WO2018223770A1 - 成膜设备 - Google Patents

成膜设备 Download PDF

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Publication number
WO2018223770A1
WO2018223770A1 PCT/CN2018/082959 CN2018082959W WO2018223770A1 WO 2018223770 A1 WO2018223770 A1 WO 2018223770A1 CN 2018082959 W CN2018082959 W CN 2018082959W WO 2018223770 A1 WO2018223770 A1 WO 2018223770A1
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WO
WIPO (PCT)
Prior art keywords
film forming
plate
forming apparatus
cleaning
module
Prior art date
Application number
PCT/CN2018/082959
Other languages
English (en)
French (fr)
Inventor
陈广飞
刘大刚
刘峰
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/304,196 priority Critical patent/US11242596B2/en
Publication of WO2018223770A1 publication Critical patent/WO2018223770A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32651—Shields, e.g. dark space shields, Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Definitions

  • the present disclosure belongs to the field of film forming technology, and in particular relates to a film forming apparatus.
  • Sputtering film formation is a commonly used film forming technology in the fields of display panels, touch screens, semiconductors, etc., in which a target material of a film forming material is bombarded with argon ions in a vacuum sputtering chamber, thereby sputtering target particles. It is formed and deposited on a substrate (such as a glass substrate, a semiconductor substrate, etc.) to form a film layer.
  • a substrate such as a glass substrate, a semiconductor substrate, etc.
  • the anti-scratch plate In order to prevent contamination by depositing target particles outside the substrate on the cavity wall or the like, it is necessary to provide an anti-plate outside the edge of the substrate so that the target particles incident on the substrate are deposited on the anti-scratch plate. As the sputtering film formation progresses, the target particles and dust deposited on the surface of the plate are gradually increased, the adhesion ability is deteriorated, and the target particles are easily dropped to deteriorate the quality of the film layer, so the anti-scratch plate is periodically performed. clean.
  • the present disclosure provides a film forming apparatus that can automatically clean an anti-slip sheet.
  • the film forming apparatus includes a film forming chamber for forming a film on a substrate disposed inside thereof, the film forming apparatus further comprising: a conveying unit for feeding the anti-plate along the conveying path Forming a cavity and moving to a first position, and moving the prevention plate out of the film forming chamber along the conveying path; a cleaning unit disposed at a conveying path outside the film forming cavity for preventing the filming cavity from being removed Board the board for cleaning.
  • the transport unit comprises: a plurality of conveyors continuously disposed along the transport path and configured to carry and transport the anti-slip plates, each of the transmitters being independently controlled.
  • the transmitting unit further includes: at least one steering module disposed on the conveying path for changing an orientation of the anti-slip plate.
  • the steering module includes: a steering platform for carrying the anti-slip plate; and a steering driver for rotating the steering platform.
  • the transmitting unit includes: a plurality of position sensors for detecting the position of the anti-plate.
  • the film forming apparatus further includes a plurality of anti-sliding plates, the anti-sliding plate includes: a bottom for contacting with the conveying unit; a top portion opposite to the bottom portion; and two side portions connected Between the bottom and the top; front and back, surrounded by the bottom, top, sides, the front side for receiving a film forming material.
  • the side of the anti-sliding plate is provided with a splicing structure for splicing with the side portions of the adjacent anti-slip plates.
  • At least one side of the anti-sliding plate is provided with an elastic block.
  • the front surface of the anti-sliding plate is provided with a plurality of horizontal strips disposed in a horizontal direction.
  • the cleaning unit includes a grinding module and a cleaning module, and the cleaning module is away from the film forming cavity along the conveying path; and the grinding module comprises: a grinding rod, which is used for stretching And a grinding rod rotating drive for driving the grinding rod to rotate; the cleaning module comprising: a cleaning brush for extending into the anti-sliding plate The gap between adjacent horizontal bars.
  • the grinding module comprises a plurality of grinding bars spaced apart in a vertical direction;
  • the cleaning module comprises a plurality of cleaning brushes spaced apart in a vertical direction.
  • the grinding module further includes: an abrasive spray head for spraying the abrasive rod with the abrasive; the cleaning module further includes: a cleaning agent spray head for spraying the cleaning brush to the cleaning brush.
  • the film forming apparatus further comprises: a protection plate storage unit to be cleaned for storing the anti-sliding plate removed from the film forming cavity and not being cleaned; the cleaned anti-plate storage unit is used for storing a cleaning anti-sliding plate; wherein the conveying unit is further configured to feed the anti-slip plate into and out of the anti-scratch plate storage unit to be cleaned, and to feed the anti-slip plate into and out of the cleaned anti-slip plate Storage unit.
  • the film forming cavity is configured to be evacuated; and a loading and unloading cavity capable of being evacuated is further disposed at a junction of the transfer unit and the film forming cavity.
  • the film forming cavity is a sputtering cavity.
  • FIG. 1 is a schematic top plan view of a film forming apparatus according to an embodiment of the present disclosure
  • FIG. 2 is a side view showing a structure of a conveyor and a steering module of a film forming apparatus according to an embodiment of the present disclosure
  • FIG. 3 is a side view showing a structure of an anti-sliding plate of a film forming apparatus according to an embodiment of the present disclosure
  • FIG. 4 is a schematic top plan view of a sheet preventing device of a film forming apparatus according to an embodiment of the present disclosure
  • FIG. 5 is a side view showing a structure of a polishing module of a film forming apparatus according to an embodiment of the present disclosure
  • FIG. 6 is a side view showing a structure of a cleaning module of a film forming apparatus according to an embodiment of the present disclosure.
  • the present embodiment provides a film forming apparatus including a film forming chamber 91 for forming a film on a substrate provided inside thereof.
  • the film forming apparatus refers to an apparatus for forming a film layer on a glass substrate, a semiconductor substrate, or the like, and is widely used in the fields of display panels, touch panels, semiconductors, and the like.
  • the above film forming process is carried out in the film forming chamber 91, that is, the substrate should be placed in the film forming chamber 91 to form a film layer.
  • the film forming cavity 91 is a sputtering cavity.
  • the film forming chamber 91 may be provided with a target, an argon ion source, a magnetron system, etc., so that it is a sputtering chamber for performing sputtering (such as magnetron sputtering) film formation. Since the target ions are most easily sputtered into the region outside the substrate in the sputtering film formation process, it is most necessary to provide the anti-slip plate 7, which is suitable for use in the present disclosure.
  • the film forming apparatus (film forming chamber) of the present embodiment is not limited thereto, and may be other types such as an evaporation apparatus, a chemical vapor deposition apparatus, and the like.
