WO2011077977A1 - Substrate processing device and substrate processing method - Google Patents

Substrate processing device and substrate processing method Download PDF

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Publication number
WO2011077977A1
WO2011077977A1 PCT/JP2010/072269 JP2010072269W WO2011077977A1 WO 2011077977 A1 WO2011077977 A1 WO 2011077977A1 JP 2010072269 W JP2010072269 W JP 2010072269W WO 2011077977 A1 WO2011077977 A1 WO 2011077977A1
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Prior art keywords
substrate
processing
tank
transport
treatment tank
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PCT/JP2010/072269
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French (fr)
Japanese (ja)
Inventor
昌彦 沖
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シャープ株式会社
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Priority to CN201080057017.0A priority Critical patent/CN102656509B/en
Publication of WO2011077977A1 publication Critical patent/WO2011077977A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid

Definitions

  • the present invention relates to a substrate processing apparatus and a substrate processing method.
  • the present invention relates to an apparatus for cleaning a substrate such as mother glass for a liquid crystal panel.
  • a liquid crystal panel which is a component of a liquid crystal display device (LCD) has a structure in which a pair of glass substrates are opposed to each other with a predetermined gap secured.
  • the glass substrates (mother glass) for liquid crystal panels have been increasing year by year, and the liquid crystal panel production line is used to transport such large glass substrates.
  • a substrate transfer device is provided in the factory.
  • FIG. 1 is a diagram showing a configuration of a substrate processing apparatus 1000 disclosed in Patent Document 1. As shown in FIG. The substrate processing apparatus 1000 shown in FIG. 1 includes a substrate introduction unit 120, a substrate processing unit 130, and a substrate derivation unit 140 in series.
  • an upstream side device 110 and an upstream side crack detection device 111 are arranged in the substrate introduction part 120.
  • the upstream apparatus 110 continues to place the substrate 200 on the substrate introduction unit 120, and then the substrate 200 is conveyed by the roller conveyor 150.
  • the substrate processing unit 130 includes a chemical washing unit 130A, a water washing unit 130B, and a drying unit 130C.
  • the chemical washing section 130A is provided with a chemical supply nozzle 121 and a brush 122 for brushing processing.
  • the washing unit 130B is divided into a low-pressure water supply unit 124, a high-pressure water supply unit 125, an ultrasonic cleaning water supply unit 126, and a pure water supply unit 127.
  • cleaning water supply nozzles 124 a to 127 a are disposed on both the upper and lower sides of the conveyor 150.
  • the drying unit 130C performs a drying process on the substrate 200 derived from the water washing unit 130B. Inside the drying unit 130C, a pair of upper and lower air knives 128 are arranged so as to sandwich the conveyor 150 therebetween.
  • the substrate lead-out unit 140 is provided with a downstream device 114 and a downstream crack detection device 115.
  • the downstream side device 114 leads the substrate 200 downstream.
  • the substrate processing unit 130 in the substrate processing apparatus 1000 can clean and dry the substrate 200 while transporting it.
  • the inventor of the present application has found that there are the following problems when actually using a substrate processing apparatus (for example, the substrate processing apparatus 1000 shown in FIG. 1).
  • FIG. 2 is a schematic cross-sectional view showing a part of the substrate processing apparatus 2000 verified by the present inventors.
  • the substrate processing apparatus 2000 shown in FIG. 2 includes a substrate processing unit 230 including a first processing tank 230A, a second processing tank 230B, and a third processing tank 230C.
  • a conveyor 250 that conveys the substrate 200 is disposed in the first processing tank 230A, the second processing tank 230B, and the third processing tank 230C.
  • the first processing tank 230A, the second processing tank 230B, and the third processing tank 230C each have a box-like structure, and an opening 290 for moving the substrate 200 between the processing tanks. (290A, 290B) are provided.
  • the second treatment tank 230B is a wet-type cleaning treatment tank (eg, a water washing tank), and the third treatment tank 230C is a dry-type washing treatment tank (eg, a drying tank). .
  • a nozzle 210 for cleaning water is disposed in the second treatment tank 230B.
  • An air shower 212 is arranged in the third treatment tank 230C.
  • the first treatment tank 230A is a wet-type washing treatment tank (for example, a chemical solution washing tank).
  • exhaust ducts 240 are provided in the first treatment tanks 230A to 230C.
  • liquid droplets in the wet type processing tank 230B do not go to the dry type processing tank 230C.
  • the processing tank 230B and the processing tank 230C are each provided with a duct, and liquid droplets (floating mist) in the wet type processing tank 230B are sucked.
  • an air knife 215 that blows out air and creates an air wall is disposed in the processing tank 230B and the processing tank 230C so that liquid droplets in the wet-type processing tank 230B do not move.
  • the air knife 215 is a liquid cutting curtain device, and the substrate 200 can be moved in the opening 290B by the wall of air blown from the air knife 215, and the splash of the liquid is blocked.
  • FIG. 3 is a perspective view showing the periphery of the air knife 215.
  • 4 and 5 are top views showing the periphery of the air knife 215.
  • FIG. 3 is a perspective view showing the periphery of the air knife 215.
  • the width W2 of the air knife 215 extends to cover the width W1 of the substrate 200.
  • FIG. 5 even when the width W of the opening 290B is the same as or narrower than the width W2 of the air knife 215, an air flow 300 passing through the gap S and the opening 290B is generated while avoiding the air knife 215. Can do.
  • the treatment tank 230C may adhere to the substrate 200.
  • the present invention has been made in view of such a point, and a main object thereof is to provide a substrate processing apparatus in which movement of liquid droplets (floating mist) between processing tanks is suppressed.
  • a substrate processing apparatus is a substrate processing apparatus for processing a substrate, and includes a first processing tank including a transport roller capable of transporting a substrate, and a second processing tank connected to the first processing tank.
  • the transport roller from the first processing tank extends in the second processing tank, and a boundary region between the first processing tank and the second processing tank includes a pair of liquids.
  • a cutting curtain device is arranged, and at least one of the conveying rollers arranged between the pair of liquid cutting curtain devices has air blow holes at both ends of a conveying shaft constituting a central portion of the conveying roller. Is a conveyance roller formed.
  • the first processing tank is a wet-type processing tank
  • the second processing tank is a dry-type processing tank.
  • the width of the transport shaft is larger than the width of the liquid draining curtain device, and a portion of the both ends of the transport shaft located outside the liquid draining curtain device is The air blow hole is formed.
  • the transport shaft has a hollow structure, and a gas to be ejected from the air blow hole is introduced into the transport shaft.
  • each of the pair of liquid curtain devices is composed of an upper curtain portion and a lower curtain portion.
  • the substrate is a mother glass for a liquid crystal panel.
  • a substrate processing method according to the present invention is a substrate processing method for processing a substrate.
  • a pair of liquid curtain devices emits gas to block the movement of floating mist between the first treatment tank and the second treatment tank.
  • the conveyance roller according to the present invention is a conveyance roller for conveying a substrate, and includes a conveyance shaft and a substrate contact portion that is provided on an outer surface of the conveyance shaft and contacts the substrate, and the conveyance shaft has a hollow structure. Air blow holes for ejecting gas are formed at both ends of the transport shaft.
  • a pair of liquid-cutting curtain devices are disposed in a boundary region between the first processing tank and the second processing tank, and a transport roller is disposed between the pair of liquid-cutting curtain devices. At least one of them is a transport roller having air blow holes formed at both ends of the transport shaft. Therefore, the movement of the liquid splash (floating mist) which goes around to both ends of the transport shaft can be suppressed by the air blown out from the air blow holes formed at both ends of the transport shaft.
  • FIG. 2 is a cross-sectional view showing a configuration of a substrate processing apparatus 2000.
  • FIG. 3 is a perspective view showing a configuration around an air knife 215.
  • FIG. 4 is a top view showing a configuration around an air knife 215.
  • FIG. 4 is a top view showing a configuration around an air knife 215.
  • FIG. It is sectional drawing which shows the structure of the substrate processing apparatus 100 which concerns on embodiment of this invention. It is a top view which shows the structure of the conveyance roller 30 and the air knife 15 which concern on embodiment of this invention. It is a perspective view which shows the structure of the conveyance roller 30 which concerns on embodiment of this invention. It is sectional drawing which shows the modification of the substrate processing apparatus 100 which concerns on embodiment of this invention.
  • FIG. 6 schematically shows the configuration of the substrate processing apparatus 100 according to the embodiment of the present invention.
  • the substrate processing apparatus 100 of this embodiment is an apparatus for processing the substrate 20, and is connected to the first processing tank 10A including a transfer roller 32 (32a) capable of transferring the substrate 20 and the first processing tank 10A. And a second treatment tank 10B.
  • the substrate 20 of this embodiment is, for example, a substrate for a liquid crystal panel, a substrate for a PDP (plasma display panel), or the like.
  • the substrate 20 in the example shown in FIG. 6 is a mother glass for a liquid crystal panel (for example, an 8th generation to 10th generation mother glass).
  • the second treatment tank 10B is provided with a conveyance roller 32 (32b), and this conveyance roller 32 (32b) is an extension of the conveyance roller 32 (32a) of the first treatment tank 10A.
