KR100817980B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

Info

Publication number
KR100817980B1
KR100817980B1 KR1020060083495A KR20060083495A KR100817980B1 KR 100817980 B1 KR100817980 B1 KR 100817980B1 KR 1020060083495 A KR1020060083495 A KR 1020060083495A KR 20060083495 A KR20060083495 A KR 20060083495A KR 100817980 B1 KR100817980 B1 KR 100817980B1
Authority
KR
South Korea
Prior art keywords
substrate
liquid
curtain
processing
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020060083495A
Other languages
English (en)
Korean (ko)
Other versions
KR20070041320A (ko
Inventor
사토시 야마모토
다카오 마츠모토
Original Assignee
다이니폰 스크린 세이조우 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이니폰 스크린 세이조우 가부시키가이샤 filed Critical 다이니폰 스크린 세이조우 가부시키가이샤
Publication of KR20070041320A publication Critical patent/KR20070041320A/ko
Application granted granted Critical
Publication of KR100817980B1 publication Critical patent/KR100817980B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020060083495A 2005-10-14 2006-08-31 기판 처리 장치 Expired - Fee Related KR100817980B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005300616 2005-10-14
JPJP-P-2005-00300616 2005-10-14
JPJP-P-2006-00054644 2006-03-01
JP2006054644A JP4668088B2 (ja) 2005-10-14 2006-03-01 基板処理装置

Publications (2)

Publication Number Publication Date
KR20070041320A KR20070041320A (ko) 2007-04-18
KR100817980B1 true KR100817980B1 (ko) 2008-03-31

Family

ID=38156040

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060083495A Expired - Fee Related KR100817980B1 (ko) 2005-10-14 2006-08-31 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP4668088B2 (enExample)
KR (1) KR100817980B1 (enExample)
CN (1) CN1947871B (enExample)
TW (1) TW200715389A (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100883298B1 (ko) * 2007-06-08 2009-02-11 아프로시스템 주식회사 상하 분리가능한 평판 디스플레이 세정장치
JP2009147260A (ja) * 2007-12-18 2009-07-02 Dainippon Screen Mfg Co Ltd 基板処理装置
KR101296659B1 (ko) * 2008-11-14 2013-08-14 엘지디스플레이 주식회사 세정 장치
KR101034374B1 (ko) * 2008-11-28 2011-05-16 세메스 주식회사 기판 세정 장치 및 방법
KR200451730Y1 (ko) 2008-12-29 2011-01-11 주식회사 케이씨텍 세정장치의 오토셔터
CN101847567B (zh) * 2009-03-26 2012-02-29 北京京东方光电科技有限公司 清洗基板的装置
CN101954358B (zh) * 2010-05-06 2012-07-04 东莞宏威数码机械有限公司 平移式基板清洗装置
DE102010024840B4 (de) * 2010-06-23 2016-09-22 Eisenmann Se Trockner
CN102357479A (zh) * 2011-07-19 2012-02-22 廖启明 应用于线路板生产的环保节水处理系统、装置及处理方法
CN102626695B (zh) * 2011-09-28 2015-04-08 北京京东方光电科技有限公司 基板清洗系统
TWI612568B (zh) * 2012-05-17 2018-01-21 Ebara Corp 基板洗淨裝置
JP6133120B2 (ja) 2012-05-17 2017-05-24 株式会社荏原製作所 基板洗浄装置
CN103406302B (zh) * 2013-08-23 2015-08-12 深圳市华星光电技术有限公司 基于紫外线的清洗方法及清洗装置
CN105665397A (zh) * 2016-03-17 2016-06-15 东旭科技集团有限公司 液晶玻璃基板清洗设备和方法
CN205692805U (zh) * 2016-05-09 2016-11-16 合肥鑫晟光电科技有限公司 基板处理设备
CN108239736B (zh) * 2016-12-23 2024-02-23 无锡市斯威克科技有限公司 一种光伏用反光焊带的脉冲风刀
CN108993960A (zh) * 2017-06-07 2018-12-14 丁保粮 一种气液喷淋清洗机
CN108325900B (zh) * 2017-09-19 2021-02-02 福建晟哲自动化科技有限公司 一种液晶面板清洗设备
CN207793414U (zh) * 2017-12-06 2018-08-31 北京铂阳顶荣光伏科技有限公司 具有防气体飘逸功能的板材镀膜设备
CN109047074B (zh) * 2018-08-26 2021-02-26 东莞市金盘模具配件有限公司 一种精密模具加工用表面清洗装置
CN109248878B (zh) * 2018-08-31 2020-10-13 深圳市华星光电技术有限公司 一种清洗平台以及清洗方法
CN110681666A (zh) * 2019-08-09 2020-01-14 江苏迪佳电子有限公司 一种电容触摸屏加工装置
JP7312738B2 (ja) * 2020-12-11 2023-07-21 芝浦メカトロニクス株式会社 基板処理装置
CN113154862B (zh) * 2021-02-26 2022-07-15 东莞汇和电子有限公司 一种电子线路板装配活塞干燥风刀
CN113020080A (zh) * 2021-03-30 2021-06-25 苏州阿洛斯环境发生器有限公司 一种定向线性双流体清洗方法及装置
CN113020079A (zh) * 2021-03-30 2021-06-25 苏州阿洛斯环境发生器有限公司 一种定向双流体清洗方法
CN116000042A (zh) * 2022-12-21 2023-04-25 芜湖东旭光电科技有限公司 玻璃基板预清洗装置
CN115947119B (zh) * 2023-03-14 2023-05-23 合肥光微光电科技有限公司 一种光学玻璃生产自动化输送设备
CN116765015A (zh) * 2023-05-19 2023-09-19 上海新阳半导体材料股份有限公司 电子元件处理装置
CN117772739A (zh) * 2023-12-05 2024-03-29 湖南邵虹特种玻璃股份有限公司 一种基板玻璃预湿机的防水汽向外泄漏设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980066508A (ko) * 1997-01-24 1998-10-15 구자홍 PDP(Plasma Display Panel)용 박리장치 및 그 방법
KR19990011149A (ko) * 1997-07-22 1999-02-18 구자홍 플라스마 디스플레이 패널용 세정 시스템
KR19990080885A (ko) * 1998-04-23 1999-11-15 김영환 포토레지스트의 에지부 제거 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5564159A (en) * 1994-05-26 1996-10-15 The John Treiber Company Closed-loop multistage system for cleaning printed circuit boards
JP3171807B2 (ja) * 1997-01-24 2001-06-04 東京エレクトロン株式会社 洗浄装置及び洗浄方法
JPH11121427A (ja) * 1997-10-13 1999-04-30 Dainippon Screen Mfg Co Ltd 基板処理装置
DE10130999A1 (de) * 2000-06-29 2002-04-18 D M S Co Multifunktions-Reinigungsmodul einer Herstellungseinrichtung für Flachbildschirme und Reinigungsgerät mit Verwendung desselben
JP2004074021A (ja) * 2002-08-19 2004-03-11 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板洗浄ユニット
JP2004273984A (ja) * 2003-03-12 2004-09-30 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2004335838A (ja) * 2003-05-09 2004-11-25 Shin Etsu Handotai Co Ltd 洗浄装置、洗浄システム及び洗浄方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980066508A (ko) * 1997-01-24 1998-10-15 구자홍 PDP(Plasma Display Panel)용 박리장치 및 그 방법
KR19990011149A (ko) * 1997-07-22 1999-02-18 구자홍 플라스마 디스플레이 패널용 세정 시스템
KR19990080885A (ko) * 1998-04-23 1999-11-15 김영환 포토레지스트의 에지부 제거 장치

