TWI372318B - Decompression drying device - Google Patents

Decompression drying device

Info

Publication number
TWI372318B
TWI372318B TW096149374A TW96149374A TWI372318B TW I372318 B TWI372318 B TW I372318B TW 096149374 A TW096149374 A TW 096149374A TW 96149374 A TW96149374 A TW 96149374A TW I372318 B TWI372318 B TW I372318B
Authority
TW
Taiwan
Prior art keywords
drying device
decompression drying
decompression
drying
Prior art date
Application number
TW096149374A
Other languages
Chinese (zh)
Other versions
TW200837515A (en
Inventor
Shunichi Yahiro
Mitsuhiro Sakai
Takahiro Sakamoto
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200837515A publication Critical patent/TW200837515A/en
Application granted granted Critical
Publication of TWI372318B publication Critical patent/TWI372318B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096149374A 2006-12-22 2007-12-21 Decompression drying device TWI372318B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006346104A JP4272230B2 (en) 2006-12-22 2006-12-22 Vacuum dryer

Publications (2)

Publication Number Publication Date
TW200837515A TW200837515A (en) 2008-09-16
TWI372318B true TWI372318B (en) 2012-09-11

Family

ID=39566707

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096149374A TWI372318B (en) 2006-12-22 2007-12-21 Decompression drying device

Country Status (4)

Country Link
JP (1) JP4272230B2 (en)
KR (1) KR20080059070A (en)
CN (1) CN101206412B (en)
TW (1) TWI372318B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618905B (en) * 2015-01-28 2018-03-21 Shibaura Mechatronics Corp Substrate processing device

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008311250A (en) * 2007-06-12 2008-12-25 Tokyo Electron Ltd Reflow system and reflow method
JP4592787B2 (en) * 2008-07-11 2010-12-08 東京エレクトロン株式会社 Substrate processing equipment
JP4638931B2 (en) * 2008-09-12 2011-02-23 東京エレクトロン株式会社 Substrate processing equipment
JP4976358B2 (en) * 2008-10-10 2012-07-18 大日本スクリーン製造株式会社 Substrate dryer
KR101020674B1 (en) 2008-11-18 2011-03-09 세메스 주식회사 Apparatus for drying a photoresist layer on a substrate
KR101021839B1 (en) * 2008-11-26 2011-03-17 세메스 주식회사 Apparatus for drying a photoresist layer on a substrate
KR101140489B1 (en) * 2008-12-12 2012-04-30 도쿄엘렉트론가부시키가이샤 Vacuum processing apparatus, vacuum processing system and processing method
JP4916035B2 (en) * 2009-08-28 2012-04-11 東京エレクトロン株式会社 Substrate transport apparatus and substrate transport method
JP4936567B2 (en) * 2009-09-18 2012-05-23 東京エレクトロン株式会社 Heat treatment equipment
JP2011086807A (en) * 2009-10-16 2011-04-28 Tokyo Electron Ltd Vacuum drying apparatus
KR101100836B1 (en) * 2009-11-26 2012-01-02 세메스 주식회사 Apparatus and method for treating substrate
KR101099555B1 (en) * 2010-01-12 2011-12-28 세메스 주식회사 Apparatus for processing a substrate
WO2012067033A1 (en) * 2010-11-18 2012-05-24 シャープ株式会社 Substrate drying apparatus and substrate drying method
IT1403717B1 (en) * 2011-01-11 2013-10-31 Nordmeccanica Spa PLANT FOR DRYING A COVERED FILM CONTINUOUSLY
CN103367194B (en) * 2012-03-26 2016-08-24 上海华虹宏力半导体制造有限公司 A kind of device and method transmitting position correction for wafer
KR101397731B1 (en) * 2012-08-09 2014-05-21 삼성전기주식회사 Apparatus for measuring a drying rate and method for measuring the drying rate using the same
KR102006878B1 (en) * 2012-12-27 2019-08-05 삼성디스플레이 주식회사 Multi-function apparatus for testing and etching substrate and substrate processing apparatus
CN103234328B (en) * 2013-03-28 2015-04-08 京东方科技集团股份有限公司 Method for baseplate drying under reduced pressure and device thereof
CN103713478B (en) * 2013-12-31 2017-02-01 四川聚能核技术工程有限公司 Pre-alignment device
JP6639175B2 (en) * 2015-09-29 2020-02-05 東京エレクトロン株式会社 Drying apparatus and drying method
JP6698489B2 (en) * 2016-09-26 2020-05-27 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
JP2018085408A (en) * 2016-11-22 2018-05-31 株式会社ディスコ Decompressor
JP6808690B2 (en) * 2018-07-25 2021-01-06 株式会社Ｓｃｒｅｅｎホールディングス Vacuum drying device, substrate processing device and vacuum drying method
CN109579438A (en) * 2018-11-16 2019-04-05 安徽江淮汽车集团股份有限公司 A kind of automatic Race Line vacuum sealing mechanism

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4426276B2 (en) * 2003-10-06 2010-03-03 住友重機械工業株式会社 Conveying device, coating system, and inspection system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618905B (en) * 2015-01-28 2018-03-21 Shibaura Mechatronics Corp Substrate processing device

Also Published As

Publication number Publication date
CN101206412B (en) 2011-03-30
CN101206412A (en) 2008-06-25
KR20080059070A (en) 2008-06-26
JP2008159782A (en) 2008-07-10
TW200837515A (en) 2008-09-16
JP4272230B2 (en) 2009-06-03

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees