KR100933125B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR100933125B1
KR100933125B1 KR1020080059490A KR20080059490A KR100933125B1 KR 100933125 B1 KR100933125 B1 KR 100933125B1 KR 1020080059490 A KR1020080059490 A KR 1020080059490A KR 20080059490 A KR20080059490 A KR 20080059490A KR 100933125 B1 KR100933125 B1 KR 100933125B1
Authority
KR
South Korea
Prior art keywords
opening
chamber
substrate
processing
shutter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020080059490A
Other languages
English (en)
Korean (ko)
Other versions
KR20090023057A (ko
Inventor
가즈오 조다이
히사아키 마츠이
Original Assignee
다이니폰 스크린 세이조우 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008046223A external-priority patent/JP2009202088A/ja
Application filed by 다이니폰 스크린 세이조우 가부시키가이샤 filed Critical 다이니폰 스크린 세이조우 가부시키가이샤
Publication of KR20090023057A publication Critical patent/KR20090023057A/ko
Application granted granted Critical
Publication of KR100933125B1 publication Critical patent/KR100933125B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
KR1020080059490A 2007-08-28 2008-06-24 기판 처리 장치 Expired - Fee Related KR100933125B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00221246 2007-08-28
JP2007221246 2007-08-28
JPJP-P-2008-00046223 2008-02-27
JP2008046223A JP2009202088A (ja) 2008-02-27 2008-02-27 基板処理装置

Publications (2)

Publication Number Publication Date
KR20090023057A KR20090023057A (ko) 2009-03-04
KR100933125B1 true KR100933125B1 (ko) 2009-12-21

Family

ID=40692804

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080059490A Expired - Fee Related KR100933125B1 (ko) 2007-08-28 2008-06-24 기판 처리 장치

Country Status (2)

Country Link
KR (1) KR100933125B1 (enExample)
TW (1) TW200916199A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4407665A3 (en) * 2023-01-27 2024-11-06 SCREEN Holdings Co., Ltd. Substrate processing system

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013191779A (ja) * 2012-03-14 2013-09-26 Toshiba Corp 処理装置および処理方法
JP7458267B2 (ja) * 2020-08-19 2024-03-29 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
KR102618629B1 (ko) * 2021-08-24 2023-12-27 세메스 주식회사 기판 처리 장치 및 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001156035A (ja) 1999-11-25 2001-06-08 Hitachi Ltd 基板処理装置及びその隣接処理槽への飛沫の浸入防止方法
JP2007073649A (ja) 2005-09-06 2007-03-22 Sharp Corp レジスト剥離洗浄装置、レジスト剥離洗浄方法および基板製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001156035A (ja) 1999-11-25 2001-06-08 Hitachi Ltd 基板処理装置及びその隣接処理槽への飛沫の浸入防止方法
JP2007073649A (ja) 2005-09-06 2007-03-22 Sharp Corp レジスト剥離洗浄装置、レジスト剥離洗浄方法および基板製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4407665A3 (en) * 2023-01-27 2024-11-06 SCREEN Holdings Co., Ltd. Substrate processing system

Also Published As

Publication number Publication date
KR20090023057A (ko) 2009-03-04
TW200916199A (en) 2009-04-16
TWI344392B (enExample) 2011-07-01

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