JP2009202088A - Substrate treating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent misty processing liquid from invading between treating chambers. <P>SOLUTION: The substrate treating device includes a first peeling treating chamber 1 that performs peeling treatment with the peeling liquid, a second peeling treating chamber 3 that performs peeling treatment with the peeling liquid of lower concentration than that of the above peeling liquid, a middle chamber 2 interposed between the treating chambers 1, 3, shutters 25, 34, and the like each open/shut openings 11a, 13a for substrate conveyance formed in partitions 11, 13 of the chamber 1, chamber 2, and chamber 3, air knives 36, 36 that deliver the air towards the opening 13a when the opening 13a is opened at least on the chamber 3 side in the chamber 2, and an exhaust port 40 between the air knives 36, 36 and opening 13a, and is provided with an exhausting means that evacuates the chamber 2 through the port 40. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention supplies various processing liquids to a substrate such as a glass substrate for FPD (flat panel display) such as an LCD (liquid crystal display device) or PDP (plasma display), a glass substrate for photomask, a semiconductor substrate, etc. The present invention relates to a substrate processing apparatus and the like.

  2. Description of the Related Art Conventionally, there is an apparatus that has a plurality of processing chambers and performs predetermined process processing on a substrate by supplying a processing liquid to the substrate in each processing chamber while transporting a substrate such as an LCD or a glass substrate for PDP. Are known. For example, Patent Document 1 describes an apparatus in which a peeling treatment chamber for peeling a resist film by supplying a peeling solution to a substrate and a cleaning treatment chamber for washing the substrate after the peeling treatment are provided adjacent to each other. ing.

In this type of apparatus, the mist-like processing liquid filled in the processing chamber with the processing enters the adjacent processing chamber (referred to as the adjacent processing chamber) through the opening for transporting the substrate, and processes the substrate in the adjacent processing chamber. It can be considered to have various effects on the above. For example, in Patent Document 1, the stripping solution used in the stripping chamber is collected and reused (circulated). In that case, if the mist of the cleaning solution enters the stripping chamber from the cleaning chamber, the stripping is performed. It is conceivable that the liquid quality of the liquid deteriorates. Therefore, in general, in order to prevent intrusion of mist, a shutter is provided between the processing chambers, and an opening is opened only when the substrate is transported to prevent intrusion of mist.
JP 2004-146414 A

  However, even in an apparatus provided with a shutter between the processing chambers, the opening is left open during the transfer of the substrate, so that mist still easily enters the adjacent processing chamber through the opening. There is still room for improvement in preventing mist intrusion.

  It should be noted that in an apparatus in which a plurality of processing chambers are adjacent as described above, intrusion of mist from one of the processing chambers into the other processing chamber becomes a problem, and vice versa is often allowed to some extent. In the apparatus of Patent Document 1, in order to prevent the stripping liquid from deteriorating, the penetration of the stripping liquid (mist) into the cleaning chamber is not a problem as long as the mist can be prevented from entering the stripping processing chamber from the cleaning processing chamber. Therefore, it is effective to take measures to prevent mist from entering the adjacent processing chamber in consideration of this point.

  The present invention has been made in view of the above circumstances, and it is an object of the present invention to more effectively prevent entry of a mist-like processing liquid into an adjacent processing chamber and to prevent mixing of the processing liquid. It is what.

  In order to solve the above problems, the substrate processing apparatus of the present invention has a first processing chamber and a second processing chamber in the substrate transport direction, and sequentially uses different processing liquids for the substrate in each processing chamber. A substrate that is subjected to a predetermined wet process, and the relationship between the different processing liquids is required to suppress mixing of the processing liquid on the other side with respect to the processing liquid on the one side during substrate processing. In the processing apparatus, an intermediate chamber interposed between the first processing chamber and the second processing chamber, and a first opening through which a substrate provided in a partition wall between the first processing chamber and the intermediate chamber passes. And a shutter means for opening and closing a second opening that allows a substrate provided in a partition between the intermediate chamber and the second processing chamber to pass through, and the intermediate chamber, the first opening and the second opening Treatment on one side and using the treatment liquid on the other side A nozzle member that discharges gas to form an air flow toward the target opening, which is an opening between the intermediate chamber and the intermediate chamber, and discharges the gas from the nozzle member at least when the target opening is open Gas discharge means to be discharged, and an exhaust means having an exhaust port at a position between the nozzle member and the target opening and exhausting the intermediate chamber through the exhaust port.

  In this substrate processing apparatus, when an intermediate chamber is provided between the first processing chamber and the second processing chamber and the opening on the processing chamber side using the processing liquid on the other side (the target opening) is opened. In the intermediate chamber, gas is discharged from the nozzle member toward the target opening, thereby preventing the mist (the processing liquid on the other side) from flowing out from the target opening. In addition, even when the mist slightly flows out, since the hollow chamber is exhausted by the exhaust means, the mist is exhausted from the intermediate chamber to the outside. At this time, since the exhaust port is provided at a position between the nozzle member and the target opening, the mist that has flowed out is quickly exhausted. Accordingly, the mist is effectively prevented from entering another processing chamber (that is, the processing chamber in which the one-side processing liquid is used), and the other-side processing liquid is prevented from mixing into the one-side processing liquid. Is done.

  In addition, in the description of the claims, “different processing liquids” means processing liquids having different properties and attributes but having different properties (attributes), and having different properties and types, and having different properties and types but having different concentrations. It is a concept that includes different processing liquids.

  In this apparatus, by providing a partition wall in the intermediate chamber, the interior of the intermediate chamber is partitioned into a nozzle chamber including the nozzle member and an exhaust chamber including the target opening and an exhaust port, and the nozzle It is preferable that the member is configured to discharge the gas through an opening through which the substrate provided on the partition wall passes.

  According to this apparatus, even when the mist slightly flows out through the target opening, diffusion of the mist to the other processing chamber side is effectively prevented by the partition wall. Therefore, it is possible to more effectively prevent the mist from entering the other processing chamber.

  Further, in the above apparatus, the gas discharge means discharges gas from the nozzle member, thereby flowing gas from the intermediate chamber side toward the processing chamber side along the surface of the substrate passing through the target opening. It is preferable to form a flow.

  According to this apparatus, it is possible to effectively prevent a situation in which the mist flows out along the substrate while the substrate passes through the target opening.

  More specifically, the apparatus as described above is a similar type of treatment liquid in which the different treatment liquids have different concentrations, and a high concentration treatment liquid is used in the first treatment chamber, The nozzle member is configured to discharge gas toward the second opening as the target opening.

  In this apparatus, the same kind of processing is performed in each processing chamber, but as a result of having the above-described apparatus configuration, a low concentration mist (processing liquid) flows out of the second processing chamber and enters the first processing chamber. Inconveniences such as intrusion and mixing with a high-concentration processing solution to dilute the processing solution are effectively prevented.

  In this case, for example, when the exhaust means is an intermediate chamber exhaust means, the first process chamber exhaust means for exhausting the first process chamber separately from the exhaust means, and the mist contained in the exhaust are captured for reuse. In the apparatus provided with the collecting means for collecting, as a result of having the apparatus configuration as described above, it is possible to effectively prevent dilution of the high-concentration treatment liquid that is collected and reused. Therefore, in the apparatus for collecting and reusing mist in this way, the above apparatus configuration is particularly useful.

  According to the substrate processing apparatus according to any one of claims 1 to 5, an intermediate chamber is provided between the first processing chamber and the second processing chamber, and the opening on the processing chamber side using the processing liquid on the other side (the target opening). ) Is opened, gas is discharged toward the target opening in the intermediate chamber and the intermediate chamber is exhausted, so that the processing chamber on one side is transferred to the processing chamber on the other side. Intrusion of the mist (mist-like processing liquid) can be prevented more effectively, and mixing of the processing liquid can be prevented.

  A preferred embodiment of the present invention will be described with reference to the drawings.

<First Embodiment>
FIG. 1 shows an example of a substrate processing apparatus according to the first embodiment. The substrate processing apparatus shown in this figure is a process processing apparatus that performs a predetermined process on a substrate S in a predetermined order while transporting the substrate S. FIG. The structure of the process of peeling the resist film formed is shown roughly.

  As shown in this figure, the substrate processing apparatus supplies a stripping solution to the substrate S to perform a stripping process, a first stripping processing chamber 1 (first processing chamber) and a second stripping processing chamber 3 (second processing chamber). And an intermediate chamber 2 interposed between the processing chambers 1 and 3. The first exfoliation processing chamber 1 and the intermediate chamber 2 are adjacent to each other by sharing the partition wall 11, and the intermediate chamber 2 and the second exfoliation processing chamber 3 are adjacent to each other by sharing the partition wall 13, 13 are communicated with each other through openings 11a and 13a for carrying the substrate. The openings 11a and 13a have a rectangular shape elongated in the width direction (a direction orthogonal to the transport direction of the substrate S; a direction orthogonal to the paper surface in the figure) and are necessary and sufficient to allow the substrate S to pass through. Is formed. In the following description, “upstream side” and “downstream side” are based on the transport direction of the substrate S.

  In each of the processing chambers 1, 3 and the intermediate chamber 2, a plurality of transport rollers 4 are arranged at predetermined intervals, and by driving these transport rollers 14, the substrate S enters a transport path constituted by the rollers 14. It is comprised so that it may be conveyed in the arrow direction in a figure with a horizontal posture along.

  A plurality of liquid nozzles 20 and 30 for supplying a stripping solution to the substrate S are provided inside the processing chambers 1 and 3, respectively. Each of the liquid nozzles 20 and 30 is a so-called spray nozzle that sprays the stripping liquid, and is arranged in a predetermined arrangement above the transport roller 4.

  The liquid nozzle 20 of the first peeling treatment chamber 1 is connected to the first liquid tank 23 via the first liquid supply pipe 21, and the driving of the pump 22 provided in the first liquid supply pipe 21 is not shown. With the control of the opening / closing valve, the stripping liquid can be supplied onto the substrate S upon receiving the stripping liquid from the first liquid tank 23. On the other hand, the liquid nozzle 30 of the second peeling treatment chamber 3 is connected to the second liquid tank 33 via the second liquid supply pipe 31, and the drive of the pump 32 provided in the second liquid supply pipe 31 and The release liquid can be supplied onto the substrate S by receiving the supply of the release liquid from the second liquid tank 33 by the control of the opening / closing valve (not shown). That is, the same kind of stripping liquids having different concentrations are stored in the liquid tanks 23 and 33, and specifically, a high concentration stripping liquid is stored in the first liquid tank 23. In the processing chambers 1 and 3, the substrate S is stripped using stripping solutions having different concentrations.

  A pair of upper and lower air knives 24, 24 for removing the stripping solution as the substrate S is carried out are disposed in the vicinity of the partition wall 11 in the first stripping treatment chamber 1. Each of the air knives 24, 24 is formed of a slit nozzle having an elongated discharge port that is elongated in the width direction of the transport path and continuously extends in the longitudinal direction, and the discharge ports are respectively provided on the upper and lower sides of the transport path. It is arranged so as to face the transport path side and slightly upstream. Each of the air knives 24, 24 is connected to an air supply source (not shown) via an air supply pipe 26. By operating an open / close valve (not shown), air of a predetermined flow rate from the air supply source, specifically, The air can be discharged onto the substrate S by receiving so-called CDA (Clean Dry Air) whose cleanliness and temperature and humidity are adjusted to predetermined levels.

  The first peeling process chamber 1 is provided with a shutter 25 for opening and closing the opening 11a, and the second peeling process chamber 3 is provided with a shutter 34 for opening and closing the opening 13a. These shutters 25 and 34 have a flat plate shape that is elongated in the width direction, and are entirely made of a material having chemical resistance, and are driven by a driving mechanism (not shown) using a motor as a driving source. As a result, it moves up and down along the wall surfaces of the partition walls 11 and 13, thereby opening and closing the openings 11a and 13a.

  As shown in the figure, the intermediate chamber 2 is partitioned into an upstream nozzle chamber 2a and a downstream exhaust chamber 2b by a partition wall 12 having an opening 12a for transporting a substrate.

  The nozzle chamber 2a is provided with a pair of upper and lower air knives 36, 36 (corresponding to the nozzle member according to the present invention), and these air knives 36, 36 are arranged with the conveyance path interposed therebetween. Each of the air knives 36 and 36 is connected to the air supply source via an air supply pipe 37, and is supplied with a predetermined flow of air (CDA) from the air supply source by operating an open / close valve (not shown). Thus, the air can be discharged onto the substrate S. Each of the air knives 36, 36 is composed of a slit nozzle that is substantially the same as that disposed in the first separation processing chamber 1, and is disposed such that the discharge port faces the transport path side and slightly downstream. With this configuration, air discharged from the air knives 36 and 36 is discharged to the second peeling processing chamber 3 side, that is, the opening 13a side through the opening 12a, and on the upper and lower surfaces of the substrate S during the transfer of the substrate S. An air flow that flows toward the second peeling treatment chamber 3 along the side is formed. In this embodiment, the air knives 36, 36, the air supply pipe 37, the air supply source, and the like correspond to the gas discharge means according to the present invention.