  • a transfer unit for feeding the anti-plate 7 along the transport path 1 into the film forming chamber 91 and moving to the first position, and moving the anti-sliding plate 7 out of the film forming chamber 91 along the transport path 1;
  • a cleaning unit is provided at the conveying path 1 outside the film forming chamber 91 for cleaning the prevention plate 7 removed from the film forming chamber 91.
  • the transport unit can send the anti-sliding plate 7 along the feeding path 1 to a predetermined first position in the film forming cavity 91 (such as outside the edge of the substrate) to receive the film forming material that is emitted outside the substrate to avoid the film forming materials. Filming on the cavity wall or the like causes contamination. After a certain time of film formation, the transport unit can again move the anti-sliding plate 7 out of the film forming chamber 91 along the feeding path 1 and send it to the cleaning unit, which then cleans the anti-sliding plate 7.
  • the film forming apparatus of the embodiment is provided with a conveying unit and a cleaning unit, so that the preventing plate 7 can be automatically removed from the film forming chamber 91 and cleaned, and then the clean anti-sliding plate 7 is automatically sent to the film forming chamber 91. Therefore, the cleaning process of the anti-board 7 is completely automated, no manual operation is required, the workload and labor cost can be reduced, and the loss of parts due to manual operation, the position of the board 7 is inaccurate, and the operator does not have to Contact with harmful substances such as dust, improve the working environment; at the same time, its efficiency is greatly improved, and the equipment utilization rate is improved.
  • the film forming cavity 91 is a film forming cavity 91 that can be evacuated; and a loading and unloading cavity 92 that can be evacuated is further disposed at a junction of the conveying unit and the film forming cavity 91.
  • the film forming chamber 91 may need to be evacuated.
  • the loading and unloading chamber 92 can be provided at the junction of the conveying unit and the film forming chamber 91, that is, the preventing plate 7 needs to pass through the loading and unloading chamber 92 to be fed into or out of the film forming chamber 91. Since the loading and unloading chamber 92 can be evacuated, when the anti-sliding plate 7 is replaced, the loading and unloading chamber 92 can be evacuated, and then the anti-sliding plate 7 is moved between the loading and unloading chamber 92 and the film forming chamber 91 which are also vacuumed.
  • the connection between the loading and unloading chamber 92 and the film forming chamber 91 is broken and the vacuum of the loading and unloading chamber 92 is broken.
  • the vacuum forming chamber 91 can be kept in a vacuum state, and the temperature and pressure thereof are basically stabilized, thereby greatly reducing the shutdown. And the time of re-opening, improve equipment utilization rate.
  • the film forming apparatus of this embodiment further includes a plurality of anti-sliding plates 7 including:
  • the front and back sides are surrounded by the bottom, top, and side, and the front side is used for film formation.
  • the anti-sliding plate 7 is no longer fixedly mounted, but is "placed" on the transport unit and can be transported to the desired position by the transport unit.
  • the side portions of the anti-sliding plate 7 are provided with a splicing structure for splicing with the side portions of the adjacent anti-sliding plates 7.
  • at least one side of the anti-sliding plate 7 is provided with an elastic block 74.
  • the plurality of anti-sliding plates 7 can be "spliced" together in side contact. Therefore, as shown in FIG. 4, the side surfaces of each of the anti-sliding plates 7 may be provided with a splicing structure (such as matching convex portions and concave portions) so as to prevent the side surfaces of the plate 7 from being more stably combined when they are in contact with each other. And preventing the film forming material from passing through the gap between the anti-sliding plates 7. Further, in order to prevent damage due to collision when the anti-sliding plate 7 is spliced, the side surface of the anti-sliding plate 7 may be provided with an elastic block 74.
  • a splicing structure such as matching convex portions and concave portions
  • the front surface of the anti-sliding plate 7 is provided with a plurality of horizontal strips 73 arranged in a horizontal direction.
  • a plurality of horizontal strips 73 (equivalent to protrusions) arranged in parallel may be provided, so that on the one hand, the anti-plate 7 is greatly increased.
  • the adhesion area on the other hand, when the film-forming material deposited on the front surface of the sheet 7 is dropped, falls on the horizontal strip 73 without falling into the film forming chamber 91, and contamination can be avoided.
  • each of the anti-sliding plates 7 may include a plate-shaped base 71 and a vertical strip 72, and the vertical strips 72 are attached to the surface of the base 71, and the edges of the two are staggered, thereby preventing
  • the side of the plate 7 forms the splicing structure described above; an elastic block 74 is attached to one side of the base 71 to serve as a buffer; the base 71 and the bottom of the vertical strip 72 are connected to the slider 75, the slider 75 is used to contact the transfer unit.
  • a plurality of horizontal strips 73 are provided at equal intervals on the front surface of the vertical strips 72. The surfaces of the vertical strips 72 and the horizontal strips 73 are undulating in a high roughness to improve the adhesion of the film forming material thereon.
  • the transport unit comprises: a plurality of conveyors 11 arranged continuously along the transport path 1 for carrying and transporting the anti-sliding plates 7, each of which can be independently controlled.
  • the transfer unit is optionally not a separate conveyor belt or the like, but is constituted by a plurality of conveyors 11 (such as conveyor belts) which are continuously arranged and can be separately controlled, and the plurality of conveyors 11 are connected end to end. The way to prevent the board 7 from being transferred to the desired position.
  • the movement of the different anti-sliding plates 7 is independent of each other, for example, when one of the anti-sliding plates 7 is sent to the first position, the movement can be stopped, while the other conveyors 11 continue to send the other anti-slip plate 7 to the first The side portions of the anti-sliding plate 7 at one position and the two anti-sliding plates 7 are brought into contact, thereby completing the splicing of the anti-sliding plate 7.
  • each of the conveyors 11 may include a roller 111 and a belt 112 that is sleeved on the roller 111, and the motor is used to drive the roller 111 to rotate to drive the belt 112.
  • the transport unit comprises a plurality of position sensors 19 for detecting the position of the anti-plate 7 .
  • a plurality of position sensors 19 may be provided in the transport unit (e.g., conveyor 11, steering module 12) for determining the position of the anti-sliding plate 7 to thereby control the operational state of the transport unit.
  • the transport unit further comprises at least one steering module 12 disposed on the transport path 1 for changing the orientation of the anti-sliding plate 7.
  • the steering module 12 includes a steering platform 13 for carrying the anti-plate 7 and a steering drive 14 for rotating the steering platform.
  • the anti-sliding plate 7 has a front surface and a rear surface.
  • the substrate carrier 911 for fixing the substrate is provided on the A side and the B side of the film forming chamber 91, and the substrate carrier 911 is provided.
  • the anti-sliding plate 7 is required to be disposed, and the front faces of the anti-sliding plates 7 on the A side and the B side should face the middle of the film forming chamber 91, that is, the opposite directions of the two. Therefore, when the guard plate 7 is moved from the A side to the B side, its orientation needs to be rotated by 180°, so that the corresponding steering module 12 can be provided in the steering chamber 93.