Also Published As

Publication number Publication date
JP2007134665A (ja) 2007-05-31
CN1947871A (zh) 2007-04-18
JP4668088B2 (ja) 2011-04-13
TWI303849B (enExample) 2008-12-01
KR20070041320A (ko) 2007-04-18
CN1947871B (zh) 2010-12-08
TW200715389A (en) 2007-04-16

Similar Documents

Publication Publication Date Title
KR100817980B1 (ko) 기판 처리 장치
JP4836997B2 (ja) フィルタの洗浄装置、およびそれを備えるフィルタの洗浄システム
JP2009148699A (ja) 基板処理装置
TWI424517B (zh) Substrate processing device
CN109373743B (zh) 风刀及采用该风刀的干燥装置
JP4352194B2 (ja) 基板乾燥装置及び基板乾燥方法
JP4796889B2 (ja) パネル洗浄機及び洗浄方法
KR20130101454A (ko) 래비린스 씰, 세정유닛 및 방법, 용액제막방법
KR101261290B1 (ko) 기판 코터 장치 및 이를 이용한 코팅 방법
KR102341061B1 (ko) 기판 세정 장치
KR101086517B1 (ko) 기판 처리 장치
JP4675113B2 (ja) 基板洗浄装置
KR20160066382A (ko) 초음파 세정 시스템
JP4861970B2 (ja) 基板処理装置
KR101634186B1 (ko) 판 형상의 소재 표면의 이물질 제거장치 및 제거방법
KR101187882B1 (ko) 기판의 건조장치
KR100938639B1 (ko) 건조 장치
KR100764683B1 (ko) 기판처리장치
JP2010056312A (ja) ダイシング装置及びワーク洗浄乾燥方法
JP2011129758A (ja) 基板処理装置
KR101664161B1 (ko) 습식 세정 챔버 내부 설치용 기판 건조 장치
KR101915053B1 (ko) 액체커튼형성 일체형 스팀노즐
KR100727825B1 (ko) 기판세정용 유체분사장치
JP4291581B2 (ja) スチーム処理装置
KR101189535B1 (ko) 패널 건조노즐 조절장치

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20130304

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20140303

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

FPAY Annual fee payment

Payment date: 20150224

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20160325

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20160325

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000