  Meanwhile, an exhaust pipe 41 is connected to the ceiling portion of the exhaust chamber 2b. The exhaust pipe 41 is connected to a negative pressure pump 42 through a filter and an open / close valve, etc., not shown in the figure, and thereby the inside of the intermediate chamber 2 through the exhaust port 40 formed in the ceiling surface of the exhaust chamber 2b. The atmosphere can be exhausted. In this embodiment, the exhaust port 40, the exhaust pipe 41, the negative pressure pump 42, and the like correspond to the intermediate chamber exhaust means according to the present invention.

  The exhaust chamber 2b is further provided with a shutter 38 that opens and closes the opening 13a from the intermediate chamber 2 side. The configuration of the shutter 38 and the driving mechanism thereof are substantially the same as those of the shutters 25 and 34. The shutter 38 moves up and down along the wall surface of the partition wall 13 on the intermediate chamber 2 side, thereby opening the opening 13a. It can be opened and closed from the intermediate chamber 2 side. In this embodiment, the shutters 25, 34, and 38 and the driving mechanism thereof correspond to the shutter means according to the present invention.

  By the way, the substrate processing apparatus has a controller 5 as a drive control means having a CPU or the like as a constituent element, and each of the liquid supply pipes 21, 31, the air supply pipes 26, 37 and the exhaust pipe 41. The opening / closing valve, the motors of the drive mechanisms of the shutters 25, 34, and 38 are all electrically connected to the controller 5 and are controlled by the controller 5 in a centralized manner. In particular, when the substrate is transported, the opening and closing of the openings 11a and 13a by the shutters 25, 34, and 38, the discharge of air, and the like are performed in accordance with the order shown in FIG. Intrusion of a mist-like stripping solution (hereinafter simply referred to as mist) from 3 into the first stripping treatment chamber 1 is prevented. Hereinafter, this point will be described.

  In this apparatus, during processing of the substrate S, the openings 11a and 13a are closed by the shutters 25, 34, and 38 as shown by the solid lines in FIG. 2 The exfoliation processing chamber 3 is brought into a non-communication state, and external diffusion of mist generated in the processing chambers 1 and 3 is prevented. The intermediate chamber 2 (exhaust chamber 2b) is always exhausted through the exhaust port 40.

  When the processing of the substrate S is completed in each processing chamber 1, 3, the substrate S in the second peeling processing chamber 3 is carried out to the next process, and the substrate S in the first peeling processing chamber 1 passes through the intermediate chamber 2. It is conveyed to the second peeling treatment chamber 3. When the substrate S is transferred from the first peeling processing chamber 1 to the second peeling processing chamber 3, the openings 11a and 13a are opened and closed according to the order shown in FIG.

  First, when the substrate S is transported to a predetermined position in the first peeling process chamber 1 and the leading end is detected by a sensor (not shown), the air knives 24 and 24 start to discharge air and the shutter 25 is activated. Thus, the opening 11a is opened, whereby the substrate S is unloaded from the first peeling treatment chamber 1 through the opening 11a, and the peeling liquid on the substrate S is discharged by the air discharged from the air knives 24, 24 along with this unloading. Etc. are removed.

  Further, after the discharge of air by the air knives 36 and 36 is started in the intermediate chamber 2 (nozzle chamber 2a), the shutter 38 on the intermediate chamber 2 side and the shutter 34 on the second peeling treatment chamber 3 side are sequentially operated. The opening 13a is opened, whereby the substrate S is carried into the second peeling process chamber 3 while passing through the intermediate chamber 2. At this time, when the discharge of air from the air knives 36, 36 is started, the air is blown to the opening 13 a through the opening 12 a formed in the partition wall 12, whereby the mist from the second peeling treatment chamber 3 is blown. Outflow is suppressed. As shown in FIG. 3, while the substrate S is being transferred into the second peeling process chamber 3 through the opening 13 a, the air discharged from the air knives 36 and 36 is downstream along the upper and lower surfaces of the substrate S. An air flow that flows to the side (solid arrow in the figure) is formed, and this air flow enters the second peeling treatment chamber 3 through the opening 13a, so that mist outflow from the second peeling treatment chamber 3 is prevented. The Note that it is considered that some mist flows out from the second peeling treatment chamber 3 to the intermediate chamber 2 during the period in which the opening 13a is open. Such mist is exhausted by the exhaust in the exhaust chamber 2b. It is discharged to the outside through 40 (see the broken line arrow in FIG. 3), thereby preventing the mist from flowing out from the intermediate chamber 2, that is, the mist entering the first peeling treatment chamber 1.

