JP5503951B2 - Sticking device - Google Patents

Description

  The present invention relates to an attaching device for attaching a workpiece to a protective film via an ultraviolet curable resin.

  When grinding highly warped plates or cutting difficult-to-cut materials, for example, a workpiece is attached to a protective member such as a rigid plate via a hot-melt adhesive, and in that state The workpiece is ground or cut. When a workpiece is attached to a protective member via a hot-melt adhesive and the adhesive is cured and fixed, the holding power becomes strong. For example, in the case of cutting, fixing with a dicing tape Even a difficult-to-cut material that has weak holding force and moves and cannot be cut can be processed (see, for example, Patent Document 1).

  As a method of attaching a workpiece to a protective member with a hot melt type adhesive, the protective member is placed on a hot plate, the hot melt type adhesive is softened and applied onto the protective member, and then applied. There is a method of placing a workpiece on the adhesive. In this method, the adhesive is cooled and cured while being pressed with a certain load in order to correct the warpage of the workpiece and to make the thickness of the adhesive layer constant. Such operations are generally performed manually for each workpiece.

JP 2000-182997 A

  However, since the above-mentioned sticking method is performed while pressing the workpiece and the protective member while applying a load, the adhesive cannot be stuck at a desired thickness, and the thickness of the adhesive is changed as desired. I can't respond to the desire. Further, since the sticking work is performed manually, the work is complicated and not efficient. Furthermore, in the pasting operation, in addition to heating the workpiece to a high temperature (100 ° C. or higher) at which the hot melt type adhesive is softened, there is a considerable load on the workpiece during the pasting. It is necessary to press while applying, and there is a concern about damage to the chip piece after processing.

  The present invention has been made in view of the above facts, and its purpose is to control the adhesive for adhering the workpiece to a desired thickness, and to apply with a hot melt type adhesive. Providing a new and improved sticking device that has the same or higher holding power, eliminates the complexity of sticking work, and reduces external damage to the work piece as much as possible. It is to be.

The present invention relates to a sticking apparatus for sticking a protective film to one surface of a disk-shaped workpiece via an ultraviolet curable resin, and has a horizontal upper surface on which the protective film is placed and transmits ultraviolet light. A surface plate, a holding pad that faces the surface plate, is placed above the surface plate, holds the work piece with one side facing downward, and sucks and holds the other surface, and moves up and down to move the holding pad up and down. Moving means, ultraviolet light irradiating means disposed below the surface plate and irradiating ultraviolet light from below the protective film, and resin for supplying a predetermined amount of ultraviolet curable resin to the central portion of the protective film And a resin supply means that selectively selects an operation position for supplying the resin to the central portion of the protective film placed on the horizontal upper surface of the surface plate and a non-operation position for retreating from the surface plate. are attached position, droplets of liquid on the center portion of the horizontal upper surface of the platen Can be selectively positioned at the operating position for retreating and the non-operating position retracted from the surface plate, and the protective film and the horizontal upper surface of the surface plate are separated by liquid dripped before placing the protective film on the horizontal upper surface. A liquid dropping means for forming a liquid layer is provided between them, and a suction groove for sucking and holding one surface of the protective film is formed on the horizontal upper surface of the surface plate, and the suction groove is connected to a suction source.

  When the holding pad has a disk shape, the outer diameter is desirably 80 to 100% of the outer diameter of the workpiece.

  A holding pad is mounted on the lower surface of the base, and the base includes an engaged means that engages with an engaging means for storing the work in a state where the base is in contact with the outer peripheral edge and one surface of the work. Then, the engaging means accommodating the workpiece can be engaged with the engaged means to position the workpiece at a predetermined position of the holding pad.

  Further, it is desirable to include a lift position detecting means for detecting the lift position of the holding pad and a pressure detecting means for detecting the pressure applied to the holding pad.

  In the present invention, an ultraviolet curable resin is used as an adhesive for adhering the workpiece, and the workpiece itself is sucked and held to press the applied resin, so that an excessive load is applied to the workpiece. This prevents the workpiece from being damaged, and since heat is not used, the workpiece is not damaged by the heat. In addition, since a series of operations from supplying the resin to the protective sheet to attaching the workpiece to the protective sheet via the resin is automated, the attaching operation can be performed efficiently.

It is sectional drawing which shows an example of a sticking apparatus schematically. It is a top view which shows an example of a surface plate. It is sectional drawing which shows schematically the state which dripped a liquid on a surface plate. It is a top view which shows the state which hold | maintained the protective film in the surface plate. It is sectional drawing which shows the state which hold | maintained the protective film in the surface plate. It is a perspective view which shows an engaging means and a to-be-processed object. (A) is sectional drawing which shows schematically the state just before hold | maintaining a workpiece to a holding pad, (b) is sectional drawing which shows schematically the state which hold | maintained the workpiece with the holding pad. It is. It is a top view which shows a state when dripping an ultraviolet curable resin to a protective film. It is sectional drawing which shows schematically a state when an ultraviolet curable resin is dripped at a protective film. It is sectional drawing which shows schematically the state by which the ultraviolet curable resin was dripped at the protective film. It is explanatory drawing which shows the state which irradiates the ultraviolet-ray of ultraviolet curable resin. It is an experimental result which shows the relationship between the magnitude | size of a holding pad and the curvature of a workpiece in the case of grinding the workpiece which adhered the protective film by changing the magnitude | size of a holding pad.

  The sticking apparatus 1 shown in FIG. 1 is an apparatus for sticking a protective film to a workpiece via an ultraviolet curable resin, and is held by a surface plate 2 that holds the protective film F and the surface plate 2. Resin supply means 3 for supplying an ultraviolet curable resin (for example, “RegiLock” provided by DISCO Corporation) to the protective film F, and the protective film F disposed above the surface plate 2 so as to face the surface plate 2. And a holding pad 4 for holding the other surface opposite to the exposed surface in a state in which one surface of the workpiece W to be adhered to is exposed downward. The surface plate 2 and the holding pad 4 are disposed inside the adhering chamber 10, and the resin supply means 3 is disposed so as to be movable between the inside and the outside of the adhering chamber 10.

  The surface plate 2 has a horizontal upper surface 20 on which the protective film F is placed, and is made of a transparent or translucent hard material such as quartz glass in order to transmit ultraviolet light. Below the surface plate 2, ultraviolet light irradiation means 5 that irradiates ultraviolet light from below the protective film F that is transmitted through the surface plate 2 and placed on the horizontal upper surface 20 is disposed. As the ultraviolet light irradiation means 5, for example, a xenon flash type UV lamp can be used. As shown in FIG. 2, on the horizontal upper surface 20 of the surface plate 2, a placement position mark 20 a that is used for alignment of the contour of the protective film F when the protective film F is placed is formed.

  As shown in FIGS. 1 and 2, a plurality of suction grooves 200 are concentrically formed on the horizontal upper surface 20, and the suction grooves 200 are evacuated via a liquid trap 201 as shown in FIG. 1. One side of the protective film F can be sucked and held by the suction force connected to the pump 202 and acting on the suction groove 200. In place of the liquid trap 201 and the vacuum pump 202, a water ring vacuum pump can also be used.

  The resin supply means 3 is configured by a resin dropping portion 31 being arranged at the tip of the arm portion 30, and a protective film in which the resin dropping portion 31 is held on the surface plate 2 by the pivoting or horizontal movement of the arm portion 30. It can be selectively positioned above the center part of F (operation position) and at a position retracted from above the surface plate 2 (non-operation position).

  The holding pad 4 is made of a porous material and communicates with a suction source (not shown). The holding pad 4 is mounted on a base 40 made of a metal such as stainless steel, and the base 40 and the holding pad 4 are supported by the lifting / lowering means 6 so as to be lifted and lowered. An annular groove 400 that is recessed in an annular shape is formed on the lower surface of the base 40. The annular groove 400 functions as an engaged means that engages with an engaging means 8 of FIG. 6 to be described later, and is a position when the work piece accommodated in the engaging means 8 is held by the holding pad 4. It is for use in combination. The holding pad 4 is formed in a shape corresponding to the shape of the workpiece to be held, and is formed in a disk shape when the workpiece is circular. The holding pad 4 is fixed to the inner peripheral side of the annular groove 400.

