JP6122602B2 - Resin sticking device - Google Patents

Description

  The present invention relates to an apparatus for attaching a resin to a circular plate-shaped workpiece.

  In a manufacturing process for manufacturing a plate-shaped workpiece such as a semiconductor wafer, a cylindrical ingot is sliced with a wire saw to form a disk-shaped plate-shaped workpiece. At the time of this slicing, warpage and undulation are formed on the plate-like workpiece.

  Warpage and waviness formed on the plate-like workpiece are removed by grinding. Specifically, a resin film is formed on one side of a plate-like workpiece on which warpage or undulation is formed, the one side on which this resin film is formed is held on a table, and the opposite surface is ground, and then the resin film Then, the ground surface is held on a table and the surface from which the resin film has been removed is ground (see, for example, Patent Document 1). In such a technique, as a method of forming a resin film on one side of a plate-like workpiece, a resin is applied to one side of a plate-like workpiece on which warpage or undulation is formed, and the surface on which the resin is applied has a substantially horizontal holding surface. Hold the mounting table to expose the surface that is not coated with resin, press the surface that is not coated with resin with a pressure pad, separate the pressure pad, and then irradiate the liquid resin with ultraviolet light. Patent Document 2 proposes a method of curing the above.

  In the conventional method as disclosed in Patent Document 2, when the liquid resin is stuck to the plate-like workpiece, the holding surface for holding the plate-like workpiece and the pressing surface for pressing the liquid resin are maintained in parallel. However, it is considered to be optimal for removing warpage and waviness of the plate-like workpiece.

JP 2006-269761 A JP 2009-148866 A

  However, when a plate-like workpiece with undulation is held on the holding surface of the mounting table, the undulation becomes substantially horizontal following the holding surface, and the undulation needs to be regenerated when the holding of the plate-like workpiece is released. Even if the holding surface for holding the plate-shaped workpiece and the pressing surface for pressing the liquid resin are parallel to each other, the resin is adhered to one surface of the plate-shaped workpiece, and then the holding of the plate-shaped workpiece is released. There is a problem that the waviness of the plate-like workpiece is hardly regenerated due to the viscosity of the liquid resin.

  On the other hand, if the viscosity of the liquid resin is reduced in order to regenerate the waviness formed on the plate-like workpiece, there is a problem that bubbles are mixed between the liquid resin and the plate-like workpiece.

  The present invention has been made in view of the above circumstances, and the plate-like workpiece can be reproduced in a state in which the swell of the plate-like workpiece can be regenerated without mixing bubbles between the plate-like workpiece having the undulation and the liquid resin. The problem to be solved by the present invention is that liquid resin can be adhered to the substrate.

The present invention is a resin adhering apparatus including a resin adhering unit and a work conveying unit, and the resin adhering unit includes a holding unit having a holding surface for sucking and holding the upper surface of a circular plate-shaped workpiece. A mounting table whose upper surface is a mounting surface facing the holding surface, a moving unit that moves the holding unit toward and away from the mounting table, and a sheet on the mounting surface of the mounting table. A sheet placing means to be placed, a resin supply means for supplying a liquid resin to the upper surface of the sheet placed on the placement surface by the sheet placing means, and a holding means to be supplied to the upper face of the sheet. A resin curing unit that cures the liquid resin after the liquid resin is pressed by the approach, and the workpiece conveyance unit includes a workpiece conveyance unit that conveys a plate-like workpiece to the holding surface of the holding unit, and a plate Temporary work A height measurement unit that measures at least the height of the upper surface of the plate-like workpiece temporarily placed on the temporary placement table, and the height measurement unit with respect to the upper surface of the temporary placement table. A height measuring unit configured to scan in parallel; and a recognition unit for recognizing a height tendency of the plate-like workpiece from the measurement result of the upper surface height of the plate-like workpiece measured by the height measuring unit. And an adjusting unit that adjusts an angular relationship between the mounting surface and the holding surface facing each other based on a height tendency recognized by the recognition unit , and the adjusting unit and the holding surface After adjusting the angle with the surface, the liquid resin is expanded by pressing the liquid resin supplied by the resin supply means to the upper surface of the sheet by the plate-like work held by the holding means, and the expanded liquid The resin is cured by the resin curing means.

  This invention is the resin sticking method using the said resin sticking apparatus, Comprising: The said height measurement part is scanned by the said scanning part, The upper surface height of the plate-shaped workpiece temporarily placed on the said temporary placing table is set. Based on the height tendency recognized by the height tendency recognition step and the height trend recognition step of measuring and recognizing the upper surface height tendency of the plate workpiece temporarily placed on the temporary placement table Then, the adjusting unit is operated, an angle adjusting step for adjusting an angular relationship between the mounting surface and the holding surface facing each other, and a sheet is mounted on the mounting table by the sheet mounting means, and the resin After the resin supply step of supplying the liquid resin to the upper surface of the sheet by the supply unit, the angle adjusting step, and the resin supply step, the holding unit is lowered by the moving unit, and the plate-like workpiece held by the holding unit By the upper surface of the sheet A resin expansion step of pressing the liquid resin and expanding the liquid resin; and a resin curing step of releasing the holding of the plate-like workpiece by the holding means after the resin expansion step and curing the expanded liquid resin; By sticking the liquid resin to the plate-like workpiece.

The resin sticking apparatus according to the present invention includes a height measuring unit that measures the upper surface height of a plate-like workpiece temporarily placed on a temporary placing table, and the height measuring unit that is parallel to the upper surface of the temporarily placing table. A height measuring means configured to measure the height of the plate-like workpiece, and a height tendency of the plate-like workpiece from the measurement result of the upper surface height of the plate-like workpiece measured by the height measuring means. A recognition section for recognizing the upper surface of the plate-like workpieces based on the measurement results of the upper surface heights of the plurality of plate-like workpieces obtained by the height measuring means. be able to.
In addition, since the resin sticking apparatus includes an adjustment unit that adjusts the angle between the mounting surface of the mounting table facing and the holding surface of the holding unit based on the height tendency recognized by the recognition unit, The holding surface of the holding means can be tilted by a predetermined angle.
Therefore, in the resin sticking apparatus, the liquid resin can be stuck to the lower surface of the plate-shaped workpiece without mixing bubbles with the plate-shaped workpiece without reducing the viscosity of the liquid resin. Further, when the holding means of the holding means is separated from the upper surface of the plate-like work by the moving means provided in the resin sticking unit, the swell formed on the plate-like work can be reliably regenerated regardless of the viscosity of the liquid resin. It becomes possible, and a plate-shaped workpiece with good thickness accuracy can be formed.

  Furthermore, the resin adhering method according to the present invention is a resin adhering method using the resin adhering device, and the height measuring unit determines the upper surface height of the plate-like workpiece by performing a height tendency recognizing step. And the recognition unit can recognize the tendency of the height of the upper surface of the plate-like workpiece based on the measurement result. Thereafter, by performing the angle adjustment step, the angle between the placement surface and the holding surface that the adjustment unit faces can be adjusted based on the tendency of the upper surface height of the plate-like workpiece. Next, by performing the resin supply step and the resin expansion step, the angle between the placement surface and the holding surface is adjusted, and the sheet is supplied to the upper surface of the sheet placed on the placement surface of the placement table. The liquid resin can be expanded according to the swell of the plate-like workpiece. Further, by performing the resin curing step, the plate-like workpiece can be released from the holding surface of the holding means and the liquid resin can be cured. Accordingly, it is not necessary to maintain the holding surface of the holding table and the mounting surface of the mounting table in parallel, and it is possible to reliably reproduce the swell formed on the plate-like workpiece regardless of the viscosity of the liquid resin. Become.

It is a perspective view which shows the structure of a resin sticking apparatus. It is sectional drawing which shows the height tendency recognition process which recognizes the height tendency of a plate-shaped workpiece. It is sectional drawing which shows the angle adjustment process which adjusts the angle of the holding surface of a holding means and the mounting surface of a mounting table. It is sectional drawing which shows the resin supply process which supplies liquid resin to a sheet | seat. It is sectional drawing which shows the resin expansion process which expands liquid resin. It is sectional drawing which shows the resin hardening process which hardens | cures liquid resin.

  A resin adhering apparatus 1 shown in FIG. 1 includes an apparatus base 2 extending in the Y-axis direction, and a resin adhering unit 10 for adhering a liquid resin to a workpiece and a workpiece conveying unit 20 for conveying the object to be processed. And at least. A roll unit 6 in which a sheet 7 to which a liquid resin is supplied is wound in a roll shape is disposed at the front portion in the Y-axis direction of the apparatus base 2.

  The resin sticking unit 10 includes a placing table 12 on which the sheet 7 is placed, a sheet placing unit 11 that places the sheet 7 on the placing table 12, and a holding surface 132 that sucks and holds a circular workpiece. The holding means 13 having the above, the moving means 14 for moving the holding means 13 closer to the placement table 12 and separating the holding means 13 from the placement table 12, and the sheet placement means 11 are placed on the placement table 12. The resin supply means 15 which supplies a liquid resin to the upper surface of the sheet | seat 7 formed and the resin hardening means 16 shown in FIG. 3 which can harden | cure a liquid resin are provided at least. The workpiece transfer unit 20 includes at least a workpiece transfer unit 21 that transfers a workpiece to the holding surface 132 of the holding unit 13 and a temporary placement table 22 that temporarily places the workpiece.

  As shown in FIG. 1, a support base 4 is disposed adjacent to the apparatus base 2, and a sheet placing means 11 is disposed on the support base 4. The sheet placing unit 11 includes an arm 110 extending in a direction orthogonal to the Y-axis direction (X-axis direction), and a clamp portion 111 attached to the arm 110. The clamp unit 111 can clamp the sheet 7 wound around the roll unit 6 and pull it in the Y-axis direction and place it on the mounting table 12.

  A circular placement surface 120 is formed at the center of the placement table 12, and the placement surface 120 is made of, for example, quartz glass. A ring-shaped suction part 121 is arranged on the outer periphery of the mounting surface 120. The suction part 121 is made of, for example, stainless steel. A plurality of suction ports 122 are formed in the suction portion 121 in the circumferential direction, and the sheet 7 placed on the placement surface 120 can be sucked and held from below.

  A column 3 extending in the Z-axis direction is erected on the apparatus base 2. In front of the column 3, a holding unit 13 is disposed via a moving unit 14. The holding means 13 shown in FIG. 3 includes a circular wheel 130 and a holding portion 131, and the lower surface side of the holding portion 131 serves as a holding surface 132 for sucking and holding a workpiece, and the placement table 12 is placed thereon. It faces the surface 120. Further, the holding unit 13 is provided with a pressing part 133 connected to the holding part 131, a suction port 134 formed in the holding part 131, a suction path 135 communicating with the suction source 9, and a suction path 135. And a valve 136.

1 includes a ball screw 140 extending in the Z-axis direction, a motor 141 connected to one end of the ball screw 140, a pair of guide rails 142 extending parallel to the ball screw 140, and a holding means 13 on one surface. And a lifting plate 143 having a nut on the other surface side. The lifting plate 143 has a nut provided on the other surface screwed into the ball screw 140 and a side portion in sliding contact with the pair of guide rails 142. When the ball screw 140 is rotated by being driven by the motor 141, the moving unit 14 moves the lifting plate 143 in the Z-axis direction along the pair of guide rails 142, thereby holding the moving unit 14 in a direction perpendicular to the holding surface 132. 13 can be raised and lowered.

  In the vicinity of the mounting surface 120 of the mounting table 12, a resin supply unit 15 including a supply port 150 for supplying a liquid resin is disposed. The resin supply means 15 can supply an appropriate amount of liquid resin from the supply port 150 toward the mounting surface 120 of the mounting table 12.

  The work conveying means 21 is disposed on the guide plate 5 adjacent to the apparatus base 2. A temporary placement table 22 for temporarily placing a workpiece is disposed at the rear portion of the apparatus base 2 in the Y-axis direction. The work conveying means 21 has a ball screw 210 extending in the Y-axis direction, a pair of guide rails 211 arranged in parallel to the ball screw 210, and a nut structure screwed into the ball screw 210, and a lower portion to the guide rail 211. A moving table 212 that is in sliding contact and a transfer robot 213 supported by the moving table 212 are provided. When the ball screw 210 rotates, the moving table 212 moves in the Y-axis direction along the pair of guide rails 211, so that the transfer robot 213 supported by the moving table 212 is placed between the temporary placement table 22 and the holding unit 13. It can be moved to the vicinity.

In the vicinity of the temporary placement table 22, a height measuring means 30 for measuring the height of the workpiece is disposed. The height measuring means 30 is parallel to the height measuring unit 31 for measuring the height of the upper surface of the workpiece temporarily placed on the temporary placing table 22 and the upper surface of the temporary placing table 22. And a scanning unit 32 that scans.

  As shown in FIG.1 and FIG.2, the height measurement part 31 is formed in the line shape longer than the width | variety of a to-be-processed object. The height measuring unit 31 incorporates, for example, an optical CCD image sensor or CMOS image sensor. The height measurement unit 31 moves in the Y-axis direction above the workpiece temporarily placed on the temporary placement table 22 by the scanning unit 32, projects light on the upper surface of the workpiece, and reflects the reflected light. The height of the workpiece can be measured by receiving light.

  A recognition unit 40 is connected to the height measurement unit 31 for recognizing the tendency of the upper surface height of the workpiece measured by the height measurement unit 31. For example, when the height measuring unit 30 measures the top surface height of a plurality of workpieces, the recognition unit 40 can recognize the tendency of the top surface height of the workpiece based on the plurality of measurement results. .

  As shown in FIG. 3, the holding means 13 is provided with a plurality of adjusting portions 50 made of screw members or the like that adjust the angle of the holding surface 132 of the holding means 13. The adjustment unit 50 is connected to the recognition unit 40, and can adjust the angular relationship between the placement surface 120 and the holding surface 132 based on the upper surface height tendency of the workpiece recognized by the recognition unit 40.

  A resin curing means 16 for curing the liquid resin is disposed below the mounting table 12. The resin curing means 16 includes a plurality of UV lamps 160 that emit ultraviolet light and can cure the liquid resin.

  Below, the process of sticking a liquid resin to a to-be-processed workpiece by the resin sticking apparatus 1 comprised as mentioned above is demonstrated. The plate-like workpiece W shown in FIG. 2 is formed in a circular shape, but is an example of a workpiece and is not particularly limited. In the plate-like workpiece W, the surface to which the liquid resin is attached is the lower surface Wb, and the surface opposite to the lower surface Wb is the upper surface Wa. Furthermore, the plate-like workpiece W has a swell.

(1) Height tendency recognition process The plate-shaped workpiece | work W before liquid resin is affixed on the temporary placement table 22 shown in FIG.1 and FIG.2 is temporarily placed. Next, the height measuring unit 31 moves relative to the upper surface Wa of the plate-like workpiece W with waviness while the height measuring unit 31 is translated in the Y-axis direction with respect to the upper surface of the temporary placement table 22 by the scanning unit 32. Project light. Then, the CCD image sensor or the CMOS image sensor built in the height measuring unit 31 receives the reflected light and measures the height distribution of the upper surface Wa of the plate-like workpiece W.

  The recognition unit 40 recognizes the height trend of the upper surface Wa of the plate workpiece W based on the measurement result of the upper surface Wa height of the plate workpiece W measured by the height measurement unit 31. Here, the height tendency of the upper surface Wa of the plate-like workpiece W is determined by, for example, measuring the height distribution of the upper surfaces Wa of the plurality of plate-like workpieces W by the height measuring unit 31 and specifying the plurality of plate-like workpieces W. It can be obtained by calculating the average value of the height of the upper surface Wa for each position.

