CN1947871B - 基板处理装置 - Google Patents

基板处理装置 Download PDF

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Publication number
CN1947871B
CN1947871B CN2006101257687A CN200610125768A CN1947871B CN 1947871 B CN1947871 B CN 1947871B CN 2006101257687 A CN2006101257687 A CN 2006101257687A CN 200610125768 A CN200610125768 A CN 200610125768A CN 1947871 B CN1947871 B CN 1947871B
Authority
CN
China
Prior art keywords
mentioned
substrate
curtain
liquid
handling part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006101257687A
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English (en)
Chinese (zh)
Other versions
CN1947871A (zh
Inventor
山本悟史
松本隆雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Skilling Group
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Publication of CN1947871A publication Critical patent/CN1947871A/zh
Application granted granted Critical
Publication of CN1947871B publication Critical patent/CN1947871B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN2006101257687A 2005-10-14 2006-08-28 基板处理装置 Expired - Fee Related CN1947871B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2005300616 2005-10-14
JP2005300616 2005-10-14
JP2005-300616 2005-10-14
JP2006-054644 2006-03-01
JP2006054644 2006-03-01
JP2006054644A JP4668088B2 (ja) 2005-10-14 2006-03-01 基板処理装置

Publications (2)

Publication Number Publication Date
CN1947871A CN1947871A (zh) 2007-04-18
CN1947871B true CN1947871B (zh) 2010-12-08

Family

ID=38156040

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006101257687A Expired - Fee Related CN1947871B (zh) 2005-10-14 2006-08-28 基板处理装置

Country Status (4)

