JP4509613B2 - Substrate processing equipment - Google Patents

Description

  In the present invention, a substrate such as a glass substrate for a flat panel display (FPD), a semiconductor wafer, a glass substrate for a photomask, or a printed circuit board is conveyed, and a gas is blown to the substrate to blow off a processing solution attached to the substrate. The present invention relates to a substrate processing apparatus to be removed.

  In the manufacturing process of FPD devices, semiconductor devices, etc., after processing the surface of a substrate such as a glass substrate for FPD or a semiconductor wafer using a processing solution, a cleaning solution such as pure water is supplied to the surface of the substrate, for example. Then, after the substrate is cleaned, in order to remove the cleaning liquid adhering to the surface of the substrate, a liquid draining process is performed in which gas is blown onto the surface of the substrate and the cleaning liquid is blown off from the substrate surface. In this liquid draining process, the substrate is transported in a horizontal direction by a roller conveyor or the like in the processing chamber, and the air knives disposed on both the upper and lower sides of the substrate transport path are used for both upper and lower surfaces of the substrate. It is performed by injecting gas toward each. In this liquid draining process, gas is blown onto the surface of the substrate, so that the cleaning liquid scatters from the surface of the substrate to generate mist, and the cleaning liquid mist is reattached to the surface of the substrate after the processing. In order to solve such a problem, a substrate processing apparatus having a schematic configuration shown in FIG. 9 has been proposed.

  The substrate processing apparatus whose side sectional view is shown in FIG. 9 includes a sealed processing chamber 1. In the processing chamber 1, a substrate carry-in port 2 into which a substrate W that has been subjected to a wet process, for example, a cleaning process using a cleaning liquid such as pure water, and a substrate carry-out port 3 from which the substrate W that has been subjected to the liquid draining process are carried out. The exhaust port 4 is formed in the lower part, and an exhaust pump (not shown) is connected to the exhaust port 4 through an exhaust pipe. Inside the processing chamber 1, a transport mechanism such as a roller conveyor for transporting the substrate W from the substrate carry-in port 2 toward the substrate carry-out port 3 in the horizontal direction (illustration of the transport mechanism is omitted, and the substrate is indicated by a two-dot chain line) The conveyance path 5 is shown). In the processing chamber 1, air knives 6a and 6b are disposed on both the upper and lower sides of the substrate transfer path 5, respectively. A partition member 7 is arranged inside the processing chamber 1 to partition the space above the substrate transfer path 5 into an upstream space a and a downstream space b at the positions where the air knives 6a and 6b are disposed. It is installed. The processing chamber 1 is provided with a blower port 8 in the ceiling, and a blower mechanism 9 that supplies clean air through the blower port 8 to the downstream space b is installed. The mechanism 9 includes a fan and a filter such as HEPA.

In the substrate processing apparatus having the configuration shown in FIG. 9, the clean air is supplied from the air blowing port 8 on the ceiling portion of the processing chamber 1 to the downstream space b by the air blowing mechanism 9, thereby the downstream space b. A flow (down flow) of clean air is generated that flows down to the exhaust port 4 at the bottom of the processing chamber 1. In addition, the gas jetted from the outlets of the air knives 6a and 6b toward the upper and lower surfaces of the substrate W is upstream by the suction force of the exhaust pump together with the mist of the cleaning liquid blown off from the surface of the substrate W. From the space a toward the exhaust port 4 below the processing chamber 1 and exhausted through the exhaust port 4. Therefore, the mist generated by the cleaning liquid splashing from the surface of the substrate W is re-appeared on the surface of the substrate W while the substrate W that has been liquid drained by the air knives 6a and 6b is transported toward the substrate carry-out port 3. It is prevented that it adheres (for example, refer patent document 1).
JP-A-9-94546 (page 4-7, FIG. 1 and FIG. 3)

  In recent years, as the size of the substrate has increased, the volume of the processing chamber has also increased. Therefore, the conventional substrate processing apparatus having the configuration shown in FIG. 9 is required for downflow in the processing chamber 1. The flow rate of clean air to be increased increases, and the blower mechanism 9 is also increased in size. Further, as the substrate becomes larger, the gas discharge flow rate from the air knives 6a and 6b increases, and accordingly, the air flow in the processing chamber 1 is easily disturbed. For this reason, the mist of the cleaning liquid scattered in the space a on the upstream side of the processing chamber 1 can easily flow into the space b on the downstream side even from a slight gap such as the peripheral edge of the partition member 7. There is a possibility that the cleaning liquid mist adheres again to the surface of the finished substrate W. Furthermore, since the supply flow rate of clean air into the processing chamber 1 and the discharge flow rate of gas from the air knives 6a and 6b increase, the exhaust flow rate from the processing chamber 1 also increases, and the exhaust pump becomes larger. Become. Also, as the substrate size increases, the rotation axis of the roller conveyor becomes longer, so it is necessary to support the rotation axis not only at both ends but also at the center with bearings. As a result, the rotation operation of the rotation axis As a result, there is a problem that the possibility that dust generated by the particles adheres to the substrate increases.