  • the steering module 12 includes a slide rail 121 and a steering platform 13 that is movable along the slide rail 121 by the steering belt 122.
  • the steering platform 13 is similar in structure to the conveyor 11, and may include a roller 1231, a belt 1232, a position sensor 19, and the like.
  • the steering driver 14 may include a driving gear 124 and a driven gear 125, and the steering platform 13 is driven by the driving gear 124 and the driven gear 125. Turn.
  • the anti-sliding plate 7 can be moved by the conveyor 11 to the steering platform 13, and the steering platform 13 is moved along the sliding rail 121, while the steering drive 14 drives the steering platform to rotate, so as to dock with the subsequent conveyor 11, and prevent The plate 7 then enters the subsequent conveyor 11 as the steering platform rotates (i.e., changes orientation).
  • the specific position, number, structure, and the like of the steering module 12 can be set as needed.
  • a plurality of steering modules may be provided to change the different positions of the transfer path to Portrait or landscape.
  • the cleaning unit comprises a grinding module 2 and a cleaning module 3, and the cleaning module 3 is further away from the film forming chamber 91 than the grinding module 2 along the conveying path 1.
  • the cleaning unit may include a polishing module 2 for grinding the anti-scratch panel 7 and a cleaning module 3 for cleaning the polished anti-scratch panel 7, which may be attached to the anti-scratch panel 7 by grinding. Most of the film-forming material is removed, and subsequent cleaning removes a small amount of attached particles and the like.
  • the grinding module 2 includes a grinding rod 21 for extending into the gap of the adjacent horizontal strip 73 of the anti-sliding plate 7, and a grinding rod rotating drive 22 for driving the rotation of the grinding rod 21. More optionally, the grinding module 2 includes a plurality of grinding bars 21 spaced apart in a vertical direction. More optionally, the grinding module 2 further includes an abrasive spray head 23 for spraying the abrasive bar 21 with an abrasive.
  • the polishing module 2 can abrade the film forming material on the prevention plate 7 by inserting the grinding bar 21 between the horizontal bars 73 and rotating.
  • the grinding module 2 can comprise a plurality of spaced apart abrasive bars 21 which can simultaneously be inserted into the gaps between the different horizontal strips 73 for grinding to improve the grinding efficiency.
  • an abrasive head 23 for spraying the abrasive to the grinding rod 21 may be provided.
  • the polishing module 2 may include a plurality of grinding rods 21 arranged at equal intervals in parallel.
  • the surface of the grinding rod 21 is made of a material having a high hardness and is cylindrical, and the abrasive nozzle 23 is disposed on the grinding rod.
  • Each of the grinding rods 21 is connected to a grinding rod rotary drive, and the grinding rod rotary drive 22 is composed of a motor 221 and a coupling 222 for driving the grinding rod 21 to rotate.
  • the grinding module 2 can also include a grinding rod horizontal drive and a grinding rod vertical drive.
  • the grinding rod horizontal drive is composed of a nut 241, a lead screw 242, a motor 243, etc., and the driving screw 242 drives the grinding rod 21 and the grinding rod rotating drive to move in the horizontal direction by the motor 243, that is, the grinding rod 21 is driven to be used for grinding prevention.
  • the H position (working area) of the board 7 and the G position (avoidance area) for avoiding the guard board 7 are rapidly moved, and can also be used to slowly move the surface of the guard board 7 when the grinding rod 21 is ground.
  • the grinding rod vertical drive may include a motor 251, a lead screw 252, a support plate 253, etc., the support plate 253 is internally threaded, and the screw 252 constitutes a motion pair, and the motor 251 can drive the grinding rod horizontal drive through the screw 252.
  • the grinding rod 21 moves vertically as a whole to align the grinding rod 21 with the spacing between the different horizontal strips 73.
  • the cleaning module 3 then includes a cleaning brush 31 for extending into the gap of the adjacent horizontal strip 73 of the panel 7. More optionally, the cleaning module includes a plurality of cleaning brushes 31 spaced apart in a vertical direction. More optionally, the cleaning module further includes: a cleaning agent nozzle 33 for spraying the cleaning agent to the cleaning brush 31.
  • the cleaning module 3 has a structure similar to that of the grinding module, except that it does not protrude into the gap of the horizontal strip 73, not the grinding rod 21, but the cleaning brush 31 for performing the brushing.
  • the cleaning brush 31 may alternatively be provided in plurality and equally spaced in the vertical direction, and a cleaning agent head 33 may be provided to spray the cleaning agent (such as high pressure spraying) to the cleaning brush 31.
  • the cleaning brush 31 may be a rectangular parallelepiped, the height of which may be the same as the distance between the two horizontal strips 71 of the anti-sliding plate 7, the width may be the same as the width of the horizontal strip 73, and the length is longer than the anti-defense The length of the plate 7 is slightly longer. Different from the grinding module, the cleaning brush 31 does not have to be rotated, but in the case of its relative movement with the preventing plate 7, the pressing of the anti-sliding plate 7 is performed, and the anti-sliding plate 7 is further cleaned by the cleaning agent. Surface particles.
  • the cleaning module 3 may also include a cleaning brush horizontal drive and a cleaning brush vertical drive.
  • the cleaning brush horizontal drive is composed of a nut 341, a lead screw 342, a motor 343, etc., and the driving screw 342 can drive the cleaning brush 31 to move in the horizontal direction by the motor 343, that is, drive the cleaning brush 31 in the working area for cleaning the anti-sliding plate 7. And the escape interval for avoiding the anti-sliding plate 7 moves quickly.
  • the cleaning brush vertical drive may include a motor 351, a lead screw 352, a support plate 353, and the like.
  • the support plate 353 is internally threaded, and the screw 352 constitutes a motion pair.
  • the motor 351 can drive the cleaning brush 31 through the screw 352 and clean.
  • the brush horizontal drive moves vertically vertically to align the cleaning brush 31 with the spacing between the different horizontal strips 73.
  • the cleaning unit may further comprise a drying module 4, along which the drying module 4 is further away from the film forming cavity 91 than the cleaning module 3 to dry the cleaned prevention plate 7.
  • the drying module 4 may include a water absorbing plate 41.
  • the water absorbing plate 41 may be composed of a highly elastic water absorbing material such as a sponge or a desiccant, and may be fixed on the bottom plate 49, and the bottom plate 49 may be connected to the cylinder 42, and the air cylinder 42 may pass through the bottom plate.
  • the 49 driving water absorbing plate 41 is horizontally moved so as to be in close contact with the surface of the squeezing plate 7, and the moisture remaining on the surface of the damper plate 7 is sucked.
  • the drying module 4 further comprises a hot air dryer connected to the plurality of hot air nozzles 43 for ejecting a high temperature, dry inert gas to further dry the anti-sliding plate 7.
  • the film forming apparatus further includes:
  • a guard plate storage unit 81 for storing the anti-slip plate 7 removed from the film forming chamber 91 and not being cleaned;
  • a cleaned anti-plate storage unit 82 for storing the cleaned anti-sliding plate 7;
  • the transfer unit is also used to feed and remove the anti-sliding plate 7 into and out of the cleaned anti-slip plate storage unit 81, and to feed the anti-sliding plate 7 into and out of the cleaned anti-scratch plate storage unit 82.
  • the anti-slip plate 7 to be cleaned and the cleaned anti-scratch plate 7 that has been cleaned can be temporarily stored separately before they enter a subsequent process (such as being cleaned or entering the film forming cavity 91).
  • a subsequent process such as being cleaned or entering the film forming cavity 91.
  • the structure of the anti-scratch board storage unit 81 and the cleaned anti-slide board storage unit 82 may be the same, and each includes a plurality of storage slots, and the transport unit is provided with a motor, a roller, a belt, and a position sensor corresponding to each storage slot. 19, etc., for sequentially transferring the prevention plates 7 one by one into or out of the storage slot.
  • the operator can control the work of the transfer unit, the cleaning unit, and the like through a unified human-machine interaction interface to realize automatic cleaning and replacement of the anti-sliding plate 7. For example, if the operator sets the desired cleaning cycle, the film forming apparatus can automatically replace the armor 7 according to the following procedure when the cleaning cycle is reached:
  • the transport unit is activated, and the conveyor 11 drives the anti-sliding plate 7 into the loading and unloading chamber 92 along the transport path 1 (the anti-sliding plate 7 on the A side of the film forming chamber 91 needs to first pass through the steering module 12 to reach the B side first. After that, the loading and unloading chamber 92) can be accessed, and then the loading and unloading chamber 92 is broken and opened.
  • the anti-sliding plate 7 is removed from the loading and unloading chamber 92, continues to enter the C position along the conveying path 1 and is turned to 90°, enters the longitudinal conveying path 1 and reaches the D position, and then the motor and the roller of the storage tank of the anti-plate storage unit 81 are to be cleaned. And the belt or the like cooperates with the movement, and the anti-sliding plate 7 is sent into the anti-scratch plate storage unit 81 to be cleaned.
  • the anti-sliding plate 7 in the cleaned anti-plate storage unit 82 is removed from the E position, enters the F position, turns to 90°, enters the horizontal conveying path 1, and is then sent to the loading and unloading chamber 92 by the respective conveyors 11, and the loading and unloading chamber
  • the film forming chamber 91 is turned on, and the preventing plate 7 is moved one by one to the first position of the film forming chamber 91 (the preventing plate 7 on the B side needs to pass through the A side and the steering module 12 first), wherein
  • the elastic block 74 serves as a cushioning action when the contact preventing plates 7 are joined.
  • the anti-sliding plates 7 stored in the anti-scratch plate storage unit 81 to be cleaned are removed one by one, and enter the position corresponding to the lapping module along the conveying path 1.
  • the grinding rod vertical drive adjusts the grinding rod 21 to a suitable height
  • the grinding rod horizontal drive drives the grinding rod 21 from the G position to the H position, and the grinding rod 21 extends into the gap between the adjacent horizontal strips 73 and starts to rotate, the abrasive nozzle 23 Spray the abrasive to remove the film forming material at the corresponding position.
  • the grinding rod horizontal drive then returns the grinding rod 21 from the H position to the G position.
  • the grinding rod vertical drive adjusts the grinding rod 21 to a position corresponding to the gap of the other horizontal strips 73, repeating the previous steps until the gap between all the horizontal strips 73 is reached. All are finished by grinding.
  • the anti-sliding plate 7 continues to move to the position corresponding to the cleaning module.
  • the cleaning module sequentially cleans the gap between the horizontal strips 73 by the cleaning brush 31 in a manner similar to the polishing module, and cleans the film-forming material remaining on the anti-plate 7.
  • the anti-sliding plate 7 is moved to the drying module after being turned 180° by the steering module 12.
  • the air cylinder 42 drives the water absorbing plate 41 to move from the I position to the J position, and absorbs moisture remaining on the anti-plate 7; after that, the hot air nozzle 43 ejects a high-temperature, dry inert gas to further dry the anti-plate 7.
  • the storage slots of the cleaned anti-sliding plate storage unit 82 are continuously entered in order, and are sent to the film forming chamber 91 when the anti-scratching plate 7 is replaced next time.

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Abstract

一种成膜设备，包括：成膜腔（91），其用于在设置于其内部的基板上成膜；传送单元，其用于沿传送路径（1）将防着板（7）送入成膜腔（91）并移动到第一位置，以及沿传送路径（1）将防着板（7）移出成膜腔（91）；清洁单元，其设置在成膜腔（91）外的传送路径（1）处，用于对由成膜腔（91）移出的防着板（7）进行清洁。

Description

成膜设备 技术领域
本公开属于成膜技术领域，具体涉及一种成膜设备。
背景技术
溅射成膜是显示面板、触摸屏、半导体等领域中一种常用的成膜技术，其是在真空的溅射腔中，用氩离子轰击成膜材料的靶材，从而将靶材粒子溅射出来并沉积在基板(如玻璃基板、半导体基板等)上形成膜层。
为防止溅射到基板外的靶材粒子沉积在腔壁等处而造成污染，需要在基板边缘外设置防着板，以使射到基板外的靶材粒子沉积在防着板上。随着溅射成膜的进行，防着板表面堆积的靶材粒子和灰尘逐渐增加，附着能力变差，靶材粒子容易掉落而导致膜层品质变差，因此要定期对防着板进行清洁。
公开内容
本公开提供一种可自动清洁防着板的成膜设备。
本公开提供的成膜设备，包括成膜腔，其用于在设置于其内部的基板上成膜，所述成膜设备还包括：传送单元，其用于沿传送路径将防着板送入成膜腔并移动到第一位置，以及沿传送路径将防着板移出成膜腔；清洁单元，其设置在所述成膜腔外的传送路径处，用于对由成膜腔移出的防着板进行清洁。
可选的，所述传送单元包括：多个传送器，其沿所述传送路径连续设置，并用于承载以及输送所述防着板，各所述传送器被独立控制。
可选的，所述传送单元还包括：至少一个转向模块，其设置于所述传送路径上，用于改变所述防着板的朝向。
可选的，所述转向模块包括：转向平台，其用于承载所述防着板；转向驱动器，其用于使所述转向平台转动。
可选的，所述传送单元包括：多个位置传感器，用于检测所述防着板位置。
可选的，所述成膜设备还包括多个防着板，所述防着板包括：底部，其用于与传送单元接触；顶部，其与所述底部相对；两个侧部，其连接在所述底部与顶部之间；正面和背面，其由所述底部、顶部、侧部围绕，所述正面用于承接成膜材料。
可选的，所述防着板的侧部设有用于与相邻防着板的侧部拼接的拼接结构。
可选的，所述防着板的至少一个侧部设有弹性块。
可选的，所述防着板的正面设有多个沿水平方向设置的水平条。
可选的，所述清洁单元包括研磨模块和清洗模块，沿所述传送路径所述清洗模块比所述研磨模块远离所述成膜腔；且所述研磨模块包括：研磨棒，其用于伸入所述防着板的相邻水平条的间隙中，以及研磨棒旋转驱动器，其用于驱动所述研磨棒转动；所述清洗模块包括：清洗刷，其用于伸入所述防着板的相邻水平条的间隙中。
可选的，所述研磨模块包括多个在竖直方向间隔设置的研磨棒；所述清洗模块包括多个在竖直方向间隔设置的清洗刷。
可选的，所述研磨模块还包括：研磨剂喷头，其用于向所述研磨棒喷洒研磨剂；所述清洗模块还包括：清洗剂喷头，其用于向所述清洗刷喷洒清洗剂。
可选的，所述成膜设备还包括：待清洁防着板存储单元，其用于存储从成膜腔移出且未进行清洁的防着板；已清洁防着板存储单元，其用于存储经过清洁的防着板；其中，所述传送单元还用于将防着板送入和移出所述待清洁防着板存储单元，以及将防着板送入和移出所述已清洁防着板存储单元。
可选的，所述成膜腔配置为能被抽真空；在所述传送单元与 所述成膜腔的连接处还设有能被抽真空的装卸腔。
可选的，所述成膜腔为溅射腔。
附图说明
图1为本公开的实施例的一种成膜设备的俯视结构示意图；
图2为本公开的实施例的一种成膜设备的传送器和转向模块的侧视结构示意图；
图3为本公开的实施例的一种成膜设备的防着板的侧视结构示意图；
图4为本公开的实施例的一种成膜设备的防着板的俯视结构示意图；
图5为本公开的实施例的一种成膜设备的研磨模块的侧视结构示意图；以及
图6为本公开的实施例的一种成膜设备的清洗模块的侧视结构示意图。
具体实施方式
为使本领域技术人员更好地理解本公开的技术方案，下面结合附图和具体实施方式对本公开作进一步详细描述。
如图1至图6所示，本实施例提供一种成膜设备，包括成膜腔91，其用于在设于其内部的基板上成膜。
