M308491 八·、新型說明： 【新型所屬之技術領域】 本創作有關於一種光阻清除設備，特別有關一種具有空氣内循環 系統的光阻清除設備。 【先前技術】 在液晶顯示器的薄膜電晶體(ThinFilmTransistor，TFT)製程中，去 光阻製程是將定義出元件的光阻以溶劑去除’如·乙醉胺(MEA)、 BDG、NMP等，基板在經過溶劑清洗後再以異丙醇(IPO)或二甲基亞楓 ⑩ （DMSO)做水洗前置換清洗(Inter-mediaRinse)，再經水洗、乾燥，以完 成去光阻製程。 圖1為傳統適用於玻璃基板之光阻清除設備示意圖。傳統的光阻清 除設備一般有多個反應室前後串連在一起，分別進行溶劑清洗、前置 換清洗、水洗、供乾等動作，因各反應室的基本結構相似，為簡化圖 示，圖1僅以一個反應室作說明。 如圖1所示，傳統光阻清除設備10的反應室11具有一入口 12及一出 口 13，反應室11内設置有一傳送機構14、複數個噴嘴15及風刀16a， ⑩ 16b。傳送機構14用於帶動玻璃基板5由入口 12進入，經反應室11再由 出口 13送出。喷嘴15分佈於反應室11的入口 12與出口 13之間，並與廠 務的清洗液供應管路17連接，可將經加壓幫浦18加壓的溶劑或水直接 喷灑於玻璃基板5上，以去除玻璃基板5上的光阻或微粒。風刀16a，16b 設置於反應室11内側，入口 12及出口 13的上方及下方，並與廠務供氣 管路19相連，當玻璃基板5通過入口 12及出口 13時，由廠務供氣管路19 所提供的潔淨空氣(Clean Dry Air，CDA)，先經減壓裝置20調整至適當 壓力，再經風刀16a，16b吹向玻璃基板5的正反兩面，以刮除溶劑或水， 6 M308491 防止光阻清除設備10各反應室11間不同的清洗液相互污染，或是清洗 液蒸氣逸散到環境中。 為了避免清洗液殘留在玻璃基板上，對後續製程造成影響，廠務 系統必需提供大量的潔淨空氣，使風刀16a，16b保持一定的出口壓力。 同時，光阻清除設備10的反應室11内壁另具有一排氣口21，排氣口21 輕排氣管路22與廠務系統的排氣幫浦23連通，用於將反應室11内的空 氣抽出，並排出至大氣。 此外，為了避免清洗液蒸氣外戌’危害工作人員，排氣幫浦23的 排氣量必須大於風刀16a, 16b吹出的潔淨空氣的總量，使光阻清除設備 10的反應室11内需保持一定的負壓狀態。因此，排氣幫浦23的負載非 常沈重，造成廠務運轉成本增加。 【新型内容】 有鑑於此，有必要提供一種可降低潔淨空氣使用量以及廠務運轉 成本的光阻清除設備。 一種適用於玻璃基板之光阻清除設備，此設備包括一反應室、傳 送機構及一空氣内循J哀系統。反應室具有一入口、一出口及一吸氣口； 傳送機構設置於反應室中，用於帶動玻璃基板由入口進入，經反應室 再由出口送出。空氣内循環系統包括複數個風刀及一抽氣幫浦，風刀 設置於反應室内侧入口及出口上方及下方，抽氣幫浦與反應室之吸氣 口及風刀連通，用於將反應室内之空氣抽出，再經風刀送入反應室中， 吹向傳送中的玻璃基板。 光阻清除設備另具有複數個喷灑頭，設置於反應室入口與出口之 間，用於將溶劑喷灑於玻璃基板表面，以去除玻璃基板上的光阻。 7 M308491 -在一較佳實施例中，吸氣口設置於反應室上方，較接近出口之一 -側·。光阻清除設備更包括一供氣單元及一排氣單元，可將過濾過的外 界空氣送入反應室中，或是將反應室内之空氣排出。 另一種適用於玻璃基板之光阻清除設備，此設備包括複數個反應 至、傳送機構及空氣内循環系統。反應室分別具有一入口、一出口及 一吸氣口，各反應室相互串聯排列，使一反應室之出口與下一反應室 之入口相連通；傳送機構設置於各反應室中，用於傳送玻璃基板通過 各反應室；複數個風刀分別設置於各反應室内侧入口及出口上方及下 >方；以及複數個抽氣幫浦，分別與各反應室之吸氣口及風刀連通，用 於將反應室内之空氣抽出，再經風刀送入反應室中，吹向傳送中的玻 璃基板。 在一較佳實施例中，光阻清除設備更包括複數個喷灑頭，設置於 各反應室入口與出口之間，用於將溶劑或水喷灑於玻璃基板表面。 其次’吸氣口設置於各反應室上方，較接近出口之一側。光阻清 除設備更包括一供氣單元及一排氣單元，可將過濾過的外界空氣送入 /反應室中，或是將反應室内之空氣排出。 前述光阻清除設備利用空氣内循環系統，將反應室内的空氣抽 出，作為風刀的空氣源，因此可大幅降低廠務潔淨空氣的使用量。此 外，排氣單元抽氣的負壓力即為反應室的負壓力，因此亦可大幅減輕 排氣單元的負載，降低廠務運轉成本。 為使本創作之上述目的、特徵和優點能更明顯易懂，以下特舉較 佳實施例並配合所附圖式作詳細說明。 【實施方式】 圖2為本創作光阻清除設備之反應室示意圖，光阻清除設備3〇的反 應室31具有一入口32及一出口33，各設置一活動門，可使反應室31形 8 M308491 成-一封閉腔體。反應室31内設置有一傳送機構34及複數個喷嘴35。傳 送拷構34用於帶動玻璃基板5由入口 32進入，經反應室31再由出口 33 送出。喷嘴35分佈於反應室31的入口32與出口33之間，並與廠務的清 洗液供應管路36、清洗液儲存槽37連接，可將經加壓幫浦38加壓的溶 Μ或水直接喷灑於玻璃基板5上，以去除玻璃基板$上的光阻或微粒。 為了減少潔淨空氣的使用量，使反應室31能一直保持負壓狀態， 反應室31具有一獨立的空氣内循環系統4〇，而空氣内循環系統4〇包括 一抽氣幫浦41、獨立的循環管路42以及複數個設置於反應室31内側， 入口32及出口33上方及下方的風刀43a，43b。抽氣幫浦41透過循環管路 犯與反應室之一吸氣口44及風刀43a，43b連接，用於將反應室31内之空 氣抽出，加壓至適當壓力後，經循環管路42，再自風刀你必送入反 2室31中，吹向傳送巾的賴基板5正反細，財除玻璃基板$上的 清洗液’避免清洗液殘留在玻璃基板5上，對後續製程造成影響。同時， 光阻清除設備3⑽反應室3纳壁具有—減⑽，減⑽經排氣管 路46與廠務纟、_職單元47魏，減單元π為—減幫浦，用於 將反應室31内的空氣抽出，使反應室31持續保持—定的負壓狀態。 其次，光阻清除設備30反應室31軸壁具有—供氣口48，供氣口 顿供氣管路49與-供氣單元5()連通，健單元5()為—麵裝置或一 Iw控制裝置’可將廠務系統提供之潔淨空氣調整至適當動，再透 過供乳官路49，將潔淨空氣送人反應室财，達到空氣更新的目的。 、此外，在一較佳實施例中，吸氣口44設置於反應室31上方，較接 ，出:33之-側，可使反應室31靠近出的3之—側形成局部較低的負 ’出π端賴環空氣流程較短，可避免含有清洗液蒸氣的循環 M308491 ，圖3為本創作具有多個反應室的光阻清除設備示意圖。在本實施方 式少’光阻清除設備有多個反應室前後串連在一起，分別進行溶劑清 洗、前置換清洗、水洗、烘乾等動作，因各反應室的基本結構與圖2 相似’為簡化圖示，圖3省略進行烘乾的反應室，僅以二個清洗反應室 作說明。 ~ 光阻清除设備60包括複數個反應室31a，31b、一傳送機構34。各反 應至31a，31b相互串聯排列，使一反應室3ia之出口 33與下一反應室3此 之入口相連通，傳送機構34設置於各反應室31a，31b中，用於傳送玻 璃基板5通過各反應室3la，31b。其次，各反應室31a，31b另具有複數個 喷嘴35a，35b與獨立的清洗液供應管路36a，36b，藉由喷嘴35a，35b喷出 溶劑或水，去除玻璃基板5上的光阻或微粒。 為了減少潔淨空氣的使用量，使各反應室31a，311?能一直保持負壓 狀態，反應室31a，31b具有各自獨立的空氣内循環系統4〇a，4〇b，而空 氣内猶環系統40a，40b分別包括一抽氣幫浦41、獨立的循環管路42以及 設置於反應室31a，31b入口32及出口33上下的風刀43a，43b，使不同的 反應室31a，31b形成不同的循環氣流，以去除玻璃基板5上的清洗液， 避免清洗液殘留在玻璃基板5上，帶到下一個反應室。 一此外，光阻清除設備60更包括一供氣單元61及一排氣單元。供 氣單元61包括數個減縣置錢流控讎置，各反應室3u，灿透過獨 立的減壓裝置或驗控雛置，提供不_力的潔淨域，以更新反 應室内=空氣；同時，排氣單元62包括單—献各自獨立的抽氣幫浦， 各反應室3la，3lb之空氣藉由排氣單元6：2，經廠務排氣管路排出，使不 同的反應至31a，31b持續保持一定的負壓狀態。 —本創^之光阻清除設備_各自獨立的空氣_縣統，將反應 室内的空氣抽&，作為風刀的空氣源，因此可大幅降低廠務潔淨空氣 M308491 的使用量。此外，排氣單元抽氣的負壓力即為反應室的負壓力，因此 亦y大幅減輕排氣單元的負載，降低廠務運轉成本。 雖然本創作已以較佳實施例揭露如上，然其並非用以限定本發 明，任何熟習此技藝者，在不脫離本發明之精神和範圍内，當可作^ 許之更動與潤飾，因此本創作之保護範圍當視後附之申請專利範圍所 界定者為準。 【圖式簡單說明】 圖1為傳統適用於玻璃基板之光阻清除設備示意圖。 圖2為本創作光阻清除設備之反應室示意圖。 圖3為本創作具有多個反應室的光阻清除設備示意圖。 【主要元件符號說明】 光阻清除設備 30、60 反應室 31、31a、31b 入口 32 出口 33 傳送機構 34 喷嘴 35、35a ' 35b 清洗液供應管路 36、36a、36b 清洗液儲存槽 37 加壓幫浦 38 空氣内循環系統 40、40a、40b 抽氣幫浦 41 循環管路 42 風刀 43a、43b 吸氣口 44 排氣口 45 排氣管路 46 排氣單元 47, 62 供氣口 48 供氣管路 49 玻璃基板 5 供氣單元 50, 61 11M308491 VIII, new description: [New technical field] This creation is about a photoresist removal equipment, especially related to a photoresist removal device with an air circulation system. [Prior Art] In the thin film transistor (TFT) process of a liquid crystal display, the photoresist removal process is to remove the photoresist of the device by solvent removal, such as "MEA", BDG, NMP, etc. After solvent cleaning, it is washed with isopropyl alcohol (IPO) or dimethyl sulfoxide 10 (DMSO) before washing with water (Inter-media Rinse), then washed with water and dried to complete the photoresist removal process. FIG. 1 is a schematic view of a photoresist removal apparatus conventionally applied to a glass substrate. Conventional photoresist removal equipment generally has a plurality of reaction chambers connected in series before and after, respectively performing solvent cleaning, pre-replacement cleaning, water washing, and drying, etc., because the basic structures of the reaction chambers are similar, to simplify the illustration, Figure 1 Only one reaction chamber is used for illustration. As shown in Fig. 1, the reaction chamber 11 of the conventional photoresist removing apparatus 10 has an inlet 12 and an outlet 13. A reaction mechanism 14, a plurality of nozzles 15, and air blades 16a, 10 16b are disposed in the reaction chamber 11. The transport mechanism 14 is used to drive the glass substrate 5 into the inlet 12, and then through the reaction chamber 11 and from the outlet 13. The nozzle 15 is distributed between the inlet 12 and the outlet 13 of the reaction chamber 11, and is connected to the cleaning liquid supply line 17 of the factory, and the solvent or water pressurized by the pressurized pump 18 can be directly sprayed on the glass substrate 5. Upper to remove photoresist or particles on the glass substrate 5. The air knives 16a, 16b are disposed inside the reaction chamber 11, above and below the inlet 12 and the outlet 13, and are connected to the factory air supply line 19. When the glass substrate 5 passes through the inlet 12 and the outlet 13, the factory supply air supply line 19 Clean Air (Cleavage Dry Air, CDA) is first adjusted to the appropriate pressure by the pressure reducing device 20, and then blown to the front and back sides of the glass substrate 5 through the air knife 16a, 16b to scrape off the solvent or water, 6 M308491 prevents different cleaning liquids in each reaction chamber 11 of the photoresist removing device 10 from being contaminated with each other, or the cleaning liquid vapor is escaping into the environment. In order to prevent the cleaning solution from remaining on the glass substrate and affecting the subsequent process, the factory system must provide a large amount of clean air to keep the air knife 16a, 16b at a certain outlet pressure. At the same time, the inner wall of the reaction chamber 11 of the photoresist removing device 10 further has an exhaust port 21, and the exhaust port 21 is connected to the exhaust pump 23 of the factory system for the inside of the reaction chamber 11. The air is pumped out and discharged to the atmosphere. In addition, in order to prevent the cleaning liquid vapor from damaging the worker, the exhaust amount of the exhaust pump 23 must be larger than the total amount of clean air blown by the air knife 16a, 16b, so that the reaction chamber 11 of the photoresist removing device 10 needs to be maintained. A certain negative pressure state. Therefore, the load of the exhaust pump 23 is very heavy, resulting in an increase in the cost of the factory operation. [New content] In view of this, it is necessary to provide a photoresist removal device that can reduce the amount of clean air used and the cost of factory operation. A photoresist removal apparatus suitable for a glass substrate, the apparatus comprising a reaction chamber, a transfer mechanism, and an air lining system. The reaction chamber has an inlet, an outlet and a suction port; the conveying mechanism is disposed in the reaction chamber for driving the glass substrate to enter through the inlet, and then sent out through the reaction chamber. The air circulation system includes a plurality of air knives and a pumping pump. The air knives are disposed above and below the inlet and outlet of the reaction chamber, and the pumping pump communicates with the suction port of the reaction chamber and the air knife for reacting The air in the room is pumped out, and then sent to the reaction chamber through the air knife, and blown to the glass substrate in the transfer. The photoresist removal device further has a plurality of showerheads disposed between the inlet and the outlet of the reaction chamber for spraying a solvent onto the surface of the glass substrate to remove the photoresist on the glass substrate. 