  • Each of the first processing tank 10A and the second processing tank 10B in the present embodiment has a box shape.
  • the first treatment tank 10A has an opening 11A on the second treatment tank 10B side, while the second treatment tank 10B has an opening 11B on the first treatment tank 10A side.
  • the openings 11A and 11B have a shape that allows the substrate 20 to pass through, and a substrate conveyor 33 including transport rollers 32 is provided through the first processing tank 10A and the second processing tank 10B.
  • the transport roller 32 can rotate as indicated by an arrow 55, and the substrate 20 moves on the transport roller 32 from the first processing tank 10A to the second processing tank 10B along the rotation (arrow 50). .
  • An opening 13A is provided on the upstream side of the first processing tank 10A, and an opening 13B is provided on the downstream side of the second processing tank 10B.
  • the substrate conveyor 33 including the transport rollers 32 extends both to the upstream side of the first processing tank 10A and to the downstream side of the second processing tank 10B.
  • the first treatment tank 10A of the present embodiment is a wet-type treatment tank
  • the second treatment tank 10B is a dry-type treatment tank.
  • wet-type substrate cleaning processing can be executed in the first processing tank 10A
  • dry-type substrate cleaning processing can be executed in the second processing tank 10B.
  • the cleaning liquid nozzles 12 are arranged both above and below the transport roller 32.
  • a cleaning brush may be disposed in the first treatment tank 10A.
  • the first processing tank 10A is a chemical cleaning tank
  • chemical liquid is ejected from the cleaning liquid nozzle 12
  • water for example, low pressure
  • water for example, low pressure
  • the air shower 14 is arrange
  • the duct 40 is provided in the 1st processing tank 10A and the 2nd processing tank 10B, and the air in each processing tank can be sucked out.
  • a pair of liquid curtain devices 15A and 15B are disposed in the boundary region 60 between the first treatment tank 10A and the second treatment tank 10B.
  • the liquid curtain device 15 (15A, 15B) is an air knife that blows out air to create an air wall. The movement of the floating mist can be blocked by discharging gas (air) from the liquid draining curtain (air knife) 15. Specifically, the liquid splash (floating mist) generated in the first treatment tank 10A enters the second treatment tank 10B through the openings 11A and 11B existing in the boundary region 60. However, the liquid curtain 15 (15A, 15B) prevents the floating mist from entering. In the configuration example shown in FIG.
  • the liquid draining curtain device 15 ⁇ / b> A of the first processing tank 10 ⁇ / b> A includes an upper curtain portion and a lower curtain portion with the conveyance roller 32 interposed therebetween.
  • the liquid curtain device 15B of the second treatment tank 10B is also composed of an upper curtain portion and a lower curtain portion with the conveyance roller 32 interposed therebetween.
  • the air 19 can be ejected from both ends of the transport rollers 30 disposed between the pair of liquid curtain devices 15A and 15B. ing. That is, at least one of the transport rollers 30 (30a, 30b) disposed between the pair of liquid curtain devices 15A and 15B has air blow holes at both ends of the transport shaft constituting the central portion of the transport roller. It is the formed conveyance roller 30, and the air 19 is injected from the air blow hole.
  • the conveyance roller 30a provided with the air blow hole is arranged in the first treatment tank 10A, and the conveyance roller 30b provided with the air blow hole is arranged also in the second treatment tank 10B. .
  • FIG. 7 is a top view showing the periphery of the transport roller 30 (30b) in the second treatment tank 10B.
  • the conveyance roller 30 b of the present embodiment includes a substrate contact portion (disk portion) 31 that contacts the substrate 20 and a conveyance shaft 34 that extends through the center of the substrate contact portion 31.
  • the substrate contact portion 31 is provided on the outer surface of the transport shaft 34, but the substrate contact portion 31 and the transport shaft 34 may be integrated.
  • the transport shaft 34 has a hollow shape (cylindrical shape), and air blow holes 35 are formed at both ends 36 of the transport shaft 34.
  • the width W3 of the transport shaft 34 is larger than the width W2 of the liquid curtain device 15 (15B).
  • An air blow hole 35 is formed in a part (a part located in the region 65) of the both ends 36 of the transport shaft 34 located outside the liquid curtain device 15 (15 ⁇ / b> B).
  • FIG. 8 is an enlarged perspective view showing the periphery of both end portions 36 of the transport roller 30. Since the conveying shaft 34 of the conveying roller 30 has a hollow structure, when air is introduced into the conveying shaft 34, the air 19 can be ejected from the air blow hole 35.
  • an air introducing tube 38 may be connected to the end of the conveying shaft 34 and air may be introduced from the tube 38.
  • the air introduced from the tube 38 is, for example, dry air, but other gases (for example, nitrogen, argon, etc.) may be used. From the viewpoint of the production line, the same gas (for example, dry air) used for the liquid curtain device 15B (and / or the air shower 14) used in the second treatment tank 10B is introduced from the tube 38 to the transport roller 30. It is efficient to do.
  • a pair of liquid curtain devices 15 ⁇ / b> A and 15 ⁇ / b> B are disposed in a boundary region 60 between the first processing tank 10 ⁇ / b> A and the second processing tank 10 ⁇ / b> B.
  • At least one of the transport rollers arranged between the pair of liquid curtain devices 15A and 15B is a transport roller 30 (30a and / or 30b) in which an air blow hole 35 is formed. Therefore, the floating mist 92 generated in the first treatment tank 10A rides on the airflow 90, passes around the outside of the liquid cutting curtain device 15A, passes through the openings 11A and 11B, and then the liquid cutting curtain device.
  • the movement of the floating mist 92 can be suppressed by the air 19 from the air blow hole 35. That is, the movement (arrow 90) of the floating mist 92 that wraps around the both end portions 36 of the transport shaft 34 can be suppressed by the air 19 ejected from the air blow hole 35.
  • the floating mist 92 from the first treatment tank 10A to the second treatment tank 10B is caused by the air wall 17 from the liquid draining curtain devices 15A and 15B and the air blow 19 from the air blow hole 35. Movement can be suppressed. As a result, it is possible to suppress the floating mist (that is, foreign matter) 92 from adhering to the substrate 20 existing in the second processing tank, and thus it is possible to reduce the cause of defects in the manufacturing process of the next process. .
  • the dimensions of the configuration of the present embodiment will be described as an example as follows.
  • the width W2 of the liquid curtain device 15 (15A, 15B) is 250 to 3230 mm, for example, and the width W3 of the transport shaft 34 is 300 to 3500 mm, for example.
  • the diameter of the conveying shaft 34 is, for example, 25 to 50 mm.
  • the diameter (in the case of a circle) of the air blow hole 35 formed in the transport shaft 34 is, for example, 0.1 to 2.0 mm.
  • the air blow hole 35 may be formed only in the upper region and the lower region of the conveyance shaft 34 in addition to the case where the air blow hole 35 is formed on the entire outer periphery of the conveyance shaft 34.
  • the attached conveyance roller 30a is provided, the effect of suppressing the movement of the floating mist 92 can be enhanced.
  • the conveyance roller 30 (30a, 30b) with the air blow hole 35 is arrange
  • the substrate processing method of the present embodiment first, after the substrate 20 is carried into the first processing tank 10A by the transport roller 32, the substrate 20 is moved by the transport roller 32 while the substrate 20 is moved by the first processing tank 10A. To process. Next, after the substrate 20 is carried into the second processing tank 10B by the transport roller 32, the substrate 20 is processed in the second processing tank 10B while the substrate 20 is moved by the transport roller 32.
  • the cleaning process by the wet process is performed in the first processing tank 10A
  • the drying process by the dry process is performed in the second processing tank 10B. Is also possible.
  • the wet treatment can be performed in the second treatment tank 10B, and in this case, the first treatment tank 10A flows into the first treatment tank 10A.
  • the movement of the floating mist 92 can be suppressed by the mechanism (15A, 15B, 30) of the present embodiment.
  • the substrate processing of the present embodiment can be applied not only to the cleaning and drying process of the substrate 20 but also to other processing.
  • the present invention can be applied to a coating process and a drying process of the substrate 20.
  • the floating mist 92 of a liquid (for example, a chemical solution) used in the first treatment tank 10A is second. If the manufacturing process is hindered by flowing into the treatment tank 10B, the mechanism of this embodiment can be applied. Even if the first treatment tank 10A is a dry treatment and the second treatment tank 10B is a dry treatment, suspended matters (for example, suspended particles) used in the first treatment tank 10A are the second treatment tank. Even when it is desired to suppress the flow into 10B, the mechanism of this embodiment can be used.
  • FIG. 9 is a cross-sectional view showing a modified example of the substrate processing apparatus 100 of the present embodiment.
  • dry processing is performed in the first processing tank 10A
  • wet processing is performed in the second processing tank 10B.
  • the heater 45 for heating the substrate 20 is disposed in the first processing tank 10A, and the first process is performed before the wet process (for example, the cleaning process) is performed in the second processing tank 10B.
  • a heating process (preliminary process for the next process) of the substrate 20 is performed in the tank 10A.

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  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning In General (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Provided is a substrate processing device in which movement of floating mist between processing tanks is suppressed. A substrate processing device (100) for processing a substrate (20) is provided with: a first processing tank (10A) which includes a conveying roller (32) that can convey the substrate (20); and a second processing tank (10B) which is linked to the first processing tank (10A). The conveying roller (32) extends to and is present in the second processing tank (10B), a pair of liquid-removing curtain devices (15A, 15B) are disposed in a boundary region (60) between the first processing tank (10A) and the second processing tank (10B), and at least one of the conveying rollers (30) disposed between the pair of liquid-removing curtain devices (15A, 15B) has air blow holes (35) formed at both ends (36) of a conveying shaft (34).

Description

基板処理装置および基板処理方法Substrate processing apparatus and substrate processing method
 本発明は、基板処理装置および基板処理方法に関する。特に、液晶パネル用のマザーガラスのような基板を洗浄する装置に関する。
 なお、本出願は2009年12月21日に出願された日本国特許出願2009-289241号に基づく優先権を主張しており、その出願の全内容は本明細書中に参照として組み入れられている。
The present invention relates to a substrate processing apparatus and a substrate processing method. In particular, the present invention relates to an apparatus for cleaning a substrate such as mother glass for a liquid crystal panel.
Note that this application claims priority based on Japanese Patent Application No. 2009-289241 filed on Dec. 21, 2009, the entire contents of which are incorporated herein by reference. .
 液晶表示装置(LCD)の構成部品である液晶パネルは、一対のガラス基板を所定のギャップを確保した状態で対向させた構造を有している。液晶パネルの大型化・量産化に伴って、液晶パネル用のガラス基板(マザーガラス)は年々大型化しており、液晶パネルの製造ラインにおいては、そのように大型化したガラス基板を搬送するための基板搬送装置が工場内に設けられている。 A liquid crystal panel, which is a component of a liquid crystal display device (LCD), has a structure in which a pair of glass substrates are opposed to each other with a predetermined gap secured. With the increase in size and mass production of liquid crystal panels, the glass substrates (mother glass) for liquid crystal panels have been increasing year by year, and the liquid crystal panel production line is used to transport such large glass substrates. A substrate transfer device is provided in the factory.
 近年、液晶パネル用のガラス基板に対して処理を行う処理装置では、効率化の観点から基板を搬送しながら各種処理を施すことが多い(例えば、特許文献1)。また、ガラス基板を搬送させながら洗浄する装置は、例えば、特許文献2にも開示されている。 In recent years, a processing apparatus that performs processing on a glass substrate for a liquid crystal panel often performs various types of processing while conveying the substrate from the viewpoint of efficiency (for example, Patent Document 1). Moreover, the apparatus which wash | cleans it, conveying a glass substrate is also disclosed by patent document 2, for example.
 図1は、特許文献1に開示された基板処理装置1000の構成を示す図である。図1に示した基板処理装置1000は、基板導入部120と、基板処理部130と、基板導出部140とを直列に備えている。 FIG. 1 is a diagram showing a configuration of a substrate processing apparatus 1000 disclosed in Patent Document 1. As shown in FIG. The substrate processing apparatus 1000 shown in FIG. 1 includes a substrate introduction unit 120, a substrate processing unit 130, and a substrate derivation unit 140 in series.
 まず、基板導入部120には、上流側引き続き装置110と、上流側割れ検出装置111とが配置されている。上流側引き続き装置110は、基板200を基板導入部120に載せ、その後、基板200は、ローラコンベア150によって搬送される。 First, in the substrate introduction part 120, an upstream side device 110 and an upstream side crack detection device 111 are arranged. The upstream apparatus 110 continues to place the substrate 200 on the substrate introduction unit 120, and then the substrate 200 is conveyed by the roller conveyor 150.
 次に、基板処理部130は、薬洗部130A、水洗部130Bと、乾燥部130Cとから構成されている。薬洗部130Aには、薬液供給ノズル121と、ブラッシング処理用のブラシ122が設けられている。水洗部130Bは、低圧水供給部124、高圧水供給部125、超音波洗浄水供給部126および純水供給部127に区分されている。各供給部124~127には、それぞれコンベア150の上下両側に洗浄水供給用のノズル124a~127a等が配置されている。乾燥部130Cは、水洗部130Bから導出された基板200に乾燥処理を施すものである。乾燥部130Cの内部には、コンベア150を挟むように、上下一対のエアナイフ128が配置されている。 Next, the substrate processing unit 130 includes a chemical washing unit 130A, a water washing unit 130B, and a drying unit 130C. The chemical washing section 130A is provided with a chemical supply nozzle 121 and a brush 122 for brushing processing. The washing unit 130B is divided into a low-pressure water supply unit 124, a high-pressure water supply unit 125, an ultrasonic cleaning water supply unit 126, and a pure water supply unit 127. In each of the supply units 124 to 127, cleaning water supply nozzles 124 a to 127 a are disposed on both the upper and lower sides of the conveyor 150. The drying unit 130C performs a drying process on the substrate 200 derived from the water washing unit 130B. Inside the drying unit 130C, a pair of upper and lower air knives 128 are arranged so as to sandwich the conveyor 150 therebetween.
 また、基板導出部140には、下流側引き続き装置114と、下流側割れ検出装置115とが配置されている。下流側引き続き装置114は、基板200を下流に導出するものである。 Also, the substrate lead-out unit 140 is provided with a downstream device 114 and a downstream crack detection device 115. The downstream side device 114 leads the substrate 200 downstream.
 ここで、基板200は、搬送開始位置P1に導入された後、コンベア150で搬送され、次いで、基板停止位置P2まで移動する。そして、基板処理装置1000における基板処理部130で、基板200を搬送させながら洗浄・乾燥することができる。 Here, after the substrate 200 is introduced to the conveyance start position P1, it is conveyed by the conveyor 150, and then moves to the substrate stop position P2. Then, the substrate processing unit 130 in the substrate processing apparatus 1000 can clean and dry the substrate 200 while transporting it.
特開2007-225324号公報JP 2007-225324 A 特開平3-29919号公報JP-A-3-29919
 本願発明者は、基板処理装置(例えば、図1に示した基板処理装置1000)を実際に使用する場合には、以下のような課題があることを見出した。 The inventor of the present application has found that there are the following problems when actually using a substrate processing apparatus (for example, the substrate processing apparatus 1000 shown in FIG. 1).
 図2は、本願発明者が検証した基板処理装置2000の一部を示す断面模式図である。図2に示した基板処理装置2000には、第1処理槽230A、第2処理槽230B、第3処理槽230Cからなる基板処理部230が設けられている。第1処理槽230A、第2処理槽230B、第3処理槽230Cには、基板200を搬送するコンベア250が配置されている。また、第1処理槽230A、第2処理槽230B、第3処理槽230Cは、それぞれ、箱形の構造をしており、各処理槽の間には、基板200が移動するための開口部290(290A、290B)が設けられている。 FIG. 2 is a schematic cross-sectional view showing a part of the substrate processing apparatus 2000 verified by the present inventors. The substrate processing apparatus 2000 shown in FIG. 2 includes a substrate processing unit 230 including a first processing tank 230A, a second processing tank 230B, and a third processing tank 230C. A conveyor 250 that conveys the substrate 200 is disposed in the first processing tank 230A, the second processing tank 230B, and the third processing tank 230C. The first processing tank 230A, the second processing tank 230B, and the third processing tank 230C each have a box-like structure, and an opening 290 for moving the substrate 200 between the processing tanks. (290A, 290B) are provided.
 図2に示した例では、第2処理槽230Bはウエット型の洗浄処理槽(例えば、水洗浄槽)であり、第3処理槽230Cはドライ型の洗浄処理槽(例えば、乾燥槽)である。第2処理槽230Bには、洗浄水用のノズル210が配置されている。また、第3処理槽230Cには、エアシャワー212が配置されている。なお、この例で第1処理槽230Aはウエット型の洗浄処理槽(例えば、薬液洗浄槽)である。また、第1処理槽230Aから230Cには、排気用のダクト240が設けられている。 In the example shown in FIG. 2, the second treatment tank 230B is a wet-type cleaning treatment tank (eg, a water washing tank), and the third treatment tank 230C is a dry-type washing treatment tank (eg, a drying tank). . A nozzle 210 for cleaning water is disposed in the second treatment tank 230B. An air shower 212 is arranged in the third treatment tank 230C. In this example, the first treatment tank 230A is a wet-type washing treatment tank (for example, a chemical solution washing tank). Further, exhaust ducts 240 are provided in the first treatment tanks 230A to 230C.
 この基板処理装置2000の構成では、ウエット型の処理槽230Bにおける液体の飛沫が、ドライ型の処理槽230Cの方に行かないようにされている。具体的には、処理槽230Bおよび処理槽230Cはそれぞれダクトが設けられて、ウエット型の処理槽230Bにおける液体の飛沫(浮遊ミスト)は吸引される構造となっている。また、処理槽230Bおよび処理槽230Cには、ウエット型の処理槽230Bにおける液体の飛沫が移動しないように、エアを噴き出して空気壁を作り出すエアナイフ215が配置されている。このエアナイフ215は、液切りカーテン装置であり、エアナイフ215から噴き出されるエアの壁によって、開口部290Bにおいて基板200は移動でき、且つ、当該液体の飛沫は遮断される。 In the configuration of the substrate processing apparatus 2000, liquid droplets in the wet type processing tank 230B do not go to the dry type processing tank 230C. Specifically, the processing tank 230B and the processing tank 230C are each provided with a duct, and liquid droplets (floating mist) in the wet type processing tank 230B are sucked. In addition, an air knife 215 that blows out air and creates an air wall is disposed in the processing tank 230B and the processing tank 230C so that liquid droplets in the wet-type processing tank 230B do not move. The air knife 215 is a liquid cutting curtain device, and the substrate 200 can be moved in the opening 290B by the wall of air blown from the air knife 215, and the splash of the liquid is blocked.
 しかしながら、本願発明者の観測によると、実際には、エアナイフ215があるにもかかわらず、ウエット型の処理槽230Bからドライ型の処理槽230Cの方に流れる気流300が発生することがわかった。その気流300に乗って液体の飛沫310が、処理槽230Bから処理槽230Cに移動して、処理槽230Cに位置する基板200の上に付着する場合があった。洗浄後の基板200の上に異物(ここでは、飛沫)310が付着することは、次工程の製造プロセスにおける不良の原因になりかねないので好ましくない。 However, according to the observation of the present inventor, it was actually found that an airflow 300 flowing from the wet type processing tank 230B to the dry type processing tank 230C is generated despite the presence of the air knife 215. The droplets 310 of the liquid riding on the airflow 300 may move from the processing bath 230B to the processing bath 230C and adhere to the substrate 200 located in the processing bath 230C. It is not preferable that a foreign substance (here, splash) 310 adheres to the substrate 200 after cleaning because it may cause a defect in the manufacturing process of the next process.
 この気流300の発生の原因を本願発明者が推測したところ、次のような結論に至った。図3は、エアナイフ215周辺を示す斜視図である。また、図4及び図5は、エアナイフ215周辺を示す上面図である。 The inventor of the present application estimated the cause of the generation of the airflow 300, and reached the following conclusion. FIG. 3 is a perspective view showing the periphery of the air knife 215. 4 and 5 are top views showing the periphery of the air knife 215. FIG.
 図3に示すように、エアナイフ215の幅W2は、基板200の幅W1を覆うように延びている。しかし、図4からわかるように、エアナイフ215の端部215eと処理槽230B(又は処理槽230C)の壁面230eとの間には隙間Sがある。すると、図5に示すように、エアナイフ215の幅W2と比べて、開口部290Bの幅Wがそれと同じ又は狭い場合でも、エアナイフ215を避けながら、隙間Sおよび開口部290Bを通る気流300が発生し得る。このような気流300に液体の飛沫が乗ると、処理槽230Cにおける基板200への付着が生じる場合が出てくる。 As shown in FIG. 3, the width W2 of the air knife 215 extends to cover the width W1 of the substrate 200. However, as can be seen from FIG. 4, there is a gap S between the end 215e of the air knife 215 and the wall surface 230e of the processing bath 230B (or processing bath 230C). Then, as shown in FIG. 5, even when the width W of the opening 290B is the same as or narrower than the width W2 of the air knife 215, an air flow 300 passing through the gap S and the opening 290B is generated while avoiding the air knife 215. Can do. When liquid droplets get on such an air flow 300, the treatment tank 230C may adhere to the substrate 200.
 本発明はかかる点に鑑みてなされたものであり、その主な目的は、処理槽の間の液体の飛沫(浮遊ミスト)の移動を抑制した基板処理装置を提供することにある。 The present invention has been made in view of such a point, and a main object thereof is to provide a substrate processing apparatus in which movement of liquid droplets (floating mist) between processing tanks is suppressed.
 本発明に係る基板処理装置は、基板の処理を行う基板処理装置であり、基板を搬送可能な搬送ローラを含む第1処理槽と、前記第1処理槽に連結された第2処理槽とを備え、前記第2処理槽には、前記第1処理槽からの前記搬送ローラが延長して存在しており、前記第1処理槽と前記第2処理槽との境界領域には、一対の液切りカーテン装置が配置されており、前記一対の液切りカーテン装置の間に配置されている前記搬送ローラのうち少なくとも1つは、前記搬送ローラの中心部を構成する搬送シャフトの両端部にエアブロー穴が形成された搬送ローラである。
 ある好適な実施形態において、前記第1処理槽は、ウエット型の処理槽であり、そして、前記第2処理槽は、ドライ型の処理槽である。
 ある好適な実施形態において、前記液切りカーテン装置の幅よりも、前記搬送シャフトの幅の方が大きく、前記搬送シャフトの両端部のうちの、前記液切りカーテン装置の外側に位置する部分には、前記エアブロー穴が形成されている。
 ある好適な実施形態において、前記搬送シャフトは、中空構造を有しており、前記搬送シャフトの内部には、前記エアブロー穴から噴き出させるための気体が導入される。
 ある好適な実施形態において、前記一対の液切りカーテン装置は、それぞれ、上側カーテン部位と下側カーテン部位とから構成されている。
 ある好適な実施形態において、前記基板は、液晶パネル用のマザーガラスである。
 本発明に係る基板処理方法は、基板を処理する基板処理方法であり、搬送ローラによって第1処理槽に基板を搬入する工程(a)と、前記搬送ローラによって前記基板を移動させながら、前記第1処理槽で前記基板を処理する第1処理工程(b)と、前記搬送ローラによって前記基板を、前記第1処理槽から、前記第1処理槽に接続した第2処理槽に搬入する工程(c)と、前記搬送ローラによって前記基板を移動させながら、前記第2処理槽で前記基板を処理する第2処理工程(d)とを含み、前記第1処理槽と前記第2処理槽との境界領域では、一対の液切りカーテン装置が気体を出すことによって、前記第1処理槽と前記第2処理槽との間における浮遊ミストの移動を遮断しており、前記一対の液切りカーテン装置の間に配置されている前記搬送ローラのうち少なくとも1つにおいては、前記搬送ローラの中心部を構成する搬送シャフトの両端部から気体を出すことによって、前記一対の液切りカーテン装置の外側を回り込む浮遊ミストの移動を遮断している。
 ある好適な実施形態において、前記第1処理工程(b)では、ウエット型の基板洗浄処理が実行され、そして、前記第2処理工程(d)では、ドライ型の基板洗浄処理が実行される。
 ある好適な実施形態において、前記基板は、液晶パネル用のマザーガラスである。
 本発明に係る搬送ローラは、基板を搬送するための搬送ローラであり、搬送シャフトと、前記搬送シャフトの外面に設けられ、基板と接触する基板接触部とを備え、前記搬送シャフトは、中空構造を有しており、前記搬送シャフトの両端部には、気体を噴き出すためのエアブロー穴が形成されている。
A substrate processing apparatus according to the present invention is a substrate processing apparatus for processing a substrate, and includes a first processing tank including a transport roller capable of transporting a substrate, and a second processing tank connected to the first processing tank. The transport roller from the first processing tank extends in the second processing tank, and a boundary region between the first processing tank and the second processing tank includes a pair of liquids. A cutting curtain device is arranged, and at least one of the conveying rollers arranged between the pair of liquid cutting curtain devices has air blow holes at both ends of a conveying shaft constituting a central portion of the conveying roller. Is a conveyance roller formed.
In a preferred embodiment, the first processing tank is a wet-type processing tank, and the second processing tank is a dry-type processing tank.
In a preferred embodiment, the width of the transport shaft is larger than the width of the liquid draining curtain device, and a portion of the both ends of the transport shaft located outside the liquid draining curtain device is The air blow hole is formed.
In a preferred embodiment, the transport shaft has a hollow structure, and a gas to be ejected from the air blow hole is introduced into the transport shaft.
In a preferred embodiment, each of the pair of liquid curtain devices is composed of an upper curtain portion and a lower curtain portion.
In a preferred embodiment, the substrate is a mother glass for a liquid crystal panel.
A substrate processing method according to the present invention is a substrate processing method for processing a substrate. The step (a) of loading a substrate into a first processing tank by a transport roller, and the substrate is moved by the transport roller while moving the substrate. A first processing step (b) for processing the substrate in one processing tank, and a step of carrying the substrate from the first processing tank into a second processing tank connected to the first processing tank by the transport roller ( c) and a second processing step (d) of processing the substrate in the second processing tank while moving the substrate by the transport roller, and the first processing tank and the second processing tank In the boundary region, a pair of liquid curtain devices emits gas to block the movement of floating mist between the first treatment tank and the second treatment tank. Placed between At least one of the transport rollers blocks the movement of the floating mist that goes around the outside of the pair of liquid draining curtain devices by discharging gas from both ends of the transport shaft that constitutes the center of the transport roller. ing.
In a preferred embodiment, a wet type substrate cleaning process is executed in the first processing step (b), and a dry type substrate cleaning process is executed in the second processing step (d).
In a preferred embodiment, the substrate is a mother glass for a liquid crystal panel.
