JPH1065047A - Package manufacturing method for mounting semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a package manufacturing method for mounting a semiconductor which has no protrusion of adhesive agent. SOLUTION: A dam which has a lower thickness than adhesive agent to be formed on material or conductive layer before junctioning is provided at a peripheral part of the adhesive agent, and the adhesive agent is so formed that a formula 0.01<=Se/Sa<=1 is complied when an area where the adhesive agent is formed be Sa of all region surrounded by the dam and an area where the adhesive agent is not formed between the agent and the dam be Se. The adhesive agent has a plasticity during junction and becomes to be solid by being hardened after the junction. This plasticity means resin flow by an outer impact such as a load or an pressurization or heating. Such adhesive agent can definitely be exemplified such as epoxy resin, BT resin, polyimide, polyester, deformed PPE(polyphenylene ether) or PPO(polyphenylene oxide).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel method of manufacturing a package for mounting a semiconductor element (hereinafter referred to as a package) for preventing an adhesive from flowing out during assembly.

[0002]

2. Description of the Related Art In recent years, in the field of semiconductor devices, as represented by microprocessors, the integration density is increasing and the speed is increasing. The important part of the technology is a combination technology of different materials, that is, an adhesive material and a bonding technology including connection and joining of different materials. This demands improved electrical characteristics of packages and other electrical components and modules, as well as improved heat dissipation and reliability, and the spread of portable personal computers and mobile phones due to their light weight and compactness has accelerated. Is considered to be the main factor. The resin-based circuit boards currently used for them are formed by combining epoxy resin, BT (bismaleimide / triazine) resin, adhesive such as polyimide, glass fiber such as glass cloth and glass nonwoven fabric, and aramid nonwoven fabric. , Has become the main constituent material of the package. On the other hand, glass fiber-epoxy resin,
Commercialization or development of a package in which a resin circuit board such as glass fiber-BT resin and glass fiber-fluororesin, which has a relatively low dielectric constant and excellent high-frequency characteristics, and a heat dissipation board made of ceramic or metal are joined together ing. Each of these substrates is a substrate whose cured body has a relatively high elasticity and a rigid adhesive layer.

On the other hand, in the bonding between different materials having different coefficients of thermal expansion, a hexafluoropropylene-vinylidene fluoride copolymer is mainly used as an adhesive (layer) in order to prevent a decrease in reliability due to thermal shock or the like. For the above-mentioned rigid resin-based circuit board, an adhesive prepared by blending an adhesive agent such as a crosslinking agent and a silane coupling agent with a silicone oil containing a silane or organopolysiloxane as a main component, Development of a package using a paste adhesive having a relatively low elasticity of a cured body has been promoted.

[0004]

However, when a package is manufactured using the above-described adhesive, the adhesive flows due to heating and pressing during bonding in the manufacturing process.
There is a problem that the material runs off or flows out from the end of the base material or the package. In particular, in bonding a package having an opening (cavity) for mounting an electronic component such as a semiconductor element, as shown in FIG. 7, the adhesive flows out into the adhesive unnecessary portion of the opening, and a terminal portion for wire bonding is formed. Failures in mounting components and electrical connection of components, such as being covered with an adhesive, occur, and cause a reduction in package manufacturing yield. In addition, the above-mentioned paste adhesive in which the cured product has low elasticity often has fluidity itself, and has a greater problem.

On the other hand, as a solution to the above problem, a method of adding a cavity by counterboring after joining has been studied. However, a technique for eliminating obstacles in mounting components and in electrical connection of components has not yet been completed. Has not been reached.

[0006] In view of the above, there is a strong demand for a manufacturing method in which the adhesive does not protrude in the joining step in the package manufacturing.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present inventor has conducted intensive studies to solve the above-mentioned problems. As a result, a method for manufacturing a package for mounting a semiconductor element, in which a base material and a conductive layer are bonded and laminated via an adhesive, has been proposed. Provide a weir lower than the thickness of the adhesive to be formed on the base material or the conductive layer before bonding on the periphery of the adhesive, and the area of the region where the adhesive is formed is Sa,
When the area of the region where the adhesive is not formed between the adhesive and the weir is defined as Se, the protrusion of the adhesive is formed by forming the adhesive so as to satisfy the following expression: 0.01 ≦ Se / Sa ≦ 1. They found that this could be prevented, and completed the present invention.

In the present invention, as the base material or the conductive layer, a known substrate used for assembling a package or an electronic component can be used without any limitation. Examples of the base material include a circuit board having an electric circuit formed on an insulating substrate, a heat dissipation board, a board made of a metal plate for power supply or grounding, and the like.

As the above-mentioned circuit board, a known material such as resin and ceramic can be used for the insulating board. Examples of the resin-based circuit board include resins such as epoxy resin, BT resin, and polyimide. Examples of the ceramic-based circuit board include sintered insulating materials such as aluminum nitride, mullite, and alumina, or crystals. And glass. Further, glass fibers such as glass cloth and glass nonwoven fabric, aramid nonwoven fabric, and a composite of ceramic powder and resin can also be used.

The circuit board is made of, for example, a metal such as gold, silver, copper, or tungsten, or a conductive material mainly composed of a conductor made of a conductive ceramic, a conductive resin, or the like. The circuit may be formed on one or both sides of the insulating substrate, or may be formed inside. Further, a plurality of circuit boards on which such an electric circuit is formed may be laminated.

The resin-based circuit board is not limited to a rigid one (thickness: about 0.15 to 2.0 mm), but a flexible flexible circuit board (thickness: about 0.15 to 2.0 mm) having an electric circuit formed on the surface or inside of a resin film or the like. (About 25 to 220 μm) can also be used. Further, in the above-mentioned resin-based circuit board, a circuit board in which a metal plate of aluminum, copper, or the like is embedded in a resin material to form a composite and heat radiation properties are improved can also be used. Further, through holes and vias can be formed in the circuit board.

The ceramic circuit board may be a black, black-gray, black-brown colored material containing a known coloring agent for image recognition during a semiconductor element mounting process.

The circuit board for heat dissipation is for dissipating heat generated from the semiconductor to the outside of the package, and a substrate having high thermal conductivity such as a ceramic sintered body, a metal, or an alloy is used for the purpose. Specifically, as a metal,
Metals such as copper, aluminum, molybdenum, and tungsten, alloys containing the above various metals as main components such as copper-tungsten alloy, copper-molybdenum alloy, copper-molybdenum-
A clad material such as copper and copper-invar-copper can be used. Examples of the ceramic include sintered bodies such as aluminum nitride, silicon carbide, and beryllium oxide.

Specific examples of the power supply or grounding metal plate include copper, copper alloy, aluminum, aluminum alloy, Kovar, other Fe-Ni-Co alloys, 42 alloys, other Fe-Ni alloys, and single-sided metal plates. Alternatively, a metal such as a double-sided aluminum clad Kovar or a single-sided or double-sided aluminum clad 42 alloy is preferably used.
In addition, the clad plate is obtained by laminating metal plates (or foils) with each other and rolling and pressing them.

Next, as the conductive layer, the above-mentioned circuit board or a board made of a metal plate for power supply or ground can be used without any problem. The conductive layer may have a region (cavity or opening) for mounting an electronic component including an active component or a passive component such as a semiconductor element. In such a case, the size and shape of the cavity are not limited at all. For example, in the case of a semiconductor device (IC), its shape, size, and input / output (I / O: Input /
The position may be determined as appropriate depending on the package specifications such as the position of the (Output) terminal and the position of wire bonding to the conductive layer. When an opening is provided, its shape is generally similar to the outer shape of the package, but is not limited thereto, and may be a square, a rectangle, a quadrangle having a radius (R) at a corner, a polygon, or a circle. And so on. The same applies to bonding in the case of laminating a plurality of layers of conductive layers having different sizes of openings on a base material.In general, a conductive layer having a smaller opening is laminated as approaching the substrate, and the step is formed. A package having a cavity portion arranged so as to be assembled is formed (for example, see FIG. 4A).

In the case of a package, the combination of the substrate materials to be joined includes a conductive layer (circuit board) -substrate (circuit board), a conductive layer (circuit board) -substrate (radiating substrate), and a conductive layer (circuit board). In general, a substrate) -a conductive layer (a power supply layer or a ground layer) or a plurality of these layers are sequentially joined and combined.

The adhesive used in the present invention is an adhesive which exhibits fluidity at the time of joining and hardens after joining to become a solid. The fluidity shown here means that the resin flows due to an external pressure such as load or pressurization or heating.

If such an adhesive is specifically illustrated,
Thermosetting epoxy resin, BT resin, polyimide, polyester, modified PPE (polyphenylene ether),
PPO (polyphenylene oxide) and the like can be mentioned, and further, a glass fiber such as a glass cloth and a glass nonwoven fabric, an aramid nonwoven fabric, and a composite of a ceramic powder and the above-mentioned adhesive resin can also be used. For example, those which are solid at room temperature, such as glass fiber-epoxy resin, glass fiber-BT resin, and glass fiber-modified PPE, can be mentioned.

Crosslinking with an epoxy adhesive, a polyimide adhesive, a fluororubber adhesive containing hexafluoropropylene-vinylidene fluoride copolymer as a main component, or a silicone oil containing silane or organopolysiloxane as a main component. And a paste at room temperature such as a silicone-based adhesive containing an adhesive or a silane coupling agent or the like.

The fluidity and viscosity of the adhesive are easily affected by the type and content of the filler. Examples of the filler include inorganic powder fillers such as silicon oxide, aluminum oxide, and titanium oxide, and organic fillers such as silicone-based and fluorine-based fillers. The surface of the powder may be modified with a silane coupling agent or the like.

Further, the adhesive may have a cured body having an insulating property or a conductive property, and may be selected according to an electric circuit design and a structural specification of a package. Gold, silver,
A metal such as copper or a ceramic conductive powder may be added.
For example, silver-epoxy, silver-polyimide, silver-
A paste adhesive such as a silicone adhesive or a sheet-like conductive adhesive is used. When it is desired to provide insulating and conductive properties in the same adhesive layer for the function of the package, for example, a part of the adhesive layer that joins the base material and the conductive layer is an insulating adhesive, and the other part is a conductive adhesive. It can also be. As a manufacturing method, an insulating adhesive may be formed on one of the opposing substrates, and a conductive adhesive may be formed on the other, and then joined. In this case, a weir described later may be provided at the boundary between the insulating adhesive and the conductive adhesive so as not to affect each other.

Generally, in a case where a portion to be bonded such as a circuit board is limited and a relatively large area is used, a screen printing method is most suitable for forming a paste-like adhesive. A paste adhesive having a viscosity of 500 to 6,000 poise at 25 ° C. of the adhesive is suitable for screen printing.

The weir formed in the present invention has a form capable of preventing the adhesive from flowing out at the time of joining the base material and the conductive layer or the conductive layers (the openings may have the same size or shape), that is, a height and a width. , Position, pattern and material. Hereinafter, description will be made sequentially.

First, referring to FIG. 1, it is necessary that the height D of the weir 6 is smaller than the thickness T of the adhesive layer to be formed on the base material 1 or the conductive layer 3 before joining. Weir 6
If the height of the conductive layer 3 is higher than the thickness of the adhesive layer, the bonding becomes difficult, or the conductive layer 3 or the base material 1 is deformed, and voids or unbonded areas are formed in the adhesive layer after bonding. Will remain.

The height D of the weir 6 is in the range of 25 to 300 μm, more preferably in the range of 50 to 150 μm, in consideration of the thickness of the package, the thickness of the appropriate adhesive 7 for securing insulation, and the limit of the screen printing method. It is preferred that

Further, by forming the position and pattern of the weir 6 on the periphery of the adhesive forming area, the flow of the adhesive 7 can be prevented. The weir 6 may be provided continuously around the entire periphery of the adhesive forming region, or may be provided discontinuously by providing a weir break portion described later. It is preferable that the bonding is performed over the entire surface of the adherend. As shown in FIG. It is desirable that the area be enclosed. The distance of the weir 6 from the end of the substrate or the end of the cavity does not need to be particularly limited. The manufacturing conditions of the package (in the case of multi-cavity or single-cavity described later), the width of the weir, the width of the adhesive layer, the width of the weir, What is necessary is just to set suitably by the formation method etc.

In addition, at the time of bonding or lamination, bubbles intervening in the adhesive are removed, and these are bonded on almost the entire opposing surface of the substrate and the conductive layer. It is usual to carry out in both atmospheres. Especially when the bonding area is large, the combined use of pressure and vacuum is most preferable.

Under such circumstances, the base material 1 and the conductive layer 3
The adhesive between them spreads laterally due to external pressure during bonding. That is, the adhesive volume corresponding to the difference between the thickness of the adhesive layer and the thickness after bonding is pushed in the lateral direction and is blocked by the weir. Finally, when the weir contacts the base material 1 or the conductive layer 3 facing the weir, the thickness of the adhesive 7 after bonding becomes the height of the weir 6. It is necessary that the thickness of the adhesive layer is thicker than the height D of the weir 6. However, even if the thickness is simply increased, the absolute amount of the adhesive may be excessive or insufficient depending on the size of the area for forming the adhesive. In some cases. Here, when the theoretically necessary volume V of the adhesive 7 determined by the height D of the weir is obtained, assuming that there is no protrusion, void, or unbonded area of the adhesive, it is expressed by Expression (1). Will be.

[0029] Volume V of adhesive layer after bonding = adhesive forming area x adhesive forming thickness --- (1) A specific description will be given with reference to FIGS. 1B and 1C. When the height of the weir 6 is D, the area of the area where the adhesive is formed is Sa, the area of the area where the adhesive between the adhesive and the weir is not formed is Se, and the average thickness of the adhesive to be formed is T. Then, a part of the formed adhesive 7 moves, and the height of the adhesive finally becomes the same as the height D of the weir.
Assuming that it is as shown in (d), the following equation (2) holds for the volume V occupied by the adhesive 7. V = (Sa + Se) × D = Sa × T (2) Here, Sa + Se indicates the entire area surrounded by the weir 6, and in this case, means the junction area.

In the present invention, the volume of the adhesive to be formed on the substrate or the conductive layer is determined by the above formula (2).
It is preferable to eliminate the non-adhesion region and improve the bonding strength. Further, an amount increased by 5 to 20% of V obtained from the above formula (2) is desirable in that voids and unbonded regions do not remain. FIG. 2 (a) and FIG. 2 (b)
FIG. 3 is a schematic diagram showing the relationship between the weir 6 and the adhesive 7 before and after joining in this case. The adhesive 7 is calculated from V obtained from the equation (2) by 5
If it is increased by up to 20%, after bonding, as shown in FIG. 2B, the adhesive 7 moves to just below the weir, and the thickness region G where the adhesive 7 is sandwiched between the weir 6 and the base material 1 facing the weir. Will occur. This region G is the volume of the adhesive 5 to 20% larger than V obtained from the equation (2), absorbs the formation variation of the adhesive, and reduces voids and unbonded regions.

Further, in the present invention, the ratio of Se to Sa (Se / Sa) in the bonding in package manufacture
Needs to be 0.01 to 1. In this range, the protrusion of the adhesive 7 can be prevented. Se
And the ratio of Sa is preferably in the range of 0.05 to 0.5. When Se / Sa is less than 0.01, the distance between the weir 6 and the adhesive 7 is short, and the adhesive is easily affected by excess or deficiency of the adhesive due to thickness variation of the adhesive 7, and the adhesive overflows at the time of joining. . On the other hand, when Se / Sa is larger than 1, the thickness of the adhesive to be formed must be extremely larger than the thickness of the weir. Further, the distance between the weir and the adhesive is too large, so that the flow of the adhesive at the time of joining is likely to be non-uniform, and as a result, the adhesive tends to protrude at the time of joining. The size of Se + Sa is not particularly limited, and may be appropriately determined from the viewpoint of the package structure specification, adhesion reliability, and the like.

The area Se where the adhesive 7 is not formed between the adhesive 7 and the weir 6 should be provided so as to keep the gap between the weir 6 and the adhesive 7 uniform to prevent the adhesive from overflowing. It is suitable.

As described above, in a pressurized atmosphere or a vacuum atmosphere at the time of bonding, an interposed void or an unbonded area isolated in the adhesive layer moves in the adhesive layer and is provided on the outer peripheral portion of the package or the conductive layer. It is discharged from the gap between the base material 1 or the conductive layer 3 facing the weir 6 at the opening. At the same time, the adhesive 7 around the area where the adhesive 7 is not applied is pushed in, and the unbonded area disappears. Residual voids and unbonded areas in the adhesive layer have an adverse effect on bonding strength and bonding reliability, which may result in a reduction in package reliability.

In view of the above, it is recommended to provide a cutout 15 in a part of the weir 6, as shown in FIG. 3, in order to promote the discharge of voids and the disappearance of the unbonded area during the joining. You. Particularly, in the case of a paste adhesive at room temperature, the adhesive 7 moves and spreads together with the setting of the conductive layer or the base material. It becomes more remarkable under the subsequent pressure and vacuum. In such a case, by providing the defective portion 15 in a part of the weir 6, it is possible to promote the discharge of the voids and the disappearance of the unbonded area together with the flow of the adhesive 7, and prevent the adhesive 7 from protruding. be able to.