7 M308491 - In a preferred embodiment, the suction port is disposed above the reaction chamber, closer to one of the outlets - side. The photoresist removal device further includes a gas supply unit and an exhaust unit for feeding the filtered outer air into the reaction chamber or discharging the air in the reaction chamber. Another photoresist removal device for a glass substrate, the device comprising a plurality of reaction to, transfer mechanisms and an air circulation system. The reaction chambers respectively have an inlet, an outlet and an intake port, and the reaction chambers are arranged in series with each other such that the outlet of one reaction chamber communicates with the inlet of the next reaction chamber; the transfer mechanism is disposed in each reaction chamber for transmission The glass substrate passes through each reaction chamber; a plurality of air knives are respectively disposed above and below the inlet and outlet of each reaction chamber; and a plurality of pumping pumps are respectively connected to the suction ports of the reaction chambers and the air knife. It is used to extract the air in the reaction chamber, and then into the reaction chamber through the air knife to blow the glass substrate in the transfer. In a preferred embodiment, the photoresist removal apparatus further includes a plurality of showerheads disposed between the inlet and the outlet of each of the reaction chambers for spraying solvent or water onto the surface of the glass substrate. Secondly, the suction port is arranged above each reaction chamber, closer to one side of the outlet. The photoresist removal device further includes a gas supply unit and an exhaust unit for feeding the filtered outside air into the reaction chamber or discharging the air in the reaction chamber. The photoresist removal device utilizes an air circulation system to extract air from the reaction chamber as an air source for the air knife, thereby greatly reducing the amount of clean air used in the factory. In addition, the negative pressure of the exhaust unit is the negative pressure of the reaction chamber, so the load on the exhaust unit can be greatly reduced, and the operating cost of the plant can be reduced. In order to make the above objects, features and advantages of the present invention more comprehensible, the following detailed description of the preferred embodiments and the accompanying drawings. [Embodiment] FIG. 2 is a schematic diagram of a reaction chamber of a photoresist removal device. The reaction chamber 31 of the photoresist removal device 3 has an inlet 32 and an outlet 33. Each of the movable doors is provided to allow the reaction chamber 31 to be shaped 8. M308491 is a closed cavity. A transfer mechanism 34 and a plurality of nozzles 35 are disposed in the reaction chamber 31. The transfer flap 34 is used to drive the glass substrate 5 into the inlet 32 and through the reaction chamber 31 to be sent out through the outlet 33. The nozzles 35 are distributed between the inlet 32 and the outlet 33 of the reaction chamber 31, and are connected to the cleaning liquid supply line 36 and the cleaning liquid storage tank 37 of the factory, and the solvent or water pressurized by the pressurized pump 38 can be pressurized. Sprayed directly onto the glass substrate 5 to remove photoresist or particles on the glass substrate $. In order to reduce the amount of clean air used, the reaction