  The present invention has been made in view of the circumstances as described above, and can prevent the mist and dust generation of the processing liquid from adhering to the surface of the substrate after the liquid draining process. To provide a substrate processing apparatus capable of reducing the flow rate of clean air required for downflow in a chamber, reducing the turbulence of airflow in the processing chamber, and reducing the exhaust flow rate from the processing chamber. Objective.

According to a first aspect of the present invention, there is provided a hermetically sealed processing chamber having a substrate carry-in port and a substrate carry-out port and having an exhaust port formed in a lower portion thereof, and the inside of the process chamber in parallel to each other and in the substrate transport direction. are arranged along a plurality conveying rollers for conveying the substrate in a predetermined direction in the processing chamber, is disposed within the processing chamber, the gas to at least the upper surface side main surface of the substrate which is transported by the transport roller A gas jetting means for blowing off and removing the processing liquid adhering to the main surface on the upper surface side of the substrate; and a space inside the processing chamber at least above the substrate transport path upstream of the gas jetting means. A partition member for partitioning into a space on the side and a space on the downstream side, supplying clean air into the downstream space partitioned by the partition member, and supplying the clean air in the space on the downstream side A clean air supply means for Do, in the substrate processing apparatus provided with an exhaust means for exhausting the inside of the processing chamber through an exhaust port of the process chamber, immediately under the substrate transportation path in the space side of at least the downstream substrate carrying A plate-like shape in which a plurality of openings are formed in a portion corresponding to the support roller portion of the conveying roller so as to partition the space on the lower side and the space on the lower side in the space on the upper side of the path. An upper and lower partition member is provided.

According to a second aspect of the present invention, in the substrate processing apparatus of the first aspect, a plurality of vent holes are formed in the upper and lower partition members.
According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, the upper and lower partition members are disposed above the rotational position of the transport roller and its bearing. It is characterized by that.

The invention according to claim 4, in the substrate processing apparatus according to any one of claims 1 to 3, directly below the substrate transportation path in the space side of the upstream side, the in the upper side of the space of the substrate transport path A flat plate-like upstream upper and lower partition member having a plurality of openings formed in a portion corresponding to the support roller portion of the transport roller is disposed so as to partition the upstream space and the space below the upstream space. It is characterized by that.

According to a fifth aspect of the present invention, in the substrate processing apparatus according to any one of the first to fourth aspects, a gas is blown into the lower chamber side main surface of the substrate transported by the transport roller into the processing chamber. And a lower gas jetting means for blowing off and removing the processing liquid adhering to the lower surface side main surface of the substrate, and the lower gas jetting is performed in the space below the substrate transport path inside the processing chamber. A lower side partitioning member for partitioning an upstream space and a downstream space with respect to the means is provided.