When the defective portion 15 is formed in the weir as described above, the void and the isolated unbonded region move relatively quickly to the defective portion 15 of the weir, particularly under the pressure and the vacuum at the time of joining. For this reason, by making the region 16 where the adhesive 7 is not formed near the defect 15 of the weir relatively large, it is possible to prevent the adhesive 7 from protruding. For example, as shown in FIG. 3, it is preferable that the pattern has a defective portion 15 such as a portion B, a portion C, and a portion D and a region 16 in which an adhesive is not formed. In this case, Se has a size obtained by adding the area of the region 16 where no adhesive is formed and the region where no adhesive is formed between the other adhesive and the weir. Then, it is basically possible to estimate the amount of the adhesive from the equation (2). That is, the total volume of the adhesive 7 (formation area × average thickness of the adhesive 7), the thickness of the weir 6, the distance between the weir 6 and the adhesive 7, and the area of the region 16 where no adhesive is formed may be considered.
For example, when the region 16 where the adhesive is not formed is provided,
The thickness of the adhesive 7 to be formed may be increased according to the increase in the occupied area. Also in this case, the position, size, and number of the cutout portions 15 of the weir may be determined in consideration of the thickness of the adhesive 7, the height of the weir 6, the viscosity and fluidity of the adhesive 7, and the like.

The position of the cutout 15 of the weir is not particularly limited, but is preferably a position where there is no problem even if the adhesive 7 protrudes during bonding (due to variations in the thickness of the adhesive 7). For example, it is preferable to dispose it at the outer periphery of the package, at the corner of the outer periphery, or at the corner of the cavity.

The size of the cutout 15 of the weir is 0.2 to 3 m.
m, and the area of one of the regions 16 in which the adhesive is not formed is preferably in a range of 3 to 30 mm 2 in that the protrusion of the adhesive 7 does not occur at the defective portion 15, but is appropriately determined according to the size of the defective portion 15. I just need. The shape of the region 16 in which the adhesive is not formed is not particularly limited, but a pattern formed symmetrically while keeping the same distance from the defective portion 15 is preferable. For example, portions B and C shown in FIG. Part and D part. The description of the symbols in each part is shown in Table 1.

[0038]

[Table 1]

The distance P between the cutouts 15 of the weirs
May or may not be at regular intervals, and is determined by the size of the weir defect 15 (for example, d1 to d3 shown in FIG. 3) and the size of the region 16 where no adhesive is formed. Good. When the defect portion 15 approaches, the region 16 where the adhesive is not formed may overlap, but there is no particular problem. The interval P is preferably in a range of 1 to 50 times the size of the defect portion 15.

The number of the cutouts 15 of the weir is preferably two or more with respect to one adhesive layer in order to uniformly discharge the non-adhesion area and voids from the adhesive layer, and more preferably four or more. , May be appropriately determined according to the size of the defective portion 15.

There is no problem if the width of the weir 6 does not hinder the joining. Basically, it depends on the size and specification of the package, but it is 0.1
10 to 10 mm is preferable, and 0.2 to 2 mm is more preferable. Further, the width of the weir 6 may not be constant, and may be appropriately determined from the viewpoint of preventing the adhesive 7 from protruding out of the adhesive 7 and the area Se of the region where the adhesive is not formed.

The height of the weir 6 also determines the thickness of the adhesive layer after joining. Utilizing this, the same material as the weir 6 is formed as spacers 6 ′ (see FIG. 6A) on the bonding surface when the weir 6 is formed, so that the thickness of the bonding layer at the time of joining is improved. You may try.

Further, as the material of the weir 6, any known material can be used without any problem as long as it has a function of blocking the flow of the adhesive 7 at the time of joining. It must be solid under pressure and heat, or under pressure and heat, and in a vacuum atmosphere during bonding. Examples of the material of the weir 6 include resin, metal, and ceramic. In the case of resin, it is necessary not to cause resin flow at the time of joining. Specific examples include the above-described thermosetting resin having the adhesive function, a fluororesin, a thermoplastic resin adhesive such as a thermosetting type polyimide, an epoxy resin, a silicone resin, a phenol resin, and an acrylic resin. And a thermosetting resin adhesive such as a polyimide resin and a room temperature curable or thermosetting resin adhesive such as an epoxy resin and a silicone resin. The material of the weir 6 is heat resistance, glass transition temperature (T
Those having a high value such as g) are preferable. Furthermore, at the time of joining,
It is more preferable that the material is a material that adheres to the adhesive 7 or the opposing substrate or conductive layer. As a specific example, an epoxy resin-based adhesive which can be B-staged (semi-cured) into a film and has a B-stage capable of being B-staged with a curing agent already mixed
Resins and polyimide resins are exemplified.

When the metal weir 6 is used, aluminum, copper, silver, iron and the like can be used. If insulation is required, surface coating with insulating resin, etc.
An oxide film treatment may be performed.

Further, in the case of the ceramic weir 6,
The above-mentioned ceramic materials can be used. Further, a composite material of an inorganic powder such as silicon oxide, aluminum oxide, a rare earth element compound, and aluminum nitride and a resin or a metal may be used.

The formation of the weir 6 according to the present invention can be carried out by a known method. For example, it can be formed in the form of a film, paste, powder, or the like. In the case of a film shape, a material formed by press punching or cutting into a required shape may be fixed at a predetermined position on at least one substrate surface with an adhesive or the like. A film having an adhesive function, for example, a B-stage (semi-cured) epoxy resin-based adhesive or a B-stage capable BT resin is preferably fixed by thermocompression bonding or the like.