  When the substrate S is thus transported and the substrate S is unloaded from the first peeling processing chamber 1, the air knives 24, 24 are stopped from discharging air, and the shutter 25 is activated to close the opening 11a. . And when the substrate S is further transported and the loading of the substrate S into the second peeling treatment chamber 3 is completed, that is, when the rear end is detected by a sensor outside the figure arranged in the second peeling treatment chamber 3, The opening 13a is closed by the operation of the shutter 34 on the second peeling treatment chamber 3 side, and then the shutter 38 on the intermediate chamber 2 side is operated and set to the closed position, and the air knives 36, 36 discharge air. Is stopped. As a result, the processing of the substrate S is started in each of the processing chambers 1 and 3.

  As described above, in this substrate processing apparatus, the intermediate chamber 2 is provided between the first peeling processing chamber 1 and the second peeling processing chamber 3, and the intermediate chamber 2 is kept open while the opening 13 a is open. Since air is discharged toward the opening 13a by the provided air knives 36, 36, mist outflow from the second peeling treatment chamber 3 is effectively prevented, and the opening from the second peeling treatment chamber 3 is temporarily assumed. Even when the mist flows out to the intermediate chamber 2 through the portion 13a, the mist is exhausted from the intermediate chamber 2 to the outside, and the intrusion into the first peeling treatment chamber 1 is prevented. Therefore, according to this apparatus, the low-concentration mist generated in the second stripping treatment chamber 3 enters the first stripping treatment chamber 1, thereby diluting the high-concentration stripping solution in the first stripping treatment chamber 1. Generation | occurrence | production of the situation which can affect the process of the 1st peeling process chamber 1 can be prevented beforehand.

  In particular, in the above substrate processing apparatus, the partition wall 12 is provided in the intermediate chamber 2 so that the intermediate chamber 2 is partitioned into the upstream nozzle chamber 2a and the downstream exhaust chamber 2b, and is opened from the nozzle chamber 2a side. Since the inside of the exhaust chamber 2b is exhausted while discharging air through the portion 12a, diffusion of the mist flowing out from the second peeling treatment chamber 3 to the upstream side is effectively prevented by the partition wall 12, As a result, mist intrusion into the first peeling treatment chamber 1 is prevented at a very high level.

<Second Embodiment>
FIG. 2 shows an example of a substrate processing apparatus according to the second embodiment.

  The substrate processing apparatus according to the second embodiment is suitable for a case where a stripping solution having a higher concentration than that of the first stripping processing chamber 1 is used in the second stripping processing chamber 3. Since the basic configuration of the substrate processing apparatus is the same as that of the first embodiment, portions common to the first embodiment are denoted by the same reference numerals and description thereof is omitted. In the description, differences from the first embodiment will be described in detail.

  As shown in the figure, in this processing tank apparatus, the exhaust chamber 2b is provided on the upstream side of the intermediate chamber 2, while the nozzle chamber 2a is provided on the downstream side. The discharge ports are arranged so as to face the upstream side of the transport path. The exhaust chamber 2b is provided with a shutter 39 that opens and closes the opening 11a of the partition wall 11 from the intermediate chamber 2 side. The configuration of the shutter 39 and the driving mechanism thereof are substantially the same as those of the shutters 25 and 34. The shutter 39 moves up and down along the wall surface of the partition wall 11 on the intermediate chamber 2 side, thereby opening the opening 11a. It can be opened and closed from the intermediate chamber 2 side. In this apparatus, the shutter 38 for opening and closing the opening 13a of the partition wall 13 from the intermediate chamber 2 side is not provided.

  In this apparatus, when the substrate S is transferred from the first peeling process chamber 1 to the second peeling process chamber 3, operations such as opening and closing of the openings 11a and 13a are performed in accordance with the order shown in FIG. Done.