In the substrate processing apparatus according to the first aspect of the present invention, the space above the substrate transfer path inside the processing chamber is partitioned by the partition member into the upstream space and the downstream space with respect to the gas injection means. Therefore, the gas containing the mist of the processing liquid generated by the liquid draining process is sucked by the exhaust means, flows from the space on the upstream side toward the exhaust port at the lower part of the processing chamber, and passes through the exhaust port in the processing chamber. Discharged from. On the other hand, when clean air is supplied into the downstream space by the clean air supply means, the flow (down flow) of clean air flowing down the downstream space and flowing toward the exhaust port at the lower part of the processing chamber. Arise. Therefore, it is possible to prevent the mist of the processing liquid from re-adhering to the surface of the substrate that has been subjected to the liquid draining process by the gas jetting means. The space between the downstream side in the space above the substrate transfer path in the processing chamber and the space below it are partitioned by the upper and lower partition members, and the clean air is transported by the transport rollers of the upper and lower partition members. Since the flow from the downstream space in the upper space of the substrate transport path to the lower space through a plurality of openings formed in the portion corresponding to the support roller portion, the supply flow rate of clean air is reduced. also be reduced, resulting a downflow in the space on the downstream side in the upper side of the space of the substrate transport path, also the space on the downstream side in the upper side of the space of the substrate transfer path becomes positive pressure state. For this reason, the mist of the processing liquid does not reattach to the surface of the substrate transported in the downstream space. Further, by reducing the supply flow rate of clean air into the processing chamber, the exhaust flow rate from the processing chamber is also reduced. Furthermore, the turbulence of clean air flowing from the downstream space in the space above the substrate transport path through the plurality of openings of the upper and lower partition members reduces the turbulence of the air flow in the processing chamber. Therefore, the gas containing the mist of the processing liquid and the dust generation material is exhausted from the processing chamber without stagnation, and the atmosphere in the processing chamber is quickly replaced. In addition, the clean air supplied into the downstream space in the upper space of the substrate transport path flows to the lower space through the plurality of openings of the upper and lower partition members, so that the flow velocity increases. For this reason, there is a possibility that dust generated in the drive unit of the transport roller rises against the flow of clean air, flows into the downstream space in the space above the substrate transport path, and adheres to the substrate. Extremely low.
Therefore, when the substrate processing apparatus of the invention according to claim 1 is used, it is possible to prevent the mist of the processing liquid and dust from adhering to the surface of the substrate that has been subjected to the liquid draining process, and the inside of the processing chamber. The flow rate of clean air required for downflow of the process can be reduced, the clean air supply mechanism can be reduced in size, the exhaust flow rate from the processing chamber can be reduced, and the exhaust mechanism can also be reduced in size. it can.

In the substrate processing apparatus according to the second aspect of the present invention, the clean air supplied into the space on the downstream side of the processing chamber flows to the space on the lower side through the plurality of vent holes formed in the upper and lower partition members.
In the substrate processing apparatus according to the third aspect of the present invention, even if dust is generated when the rotation shaft of the transport roller is supported by the bearing and rotates, the generated dust is downstream in the space above the substrate transport path. The possibility of flowing into the space and adhering to the substrate becomes extremely low.

In the substrate processing apparatus according to the fourth aspect of the present invention, the upstream space in the space above the substrate transport path in the processing chamber and the space below it are partitioned by the upstream vertical partition member. The gas ejected from the gas ejecting means passes upstream in the space above the substrate transport path through a plurality of openings formed in a portion corresponding to the support roller portion of the transport roller of the upstream upper and lower partition members. The space on the upstream side in the space above the substrate transport path is in a positive pressure state and flows downward through a plurality of openings in the upstream side upper and lower partition members. The flow velocity of the gas flowing into the side space increases. For this reason, there is a possibility that dust generated in the drive unit of the transport roller rises against the flow of clean air, flows into the upstream space in the space above the substrate transport path, and adheres to the substrate. Extremely low.

In the substrate processing apparatus according to the fifth aspect of the present invention, the space below the substrate transfer path inside the processing chamber is divided into a space on the upstream side and a space on the downstream side with respect to the lower gas injection means. Since it is partitioned by the member, the gas containing the mist of the processing liquid generated by the liquid draining process is sucked by the exhaust means, flows from the upstream space toward the exhaust port at the lower part of the processing chamber, and passes through the exhaust port. It is discharged from the processing chamber. Therefore, it is possible to prevent the mist of the processing liquid from reattaching to the surface of the substrate after the liquid draining process by the lower gas injection means.

Hereinafter, the best embodiment of the present invention will be described with reference to FIGS.
1 and 2 show an example of an embodiment of the present invention, FIG. 1 is a side sectional view showing a schematic configuration of a substrate processing apparatus, and FIG. 2 is viewed from the direction of arrow V in FIG. It is a fragmentary sectional view.

  Similar to the conventional apparatus shown in FIG. 9, this substrate processing apparatus includes a sealed processing chamber 10, and the processing chamber 10 is subjected to a wet process, for example, a cleaning process using a cleaning liquid such as pure water. A substrate carry-in port 12 into which the substrate W is carried in and a substrate carry-out port 14 through which the substrate W that has been subjected to the liquid draining process are carried out are provided. An exhaust port 16 is formed in the lower part of the processing chamber 10, and an exhaust pump (not shown) is connected to the exhaust port 16 through an exhaust pipe. Inside the processing chamber 10, there is provided a roller conveyor 18 (a substrate transport path 20 is indicated by a two-dot chain line) for transporting the substrate W in the horizontal direction from the substrate transport inlet 12 toward the substrate transport outlet 14. ing. The roller conveyor 18 is composed of a plurality of transport rollers 22 arranged in parallel with each other and along the transport direction of the substrate W. The transport roller 22 is fixed to a rotation shaft 26 rotatably supported by a bearing 24 fixed to a fixed portion of the processing chamber 10, and a plurality of support roller portions 28 that contact the lower surface of the substrate W and support the substrate W are fixed. Configured. A rotation shaft of a motor 30 is connected to a part of the rotation shafts 26 of the plurality of conveyance rollers 22, and the conveyance roller 22 and the other conveyance rollers 22 are fixed to the respective rotation shafts 26. The pulleys 32 and the belt 34 are connected dynamically.