In the case of a paste, it may be formed and cured by applying it to at least one substrate surface using screen printing, a dispenser or the like. Further, in the case of a powder, it may be formed by applying to at least one substrate surface by electrostatic coating or the like. In the case of electrostatic coating, masking may be performed using a shielding plate, taping, or the like, except for a desired coating area. The weir 6 may be formed on at least one substrate surface of the base material 1 or the conductive layer 3 to be bonded. The weir 6 and the adhesive 7 may be arranged on one of the substrate and the conductive layer and joined, or the weir 6 may be formed on one of the substrates and the adhesive 7 on the other opposing substrate and joined. May be served. Weir 6
Is preferably formed in advance on at least one substrate surface in the manufacturing process of the package.

According to the package manufacturing method of the present invention,
A step of sequentially laminating the conductive layers 3 on the base material 1 and curing each time, a step of joining the desired number of layers together including the base material 1 and laminating and curing, or a method of bonding the conductive layers in advance. 11 joined by the method of the present invention (FIG. 5)
Any of the steps of bonding (see (e)) to a substrate or the like can be freely selected. The size and structure of the package and other factors may be determined as appropriate according to the manufacturing specifications of the package.

The pressure at the time of joining may be determined in consideration of the fluidity of the adhesive 7 at the time of joining. 500 at room temperature
The adhesive having a low viscosity of ~ 6,000 poise is 0.005
-0.050 kg / cm <2> is a preferable range in order to prevent the adhesive from protruding and to promote the contact. In addition, the adhesive 7 which is solid at room temperature and exhibits fluidity at the time of joining, or an adhesive 7 containing glass cloth or the like contains 5 to 100 k.
g / cm 2 is preferable in terms of promoting and improving adhesion and preventing the adhesive 7 from protruding. The heating temperature depends on the curing conditions of the resin, Tg
Or the flowability of the resin. Heating temperature is 100
~ 200 ° C is a preferable range in terms of reliable bonding.

Further, the present invention can be applied without particular limitation not only in the case of assembling a single unit (single unit) in the manufacture of a package but also in the case of assembling a plurality of units (multi unit unit). In laminating the base material 1 or the conductive layer 3, a known method such as alignment of a reference point by a camera or the like or alignment by a reference pin hole can be used. In the case of multi-panning, after assembly, a band saw, blade,
The product can be cut off by a known method such as NC cutting with a drill or press punching or the like. In the case of manufacturing a package in such a multi-cavity, since the protruding portion of the adhesive 7 can be separated in the outer shape cutting step, the present invention may be applied by paying particular attention to the protruding portion of the adhesive 7 in the opening 2. .

[0051]

As described above, according to the present invention, in a method of manufacturing a package for mounting a semiconductor element in which a base material and a conductive layer are bonded and bonded via an adhesive, the base material before bonding is formed. Alternatively, a weir lower than the thickness of the adhesive to be formed on the conductive layer is provided on the periphery of the adhesive, and the ratio of the area of the adhesive formed on the base material or the conductive layer before bonding to the area not formed with the adhesive is determined. The selection can prevent the adhesive from overflowing at the time of joining.

Further, by providing a defective portion at a predetermined position of the weir, voids and isolated non-contact areas interposed at the time of joining can be efficiently discharged, and the bonding reliability can be improved.

[0053]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. In the following examples, the formation height of the weir 6 and the applied thickness of the adhesive 7 were measured using a non-contact type optical step measuring device. The formation positions of the weirs 6 are all 350 μm from the end of the substrate or the end of the opening.

Example 1 A package having a sectional structure as shown in FIG. First, a copper foil 4 having a thickness of 1.6 mm and an outer shape 60 mm square having a 20 mm square opening 2 in the center as a conductive layer 3.
A layer of glass epoxy circuit board was prepared. Next, weir 6
As shown in FIG. 1A, a paste-like epoxy resin was formed by screen printing and then cured. The height of the weir 6 is 75.8 μm, the average of 8 points in total at 2 points on each side, and the width is 5
00 μm. Then, a silicone adhesive 7 having a viscosity of 2,600 poise at 25 ° C. was used as the adhesive.
Was applied to the conductive layer by screen printing. At this time, the area Se of the region where the adhesive is not formed between the adhesive and the weir
Ratio Se / Sa between the area and the area Sa of the region where the adhesive is formed
Was set in the range of 0 to 1.2 as shown in Table 2, and the volume of the adhesive 7 to be formed was changed in the range of 222 to 273 mm3 to prepare five conductive layers 3 each applied. Silicone adhesive is a paste-like, one-part, heat-curing type.
A heat-curable type was used in which organopolysiloxanes containing SiH groups and vinyl groups were heated together with a chloroplatinic acid catalyst and subjected to an addition polymerization reaction to form and cure dimethylene crosslinks. Note that Se / Sa is changed by using various printing screens in which the area (Sa) of the region where the adhesive 7 is formed is changed, and the amount of the adhesive 7 is changed by changing the screen plate making condition and the printing condition. Was. The volume of the adhesive was calculated using Sa and the average thickness of the adhesive. In this case, the volume (V) of the adhesive obtained from Expression (2) is 228 mm3. The average thickness of the formed adhesive was different for each sample, and is shown in Table 2 by the numerical value in parentheses. Then
Copper (nickel-plated copper: thickness 0.
(7 mm, 60 mm square) was overlapped with the conductive layer 3 coated with the above adhesive, and the laminate was held at a load of 0.01 kg / cm 2 in vacuum for 5 minutes. After that, excluding load, 150
C. for 2 hours to obtain a package under each condition. Then, the state of the adhesive 7 protruding from the opening 2 of each package was observed with a stereoscopic microscope at a magnification of 40 times. Table 2 shows the results.

