TWD197322S - 物理氣相沉積室靶 - Google Patents

物理氣相沉積室靶

Info

Publication number
TWD197322S
TWD197322S TW107303087F TW107303087F TWD197322S TW D197322 S TWD197322 S TW D197322S TW 107303087 F TW107303087 F TW 107303087F TW 107303087 F TW107303087 F TW 107303087F TW D197322 S TWD197322 S TW D197322S
Authority
TW
Taiwan
Prior art keywords
target
vapor deposition
physical vapor
deposition chamber
profile
Prior art date
Application number
TW107303087F
Other languages
English (en)
Chinese (zh)
Inventor
Martin Lee Riker
Fuhong Zhang
Zheng Wang
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD197322S publication Critical patent/TWD197322S/zh

Links

TW107303087F 2017-12-11 2018-06-01 物理氣相沉積室靶 TWD197322S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/629,062 USD868124S1 (en) 2017-12-11 2017-12-11 Target profile for a physical vapor deposition chamber target

Publications (1)

Publication Number Publication Date
TWD197322S true TWD197322S (zh) 2019-05-01

Family

ID=67390873

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107303087F TWD197322S (zh) 2017-12-11 2018-06-01 物理氣相沉積室靶
TW107303086F TWD197321S (zh) 2017-12-11 2018-06-01 物理氣相沉積室靶

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW107303086F TWD197321S (zh) 2017-12-11 2018-06-01 物理氣相沉積室靶

Country Status (3)

Country Link
US (2) USD868124S1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (2) JP1637543S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (2) TWD197322S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1027120S1 (en) 2020-12-17 2024-05-14 Applied Materials, Inc. Seal for an assembly in a vapor deposition chamber

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
JP1655453S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2019-06-17 2020-03-23
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD926942S1 (en) * 2020-01-28 2021-08-03 Universal Flow Monitors, Inc. Flow control plate
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD980394S1 (en) * 2020-04-01 2023-03-07 Watermann Polyworks Gmbh Sealing apparatus
US12080522B2 (en) 2020-04-22 2024-09-03 Applied Materials, Inc. Preclean chamber upper shield with showerhead
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD989012S1 (en) 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
JP1684468S (ja) * 2020-09-24 2021-05-10 基板処理装置用天井ヒータ
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1072774S1 (en) * 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1700776S (ja) * 2021-03-04 2021-11-29 基板処理装置用基板載置プレート
USD1057675S1 (en) * 2021-04-12 2025-01-14 Lam Research Corporation Pedestal for a substrate processing system
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD990441S1 (en) * 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate
TWD229503S (zh) 2021-09-08 2024-01-11 美商蘭姆研究公司 美國 除泡器元件
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate

Family Cites Families (114)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320728A (en) * 1990-03-30 1994-06-14 Applied Materials, Inc. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
USD363464S (en) * 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD351450S (en) * 1993-05-19 1994-10-11 Riteflite Pty. Limited Target for shooting
USD376744S (en) 1994-08-03 1996-12-24 Gerd Eisenblatter Gmbh Support plate
USD381030S (en) * 1995-11-21 1997-07-15 Avi Tepman Sputtering target
AU129071S (en) * 1996-06-07 1997-01-14 Riteflite Pty Ltd Target
US6114216A (en) * 1996-11-13 2000-09-05 Applied Materials, Inc. Methods for shallow trench isolation
USD423026S (en) * 1997-08-20 2000-04-18 Tokyo Electron Limited Quartz cover
US6086725A (en) * 1998-04-02 2000-07-11 Applied Materials, Inc. Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
JP3551867B2 (ja) 1999-11-09 2004-08-11 信越化学工業株式会社 シリコンフォーカスリング及びその製造方法
US6390905B1 (en) 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
USD446231S1 (en) * 2000-08-21 2001-08-07 Komatsu Industries Corporation Nozzle for a plasma arc torch
US6638402B2 (en) * 2001-06-05 2003-10-28 Praxair S.T. Technology, Inc. Ring-type sputtering target
USD487254S1 (en) * 2002-05-24 2004-03-02 Nichia Corporation Light emitting diode
JP2006509911A (ja) 2002-12-16 2006-03-23 アイファイアー・テクノロジー・コープ 複合スパッタターゲット及び燐光物質の蒸着方法
USD496951S1 (en) * 2003-01-30 2004-10-05 Thermal Dynamics Corporation Mechanized cap for a plasma arc torch
USD503729S1 (en) * 2003-10-31 2005-04-05 Nordson Corporation Nozzle for dispensing adhesives and sealants
JP4744855B2 (ja) 2003-12-26 2011-08-10 日本碍子株式会社 静電チャック
JP5189294B2 (ja) 2004-02-13 2013-04-24 エーエスエム アメリカ インコーポレイテッド オートドーピングおよび裏面堆積を減少させるための基板支持システム
USD553104S1 (en) * 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD559066S1 (en) 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
TWD121115S1 (zh) 2005-03-30 2008-01-21 東京威力科創股份有限公司 遮護環
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
TWD117939S1 (zh) * 2005-07-29 2007-07-01 東京威力科創股份有限公司 電漿處理裝置之微波導入窗用頂板
TWD117940S1 (zh) * 2005-07-29 2007-07-01 東京威力科創股份有限公司 電漿處理裝置之微波導入窗用頂板
TWD125340S1 (zh) * 2005-07-29 2008-10-11 東京威力科創股份有限公司 電漿處理裝置之微波導入窗用頂板
TWD117941S1 (zh) * 2005-07-29 2007-07-01 東京威力科創股份有限公司 電漿處理裝置之微波導入窗用頂板
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20070076345A1 (en) 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement
USD545853S1 (en) * 2006-03-30 2007-07-03 Dave Hawley Plasma gun nozzle retention ring
USD570310S1 (en) * 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US7402098B2 (en) 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
TWD130501S1 (zh) * 2006-12-15 2009-08-21 東京威力科創股份有限公司 電漿處理裝置的加熱平台用遮罩
US20080173541A1 (en) * 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
US8968536B2 (en) * 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
TWD130834S1 (zh) * 2008-03-28 2009-09-11 東京威力科創股份有限公司 半導體製造用保溫筒之散熱翼片
WO2009154853A2 (en) * 2008-04-16 2009-12-23 Applied Materials, Inc. Wafer processing deposition shielding components
JP5676429B2 (ja) * 2008-04-21 2015-02-25 ハネウェル・インターナショナル・インコーポレーテッド Ｄｃマグネトロンスパッタリングシステムの設計および使用
USD614593S1 (en) 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US8371904B2 (en) 2008-08-08 2013-02-12 Globalfoundries Singapore Pte. Ltd. Polishing with enhanced uniformity
US8070925B2 (en) * 2008-10-17 2011-12-06 Applied Materials, Inc. Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target
USD616389S1 (en) 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
US8133368B2 (en) * 2008-10-31 2012-03-13 Applied Materials, Inc. Encapsulated sputtering target
TWI397600B (zh) * 2009-01-07 2013-06-01 Solar Applied Mat Tech Corp Recycled sputtering target and its making method
USD616390S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US9181619B2 (en) * 2010-02-26 2015-11-10 Fujifilm Corporation Physical vapor deposition with heat diffuser
KR101892911B1 (ko) * 2010-08-06 2018-08-29 어플라이드 머티어리얼스, 인코포레이티드 정전 척 및 정전 척의 사용 방법들
TWD146490S (zh) 2011-01-12 2012-04-21 荏原製作所股份有限公司 半導體晶圓研磨用彈性膜
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
USD678745S1 (en) 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
JP1438319S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2011-09-20 2015-04-06
USD669509S1 (en) * 2011-10-19 2012-10-23 Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts Nozzle for torch