其中，成膜设备是指用于在玻璃基板、半导体基板等上形成膜层的设备，其被广泛用于显示面板、触摸屏、半导体等领域中。而以上的成膜过程是在成膜腔91中进行的，即基板应被置于成膜腔91中形成膜层。
可选的，成膜腔91为溅射腔。
也就是说，该成膜腔91中可设有靶材、氩离子源、磁控系统等，从而其是用于进行溅射(如磁控溅射)成膜的溅射腔。由于在溅射成膜工艺中靶材离子最容易溅射到基板外的区域中，故其最需 要设置防着板7，其适用于本公开。
当然，本实施例的成膜设备(成膜腔)并不限于此，其也可为蒸镀设备、化学气相沉积设备等其它类型。
本实施例的成膜设备还包括：
传送单元，其用于沿传送路径1将防着板7送入成膜腔91并移动到第一位置，以及沿传送路径1将防着板7移出成膜腔91；
清洁单元，其设于成膜腔91外的传送路径1处，用于对由成膜腔91移出的防着板7进行清洁。
其中，传送单元可沿着送路径1将防着板7送到成膜腔91内预定的第一位置(如基板的边缘外)接收射到基板外的成膜材料，以避免这些成膜材料在腔壁等上成膜而造成污染。在成膜一定时间后，传送单元又可沿着送路径1将防着板7移出成膜腔91并送到清洁单元处，清洁单元再对防着板7进行清洁。
本实施例的成膜设备中设有传送单元和清洁单元，故其可自动将防着板7移出成膜腔91外并完成清洁，再自动将干净的防着板7送入成膜腔91中；因此其防着板7清洁过程完全自动化，不需人工操作，可降低工作量和人工成本，并避免人工操作导致的零件丢失损坏、防着板7位置不准确等问题，而且操作人员不必接触粉尘等有害物质，工作环境改善；同时其效率大幅改善，设备稼动率提高。
可选的，成膜腔91为能被抽真空的成膜腔91；在传送单元与成膜腔91的连接处还设有能被抽真空的装卸腔92。
许多成膜工艺(如溅射)都要在真空环境下进行，因此成膜腔91可能需要被抽真空。在此情况下，可在传送单元与成膜腔91的连接处设置装卸腔92，即防着板7需要经过装卸腔92才能被送入或移出成膜腔91。由于该装卸腔92能被抽真空，故在更换防着板7时，可先对装卸腔92抽真空，之后使防着板7在同为真空的装卸腔92与成膜腔91间移动，移动完成后断开装卸腔92与成膜腔91间的连接并打破装卸腔92的真空。这样，在更换防着板7 的过程中，只要对较小的装卸腔92破真空、抽真空即可，而成膜腔91可保持真空状态，其温度和压力基本稳定，从而可大幅缩短停机和复机时间，提高设备稼动率。
可选的，本实施例的成膜设备还包括多个防着板7，防着板7包括：
用于与传送单元接触的底部；
与底部相对的顶部；
连接在底部与顶部间的两个侧部；
被底部、顶部、侧部围绕的正面和背面，正面用于成膜。
如图3、图4所示，本实施例的成膜设备中，防着板7不再被固定安装，而是被“放置”在传送单元上，并可被传送单元送到所需位置。
可选的，防着板7的侧部设有用于与相邻防着板7的侧部拼接的拼接结构。可选的，防着板7的至少一个侧部设有弹性块74。
其中，为使防着板7达到预定的尺寸和遮挡效果，多个防着板7可侧面接触的被“拼接”在一起。为此，如图4所示，各防着板7的侧面可设有拼接结构(如相互匹配的凸部和凹部)，以便防着板7的侧面相互接触时可更稳定的组合在一起，并防止成膜材料穿过防着板7之间的间隙。进一步的，为防止防着板7拼接时因碰撞而损坏，故防着板7的侧面可设有弹性块74。
可选的，防着板7的正面设有多个沿水平方向设置的水平条73。
如图3所示，在防着板7用于沉积成膜材料的正面上，可设有多个平行设置的水平条73(相当于凸起)，这样一方面大幅增加了防着板7的附着面积，另一方面，当沉积在防着板7正面的成膜材料掉落时，会落在水平条73上，而不会落入成膜腔91中，可避免产生污染。
具体的，如图4所示，每个防着板7可包括板状的基底71和竖直条72，竖直条72连接在基底71表面上，且二者的边缘错开， 从而使防着板7的侧部形成以上所述的拼接结构；在基底71的一侧贴设有弹性块74，以起到缓冲通；基底71和竖直条72的底部则可连接滑块75，滑块75用于与传送单元接触。在竖直条72的正面等间隔的设有有多个水平条73，竖直条72和水平条73的表面为粗糙度高的凹凸起伏形状，以提高成膜材料在其上的附着力。
可选的，传送单元包括：多个沿传送路径1连续设置的、用于承载并输送防着板7的传送器11，各传送器11能被独立控制。
也就是说，传送单元可选地不是一条单独的传送带等，而是由多个连续设置并可被分别控制的传送器11(如传送带)构成，而多个传送器11以“首尾相接”的方式将防着板7传送到所需位置。这样，不同防着板7的运动是相互独立的，例如，当一个防着板7被送到第一位置时可停止运动，而其它传送器11继续将另一防着板7送到位于第一位置的防着板7的侧部并使两防着板7接触，从而完成防着板7的拼接。
具体的，每个传送器11可包括滚轮111和套在滚轮111上的皮带112，而马达则用于驱动滚轮111转动以带动皮带112。
可选的，传送单元包括多个用于检测防着板7位置的位置传感器19。
如图2所示，在传送单元(如传送器11、转向模块12)中可设有多个位置传感器19，用于确定防着板7的位置，以据此控制传送单元的工作状态。
可选的，传送单元还包括至少一个设于传送路径1上的转向模块12，其用于改变防着板7的朝向。更可选的，转向模块12包括：用于承载防着板7的转向平台13；用于使转向平台转动的转向驱动器14。
如前所述，防着板7是有正面和背面的，若如图1所示，成膜腔91的A侧和B侧均设有用于固定基板的基板载具911，而基板载具911旁边需要设置防着板7，则位于A侧和B侧的防着板7的正面均应朝向成膜腔91的中部，即二者的朝向相反。因此， 当防着板7从A侧移动到B侧时，其朝向需要转动180°，故可在转向腔93中设置相应的转向模块12。
具体的，如图2所示，转向模块12包括滑轨121和可在转向皮带122带动下沿滑轨121移动的转向平台13。转向平台13结构与传送器11类似，可包括滚轮1231、皮带1232、位置传感器19等，转向驱动器14可以包括主动齿轮124和从动齿轮125，通过主动齿轮124和从动齿轮125带动转向平台13转动。其中，防着板7可通过传送器11运动到转向平台13上，转向平台13则沿滑轨121移动，同时转向驱动器14驱动转向平台转动，使其与后续的传送器11对接，而防着板7则随转向平台转动(即朝向改变)后进入后续的传送器11。
其中，转向模块12的具体位置、个数、结构等可根据需要设置。例如，在成膜腔91外，为更合理的布局传送路径1以减小整体占地面积，也可设有多个转向模块(图中未示出)，以将传送路径的不同位置改变为纵向或横向。
可选的，清洁单元包括研磨模块2和清洗模块3，沿传送路径1清洗模块3比研磨模块2更远离成膜腔91。
如图1所示，清洁单元可包括用于研磨防着板7的研磨模块2和用于对研磨后的防着板7进行清洗的清洗模块3，通过研磨可将附着在防着板7上的大部分成膜材料除去，而后续的清洗则进一步除去附着的少量粒子等。
其中，研磨模块2包括：用于伸入防着板7的相邻水平条73的间隙中的研磨棒21，以及用于驱动研磨棒21转动的研磨棒旋转驱动器22。更可选的，研磨模块2包括多个在竖直方向间隔设置的研磨棒21。更可选的，研磨模块2还包括：用于向研磨棒21喷洒研磨剂的研磨剂喷头23。
如图5所示，研磨模块2可通过将研磨棒21插入到水平条73之间并旋转而磨掉防着板7上的成膜材料。显然，研磨模块2可包括多个间隔设置的研磨棒21，它们可同时伸入不同水平条73 之间的间隙进行研磨，以提高研磨效率。而为提高研磨效果和降低温度，还可设置用于向研磨棒21喷洒研磨剂的研磨剂喷头23。
具体的，如图5所示，研磨模块2可包括多个等间隔平行设置的研磨棒21，研磨棒21的表面由硬度较高的材质构成，呈圆柱形，研磨剂喷头23设于研磨棒21旁边。每个研磨棒21均连接研磨棒旋转驱动器，研磨棒旋转驱动器22由马达221、联轴器222、组成，用于驱动研磨棒21旋转。
研磨模块2还可包括研磨棒水平驱动器和研磨棒竖直驱动器。研磨棒水平驱动器由螺母241、丝杠242、马达243等组成，通过马达243带动丝杠242可驱动研磨棒21、研磨棒旋转驱动器沿水平方向移动，即驱动研磨棒21在用于研磨防着板7的H位置(工作区)和用于躲开防着板7的G位置(避让区)间迅速运动，且还可用于使研磨棒21研磨时缓慢的在防着板7表面移动。研磨棒竖直驱动器则可包括马达251、丝杠252、支撑板253等，支撑板253中间开有内螺纹，与丝杠252组成运动副，马达251可通过丝杠252驱动研磨棒水平驱动器以及研磨棒21整体竖直移动，以使研磨棒21与不同水平条73间的间隔对齐。