[0055]

[Table 2]

Example 2 Example 2 was performed using a weir 6 as shown in FIG. 3 and a pattern having a deficient portion 15 and a region 16 where no adhesive was formed.
A package was produced in the same manner as in 1. The layer structure and the outer shape are the same as in the first embodiment. The area 16 where no adhesive is formed is B
Section, C section and D section.
Details of the pattern are also shown in FIG. For the part D, d3 and Q are 1.5 mm and 3.0 mm, respectively, and for the part B, d1 and M are 2.5 mm and 4.5 m, respectively.
m each provided four corners. In the part C, d2 and R were 1.5 mm and 3.0 mm, respectively.
The number and the interval P on one side of the portion C are as shown in Table 3. In this case, the area of the portion 16 to which the adhesive 7 is not applied is 9 mm 2 (D portion) per piece,
They are 4 mm2 (part B) and 13 mm2. In addition, weir 6
Has a height D of 76 μm (width: 500 μm), and an interval between the weir 6 and the adhesive 7 other than the defective portion 15 is 0.45 mm (S
e / Sa = 0.07-0.18). The applied adhesive volume was 255 mm3. In this case, the volume (V) of the adhesive obtained from Expression (2) is 230 mm3. The interval P between the cutouts of the weir is obtained by dividing the length of one side of 60 mm by the number of the cutouts 15 included in the weir plus one, and the cutouts 15 are arranged at equal intervals on each side from the end of the substrate. The protrusion of the adhesive and voids in the obtained package were evaluated in the same manner as in Example 1. As a result, no protrusion of the adhesive was observed. Table 3 shows the evaluation results of voids. As can be seen from Table 3, when the defective portion 15 is provided, the number of remaining voids is reduced.

[0057]

[Table 3]

Example 3 A package comprising a conductive layer 3 having a three-layer structure of a power supply layer 12, a ground layer 13 and a signal layer 14, as shown in FIG. The substrate 1 has a thickness of 0.7 mm and a size of 40
A nickel-plated copper plate of mm square was used. First, as the power supply layer 12 and the ground layer 13, a power supply layer 12 having an outer connection lead L having an outer diameter of 40 mm square and an inner diameter of 17 mm square and a ground layer 13 having an outer diameter of 40 mm square and an inner diameter of 18.5 mm square are coated with a double-sided aluminum clad 42. An alloy (aluminum thickness: 4 μm) was used.
A glass epoxy circuit board (FR-5 grade), which is a double-sided copper foil having an mm square and an inner diameter of 20 mm square, was used. And FIG.
PKG-A (FIG. 4 (b)) and PKG-B (FIG. 4 (c)), which are packages having different structures of the adhesive 7 and the weir 6 in the structure shown in FIG. Although not shown in the figure, the signal layer 14 has the same pattern.

First, in the PKG-A, a paste-like epoxy resin is used as a weir 6 for each of the conductive layers as shown in FIG.
As shown in (b), the weir 6 in which the four corners of the opening 2 are defective 15 was applied by screen printing and then cured. Next, a pattern as shown in FIG. 4B, that is, a pattern in which the vicinity of the defective portion 15 is a region 16 where no adhesive is formed, is formed by screen printing the same silicone-based adhesive 7 as shown in Example 1. Formed.

On the other hand, in PKG-B, a similar paste-like epoxy resin adhesive 7 is applied to each of the conductive layers as shown in FIG.
As shown in (c), the weirs 6 having the defect portions 15 at the four corners of the opening 2 and one at each side in total were applied by screen printing and cured. Then, the same silicone adhesive 7 as described above was applied by printing in a pattern as shown in FIG. The height of the weir 6 is 78 μm, the width is 300 μm, and the size M, d1,
Table 4 summarizes d2 and R (the same patterns and symbols as in Example 2), and the total area and Se / Sa of the region 16 where no adhesive is formed in each layer. The applied adhesive volume is PKG-A and PKG-B
In each case, the power supply layer is 111 mm3, the ground layer is 106 mm3, and the signal layer is 98 mm3 (about 1.15 times the volume (V) of the adhesive obtained from the equation (2)). The distance between the weir 6 and the adhesive 7 other than the defective portion 15 is 0.2 mm.

[0061]

[Table 4]

The three conductive layers formed as described above are
As shown in (a), the layers were stacked at a load of 0.01 kg / cm 2 for 6 minutes in a vacuum, and then removed for 150 minutes.
C. for 2 hours to obtain a package. Then, the adhesive 7 in the opening 2 of the package and the outer periphery of the package
The protruding state was evaluated in the same manner as in Example 1. In addition, 20 packages PKG-A and 20 packages PKG-B were produced.

Openings 2 between the layers of all the packages prepared, ie, base material 1 and power supply layer 12, power supply layer 12 and ground layer 13
In addition, between the ground layer 13 and the signal layer 14 and the outer periphery of the package were observed and evaluated in the same manner as in Example 1. As a result, PK
In the case of G-A, two packages in which the adhesive protruded at one or more corners (damped portion 15 of the weir) between the ground layer 13 and the signal layer 14 were observed. The amount of protrusion did not cause any problem for ()). Also, for PKG-B, 1
Four packages with the adhesive protruding at more than four locations were observed, but the protruding amount had no problem in appearance. As a result of evaluating voids in the adhesive layer in the same manner as in Example 2, PKG-A
0.7-0.9 pieces / cm 2 for PKG-B, and 0.2-0.5 pieces / cm 2 for PKG-B. It can be seen that there are few voids.

Example 4 A package having a sectional structure as shown in FIG. First, the thickness of the conductive layer 3 was 1.0 m
m, a double-sided circuit board 3 (glass epoxy board) made of glass fiber-epoxy resin having an opening 2 formed by counterboring with a 20 mm square in the center and a depth of 0.5 mm and having an outer shape of 40 mm square was prepared (FIG. 5 (c)). )reference). Separately, a substrate of the same material having a size of 40 mm square without the opening 2 was prepared as the conductive layer 3 ′. Each substrate is provided with a copper foil pattern 4, and connection terminals 5 from a semiconductor element are patterned in a peripheral region located in the opening 2 of the conductive layer 3 ′. Next, the glass fiber-B is used as the weir 6.
1.8 mm wide, 0.1 mm high, 36.2 mm inside diameter and 20.2 mm inside diameter made of T resin (Tg: 220 ° C.)
5 are manufactured by press punching.
Thermocompression bonding was performed at the position (conductive layer 3) shown in FIG. On the other hand, a film-shaped semi-cured glass fiber-epoxy resin adhesive (Tg: 155 ° C.) as an adhesive 7 is inserted into the inside of the weir 6 (opening 2: 24.2 mm square, outer shape: 35.8 mm square,
It was produced by press punching with a thickness of 0.12 mm).
The adhesive has a volume of 93.6 mm3 (volume (V) of the adhesive determined from equation (2): 82.6 mm3). After arranging this adhesive 7 as shown in FIG. 5B, it was bonded by a vacuum hot press at 170 ° C. Next, through holes 8 were formed at predetermined positions, and after electrical connection and wiring patterning were performed by Cu plating and etching, a solder resist was formed. Then, as shown in FIG.
Then, a through hole processing 10 of 17 mm square was performed, and gold plating was performed on a Cu pattern portion to obtain a joined body 11 (FIG. 5 (e)) as a semi-finished package. After that, as the weir 6 on the joined body 11, a width of 1.8 mm, a height of 0.1 mm, and an inner diameter of 36.2 mm made of glass fiber-BT resin (Tg: 220 ° C.).
In addition, two types of square rings having an inner diameter of 17.2 mm were prepared by press punching, and were thermocompression-bonded to the surface of the bonded body 11 to be bonded to the base material 1 (the bonding position is the same as in FIG. 5B). On the other hand, a film-shaped semi-cured glass fiber-epoxy resin adhesive (Tg: 155 ° C.) as an adhesive 7 is inserted into the inside of the weir 6 (opening 2: 21.2 mm square, outer diameter: 35.8 m).
m square, thickness 0.12 mm). Then, the substrate 1
As shown in FIG. 5 (f), a heat radiation substrate which is a high thermal conductive aluminum nitride substrate (180 W / K · m) having a thickness of 0.635 mm and a size of 40 mm square is prepared and bonded by the same method as described above. A semiconductor element mounting package having a simple cross-sectional structure was obtained. Table 5 summarizes the thickness of the adhesive, the height of the weir, the volume of the adhesive, and Se / Sa in the production of the joined body and the package. As a result of observing and evaluating the obtained package with a stereoscopic microscope at a magnification of 40, no protrusion of the adhesive 7 was observed.

[0065]

[Table 5]

Example 5 By using the same materials and processes as in Example 4, a bonded body 11 having four 40 mm square packages (one package is shown in FIG.
(E) comprising the structure and material of (e). As the conductive layer 3, a double-sided copper foil glass cloth-BT resin circuit board having an outer shape of 110 mm square and a thickness of 0.8 mm was used. A paste-like epoxy resin was applied as a weir 6 to the obtained joined body 11 by screen printing in a pattern as shown in FIG. Then, a silicone adhesive similar to that used in Example 1 was applied as the adhesive 7 by screen printing in the pattern 18 shown in FIG. 6B. The adhesive formation volume was 945 mm3 (volume (V) of the adhesive determined from the formula (2): about 790 mm3).
Excess adhesive 7 is allowed to protrude from the outer peripheral portion of the joined body and the slit portion 17 (opening: 30 mm × 5 mm). Next, a separately prepared base material 1 having a size of 110 mm
At the corner, on a nickel-plated 0.5 mm thick copper plate,
The joined bodies 11 to which the adhesive 7 prepared above was applied were respectively overlapped. Then, the load is set to 0.01 kg / cm 2, the substrate is held in a vacuum for 10 minutes, and then cured at 150 ° C. for 2 hours to obtain a board having four packages (see a schematic view of the package side surface (FIG. 6C)). Were produced. At this stage, when the protrusion of the adhesive 7 was observed in the same manner as in Example 1, no protrusion of the adhesive 7 was found in the opening 2, but the adhesive 7 was formed on the outer peripheral portion of the board and the slit 17. The protrusion was uniformly seen on all the boards. The thickness of the adhesive, the height of the weir, the volume of the adhesive, and Se
/ Sa is shown in Table 6.

After that, the opening 2 was masked with a tape and then cut and divided to obtain twelve 40 mm square packages each having a sectional structure as shown in FIG. 6D and an external appearance as shown in FIG. 6E. Was. The cutting was performed using a blade cutter. The cutting outline 21 is also shown in FIG.
The voids in the bonding interface between the base material 1 and the joined body 11 of the obtained package were evaluated in the same manner as in Example 2. As a result, the number of voids was 0.1 / cm 2 or less in all the obtained packages. This is considered to be due to the fact that voids interposed at the time of bonding and the unbonded area were more effectively discharged together with the adhesive 7 from the outer peripheral portion of the bonded body 11 and the slit 17.

[0068]

[Table 6]

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a relationship between a weir and an adhesive in a package assembly of the present invention.

FIG. 2 is a schematic diagram showing a relationship between a weir and an adhesive according to the present invention.

FIG. 3 is a schematic view showing one embodiment of the present invention.

FIG. 4 is a schematic view showing a relationship between a weir of a package and an adhesive according to the present invention. (A) Cross-sectional schematic diagram of a package (b) and (c) Schematic diagrams showing patterns of a weir and an adhesive formed on a conductive layer

FIG. 5 is a schematic view showing a package manufacturing process according to an embodiment of the present invention. (A) Bottom view showing a substrate on which one surface of conductive layer 3 is counterbored. Schematic diagram showing a state in which a weir and an adhesive are formed in a cross-sectional schematic diagram in the steps (c) to (f)

FIGS. 6A and 6B are schematic diagrams showing an embodiment of the present invention. FIG. 6A is a schematic diagram showing a state in which a weir and an adhesive are formed on a four-packaged joined body. FIG. (D) Schematic cross-sectional view of the package (e) Schematic front view of the package

FIGS. 7A and 7B are schematic diagrams showing a situation in which the adhesive has protruded during the manufacture of the package. FIG. 7A is a schematic plan view of the package. FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base material 2 Opening part 3 Conductive layer 3 'Conductive layer 4 Circuit pattern 5 Connection terminal 6 Weir 6' Spacer 7 Adhesive 7 'Extruded part of adhesive 8 Through hole 9 Counterbore processing part 10 Through-hole processing part 11 Joint DESCRIPTION OF SYMBOLS 12 Power supply layer 13 Ground layer 14 Signal layer 15 Damaged part of dam 16 Area where adhesive is not formed 17 Slit 18 Adhesive pattern 19 Lamination positioning hole 20 External connection terminal 21 Cutting outline L External connection lead d1, d2, d3 Weak defect M, Q, R Distance from dam to adhesive P Distance of defect Sa Area of adhesive forming area Se Area of adhesive not forming G Thickness area sandwiching adhesive

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] April 3, 1997

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0004

[Correction method] Change

[Correction contents]

[0004]

However, when a package is manufactured using the above-described adhesive, the adhesive flows due to heating and pressing during bonding in the manufacturing process.
There is a problem that the material runs off or flows out from the end of the base material or the package. In particular, in bonding a package having an opening (cavity) for mounting an electronic component such as a semiconductor element, as shown in FIG. 8 , the adhesive flows into an adhesive unnecessary portion of the opening, and a terminal portion for wire bonding is formed. Failures in mounting components and electrical connection of components, such as being covered with an adhesive, occur, and cause a reduction in package manufacturing yield. In addition, the above-mentioned paste adhesive in which the cured product has low elasticity often has fluidity itself, and has a greater problem.

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0067

[Correction method] Change

[Correction contents]

Thereafter, the opening 2 was masked with a tape, and then cut and divided to obtain 12 packages each having a 40 mm square cross section as shown in FIG. 7A and the external appearance as shown in FIG. 7B. Was. The cutting was performed using a blade cutter. The cutting outline 21 is also shown in FIG.
The voids in the bonding interface between the base material 1 and the joined body 11 of the obtained package were evaluated in the same manner as in Example 2. As a result, the number of voids was 0.1 / cm 2 or less in all the obtained packages. This is considered to be due to the fact that voids interposed at the time of bonding and the unbonded area were more effectively discharged together with the adhesive 7 from the outer peripheral portion of the bonded body 11 and the slit 17.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] Brief description of drawings

[Correction method] Change

[Correction contents]

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a relationship between a weir and an adhesive in a package assembly of the present invention.

FIG. 2 is a schematic diagram showing a relationship between a weir and an adhesive according to the present invention.

FIG. 3 is a schematic view showing one embodiment of the present invention.

FIG. 4 is a schematic view showing a relationship between a weir of a package and an adhesive according to the present invention. (A) Cross-sectional schematic diagram of a package (b) and (c) Schematic diagrams showing patterns of a weir and an adhesive formed on a conductive layer

FIG. 5 is a schematic view showing a package manufacturing process according to an embodiment of the present invention. (A) Bottom view showing a substrate on which one surface of conductive layer 3 is counterbored. Schematic diagram showing a state in which a weir and an adhesive are formed in a cross-sectional schematic diagram in the steps (c) to (f)

FIGS. 6A and 6B are schematic diagrams showing an embodiment of the present invention. FIG. 6A is a schematic diagram showing a state in which a weir and an adhesive are formed on a four-packaged joined body. FIG. Side view of the joint body and the substrate

FIG. 7 is a schematic view showing an embodiment of the present invention . FIG. 7 (a) is a schematic cross-sectional view of a package . FIG.

FIG. 8 shows a situation in which the adhesive has protruded during package manufacturing.
Schematic diagram shown (A) Schematic plan view of package (B) Cross-sectional schematic diagram of the package

[Description of Signs] 1 Base material 2 Opening 3 Conductive layer 3 'Conductive layer 4 Circuit pattern 5 Connection terminal 6 Weir 6' Spacer 7 Adhesive 7 'Adhesive protrusion 8 Through hole 9 Counterbored portion 10 Through hole Processed part 11 Joint 12 Power supply layer 13 Ground layer 14 Signal layer 15 Damaged part of weir 16 Area where adhesive is not formed 17 Slit 18 Adhesive pattern 19 Lamination positioning hole 20 External connection terminal 21 Cutting outline L External connection Leads d1, d2, d3 Weak defect M, Q, R Distance from weir to adhesive P Interval of defect Sa Sa Area of area where adhesive is formed Se Area of area where adhesive is not formed G Glue sandwiched Thickness area

[Procedure amendment 4]

[Document name to be amended] Drawing

[Correction target item name] All figures

[Correction method] Change

[Correction contents]

FIG.

FIG. 2

FIG. 3

FIG. 4

FIG. 5

FIG. 7

FIG. 6

FIG. 8

Claims (1)

[Claims] In a method of manufacturing a package for mounting a semiconductor element, in which a base material and a conductive layer are bonded and laminated via an adhesive, the thickness of the adhesive to be formed on the base material or the conductive layer before bonding is reduced. When a low weir is provided at the periphery of the adhesive, and the area of the area where the adhesive is formed is Sa, and the area of the area where the adhesive is not formed between the adhesive and the weir is Se,
A method of manufacturing a package for mounting a semiconductor element, comprising forming an adhesive so as to satisfy the following expression: 0.01 ≦ Se / Sa ≦ 1.