USD691974S1 (en) 2011-12-22 2013-10-22 Tokyo Electron Limited Holding pad for transferring a wafer
USD683806S1 (en) * 2012-01-12 2013-06-04 Surefire, Llc Front plate for a firearm sound suppressor
USD687791S1 (en) * 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD687790S1 (en) * 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
KR20130131120A (ko) 2012-05-23 2013-12-03 삼성전자주식회사 연마 헤드용 가요성 멤브레인
JP5875950B2 (ja) 2012-06-29 2016-03-02 株式会社荏原製作所 基板保持装置および研磨装置
USD732094S1 (en) * 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
US9475996B2 (en) 2012-10-17 2016-10-25 Richard Max Mandle Centrifugal fluid ring plasma reactor
USD703162S1 (en) 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
KR20150101470A (ko) * 2013-01-04 2015-09-03 토소우 에스엠디, 인크 보강된 표면 프로파일 및 개선된 성능을 갖는 실리콘 스퍼터링 타겟 및 그 제조 방법
FR3002241B1 (fr) 2013-02-21 2015-11-20 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
FR3002242B1 (fr) 2013-02-21 2015-04-03 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
US9534286B2 (en) * 2013-03-15 2017-01-03 Applied Materials, Inc. PVD target for self-centering process shield
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) * 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
TWD169790S (zh) 2013-07-10 2015-08-11 日立國際電氣股份有限公司 基板處理裝置用氣化器之部分
USD754468S1 (en) * 2013-07-23 2016-04-26 Michael F. Nason Disposable splatter shield
US9779920B2 (en) * 2013-08-14 2017-10-03 Applied Materials, Inc. Sputtering target with backside cooling grooves
USD716742S1 (en) 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
US9960021B2 (en) 2013-12-18 2018-05-01 Applied Materials, Inc. Physical vapor deposition (PVD) target having low friction pads
USD741921S1 (en) 2014-04-15 2015-10-27 Q-Linea Ab Positive mold for manufacturing a sample holding disc
US9991101B2 (en) * 2014-07-29 2018-06-05 Applied Materials, Inc. Magnetron assembly for physical vapor deposition chamber
USD750728S1 (en) * 2014-12-02 2016-03-01 John K. Kremer Laser target
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD801942S1 (en) 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1545222S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2015-06-10 2016-03-07
JP1546800S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2015-06-12 2016-03-28
USD798248S1 (en) 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US10174437B2 (en) * 2015-07-09 2019-01-08 Applied Materials, Inc. Wafer electroplating chuck assembly
JP1549882S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2015-08-18 2016-05-23
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
USD830434S1 (en) 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
TWD178424S (zh) * 2016-01-08 2016-09-21 Asm Ip Holding Bv 用於半導體製造設備的氣流控制板
TWD178699S (zh) * 2016-01-08 2016-10-01 Asm Ip Holding Bv 用於半導體製造設備的氣體分散板
USD794753S1 (en) 2016-04-08 2017-08-15 Applied Materials, Inc. Showerhead for a semiconductor processing chamber
USD790039S1 (en) 2016-04-08 2017-06-20 Applied Materials, Inc. Showerhead for a semiconductor processing chamber
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD804230S1 (en) * 2016-06-23 2017-12-05 Cbd Consolidated Llc Bench top gripping device
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
CN206573738U (zh) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 低损耗光纤
US10662520B2 (en) 2017-03-29 2020-05-26 Applied Materials, Inc. Method for recycling substrate process components
USD830981S1 (en) 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US10811232B2 (en) 2017-08-08 2020-10-20 Applied Materials, Inc. Multi-plate faceplate for a processing chamber
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD197827S (zh) 2017-12-19 2019-06-01 Ebara Corp 半導體晶圓研磨用彈性膜
USD880437S1 (en) * 2018-02-01 2020-04-07 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD891382S1 (en) 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
JP1716516S (ja) 2021-11-25 2022-06-02 包装用袋

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1027120S1 (en) 2020-12-17 2024-05-14 Applied Materials, Inc. Seal for an assembly in a vapor deposition chamber

Also Published As

Publication number Publication date
USD868124S1 (en) 2019-11-26
TWD197321S (zh) 2019-05-01
USD946638S1 (en) 2022-03-22
JP1637543S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2019-07-29
JP1651698S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2020-01-27

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