  In the processing chamber 10, air knives 36a and 36b are disposed on the upper and lower sides of the substrate transfer path 20, respectively. Further, inside the processing chamber 10, there is a partition member 38 that divides the space above the substrate transport path 20 into a space A on the upstream side and a space B on the downstream side at the positions where the air knives 36a and 36b are disposed. It is arranged. Further, a blower opening 40 is provided in the ceiling portion of the processing chamber 10, and a blower mechanism 42 that supplies clean air into the space B on the downstream side through the blower opening 40 is installed. The mechanism 42 includes a fan and a filter such as HEPA.

  A flat plate-shaped upper and lower partition member 44 is disposed inside the processing chamber 10 so as to partition the space B on the downstream side and the space on the lower side thereof. As shown in a cross-sectional view in FIG. 3, the upper and lower partition members 44 are formed with a plurality of openings 46 at portions corresponding to the support roller portions 28 of the transport roller 22, and the openings 46 are clean air. It becomes the passage. As shown in the cross-sectional view of FIG. 4, a plurality of vent holes 48 may be formed in the upper and lower partition members 44 in addition to the plurality of openings 46. Further, in this apparatus, a plurality of openings are formed in a portion corresponding to the support roller portion 28 of the transport roller 22 in the same manner as the upper and lower partition members 44 so as to partition the space A on the upstream side and the space on the lower side thereof. A flat plate-like upstream side upper and lower partition member 50 is provided. The upper and lower partition members 44 and the upstream upper and lower partition members 50 are respectively disposed directly below the substrate transport path 20 and above the position where the rotation shaft 26 of the transport roller 22 and the bearing 24 are disposed.

  In the substrate processing apparatus having the above-described configuration, clean air is supplied by the blower mechanism 42 into the downstream space B partitioned by the partition member 38, and a clean air downflow occurs in the downstream space B. The clean air flows down into the lower space through the opening 46 of the upper and lower partition members 44, and is exhausted from the processing chamber 10 through the exhaust port 16. Further, the mist of the cleaning liquid splashed from the surface of the substrate W when the gas is blown from the air knives 36 a and 36 b to the upper and lower main surfaces of the substrate W is gas from the upstream space A partitioned by the partition member 38. At the same time, it flows down into the space on the lower side through the opening of the upstream side upper and lower partition members 50, and is discharged from the processing chamber 10 through the exhaust port 16. Therefore, it is possible to prevent the mist of the cleaning liquid from re-adhering to the surface of the substrate W that has passed through the positions where the air knives 36a and 36b are finished after the liquid cutting process by the air knives 36a and 36b.

  Further, the space B on the downstream side in the processing chamber 10 and the space on the lower side thereof are partitioned by an upper and lower partition member 44, and the clean air passes through the opening 46 of the upper and lower partition member 44 and is downstream. Since it flows from the space B to the space below it, it is possible to reduce the supply flow rate of clean air necessary to cause a downflow in the downstream space B. In addition, the flow rate of exhaust air from the processing chamber 10 can be reduced by reducing the supply flow rate of clean air into the processing chamber 10. Furthermore, the turbulence of clean air flowing from the downstream space B through the opening 46 of the upper and lower partition members 44 reduces the turbulence of the air flow in the processing chamber 10. For this reason, the gas containing the mist of the cleaning liquid and the dust generation material is exhausted from the processing chamber 10 without stagnation, and the atmosphere in the processing chamber 10 is quickly replaced. Further, since the upper and lower partition members 44 are installed, a rectifying effect is obtained, so that it is not necessary to increase the height of the processing chamber 10 in order to rectify the downflow in the downstream space B. For this reason, the height of the processing chamber 10 can be lowered and the volume of the processing chamber 10 can be reduced. Further, since the upper and lower partition members 44 are installed, the downstream space B to which clean air is supplied is in a positive pressure state, and further, the clean air supplied into the downstream space B is separated from the upper and lower partition members. Since it flows to the space below through the opening 46 of 44, the flow velocity becomes large. For this reason, even if dust is generated when the rotation shaft 26 of the transport roller 22 is supported by the plurality of bearings 24 and rotates, the generated dust rises against the flow of clean air, and the downstream space B The possibility of inflowing and adhering to the substrate W is extremely low.

