TWI344392B - - Google Patents
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- Publication number
- TWI344392B TWI344392B TW097121584A TW97121584A TWI344392B TW I344392 B TWI344392 B TW I344392B TW 097121584 A TW097121584 A TW 097121584A TW 97121584 A TW97121584 A TW 97121584A TW I344392 B TWI344392 B TW I344392B
- Authority
- TW
- Taiwan
- Prior art keywords
- chamber
- substrate
- opening
- processing
- processing chamber
- Prior art date
Links
- 238000012545 processing Methods 0.000 claims description 345
- 239000000758 substrate Substances 0.000 claims description 202
- 239000007788 liquid Substances 0.000 claims description 112
- 239000003595 mist Substances 0.000 claims description 100
- 230000007246 mechanism Effects 0.000 claims description 81
- 238000011282 treatment Methods 0.000 claims description 55
- 238000005192 partition Methods 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 16
- 230000032258 transport Effects 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 14
- 238000012805 post-processing Methods 0.000 claims description 12
- 238000012546 transfer Methods 0.000 claims description 11
- 238000002360 preparation method Methods 0.000 claims description 6
- 238000002203 pretreatment Methods 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims 1
- 238000000638 solvent extraction Methods 0.000 claims 1
- 206010040844 Skin exfoliation Diseases 0.000 description 86
- 239000007789 gas Substances 0.000 description 29
- 238000011144 upstream manufacturing Methods 0.000 description 17
- 239000000126 substance Substances 0.000 description 13
- 238000007781 pre-processing Methods 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 7
- 230000009471 action Effects 0.000 description 5
- 230000002441 reversible effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000008267 milk Substances 0.000 description 2
- 210000004080 milk Anatomy 0.000 description 2
- 235000013336 milk Nutrition 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000013022 venting Methods 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003196 chaotropic effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007221246 | 2007-08-28 | ||
| JP2008046223A JP2009202088A (ja) | 2008-02-27 | 2008-02-27 | 基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200916199A TW200916199A (en) | 2009-04-16 |
| TWI344392B true TWI344392B (enExample) | 2011-07-01 |
Family
ID=40692804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097121584A TW200916199A (en) | 2007-08-28 | 2008-06-10 | Substrate processing apparatus |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100933125B1 (enExample) |
| TW (1) | TW200916199A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013191779A (ja) * | 2012-03-14 | 2013-09-26 | Toshiba Corp | 処理装置および処理方法 |
| JP7458267B2 (ja) * | 2020-08-19 | 2024-03-29 | 東京エレクトロン株式会社 | 基板処理装置及び基板搬送方法 |
| KR102618629B1 (ko) * | 2021-08-24 | 2023-12-27 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
| JP7624466B2 (ja) * | 2023-01-27 | 2025-01-30 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理システム |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001156035A (ja) | 1999-11-25 | 2001-06-08 | Hitachi Ltd | 基板処理装置及びその隣接処理槽への飛沫の浸入防止方法 |
| JP2007073649A (ja) | 2005-09-06 | 2007-03-22 | Sharp Corp | レジスト剥離洗浄装置、レジスト剥離洗浄方法および基板製造方法 |
-
2008
- 2008-06-10 TW TW097121584A patent/TW200916199A/zh not_active IP Right Cessation
- 2008-06-24 KR KR1020080059490A patent/KR100933125B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR100933125B1 (ko) | 2009-12-21 |
| KR20090023057A (ko) | 2009-03-04 |
| TW200916199A (en) | 2009-04-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |