TWI295732B - High resolution analytical probe station - Google Patents
High resolution analytical probe station Download PDFInfo
- Publication number
- TWI295732B TWI295732B TW092107976A TW92107976A TWI295732B TW I295732 B TWI295732 B TW I295732B TW 092107976 A TW092107976 A TW 092107976A TW 92107976 A TW92107976 A TW 92107976A TW I295732 B TWI295732 B TW I295732B
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- dut
- microscope
- probe station
- station
- Prior art date
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07392—Multiple probes manipulating each probe element or tip individually
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/305—Contactless testing using electron beams
- G01R31/307—Contactless testing using electron beams of integrated circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/025—General constructional details concerning dedicated user interfaces, e.g. GUI, or dedicated keyboards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/119,346 US6744268B2 (en) | 1998-08-27 | 2002-04-08 | High resolution analytical probe station |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200305724A TW200305724A (en) | 2003-11-01 |
| TWI295732B true TWI295732B (en) | 2008-04-11 |
Family
ID=28453984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092107976A TWI295732B (en) | 2002-04-08 | 2003-04-08 | High resolution analytical probe station |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US6744268B2 (enExample) |
| EP (1) | EP1353188A3 (enExample) |
| JP (1) | JP2003309153A (enExample) |
| KR (1) | KR20030081083A (enExample) |
| TW (1) | TWI295732B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI507692B (zh) * | 2010-04-23 | 2015-11-11 | Rudolph Technologies Inc | 具有可垂直移動總成之檢查裝置 |
| TWI641839B (zh) * | 2017-08-18 | 2018-11-21 | 中華精測科技股份有限公司 | 偵測裝置 |
Families Citing this family (192)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6380751B2 (en) | 1992-06-11 | 2002-04-30 | Cascade Microtech, Inc. | Wafer probe station having environment control enclosure |
| US5345170A (en) | 1992-06-11 | 1994-09-06 | Cascade Microtech, Inc. | Wafer probe station having integrated guarding, Kelvin connection and shielding systems |
| US6232789B1 (en) | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
| US5561377A (en) | 1995-04-14 | 1996-10-01 | Cascade Microtech, Inc. | System for evaluating probing networks |
| US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
| US6002263A (en) | 1997-06-06 | 1999-12-14 | Cascade Microtech, Inc. | Probe station having inner and outer shielding |
| US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
| US6744268B2 (en) * | 1998-08-27 | 2004-06-01 | The Micromanipulator Company, Inc. | High resolution analytical probe station |
| US6578264B1 (en) | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
| US6445202B1 (en) | 1999-06-30 | 2002-09-03 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
| US6838890B2 (en) | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
| US6914423B2 (en) | 2000-09-05 | 2005-07-05 | Cascade Microtech, Inc. | Probe station |
| US6965226B2 (en) | 2000-09-05 | 2005-11-15 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| DE10143173A1 (de) | 2000-12-04 | 2002-06-06 | Cascade Microtech Inc | Wafersonde |
| WO2003052435A1 (en) | 2001-08-21 | 2003-06-26 | Cascade Microtech, Inc. | Membrane probing system |
| WO2003020467A1 (en) | 2001-08-31 | 2003-03-13 | Cascade Microtech, Inc. | Optical testing device |
| EP1433184B1 (de) * | 2001-09-24 | 2016-03-23 | JPK Instruments AG | Vorrichtung zum halten einer messsonde für ein rasterkraftmikroskop |
| US6777964B2 (en) | 2002-01-25 | 2004-08-17 | Cascade Microtech, Inc. | Probe station |
| AU2003233659A1 (en) | 2002-05-23 | 2003-12-12 | Cascade Microtech, Inc. | Probe for testing a device under test |
| CN1659442A (zh) * | 2002-06-03 | 2005-08-24 | 皇家飞利浦电子股份有限公司 | 测试电子部件的装置和方法 |
| US6891170B1 (en) * | 2002-06-17 | 2005-05-10 | Zyvex Corporation | Modular manipulation system for manipulating a sample under study with a microscope |
| US7154257B2 (en) * | 2002-09-30 | 2006-12-26 | Intel Corporation | Universal automated circuit board tester |
| US6999888B2 (en) * | 2002-09-30 | 2006-02-14 | Intel Corporation | Automated circuit board test actuator system |
| US6741409B2 (en) * | 2002-10-04 | 2004-05-25 | Finisar Corporation | Precision alignment of optical devices |
| US6847219B1 (en) | 2002-11-08 | 2005-01-25 | Cascade Microtech, Inc. | Probe station with low noise characteristics |
| US6724205B1 (en) | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
| US7250779B2 (en) | 2002-11-25 | 2007-07-31 | Cascade Microtech, Inc. | Probe station with low inductance path |
| US6861856B2 (en) | 2002-12-13 | 2005-03-01 | Cascade Microtech, Inc. | Guarded tub enclosure |
| JP2004227842A (ja) * | 2003-01-21 | 2004-08-12 | Canon Inc | プローブ保持装置、試料の取得装置、試料加工装置、試料加工方法、および試料評価方法 |
| US7221172B2 (en) | 2003-05-06 | 2007-05-22 | Cascade Microtech, Inc. | Switched suspended conductor and connection |
| US7492172B2 (en) | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
| KR100984608B1 (ko) * | 2003-09-23 | 2010-09-30 | 지벡스 인스투르먼츠, 엘엘시 | 집속 이온빔으로 준비한 샘플을 파지하는 파지 요소를 사용한 현미경 검사 방법, 시스템 및 장치 |
| US7250626B2 (en) | 2003-10-22 | 2007-07-31 | Cascade Microtech, Inc. | Probe testing structure |
| DE102004058483B4 (de) * | 2003-12-05 | 2009-12-17 | Hitachi High-Technologies Corp. | Vorrichtung zur Untersuchung von Produkten auf Fehler, Messfühler-Positionierverfahren und Messfühler-Bewegungsverfahren |
| DE202004021093U1 (de) | 2003-12-24 | 2006-09-28 | Cascade Microtech, Inc., Beaverton | Aktiver Halbleiterscheibenmessfühler |
| US7187188B2 (en) | 2003-12-24 | 2007-03-06 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
| US7071715B2 (en) * | 2004-01-16 | 2006-07-04 | Formfactor, Inc. | Probe card configuration for low mechanical flexural strength electrical routing substrates |
| TWI232938B (en) * | 2004-02-11 | 2005-05-21 | Star Techn Inc | Probe card |
| TW200531420A (en) | 2004-02-20 | 2005-09-16 | Zyvex Corp | Positioning device for microscopic motion |
| SI21714A (en) * | 2004-02-23 | 2005-08-31 | Inst Jozef Stefan | Procedure and device for measuring ultrahigh vacuum |
| EP1566647B1 (en) * | 2004-02-23 | 2007-09-12 | Zyvex Instruments, LLC | Particle beam device probe operation |
| JP4563700B2 (ja) * | 2004-03-16 | 2010-10-13 | 東京エレクトロン株式会社 | 真空プローブ装置及び真空プローブ方法 |
| US7326293B2 (en) * | 2004-03-26 | 2008-02-05 | Zyvex Labs, Llc | Patterned atomic layer epitaxy |
| WO2005093485A1 (ja) * | 2004-03-29 | 2005-10-06 | Research Organization Of Information And Systems | 試料温度調節装置 |
| DE202005021434U1 (de) | 2004-06-07 | 2008-03-20 | Cascade Microtech, Inc., Beaverton | Thermooptische Einspannvorrichtung |
| US7330041B2 (en) | 2004-06-14 | 2008-02-12 | Cascade Microtech, Inc. | Localizing a temperature of a device for testing |
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-
2002
- 2002-04-08 US US10/119,346 patent/US6744268B2/en not_active Expired - Fee Related
-
2003
- 2003-04-08 EP EP03007929A patent/EP1353188A3/en not_active Withdrawn
- 2003-04-08 JP JP2003104616A patent/JP2003309153A/ja active Pending
- 2003-04-08 KR KR10-2003-0022121A patent/KR20030081083A/ko not_active Withdrawn
- 2003-04-08 TW TW092107976A patent/TWI295732B/zh active
-
2004
- 2004-04-01 US US10/816,114 patent/US7180317B2/en not_active Expired - Fee Related
-
2007
- 2007-02-16 US US11/676,142 patent/US20070290703A1/en not_active Abandoned
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI507692B (zh) * | 2010-04-23 | 2015-11-11 | Rudolph Technologies Inc | 具有可垂直移動總成之檢查裝置 |
| TWI641839B (zh) * | 2017-08-18 | 2018-11-21 | 中華精測科技股份有限公司 | 偵測裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1353188A3 (en) | 2004-01-14 |
| US7180317B2 (en) | 2007-02-20 |
| JP2003309153A (ja) | 2003-10-31 |
| KR20030081083A (ko) | 2003-10-17 |
| TW200305724A (en) | 2003-11-01 |
| US20070290703A1 (en) | 2007-12-20 |
| US20040207424A1 (en) | 2004-10-21 |
| US20030042921A1 (en) | 2003-03-06 |
| EP1353188A2 (en) | 2003-10-15 |
| US6744268B2 (en) | 2004-06-01 |
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