The conveyance roller according to the present invention is a conveyance roller for conveying a substrate, and includes a conveyance shaft and a substrate contact portion that is provided on an outer surface of the conveyance shaft and contacts the substrate, and the conveyance shaft has a hollow structure. Air blow holes for ejecting gas are formed at both ends of the transport shaft.
 本発明の基板処理装置では、第1処理槽と第2処理槽との境界領域に、一対の液切りカーテン装置が配置されており、一対の液切りカーテン装置の間に配置されている搬送ローラのうち少なくとも1つは、搬送シャフトの両端部にエアブロー穴が形成された搬送ローラである。したがって、搬送シャフトの両端部に形成されたエアブロー穴から噴き出されるエアによって、搬送シャフトの両端部に回り込む液体の飛沫(浮遊ミスト)の移動を抑制することができる。 In the substrate processing apparatus of the present invention, a pair of liquid-cutting curtain devices are disposed in a boundary region between the first processing tank and the second processing tank, and a transport roller is disposed between the pair of liquid-cutting curtain devices. At least one of them is a transport roller having air blow holes formed at both ends of the transport shaft. Therefore, the movement of the liquid splash (floating mist) which goes around to both ends of the transport shaft can be suppressed by the air blown out from the air blow holes formed at both ends of the transport shaft.
従来の基板処理装置1000の構成を示す図である。It is a figure which shows the structure of the conventional substrate processing apparatus 1000. FIG. 基板処理装置2000の構成を示す断面図である。2 is a cross-sectional view showing a configuration of a substrate processing apparatus 2000. FIG. エアナイフ215の周辺の構成を示す斜視図である。3 is a perspective view showing a configuration around an air knife 215. FIG. エアナイフ215の周辺の構成を示す上面図である。4 is a top view showing a configuration around an air knife 215. FIG. エアナイフ215の周辺の構成を示す上面図である。4 is a top view showing a configuration around an air knife 215. FIG. 本発明の実施形態に係る基板処理装置100の構成を示す断面図である。It is sectional drawing which shows the structure of the substrate processing apparatus 100 which concerns on embodiment of this invention. 本発明の実施形態に係る搬送ローラ30及びエアナイフ15の構成を示す上面図である。It is a top view which shows the structure of the conveyance roller 30 and the air knife 15 which concern on embodiment of this invention. 本発明の実施形態に係る搬送ローラ30の構成を示す斜視図である。It is a perspective view which shows the structure of the conveyance roller 30 which concerns on embodiment of this invention. 本発明の実施形態に係る基板処理装置100の改変例を示す断面図である。It is sectional drawing which shows the modification of the substrate processing apparatus 100 which concerns on embodiment of this invention.
 以下、図面を参照しながら、本発明の実施形態を説明する。以下の図面においては、説明の簡潔化のために、実質的に同一の機能を有する構成要素を同一の参照符号で示す。なお、本発明は以下の実施形態に限定されない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, components having substantially the same function are denoted by the same reference numerals for the sake of brevity. In addition, this invention is not limited to the following embodiment.
 図6は、本発明に係る実施形態の基板処理装置100の構成を模式的に示している。本実施形態の基板処理装置100は、基板20の処理を行う装置であり、基板20を搬送可能な搬送ローラ32(32a)を含む第1処理槽10Aと、第1処理槽10Aに連結された第2処理槽10Bとを備えている。本実施形態の基板20は、例えば、液晶パネル用の基板、PDP(プラズマ・ディスプレイ・パネル)用の基板などである。図6に示した例の基板20は、液晶パネル用のマザーガラス(例えば、第8世代~第10世代のマザーガラス)である。 FIG. 6 schematically shows the configuration of the substrate processing apparatus 100 according to the embodiment of the present invention. The substrate processing apparatus 100 of this embodiment is an apparatus for processing the substrate 20, and is connected to the first processing tank 10A including a transfer roller 32 (32a) capable of transferring the substrate 20 and the first processing tank 10A. And a second treatment tank 10B. The substrate 20 of this embodiment is, for example, a substrate for a liquid crystal panel, a substrate for a PDP (plasma display panel), or the like. The substrate 20 in the example shown in FIG. 6 is a mother glass for a liquid crystal panel (for example, an 8th generation to 10th generation mother glass).
 第2処理槽10Bには、搬送ローラ32(32b)が設けられており、この搬送ローラ32(32b)は、第1処理槽10Aの搬送ローラ32(32a)が延長したものである。本実施形態における第1処理槽10Aおよび第2処理槽10Bは、それぞれ箱型形状をしている。第1処理槽10Aには、第2処理槽10B側に開口部11Aが形成されており、一方、第2処理槽10Bには、第1処理槽10A側に開口部11Bが形成されている。開口部11Aおよび11Bは、基板20が通過可能な形状を有しており、そして、第1処理槽10Aおよび第2処理槽10Bを通じて、搬送ローラ32からなる基板コンベア33が設けられている。搬送ローラ32は矢印55のように回転可能であり、その回転に沿って、基板20は、搬送ローラ32の上で第1処理槽10Aから第2処理槽10Bまで移動していく(矢印50)。なお、第1処理槽10Aの上流側には開口部13Aが設けられており、第2処理槽10Bの下流側には開口部13Bが設けられている。そして、搬送ローラ32からなる基板コンベア33は、第1処理槽10Aの上流側にも、第2処理槽10Bの下流側にも延びている。 The second treatment tank 10B is provided with a conveyance roller 32 (32b), and this conveyance roller 32 (32b) is an extension of the conveyance roller 32 (32a) of the first treatment tank 10A. Each of the first processing tank 10A and the second processing tank 10B in the present embodiment has a box shape. The first treatment tank 10A has an opening 11A on the second treatment tank 10B side, while the second treatment tank 10B has an opening 11B on the first treatment tank 10A side. The openings 11A and 11B have a shape that allows the substrate 20 to pass through, and a substrate conveyor 33 including transport rollers 32 is provided through the first processing tank 10A and the second processing tank 10B. The transport roller 32 can rotate as indicated by an arrow 55, and the substrate 20 moves on the transport roller 32 from the first processing tank 10A to the second processing tank 10B along the rotation (arrow 50). . An opening 13A is provided on the upstream side of the first processing tank 10A, and an opening 13B is provided on the downstream side of the second processing tank 10B. The substrate conveyor 33 including the transport rollers 32 extends both to the upstream side of the first processing tank 10A and to the downstream side of the second processing tank 10B.
 本実施形態の第1処理槽10Aは、ウエット型の処理槽であり、そして、第2処理槽10Bは、ドライ型の処理槽である。図6に示した例では、第1処理槽10Aでは、ウエット型の基板洗浄処理を実行することができ、一方、第2処理槽10Bでは、ドライ型の基板洗浄処理を実行することができる。第1処理槽10Aには、搬送ローラ32の上下両方に、洗浄液用のノズル12が配置されている。図示していないが、第1処理槽10Aに、洗浄用のブラシを配置することも可能である。なお、第1処理槽10Aが薬液洗浄槽の場合、洗浄液用のノズル12からは薬液が噴射され、第1処理槽10Aが水洗浄槽の場合、洗浄液用のノズル12からは水(例えば、低圧水、高圧水、超音波洗浄水、純水など)が噴射される。また、第2処理槽10Bには、エアシャワー14が配置されている。エアシャワー14からは、例えば、乾燥空気が噴射される。また、第1処理槽10Aおよび第2処理槽10Bには、ダクト40が設けられており、各処理槽の中の空気を吸い出すことができる。 The first treatment tank 10A of the present embodiment is a wet-type treatment tank, and the second treatment tank 10B is a dry-type treatment tank. In the example shown in FIG. 6, wet-type substrate cleaning processing can be executed in the first processing tank 10A, while dry-type substrate cleaning processing can be executed in the second processing tank 10B. In the first treatment tank 10 </ b> A, the cleaning liquid nozzles 12 are arranged both above and below the transport roller 32. Although not shown, a cleaning brush may be disposed in the first treatment tank 10A. When the first processing tank 10A is a chemical cleaning tank, chemical liquid is ejected from the cleaning liquid nozzle 12, and when the first processing tank 10A is a water cleaning tank, water (for example, low pressure) is supplied from the cleaning liquid nozzle 12. Water, high-pressure water, ultrasonic cleaning water, pure water, etc.) are jetted. Moreover, the air shower 14 is arrange | positioned at the 2nd processing tank 10B. From the air shower 14, for example, dry air is jetted. Moreover, the duct 40 is provided in the 1st processing tank 10A and the 2nd processing tank 10B, and the air in each processing tank can be sucked out.
 また、第1処理槽10Aと第2処理槽10Bとの境界領域60には、一対の液切りカーテン装置15A、15Bが配置されている。液切りカーテン装置15(15A、15B)は、エアを噴き出して空気壁を作り出すエアナイフである。そして、液切りカーテン(エアナイフ)15から気体(エア)を出すことによって浮遊ミストの移動を遮断することができる。具体的には、第1処理槽10A内に発生している液体の飛沫(浮遊ミスト)が、境界領域60に存在する開口部11A、11Bを通って、第2処理槽10Bに入ってくることがあるが、その浮遊ミストの進入を、液切りカーテン15(15A、15B)が防止している。図6に示した構成例では、第1処理槽10Aの液切りカーテン装置15Aは、搬送ローラ32を挟んで、上側カーテン部位と下側カーテン部位とから構成されている。同様に、第2処理槽10Bの液切りカーテン装置15Bも、搬送ローラ32を挟んで、上側カーテン部位と下側カーテン部位とから構成されている。 Also, a pair of liquid curtain devices 15A and 15B are disposed in the boundary region 60 between the first treatment tank 10A and the second treatment tank 10B. The liquid curtain device 15 (15A, 15B) is an air knife that blows out air to create an air wall. The movement of the floating mist can be blocked by discharging gas (air) from the liquid draining curtain (air knife) 15. Specifically, the liquid splash (floating mist) generated in the first treatment tank 10A enters the second treatment tank 10B through the openings 11A and 11B existing in the boundary region 60. However, the liquid curtain 15 (15A, 15B) prevents the floating mist from entering. In the configuration example shown in FIG. 6, the liquid draining curtain device 15 </ b> A of the first processing tank 10 </ b> A includes an upper curtain portion and a lower curtain portion with the conveyance roller 32 interposed therebetween. Similarly, the liquid curtain device 15B of the second treatment tank 10B is also composed of an upper curtain portion and a lower curtain portion with the conveyance roller 32 interposed therebetween.
 本実施形態の構成では、基板コンベア33を構成する搬送ローラ32のうち、一対の液切りカーテン装置15A、15Bの間に配置されている搬送ローラ30の両端部からエア19を噴射可能な構造にしている。すなわち、一対の液切りカーテン装置15A、15Bの間に配置された搬送ローラ30(30a、30b)のうちの少なくとも1つは、搬送ローラの中心部を構成する搬送シャフトの両端部にエアブロー穴が形成された搬送ローラ30であり、そのエアブロー穴からエア19が噴射される。図6に示した例では、第1処理槽10Aに、エアブロー穴を設けた搬送ローラ30aを配置し、そして、第2処理槽10Bにも、エアブロー穴を設けた搬送ローラ30bを配置している。 In the configuration of the present embodiment, among the transport rollers 32 constituting the substrate conveyor 33, the air 19 can be ejected from both ends of the transport rollers 30 disposed between the pair of liquid curtain devices 15A and 15B. ing. That is, at least one of the transport rollers 30 (30a, 30b) disposed between the pair of liquid curtain devices 15A and 15B has air blow holes at both ends of the transport shaft constituting the central portion of the transport roller. It is the formed conveyance roller 30, and the air 19 is injected from the air blow hole. In the example shown in FIG. 6, the conveyance roller 30a provided with the air blow hole is arranged in the first treatment tank 10A, and the conveyance roller 30b provided with the air blow hole is arranged also in the second treatment tank 10B. .
 図7は、第2処理槽10Bにおける搬送ローラ30(30b)の周辺を示す上面図である。本実施形態の搬送ローラ30bは、基板20に接触する基板接触部(円盤部)31と、基板接触部31の中心を通って延びる搬送シャフト34とから構成されている。基板接触部31は、搬送シャフト34の外面に設けられているが、基板接触部31と搬送シャフト34とを一体型の構成にすることも可能である。また、搬送シャフト34は、中空形状(円筒形状)を有しており、搬送シャフト34の両端部36にはエアブロー穴35が形成されている。本実施形態の構成では、液切りカーテン装置15(15B)の幅W2よりも、搬送シャフト34の幅W3の方が大きい。そして、搬送シャフト34の両端部36のうち、液切りカーテン装置15(15B)の外側に位置する部分(領域65に位置する部分)にはエアブロー穴35が形成されている。 FIG. 7 is a top view showing the periphery of the transport roller 30 (30b) in the second treatment tank 10B. The conveyance roller 30 b of the present embodiment includes a substrate contact portion (disk portion) 31 that contacts the substrate 20 and a conveyance shaft 34 that extends through the center of the substrate contact portion 31. The substrate contact portion 31 is provided on the outer surface of the transport shaft 34, but the substrate contact portion 31 and the transport shaft 34 may be integrated. Further, the transport shaft 34 has a hollow shape (cylindrical shape), and air blow holes 35 are formed at both ends 36 of the transport shaft 34. In the configuration of the present embodiment, the width W3 of the transport shaft 34 is larger than the width W2 of the liquid curtain device 15 (15B). An air blow hole 35 is formed in a part (a part located in the region 65) of the both ends 36 of the transport shaft 34 located outside the liquid curtain device 15 (15 </ b> B).
 図8は、搬送ローラ30における両端部36周辺を拡大して示す斜視図である。搬送ローラ30の搬送シャフト34は中空構造を有しているので、搬送シャフト34の内部にエアを導入すると、エアブロー穴35からエア19を噴き出させることができる。搬送シャフト34の内部にエアを導入するには、搬送シャフト34の端部に、エア導入用チューブ38を接続して、そのチューブ38からエアを導入したらよい。チューブ38から導入されるエアは、例えば、乾燥空気であるが、他の気体(例えば、窒素、アルゴンなど)を使用しても構わない。製造ラインの観点からは、第2処理槽10Bで用いる液切りカーテン装置15B(及び/又はエアシャワー14)に使用する気体(例えば、乾燥空気)と同じ気体を、チューブ38から搬送ローラ30に導入することが効率的である。 FIG. 8 is an enlarged perspective view showing the periphery of both end portions 36 of the transport roller 30. Since the conveying shaft 34 of the conveying roller 30 has a hollow structure, when air is introduced into the conveying shaft 34, the air 19 can be ejected from the air blow hole 35. In order to introduce air into the conveying shaft 34, an air introducing tube 38 may be connected to the end of the conveying shaft 34 and air may be introduced from the tube 38. The air introduced from the tube 38 is, for example, dry air, but other gases (for example, nitrogen, argon, etc.) may be used. From the viewpoint of the production line, the same gas (for example, dry air) used for the liquid curtain device 15B (and / or the air shower 14) used in the second treatment tank 10B is introduced from the tube 38 to the transport roller 30. It is efficient to do.
 本実施形態の基板処理装置100では、図7に示したように、第1処理槽10Aと第2処理槽10Bとの境界領域60に、一対の液切りカーテン装置15A、15Bが配置されている。そして、一対の液切りカーテン装置15A、15Bの間に配置されている搬送ローラのうち少なくとも1つは、エアブロー穴35が形成された搬送ローラ30(30a及び/又は30b)である。したがって、第1処理槽10Aに発生している浮遊ミスト92が気流90に乗り、液切りカーテン装置15Aの外側を回り込んで通過した後、開口部11A、11Bを抜け、次いで、液切りカーテン装置15Bの外側を回り込もうとしても、その浮遊ミスト92の移動を、エアブロー穴35からのエア19によって抑制することができる。すなわち、エアブロー穴35から噴き出されるエア19によって、搬送シャフト34の両端部36に回り込む浮遊ミスト92の移動(矢印90)を抑制することができる。 In the substrate processing apparatus 100 of the present embodiment, as shown in FIG. 7, a pair of liquid curtain devices 15 </ b> A and 15 </ b> B are disposed in a boundary region 60 between the first processing tank 10 </ b> A and the second processing tank 10 </ b> B. . At least one of the transport rollers arranged between the pair of liquid curtain devices 15A and 15B is a transport roller 30 (30a and / or 30b) in which an air blow hole 35 is formed. Therefore, the floating mist 92 generated in the first treatment tank 10A rides on the airflow 90, passes around the outside of the liquid cutting curtain device 15A, passes through the openings 11A and 11B, and then the liquid cutting curtain device. Even if it tries to go around the outside of 15 B, the movement of the floating mist 92 can be suppressed by the air 19 from the air blow hole 35. That is, the movement (arrow 90) of the floating mist 92 that wraps around the both end portions 36 of the transport shaft 34 can be suppressed by the air 19 ejected from the air blow hole 35.
 本実施形態の構成によれば、液切りカーテン装置15A、15Bからのエア壁17と、エアブロー穴35からのエアブロー19とによって、第1処理槽10Aから第2処理槽10Bへの、浮遊ミスト92の移動を抑制することができる。その結果、第2処理槽に存在する基板20の上に浮遊ミスト(すなわち、異物)92が付着することを抑制することができるので、次工程の製造プロセスにおける不良の原因を低減することができる。 According to the configuration of the present embodiment, the floating mist 92 from the first treatment tank 10A to the second treatment tank 10B is caused by the air wall 17 from the liquid draining curtain devices 15A and 15B and the air blow 19 from the air blow hole 35. Movement can be suppressed. As a result, it is possible to suppress the floating mist (that is, foreign matter) 92 from adhering to the substrate 20 existing in the second processing tank, and thus it is possible to reduce the cause of defects in the manufacturing process of the next process. .