  First, when the substrate S is transported to a predetermined position in the first peeling processing chamber 1, the discharge of air by the air knives 24, 24 is started, and the shutter 39 on the intermediate chamber 2 side is operated to open the opening 11a. The shutter 39 is set at a position where it can be performed (at this time, the opening 11a is closed by the shutter 25). Next, the discharge of air by the air knives 36, 36 is started, and then the opening 25a is opened by operating the shutter 25, and the opening 13a is opened by further operating the shutter 34. As a result, the first separation processing chamber 1 is unloaded from the substrate S through the opening 11a, and the unloading liquid on the substrate S is removed by the air discharged from the air knives 24, 24 along with the unloading. At this time, when the discharge of air from the air knives 36, 36 is started, the air is blown to the opening 11 a through the opening 12 a formed in the partition wall 12, whereby the mist from the first peeling treatment chamber 1 is blown. Outflow is suppressed. And while the board | substrate S is carried out from the 1st peeling process chamber 1 through the opening part 11a, the air flow which flows upstream along the up-and-down both surfaces of the board | substrate S is formed with the air discharged from the air knives 36 and 36. Then, this air flow enters the first peeling treatment chamber 1 through the opening 11a, so that mist outflow from the first peeling treatment chamber 1 is prevented. During the period when the opening 11a is open, it is considered that some mist flows out from the first separation processing chamber 1 to the intermediate chamber 2, but such mist is exhausted by the exhaust in the exhaust chamber 2b. It is discharged to the outside through the port 40, thereby preventing the mist from flowing out from the intermediate chamber 2, that is, the mist entering the second peeling treatment chamber 3.

  When the substrate S is thus transported and the substrate S is unloaded from the first peeling processing chamber 1, the shutter 25 on the first peeling processing chamber 1 side is actuated to close the opening 11a, and the air knife 24, 24 is stopped, and the shutter 39 on the intermediate chamber 2 side is operated to be set at the closed position. When the substrate S is further transferred and the loading of the substrate S into the second peeling processing chamber 3 is completed, the shutter 34 is operated to close the opening 13a, and the discharge of air by the air knives 36 and 36 is stopped. The

  According to such a substrate processing apparatus of the second embodiment, air is discharged toward the opening 11a by the air knives 36, 36 provided in the intermediate chamber 2, so that the mist from the first peeling processing chamber 1 is discharged. Outflow is effectively prevented, and even if mist flows out from the first peeling treatment chamber 1 to the intermediate chamber 2 through the opening 11a, the mist is exhausted from the intermediate chamber 2 to the outside. Intrusion into the peeling treatment chamber 3 is prevented. Therefore, according to this apparatus, the low concentration mist generated in the first peeling treatment chamber 1 enters the second peeling treatment chamber 3 to dilute the peeling solution in the second peeling treatment chamber 3, thereby It is possible to prevent the occurrence of a situation where the peeling process in the peeling process chamber 3 can be affected.

  By the way, the substrate processing apparatus according to the first and second embodiments described above is an example of a part of a preferred embodiment of the substrate processing apparatus according to the present invention. Changes can be made as appropriate without departing from the scope of the invention.

  For example, in the above embodiment, the partition wall 12 is provided in the intermediate chamber 2 to partition the interior into the nozzle chamber 2a and the exhaust chamber 2b, but the partition wall 12 may be omitted. However, according to the configuration in which the partition wall 12 is provided, as described above, even when the low concentration mist flows into the intermediate chamber 2, the mist diffuses to the processing chamber side where the high concentration stripping solution is used. Can be effectively prevented. Therefore, it is desirable to provide the partition wall 12 in order to more reliably prevent the low concentration mist from entering the high concentration side peeling treatment chamber.

  In addition, the substrate processing apparatus of the first embodiment includes, for example, an exhaust device (corresponding to the first processing chamber exhaust means according to the present invention) for exhausting the inside of the first separation processing chamber 1 and exhausting by the exhaust device. It further comprises a collecting device (corresponding to the collecting means according to the present invention) for collecting the contained mist (high concentration mist), and the collected mist is returned to the liquid tank 23 for reuse. It may be. That is, when collecting and reusing mist, it is considered that when the low concentration mist enters the first peeling treatment chamber 1, the low concentration mist is also collected, so that the dilution of the peeling solution is likely to proceed. According to the apparatus configuration shown in FIG. 1, since the low concentration mist can be effectively prevented from entering the first peeling treatment chamber 1, it is particularly advantageous in the above-described apparatus for collecting and reusing the high concentration mist. It will be a thing. This also applies to the case where the high concentration mist is collected and reused in the second peeling processing chamber 3 in the substrate processing apparatus of the second embodiment.

  In the above embodiment, as an application of the present invention, the substrate processing apparatus that performs the stripping process in each of the processing chambers 1 and 3 using the same kind of stripping liquids having different concentrations has been described. It is not limited. For example, the present invention can also be applied to a substrate processing apparatus that performs etching processing on a substrate in each processing chamber using etching solutions having different concentrations. Further, in addition to using the same type of processing liquids having different concentrations in each processing chamber in this way, the apparatus using the processing liquids having different properties (attributes; in other words, the target process) and different types, the properties (attributes). ), For example, an apparatus that performs a stripping process using a stripping solution in an upstream processing chamber and a cleaning process using pure water in a downstream processing chamber. The invention is applicable.

  In the above-described embodiment, the case where the substrate S is processed while being transported in a horizontal posture has been described. Of course, an apparatus that performs processing on the substrate S while the substrate S is transported in an inclined posture is also described. The present invention is applicable.

1 is a schematic configuration diagram showing a substrate processing apparatus (first embodiment) according to the present invention. It is a figure explaining the operation | movement order of a shutter etc. at the time of board | substrate conveyance from a 1st peeling process chamber to a 2nd peeling process chamber. It is a figure which shows the state in which the board | substrate is conveyed from the 1st peeling process chamber to the 2nd peeling process chamber. It is a schematic block diagram which shows the substrate processing apparatus (2nd Embodiment) which concerns on this invention. It is a figure explaining the operation | movement order of a shutter etc. at the time of board | substrate conveyance from a 1st peeling process chamber to a 2nd peeling process chamber.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st peeling process chamber 2 Intermediate | middle chamber 2a Nozzle chamber 2b Exhaust chamber 3 2nd peeling process chamber 4 Conveyance roller 5 Controller 11a, 13a Opening part 24,36 Air knife 20,30 Liquid nozzle 25,34,38 Shutter 40 Exhaust port S substrate

Claims (5)

A first processing chamber and a second processing chamber are provided in the substrate transport direction, and each substrate is sequentially subjected to predetermined wet processing using different processing liquids in each processing chamber, and the different processing liquids are used. In the substrate processing apparatus in which the relationship is required to suppress mixing of the processing liquid on the other side with respect to the processing liquid on the one side during substrate processing,
An intermediate chamber interposed between the first processing chamber and the second processing chamber;
Opening and closing each of a first opening for passing a substrate provided in a partition between the first processing chamber and the intermediate chamber and a second opening for passing a substrate provided in a partition between the intermediate chamber and the second processing chamber Shutter means for
The intermediate chamber is directed to a target opening which is one of the first opening and the second opening and is an opening between the processing chamber in which the processing liquid on the other side is used and the intermediate chamber. A gas discharging means that includes a nozzle member that discharges gas so as to form an air flow, and discharges the gas from the nozzle member when at least the target opening is open;
An exhaust unit having an exhaust port at a position between the nozzle member and the target opening, and exhausting the intermediate chamber through the exhaust port;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
By providing a partition wall in the intermediate chamber, the interior of the intermediate chamber is partitioned into a nozzle chamber including the nozzle member and an exhaust chamber including the target opening and an exhaust port, and the nozzle member includes the partition A substrate processing apparatus, wherein the gas is discharged through an opening that allows a substrate provided on a wall to pass therethrough. In the substrate processing apparatus according to claim 1 or 2,
The gas discharge means forms a gas flow that flows from the intermediate chamber side toward the processing chamber side along the surface of the substrate passing through the target opening by discharging gas from the nozzle member. A substrate processing apparatus. In the substrate processing apparatus as described in any one of Claims 1 thru | or 3,
The different processing liquids are similar processing liquids having different concentrations, and a high-concentration processing liquid is used in the first processing chamber, and the nozzle member is the second opening as the target opening. A substrate processing apparatus which discharges gas toward the substrate. The substrate processing apparatus according to claim 4,
When the exhaust means is an intermediate chamber exhaust means, a first process chamber exhaust means for exhausting the first process chamber separately from the exhaust means, and a collection for collecting the mist contained in the exhaust for reuse. And a substrate processing apparatus.

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