Country Link
JP (1) JP4668088B2 (enExample)
KR (1) KR100817980B1 (enExample)
CN (1) CN1947871B (enExample)
TW (1) TW200715389A (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100883298B1 (ko) * 2007-06-08 2009-02-11 아프로시스템 주식회사 상하 분리가능한 평판 디스플레이 세정장치
JP2009147260A (ja) * 2007-12-18 2009-07-02 Dainippon Screen Mfg Co Ltd 基板処理装置
KR101296659B1 (ko) * 2008-11-14 2013-08-14 엘지디스플레이 주식회사 세정 장치
KR101034374B1 (ko) * 2008-11-28 2011-05-16 세메스 주식회사 기판 세정 장치 및 방법
KR200451730Y1 (ko) 2008-12-29 2011-01-11 주식회사 케이씨텍 세정장치의 오토셔터
CN101847567B (zh) * 2009-03-26 2012-02-29 北京京东方光电科技有限公司 清洗基板的装置
CN101954358B (zh) * 2010-05-06 2012-07-04 东莞宏威数码机械有限公司 平移式基板清洗装置
DE102010024840B4 (de) * 2010-06-23 2016-09-22 Eisenmann Se Trockner
CN102357479A (zh) * 2011-07-19 2012-02-22 廖启明 应用于线路板生产的环保节水处理系统、装置及处理方法
CN102626695B (zh) * 2011-09-28 2015-04-08 北京京东方光电科技有限公司 基板清洗系统
TWI612568B (zh) * 2012-05-17 2018-01-21 Ebara Corp 基板洗淨裝置
JP6133120B2 (ja) 2012-05-17 2017-05-24 株式会社荏原製作所 基板洗浄装置
CN103406302B (zh) * 2013-08-23 2015-08-12 深圳市华星光电技术有限公司 基于紫外线的清洗方法及清洗装置
CN105665397A (zh) * 2016-03-17 2016-06-15 东旭科技集团有限公司 液晶玻璃基板清洗设备和方法
CN205692805U (zh) * 2016-05-09 2016-11-16 合肥鑫晟光电科技有限公司 基板处理设备
CN108239736B (zh) * 2016-12-23 2024-02-23 无锡市斯威克科技有限公司 一种光伏用反光焊带的脉冲风刀
CN108993960A (zh) * 2017-06-07 2018-12-14 丁保粮 一种气液喷淋清洗机
CN108325900B (zh) * 2017-09-19 2021-02-02 福建晟哲自动化科技有限公司 一种液晶面板清洗设备
CN207793414U (zh) * 2017-12-06 2018-08-31 北京铂阳顶荣光伏科技有限公司 具有防气体飘逸功能的板材镀膜设备
CN109047074B (zh) * 2018-08-26 2021-02-26 东莞市金盘模具配件有限公司 一种精密模具加工用表面清洗装置
CN109248878B (zh) * 2018-08-31 2020-10-13 深圳市华星光电技术有限公司 一种清洗平台以及清洗方法
CN110681666A (zh) * 2019-08-09 2020-01-14 江苏迪佳电子有限公司 一种电容触摸屏加工装置
JP7312738B2 (ja) * 2020-12-11 2023-07-21 芝浦メカトロニクス株式会社 基板処理装置
CN113154862B (zh) * 2021-02-26 2022-07-15 东莞汇和电子有限公司 一种电子线路板装配活塞干燥风刀
CN113020080A (zh) * 2021-03-30 2021-06-25 苏州阿洛斯环境发生器有限公司 一种定向线性双流体清洗方法及装置
CN113020079A (zh) * 2021-03-30 2021-06-25 苏州阿洛斯环境发生器有限公司 一种定向双流体清洗方法
CN116000042A (zh) * 2022-12-21 2023-04-25 芜湖东旭光电科技有限公司 玻璃基板预清洗装置
CN115947119B (zh) * 2023-03-14 2023-05-23 合肥光微光电科技有限公司 一种光学玻璃生产自动化输送设备
CN116765015A (zh) * 2023-05-19 2023-09-19 上海新阳半导体材料股份有限公司 电子元件处理装置
CN117772739A (zh) * 2023-12-05 2024-03-29 湖南邵虹特种玻璃股份有限公司 一种基板玻璃预湿机的防水汽向外泄漏设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5564159A (en) * 1994-05-26 1996-10-15 The John Treiber Company Closed-loop multistage system for cleaning printed circuit boards
CN1194454A (zh) * 1997-01-24 1998-09-30 东京电子株式会社 清洗装置及清洗方法
CN1485150A (zh) * 2002-08-19 2004-03-31 大日本屏影象制造株式会社 基板处理装置及基板清洗设备
CN1531029A (zh) * 2003-03-12 2004-09-22 大日本屏影象制造株式会社 基板处理方法和基板处理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100232593B1 (ko) * 1997-01-24 1999-12-01 구자홍 Pdp용박리장치및그방법
KR100237210B1 (ko) * 1997-07-22 2000-01-15 구자홍 플라스마 디스플레이 패널용 세정 시스템
JPH11121427A (ja) * 1997-10-13 1999-04-30 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100542299B1 (ko) * 1998-04-23 2006-04-14 비오이 하이디스 테크놀로지 주식회사 포토레지스트의 에지부 제거 장치
DE10130999A1 (de) * 2000-06-29 2002-04-18 D M S Co Multifunktions-Reinigungsmodul einer Herstellungseinrichtung für Flachbildschirme und Reinigungsgerät mit Verwendung desselben
JP2004335838A (ja) * 2003-05-09 2004-11-25 Shin Etsu Handotai Co Ltd 洗浄装置、洗浄システム及び洗浄方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5564159A (en) * 1994-05-26 1996-10-15 The John Treiber Company Closed-loop multistage system for cleaning printed circuit boards
CN1194454A (zh) * 1997-01-24 1998-09-30 东京电子株式会社 清洗装置及清洗方法
CN1485150A (zh) * 2002-08-19 2004-03-31 大日本屏影象制造株式会社 基板处理装置及基板清洗设备
CN1531029A (zh) * 2003-03-12 2004-09-22 大日本屏影象制造株式会社 基板处理方法和基板处理装置

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开2000-31112A 2000.01.28
JP特开2002-172369A 2002.06.18
JP特开平11-16871A 1999.01.22

Also Published As

Publication number Publication date
JP2007134665A (ja) 2007-05-31
KR100817980B1 (ko) 2008-03-31
CN1947871A (zh) 2007-04-18
JP4668088B2 (ja) 2011-04-13
TWI303849B (enExample) 2008-12-01
KR20070041320A (ko) 2007-04-18
TW200715389A (en) 2007-04-16

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Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: SCREEN GROUP CO., LTD.

Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD.

Owner name: DAINIPPON SCREEN MFG. CO., LTD.

Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: Kyoto City, Kyoto, Japan

Patentee after: Skilling Group

Address before: Kyoto City, Kyoto, Japan

Patentee before: DAINIPPON SCREEN MFG Co.,Ltd.

Address after: Kyoto City, Kyoto, Japan

Patentee after: DAINIPPON SCREEN MFG Co.,Ltd.

Address before: Kyoto City, Kyoto, Japan

Patentee before: Dainippon Screen Mfg. Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101208

Termination date: 20160828