 本実施形態の構成の寸法を例示的に説明すると、次の通りである。液切りカーテン装置15(15A、15B)の幅W2は例えば250~3230mmであり、搬送シャフト34の幅W3は例えば300~3500mmである。搬送シャフト34の直径は例えば25~50mmである。搬送シャフト34に形成されるエアブロー穴35の直径(円形の場合)は例えば0.1~2.0mmである。なお、エアブロー穴35は、搬送シャフト34の外周全面に形成する場合の他、搬送シャフト34の上部領域と下部領域に形成するだけでも構わない。 The dimensions of the configuration of the present embodiment will be described as an example as follows. The width W2 of the liquid curtain device 15 (15A, 15B) is 250 to 3230 mm, for example, and the width W3 of the transport shaft 34 is 300 to 3500 mm, for example. The diameter of the conveying shaft 34 is, for example, 25 to 50 mm. The diameter (in the case of a circle) of the air blow hole 35 formed in the transport shaft 34 is, for example, 0.1 to 2.0 mm. The air blow hole 35 may be formed only in the upper region and the lower region of the conveyance shaft 34 in addition to the case where the air blow hole 35 is formed on the entire outer periphery of the conveyance shaft 34.
 なお、図7に示した例では、第2処理槽10Bの側に、エアブロー穴35付きの搬送ローラ30bを設けた構成にて説明したが、第1処理槽10Aの側にも、エアブロー穴35付きの搬送ローラ30aを設けた構成にすると、浮遊ミスト92の移動を抑制する効果を高めることができる。また、本実施形態では、一対の液切りカーテン装置15A、15Bの間に、エアブロー穴35付きの搬送ローラ30(30a、30b)を配置しているが、一対の液切りカーテン装置15A、15Bの間以外の領域(すなわち、カーテン装置15Aの上流、または、カーテン装置15Bの下流)に、エアブロー穴35付きの搬送ローラ30を配置しても構わない。加えて、本実施形態の搬送ローラ30における搬送シャフト34の両端部36に、エアブロー穴35を形成しているが、両端部36以外の部位(例えば、中央部)に、エアブロー穴35を形成して、エアブロー19を生じさせることも可能である。 In the example shown in FIG. 7, the description has been made with the configuration in which the conveyance roller 30b with the air blow hole 35 is provided on the second processing tank 10B side, but the air blow hole 35 is also provided on the first processing tank 10A side. When the attached conveyance roller 30a is provided, the effect of suppressing the movement of the floating mist 92 can be enhanced. Moreover, in this embodiment, although the conveyance roller 30 (30a, 30b) with the air blow hole 35 is arrange | positioned between a pair of liquid cutting curtain apparatus 15A, 15B, a pair of liquid cutting curtain apparatus 15A, 15B is arranged. You may arrange | position the conveyance roller 30 with the air blow hole 35 in area | regions (namely, upstream of curtain apparatus 15A, or downstream of curtain apparatus 15B) other than between. In addition, air blow holes 35 are formed in both end portions 36 of the transport shaft 34 in the transport roller 30 of the present embodiment. However, air blow holes 35 are formed in portions other than both end portions 36 (for example, the central portion). Thus, the air blow 19 can be generated.
 また、本実施形態の基板処理方法では、まず、搬送ローラ32によって第1処理槽10Aに基板20を搬入した後、搬送ローラ32によって基板20を移動させながら、第1処理槽10Aで基板20を処理する。次いで、搬送ローラ32によって基板20を第2処理槽10Bに搬入した後、搬送ローラ32によって基板20を移動させながら、第2処理槽10Bで基板20を処理する。上述の実施形態では、第1処理槽10Aではウエット処理による洗浄処理を実行して、第2処理槽10Bではドライ処理による乾燥処理を実行したが、これに限らず、他の処理を実行することも可能である。具体的には、第1処理槽10Aでドライ処理を実行した後、第2処理槽10Bでウエット処理をすることができ、この場合には、第2処理槽10Bから第1処理槽10Aへ流れ込む浮遊ミスト92の移動を、本実施形態の機構(15A、15B、30)によって抑制することができる。 Further, in the substrate processing method of the present embodiment, first, after the substrate 20 is carried into the first processing tank 10A by the transport roller 32, the substrate 20 is moved by the transport roller 32 while the substrate 20 is moved by the first processing tank 10A. To process. Next, after the substrate 20 is carried into the second processing tank 10B by the transport roller 32, the substrate 20 is processed in the second processing tank 10B while the substrate 20 is moved by the transport roller 32. In the above-described embodiment, the cleaning process by the wet process is performed in the first processing tank 10A, and the drying process by the dry process is performed in the second processing tank 10B. Is also possible. Specifically, after the dry treatment is performed in the first treatment tank 10A, the wet treatment can be performed in the second treatment tank 10B, and in this case, the first treatment tank 10A flows into the first treatment tank 10A. The movement of the floating mist 92 can be suppressed by the mechanism (15A, 15B, 30) of the present embodiment.
 加えて、本実施形態の基板処理は、基板20の洗浄・乾燥工程に限らず、他の処理にも適用することができる。例えば、基板20の塗布工程と乾燥工程などにも適用することが可能である。さらには、第1処理槽10Aがウエット処理で、第2処理槽10Bがウエット処理の場合であっても、第1処理槽10Aで使用する液体(例えば、薬液)の浮遊ミスト92が、第2処理槽10Bに流れ込むと製造プロセスに支障がでる場合には、本実施形態の機構を適用することが可能である。そして、第1処理槽10Aがドライ処理で、第2処理槽10Bがドライ処理の場合であっても、第1処理槽10Aで使用する浮遊物(例えば、浮遊粒子)などが、第2処理槽10Bに流れ込むことを抑制したい場合にも、本実施形態の機構を用いることが可能である。 In addition, the substrate processing of the present embodiment can be applied not only to the cleaning and drying process of the substrate 20 but also to other processing. For example, the present invention can be applied to a coating process and a drying process of the substrate 20. Furthermore, even when the first treatment tank 10A is a wet process and the second treatment tank 10B is a wet process, the floating mist 92 of a liquid (for example, a chemical solution) used in the first treatment tank 10A is second. If the manufacturing process is hindered by flowing into the treatment tank 10B, the mechanism of this embodiment can be applied. Even if the first treatment tank 10A is a dry treatment and the second treatment tank 10B is a dry treatment, suspended matters (for example, suspended particles) used in the first treatment tank 10A are the second treatment tank. Even when it is desired to suppress the flow into 10B, the mechanism of this embodiment can be used.
 図9は、本実施形態の基板処理装置100の改変例を示す断面図である。図9に示した基板処理装置100では、第1処理槽10Aではドライ処理が実行され、第2処理槽10Bではウエット処理が実行される。具体的には、第1処理槽10Aには、基板20を加熱するヒーター45が配置されており、第2処理槽10Bでウエット処理(例えば、洗浄処理)が実行される前に、第1処理槽10Aで基板20の加熱工程(次工程のための予備処理)が実行される。 FIG. 9 is a cross-sectional view showing a modified example of the substrate processing apparatus 100 of the present embodiment. In the substrate processing apparatus 100 shown in FIG. 9, dry processing is performed in the first processing tank 10A, and wet processing is performed in the second processing tank 10B. Specifically, the heater 45 for heating the substrate 20 is disposed in the first processing tank 10A, and the first process is performed before the wet process (for example, the cleaning process) is performed in the second processing tank 10B. A heating process (preliminary process for the next process) of the substrate 20 is performed in the tank 10A.
 図9に示した構成において、第2処理槽10Bから浮遊ミストが第1処理槽10Aに流れ込んで、第1処理槽10Aにおける基板20に付着すると、その浮遊ミストが乾燥して基板20上でシミになる可能性がある。そのシミが第2処理槽10Bでの洗浄処理で取り除けない場合、後の製造プロセスで不良の原因に発展する可能性がある。ここでは、一対の液切りカーテン装置15A、15Bと、エアブロー穴35付きの搬送ローラ30(30a、30b)が設けられているので、そのような浮遊ミストの移動を抑制することができるという効果を得ることができる。 In the configuration shown in FIG. 9, when floating mist flows from the second processing tank 10 </ b> B into the first processing tank 10 </ b> A and adheres to the substrate 20 in the first processing tank 10 </ b> A, the floating mist is dried and stained on the substrate 20. There is a possibility. If the stain cannot be removed by the cleaning process in the second processing tank 10B, there is a possibility that it will develop into a cause of defects in a later manufacturing process. Here, since the pair of liquid curtain devices 15A and 15B and the transport roller 30 (30a and 30b) with the air blow holes 35 are provided, the effect of suppressing such movement of the floating mist can be achieved. Obtainable.
 以上、本発明を好適な実施形態により説明してきたが、こうした記述は限定事項ではなく、勿論、種々の改変が可能である。 As mentioned above, although this invention has been demonstrated by suitable embodiment, such description is not a limitation matter and, of course, various modifications are possible.
 本発明によれば、処理槽の間の浮遊ミストの移動を抑制した基板処理装置を提供することができる。 According to the present invention, it is possible to provide a substrate processing apparatus that suppresses the movement of floating mist between processing tanks.