清洗模块3则包括用于伸入防着板7的相邻水平条73的间隙中的清洗刷31。更可选的，清洗模块包括多个在竖直方向间隔设置的清洗刷31。更可选的，清洗模块还包括：用于向清洗刷31喷洒清洗剂的清洗剂喷头33。
清洗模块3具有与研磨模块类似的结构，区别在于其伸入水平条73的间隙中的不是研磨棒21，而是用于进行刷洗的清洗刷31。当然，清洗刷31可选也有多个且沿竖直方向等间距设置，且也可设置清洗剂喷头33以向清洗刷31喷洒清洗剂(如高压喷洒)。
具体的，如图6所示，清洗刷31可为长方体，其高度可与防着板7的两个水平条71间的间距相同，宽度可与水平条73的宽度相同，长度则比防着板7的长度略长。与研磨模块不同的是，清洗刷31不必旋转，而是在其与防着板7发生相对移动的情况下对防着板7产生挤压摩擦，在清洗剂的作用下进一步清洗防着板7 表面的粒子。
清洗模块3还可包括清洗刷水平驱动器和清洗刷竖直驱动器。清洗刷水平驱动器由螺母341、丝杠342、马达343等组成，通过马达343带动丝杠342可驱动清洗刷31沿水平方向移动，即驱动清洗刷31在用于清洗防着板7的工作区和用于躲开防着板7的避让区间迅速运动。清洗刷竖直驱动器则可包括马达351、丝杠352、支撑板353等，支撑板353中间开有内螺纹，与丝杠352组成运动副，马达351可通过丝杠352驱动清洗刷31、清洗刷水平驱动器整体竖直移动，以使清洗刷31与不同水平条73间的间隔对齐。
可选的，清洁单元还可包括干燥模块4，沿传送路径1干燥模块4比清洗模块3更远离成膜腔91，以对经过清洗的防着板7进行干燥。
具体的，干燥模块4可包括吸水板41，吸水板41可由海绵、干燥剂等高弹性的吸水材质组成，并可固定在底板49上，而底板49可与气缸42连接，气缸42可通过底板49驱动吸水板41水平移动以使其紧贴防着板7表面，吸取防着板7表面残留的水分。同时，干燥模块4还包括热风烘干机，其连接多个热风喷头43，用于喷出高温、干燥的惰性气体以进一步干燥防着板7。
可选的，如图1所示，成膜设备还包括：
用于存储从成膜腔91移出且未进行清洁的防着板7的待清洁防着板存储单元81；
用于存储经过清洁的防着板7的已清洁防着板存储单元82；
传送单元还用于将防着板7送入和移出待清洁防着板存储单元81，以及将防着板7送入和移出已清洁防着板存储单元82。
如图1所示，对于待清洁的防着板7和已经过清洁的已清洁防着板7，在它们进入后续的工序(如被清洁或进入成膜腔91)前，可被分别临时存储在待清洁防着板存储单元81和已清洁防着板存储单元82中。其中，待清洁防着板存储单元81和已清洁防着板 存储单元82的结构可相同，都包括多个存储槽，而传送单元设有对应每个存储槽的马达、滚轮、皮带、位置传感器19等，用于按照顺序将防着板7逐一传入或移出存储槽。
本实施例的成膜设备中，操作人员可通过统一的人机交互界面控制传送单元、清洁单元等的工作，以实现对防着板7的自动清洁和更换。例如，操作人员只要设定希望的清洁周期，则在达到清洁周期，成膜设备可按以下流程自动更换防着板7：
达到清洁周期后，传送单元启动，传送器11带动防着板7沿传送路径1进入装卸腔92(位于成膜腔91的A侧的防着板7需先经过转向模块12先达到B侧，之后才能进入装卸腔92)，之后装卸腔92破真空并打开。
防着板7从装卸腔92移出，继续沿传送路径1进入C位置并转向90°，进入纵向的传送路径1并达到D位置，之后待清洁防着板存储单元81的存储槽的马达、滚轮、皮带等配合运动，将防着板7送入待清洁防着板存储单元81中。
同时，已清洁防着板存储单元82中的防着板7从E位置移出，进入F位置后转向90°而进入横向的传送路径1，再由各传送器11送入装卸腔92，装卸腔92抽真空后与成膜腔91导通，防着板7逐一运动到成膜腔91的第一位置(位于B侧的防着板7需先经过A侧和转向模块12)，其中，相互接触的防着板7拼接时弹性块74起到缓冲作用。
存储在待清洁防着板存储单元81中的防着板7被逐一移出，沿传送路径1进入对应研磨模块的位置。研磨棒竖直驱动器将研磨棒21调整至合适高度，研磨棒水平驱动器驱动研磨棒21从G位置进入H位置，研磨棒21伸入相邻的水平条73间的间隙后开始旋转，研磨剂喷头23喷洒研磨剂，将相应位置的成膜材料研磨除去。研磨棒水平驱动器再使研磨棒21从H位置回到G位置，研磨棒竖直驱动器将研磨棒21调整至对应其它水平条73间隙的位置，重复之前步骤，直到将全部水平条73间的间隙全部被研磨 完成为止。
防着板7继续运动至对应清洗模块的位置。清洗模块通过与研磨模块类似的方式依次用清洗刷31清洗各水平条73间的间隙，将防着板7上残留的成膜材料清洗干净。
防着板7经过转向模块12转向180°后运动至干燥模块处。气缸42驱动吸水板41从I位置运动至J位置，吸干防着板7上残留的水分；之后热风喷头43喷出高温、干燥的惰性气体，进一步干燥防着板7。
防着板7清洁完成后，继续按顺序进入已清洁防着板存储单元82的各存储槽，等待下次更换防着板7时被送入成膜腔91。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (15)

  1. 一种成膜设备，包括成膜腔，其用于在设置于其内部的基板上成膜，所述成膜设备还包括：
    传送单元，其用于沿传送路径将防着板送入成膜腔并移动到第一位置，以及沿传送路径将防着板移出成膜腔；
    清洁单元，其设置在所述成膜腔外的传送路径处，用于对由成膜腔移出的防着板进行清洁。
  2. 根据权利要求1所述的成膜设备，其中，所述传送单元包括：
    多个传送器，其沿所述传送路径连续设置，并用于承载以及输送所述防着板，各所述传送器被独立控制。
  3. 根据权利要求2所述的成膜设备，其中，所述传送单元还包括：
    至少一个转向模块，其设置于所述传送路径上，用于改变所述防着板的朝向。
  4. 根据权利要求3所述的成膜设备，其中，所述转向模块包括：
    转向平台，其用于承载所述防着板；
    转向驱动器，其用于使所述转向平台转动。
  5. 根据权利要求1所述的成膜设备，其中，所述传送单元包括：
    多个位置传感器，用于检测所述防着板位置。
  6. 根据权利要求1所述的成膜设备，其中，所述成膜设备还 包括多个防着板，所述防着板包括：
    底部，其用于与传送单元接触；
    顶部，其与所述底部相对；
    两个侧部，其连接在所述底部与顶部之间；
    正面和背面，其由所述底部、顶部、侧部围绕，所述正面用于承接成膜材料。
  7. 根据权利要求6所述的成膜设备，其中，
    所述防着板的侧部设有用于与相邻防着板的侧部拼接的拼接结构。
  8. 根据权利要求7所述的成膜设备，其中，
    所述防着板的至少一个侧部设有弹性块。
  9. 根据权利要求6所述的成膜设备，其中，
    所述防着板的正面设有多个沿水平方向设置的水平条。
  10. 根据权利要求9所述的成膜设备，其中，所述清洁单元包括研磨模块和清洗模块，沿所述传送路径所述清洗模块比所述研磨模块远离所述成膜腔；且
    所述研磨模块包括：
    研磨棒，其用于伸入所述防着板的相邻水平条的间隙中，以及研磨棒旋转驱动器，其用于驱动所述研磨棒转动；
    所述清洗模块包括：
    清洗刷，其用于伸入所述防着板的相邻水平条的间隙中。
  11. 根据权利要求10所述的成膜设备，其中，
    所述研磨模块包括多个在竖直方向间隔设置的研磨棒；
    所述清洗模块包括多个在竖直方向间隔设置的清洗刷。
  12. 根据权利要求10所述的成膜设备，其中，
    所述研磨模块还包括：研磨剂喷头，其用于向所述研磨棒喷洒研磨剂；
    所述清洗模块还包括：清洗剂喷头，其用于向所述清洗刷喷洒清洗剂。
  13. 根据权利要求1至12中任意一项所述的成膜设备，其中，还包括：
    待清洁防着板存储单元，其用于存储从成膜腔移出且未进行清洁的防着板；
    已清洁防着板存储单元，其用于存储经过清洁的防着板；
    其中，所述传送单元还用于将防着板送入和移出所述待清洁防着板存储单元，以及将防着板送入和移出所述已清洁防着板存储单元。
  14. 根据权利要求1至12中任意一项所述的成膜设备，其中，所述成膜腔配置为能被抽真空；
    在所述传送单元与所述成膜腔的连接处还设有能被抽真空的装卸腔。
  15. 根据权利要求1至12中任意一项所述的成膜设备，其中，
    所述成膜腔为溅射腔。