  Further, the space A on the upstream side in the processing chamber 10 and the space on the lower side thereof are partitioned by the upstream upper and lower partition members 50, and the gas injected from the air knives 36a and 36b is separated from the upstream upper and lower partitions. Since the air flows from the upstream space A to the lower space through the opening of the member 50, the upstream space A is in a positive pressure state, and passes through the opening of the upstream upper and lower partition members 50. The flow velocity of the gas flowing into the side space increases. For this reason, also in the upstream space A, the possibility that dust generated due to the rotation of the rotation shaft 26 of the transport roller 22 rises against the flow of clean air and adheres to the substrate W is extremely reduced. Can do.

  Next, FIG. 5 is a side sectional view showing a schematic configuration of a substrate processing apparatus according to another embodiment of the present invention. In this figure, members having the same functions as those described with reference to FIG. 1 are denoted by the same reference numerals as those used in FIG. 1, and description thereof is omitted.

  In the apparatus shown in FIG. 5, the space above the substrate transfer path 20 is disposed in the processing chamber 52 having the substrate carry-in port 54 and the substrate carry-out port 56 at the upstream side of the air knife 36a, 36b. In addition to the partition member 58 for partitioning the space C and the downstream space D, the space below the substrate transport path 20 is the upstream space at the position where the air knives 36a and 36b are disposed. A lower partitioning member 60 that partitions E into a downstream space F is provided. In the lower part of the processing chamber 52, exhaust ports 62 and 64 are respectively formed on both the upstream space E side and the downstream space F side. Further, in the processing chamber 52, a portion corresponding to the support roller portion of the transport roller is provided in the same manner as the upper and lower partition members 44 so as to partition the downstream space D and the lower space F. A flat plate-like upper and lower partition member 66 having a plurality of openings is provided.

  In the substrate processing apparatus having the configuration shown in FIG. 5, the space on the upper side and the lower side of the substrate transfer path 20 inside the processing chamber 52 is separated into the upstream space C by the partition member 58 and the lower partition member 60, respectively. , E and downstream spaces D and F, and exhaust is performed through the exhaust ports 62 and 64 from the upstream space E and the downstream space F, respectively. For this reason, the mist of the cleaning liquid scattered from the surface of the substrate W when the gas is blown from the air knives 36a and 36b to the upper and lower main surfaces of the substrate W finishes the liquid draining process by the air knives 36a and 36b. Reattachment to the surface of the substrate W that has passed through the arrangement positions of 36a and 36b is more reliably prevented.

  Next, in the substrate processing apparatus whose plan view of the substrate transfer surface is shown in FIG. 6, the air knife 68 is disposed so as to be inclined in a plan view with respect to a direction orthogonal to the substrate transfer direction. The roller conveyor includes a plurality of small-diameter conveying rollers 70 each having a plurality of small-diameter support roller portions fixed to the rotating shaft, and a plurality of large-diameter conveying rollers 72 each having a plurality of large-diameter supporting roller portions fixed to the rotating shaft. The air knife 68 is arranged at the arrangement position of the plurality of large-diameter conveying rollers 72. A plurality of openings 76 and 78 are formed on the downstream side of the air knife 68 at portions corresponding to the support roller portion of the small-diameter conveyance roller 70 and the support roller portion of the large-diameter conveyance roller 72, respectively, and the planar shape is trapezoidal. A flat plate-shaped upper and lower partition member 74 is provided.

  Further, in the substrate processing apparatus shown in the schematic plan view of FIG. 7, the air knife (not shown) is inclined in a plan view with respect to the direction orthogonal to the substrate transport direction as in the apparatus shown in FIG. In the processing chamber 80, a partition member 82 that divides the space above the substrate transport path into an upstream space G and a downstream space H at the position where the air knife is disposed is in the substrate transport direction. Are inclined with respect to the direction orthogonal to the plane view. In order to supply clean air into the downstream space H, three small air blowing mechanisms 84a, 84b, 84c are installed in parallel. In this way, when a plurality of small air blowing mechanisms 84a, 84b, 84c are installed instead of installing one large air blowing mechanism, the rectifying effect of the clean air downflow is enhanced. As a result, the height of the processing chamber 80 can be lowered and the volume of the processing chamber 80 can be reduced. For example, as shown in FIG. 8, when the ionizer 88 is installed in the downstream space H that is partitioned from the lower space by a flat plate-shaped upper and lower partition member 86 in which a plurality of ventilation portions are formed. Since the rectifying effect of the downflow of clean air is enhanced, ions can be easily diffused evenly, and the charge removal capability of the ionizer 88 can be maximized. In FIG. 8, members denoted by the same reference numerals as those used in FIG. 1 indicate members having the same functions as those described with reference to FIG. 1.

1 is a side sectional view illustrating a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention. It is the fragmentary sectional view which looked at the substrate processing apparatus shown in FIG. 1 from the arrow V direction in FIG. It is a cross-sectional view of the upper and lower partition member which is a component of the substrate processing apparatus shown in FIG. It is a cross-sectional view which shows another structural example of an up-and-down partition member. It is a sectional side view which shows another embodiment of this invention and shows schematic structure of a substrate processing apparatus. It is a top view of the board | substrate conveyance surface in a substrate processing apparatus which shows the modification of this invention. It is another schematic modification of this invention, and is a schematic plane sectional view of a substrate processing apparatus. It is a sectional side view which shows schematic structure of the substrate processing apparatus shown in FIG. It is a sectional side view which shows an example of schematic structure of the conventional substrate processing apparatus.

Explanation of symbols

10, 52, 80 Processing chamber 12, 54 Substrate carry-in port 14, 56 Substrate carry-out port 16, 62, 64 Exhaust port 18 Roller conveyor 20 Substrate transport path 22, 70, 72 Transport roller 24 Bearing 26 Rotating shaft 36a of transport roller 36b, 68 Air knife 38, 58, 82 Partition member 40 Blower port 42, 84a, 84b, 84c Blower mechanism 44, 66, 74, 86 Vertical partition member 46, 76, 78 Opening 48 Ventilation hole 50 Upstream vertical partition member 60 Lower partition member
W Board A, C, E, G Upstream space B, D, F, H Downstream space

Claims (5)

A sealed processing chamber having a substrate carry-in port and a substrate carry-out port and having an exhaust port formed in the lower part;
A plurality of transport rollers arranged in parallel to each other in the processing chamber and along the transport direction of the substrate, and transports the substrate in a predetermined direction in the processing chamber;
A gas jetting means disposed inside the processing chamber, for blowing gas to at least the upper surface main surface of the substrate conveyed by the conveying roller , and blowing away the processing liquid adhering to the upper surface main surface of the substrate; ,
A partition member that divides at least the space above the substrate transfer path inside the processing chamber into a space on the upstream side and a space on the downstream side with respect to the gas ejection unit;
Clean air supply means for supplying clean air into the downstream space partitioned by the partition member and causing the clean air to flow down in the downstream space;
Exhaust means for exhausting the interior of the processing chamber through the exhaust port of the processing chamber;
In a substrate processing apparatus comprising:
The support roller portion of the transport roller so as to partition between the downstream space in the space above the substrate transport path and the space below it immediately below the substrate transport path at least in the downstream space side A substrate processing apparatus comprising a flat plate-like upper and lower partition member having a plurality of openings formed in a portion corresponding to . The substrate processing apparatus according to claim 1,
A substrate processing apparatus, wherein a plurality of air holes are formed in the upper and lower partition members. In the substrate processing apparatus of Claim 1 or Claim 2,
  The substrate processing apparatus, wherein the upper and lower partition members are disposed above a position where a rotation shaft of the transport roller and a bearing thereof are disposed. The substrate processing apparatus according to claim 1 , wherein:
Immediately below the substrate transport path on the upstream space side, on the support roller portion of the transport roller so as to partition the upstream space in the space above the substrate transport path and the space below it. A substrate processing apparatus, comprising: a plate-like upstream upper and lower partition member having a plurality of openings formed in corresponding portions . The substrate processing apparatus according to claim 1 , wherein:
Inside the processing chamber, there is disposed a lower side gas jetting means for blowing gas to the lower surface side main surface of the substrate conveyed by the conveying roller and blowing away the processing liquid adhering to the lower surface side main surface of the substrate. And
A lower partitioning member for partitioning the space below the substrate transfer path inside the processing chamber into a space on the upstream side and a space on the downstream side with respect to the lower gas injection means is provided. Substrate processing apparatus.

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