TW200916199A - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

Info

Publication number
TW200916199A
TW200916199A TW097121584A TW97121584A TW200916199A TW 200916199 A TW200916199 A TW 200916199A TW 097121584 A TW097121584 A TW 097121584A TW 97121584 A TW97121584 A TW 97121584A TW 200916199 A TW200916199 A TW 200916199A
Authority
TW
Taiwan
Prior art keywords
chamber
substrate
opening
processing
processing chamber
Prior art date
Application number
TW097121584A
Other languages
English (en)
Chinese (zh)
Other versions
TWI344392B (enExample
Inventor
Kazuo Jodai
Hisaaki Matsui
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008046223A external-priority patent/JP2009202088A/ja
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200916199A publication Critical patent/TW200916199A/zh
Application granted granted Critical
Publication of TWI344392B publication Critical patent/TWI344392B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
TW097121584A 2007-08-28 2008-06-10 Substrate processing apparatus TW200916199A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007221246 2007-08-28
JP2008046223A JP2009202088A (ja) 2008-02-27 2008-02-27 基板処理装置

Publications (2)

Publication Number Publication Date
TW200916199A true TW200916199A (en) 2009-04-16
TWI344392B TWI344392B (enExample) 2011-07-01

Family

ID=40692804

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097121584A TW200916199A (en) 2007-08-28 2008-06-10 Substrate processing apparatus

Country Status (2)

Country Link
KR (1) KR100933125B1 (enExample)
TW (1) TW200916199A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI583452B (zh) * 2012-03-14 2017-05-21 東芝股份有限公司 Processing device and processing method
TWI878591B (zh) * 2020-08-19 2025-04-01 日商東京威力科創股份有限公司 基板處理裝置及基板搬送方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102618629B1 (ko) * 2021-08-24 2023-12-27 세메스 주식회사 기판 처리 장치 및 방법
JP7624466B2 (ja) * 2023-01-27 2025-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001156035A (ja) 1999-11-25 2001-06-08 Hitachi Ltd 基板処理装置及びその隣接処理槽への飛沫の浸入防止方法
JP2007073649A (ja) 2005-09-06 2007-03-22 Sharp Corp レジスト剥離洗浄装置、レジスト剥離洗浄方法および基板製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI583452B (zh) * 2012-03-14 2017-05-21 東芝股份有限公司 Processing device and processing method
TWI878591B (zh) * 2020-08-19 2025-04-01 日商東京威力科創股份有限公司 基板處理裝置及基板搬送方法

Also Published As

Publication number Publication date
TWI344392B (enExample) 2011-07-01
KR100933125B1 (ko) 2009-12-21
KR20090023057A (ko) 2009-03-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees