjusted according to the characteristics, and the glue is cured after being irradiated with ultraviolet light for subsequent bonding. Process. After the ultraviolet light is irradiated by the ultraviolet scanner 13, the motor 121 drives the adsorption device 120 to move downward, and the second substrate 123 is moved toward the first substrate 112 and is in contact with the first substrate 112. At this time, due to the material or size characteristics of the substrate, The first substrate 112 and the second substrate 123 may be closely adhered to each other. Therefore, the gas is injected into the pressurizing device 111 to raise the carrier base 110. After the film is completely cured and adhered, the second pipeline injects the gas so that the second substrate 123 is no longer adsorbed on the adsorption device 120, but is placed on the carrier base 110 together with the first substrate 112, and the upper cover 101 is opened. , the completed substrate can be taken out.

Further description will be made below for individual components, and the same components will be denoted by the same reference numerals. Please refer to FIG. 2, which is a schematic view showing the opening of the upper cover of the vacuum bonding device of the present invention. As shown in the figure, the upper cover 101 of the vacuum bonding apparatus 1 can be mounted on one side of the chamber body 100 by the rotating shaft 103, or the upper cover 101 can be mounted on the independent pillar 105. When the rotating shaft 103 is opened, the second carrier 12 is exposed together with the second carrier 12 to expose the second carrier 12 outside the chamber body 100. At this time, the upper cover 101 can be flipped to the preset angle T by being supported by the auxiliary rod 106, and the preset angle T can be opened to 180 degrees, depending on the arrangement of the setting area of the vacuum bonding device 1, and the auxiliary rod 106 can also be adjusted. Height adjusts the preset angle T that is turned on. After the upper cover 101 is opened, it helps to clear the working space 104 occupied by the original second carrier 12, so that the user can easily adjust the first carrier 11 and the ultraviolet scanner 13, and can also simply set the first substrate 112. On the carrier base 110. Similarly, the second carrier 12, which is turned over to the outside, also makes it easier to place the second substrate 123, and the adsorption device 120 adsorbs and fixes the second substrate 123.

Please refer to FIG. 3a again, which is a schematic diagram of the operation of the first carrier of the vacuum laminating device of the present invention. As shown, the first carrier 11 includes a carrier base 110 and a pressurized air bag 111a. The pressurized air bag 111a is located inside the first carrier 11 and directly contacts the bottom surface of the carrier base 110. The top surface of the carrier base 110 is divided into a plurality of load-bearing portions by the jig 113. The first substrate 112 is placed respectively. The mounting position of the jig 113 depends on the size of the substrate, and the single piece may be replaced without the jig 113. The first substrate 112 is directly placed on the carrier base 110. A first duct 114 is connected to the bottom of the pressurized air bag 111a, and is connectable to the air pressure device to inject a gas into the inside of the pressurized air bag 111a. When the pressurized airbag 111a expands due to being filled with gas, the carrier base 110 thereon is directly pressurized, so that the first substrate 112 on the carrier base 110 also rises. The height is adjusted by the pressurized airbag 111a because when the first substrate 112 is in contact with the bonded substrate, the surface-coated film adhesive may have a gap or another non-closed portion between the other substrate. Bad or flaws may form when the film adhesive is cured. Therefore, by pressurizing the carrier base 110 by the pressurized airbag 111 to raise the height of the base, the first substrate 112 and the bonded substrate can be further tightly coupled. At the same time, the pressurized airbag 111a has elasticity, which reduces the pressure of direct contact between the two substrates, reduces the possibility of cracking of the substrate, and makes the degree of adhesion between the substrates more uniform, thereby improving the quality of the bonding.

Please refer to FIG. 3b, which is also a schematic diagram of the operation of the first carrier of the vacuum laminating device of the present invention. The difference from Fig. 3a is that the pressurizing device can instead use the pressurizing cylinder 111b, which is also located inside the first carrier 11, and directly contacts the bottom surface of the carrier base 110 by the support base 117. The inlet and outlet ports 116 are provided on the side of the pressurizing cylinder 111b, and are connected to the first pipe or the air pressure device to inject gas into the inside of the pressurizing cylinder 111b. When the pressurizing cylinder 111b pushes up the support seat due to the filling of the gas, the carrier base 110 thereon is directly pressurized, so that the first substrate 112 on the carrier base 110 also rises. Since the use of the pressurizing cylinder 111b raises the support base 117 to a fixed height and has no buffer space, it is more suitable for a flexible substrate having elasticity or elasticity. The pressurizing device may be a pressurized air bag 111a or a pressurizing cylinder 111b. However, the present invention is not limited thereto, and the device that presses the bottom of the base 110 with a motor or other mechanism to make it rise and closely fit is applicable. In the present invention.

Please refer to FIG. 4, which is a schematic diagram of the operation of the second carrier of the vacuum laminating device of the present invention. As shown in the figure, the second carrier 12 includes an adsorption device 120 and a motor 121. The adsorption device is connected to the motor 121 by the upper and lower shafts 122, and the upper and lower shafts 122 are driven by the motor 121 to adjust the height of the second carrier 12. When the upper cover 101 is closed to seal the vacuum chamber, the second substrate 123 adsorbed on the adsorption device 120 can be moved toward the first substrate 112 until the first substrate 112 is contacted, and then the first carrier is used. In the operation mode of 11, the gas is injected into the pressurizing device 111 to press the carrier base 110, and the first substrate 112 is lifted to be more closely attached to the second substrate 123. In addition, the second carrier 12 can be additionally connected to the auxiliary shaft 124. The auxiliary shaft 124 is disposed on the upper cover 101, and can mainly support the balance of the second carrier 12 when the upper and lower shafts 122 are actuated, so that the fitting is performed. The second carrier 12 is not inclined due to the weight of the second substrate 123, and finally the contact surface with the first substrate 112 is uneven, and the bonding defect is formed. Here, the number of the auxiliary shafts 124 is not limited to the two shown in the drawing, but the number of the auxiliary shafts 124 sufficient to maintain balance is planned depending on the size area of the second carrier 12.

Please refer to FIG. 5, which is a schematic view of the vacuum bonding device adsorption device of the present invention. As shown in the figure, the adsorption device 120 is connected to the motor by the upper and lower shafts 122, thereby adjusting its height position, and the adsorption device 120 mainly adsorbs the second substrate 123 by the principle of the air pressure difference. It can be seen that a plurality of vent holes 126 are disposed on the surface of the adsorption device 120 to communicate with the second pipe 125. The second pipe 125 can be disposed inside the hollow upper and lower shafts 122 to prevent the second pipe 122 from being lifted or turned over when the upper cover is lifted or turned over. Improper entanglement and damage, thus reducing the life of use. The second pipe 125 is connected to the air inlet and the air inlet device. When the second substrate 123 is on the surface of the adsorption device 120, the air pressure device suctions the gas in the vent hole 126, so that the vent hole 126 is in a vacuum state or close to Vacuum state. At this time, the air pressure outside the second substrate 123 is greater than the air pressure of the vent hole 126, so that the second substrate 123 is fixed to the adsorption device 120. When the bonding is completed, the air pressure device supplies air to the vent hole 126 to return the air pressure, and the second substrate 123 is separated from the adsorption device 120 by gravity.

Please refer to Fig. 6, which is a plan view of the vacuum chamber of the vacuum bonding apparatus of the present invention. As shown in the figure, the vacuum chamber is mainly provided with a first carrier 11 and an ultraviolet scanner 13 inside the chamber body 100, wherein the bearing base of the top surface of the first carrier 11 is divided into a plurality of parts by the jig 113. The first substrate 112 of an appropriate size is placed separately. The ultraviolet light scanner 13 is mounted on the crossbar 130 across the chamber body 100. The ultraviolet light-emitting LED 132 is disposed along the crossbar 130 to irradiate the ultraviolet curable glue on the first substrate 112 with ultraviolet light. It can be used as a film glue between the bonded substrates. The ultraviolet LEDs 132 can be arranged on the crossbar 130 according to the illumination range or direction. However, not limited thereto, one or more ultraviolet lamps can also be used as the light source for providing ultraviolet light. Different from the foregoing embodiment, the crossbar 130 can further erect the dispenser 133 so that when the first substrate 112 is coated with the film glue, it can also be performed in the vacuum chamber to further avoid contamination of the external environment. At the same time, for the film glue of different characteristics, a plurality of heaters 134 may be further disposed, which may also be mounted on the cross bar 130, and the film glue is irradiated simultaneously or sequentially with the ultraviolet light scanner 13 to obtain an optimal adhesion effect. In addition, a plurality of alignment marks 115 may be disposed on the first carrier, and the alignment marks 115 are detected by the photographing device or the sensing device to further adjust the position of the first stage 11 or the carrier base thereon. When the second substrate is attached downward, the first substrate 112 can be positioned at the correct position to prevent the occurrence of skewing.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

1‧‧‧Vacuum laminating device
10‧‧‧vacuum chamber
11‧‧‧First Vehicle
12‧‧‧Second Vehicle
13‧‧‧UV scanner
100‧‧‧ chamber body
101‧‧‧Upper cover
103‧‧‧Rotary axis
104‧‧‧Processing space
105‧‧‧ pillar
106‧‧‧Auxiliary pole
110‧‧‧Loading base
111‧‧‧Pressure device
111a‧‧‧Pressure airbag
111b‧‧‧ Pressurized cylinder
112‧‧‧First substrate
113‧‧‧ fixture
114‧‧‧First pipeline
115‧‧‧ alignment mark
116‧‧‧Inlet and outlet
117‧‧‧ support
120‧‧‧Adsorption device
121‧‧‧Motor
122‧‧‧Up and down shaft
123‧‧‧second substrate
124‧‧‧Auxiliary shaft
125‧‧‧Second pipeline
126‧‧‧ Ventilation holes
130‧‧‧crossbar
131‧‧‧Scanner motor
132‧‧‧UV LED
133‧‧ ‧ Dispenser
134‧‧‧heater
T‧‧‧Preset angle

Figure 1 is a schematic view of a vacuum laminating apparatus of the present invention.

Fig. 2 is a schematic view showing the opening of the upper cover of the vacuum bonding device of the present invention.

Figures 3a and 3b are schematic views showing the operation of the first carrier of the vacuum laminating apparatus of the present invention.

Figure 4 is a schematic view showing the operation of the second carrier of the vacuum laminating apparatus of the present invention.

Fig. 5 is a schematic view showing the adsorption device of the vacuum bonding apparatus of the present invention.

Figure 6 is a plan view of the vacuum chamber of the vacuum bonding apparatus of the present invention.

1‧‧‧Vacuum laminating device

10‧‧‧vacuum chamber

11‧‧‧First Vehicle

12‧‧‧Second Vehicle

13‧‧‧UV scanner

100‧‧‧ chamber body

101‧‧‧Upper cover

103‧‧‧Rotary axis

104‧‧‧Processing space

110‧‧‧Loading base

111‧‧‧Pressure device

112‧‧‧First substrate

113‧‧‧ fixture

114‧‧‧First pipeline

120‧‧‧Adsorption device

121‧‧‧Motor

122‧‧‧Up and down shaft

123‧‧‧second substrate

130‧‧‧crossbar

131‧‧‧Scanner motor

Claims (11)

A vacuum laminating device comprising: a vacuum chamber comprising a chamber body and an upper cover, the upper cover being mounted on the chamber body to form a sealed space inside the chamber body, and the vacuum is The first chamber is disposed at the bottom of the vacuum chamber, and includes: a carrier base disposed on a top surface of the first carrier Fixing a first substrate on the carrier base; and a pressing device disposed inside the first carrier, in direct contact with the carrier base, the pressing device is connected to a first pipe, via the first The pipe is filled with gas, so that the pressurizing device raises the height of the bearing base; a second carrier is disposed at the top of the vacuum chamber and is disposed on the upper cover, and includes: an adsorption device disposed on the The second carrier faces one side of the first carrier, and a surface of the adsorption device includes a plurality of vent holes connected to a second pipe, and a second substrate is placed on the surface, and the second pipe is Gas pumping of the plurality of vent holes The second substrate is adsorbed on the adsorption device; and a motor is disposed on the second carrier, and is connected to the adsorption device by a vertical shaft, the motor drives the upper and lower shafts to adjust the adsorption device An ultraviolet light scanner is disposed inside the vacuum chamber between the first carrier and the second carrier, and the ultraviolet scanner applies a film adhesive to the first substrate. Irradiating an ultraviolet light; wherein, after the ultraviolet light irradiates the ultraviolet light, the adsorption device is driven by the motor to move the second substrate toward the first substrate and contact the first substrate, and then inject a gas into the In the pressurizing device, the carrier base is raised to further adhere the first substrate to the second substrate. The vacuum laminating device of claim 1, wherein the pressing device is a pressurized air bag or a pressurized air cylinder. The vacuum laminating device of claim 1, wherein a side of the upper cover is mounted on the chamber body by a rotating shaft, and the upper cover is rotated and opened along the rotating shaft to expose the second carrier. And maintaining the upper cover at a predetermined angle when the upper cover is opened by an auxiliary lever support. The vacuum laminating apparatus according to claim 1, wherein the vacuum chamber is connected to a vacuuming device by an evacuation pipe, and the vacuum chamber is evacuated to be in a vacuum state. The vacuum bonding apparatus of claim 1, wherein the first substrate comprises a glass substrate, a plastic substrate or a metal substrate. The vacuum bonding apparatus of claim 1, wherein the second substrate comprises a glass substrate, a plastic substrate or a metal substrate. The vacuum laminating device of claim 1, wherein the jig is detachably mounted on the carrying base, and the position of the jig is adjusted according to the size of the first substrate, so that the first The substrate is fixed to the carrier base. The vacuum bonding device of claim 1, wherein the ultraviolet light scanner comprises an ultraviolet light LED disposed on one of the cross bars of the vacuum chamber and connected to a scanner motor, the ultraviolet light LED Driven by the scanner motor, it moves along the crossbar to illuminate the film glue. The vacuum laminating device of claim 1, wherein the film adhesive comprises an ultraviolet curing adhesive. The vacuum laminating device according to claim 1, further comprising a glue machine disposed in the vacuum chamber, wherein a dispensing opening of the dispensing machine faces the first carrier, the first substrate After being fixed on the carrier base, the film glue is applied at a preset position of the first substrate. The vacuum laminating apparatus according to claim 1, further comprising a heater disposed in the vacuum chamber and facing the first carrier to heat the film glue coated on the first substrate.