 10A 第1処理槽
 10B 第2処理槽
 11A 開口部
 11B 開口部
 12 ノズル
 13A 開口部
 13B 開口部
 14 エアシャワー
 15 液切りカーテン装置(エアナイフ)
 17 エア(エア壁)
 19 エア(エアブロー)
 20 基板
 30 搬送ローラ
 31 基板接触部
 32 搬送ローラ
 33 基板コンベア
 34 搬送シャフト
 35 エアブロー穴
 36 搬送シャフトの両端部
 38 エア導入用チューブ
 40 ダクト
 45 ヒーター
 90 気流
 92 浮遊ミスト
100 基板処理装置
121 薬液供給ノズル
122 ブラシ
124 低圧水供給部
124a~127a ノズル
125 高圧水供給部
126 超音波洗浄水供給部
127 純水供給部
128 エアナイフ
130 基板処理部
130A 薬洗部
130B 水洗部
130C 乾燥部
200 基板
1000 基板処理装置
2000 基板処理装置
DESCRIPTION OF SYMBOLS 10A 1st processing tank 10B 2nd processing tank 11A Opening part 11B Opening part 12 Nozzle 13A Opening part 13B Opening part 14 Air shower 15 Liquid cutting curtain apparatus (air knife)
17 Air (Air wall)
19 Air (Air blow)
20 Substrate 30 Conveying Roller 31 Substrate Contacting Section 32 Conveying Roller 33 Substrate Conveyor 34 Conveying Shaft 35 Air Blow Hole 36 Both Ends of Conveying Shaft 38 Air Introducing Tube 40 Duct 45 Heater 90 Air Flow 92 Floating Mist 100 Substrate Processing Device 121 Chemical Solution Supply Nozzle 122 Brush 124 Low-pressure water supply unit 124a to 127a Nozzle 125 High-pressure water supply unit 126 Ultrasonic cleaning water supply unit 127 Pure water supply unit 128 Air knife 130 Substrate processing unit 130A Chemical cleaning unit 130B Water-washing unit 130C Drying unit 200 Substrate 1000 Substrate processing apparatus 2000 Substrate processing equipment

Claims (10)

  1.  基板の処理を行う基板処理装置であって、
     基板を搬送可能な搬送ローラを含む第1処理槽と、
     前記第1処理槽に連結された第2処理槽と
     を備え、
     前記第2処理槽には、前記第1処理槽からの前記搬送ローラが延長して存在しており、
     前記第1処理槽と前記第2処理槽との境界領域には、一対の液切りカーテン装置が配置されており、
     前記一対の液切りカーテン装置の間に配置されている前記搬送ローラのうち少なくとも1つは、前記搬送ローラの中心部を構成する搬送シャフトの両端部にエアブロー穴が形成された搬送ローラである、基板処理装置。
    A substrate processing apparatus for processing a substrate,
    A first processing tank including a transfer roller capable of transferring a substrate;
    A second treatment tank connected to the first treatment tank,
    In the second processing tank, the conveying roller from the first processing tank is extended and exists,
    In a boundary region between the first treatment tank and the second treatment tank, a pair of liquid draining curtain devices are disposed,
    At least one of the transport rollers disposed between the pair of liquid curtain devices is a transport roller in which air blow holes are formed at both ends of a transport shaft constituting a central portion of the transport roller. Substrate processing equipment.
  2.  前記第1処理槽は、ウエット型の処理槽であり、そして、
     前記第2処理槽は、ドライ型の処理槽である、請求項1に記載の基板処理装置。
    The first treatment tank is a wet-type treatment tank, and
    The substrate processing apparatus according to claim 1, wherein the second processing tank is a dry processing tank.
  3.  前記液切りカーテン装置の幅よりも、前記搬送シャフトの幅の方が大きく、
     前記搬送シャフトの両端部のうちの、前記液切りカーテン装置の外側に位置する部分には、前記エアブロー穴が形成されている、請求項1または2に記載の基板処理装置。
    The width of the transport shaft is larger than the width of the liquid curtain device,
    3. The substrate processing apparatus according to claim 1, wherein the air blow hole is formed in a portion of the both ends of the transport shaft located outside the liquid curtain device.
  4.  前記搬送シャフトは、中空構造を有しており、
     前記搬送シャフトの内部には、前記エアブロー穴から噴き出させるための気体が導入される、請求項1から3の何れか一つに記載の基板処理装置。
    The transport shaft has a hollow structure,
    4. The substrate processing apparatus according to claim 1, wherein a gas to be ejected from the air blow hole is introduced into the conveyance shaft.
  5.  前記一対の液切りカーテン装置は、それぞれ、上側カーテン部位と下側カーテン部位とから構成されている、請求項1から4の何れか一つの基板処理装置。 The substrate processing apparatus according to any one of claims 1 to 4, wherein each of the pair of liquid curtain devices includes an upper curtain portion and a lower curtain portion.
  6.  前記基板は、液晶パネル用のマザーガラスである、請求項1から5の何れか一つに記載の基板処理装置。 The substrate processing apparatus according to any one of claims 1 to 5, wherein the substrate is a mother glass for a liquid crystal panel.
  7.  基板を処理する基板処理方法であって、
     搬送ローラによって第1処理槽に基板を搬入する工程(a)と、
     前記搬送ローラによって前記基板を移動させながら、前記第1処理槽で前記基板を処理する第1処理工程(b)と、
     前記搬送ローラによって前記基板を、前記第1処理槽から、前記第1処理槽に接続した第2処理槽に搬入する工程(c)と、
     前記搬送ローラによって前記基板を移動させながら、前記第2処理槽で前記基板を処理する第2処理工程(d)と
     を含み、
     前記第1処理槽と前記第2処理槽との境界領域では、一対の液切りカーテン装置が気体を出すことによって、前記第1処理槽と前記第2処理槽との間における浮遊ミストの移動を遮断しており、
     前記一対の液切りカーテン装置の間に配置されている前記搬送ローラのうち少なくとも1つにおいては、前記搬送ローラの中心部を構成する搬送シャフトの両端部から気体を出すことによって、前記一対の液切りカーテン装置の外側を回り込む浮遊ミストの移動を遮断している、基板処理方法。
    A substrate processing method for processing a substrate, comprising:
    A step (a) of carrying the substrate into the first processing tank by the transport roller;
    A first processing step (b) for processing the substrate in the first processing tank while moving the substrate by the transport roller;
    (C) carrying the substrate from the first processing tank into the second processing tank connected to the first processing tank by the transport roller;
    A second processing step (d) of processing the substrate in the second processing tank while moving the substrate by the transport roller, and
    In a boundary region between the first treatment tank and the second treatment tank, a pair of liquid curtain devices emits gas, thereby moving the floating mist between the first treatment tank and the second treatment tank. Shut off,
    In at least one of the transport rollers disposed between the pair of liquid cutting curtain devices, the pair of liquids is generated by discharging gas from both ends of the transport shaft constituting the central portion of the transport roller. A substrate processing method that blocks the movement of floating mist that wraps around the outside of a cut curtain device.
  8.  前記第1処理工程(b)では、ウエット型の基板洗浄処理が実行され、そして、
     前記第2処理工程(d)では、ドライ型の基板洗浄処理が実行される、請求項7に記載の基板処理方法。
    In the first processing step (b), a wet type substrate cleaning process is executed, and
    The substrate processing method according to claim 7, wherein in the second processing step (d), a dry-type substrate cleaning process is performed.
  9.  前記基板は、液晶パネル用のマザーガラスである、請求項7または8に記載の基板処理方法。 The substrate processing method according to claim 7 or 8, wherein the substrate is a mother glass for a liquid crystal panel.
  10.  基板を搬送するための搬送ローラであって、
     搬送シャフトと、
     前記搬送シャフトの外面に設けられ、基板と接触する基板接触部と
     を備え、
     前記搬送シャフトは、中空構造を有しており、
     前記搬送シャフトの両端部には、気体を噴き出すためのエアブロー穴が形成されている、搬送ローラ。
    A transport roller for transporting a substrate,
    A conveying shaft;
    A substrate contact portion provided on the outer surface of the transport shaft and in contact with the substrate;
    The transport shaft has a hollow structure,
    The conveyance roller in which the air blow hole for ejecting gas is formed in the both ends of the said conveyance shaft.
PCT/JP2010/072269 2009-12-21 2010-12-10 Substrate processing device and substrate processing method WO2011077977A1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
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JPH11162919A (en) * 1997-11-27 1999-06-18 Dainippon Screen Mfg Co Ltd Substrate treating apparatus
JP2009202088A (en) * 2008-02-27 2009-09-10 Dainippon Screen Mfg Co Ltd Substrate treating device

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JP2004074021A (en) * 2002-08-19 2004-03-11 Dainippon Screen Mfg Co Ltd Substrate processing apparatus and substrate cleaning unit
JP4808509B2 (en) * 2006-02-21 2011-11-02 大日本スクリーン製造株式会社 Substrate crack detection device and substrate processing device
CN201010291Y (en) * 2007-03-02 2008-01-23 亚智科技股份有限公司 Dustproof guide pulley
JP2009076856A (en) * 2007-08-28 2009-04-09 Dainippon Screen Mfg Co Ltd Substrate-treating equipment

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Publication number Priority date Publication date Assignee Title
JPH11162919A (en) * 1997-11-27 1999-06-18 Dainippon Screen Mfg Co Ltd Substrate treating apparatus
JP2009202088A (en) * 2008-02-27 2009-09-10 Dainippon Screen Mfg Co Ltd Substrate treating device

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