  After recognizing the height trend of the upper surface Wa of the plate-like workpiece W by the recognition unit 40, the transfer robot 213 takes out the plate-like workpiece W temporarily placed on the temporary placement table 22 by the operation of the workpiece carrying means 21. Next, the moving table 212 moves in the Y-axis direction along the guide rail 211, moves the transfer robot 213 to the vicinity of the holding unit 13, and transfers the plate-like workpiece W to the holding surface 132 of the holding unit 13.

(2) Angle adjustment process After performing the height tendency recognition process, as shown in FIG. 3, the holding means 13 opens the valve 136, and the plate-like workpiece W is applied to the holding surface 132 by the suction force from the suction source 9. Hold by suction. The plate-like workpiece W sucked and held on the holding surface 132 shown in FIG. 3 is formed so that the undulation of the lower surface Wb rises to the right.

  Here, the adjusting unit 50 determines the holding surface 132 of the holding unit 13 and the mounting surface 120 of the mounting table 12 based on the height tendency of the upper surface Wa of the plate-like workpiece W recognized in the height tendency recognition step. For example, the holding means 13 is tilted to the right by a predetermined angle.

(3) Resin supply process After the angle adjustment process is performed, the arm 110 moves in the Y-axis direction while the clamp unit 111 clamps the sheet 7, and the sheet 7 clamped by the clamp unit 111 is placed on the mounting table 12. Place on the placement surface 120.

  As shown in FIG. 4A, the resin supply unit 15 supplies the liquid resin 8 from the supply port 150 to the upper surface 7 a of the sheet 7 placed on the placement surface 120. As the liquid resin 8, for example, a UV curable resin having viscosity can be used. As shown in FIG. 4B, when an appropriate amount of the liquid resin 8 is deposited on the upper surface 7 a of the sheet 7, the resin supply unit 15 stops the supply of the liquid resin 8.

(4) Resin Expansion Step After performing the resin supply step, the holding means 13 is lowered in the direction perpendicular to the holding surface 132 by the moving means 14 shown in FIG. As shown in FIG. 5, the lower surface Wb of the plate-like workpiece W sucked and held by the holding surface 132 inclined to the right by a predetermined angle comes into contact with the liquid resin 8.

  At this time, when the pressing force by the pressing portion 133 shown in FIG. 5 acts on the liquid resin 8 via the plate-like workpiece W, the liquid resin 8 rises to the left following the undulation of the lower surface Wb of the plate-like workpiece W. Expand. And since the thickness of the left part of the liquid resin 8 is high, the surface tension is weakened, and the swell of the plate-like workpiece W can be reproduced when the plate-like workpiece W is separated from the holding surface 132. .

(5) Resin curing step After performing the resin supply step, as shown in FIG. 6, the holding means 13 closes the valve 136 to stop the suction from the suction port 134 and is held by the holding surface 132. Release the workpiece W. At the same time, the holding means 13 is raised by the moving means 14 shown in FIG. 1, and the holding surface 132 is separated from the upper surface Wa of the plate-like workpiece W.

  As shown in FIG. 6, the swell is regenerated on the plate-like workpiece W released from the suction holding by the holding means 13. At the same time, the resin curing means 16 operates, and the plurality of UV lamps 160 irradiate ultraviolet light from below toward the expanded liquid resin 8. In this way, the liquid resin 8 is cured and adhered to the lower surface Wb of the plate-like workpiece W.

As described above, since the resin sticking apparatus 1 includes the height measuring means 30 for measuring the height of the upper surface Wa of the plate workpiece W and the recognition unit 40, the upper surfaces of the plurality of plate workpieces W are included. The height of Wa is measured, and the recognition unit 40 can recognize the average height tendency of the height of the upper surface Wa of the plate-like workpiece W based on the measurement result by the height measuring means 30.
Further, in the resin sticking apparatus 1, the mounting surface 120 of the mounting table 12 and the holding surface 132 of the holding means 13 facing each other based on the height tendency of the upper surface Wa of the plate-like workpiece W recognized by the recognition unit 40. Therefore, the holding surface 132 of the holding means 13 can be tilted by a predetermined angle.
Therefore, even if the viscosity of the liquid resin 8 is not weakened, the liquid resin 8 can be adhered to the lower surface Wb of the plate-like workpiece W without mixing bubbles between the plate-like workpiece W. Further, when the holding surface 132 of the holding means 13 is separated from the upper surface Wa of the plate-like workpiece W, it is possible to reliably reproduce the swell formed on the plate-like workpiece W regardless of the viscosity of the liquid resin 8. A plate-like workpiece W with good thickness accuracy can be formed.

1: Resin pasting device 2: Device base 3: Column 4: Support base 4a: Upper surface 5: Guide plate 6: Roll part 7: Sheet 7a: Upper surface 8: Liquid resin 9: Suction source 10: Resin pasting unit 11: Sheet placing means 110: Arm 111: Clamping part 12: Placement table 120: Placement surface 121: Suction part 122: Suction port 13: Holding means 130: Wheel 131: Holding part 132: Holding surface 133: Pressing part 134: Suction port 135: Suction path 136: Valve 14: Moving means 140: Ball screw 141: Motor 142: Guide rail 143: Elevating plate 15: Resin supply means 150: Supply port 16: Resin curing means 160: UV lamp 20: Work transfer unit 21: Work transfer means 210: Ball screw 211: Guide rail 212: Moving table 213: Transfer robot 22: Temporary placement Table 30: height measuring means 31: height measuring unit 32: scanning unit 40: recognition unit 50: adjusting unit W: plate-like work Wa: upper surface Wb: lower surface

Claims (2)

A resin sticking apparatus composed of a resin sticking unit and a work transfer unit,
The resin sticking unit includes a holding means having a holding surface for sucking and holding the upper surface of a circular plate-shaped workpiece;
A mounting table whose upper surface is a mounting surface facing the holding surface;
Moving means for moving the holding means toward and away from the mounting table;
Sheet placing means for placing a sheet on the placement surface of the placement table;
A resin supply means for supplying a liquid resin to the upper surface of the sheet placed on the placement surface by the sheet placement means;
A resin curing means for curing the liquid resin after the liquid resin is pressed by the approach of the holding means supplied to the upper surface of the sheet,
The workpiece transfer unit includes a workpiece transfer unit that transfers a plate-like workpiece to the holding surface of the holding unit;
A temporary placement table for temporarily placing a plate-like workpiece;
A height measurement unit that measures the height of the upper surface of the plate-like workpiece temporarily placed on the temporary placement table, and a scanning unit that scans the height measurement unit parallel to the upper surface of the temporary placement table. A height measuring means,
A recognition unit for recognizing the height tendency of the plate-like workpiece from the measurement result of the upper surface height of the plate-like workpiece measured by the height measuring means;
An adjustment unit that adjusts an angle between the mounting surface and the holding surface facing each other based on a height tendency recognized by the recognition unit ;
After the adjusting unit adjusts the angle between the mounting surface and the holding surface, the resin supply means presses the liquid resin supplied to the upper surface of the sheet by the plate-like work held by the holding means, and the A resin sticking apparatus that expands a liquid resin and cures the expanded liquid resin by the resin curing means . A resin sticking method using the resin sticking apparatus according to claim 1,
The height measurement unit is scanned by the scanning unit, the upper surface height of the plate-like workpiece temporarily placed on the temporary placement table is measured, and the recognition unit is temporarily placed on the temporary placement table. A height trend recognition process for recognizing the top surface height trend of
An angle adjustment step of adjusting the angle between the mounting surface and the holding surface that the adjustment unit faces, based on the height trend recognized by the height trend recognition step;
A resin supply step of placing a sheet on the placement table by the sheet placement means and supplying a liquid resin to the upper surface of the sheet by the resin supply means;
After the angle adjustment step and the resin supply step, the holding unit is lowered by the moving unit, the liquid resin on the upper surface of the sheet is pressed by a plate-like work held by the holding unit, and the liquid resin is expanded. Resin expansion process;
A resin adhering method for adhering the liquid resin to the plate-shaped workpiece by the resin curing step of releasing the holding of the plate-shaped workpiece by the holding means and curing the expanded liquid resin after the resin expanding step.

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