  The lifting / lowering means 6 is slidable with respect to the plurality of guide rods 60 erected in the vertical direction, the lifting rod 61 hanging vertically from the upper side, and the guide rod 60, and the upper part is at the lower end of the lifting rod 61. A base holding portion 62 that is fixed and holds the base 40 and a motor 63 that raises and lowers the elevating rod 61 are provided, and the base is held as the elevating rod 61 moves up and down driven by the motor 63. The part 62 is guided by the guide rod 60 to move up and down, and the base 40 and the holding pad 4 are moved up and down together with the base holding part 62. Further, the lifting / lowering means 6 includes an encoder 64 that is a lifting / lowering position detecting means for detecting the vertical position of the holding pad 4 through recognition of the vertical position of the lifting / lowering rod 61, and the lift position recognized by the encoder 64. Information is recognized by the control means 65, and the control means 65 can control the motor 63 based on the recognized information to control the raising / lowering position of the holding pad 4.

  A pressure detecting means 66 is connected to the lower end of the lifting rod 61. The pressure detection means 66 is a load detector that detects the pressure applied to the holding pad 4, and the control means 65 can control the raising and lowering of the holding pad 4 based on the pressure value.

  The sticking device 1 has a liquid dripping means 7 that is movably arranged inside and outside the sticking chamber 10. The liquid dripping means 7 has a function of supplying a liquid onto the horizontal upper surface 20 of the surface plate 2, and is configured with a dripping head 71 disposed at the tip of the arm unit 70. By the horizontal movement, the liquid dripping means 7 is arranged so that the dripping head 71 is located above the central portion of the horizontal upper surface 20 of the surface plate 2 and drops the liquid (operating position), and the dripping head 71 from above the surface plate 2 It can be located at the retracted position (non-acting position).

  A side part of the sticking chamber 10 is provided with an openable / closable door 10a which serves as a carry-in / out port for a workpiece to which a protective film is stuck. An open / close sensor 10b is provided for detecting the open state of the open / close door 10a. When the open / close door 10a is open, the control means 65 detects the open / close door 10a, and a protective film sticking operation is performed inside the sticking chamber 10. Do not. The sticking chamber 10 is covered with UV cut glass so that the inside can be visually recognized and ultraviolet rays are prevented from leaking to the outside.

  Next, the method of sticking the protective film F on one side of the workpiece using the sticking apparatus 1 configured as described above will be described.

  Before placing the protective film F by aligning the four corners of the protective film F with the placement position mark 20a on the horizontal upper surface 20 of the surface plate 2 shown in FIG. 2, before the liquid dropping, as shown in FIG. About 5 to 15 cc of a liquid, for example, water 71a is dropped from the dropping head 71 of the means 7. At this time, the ultraviolet light irradiation means 5 shown in FIG. 1 is turned off.

  Then, a protective film F formed of polyethylene terephthalate (PET), polyolefin (PO) or the like is placed on the water, and a suction force is applied to the suction groove 200. As shown in FIG. Hold by suction. Then, even if contamination is mixed between the horizontal upper surface 20 and the protective film F, the contamination is removed from the suction groove 200 together with water. The removed water collects in the liquid trap 201 shown in FIG. In order to suppress the generation of static electricity, it is desirable to mix carbon dioxide with water.

  As shown in FIG. 5, the water remaining without being sucked spreads between the horizontal upper surface 20 and the protective film F. A water layer 71b having a uniform thickness is formed between the protective film F and the horizontal upper surface 20, and the protective film F is sucked and held at a predetermined position of the surface plate 2 through the water layer 71b.

  As shown in FIG. 6, the workpiece W includes a side plate 80 that is formed of resin or the like and has a ring-shaped side plate 80 and a bottom plate 81 that closes the lower portion of the workpiece W. It is accommodated in the accommodating portion 82 of the engaging means 8. In other words, the workpiece W is accommodated in the accommodating portion 82 in a state where the outer peripheral edge and one surface are in contact with the side plate 80 and the bottom plate 81. Then, as shown in FIG. 7 (a), the engaging means 8 in which the workpiece W is accommodated is positioned below the holding pad 4, and the engaging means 8 is raised from that state, and FIG. As shown in FIG. 4, the side plate 80 is engaged with an annular groove 400 which is an engaged means formed on the base 40 to bring the workpiece W into contact with the holding pad 4, and a negative pressure is applied to the holding pad 4. The workpiece W is sucked and held. In this way, the workpiece W is positioned and held at a predetermined position of the holding pad 4 by the engagement between the annular groove 400 and the engaging means 8.

  As described above, when the protective film F is sucked and held on the surface plate 2 through the water layer 71b and the workpiece W is sucked and held on the holding pad 4, as shown in FIG. The means 3 moves in the horizontal direction (X-axis direction) entering the adhering chamber 10, and also moves in the Y-axis direction orthogonal to the X-axis direction and the horizontal direction as necessary. The dripping part 31 is positioned above the central part of the protective film F. Then, as shown in FIG. 9, a predetermined amount of ultraviolet curable resin 31 a is dropped from the resin dropping portion 31. Then, as shown in FIG. 10, a mountain-shaped lump resin 31 b is deposited on the central portion of the protective film F. The predetermined amount of the ultraviolet curable resin 31a is such an amount that a resin layer having a desired thickness is formed over the entire surface of one surface of the workpiece W. Further, as the ultraviolet curable resin, for example, “Resiroc” manufactured by DISCO Corporation is suitable.

  Next, the control means 65 starts driving the raising / lowering means 6, lowers the holding pad 4 that sucks and holds the workpiece W together with the base 40, and applies the resin 31 b on the exposed surface of the workpiece W. Press. The position of the holding pad 4 is detected by the raising / lowering position detection means 64. When the holding pad 4 is lowered to a predetermined position, this is detected by the raising / lowering position detection means 64, and the control means 65 is Stop driving. When the holding pad 4 is lowered to a predetermined position, the resin 31b spreads over the entire surface of the workpiece W. In addition, the detection of the pressure by the pressure detecting means 66 is started simultaneously with the start of the driving of the lifting / lowering means 6. The pressure value increases due to the pressing of the resin 31b due to the lowering of the holding pad 4, and the pressure gradually decreases after the lowering of the holding pad 4 due to the stop of the driving of the lifting and lowering means 6. And it waits in the position until the measured value in the pressure detection means 66 becomes zero in the state which the holding pad 4 stopped.

  When the measured pressure value becomes zero, as shown in FIG. 11, the ultraviolet light irradiation means 5 is turned on, the surface plate 2 and the protective film F are transmitted, and the resin layer 31c is irradiated with ultraviolet light and cured. Then, a resin layer 31c having a uniform thickness and a uniform thickness is formed between the workpiece W and the protective film F. Thus, since the protective film F and the workpiece W are stuck by pressing the resin layer 31c with the workpiece W and curing the resin layer 31c, an excessive load or heat is applied to the workpiece. There is no, and damage to the workpiece can be suppressed. Further, since heat is not used, a thin and easily meltable material such as a protective film can be attached as a protective member for protecting the workpiece. Therefore, it is not necessary to use a rigid plate, and peeling after processing becomes easy.

  In order to press the resin 31a with the workpiece W held on the holding pad 4 in this way, when the workpiece W is thin or when it is desired to apply the resin so as to cover the outer peripheral edge of the workpiece W, Resin tends to adhere to the holding pad 4. When the outer diameter of the holding pad 4 exceeds 100% of the outer diameter of the workpiece W, the resin 31a adheres to the holding pad 4. However, when the outer diameter of the holding pad 4 is less than 80% of the outer diameter of the workpiece W, the deformation of the workpiece increases. Therefore, it is desirable to form the holding pad 4 so that its outer diameter is 80 to 100% of the outer diameter of the workpiece W.

  As described above, after the stress of the resin layer 31c is uniformed, the resin layer 31c is cured by irradiating the work piece W with the holding pad 4 while being sucked and held, so that the work piece W is warped severely. The resin layer 31c can be held with the warp corrected. Therefore, if grinding / polishing is performed in a state in which the warpage is corrected in this way, it is possible to perform processing with high finished thickness accuracy. When the workpiece W is held by the resin layer 31c and cutting is performed with the warp corrected, the cutting depth can be made uniform. In addition, when the workpiece W is an as-sliced wafer (wafer cut out from a silicon ingot), since it is immediately after cutting, warping and undulation generated during slicing remain as it is, and processes such as lapping and polishing are performed. Warpage and undulation are larger than the wafer after passing. Therefore, after the protective film F is stuck via the resin layer 31c and the stress of the resin layer 31c is made uniform, the holding pad 4 is detached from the as-sliced wafer. In the state where the as-sliced wafer is adsorbed by the holding pad 4, the warp and undulation are corrected, but by releasing the adsorbing by the holding pad 4, the warp and undulation of the as-sliced wafer occurs again and becomes apparent. In this state, the resin layer 31c is irradiated with ultraviolet rays. Then, by flattening the exposed surface of the as-sliced wafer in which warpage and undulation have occurred again by grinding and polishing, the warpage and undulation can be effectively removed.

  In the above example, one holding pad 4 is fixed to one base 40, but a plurality of holding pads 4 having a smaller diameter than the base 40 are provided on one base 40. If the workpieces are respectively held by the holding pads 4, the resin and the protective film F can be adhered to a plurality of workpieces having a small diameter at a time. In this case, as shown in FIG. 8, since the resin supply means 3 is freely movable in the X-axis direction and the Y-axis direction, the resin can be supplied to each predetermined position of the plurality of workpieces. .

  A plurality of holding pads 4 having different outer diameters were used to grind the exposed surface of an Si wafer having a diameter of 300 mm on which a UV curable resin was applied and applied, molded and cured, and a protective film was attached. Then, the warpage of the wafer was measured with a bow / warp measuring device SBW-331M manufactured by Kobelco Research Institute. The results are shown in the table of FIG.

  As shown in the table of FIG. 12, when the workpiece to which the protective film is attached is ground with the outer diameter being supported by a holding pad that is 80% or more of the outer diameter of the workpiece, initially 20 μm. When the workpiece to which the protective film is attached is ground while being supported by a holding pad whose outer diameter is less than 80% of the outer diameter of the workpiece, the warpage of the workpiece has been reduced. The warpage worsened. From this, when the outer diameter of the holding pad 4 is 80 to 100% of the outer diameter of the workpiece, the workpiece in a state of being attached to the protective film via the ultraviolet curable resin has less warpage. Was confirmed.

1: Adhering device 10: Adhering chamber 10a: Opening / closing door 2: Surface plate 20: Horizontal upper surface 20a: Placement mark 200: Suction groove 201: Liquid trap 202: Vacuum pump 3: Resin supply means 30: Arm 31 : Resin dripping part 31a, 31b: Resin 31c: Resin layer 4: Holding pad 40: Base 400: Annular groove (engaged means)
5: Ultraviolet light irradiation means 6: Elevating means 60: Guide rod 61: Elevating rod 62: Base holder 63: Motor 64: Encoder (elevating position detecting means) 65: Control means 66: Pressure detecting means 7: Liquid dropping Means 70: Arm portion 71: Dropping head 71a: Water 71b: Water layer 8: Engagement means 80: Side plate 81: Bottom plate 82: Storage portion 10: Adhering chamber 10a: Opening / closing door F: Protective film

Claims (4)

A sticking device for sticking a protective film on one side of a disk-shaped workpiece via an ultraviolet curable resin,
A surface plate having a horizontal upper surface on which the protective film is placed and transmitting ultraviolet rays, and a surface plate facing the surface plate and disposed above the surface plate, with the work piece facing one side downward A holding pad that sucks and holds the other surface in an exposed state, a lifting and lowering means that moves the holding pad up and down, and an ultraviolet light that is disposed below the surface plate and passes through the surface plate and passes through the surface plate. And a resin supply means for supplying a predetermined amount of ultraviolet curable resin to the central portion of the protective film,
The resin supply means is selectively positioned at an operation position for supplying the resin to a central portion of the protective film placed on the horizontal upper surface of the surface plate and a non-operation position for retreating from the surface plate. And
It can be selectively positioned at a working position for dropping liquid on the central portion of the surface plate on the horizontal upper surface and a non-working position for retreating from the surface plate, and the protective film is mounted on the horizontal upper surface. Liquid dropping means is provided to form a liquid layer between the protective film and the horizontal upper surface of the surface plate by the liquid dripped before placing,
A sticking apparatus, wherein a suction groove for sucking and holding one surface of the protective film is formed on the horizontal upper surface of the surface plate, and the suction groove is connected to a suction source .   The sticking device according to claim 1, wherein the holding pad has a disk shape, and an outer diameter thereof is 80 to 100% of an outer diameter of the workpiece. The holding pad is attached to the lower surface of the base, and the base is engaged with an engaging means for storing the workpiece while being in contact with the outer peripheral edge and one surface of the workpiece. Equipped with a means,
The adhering device according to claim 1 or 2 , wherein the engaging means storing the workpiece is engaged with the engaged means to position the workpiece at a predetermined position of the holding pad. The sticking apparatus according to any one of claims 1 to 3 , further comprising a lift position detection unit that detects a lift position of the holding pad and a pressure detection unit that detects a pressure applied to the holding pad.

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