PCT/CN2018/082959 2017-06-08 2018-04-13 成膜设备 WO2018223770A1 (zh)

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206768212U (zh) * 2017-06-08 2017-12-19 合肥鑫晟光电科技有限公司 成膜设备
CN108385070A (zh) * 2018-04-13 2018-08-10 深圳市华星光电技术有限公司 防着板以及溅射装置
KR20210061639A (ko) * 2019-11-20 2021-05-28 캐논 톡키 가부시키가이샤 성막 장치, 이를 사용한 성막 방법 및 전자 디바이스 제조 방법
JP7213226B2 (ja) * 2020-11-30 2023-01-26 キヤノントッキ株式会社 搬送装置、および成膜装置

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05311427A (ja) * 1992-05-08 1993-11-22 Tokin Corp 薄膜形成装置
US5509772A (en) * 1992-01-16 1996-04-23 Commissariat A L'energie Atomique System for the handling and confinement of flat objects in individual boxes
JP2003034857A (ja) * 2001-07-26 2003-02-07 Matsushita Electric Ind Co Ltd スパッタリング装置及び方法
JP2003129233A (ja) * 2001-10-22 2003-05-08 Matsushita Electric Ind Co Ltd スパッタリング方法及び装置
CN201031252Y (zh) * 2007-03-26 2008-03-05 建铯科技股份有限公司 溅镀机的防着板结构
CN201301336Y (zh) * 2008-10-10 2009-09-02 苏州凡特真空溅镀科技有限公司 溅镀机的防着板结构
CN102119237A (zh) * 2008-09-19 2011-07-06 株式会社爱发科 对等离子体显示器面板的基板形成保护膜的方法以及该保护膜的形成装置
CN102867717A (zh) * 2011-07-08 2013-01-09 日新离子机器株式会社 防着板支承部件及具有该防着板支承部件的离子源
JP2013064168A (ja) * 2011-09-15 2013-04-11 Hitachi High-Technologies Corp 成膜装置
CN205803584U (zh) * 2016-07-11 2016-12-14 合肥京东方光电科技有限公司 一种防着板及磁控溅射设备
CN206768212U (zh) * 2017-06-08 2017-12-19 合肥鑫晟光电科技有限公司 成膜设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0353063A (ja) * 1989-07-18 1991-03-07 Dainippon Printing Co Ltd スパッタリング装置
US6565717B1 (en) * 1997-09-15 2003-05-20 Applied Materials, Inc. Apparatus for sputtering ionized material in a medium to high density plasma
US6471830B1 (en) * 2000-10-03 2002-10-29 Veeco/Cvc, Inc. Inductively-coupled-plasma ionized physical-vapor deposition apparatus, method and system
EP1786947B1 (en) * 2004-09-03 2012-12-19 Cardinal CG Company Coater and method for applying films on a substrate
US7109503B1 (en) * 2005-02-25 2006-09-19 Cymer, Inc. Systems for protecting internal components of an EUV light source from plasma-generated debris
US9251930B1 (en) * 2006-08-11 2016-02-02 Essex Group, Inc. Segmented shields for use in communication cables
SG175129A1 (en) * 2009-04-14 2011-11-28 Internat Test Solutions Wafer manufacturing cleaning apparatus, process and method of use
JP4766500B2 (ja) * 2009-08-26 2011-09-07 シャープ株式会社 真空処理装置、および真空処理工場
US8801858B2 (en) * 2010-12-23 2014-08-12 First Solar, Inc. Non-wear shutter apparatus for a vapor deposition apparatus
US9327848B2 (en) * 2012-06-11 2016-05-03 Bigelow Aerospace Method of deploying a spacecraft shield in space
JP5592035B1 (ja) * 2012-10-23 2014-09-17 株式会社シンクロン 薄膜形成装置，スパッタリングカソード及び薄膜形成方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5509772A (en) * 1992-01-16 1996-04-23 Commissariat A L'energie Atomique System for the handling and confinement of flat objects in individual boxes
JPH05311427A (ja) * 1992-05-08 1993-11-22 Tokin Corp 薄膜形成装置
JP2003034857A (ja) * 2001-07-26 2003-02-07 Matsushita Electric Ind Co Ltd スパッタリング装置及び方法
JP2003129233A (ja) * 2001-10-22 2003-05-08 Matsushita Electric Ind Co Ltd スパッタリング方法及び装置
CN201031252Y (zh) * 2007-03-26 2008-03-05 建铯科技股份有限公司 溅镀机的防着板结构
CN102119237A (zh) * 2008-09-19 2011-07-06 株式会社爱发科 对等离子体显示器面板的基板形成保护膜的方法以及该保护膜的形成装置
CN201301336Y (zh) * 2008-10-10 2009-09-02 苏州凡特真空溅镀科技有限公司 溅镀机的防着板结构
CN102867717A (zh) * 2011-07-08 2013-01-09 日新离子机器株式会社 防着板支承部件及具有该防着板支承部件的离子源
JP2013064168A (ja) * 2011-09-15 2013-04-11 Hitachi High-Technologies Corp 成膜装置
CN205803584U (zh) * 2016-07-11 2016-12-14 合肥京东方光电科技有限公司 一种防着板及磁控溅射设备
CN206768212U (zh) * 2017-06-08 2017-12-19 合肥鑫晟光电科技有限公司 成膜设备

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