chamber 31 can be maintained in a negative pressure state at all times, the reaction chamber 31 has a separate air circulation system 4〇, and the air internal circulation system 4〇 includes a pumping pump 41, independent The circulation line 42 and a plurality of air knives 43a, 43b disposed inside the reaction chamber 31, above and below the inlet 32 and the outlet 33. The pumping pump 41 is connected to one of the reaction chambers 44 and the air knives 43a, 43b through the circulation line for extracting the air in the reaction chamber 31 and pressurizing it to an appropriate pressure through the circulation line 42. Then, from the air knife, you will be sent to the anti-2 room 31, and the substrate 5 that is blown to the conveyor towel is reversed and fine, and the cleaning liquid on the glass substrate $ is avoided to prevent the cleaning liquid from remaining on the glass substrate 5 for subsequent processes. Make an impact. At the same time, the photoresist removal device 3 (10) reaction chamber 3 nano wall has - minus (10), minus (10) through the exhaust line 46 and the factory 纟, _ job unit 47 Wei, minus unit π is - minus pump, used to transfer the reaction chamber The air in 31 is withdrawn, so that the reaction chamber 31 is continuously maintained at a predetermined negative pressure state. Next, the photoresist chamber 30 has a shaft wall having a gas supply port 48, a gas supply port 49 and a gas supply unit 5 (), and the health unit 5 () is a surface device or an Iw control. The device can adjust the clean air provided by the factory system to the appropriate movement, and then send the clean air to the reaction room through the milk supply road 49 to achieve the purpose of air renewal. In addition, in a preferred embodiment, the suction port 44 is disposed above the reaction chamber 31, and is connected to the side of the 33 side, so that the reaction chamber 31 is adjacent to the side of the 3 to form a locally lower negative. 'The π-end lag ring air flow is shorter, and the cycle M308491 containing the cleaning liquid vapor can be avoided. FIG. 3 is a schematic diagram of the photoresist removal device with multiple reaction chambers. In the present embodiment, the photoresist removal apparatus has a plurality of reaction chambers connected in series, and performs solvent cleaning, pre-replacement cleaning, water washing, drying, etc., since the basic structure of each reaction chamber is similar to that of FIG. Simplified illustration, FIG. 3 omits the reaction chamber for drying, and only two cleaning reaction chambers are used for illustration. The photoresist removal device 60 includes a plurality of reaction chambers 31a, 31b and a transfer mechanism 34. Each reaction to 31a, 31b is arranged in series with each other such that the outlet 33 of one reaction chamber 3ia is in communication with the inlet of the next reaction chamber 3, and the transfer mechanism 34 is disposed in each of the reaction chambers 31a, 31b for transporting the glass substrate 5 through Each reaction chamber 31a, 31b. Next, each of the reaction chambers 31a, 31b further has a plurality of nozzles 35a, 35b and independent cleaning liquid supply lines 36a, 36b. The solvent or water is ejected by the nozzles 35a, 35b to remove the photoresist or particles on the glass substrate 5. . In order to reduce the amount of clean air used, the reaction chambers 31a, 311 can be maintained in a negative pressure state, and the reaction chambers 31a, 31b have independent air circulation systems 4a, 4b, and the air inner system. 40a, 40b respectively include a pumping pump 41, a separate circulation line 42 and air knives 43a, 43b disposed above and below the inlet 32 and the outlet 33 of the reaction chambers 31a, 31b, so that different reaction chambers 31a, 31b are formed differently. The air flow is circulated to remove the cleaning liquid on the glass substrate 5, and the cleaning liquid is prevented from remaining on the glass substrate 5 and taken to the next reaction chamber. In addition, the photoresist removal device 60 further includes a gas supply unit 61 and an exhaust unit. The gas supply unit 61 includes a plurality of declining flow control devices, and each reaction chamber is 3u, and the can be passed through an independent decompression device or a control device to provide a clean field without force to update the reaction chamber = air; The exhaust unit 62 includes a separate pumping pump, and each of the reaction chambers 3la, 3lb of air is exhausted through the exhaust line 6:2 through the factory exhaust line to make a different reaction to 31a. 31b continues to maintain a certain negative pressure state. —The light-resisting equipment of this creator _ separate air _ county system, the air in the reaction chamber is pumped & as the air source of the air knife, so the use of the factory clean air M308491 can be greatly reduced. In addition, the negative pressure of the exhaust unit is the negative pressure of the reaction chamber, so the load of the exhaust unit is greatly reduced, and the operating cost of the plant is reduced. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and it is intended that the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection of the creation shall be subject to the definition of the scope of the patent application attached. [Simple description of the drawing] Fig. 1 is a schematic view of a conventional photoresist removal device suitable for a glass substrate. FIG. 2 is a schematic diagram of a reaction chamber of the photoresist removal device. FIG. 3 is a schematic view of a photoresist removal device having a plurality of reaction chambers. [Main component symbol description] Photoresist removal device 30, 60 Reaction chamber 31, 31a, 31b Entrance 32 Exit 33 Transfer mechanism 34 Nozzle 35, 35a ' 35b Washing liquid supply line 36, 36a, 36b Washing liquid storage tank 37 Pressurized Pump 38 air circulation system 40, 40a, 40b pumping pump 41 circulation line 42 air knife 43a, 43b suction port 44 exhaust port 45 exhaust line 46 exhaust unit 47, 62 air supply port 48 Gas line 49 glass substrate 5 gas supply unit 50, 61 11